Lightweight liquid cooling plate
By using aluminum alloy plates on the upper layer of the liquid-cooled plate for heat transfer and using polymer material plates on the lower layer for thermal insulation, the existing liquid-cooled plates have been solved, and a more efficient and energy-saving heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202411889665.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-03-28
AI Technical Summary
The existing liquid-cooled plates have large weight, high energy consumption, and poor thermal insulation performance for batteries, making it difficult to effectively maintain the optimal working state of the battery cell in low temperature environments in winter.
The upper aluminum alloy plate is used for heat transfer, and the lower layer is used for thermal insulation and insulation. Heat is transferred through the refrigerant runner, and combined with the design of the bonding layer, the upper and lower liquid-cooled plates are sealed and bonded.
The design of a lightweight liquid-cooled plate is realized, which reduces energy consumption and improves the insulation performance of the battery, and can effectively maintain the optimal working state of the battery cell in a low temperature environment.
Smart Images
Figure CN119725895A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of battery heat dissipation, and in particular, relates to a lightweight liquid cooling plate. Background Art
[0002] Liquid cooling plates are commonly used devices for battery heat dissipation. They absorb and transfer heat through the circulation of liquid, thereby effectively reducing the temperature of electronic equipment. At present, the main material of liquid cooling plates is aluminum alloy, which is favored for its excellent thermal conductivity. It can improve the heat exchange efficiency between the liquid cooling plate and the module, thereby improving the efficiency of the refrigerant.
[0003] However, the liquid cooling plate in the prior art also has some shortcomings. First, the density of aluminum is relatively large, about 2.7×10 3 kg / m 3 , which makes the liquid cooling plate made of aluminum heavier and has higher energy consumption. Secondly, although aluminum has excellent thermal conductivity, it also means that it will accelerate heat exchange with the environment. When aluminum is used as the lower liquid cooling plate, it may cause some energy waste. In addition, the optimal operating temperature of battery cells is usually 20-45℃, and in winter when the temperature is below 20℃, the liquid cooling plate needs to have good thermal insulation performance to maintain the optimal working state of the battery cell.
[0004] Therefore, although aluminum liquid cold plates perform well in heat dissipation, there is still room for improvement to achieve more efficient and energy-efficient heat dissipation solutions. Summary of the invention
[0005] The embodiment of the present application provides a lightweight liquid cooling plate, which can solve the problems of heavy weight, high energy consumption and poor thermal insulation performance of batteries of existing liquid cooling plates.
[0006] In a first aspect, an embodiment of the present application provides a lightweight liquid cooling plate, comprising:
[0007] The upper liquid cooling plate is made of aluminum alloy and is used for heat transfer;
[0008] The lower liquid cooling plate is used for heat insulation; the material of the lower liquid cooling plate is a polymer material, and the density of the polymer material is lower than that of aluminum alloy and the thermal conductivity is lower than that of aluminum alloy;
[0009] A refrigerant flow channel, located between the upper liquid cooling plate and the lower liquid cooling plate, and used for carrying refrigerant;
[0010] The bonding layer is used to bond the upper liquid cooling plate and the lower liquid cooling plate.
[0011] In a possible implementation manner of the first aspect, a surface of the upper liquid cooling plate close to the bonding layer is provided with protrusions or pits.
[0012] In a possible implementation manner of the first aspect, the refrigerant flow channel is molded on a surface of the lower liquid cooling plate close to the bonding layer.
[0013] In a possible implementation manner of the first aspect, the material of the lower liquid cooling plate is a continuous fiber reinforced thermoplastic material.
[0014] Exemplarily, the continuous fiber reinforced thermoplastic material includes continuous fibers and one or a combination of at least two of PP-g-MAH, POE-g-MAH, PP, PE, ABS, PA, PC, and PET materials.
[0015] In a possible implementation manner of the first aspect, the material of the lower liquid cooling plate is a fiber-reinforced thermosetting material.
