A pressure oven based on semiconductor packaging automation

Abstract

The present invention discloses a pressure oven based on semiconductor packaging automation, comprising: a pressure oven main body, the pressure oven main body includes an outer baking box body, a heating mechanism, a nitrogen module, and a pressure module. An inner baking and pressing cavity and an assembly cavity are provided inside the outer baking box body. The nitrogen module and the pressure module are arranged in the assembly cavity, and the heating mechanism is arranged in the inner baking and pressing cavity. A controller is arranged at the front part of the outer baking box body, and the nitrogen module and the pressure module are respectively communicated with the inner baking and pressing cavity. The present invention provides a pressure oven based on semiconductor packaging automation. Through the controller, the heating mechanism, the nitrogen module, and the pressure module can be controlled, so that the glue for semiconductor packaging can be statically placed and cured. And through the pressure module, the low vacuum and high pressure can be switched at any time, so that the glue can be filled into the welding gaps and around the components vulnerable to contamination as much as possible, reducing the occurrence of voids and bubbles in the glue, improving the overall quality and reliability of the product, and providing a good product rate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging devices. More specifically, the present invention relates to a pressure oven based on semiconductor packaging automation. Background Art

[0002] Semiconductor packaging refers to the process of processing wafers that have passed testing into independent chips according to product models and functional requirements. The packaging process is as follows: wafers from the front-end process of the wafer are cut into small chips through a dicing process, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuit. Glue is applied to the outer ring of the chip to ensure the firmness of the chip, and then the independent chip is encapsulated with an injection-molded resin shell for protection.

[0003] Chinese invention patent with application number CN201810777963.0 discloses an oven for packaging semiconductor components and its usage method, including a baking part. A driving part is provided above the baking part, and four groups of elastic units are symmetrically provided at the bottom of the baking part. Universal wheels are installed at the bottom of the four groups of elastic units. In the present invention, it is possible to achieve layered baking of semiconductor components during the packaging process using different temperatures, which can prevent semiconductor components from being contaminated by dust when transferred from a low-temperature oven to a high-temperature oven, thereby ensuring the packaging quality of semiconductor components. It can replace traditional low-temperature ovens and high-temperature ovens, effectively saving the procurement cost of enterprises. It can eliminate the process of transferring semiconductor components from a low-temperature oven to a high-temperature oven, which can not only reduce the labor intensity of workers but also improve the packaging efficiency of semiconductor components. In addition, it has good shock absorption performance, is easy to move, and is convenient to use, and is worthy of promotion and popularization.

[0004] However, the oven in the above technical solution mainly focuses on layered baking of semiconductor components during the packaging process using different temperatures. The influence of pressure is not considered during the semiconductor packaging process, which will inevitably cause voids and bubbles to appear during the curing of the glue, thereby affecting the quality and performance and reducing the yield. Therefore, it is necessary to propose a pressure oven based on semiconductor packaging automation to at least partially solve the problems existing in the prior art. Summary of the Invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention section, which will be further elaborated in the Detailed Description section. The Summary of the Invention section of the present invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0006] To at least partially solve the above problems, the present invention provides a pressure oven based on semiconductor packaging automation, including: a pressure oven main body, the pressure oven main body includes an outer baking box body, a heating mechanism, a nitrogen module, and a pressure module. An inner baking and pressing cavity and an assembly cavity are provided in the outer baking box body. The nitrogen module and the pressure module are arranged in the assembly cavity, the heating mechanism is arranged in the inner baking and pressing cavity, a controller is arranged at the front part of the outer baking box body, and the nitrogen module and the pressure module are respectively communicated with the inner baking and pressing cavity. The heating mechanism, the nitrogen module, and the pressure module are respectively electrically connected to the controller.

[0007] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, the pressure module includes a vacuum pressure part and a boosting pressure part. The vacuum pressure part and the boosting pressure part are both arranged in the assembly cavity, and the vacuum pressure part and the boosting pressure part are respectively electrically connected to the controller.

[0008] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, a pushing rack is arranged in the inner baking and pressing cavity, and the pushing rack is used to push the workpiece rack.

