Display module and display device

Abstract

The present application provides a display module and a display device; the display module includes a display panel and a flexible circuit board, the display panel includes a planar portion and a first binding portion located on one side of the planar portion, the flexible circuit board includes a flexible body and a support member provided on one side of the flexible body, the flexible body is provided with a second binding portion bound to the first binding portion, and the stiffness of the support member is less than or equal to the stiffness of the flexible body; the present application reduces the stiffness of the support member in the flexible circuit board so that the stiffness of the support member is less than or equal to the stiffness of the flexible body, thereby reducing the yield strength of the support member and avoiding the technical problem of separation of the support member from the display panel due to warping of the edge of the support member.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] In existing display devices, a flexible circuit board is usually bound and connected to the binding area of ​​a display panel in the display device to transmit data signals. After the flexible circuit board is bound and connected to the binding terminals in the display panel, it is usually fixed on the side of the display panel away from the light-emitting surface.

[0003] However, since the design of existing display modules is usually to achieve easy folding and thin modules, the thickness and modulus of each layer in the module are designed to be small, resulting in a decrease in the impact resistance of the flexible circuit board; and when the rigidity of the flexible circuit board increases, the edges of the flexible circuit board are prone to warping. Summary of the Invention

[0004] The present application provides a display module and a display device to improve the technical problem of warping of edges of flexible circuit boards in existing display modules.

[0005] To solve the above problem, the technical solution provided by this application is as follows:

[0006] This application proposes a display module, which includes:

[0007] The display panel includes a plane portion and a first binding portion located on one side of the plane portion;

[0008] A flexible circuit board comprises a flexible body and a support member provided on one side of the flexible body, wherein the flexible body is provided with a second binding portion that is bound and connected to the first binding portion;

[0009] Wherein, the rigidity of the support member is less than or equal to the rigidity of the flexible body.

[0010] Optionally, the support member includes a first portion, a second portion, and a third portion which are arranged along the width direction of the display panel and are connected to each other;

[0011] The stiffness of the second part is greater than the stiffness of the first part, or / and the stiffness of the second part is greater than the stiffness of the third part.

[0012] Optionally, the flexible circuit board further comprises a functional element provided on a side of the flexible body away from the support member;

[0013] The first part is arranged close to the functional element, the third part is arranged far away from the functional element, and the rigidity of the first part is smaller than that of the third part.

[0014] Optionally, the second binding portion and the flexible body corresponding to the support member both include single-layer boards, and the number of single-layer boards in the flexible body corresponding to the support member is greater than the number of single-layer boards in the second binding portion.

[0015] Optionally, a plurality of grooves are formed on a side of the support member facing the flexible body, and a depth of the grooves is less than or equal to a thickness of the support member.

[0016] Optionally, in a top view of the support member, the sum of the areas of the plurality of grooves is less than or equal to half of the area of ​​the support member.

[0017] Optionally, the depth of the groove is less than or equal to half the thickness of the support member.

[0018] Optionally, in a top view of the support member, the shape of the groove is at least one of a capsule, a circle, a triangle or a quadrilateral.

[0019] Optionally, the support member has a thickness ranging from 30 μm to 100 μm.

[0020] Optionally, the display module further includes:

[0021] a first back plate, disposed on a first side of the planar portion close to the first binding portion;

[0022] a first supporting layer, disposed on a side of the first back plate away from the planar portion;

[0023] The surface of the support member away from the flexible body is bonded to the first support layer via a first adhesive, and the surface of the support member close to the flexible body is bonded to the second flexible body via a second adhesive.

[0024] Optionally, the first adhesive material is a pressure-sensitive adhesive, and the second adhesive material is a thermosetting adhesive.

[0025] Optionally, the support member and the first support layer are both made of steel sheets, and the rigidity of the support member is smaller than the rigidity of the first support layer.

[0026] The present application also proposes a display device, which includes the above-mentioned display panel.