[0016] Exemplarily, the fiber-reinforced thermosetting material includes long and short fibers and a resin material.
[0017] In a possible implementation manner of the first aspect, the bonding layer includes at least one layer of adhesive film, and the adhesive film does not cover the refrigerant flow channel.
[0018] Exemplarily, the adhesive film is prepared by adding 5-10 parts of compatibilizer masterbatch, 0.05-5 parts of initiator, 0.05-5 parts of cross-linking agent, 0.1-0.5 parts of adhesion enhancing agent and 0.1-2 parts of antioxidant to every 100 parts of resin; alternatively, the adhesive film is prepared by adding 5-20 parts of compatibilizer masterbatch, 0.1-1 parts of adhesion enhancing agent and 0.1-2 parts of antioxidant to every 100 parts of resin.
[0019] Exemplarily, the resin in the above-mentioned film is one or a combination of at least two of PE, PP, POE, and EVA;
[0020] The compatibilizer masterbatch is at least one modified plastic;
[0021] The initiator is one or a combination of at least two of carbon peroxyacid-O,O-(1,1-dimethylethyl)-O-(2-ethylhexyl) ester, tert-butyl peroxycarbonate-2-ethylhexyl ester, tert-butyl peroxy-2-ethylhexyl carbonate, tert-butyl peroxycarbonate-2-ethylhexyl ester, tert-butyl peroxyformic acid 2-ethylhexyl ester, tert-butyl peroxyformic acid 2-ethylhexyl ester and tert-butyl peroxycarbonate-2-ethylhexyl ester;
[0022] The cross-linking agent is one or a combination of at least two of triallyl isocyanurate, triallyl isocyanurate, 1,3,5-tri-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, triallyl isocyanate, triisopropyl isocyanurate, triallyl isocyanurate and triallyl isocyanurate;
[0023] The above-mentioned adhesion enhancing agent is a coupling agent and / or a polyhydroxy polar polymer;
[0024] The antioxidant is one of a hindered phenol antioxidant, a phosphite antioxidant, and an amine antioxidant, or a combination of at least two of them.
[0025] Compared with the prior art, the embodiments of the present application have the following beneficial effects: by adopting a structural design in which an upper aluminum alloy plate is used for heat conduction and a lower polymer material plate is used for heat insulation, it can achieve lightweight, reduce energy consumption, and improve thermal insulation performance compared with the existing aluminum liquid cooling plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0027] Figure 1 This is a schematic diagram of the structure of a lightweight liquid cooling plate provided in one embodiment of the present application;
[0028] Figure 2 This is a schematic diagram of the structure of an upper liquid cooling plate provided in an embodiment of the present application;
[0029] Figure 3 It is a schematic diagram of the refrigerant flow channel structure provided by an embodiment of the present application;
[0030] Figure 4 is a schematic diagram of the film structure provided by an embodiment of the present application;
[0031] Figure 5 This is a schematic diagram of the structure of the lower liquid cooling plate provided in one embodiment of the present application. DETAILED DESCRIPTION
[0032] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.
[0033] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.
[0034] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0035] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.
[0036] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.
[0037] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.
[0038] The technical solutions in the embodiments of the present application are described in detail below.
[0039] Figure 1 The diagram is a schematic diagram of the structure of a lightweight liquid cooling plate provided in an embodiment of the present application. As shown in the figure, the lightweight liquid cooling plate provided in an embodiment of the present application comprises: an upper liquid cooling plate (1), a refrigerant flow channel (2), a bonding layer (3) and a lower liquid cooling plate (4).
[0040] The various components and structures of the lightweight liquid cooling plate provided in the embodiments of the present application are described in detail below.