[0009] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, the pushing rack includes a pushing main support seat, side support seats, a plurality of pushing rotating rods, and a pushing power part. The side support seats are arranged on one side of the pushing main support seat, a plurality of the pushing rotating rods are arranged between the pushing main support seat and the side support seats, and the pushing power part is arranged at the bottom of the pushing main support seat. The pushing power part is rotationally connected to the pushing rotating rods, and the pushing rotating rods can push the workpiece rack to move.

[0010] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, a limiting mechanism is further arranged on the pushing main support seat. The limiting mechanism includes a limiting seat and a vertical limiting frame. The limiting seat is arranged on the side wall of the pushing main support seat, and the vertical limiting frame is arranged on the limiting seat.

[0011] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, the workpiece rack includes a top plate, a bottom plate, and two vertical side plates. The top plate and the bottom plate are arranged at the upper end and the lower end of the two vertical side plates, and a plurality of first hollow slots are arranged on the top plate and the bottom plate. A plurality of second hollow slots are arranged on the vertical side plates, and a workpiece plate is arranged between two second hollow slots at the same level.

[0012] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, the heating mechanism includes an inverted U-shaped frame, a blower, and a plurality of heating seats. The inverted U-shaped frame is arranged in the inner baking and pressing cavity. A flow guiding cavity is provided in the inverted U-shaped frame. A plurality of the heating seats are evenly distributed on the inner wall of the inverted U-shaped frame. The blower is arranged at the inner top of the inverted U-shaped frame, and a heating wire is arranged in the heating seat.

[0013] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, the pressurizing pressure part includes a pressurizing pump group and a pressurizing guide cylinder, and the pressurizing pump group is communicated with the inner baking and pressing cavity through the pressurizing guide cylinder.

[0014] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, it further includes: a leak-proof joint assembly, the leak-proof joint assembly includes a first leak-proof joint and a second leak-proof joint, the first leak-proof joint is arranged on the partition board, the first leak-proof joint has an outer extension head, the second leak-proof joint is arranged on the inner extension head of the pressurizing guide cylinder, there is a receiving groove between the second leak-proof joint and the inner extension head, the outer extension head can be inserted into the receiving groove, there are a plurality of outer locking grooves on the outer wall of the outer extension head, and there are a plurality of inner locking mechanisms corresponding to the outer locking grooves in the second leak-proof joint.

[0015] According to the pressure oven based on semiconductor packaging automation of the embodiment of the present invention, there are a plurality of anti-slosh inner grooves on the inner wall of the outer extension head, and anti-slosh convex plates corresponding to the anti-slosh inner grooves on the outer wall of the inner extension head.

[0016] Compared with the prior art, the present invention at least includes the following beneficial effects:

[0017] The present invention provides a pressure oven based on semiconductor packaging automation. The pressure oven based on semiconductor packaging automation includes a pressure oven main body, and the pressure oven main body includes an outer baking box body, a heating mechanism, a nitrogen module, and a pressure module. Among them, there is a partition board in the outer baking box body, and the outer baking box body is divided into an inner baking and pressing cavity and an assembly cavity through the partition board. Then, the above-mentioned nitrogen module and pressure module are installed in the assembly cavity, and the nitrogen module and the pressure module are communicated with the inner baking and pressing cavity. A heating mechanism is installed in the inner baking and pressing cavity, and the nitrogen module and the pressure module are respectively communicated with the inner baking and pressing cavity. A controller is installed at the front part of the outer baking box body, and the heating mechanism, the nitrogen module, and the pressure module are respectively electrically connected to the controller. Therefore, through the controller, the above-mentioned heating mechanism, nitrogen module, and pressure module can be started to provide working environments such as heating and nitrogen in the inner baking and pressing cavity, so that the glue for semiconductor packaging can be statically placed and cured. And through the pressure module, the low vacuum and high pressure can be switched at any time, so that the glue can be filled into the welding gaps and around the components that are easily contaminated as much as possible, reducing the appearance of voids and bubbles in the glue, and overall improving the quality and reliability of the product and providing the yield rate.

