Local metal deposition methods for probe card assemblies and related systems

Abstract

The invention discloses a local metal deposition method for a probe card assembly. The probe card assembly comprises a probe head and a space converter. The method comprises the following steps: identifying and determining a defective welding pad on the spatial converter; electrically connecting the electroplating electrode to a positive electrode of a power supply and electrically connecting a second end portion of a corresponding electrical connection channel corresponding to and electrically connected to the defective pad to a negative electrode of the power supply; electroplating liquid is supplied to the position of the defect welding pad, and the electroplating electrode and the defect welding pad are conducted through the electroplating liquid to form a continuous circuit; electrifying for a first preset time period through the electroplating liquid at a first preset voltage and a first preset current; the electroplating electrode and the defect welding pad are isolated from each other, and the residual electroplating liquid at the defect welding pad is removed; and cleaning the electroplated defective welding pad. The invention further designs a related system. By means of the space converter, cost effectiveness is achieved, and the problem of circuit connectivity degradation caused by defect of the welding pad of the space converter can be conveniently solved.

Description

Technical Field

[0001] The present disclosure generally relates to localized metal deposition methods and related systems, particularly for use in probe card assemblies. Background Art

[0002] As known to those skilled in the art, the probe card assembly is configured to be disposed between the tester and the die or wafer to be tested for testing the performance of the die or wafer. As known to those skilled in the art, the probe card assembly includes a probe head, the probe head includes a probe (various types are possible, including but not limited to vertical probes) and a probe plate for supporting the probe, and the front end of the probe is configured to contact the pads or contacts on the die or wafer. The probe card assembly also includes a printed circuit board (PCB) for electrically connecting to the signal transmission terminal of the tester and a space transformer (ST for short) disposed on the lower surface of the main circuit board. The upper surface of the space transformer has a plurality of conductive contacts or pads with larger spacing for electrically connecting to the main circuit board; the lower surface of the space transformer is provided with a plurality of conductive contacts or pads with smaller spacing for abutting the rear ends of the plurality of probes in the probe head.

[0003] As is known, when the probe card assembly is not in use, the rear end of the probe is constructed to be a certain gap from the lower surface of the space converter; while in its use state, a certain pressing force is applied to the probe card assembly so that the front and rear ends of the probe are respectively tightly against the die or wafer and the pads or contacts on the space converter. Due to this pressing force, the rear end of the probe continuously erodes or wears the contacts or pads on the space converter over time, causing defects in the contacts or pads, such as depressions or dents, and thus may not ensure a reliable electrical connection between the probe and the space converter, for example, an open circuit may occur. Although the relevant problems can be solved by replacing a new space converter, it is obvious that such replacement is costly. In addition, when the contacts or pads on the space converter or the ends of the probe are cleaned using, for example, isopropyl alcohol, the relevant contacts or pads and the corresponding ends of the probe may also be corroded and missing.

[0004] Therefore, there is a need for a system and method that is cost-effective and can solve the above-mentioned problem of circuit connectivity degradation caused by defects in contacts or pads of a space transformer. Summary of the invention

[0005] The following presents an overview that provides a basic understanding of one or more embodiments of the present invention. This overview is not intended to identify key or important elements or to describe any scope of a particular embodiment or any scope of the claims. Its sole purpose is to present concepts in a simplified form as an introduction to a more detailed description that is presented later.

[0006] According to one aspect of the present application, a local metal deposition method for a probe card assembly is proposed, wherein the probe card assembly includes: a probe head for supporting a probe; a space transformer including a pad on one side for electrically contacting a rear end of the probe, and an electrical connection channel included in the space transformer, wherein the first end of each of the electrical connection channels is used to electrically connect to the pad; wherein the method includes: - identifying and determining a defective pad on the space transformer; - electrically connecting a plating electrode to the positive pole of a power supply and electrically connecting the second end of a corresponding electrical connection channel corresponding to and electrically connected to the defective pad to the negative pole of the power supply; - supplying a plating solution to the position of the defective pad and conducting the plating electrode and the defective pad into a continuous circuit via the plating solution; - energizing the plating solution at a first predetermined voltage and a first predetermined current for a first predetermined time period to deposit a desired material on the defective pad; - isolating the plating electrode and the defective pad from each other and removing the remaining plating solution at the position of the defective pad; and - cleaning the plated defective pad to obtain a completed pad.