[0041] The upper liquid cooling plate (1) is mainly used for heat transfer. In actual use, the upper liquid cooling plate can be in contact with the battery cell, thereby exchanging heat with the battery cell and accelerating the cooling of the battery cell. In one example, the material of the upper liquid cooling plate (1) can be aluminum alloy, which can better play the role of heat transfer by taking advantage of the high heat exchange efficiency and good thermal conductivity of aluminum alloy. In order to enhance the sealing strength between the upper and lower liquid cooling plates, the bonding area of the upper and lower layers can be increased. Figure 2 Schematic diagram of the structure of the upper liquid cooling plate provided in one embodiment of the present application. Figure 2 As shown, the upper liquid cooling plate (1) can be surface treated by providing protrusions or depressions on the surface of the upper liquid cooling plate (1) to increase the roughness of the bonding surface, thereby improving the bonding force with the lower liquid cooling plate (4) and reducing the risk of refrigerant leakage.
[0042] The refrigerant flow channel (2) is arranged between the upper liquid cooling plate and the lower liquid cooling plate. It is a channel for the refrigerant to flow inside the liquid cooling plate. Heat can be transferred and dispersed through the refrigerant flow channel, thereby cooling structures such as batteries and electronic devices. Among them, the refrigerant, that is, the cooling medium, in the liquid cooling plate refers to the liquid used to absorb and transfer heat. In one example, the refrigerant flow channel can be directly molded on the surface of the lower liquid cooling plate (4), and then the upper and lower liquid cooling plates are sealed and bonded through the adhesive layer (3) to achieve a sealing effect. The structure of the refrigerant flow channel is relatively diverse. Figure 3 It is a schematic diagram of the refrigerant flow channel structure provided in an embodiment of the present application, showing a specific flow channel design, which is mainly used for illustration and is not used to limit the protection scope of the present application.
[0043] The bonding layer (3) is used to bond the upper liquid cooling plate (1) and the lower liquid cooling plate (4). As can be seen from the above and below descriptions, the lightweight liquid cooling plate provided in the embodiment of the present application adopts an upper aluminum alloy plate and a lower fiber reinforced composite material (continuous fiber reinforced thermoplastic material and fiber reinforced thermosetting material) structural design. At the same time, a refrigerant liquid with a certain pressure will be rushed into the refrigerant flow channel. Therefore, there are high requirements for the bonding strength between the upper and lower liquid cooling plates, especially the bonding strength resistant to refrigerant erosion. In this regard, the present application provides two design schemes for bonding layers, which are described in detail below:
[0044] Solution 1: Liquid glue bonding solution.
[0045] The glue adopts an adhesive system with strong bonding force and good resistance to cold media corrosion. The adhesive system includes but is not limited to one or more of epoxy glue, organic silicone glue, butyl glue, polyurethane glue, etc.
[0046] Solution 2: Solid glue bonding solution.
[0047] Hot melt adhesive film is used to bond the upper and lower liquid cooling plates. The hot melt adhesive film has weak fluidity and is not easy to overflow. The structural system can be designed according to different substrates, and the effect is good. The adhesive film adopts a one-layer or multi-layer structure. When a multi-layer structure is adopted, the materials of different layers can be the same or different. During processing, the adhesive film can be engraved into a corresponding shape by an engraving machine according to the structure of the lower liquid cooling plate, so that the adhesive film exists at the bonding point of the upper and lower liquid cooling plates, and there is no adhesive film at the refrigerant flow channel, so as to achieve precise matching. Figure 4 Schematic diagram of the film structure provided by an embodiment of the present application. Figure 4 As shown, the film avoids the hollow part of the refrigerant flow channel.
[0048] In one embodiment, the above-mentioned adhesive film is prepared by adding 5-10 compatibilizer masterbatch, 0.05-5 parts of initiator, 0.05-5 parts of crosslinking agent, 0.1-0.5 parts of adhesion enhancing agent and 0.1-2 parts of antioxidant per 100 parts of resin; or, by adding 5-20 parts of compatibilizer masterbatch, 0.1-1 parts of adhesion enhancing agent and 0.1-2 parts of antioxidant per 100 parts of resin. The above parts are calculated by mass, and the range of parts includes the endpoints.