[0018] For the pressure oven based on semiconductor packaging automation of the present invention, other advantages, objectives, and features of the present invention will be partially reflected by the following description, and will also be understood by those skilled in the art through the research and practice of the present invention. Description of the Drawings

[0019] The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the accompanying drawings:

[0020] Figure 1 is a schematic structural diagram of the present invention.

[0021] Figure 2 is a schematic internal structure diagram of the present invention.

[0022] Figure 3 is a schematic structural diagram of the heating mechanism in the present invention.

[0023] Figure 4 is a schematic structure of the pushing frame in the present invention Figure 1 .

[0024] Figure 5 is a schematic structure of the pushing frame in the present invention Figure 2 .

[0025] Figure 6 is a schematic structural diagram of the workpiece rack in the present invention.

[0026] Figure 7 is a schematic structure of the leak-proof joint assembly in the present invention Figure 1 .

[0027] Figure 8 is a schematic structure of the leak-proof joint assembly in the present invention Figure 2 .

[0028] Figure 9 is a schematic structure of the second leak-proof joint in the present invention Figure 1 .

[0029] Figure 10 is a schematic structure of the second leak-proof joint in the present invention Figure 2 .

[0030] Figure 11 is of the present invention Figure 7 a schematic enlarged structural diagram of the partial area A.

[0031] Figure 12 is of the present invention Figure 8 a schematic enlarged structural diagram of the partial area B.

[0032] Figure 13 is of the present invention Figure 10 a schematic enlarged structural diagram of the partial area C.

[0033] Figure 14 is of the present invention Figure 10 a schematic enlarged structural diagram of the partial area D. Detailed implementation manners

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, so that those skilled in the art can implement it with reference to the text of the specification.

[0035] It should be understood that terms such as "having", "comprising", and "including" used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0036] As Figures 1 - 3 shown, the present invention provides a pressure oven based on semiconductor packaging automation, including: a pressure oven main body 100, where the pressure oven main body 100 includes an outer baking box body 1, a heating mechanism 2, a nitrogen module 3, and a pressure module 4. Among them, a partition 10 is provided inside the outer baking box body 1, and the inner baking and pressing cavity 11 and the assembly cavity 12 are separated inside the outer baking box body 1 by the partition 10. Then, the above-mentioned nitrogen module 3 and pressure module 4 are installed in the assembly cavity 12, and the nitrogen module 3 and pressure module 4 are communicated with the inner baking and pressing cavity 11. The heating mechanism 2 is installed in the inner baking and pressing cavity 11, and the nitrogen module 3 and pressure module 4 are respectively communicated with the inner baking and pressing cavity 11. A controller 101 is installed at the front of the outer baking box body 1, and the heating mechanism 2, the nitrogen module 3, and the pressure module 4 are respectively electrically connected to the controller 101. Therefore, the above-mentioned heating mechanism 2, nitrogen module 3, and pressure module 4 can be started through the controller 101 to provide a working environment such as heating and nitrogen inside the inner baking and pressing cavity 11, so that the glue for semiconductor packaging can be statically placed and cured. And through the pressure module 4, the low vacuum and high pressure can be switched at any time, so that the glue can be filled into the welding gaps and around the components that are easily contaminated as much as possible, reducing the occurrence of voids and bubbles in the glue, improving the quality and reliability of the product as a whole, and providing the yield rate.

[0037] Exemplary heating mechanism

[0038] Further, in some embodiments of the present invention, the specific structure of the heating mechanism 2 is provided. Here, the heating mechanism 2 of this structure includes an inverted U-shaped frame 21, a blower 22, and a plurality of heating seats 23. Among them, the inverted U-shaped frame 21 is installed in the inner baking and pressing cavity 11 and covers the pushing frame 5. The blower 22 is installed on the inner top of the inverted U-shaped frame 21. By adopting the built-in design of the blower 22, the space occupied by the inner baking and pressing cavity 11 can be greatly saved. A diversion cavity 211 is formed in the inverted U-shaped frame 21, and a plurality of mounting grooves 212 are provided on the inner wall of the inverted U-shaped frame 21. The plurality of heating seats 23 are respectively installed in the plurality of mounting grooves 212, so that the plurality of heating seats 23 can be evenly distributed on the inner wall of the inverted U-shaped frame 21. A heating wire is provided in the heating seat 23. Therefore, after the blower 22 is started, it blows air into the diversion cavity 211, and then blows the heat in the heating seat 23 into the workpiece rack 6 to uniformly heat and package the semiconductor, improving the packaging quality. Further still, a HEPA purification layer 24 is also installed on the inner top of the inverted U-shaped frame 21, which can meet the requirements of a dust-free welding environment.