[0007] According to another aspect of the present application, a local metal deposition method for a probe card assembly is also proposed, wherein the probe card assembly includes: a probe head, which is used to support the probe; a space transformer, which includes a pad on one side for electrically contacting the rear end of the probe, and the space transformer includes an electrical connection channel, and the first end of each of the electrical connection channels is used to electrically connect to the pad; wherein the method includes: - identifying and determining a defective pad on the space transformer; - electrically connecting a degreasing electrode and a second end of a corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad to a power source; - supplying an electrolytic degreasing liquid to the position of the defective pad so that the degreasing electrode and the defective pad are connected to form a continuous circuit via the electrolytic degreasing liquid; - supplying a second predetermined voltage and a second predetermined - energizing the electrolytic degreasing liquid for a second predetermined time period to degrease the location of the defective pad; - isolating the degreasing electrode and the defective pad from each other and removing the remaining electroplating degreasing liquid; - electrically connecting the plating electrode to the positive pole of the power supply and electrically connecting the second end of the corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad to the negative pole of the power supply; - supplying the plating liquid to the location of the defective pad so that the plating electrode and the defective pad are connected to form a continuous circuit through the plating liquid; - energizing the plating liquid at a third predetermined voltage and a third predetermined current for a third predetermined time period to deposit the desired material on the defective pad; - isolating the plating electrode and the defective pad from each other and removing the remaining plating liquid; and - cleaning the plated defective pad to obtain a completed pad.

[0008] According to another aspect of the present application, a system for local metal deposition of a probe card assembly is also proposed, wherein it is constructed to implement the local metal deposition method as above, wherein the probe card assembly includes: a probe head, which is used to support the probe; a space transformer, which includes a solder pad on one side for electrically contacting the rear end of the probe, and the space transformer includes electrical connection channels, and the first end of each of the electrical connection channels is used to electrically connect to the solder pad; wherein the system includes at least: - a power supply, which is constructed to provide a desired current and a desired voltage; - a plating electrode, which is electrically connected to the negative pole of the power supply; and - a plating liquid supply source, which is constructed to supply the plating liquid to the location of the defective solder pad; wherein the second end of the corresponding electrical connection channel corresponding to the defective solder pad and electrically connected to the defective solder pad is constructed to be able to be electrically connected to the positive pole of the power supply via a cable.

[0009] With the present application, a system and method are realized that are cost-effective and can conveniently solve the problem of circuit connectivity degradation caused by defects in contacts or pads of a space transformer. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A flow chart of a local metal deposition method for a probe card assembly according to a first embodiment of the present application is shown.

[0011] Figure 2 A schematic diagram showing a first exemplary operation of electrically connecting the second end of a corresponding electrical connection channel corresponding to and electrically connected to a defective pad to a positive electrode of a power source according to the first embodiment of the present application is shown.

[0012] Figure 3 A schematic diagram showing a second exemplary operation of electrically connecting the second end of a corresponding electrical connection channel corresponding to and electrically connected to a defective pad to a positive electrode of a power source according to the first embodiment of the present application is shown.

[0013] Figure 4 A schematic diagram showing a third exemplary operation of electrically connecting the second end of a corresponding electrical connection channel corresponding to and electrically connected to a defective pad to a positive electrode of a power source according to the first embodiment of the present application is shown.

[0014] Figure 5 A schematic diagram is shown of a fourth exemplary operation of electrically connecting the second end of a corresponding electrical connection channel corresponding to and electrically connected to a defective pad to a positive electrode of a power source according to the first embodiment of the present application.

[0015] Figure 6 A flow chart of a local metal deposition method for a probe card assembly according to a second embodiment of the present application is shown.

[0016] Figure 7A schematic diagram of a system for localized metal deposition of a probe card assembly according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0017] In the following embodiments, the same reference numerals denote the same or similar components.

[0018] Figure 1 A flow chart of a local metal deposition method for a probe card assembly according to a first embodiment of the present application is shown. Before elaborating on the process of the local metal deposition method, the relevant structure of the probe card assembly will be first introduced to help better understand the relevant steps of the present application and the advantages achieved thereby.

[0019] The probe card assembly 1 generally includes a probe head (not shown) for supporting the probe, wherein the structure of the probe head for supporting the probe is well known to those skilled in the art and will not be described in detail herein. However, as an example and not limitation, the probe head includes a frame consisting of a multilayer board and perforations passing through these boards, wherein the probe is constructed to pass through the corresponding perforations and be retained in the frame. This frame consisting of a multilayer board for the probe head is well known to those skilled in the art and will not be described in detail herein. The probe can be selected as any possible type of probe, such as a vertical probe, a flexed probe, etc. The front end of the probe is constructed to abut against contacts such as solder pads on the surface of the component to be tested (wafer or die) (not shown) when performing a test operation (in the field of the probe card assembly and in subsequent embodiments of the present application, solder pads are equivalent to contacts to a certain extent and can be interchanged with each other).