[0049] The resin in the film is one of PE (Polyethylene), PP (Polypropylene), POE (Poly Olefin Elastomer), and EVA (Ethylene-vinyl acetate copolymer) or a combination of at least two of them.
[0050] The compatibilizer masterbatch in the film is at least one modified plastic, such as maleic anhydride grafted modified polypropylene (PP-g-MAH), glycidyl methacrylate grafted modified polypropylene (PP-g-GMA), and the like.
[0051] The initiator in the adhesive film is one or any combination of carbon peroxide-O,O-(1,1-dimethylethyl)-O-(2-ethylhexyl) ester, tert-butyl peroxycarbonate-2-ethylhexyl ester, tert-butyl peroxy 2-ethylhexyl carbonate, tert-butyl peroxycarbonate-2-ethylhexyl ester, tert-butyl peroxyformic acid 2-ethylhexyl ester, tert-butyl peroxyformic acid 2-ethylhexyl ester and tert-butyl peroxycarbonate-2-ethylhexyl ester.
[0052] The crosslinking agent in the adhesive film is one or any combination of triallyl isocyanurate, triallyl isocyanurate, 1,3,5-tri-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, triallyl isocyanate, triisopropyl isocyanurate, triallyl isocyanurate and triallyl isocyanurate.
[0053] The adhesive strength enhancing agent in the adhesive film is a coupling agent, one or more of a polyhydroxy polar polymer. The coupling agent can be one or a combination of at least two of vinyl triethoxy silane, 3-aminopropyl trimethoxy silane, vinyl trimethoxy silane, methyl diethoxy silane, and 3-(methacryloyloxy) propyl trimethoxy silane.
[0054] The antioxidant in the film is one or more of a hindered phenol antioxidant (such as antioxidants 1010, 1076, and 1790), a phosphite antioxidant (such as antioxidant 168), and an amine antioxidant.
[0055] The above materials are melt-extruded and cast and then engraved by an engraving machine.
[0056] The lower liquid cooling plate (4) is mainly used for heat insulation and heat preservation, and can achieve constant temperature protection for the refrigerant. When used for battery heat dissipation, it can be in contact with the battery pack body. In one embodiment, the lower liquid cooling plate (4) is made of polymer material, and the density of polymer material is lower than that of aluminum alloy, thereby achieving a significant lightweight effect, and it is expected to reduce weight by 20-25%. In addition, the thermal conductivity of polymer material is weaker than that of aluminum alloy. By using polymer material in the lower liquid cooling plate (4), the heat exchange between the refrigerant and the air or battery can be effectively reduced. For the battery, it can generally play the role of heat insulation in summer and heat preservation in winter, thereby reducing energy consumption and improving driving range.
[0057] In one example, the lower liquid cooling plate (4) specifically uses continuous fiber reinforced thermoplastic material. The continuous fiber reinforced thermoplastic material here includes continuous fiber, and PP-g-MAH, ethylene polymer grafted maleic anhydride (POE-g-MAH), PP, PE, ABS (Acrylonitrile-butadiene-styrene, acrylonitrile / butadiene / styrene copolymer), PA (Polyamide, commonly known as nylon), PC (Polycarbonate), PET (Polyethyleneterephthalate, polyethylene terephthalate) materials, or a combination of at least two. During processing, the continuous fiber reinforced thermoplastic material can be first made into a strip, and then the required structure such as the refrigerant flow channel can be molded on the surface. In addition, since the continuous fiber reinforced thermoplastic material is a recyclable material, the material can be recycled.