[0027] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0029] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0030] Figure 1 A cross-sectional view of a display module provided in an embodiment of the present application;

[0031] Figure 2 A cross-sectional view of a display panel provided in an embodiment of the present application;

[0032] Figure 3 A structural diagram of the flexible body in the flexible circuit board provided in an embodiment of the present application;

[0033] Figure 4 A front view of the flexible circuit board provided in an embodiment of the present application;

[0034] Figure 5 A first top view of the support member provided in an embodiment of the present application;

[0035] Figure 6 A second top view of the support member provided in an embodiment of the present application;

[0036] Figure 7 A third top view of the support member provided in an embodiment of the present application;

[0037] Figure 8 A first front view structural diagram of a support member provided in an embodiment of the present application;

[0038] Figure 9 A second front view structural diagram of the support member provided in an embodiment of the present application;

[0039] Figure 10 A fourth top view of the support member provided in an embodiment of the present application;

[0040] Figure 11 A third front view structural diagram of the support member provided in an embodiment of the present application;

[0041] Figure 12 A fifth top view of the support member provided in an embodiment of the present application;

[0042] Figure 13 This is a fourth front view structural diagram of the support member provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0044] See also Figures 1 to 9 The present application proposes a display module 100 , which includes a display panel 200 and a flexible circuit board 300 bound and connected to the display panel 200 .

[0045] In this embodiment, the display panel 200 includes a planar portion 10a and a first binding portion 10b located on one side of the planar portion 10a. The flexible circuit board 300 includes a flexible body 310 and a support member 320 provided on one side of the flexible body 310. The flexible body 310 is provided with a second binding portion 310a that is bound and connected to the first binding portion 10b.

[0046] In this embodiment, the rigidity of the support member 320 is less than or equal to the rigidity of the flexible body 310 .

[0047] Because the thickness and modulus of each laminated layer in the existing display module 100 are designed to be relatively small, the impact resistance of the flexible circuit board 300 is reduced. Furthermore, when the rigidity of the flexible circuit board 300 is increased, the edges of the flexible circuit board 300 are prone to warping. This application reduces the rigidity of the support member 320 in the flexible circuit board 300, making it less than or equal to the rigidity of the flexible body 310. This reduces the yield strength of the support member 320 and avoids the technical problem of separation of the support member 320 from the display panel 200 due to warping of the edges of the support member 320.

[0048] It should be noted that the display panel 200 of the present application may be a flexible display panel 200 , such as a static bending display panel 200 and a dynamic bending display panel 200 .

[0049] It should be noted that the display panel 200 of the present application can be an organic light-emitting display panel 200, Mini LED, Micro LED or other small-sized light-emitting devices. The following embodiments are described using the organic light-emitting display panel 200 as an example.

[0050] The technical solution of this application is now described in conjunction with specific embodiments.

[0051] See also Figure 1The display panel 200 may include a display layer 10, and the display layer 10 may include a base substrate 110, an array driving layer 150 provided on the base substrate 110, a pixel definition layer 160 provided on the array driving layer 150, a light-emitting device layer 170 provided on the same layer as the pixel definition layer 160, an encapsulation layer 180 provided on the pixel definition layer 160, a polarizer layer 20 provided on the encapsulation layer 180, an optical adhesive layer 30, an ultra-thin glass layer 40, a first protective layer 50 and a second protective layer 60.

[0052] In this embodiment, the display panel 200 may further include a touch layer 190 . The touch layer 190 may be positioned on the encapsulation layer 180 or between the encapsulation layer 180 and the base substrate 110 , which is not specifically limited in this application.

[0053] In this embodiment, the base substrate 110 is used to support various film layers provided on the base substrate 110 . The base substrate 110 may be a flexible substrate that can be bent, folded, rolled, etc. Examples of flexible materials for the flexible substrate include, but are not limited to, polyimide (PI).

[0054] In this embodiment, the array drive layer 150 may include a plurality of thin film transistors, which may be of an etch barrier type, a back channel etch type, or may be divided into a bottom gate thin film transistor, a top gate thin film transistor, and other structures according to the position of the gate electrode and the active layer, or may be divided into an N-type thin film transistor and a P-type thin film transistor according to the performance of the thin film transistor.

[0055] For example, Figure 2 The thin film transistor shown in the figure is a top-gate thin film transistor, which may include a light shielding unit 151 provided on a substrate, a buffer layer 152 provided on the light shielding unit 151, an active layer 153 provided on the buffer layer 152, a gate insulating layer 154 provided on the active layer 153, a gate layer 155 provided on the gate insulating layer 154, an inter-insulating layer 156 provided on the gate layer 155, a source-drain electrode layer 157 provided on the inter-insulating layer 156, and a planarizing layer 158 provided on the source-drain electrode layer 157. In this embodiment, the inter-insulating layer 156 may be laid as a whole layer, or may be formed in the same photomask process as the structure shown in the figure together with the gate layer 155. Figure 2 The structure of the thin film transistor is only an example of the present application, and other types of thin film transistors are also applicable to the present application.