[0020] It will also be understood that in an embodiment of the present application, the rear ends of the probes in the probe head are electrically connected to the printed circuit board 12 via the space transformer 10 and then connected to the tester (not shown) via the printed circuit board 12. With respect to the space transformer 10, it can be customized or packaged without departing from the scope of the present application. It is known that the contacts on the surface such as the die are small and closely spaced, and for this reason, it is difficult to directly connect the densely arranged probes to the tester for testing operations without interference. For this reason, in order to increase the spacing between the probes, especially the rear ends thereof, the space transformer 10 is generally used. The upper surface of the space transformer 10 during the test operation (the surface on the side opposite to the probes to be used in combination during the test operation) has a plurality of conductive contacts or pads (not shown) with large spacing for electrical connection with the printed circuit board 12; in contrast, the lower surface of the space transformer 10 during the test operation (the surface on the side close to the probes to be used in combination during the test operation) is provided with a plurality of conductive contacts or pads 102 with small spacing for abutting the rear ends of the plurality of probes in the probe head, that is, the space transformer 10 includes pads 102 on one side for electrically contacting the rear ends of the probes. As will be understood, the space transformer 10 includes electrical connection channels 104 therein, and the first end 1040 of each of the electrical connection channels is used to electrically connect to the pads 102 on the lower side of the space transformer, that is, abut the rear ends of the corresponding probes via the pads 102. As will be understood, the second end 1042 of each of the electrical connection channels 104, which is opposite to the first end 1040, can be selectively configured to be electrically connected to at least one of the following during a test operation, depending on the function of a contact on a component to be tested (e.g., a wafer or a die, not shown) electrically connected to the corresponding first end 1040:

[0021] - power terminals or supply terminals (not shown) to provide power or current / voltage for supplying power, for example, to contacts on the component under test;

[0022] - a ground terminal (not shown), for example, to cooperate with the power terminal to form a power supply loop;

[0023] - signal terminals (not shown), for example signal terminals of a tester, for example via the printed circuit board 12, for example to transmit signals, including input signals and output signals;

[0024] - a capacitor 1200, for example, to form a loopback circuit. It should be noted that the other side of the capacitor can also be electrically connected to another contact of the component under test. Therefore, it can be known that in this case, there is always at least one pair of contacts electrically connected to the two poles of the capacitor 1200; and

[0025] - Another contact point on the component under test, thus forming another form of loop circuit.

[0026] It should be noted that the form and function of the loop circuit are well known to those skilled in the art and will not be further elaborated herein.

[0027] Here, it is necessary to briefly describe the structure of the second end 1042 to the power terminal and the ground terminal. For the component to be tested (such as a wafer or a die, not shown), some of the contacts on it need to be powered and therefore need to form a power supply circuit with corresponding other certain contacts. It can be imagined that one side of the certain contacts is called power supply and the other side of the certain contacts is called grounding (here "grounding" can be expressed as all currents or power supply outflow branches used to realize a complete closed power supply circuit, rather than grounding in a narrow sense). Correspondingly, the contacts that power the component to be tested (such as a wafer or a die, not shown) are electrically connected to the power terminal, such as the power terminal of the power component to provide power; and the contacts that constitute the grounding in the component to be tested are electrically connected to the ground terminal, such as the ground terminal of the power component to cooperate with the power terminal to form a complete power supply circuit.

[0028] It can be imagined that for the contacts in the component to be tested (such as wafers or dies, not shown) that need to supply the same current, they can be electrically connected to the same power terminal, and for the contacts in the component to be tested that need to provide the same ground, they can naturally be electrically connected to the same ground terminal. This can be achieved through the electrical connection channels 104 in the space transformer. For example, the electrical connection channels corresponding to the contacts in the component to be tested (such as wafers or dies, not shown) that need to supply the same current can be collected into a total electrical connection channel 104 and further connected to the same power terminal via the end of the total electrical connection channel. In this case, the end of the total electrical connection channel 104 to the power component is the common second end of each electrical connection channel 104. For the electrical connection channels 104 corresponding to the contacts for the same ground, they can also be collected into a total electrical connection channel 104. The end of the total electrical connection channel 104 electrically connected to the ground terminal can be the common second end 1042 of all related electrical connection channels.

[0029] In addition, it is necessary to understand that, in general, for the probe card assembly 1, the probe card assembly is connected to a power component (as an example and not limitation, it is optionally integrated into the tester or not integrated into the tester) via a connector 14 (which is optionally electrically connected to the corresponding terminals in the printed circuit board 12), and the connector 14 can be selected as a plug-in connector, such as a J-type connector. In this case, it can be determined that the power terminals and grounding terminals in the power component are connected to corresponding contacts for power supply or grounding in the component to be tested (such as a wafer or a die, not shown) via the connector 14. Regarding the specific structure of the connector 14, it can be any possible connector type and specification that can be used to achieve the above-mentioned connection, and no additional limitation or elaboration is made here. Regarding the power component, it can also include any possible structure and specification of power supply terminals and grounding terminals, and no additional limitation or elaboration is made here. As an example, the power component can be a transformer (not shown), and its power supply terminal can be the positive pole of the transformer and the grounding terminal can be the negative pole of the transformer.

[0030] After understanding the above specific structure of the probe card assembly 1, the following will refer to Figure 1 The flow of a local metal deposition method for a probe card assembly according to a first embodiment of the present application is described.

[0031] like Figure 1 As shown, the method includes identifying and determining a defective pad or contact 102 on the space transformer 10 at step 100. As an example, the identification and determination of the defective pad can be completed by the operator's vision. Alternatively, the identification and determination of the defective pad can be achieved by machine through methods such as image recognition technology, machine learning technology, etc., which obviously helps to improve the automation and accuracy of the identification and determination process.