[0039] Exemplary pressure module

[0040] As Figure 2 As shown, further, in some embodiments of the present invention, the specific structure of the pressure module 4 is provided. Here, the pressure module 4 of this structure includes a vacuum pressure part 41 and a boosting pressure part 42. Among them, the vacuum pressure part 41 and the boosting pressure part 42 are both installed in the assembly cavity 12, and the boosting pressure part 42 and the vacuum pressure part 41 are respectively communicated with the inner baking and pressing cavity 11. The vacuum pressure part 41 and the boosting pressure part 42 can be respectively started through a controller to control the pressure in the inner baking and pressing cavity 11, realizing the seamless switching between a low vacuum of 15 mbar and a high pressure of 1.0 Mpa, so that the glue can be filled into the welding gaps and around the components vulnerable to contamination as much as possible, reducing the occurrence of voids and bubbles in the glue, overall improving the quality and reliability of the product, and providing a good product rate.

[0041] Even further, the above-mentioned boosting pressure part 42 includes a boosting pump group 43 and a boosting guide cylinder 44. Among them, the boosting pump group 43 is communicated with the inner baking and pressing cavity 11 through the boosting guide cylinder 44. By starting the boosting pump group 43, the inner baking and pressing cavity 11 can be boosted, and a filter screen can also be installed in the boosting guide cylinder 44 to intercept dust.

[0042] Exemplary pushing frame

[0043] As Figures 4 - 5 As shown, further, in some embodiments of the present invention, a pushing frame 5 is installed in the inner baking and pressing cavity 11. The pushing frame 5 can be used to push the workpiece rack 6. Here, a workpiece plate (not shown) can be placed in the workpiece rack 6, and the workpiece plate is arranged with the semiconductor to be packaged.

[0044] Further, the above-mentioned pushing frame 5 includes a main pushing support base 51, side support bases 52, a plurality of pushing rotating rods 53, and a pushing power unit 54. Among them, the side support bases 52 are installed on one side of the main pushing support base 51, and the plurality of pushing rotating rods 53 are arranged between the main pushing support base 51 and the side support bases 52. The three form the main structure of the pushing frame 5, and the pushing power unit 54 is installed at the bottom of the main pushing support base 51. The pushing power unit 54 can be rotationally connected to the above-mentioned plurality of pushing rotating rods 53 through a chain. Therefore, after the workpiece rack 6 is placed on the plurality of pushing rotating rods 53, the pushing power unit 54 is started to drive the plurality of pushing rotating rods 53 to rotate. After the plurality of pushing rotating rods 53 rotate in the same direction, the workpiece rack 6 is pushed into the inner baking and pressing cavity 11. In this way, when the heating mechanism 2 is started, the semiconductor in the workpiece rack 6 can be heated and encapsulated, and used in cooperation with the above-mentioned pressure module 4 to realize the switching between a low vacuum of 15 mbar and a high pressure of 1.0 Mpa at any time, so that the glue can be filled into the welding gaps and around the components vulnerable to contamination as much as possible, reducing the occurrence of voids and bubbles in the glue, improving the overall quality and reliability of the product, and providing the yield rate.

[0045] Further, a limiting mechanism 55 is also installed on the above-mentioned main pushing support base 51. Here, the limiting mechanism 55 of this structure includes a limiting seat 551 and a vertical limiting frame 552. Among them, the limiting seat 551 is installed on the side wall of the main pushing support base 51, and the vertical limiting frame 552 is installed on the limiting seat 551. Therefore, when the workpiece rack 6 contacts the vertical limiting frame 552 after being pushed on the workpiece rack 6, the pushing power unit 54 stops working, so that the workpiece rack 6 can be pushed to a suitable position inside the inner baking and pressing cavity 11.