[0056] See also Figure 2The light-emitting device layer 170 may further include an anode layer 171 disposed on the planar layer 158, a light-emitting layer 172 disposed on the anode layer 171, and a cathode layer 173 disposed on the light-emitting layer 172. The anode layer 171 includes a plurality of anodes, the pixel definition layer 160 includes a plurality of pixel openings corresponding one-to-one to the plurality of anodes, and each pixel opening exposes the upper surface of an anode, and the light-emitting layer 172 may include a plurality of light-emitting pixels corresponding one-to-one to the plurality of anodes.

[0057] See also Figure 2 The encapsulation layer 180 covers the pixel definition layer 160 and continuously covers multiple pixel openings and multiple light-emitting pixels; wherein the encapsulation layer 180 can include at least a first inorganic encapsulation layer 181, a first organic encapsulation layer 182 and a second inorganic encapsulation layer 183 stacked on the pixel definition layer 160.

[0058] See also Figure 2 The touch layer 190 may include a first touch metal layer and a second touch metal layer disposed on the encapsulation layer 180, and an insulating layer disposed between the first touch metal layer and the second touch metal layer. The touch layer 190 provided in the present embodiment may be of a mutual capacitance type or a self-capacitance type. The specific type and structure of the touch layer 190 may be selected based on actual needs.

[0059] See also Figure 1 The display module 100 further includes a first backplane 121 and a second backplane 122, which are disposed separately on a side of the display panel 200 away from the light-emitting surface. The first backplane 121 and the second backplane 122 are disposed on the non-light-emitting side of the display module 100 and are used to support the display panel 200. The material of the first backplane 121 and the second backplane 122 may include polyethylene terephthalate, etc.

[0060] See also Figure 1 The display module 100 further includes a supporting functional layer provided on the side of the backplane away from the display layer 10. The supporting functional layer is used to cooperate with the backplane to support the display panel 200 and to dissipate heat from the display panel 200. The supporting functional layer may include a plurality of stacked sublayers, such as a first supporting layer 131, a second supporting layer 132, and a buffer member 140 located between the first supporting layer 131 and the first backplane 121. The first supporting layer 131 and the first backplane 121 are bonded by an adhesive layer, and the second supporting layer 132 and the second backplane 122 are bonded by an adhesive layer. The material of the first supporting layer 131 may be stainless steel, and the material of the second supporting layer 132 may be steel sheet or polyethylene terephthalate (PET), etc. The material of the buffer member 140 may include foam or polyimide (PI) with relatively large elastic deformation properties.

[0061] It should be noted that the ends of the second back plate 122 and the second supporting layer 132 close to the flexible printed circuit board 300 may be flush with the edge of the first binding portion 10 b or retracted from the edge of the first binding portion 10 b.

[0062] It should be noted that both the first protective layer 50 and the second protective layer 60 are protective films with built-in optical adhesive, and the second protective layer 60 is a replaceable protective film.

[0063] It should be noted that the display panel 200 further includes a third protective layer 70 covering the bending portion 10c, a portion of the planar portion 10a and a portion of the first binding portion 10b. The third protective layer 70 may be ultraviolet optical adhesive.

[0064] See also Figure 1 The display layer 10 includes a planar portion 10a, a first binding portion 10b located on one side of the planar portion 10a, and a bending portion 10c connecting the planar portion 10a and the first binding portion 10b. The first binding portion 10b is bent to the side of the display panel 200 away from the light emitting direction, and the side of the first binding portion 10b close to the planar portion 10a is bonded to the second back panel 122.

[0065] See also Figure 1 The flexible circuit board 300 may include a flexible body 310 and the support member 320 provided on one side of the flexible body 310. The support member 320 may be provided between the flexible body 310 and the first supporting layer 131. The surface of the support member 320 close to the flexible body 310 may be bonded to the flexible body 310 by a viscous adhesive such as a second adhesive 342. The surface of the support member 320 away from the flexible body 310 may be bonded to the first supporting layer 131 by a viscous adhesive such as a first adhesive 341.

[0066] In this embodiment, the first adhesive material 341 may be a pressure-sensitive adhesive, and the second adhesive material 342 may be a thermosetting adhesive.