[0032] It should be understood that, for all embodiments of the present application, the probe card assembly 1 for local metal deposition is a separate assembly that has been disassembled from the tester and the probe head has been removed, so that the first end 1040 and the second end 1042 of the electrical connection channel 104 associated with the pad located on one side of the space transformer 10 for abutting the rear end of the probe are exposed and the component or device electrically connected to can be changed. Therefore, optionally, the method includes the steps of detaching the probe card assembly 1 from the tester and removing the probe head in the probe card assembly 1, which can be completed before or after identifying and determining the defective pad without departing from the scope of the present application.

[0033] At step 102, on the one hand, the electroplating electrode 20 is electrically connected to the positive electrode V+ of the power source 22; and on the other hand, the second end 1042 of the corresponding electrical connection channel 104 corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 is electrically connected to the negative electrode V- of the power source 22 (for example, via any probe, pin, clip, etc. contact component 1600). It should be noted that, as mentioned above, since the probe head assembly 1 has been removed from the tester, the second end 1042 of the electrical connection channel 104 associated with the defective pad 1020 can change the component or device to which it is electrically connected, and is changed to be electrically connected to the negative electrode V- of the power source 22. It should be understood that the electrical connection of the electroplating electrode 20 and the associated second end 1042 to the power source 22 can be direct (for example, connected only via a wire) or indirect (including other intermediate components in addition to the wire (as described later)) without departing from the scope of the present application. It should be noted that the electrical connection of the electroplating electrode 20 to the positive electrode V+ of the power source 22 can be completed in advance. For example, the electroplating electrode 20 can be electrically connected to the power source 22 as a whole. Such an embodiment is obviously also included in the scope of the present application. Although the electrical connection of the electroplating electrode 20 and the related second end 1042 is described in the same step, this is only exemplary and not restrictive. The electrical connection of the two to the power source 22 can be implemented separately in different steps.

[0034] At step 104, the method includes supplying a plating solution (not shown) to the location of the defective pad 1020 and enabling the plating electrode 20 and the defective pad 1020 to be connected to form a continuous circuit via the plating solution. As previously mentioned, in order to achieve electroplating and depositing metal on the defective pad 1020, it is necessary to introduce the plating solution between the plating electrode 20 and the defective pad 1020 so that current can pass through the plating solution so that the metal ions in the plating solution can be reduced to corresponding metal atoms at the anode. To this end, this step can also be expressed as: supplying the plating solution to the location of the defective pad 1020 and contacting the plating electrode 20 with the plating solution to conduct a continuous circuit for implementing the electroplating operation.

[0035] At step 106, the first predetermined voltage and the first predetermined current are energized via the electrolyte for a first predetermined time period to deposit the desired metal material on the defective pad 102. It is understood that the first predetermined voltage and the first predetermined current can be controlled by the power supply 22. In the first embodiment of the present application, the first predetermined voltage and the first predetermined current are energized via the electrolyte for a first predetermined time period to ensure that a sufficient amount of metal is deposited on the defective pad 1020 and does not cause a drastic change in the pad size caused by excessive deposition. As an example, the first predetermined voltage can be selected as 5 to 8V, the first predetermined current can be selected as 0.3 to 0.5A, and the first predetermined time period can be selected as 3 to 5s. It should be understood that the selection of the above parameters is only exemplary and not restrictive, and can be appropriately changed according to the electroplating properties (various factors such as concentration and deposition rate) of the metal ions to be deposited on the defective pad 1020 in the electroplating solution without departing from the scope of the present application.

[0036] In the embodiment of the present application, the metal material to be deposited can be selected as gold, so the electroplating solution can be selected as a gold ion (positive) electroplating solution. The basic principle of electroplating is well known to those skilled in the art and will not be described in detail here. However, it can be understood that the metal ions in the electroplating solution will obtain electrons at the position of the negative electrode V- of the power supply and be reduced to metal atoms and deposited, so the desired metal material can be deposited at the position of the defective pad 1020.

[0037] At step 108, the electroplating electrode 20 and the defective pad 1020 are isolated from each other, that is, the electroplating electrode is isolated from the defective pad and disconnected from the conduction achieved by the electroplating solution, and the remaining electroplating solution at the position of the defective pad 1020 is removed. At this step, it is optionally indicated that the desired amount of metal has been deposited at the position of the defective pad 1020 without continuing the electroplating process. Of course, optionally, this step may include the power supply 22 stopping the power supply. Due to the direct contact between the electroplating solution and the defective pad 1020, it is necessary to remove the electroplating solution remaining or adhering to the pad, such as blotting, wiping, etc. In fact, any feasible method can be adopted without additional restrictions here.

[0038] At step 110, the electroplated defective pad 102 is cleaned, especially when the remaining plating solution has been removed, such as physical cleaning such as wiping, blowing, water flushing and then blowing dry, or possible chemical cleaning (such as cleaning with possible chemicals) to obtain a completed pad, which helps to remove any impurities that may affect the conductive properties of the surface of the completed pad.

[0039] With the help of the above-mentioned local metal deposition method of the present application, it is possible to simply and efficiently ensure the completion of the defective pad 1020 on the one hand, and it is cost-effective and ensures the performance of the completed pad on the other hand.