[0046] It can be understood that a plurality of detection and limiting sensor modules 56 are also installed on the pushing frame 5. Through the detection and limiting sensor modules 56, the position of the workpiece rack 6 can be detected and limited more accurately, improving the working efficiency.

[0047] Exemplary workpiece rack

[0048] Such as Figure 6As shown, further, in some embodiments of the present invention, the specific structure of the workpiece holder 6 is provided. Here, the workpiece holder 6 of this structure includes a top plate 61, a bottom plate 62, and two vertical side plates 63. Among them, the top plate 61 and the bottom plate 62 are installed at the upper and lower ends of the two vertical side plates 63. A plurality of first hollow slots 621 are opened on the top plate 61 and the bottom plate 62, and a plurality of second hollow slots 631 are opened on the vertical side plates 63. And a workpiece plate can be installed between two second hollow slots 631 at the same level. Here, semiconductors to be encapsulated are arranged on the workpiece plate. Through the design of the above-mentioned first hollow slots 621 and second hollow slots 631, heat can enter the workpiece holder 6 conveniently and be evenly distributed above and below the workpiece plate, so as to realize the encapsulation of semiconductors more evenly. Cooperating with the use of the pressure module 4, the glue can be filled into the welding gaps and around the components that are easily contaminated as much as possible, reducing the occurrence of voids and bubbles in the glue, improving the quality and reliability of the product as a whole, and providing a good product rate.

[0049] Exemplary leak-proof joint assembly

[0050] As Figures 7 - 14 shown, further, in some embodiments of the present invention, the pressurizing guide cylinder 44 is connected to the internal baking and pressing cavity 11 through a leak-proof joint assembly 7. Here, the leak-proof joint assembly 7 includes a first leak-proof joint 71 and a second leak-proof joint 72, and the first leak-proof joint 71 and the second leak-proof joint 72 can prevent air leakage and facilitate subsequent maintenance.

[0051] Specifically, here the first leak-proof joint 71 is installed on the partition plate 10. The first leak-proof joint 71 has an outer extension head 711, and the second leak-proof joint 72 is installed on the inner extension head 441 of the cooling pipe 70. The inner extension head 441 also has an inner leak-proof ring 443. Among them, there is a receiving groove 710 between the second leak-proof joint 72 and the inner extension head 441. So when the first leak-proof joint 71 and the second leak-proof joint 72 are connected, the second leak-proof joint 72 is aligned with the first leak-proof joint 17 so that the outer extension head 711 can be inserted into the receiving groove 710. Further, there are a plurality of outer locking grooves 712 on the outer wall of the outer extension head 711, and a plurality of inner locking mechanisms 73 corresponding to the outer locking grooves 712 are provided in the second leak-proof joint 72. So the inner locking mechanism 73 is stuck on the outer locking groove 712 of the first leak-proof joint 17 to complete the locking, and at the same time, the first leak-proof joint 17 abuts against the inner leak-proof ring 443, so as to realize the fixed leak-proof connection between the first leak-proof joint 17 and the second leak-proof joint 72.

[0052] Further, a plurality of anti-slosh inner grooves 713 are formed on the inner wall of the outer extension head 711. Correspondingly, anti-slosh convex plates 442 corresponding to the anti-slosh inner grooves 713 are provided on the outer wall of the inner extension head 441. Therefore, when the outer extension head 711 enters the receiving groove 710, the anti-slosh convex plates 442 are correspondingly positioned on the anti-slosh inner grooves 713, thereby facilitating the fixing of the outer extension head 711 to the inner extension head 441 and preventing the outer extension head 711 from circumferentially rotating on the inner extension head 441, avoiding the misalignment between the inner locking mechanism 73 and the outer locking groove 712 and reducing the fixed leak-proof effect between the first leak-proof joint 17 and the second leak-proof joint 72.