[0067] In this embodiment, the flexible body 310 may include multiple layers of single-layer boards 400, for example Figure 3 The flexible body 310 in the embodiment may be a three-layer single-layer plate 400, for example, Figure 1 In the structure, a single-layer board 400 of the present application can extend to the first binding portion 10b and be bound and connected to the first binding portion 10b, and the extended section of the single-layer board 400 serves as the second binding portion 310a of the flexible circuit board 300.

[0068] exist Figure 3In the structure, each single-layer board 400 includes an insulating substrate 410, a first conductive layer 420, a first insulating layer 440, a second conductive layer 430 and a second insulating layer 450. The first conductive layer 420 is arranged on the surface of the insulating substrate 410 close to the display panel 200, the first insulating layer 440 is arranged on the surface of the first conductive layer 420 close to the display panel 200, the second conductive layer 430 is arranged on the surface of the insulating substrate 410 away from the display panel 200, and the second insulating layer 450 is arranged on the surface of the second conductive layer 430 close to the display panel 200.

[0069] In this embodiment, the material of the insulating substrate 410 can be a flexible insulating material such as polyimide, the first conductive layer 420 and the second conductive layer 430 can be made of a metal material with good conductivity such as copper, and the material of the first insulating layer 440 and the second insulating layer 450 can be a flexible insulating material such as polyimide.

[0070] exist Figure 3 In the structure, the first conductive layer 420 can be formed by stacking two copper layers, and an insulating adhesive 460 is provided between the first insulating layer 440 and the first conductive layer 420, and between the second insulating layer 450 and the second conductive layer 430, and the insulating layer and the conductive layer are bonded by the insulating adhesive 460; at the same time, an electromagnetic shielding layer 470 is also provided on the surface of the outermost first insulating layer 440 and the second insulating layer 450 to shield the interference of external electrical signals to the inside of the flexible circuit board 300.

[0071] exist Figure 3 In the structure, two adjacent single-layer boards 400 can share an insulating layer, for example, the second insulating layer 450 of the middle single-layer board 400 and the first insulating layer 440 of the upper single-layer board 400 are shared, and the first insulating layer 440 of the middle single-layer board 400 and the second insulating layer 450 of the lower single-layer board 400 are shared.

[0072] See also Figure 1 A functional element 330 is further provided on a side of the flexible body 310 away from the support member 320 . The functional element 330 may be a resistor, a capacitor or other device.

[0073] Due to the provision of the support member 320 , the rigidity of the flexible circuit board 300 is increased, and the impact resistance of the flexible circuit board 300 is improved. However, the high yield strength of the support member 320 makes the edge of the support member 320 prone to warping, resulting in the support member 320 being separated from the first support layer 131 .

[0074] See also Figure 4The support member 320 includes a first part 321, a second part 322 and a third part 323 arranged and connected along the width direction of the display panel 200, and the stiffness of the second part 322 is greater than the stiffness of the first part 321, or / and the stiffness of the second part 322 is greater than the stiffness of the third part 323.

[0075] In this embodiment, the separation of the support member 320 from the first supporting layer 131 occurs primarily at the two ends of the support member 320 along the width direction of the display panel 200. For example, if the first portion 321 warps, the present invention can reduce the stiffness of only the first portion 321, while leaving the second portion 322 and the third portion 323 untreated. If the third portion 323 warps, the present invention can reduce the stiffness of only the third portion 323, while leaving the first portion 321 and the second portion 322 untreated. If both the first portion 321 and the third portion 323 warp, the present invention can reduce the stiffness of both portions simultaneously to reduce their yield strengths and prevent warping. This prevents the flexible circuit board 300 from separating from the first supporting layer 131 while maintaining its impact resistance.

[0076] See also Figure 4 , the first part 321 is arranged close to the functional element 330 , the third part 323 is arranged away from the functional element 330 , and the stiffness of the first part 321 is smaller than the stiffness of the third part 323 .

[0077] In this embodiment, since it is necessary to apply a certain pressure on the flexible circuit board 300 to make the flexible circuit board 300 adhere to the first supporting layer 131, the first part 321 is arranged close to the functional element 330, or the first part 321 partially overlaps with the functional element 330, and the area where the functional element 330 is located cannot be applied with pressure. Therefore, the pressure applied on the first part 321 is less than the pressure applied on the third part 323. Therefore, compared with the third part 323, the area where the first part 321 is located is more prone to warping. The present application further reduces the stiffness of the first part 321 so that the stiffness of the first part 321 is less than the stiffness of the third part 323, so as to reduce the yield strength of the first part 321 and avoid warping of the first part 321. Under the premise of ensuring the impact resistance of the flexible circuit board 300, the separation of the flexible circuit board 300 and the first supporting layer 131 is avoided.