[0040] Below, a detailed description will be given of how to electrically connect the second end 1042 of the corresponding electrical connection channel 104 corresponding to the defective welding pad 1020 and electrically connected to the defective welding pad 1020 to the negative pole V- of the power supply 22, with respect to the different components or paths to which the second end 1042 of the different electrical connection channels 104 within the space converter 10 of the present application are connected during the test operation.

[0041] Figure 2 A schematic diagram of a first exemplary operation of electrically connecting the second end 1042 of the corresponding electrical connection channel 104 corresponding to and electrically connected to the defective pad to the negative electrode V- of the power source according to the first embodiment of the present application is shown. As mentioned above, optionally, the second end 1042 of at least one first electrical connection channel in the electrical connection channel 104 is configured to be powered via the electrical connector 14 during the test operation (that is, connected to the power terminal or the power supply terminal via the connector 14 as mentioned above, so the first electrical connection channel is also called a power channel), or correspondingly, the second end 1042 of at least one second electrical connection channel in the electrical connection channel 104 is configured to be grounded via the electrical connector 14 during the test operation (that is, connected to the ground terminal via the connector 14 as mentioned above, so the second electrical connection channel is also called a ground channel). It should be understood that, optionally, the corresponding second end 1042 of at least one first / second electrical connection channel can correspond to multiple defective pads 1020, which is related to the functions of power supply and grounding (see above). Optionally, as an example, a solder pad (not shown) of the space transformer 10 electrically connected to the second end 1042 of the first or second electrical connection channel may be electrically connected to the printed circuit board 12 of the probe card assembly and electrically connected to a selected terminal in an electrical connector (or connector 14, such as a J-type connector) engaged to the printed circuit board 12 via a corresponding circuit (e.g., a printed circuit) on the printed circuit board 12, thereby enabling a simple and quick connection to the power component during a test operation via another electrical connector that is complementary to the power component.

[0042] In this case, the deposition method as described above may further optionally include step 112, in which the defective pad 1020 is identified and determined to be electrically connected to the first end 1040 of the at least one first electrical connection channel or the at least one second electrical connection channel. In this case, the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad 1020 and electrically connected to the defective pad at step 102 is electrically connected to the negative pole V- of the power source 22, which specifically corresponds to electrically connecting the corresponding second end 1042 of the first electrical connection channel or the second electrical connection channel corresponding to the defective pad 1020 to the negative pole V- of the power source 22 via the electrical connector 14, especially the corresponding terminal in the electrical connector, for example, via an interface in the form of a complementary electrical connector connected to the power source or contacting the pin terminal electrically connected to the power source 22 with the corresponding terminal in the electrical connector 14. This step may be performed manually or by a machine.

[0043] Figure 3 A schematic diagram of a second exemplary operation of electrically connecting the second end 1042 of the corresponding electrical connection channel 104 corresponding to and electrically connected to the defective pad 1020 to the negative electrode V- of the power source 22 according to the first embodiment of the present application is shown. As mentioned above, optionally, the second end 1042 of at least one third electrical connection channel in the electrical connection channel 104 is configured to be electrically connected to a signal terminal of a tester during a test operation to transmit a signal (therefore, the third electrical connection channel is also referred to as a signal channel or an I / O channel). Optionally, as an example, the pad of the space transformer 10 electrically connected to the second end 1042 of the third electrical connection channel can be electrically connected to the printed circuit board 12 of the probe card assembly 1 and extend to the interface area 120 on the printed circuit board 12 via the printed circuit on the printed circuit board 12, so that the second end 1042 of these third electrical connection channels can be stably connected to the tester via the printed circuit board 12 in the interface area 120 during a test operation for testing, especially for transmitting a test signal.

[0044] In this case, the deposition method as described above may further optionally include step 114, wherein the method further includes identifying and determining that the defective pad 1020 is electrically connected to the first end 1040 of at least one third electrical connection channel. In this case, electrically connecting the second end 1042 of the corresponding electrical connection channel 104 corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 at step 102 to the negative pole V- of the power source specifically corresponds to electrically connecting the corresponding second end 1042 of the third electrical connection channel corresponding to the defective pad 1020 to the negative pole V- of the power source 22 via the printed circuit board 12.

[0045] In addition, optionally, in order to facilitate the above-mentioned connection, an expander card 30 can be set or inserted to first electrically connect to the second end 1042 of at least one third electrical connection channel. For example, when inserting the expander card 30 into the above-mentioned interface area 120, the terminals on one side of the expander card 30 can be electrically connected to different second ends 1042 in the interface area 120, so that different second ends can be further spaced with the help of the expander card 30 and can facilitate the accurate selection of different second ends 1042 (the position of the solder pads in the interface area 120 is obviously difficult to determine and select), thereby facilitating the determination of the desired second end 1042 and facilitating the connection with the power supply. In this case, the step 102 can specifically correspond to electrically connecting the corresponding second end 1042 of the third electrical connection channel corresponding to the defective solder pad 1020 to the negative pole V- of the power supply 22 via the expander card 30.