[0053] Exemplary second leak-proof joint

[0054] As Figures 9 - 10 shown, further, in some embodiments of the present invention, the specific structure of the second leak-proof joint 72 is provided. Here, the second leak-proof joint 72 of this structure includes a leak-proof sealing plate 721 and a leak-proof cone cap 722. Among them, the leak-proof cone cap 722 is installed on the inner extension head 441 through an inner support member 720, the leak-proof sealing plate 721 is installed at the front end of the leak-proof cone cap 722, and an inner opening 7211 corresponding to the inner extension head 441 is provided on the leak-proof sealing plate 721;

[0055] And the above-mentioned inner locking mechanism 73 includes an inner linkage part 74 and a plurality of lock core parts 75. Among them, the inner linkage part 74 is movably installed inside the leak-proof cone cap 722, and the plurality of lock core parts 75 are evenly distributed on the inner end wall of the leak-proof cone cap 722 and are rotationally connected to the inner linkage part 74. Further, a handle member 723 is installed on the outside of the leak-proof cone cap 722 and is rotationally connected to the inner linkage part 74. Therefore, after rotating the handle member 723, the handle member 723 drives the internal inner linkage part 74 to rotate as well. The inner linkage part 74 drives the plurality of lock core parts 75 to act on the outer extension head 711. Then, the lock core parts 75 abut against the outer locking groove 712, realizing the locking of the outer extension head 711 by the inner locking mechanism 73. At the same time, the first leak-proof joint 17 abuts against the inner leak-proof ring 443, thereby realizing the fixed leak-proof connection between the first leak-proof joint 17 and the second leak-proof joint 72.

[0056] Furthermore, the above-mentioned inner support member 720 includes an inner support ring 7201 and a plurality of inner support plates 7202. The inner support ring 7201 is fixed on the inner extension head 441, and the plurality of inner support plates 7202 are evenly distributed on the inner extension head 441 and are connected to the inner wall of the leak-proof cone cap 722, thereby further fixing and supporting the leak-proof cone cap 722 on the inner extension head 441 through the above-mentioned inner support member 720.

[0057] Exemplary lock core part

[0058] As Figure 13As shown, further, in some embodiments of the present invention, the specific structure of the lock core portion 75 is provided. Here, the lock core portion 75 of this structure includes a lock core base plate 751, a first elastic member 752, a lock core clamping plate 753, and a second elastic member 754. Among them, the first elastic member 752 is installed on the inner end wall of the leak-proof cone cap 722, the lock core base plate 751 is installed on the first elastic member 752, the second elastic member 754 is installed on the lock core base plate 751, the lock core clamping plate 753 is installed on the second elastic member 754, and the lock core clamping plate 753 abuts against the outer lock groove 712;

[0059] The lock core portion 75 can support the lock core base plate 751 through two first elastic members 752, and the lock core base plate 751 supports the lock core clamping plate 753 through two elastic members 754, so that the lock core clamping plate 753 can be clamped and abutted into the outer lock groove 712. Moreover, the first elastic member 752 and the second elastic member 754 also have a contraction function, which facilitates the subsequent separation of the lock core clamping plate 753 from the outer lock groove 712, and is convenient for the subsequent separation of the first leak-proof joint 17 and the second leak-proof joint 72 for maintenance.

[0060] Among them, the first elastic member 752 includes a first cylinder body 7521, a first inner support column 7522, and a first spring body 7523. The first cylinder body 7521 is installed on the inner end wall of the leak-proof cone cap 722. The first inner support column 7522 is installed in the first cylinder body 7521 and is connected to the lock core base plate 751. The first spring body 7523 is sleeved on the first cylinder body 7521 and the first inner support column 7522, and abuts and supports on the lock core base plate 751 and the inner end wall of the leak-proof cone cap 722 to achieve the support and contraction of the first elastic member 752. Similarly, the second elastic member 754 includes a second cylinder body 7541, a second inner support column 7542, and a second spring body 7543. The second cylinder body 7541 is installed on the lock core base plate 751. The second inner support column 7542 is installed in the second cylinder body 7541. The lock core clamping plate 753 is installed on the second inner support column 7542. The second spring body 7543 is sleeved on the second cylinder body 7541 and the second inner support column 7542, and abuts and supports between the lock core base plate 751 and the lock core clamping plate 753 to achieve the support and contraction of the second elastic member 754.