[0078] In order to improve the rigidity of the support member 320 , the present application may perform patterning on the support member 320 .

[0079] In this embodiment, the support member 320 may be provided with a plurality of grooves 320a on one side facing the flexible body 310; Figures 5 to 7 In the embodiment, the first portion 321 , the second portion 322 and the third portion 323 of the support member 320 are all provided with the grooves 320 a , and the grooves 320 a are evenly distributed.

[0080] In this embodiment, in the top view of the support member 320, the shape of the groove 320a is at least one of a capsule, a circle, a triangle or a quadrilateral. Figure 5 The shape of the groove 320a can be capsule-shaped. Figure 6 The shape of the groove 320a can be circular. Figure 7 The shape of the groove 320a can be triangular.

[0081] In this embodiment, the depth of the groove 320a can be less than or equal to the thickness of the support member 320, that is, according to the rigidity requirement of the support member 320, the groove 320a of the present application can be fully etched or half etched. When the depth of the groove 320a is equal to the thickness of the support member 320, the groove 320a is formed by a full etching process. When the depth of the groove 320a is less than the thickness of the support member 320, the groove 320a is formed by a half etching process.

[0082] For example, since the stiffness of the second portion 322 is greater than the stiffness of the third portion 323 and the stiffness of the first portion 321, the groove 320a may be provided only in the first portion 321 and the third portion 323 to reduce the stiffness of the first portion 321 and the third portion 323; when the stiffness of the first portion 321 is less than the stiffness of the third portion 323, the stiffness of the second portion 322 is the largest and the stiffness of the first portion 321 is the smallest. In this application, the groove 320a in the third portion 323 may be half-etched and the groove 320a in the first portion 322 may be fully etched to further reduce the stiffness of the first portion 321. For details, please refer to Figure 8 .

[0083] In this embodiment, the grooves 320a are provided in the first portion 321, the second portion 322, and the third portion 323, and the grooves 320a are evenly distributed. The depth of the grooves 320a in the second portion 322 can be smaller than the depth of the grooves 320a in the third portion 323, and the depth of the grooves 320a in the first portion 321 can be greater than the depth of the grooves 320a in the third portion 323. For details, please refer to Figure 9 .

[0084] In this embodiment, the grooves 320a are provided in the first part 321, the second part 322 and the third part 323, and the depth of the grooves 320a is equal to the thickness of the support member 320, that is, the number of the grooves 320a provided in the second part 322 under the same area is the least, the number of the grooves 320a provided in the first part 321 under the same area is the largest, and the number of the grooves 320a provided in the third part 323 under the same area is in the middle; or, when the number of the grooves 320a per unit area is the same, the area of ​​the grooves 320a in the second part 322 is the smallest, the area of ​​the grooves 320a in the third part 323 is in the middle, and the area of ​​the grooves 320a in the first part 321 is the largest.

[0085] In this example, see Figure 10 Since the first part 321 is prone to warping, the present application can only set the groove 320a in the first part 321, and the second part 322 and the third part 323 do not need to be etched.

[0086] In this embodiment, under the premise that the impact resistance of the flexible circuit board 300 meets the requirements, the present application can also reduce the stiffness of the second portion 322, so that the stiffness of the flexible body 310 gradually decreases in the direction from the third portion 323 to the first portion 321. For example, see Figure 11 , in the direction from the third portion 323 to the first portion 321, the depth of the groove 320a may gradually increase; for example, see Figure 12 In the direction from the third portion 323 to the first portion 321 , the area of ​​the groove 320 a may gradually increase.

[0087] When the depth of the groove 320a is equal to the thickness of the support member 320, that is, the groove 320a is prepared using a full etching process, the surface area of ​​the support member 320 close to the first support layer 131 will be reduced, and the bonding area between the support member 320 and the pressure-sensitive adhesive will be reduced, thereby reducing the adhesion between the support member 320 and the first support layer 131.

[0088] In this embodiment, when the depth of the groove 320 a is equal to the thickness of the support member 320 , in a top view of the support member 320 , the sum of the areas of the plurality of grooves 320 a is less than or equal to half the area of ​​the support member 320 .