[0046] Figure 4 FIG. 1 is a schematic diagram showing a third exemplary operation of electrically connecting the second end 1042 of the corresponding electrical connection channel 104 corresponding to and electrically connected to the defective pad 1020 to the negative electrode V- of the power source according to the first embodiment of the present application. Figure 4 As described above, the second ends 1042 of at least two fourth electrical connection channels in the electrical connection channel 104 are configured to be electrically connected to the capacitor 1200 during the test operation (thus, the fourth electrical connection channel is also called a capacitor loop channel).

[0047] In this case, the deposition method as described above may also optionally include step 116, so the method further includes: identifying and determining that the defective pad 1020 is electrically connected to the first end 1040 of at least one of the at least two fourth electrical connection channels. Therefore, in this case, the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 at step 102 is electrically connected to the negative electrode V- of the power source, which specifically corresponds to: short-circuiting the capacitor 1200 associated with the fourth electrical connection channel corresponding to the defective pad 1020 (that is, directly connecting the two side terminals of the capacitor 1200 such as wires to short-circuit them) and then electrically connecting the corresponding first end 1040 of another fourth electrical connection channel of the capacitor 1200 associated with the fourth electrical connection channel corresponding to the defective pad 1020 or the pad thereat (directly connected to the identified and determined defective pad 1020 due to the short-circuit) to the negative electrode V- of the power source 22. Here, in other words, the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 is electrically connected to the negative electrode V- of the power source via the short-circuit wire 1300 of the short-circuit capacitor 1200 and another fourth electrical connection channel related to the capacitor 1200. Of course, optionally, in this embodiment, when the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 can be fully exposed, the second end 1042 can be directly electrically connected to the negative electrode V- of the power source without the need to short-circuit the capacitor 1200.

[0048] exist Figure 4 In the embodiment of the present invention, although the printed circuit board 12 is not shown, those skilled in the art will appreciate that, in the case where a printed circuit board is present, similar means as described above may be adopted without departing from the scope of the present application. Figure 4 Only a simplified diagram without printed circuits or other intermediate components is shown in FIG. 1 , but this is only exemplary and not restrictive. Figure 4 In the embodiment, the defective pad is shown as being located on the space transformer 10, but those skilled in the art will appreciate that this is merely illustrative and not restrictive, and that the defective pad may actually be located on other possible components such as the printed circuit board 12 without departing from the scope of the present application.

[0049] Figure 5 1042 of the corresponding electrical connection channel corresponding to and electrically connected to the defective pad 1020 is electrically connected to the negative electrode V- of the power source 22 according to the first embodiment of the present application. Figure 5In the embodiment, the second end 1042 of at least one fifth electrical connection channel in the electrical connection channel 104 is constructed to be electrically connected to another pad in the space transformer 10 to abut against the rear end of another probe (therefore, the fifth electrical connection channel is also called a capacitor-free loopback channel or an exposed loopback channel). In this case, the deposition method as described above may optionally include step 118, which includes identifying and determining that the defective pad 1020 is electrically connected to the first end 1040 in at least one fifth electrical connection channel. Therefore, in this case, the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 or another pad thereat is electrically connected to the negative pole V- of the power supply at step 102, which specifically corresponds to: electrically connecting the corresponding second end 1042 of the fifth electrical connection channel corresponding to the defective pad 1020 to the negative pole V- of the power supply 22. Figure 5 In the embodiment of the present invention, although the printed circuit board 12 is not shown, those skilled in the art will appreciate that, in the case where a printed circuit board is present, similar means as described above may be adopted without departing from the scope of the present application. Figure 5 Only a simplified diagram without printed circuits or other intermediate components is shown in FIG. 1 , but this is only exemplary and not restrictive. Figure 5 In the embodiment, the defective pad is shown as being located on the space transformer 10, but those skilled in the art will appreciate that this is merely illustrative and not restrictive, and that the defective pad may actually be located on other possible components such as the printed circuit board 12 without departing from the scope of the present application.

[0050] exist Figure 5 In the embodiment, the corresponding second end 1042 of the fifth electrical connection channel corresponding to the defective welding pad is brought into contact with the flexible pin electrically connected to the negative electrode V- of the power source. This is because the contact between another welding pad at the second end 1042 and the rigid pin is usually prone to wear or scratches, thereby affecting the function and electrical performance of the other welding pad.

[0051] Of course, for Figure 4 For the third exemplary operation, the corresponding first end 1040 of another fourth electrical connection channel of the capacitor 1200 associated with the fourth electrical connection channel corresponding to the defective welding pad 1020 or the welding pad thereat can also be selectively brought into contact with the flexible pin electrically connected to the negative pole V- of the power source, thereby avoiding wear or scratches on the welding pad at this position.

[0052] Optionally, in order to avoid the adverse effects of impurities that may exist at the defective pad on electroplating, such as affecting the adhesion of the electroplated metal or the electroplating current, the defective pad is physically cleaned before supplying the plating solution, such as wiping (with the help of special erasers), blowing, flushing with water and then blowing dry, etc.