[0058] In another example, the lower liquid cooling plate (4) is made of fiber-reinforced thermosetting material. The fiber-reinforced thermosetting material includes long and short fibers and thermosetting resin material (such as epoxy resin). During processing, the required structure such as the refrigerant flow channel can be molded on the surface of the material. Figure 5Schematic diagram of the structure of the lower liquid cooling plate provided in one embodiment of the present application. Figure 5 As shown, a refrigerant flow channel structure is molded on the surface of the lower liquid cooling plate (4).
[0059] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A lightweight liquid cooling plate, characterized in that: include: The upper liquid cooling plate is made of aluminum alloy and is used for heat transfer; The lower liquid cooling plate is used for heat insulation; the material of the lower liquid cooling plate is a polymer material, the density of the polymer material is lower than that of aluminum alloy and the thermal conductivity is lower than that of aluminum alloy; A refrigerant flow channel, located between the upper liquid cooling plate and the lower liquid cooling plate, and used for carrying refrigerant; The bonding layer is used to bond the upper liquid cooling plate and the lower liquid cooling plate.
2. The lightweight liquid cooling plate according to claim 1, characterized in that: The surface of the upper liquid cooling plate close to the bonding layer is provided with convex points or concave pits.
3. The lightweight liquid cooling plate according to claim 1, characterized in that: The refrigerant flow channel is molded on the surface of the lower liquid cooling plate close to the bonding layer.
4. The lightweight liquid cooling plate according to claim 1, characterized in that: The material of the lower liquid cooling plate is continuous fiber reinforced thermoplastic material.
5. The lightweight liquid cooling plate according to claim 4, characterized in that: The continuous fiber reinforced thermoplastic material includes continuous fibers and one or a combination of at least two of PP-g-MAH, POE-g-MAH, PP, PE, ABS, PA, PC, and PET materials.
6. The lightweight liquid cooling plate according to claim 1, characterized in that: The material of the lower liquid cooling plate is fiber-reinforced thermosetting material.
7. The lightweight liquid cooling plate according to claim 6, characterized in that: The fiber-reinforced thermosetting material comprises long and short fibers and a thermosetting resin material.
8. The lightweight liquid cooling plate according to any one of claims 1 to 7, characterized in that: The bonding layer includes at least one layer of adhesive film, and the adhesive film does not cover the refrigerant flow channel.
9. The lightweight liquid cooling plate according to claim 8, characterized in that: The adhesive film is prepared by adding 5-10 parts of compatibilizer masterbatch, 0.05-5 parts of initiator, 0.05-5 parts of crosslinking agent, 0.1-0.5 parts of adhesion enhancing agent and 0.1-2 parts of antioxidant to every 100 parts of resin; or, The adhesive film is prepared by adding 5-20 parts of compatibilizer masterbatch, 0.1-1 part of adhesion enhancing auxiliary agent and 0.1-2 parts of antioxidant to every 100 parts of resin.
10. The lightweight liquid cooling plate according to claim 9, characterized in that: The resin in the adhesive film is one or a combination of at least two of PE, PP, POE, and EVA; The compatibilizer masterbatch is at least one modified plastic; The initiator is one or a combination of at least two of carbon peroxyacid-O,O-(1,1-dimethylethyl)-O-(2-ethylhexyl) ester, tert-butyl peroxycarbonic acid-2-ethylhexyl ester, tert-butyl peroxy 2-ethylhexyl carbonate, tert-butyl peroxycarbonic acid-2-ethylhexyl ester, tert-butyl peroxyformic acid-2-ethylhexyl ester, and tert-butyl peroxycarbonic acid-2-ethylhexyl ester; The cross-linking agent is one or a combination of at least two of triallyl isocyanurate, triallyl isocyanurate, 1,3,5-tri-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, triallyl isocyanate, triisopropyl isocyanurate, triallyl isocyanurate and triallyl isocyanurate; The adhesion enhancing agent is a coupling agent and / or a polyhydroxy polar polymer; The antioxidant is one of a hindered phenol antioxidant, a phosphite antioxidant, and an amine antioxidant, or a combination of at least two of them.