[0061] Exemplary internal linkage portion

[0062] Further, in some embodiments of the present invention, the specific structure of the above-mentioned inner linkage portion 74 is provided. Here, the inner linkage portion 74 of this structure includes an inner peripheral circle 741 and a linkage hinge frame 742. Here, the inner peripheral circle 741 is rotatably installed in the inner peripheral groove of the leak-proof conical cap 722, and the linkage hinge frame 742 includes two hinge plates 743 and a hinge seat 744. Here, the hinge seat 744 is installed on the lock core seat plate 751. One end of the hinge plate 743 is connected to the first hinge shaft 745 on the hinge seat 744, and the other end is connected to the second hinge shaft 746 on the inner peripheral circle 741. And there are a plurality of first convex tooth blocks 747 on the inner peripheral circle 741. Correspondingly, there are a plurality of second convex tooth blocks 724 on the handle member 723. Furthermore, the first convex tooth blocks 747 are rotationally connected to the second convex tooth blocks 724. Therefore, by rotating the handle member 723, the rotation of the inner peripheral circle 741 is driven. In this way, when the inner peripheral circle 741 rotates, the inclined hinge plate 743 can be driven to gradually vertically reach the lock core seat plate 751, so that the lock core seat plate 751 further supports the second elastic member 754 and the lock core clamping plate 753, so that the lock core clamping plate 753 fixes the outer lock groove 712; Similarly, the inner peripheral circle 741 can also drive the hinge plate 743 to further pull and contract the second elastic member 754 and the lock core clamping plate 753. In this way, the lock core clamping plate 753 is separated from the outer lock groove 712.

[0063] Exemplary locking anti-movement mechanism

[0064] As Figure 14 shown, further, in some embodiments of the present invention, a locking anti-movement mechanism 75 is also installed on the leak-proof conical cap 722. Through the locking anti-movement mechanism 75, not only can the handle member 723 be fixed again to prevent it from moving, but it is also convenient to move away from the handle member 723 later to unlock the handle member 723;

[0065] Specifically, the locking anti-movement mechanism 75 of the above structure includes an anti-movement rod 751, an anti-movement seat 752, a third elastic member 753, a first anti-movement wedge block 754, a fourth elastic member 755, and a second anti-movement wedge block 756. Among them, the anti-movement seat 752 is installed on the inner end wall of the leak-proof conical cap 722, and the anti-movement rod 751 is movably inserted through the leak-proof conical cap 722. One end of the anti-movement rod 751 is connected to the first anti-movement wedge block 754. The third elastic member 753 is installed between the first anti-movement wedge block 754 and the leak-proof conical cap 722. The fourth elastic member 755 is movably inserted through the anti-movement seat 752. The second anti-movement wedge block 756 is installed at the bottom of the fourth elastic member 755 and corresponds to a plurality of third convex tooth blocks 725 on the handle member 723. Further, the first anti-movement wedge block 754 has a first wedge-shaped wall 757 that abuts against the corresponding fourth elastic member 755, and the second anti-movement wedge block 756 has a second wedge-shaped wall 758;

[0066] Therefore, when the handle member 723 is rotated, the handle member 723 rotates and the third convex tooth block 725 abuts against the second wedge-shaped wall 758, causing the second anti-movement wedge block 756 to move upward and the fourth elastic member 755 to also move upward. In this way, the third convex tooth block 725 rotates to the rear side of the second anti-movement wedge block 756, thereby realizing that the anti-movement locking mechanism 75 fixes the handle member 723 again to prevent it from moving erratically.

[0067] Then, the anti-movement rod 751 can be pressed from the outside of the leak-proof cone cap 722. Then, the anti-movement rod 751 drives the first anti-movement wedge block 754 to move to the top of the fourth elastic member 755 and push the top of the fourth elastic member 755 upward. Then, the fourth elastic member 755 drives the second anti-movement wedge block 756 below to move upward away from the third convex tooth block 725, thereby facilitating the rotation of the handle member 723 again to unlock the handle member 723, and then facilitating the rotation of the inner linkage portion 74.