[0053] It should be noted here that for different electroplating solutions, the metal to be deposited may be deposited on the positive electrode V+ of the power supply. In this case, it is necessary to reverse the positions to which the positive electrode V+ and the negative electrode V- of the power supply in the above embodiments are connected. Obviously, these embodiments are also included in the scope of protection of the present application.

[0054] Figure 6 A flow chart of a local metal deposition method for a probe card assembly 1 according to a second embodiment of the present application is shown. The main difference between the second embodiment and the first embodiment is that the local metal deposition method in the second embodiment deposits a larger amount of metal material and even reconstructs a new pad instead of simply completing it.

[0055] In the second embodiment, the structure of the probe card assembly 1 is the same as or similar to that of the first embodiment and will not be further described herein.

[0056] according to Figure 6 The flow of a local metal deposition method for a probe card assembly is shown, the method includes identifying and determining a defective pad 1020 on a space transformer 10 at step 600 .

[0057] Similarly, optionally, the method includes the step of detaching the probe card assembly 1 from the tester and / or detaching the probe head from the probe card assembly, which may be performed before or after identifying and determining the defective pad 1020 without departing from the scope of the present application.

[0058] Additionally, in the method of the second embodiment, step 620 is included, wherein the degreasing electrode (not shown) and the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad 1020 and electrically connected to the defective pad 1020 are electrically connected to a power source. The relevant technical principles of electrolytic degreasing are well known to those skilled in the art and will not be further described herein. It should be understood that any appropriate electrolytic degreasing method may be used herein without departing from the scope of the present application.

[0059] In step 622, an electrolytic degreasing liquid is supplied to the position of the defective pad 1020 so that the degreasing electrode and the defective pad can be connected to form a continuous circuit via the electrolytic degreasing liquid.

[0060] In step 624, the electrolytic degreasing liquid is energized with a second predetermined voltage and a second predetermined current for a second predetermined time period to degrease the position of the defective pad. It can be imagined that the electrolytic degreasing liquid can be the same as the electroplating liquid described above and below (the same composition and content) or similar (the same composition but the content is different but similar) or different (the composition is different and the content of most components is also different) without departing from the scope of this application. Optionally, the second predetermined voltage is selected as 11V, the second predetermined current is selected as 0.02A, and the second predetermined time period is selected as 15 to 30s, so as to be able to fully remove the possible existence of grease and other substances. More generally, in the case of using the corresponding electroplating liquid described in the first embodiment as the electrolytic degreasing liquid, compared with the first embodiment, the second predetermined voltage is higher than the first predetermined voltage, the second predetermined current is less than the first predetermined current, but the second predetermined time is longer than the first predetermined time, so that the deposited metal material can be fully deposited under the grease and the grease is separated from the defective pad 1020.

[0061] In step 626, the degreasing electrode and the defective pad 1020 are isolated from each other and the remaining electrolytic degreasing liquid is removed. At this step, it is indicated that the electrolytic degreasing has been completed. Although in the embodiment of the present application, a degreasing or cleaning method for the defective pad is described with the aid of the electrolytic degreasing steps of steps 620-626, it should be known to those skilled in the art that the degreasing or cleaning method can be other forms other than electrolytic degreasing without departing from the scope of the present application, such as chemical cleaning (with the aid of specific chemical components), etc.

[0062] Thereafter, at step 602, the electroplating electrode 20 is electrically connected to the positive electrode V+ of the power source 22, and the second end 1042 of the corresponding electrical connection channel 104 corresponding to and electrically connected to the defective pad 1020 is electrically connected to the negative electrode V- of the power source 22. For the specific meaning and explanation of step 602, reference may be made to step 102 of the first embodiment and no further details will be given here.

[0063] At step 604, the plating solution is supplied to the position of the degreased defective pad 1020 so that the electroplating electrode 20 and the defective pad are connected to form a continuous circuit via the plating solution. The specific meaning and explanation of step 604 can be referred to step 104 of the first embodiment and will not be further described here.

[0064] At step 606, the plating solution is energized at a third predetermined voltage and a third predetermined current for a third predetermined period of time to deposit a desired material on the defective pad 1020. The specific meaning and explanation of step 606 can be referred to step 106 of the first embodiment and will not be further described here.

[0065] In the case where the corresponding plating solution described in the first embodiment is used as the plating solution of the second embodiment, compared with the first embodiment, the third predetermined voltage is substantially the same as the first predetermined voltage, the third predetermined current is much smaller than the first predetermined current, but the third predetermined time is significantly longer than the first predetermined time, so that the desired metal material can be fully deposited at the position of the defective pad 1020. In this case, as an example, compared with the first embodiment, the third predetermined voltage is selected to be 5 to 8V, the third predetermined current is selected to be 0.1mA, and the third predetermined time period is selected to be at least 2 hours.

[0066] At step 608, the electroplating electrode 20 and the defective pad 1020 are separated from each other and the remaining electroplating solution is removed. The specific meaning and explanation of step 608 can be referred to step 108 of the first embodiment and will not be further described here.