[0089] In this embodiment, when the stiffness of the support member 320 is reduced, the present application can make the sum of the areas of the multiple grooves 320a less than or equal to half of the area of ​​the support member 320, thereby reducing the yield strength of the support member 320, ensuring the adhesion between the support member 320 and the first supporting layer 131, and avoiding the technical problem of separation of the support member 320 from the display panel 200 due to warping of the edges of the support member 320.

[0090] When the groove 320a is formed by a half-etching process, if the depth of the groove 320a is too large, etching marks will appear on the surface of the support member 320 close to the first supporting layer 131, resulting in reduced adhesion between the support member 320 and the first supporting layer 131.

[0091] In this example, see Figure 13 In the present application, the depth H1 of the groove 320a can be less than or equal to half the thickness H2 of the support member 320. The provision of the groove 320a reduces the rigidity of the support member 320 and prevents etching marks from appearing on the surface of the support member 320 on the side close to the first supporting layer 131, thereby ensuring adhesion between the support member 320 and the first supporting layer 131 and avoiding the technical problem of separation of the support member 320 from the display panel 200 due to warping of the edge of the support member 320.

[0092] In this embodiment, the thickness of the support member 320 ranges from 30 μm to 100 μm. For example, the thickness of the support member 320 may be 50 μm.

[0093] In this embodiment, the support member 320 may be made of metal. For example, the support member 320 and the first support layer 131 may both be made of steel sheets, and the stiffness of the support member 320 is less than that of the first support layer 131 .

[0094] It should be noted that the present application also proposes a display device, which includes the above-mentioned display panel, and the display device of the present application can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, etc.

[0095] The present application provides a display module and a display device; the display module includes a display panel and a flexible circuit board, the display panel includes a planar portion and a first binding portion located on one side of the planar portion, the flexible circuit board includes a flexible body and a support member provided on one side of the flexible body, the flexible body is provided with a second binding portion bound to the first binding portion, and the stiffness of the support member is less than or equal to the stiffness of the flexible body; the present application reduces the stiffness of the support member in the flexible circuit board so that the stiffness of the support member is less than or equal to the stiffness of the flexible body, thereby reducing the yield strength of the support member and avoiding the technical problem of separation of the support member from the display panel due to warping of the edge of the support member.

[0096] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0097] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] In the above embodiments, the structures shown in the drawings are only schematic diagrams, and the specific structure of the display panel of the present application is mainly based on the description.

[0099] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0100] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: The display panel includes a plane portion and a first binding portion located on one side of the plane portion; A flexible circuit board comprising a flexible body and a support member disposed on one side of the flexible body, wherein the flexible body is provided with a second binding portion bound to the first binding portion, and the support member comprises a first portion, a second portion, and a third portion disposed along the width direction of the display panel and connected thereto; Wherein, the stiffness of the support member is less than or equal to the stiffness of the flexible body, the stiffness of the second part is greater than the stiffness of the first part, or / and the stiffness of the second part is greater than the stiffness of the third part.

2. The display module according to claim 1, wherein: The flexible circuit board further includes a functional element disposed on a side of the flexible body away from the support member; The first part is arranged close to the functional element, the third part is arranged far away from the functional element, and the rigidity of the first part is smaller than that of the third part.

3. The display module according to claim 1, wherein: The second binding portion and the flexible body corresponding to the support member both include single-layer boards, and the number of single-layer boards in the flexible body corresponding to the support member is greater than the number of single-layer boards in the second binding portion.

4. The display module according to any one of claims 1 to 3, wherein: A plurality of grooves are formed on a side of the support member facing the flexible body, and a depth of the grooves is less than or equal to a thickness of the support member.

5. The display module according to claim 4, wherein: In a top view of the support member, the sum of the areas of the plurality of grooves is less than or equal to half the area of ​​the support member, and the depth of the grooves is less than or equal to half the thickness of the support member.

6. The display module according to any one of claims 1 to 3, wherein: The display module further includes: a first back plate, disposed on a first side of the planar portion close to the first binding portion; a first supporting layer, disposed on a side of the first back plate away from the planar portion; The surface of the support member away from the flexible body is bonded to the first support layer via a first adhesive, and the surface of the support member close to the flexible body is bonded to the flexible body via a second adhesive.

7. The display module according to claim 6, wherein: The first adhesive material is a pressure-sensitive adhesive, and the second adhesive material is a thermosetting adhesive.

8. The display module according to claim 6, wherein: The support member and the first support layer are both made of steel sheets, and the rigidity of the support member is smaller than that of the first support layer.

9. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 8.

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