[0068] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0069] In the present invention, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0070] Although the embodiments of the present invention have been disclosed as above, it is not limited to only the applications listed in the specification and embodiments. It can be fully applied to various fields suitable for the present invention. For those familiar with the field, additional modifications can be easily made. Therefore, without departing from the general concept defined by the claims and the equivalent scope, the present invention is not limited to the specific details and the illustrated examples here.

Claims

1. A pressure oven based on semiconductor packaging automation, characterized in that: include: The pressure oven body comprises an outer oven body, a heating mechanism, a nitrogen module, and a pressure module. The outer oven body is provided with an inner baking pressure cavity and an assembly cavity. The nitrogen module and the pressure module are arranged in the assembly cavity, and the heating mechanism is arranged in the inner baking pressure cavity. A controller is arranged at the front of the outer oven body, and the nitrogen module and the pressure module are respectively connected to the inner baking pressure cavity, and the heating mechanism, the nitrogen module, and the pressure module are respectively electrically connected to the controller; The pressure module includes a vacuum pressure unit and a boost pressure unit, both of which are arranged in the assembly cavity, and are electrically connected to the controller respectively; the boost pressure unit includes a boost pump group and a boost guide tube, and the boost pump group is connected to the inner pressure cavity through the boost guide tube, and also includes: The leak-proof joint assembly includes a first leak-proof joint and a second leak-proof joint. The first leak-proof joint is arranged on the partition and has an external protruding head. The second leak-proof joint is arranged on the internal protruding head of the booster guide tube. There is a receiving groove between the second leak-proof joint and the internal protruding head. The external protruding head can be inserted into the receiving groove. The outer wall of the external protruding head has a plurality of external locking grooves, and the second leak-proof joint has a plurality of internal locking mechanisms corresponding to the external locking grooves.

2. A pressure oven based on semiconductor packaging automation according to claim 1, characterized in that: A pushing rack is arranged in the inner baking pressure cavity, and the pushing rack is used for pushing the workpiece rack.

3. A pressure oven based on semiconductor packaging automation according to claim 2, characterized in that: The pushing frame includes a pushing main support seat, a side support seat, multiple pushing rotating rods and a pushing power unit. The side support seat is arranged on one side of the pushing main support seat, the multiple pushing rotating rods are arranged between the pushing main support seat and the side support seat, and the pushing power unit is arranged at the bottom of the pushing main support seat. The pushing power unit is rotatably connected to the pushing rotating rod, and the pushing rotating rod can push the workpiece frame to move.

4. A pressure oven based on semiconductor packaging automation according to claim 3, characterized in that: The main push support seat is also provided with a limiting mechanism, which includes a limiting seat and a vertical limiting frame. The limiting seat is provided on the side wall of the main push support seat, and the vertical limiting frame is provided on the limiting seat.

5. A pressure oven based on semiconductor packaging automation according to claim 2, characterized in that: The workpiece rack includes a top plate, a bottom plate, and two vertical side plates. The top plate and the bottom plate are arranged at the upper end and the lower end of the two vertical side plates, and the top plate and the bottom plate are arranged with a plurality of first hollow grooves, the vertical side plates are arranged with a plurality of second hollow grooves, and a workpiece plate is arranged between two second hollow grooves at the same level.

6. A pressure oven based on semiconductor packaging automation according to claim 1, characterized in that: The heating mechanism includes an inverted U-shaped frame, a fan, and multiple heating seats. The inverted U-shaped frame is arranged in the inner baking pressure cavity. The inverted U-shaped frame has a guide cavity. The multiple heating seats are evenly distributed on the inner wall of the inverted U-shaped frame. The fan is arranged on the inner top of the inverted U-shaped frame. The heating seat has a heating wire.

7. A pressure oven based on semiconductor packaging automation according to claim 1, characterized in that: The inner wall of the outer extension head is provided with a plurality of anti-sway inner grooves, and the outer wall of the inner extension head is provided with anti-sway convex plates corresponding to the anti-sway inner grooves.

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