[0067] At step 610, the electroplated defective pad 1020 is cleaned to obtain a completed pad. The specific meaning and explanation of step 610 can be referred to step 110 of the first embodiment and will not be further described here.

[0068] Optionally, in a second embodiment of the present application, step 606 also includes multiple electroplating cycles during a third predetermined time period: wherein, at predetermined intervals, the plating electrode 20 and the defective pad 1020 are isolated from each other (for example, the electrical connection between the plating electrode and the defective pad via the plating solution is disconnected) and the current remaining plating solution is removed by scraping; and then new plating solution is supplied to the position of the defective pad 1020 and the plating electrode 20 and the defective pad 1020 are connected to form a continuous circuit via the plating solution to restart electroplating for the same predetermined time. In other words, step 606 consists of a plurality of electroplating cycles, each of which includes: supplying the plating solution to the position of the defective pad 1020 and conducting the plating electrode 20 and the defective pad 1020 into a continuous circuit via the plating solution; energizing the plating solution at a third predetermined voltage and a third predetermined current for a predetermined time to deposit the desired material on the defective pad; isolating the plating electrode 20 and the defective pad 1020 from each other (disconnecting the electrical connection) and removing the current remaining plating solution by scraping; and then supplying a new plating solution to the position of the defective pad 1020 and conducting the plating electrode 20 and the defective pad 1020 into a continuous circuit via the plating solution to restart the electroplating. As an example, the predetermined time is selected as 5 minutes. At this time, step 606 includes: supplying the plating solution to the position of the defective pad 1020 and connecting the plating electrode 20 and the defective pad 1020 to form a continuous circuit through the plating solution; energizing the plating solution for 5 minutes at a third predetermined voltage and a third predetermined current; isolating the plating electrode 20 and the defective pad 1020 from each other and removing the current remaining plating solution by scraping; and then supplying new plating solution to the position of the defective pad 1020, connecting the plating electrode 20 and the defective pad 1020 to form a continuous circuit through the plating solution and restarting plating for 5 minutes, and repeating this cycle until the third predetermined time is reached.

[0069] Figure 7 A schematic diagram of a system for local metal deposition of a probe card assembly 1 according to an embodiment of the present application is shown. As previously mentioned, the probe card assembly 1 includes a structure similar to or the same as that described in the first and second embodiments. At this time, the system includes at least: - a power supply, which is configured to provide a desired current and a desired voltage; - a plating electrode, which is electrically connected to the positive pole V+ of the power supply; and - a plating liquid supply source 300, which is configured to supply the plating liquid to the location of the defective pad 1020; With the system of the present application, the second end 1042 of the corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad 1020 is configured to be electrically connected to the negative pole V- of the power supply via a cable for related electroplating operations.

[0070] Further, in an embodiment of the present application, the plating solution supply source 300 or its supply opening 302 is configured to be integrated with the plating electrode 20, so that the plating solution is supplied to the front end position of the plating electrode 20 and can form a conductive loop by contacting the defective pad 1020 with the plating solution. It should be noted that the structure of such an integrated supply opening and the plating electrode 20 can be configured as a pen, wherein the supply opening supplies the plating solution to or near the front end of the pen-shaped structure and the plating electrode extends to the front end and can contact the plating solution. At this time, supplying the plating solution can be described as bringing the front end of the pen-shaped structure close to the defective pad so that the defective pad is connected to the plating electrode via the plating solution to form a path to achieve the electroplating operation.

[0071] Although in the embodiments of the present application, the steps of the relevant methods of the present application are described in a certain order, these orders are merely exemplary and not restrictive, and some of these steps can be performed in the opposite order or omitted, or some of the steps can be implemented in the same step or one of these steps can be implemented in combination of multiple steps, and these variations are all included in the relevant protection scope of the present application.

[0072] Although the present application has been described with reference to the drawings and embodiments of the present application, those skilled in the art can conceive of various modifications based on the teachings of the present application without departing from the scope of the present application.

Claims

1. A method for local metal deposition of a probe card assembly, wherein: The probe card assembly comprises: a probe head for supporting the probe; A space transformer including a pad on one side for electrically contacting a rear end of the probe, the space transformer including electrical connection channels therein, the first end of each of the electrical connection channels being used to electrically connect to the pad; Wherein, the method comprises: - identifying and locating defective pads on the space transformer; - electrically connecting the electroplating electrode to the positive pole of a power source and electrically connecting the second end of the corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad to the negative pole of the power source; - supplying a plating solution to the position of the defective pad and connecting the plating electrode and the defective pad to form a continuous circuit via the plating solution; - passing electricity through the plating solution at a first predetermined voltage and a first predetermined current for a first predetermined period of time to deposit a desired material on the defective pad; - isolating the electroplating electrode and the defective pad from each other and removing the remaining electroplating solution at the location of the defective pad; and - Cleaning the electroplated defective pad to obtain a completed pad.

2. The local metal deposition method according to claim 1, wherein: The second end of at least one first electrical connection channel among the electrical connection channels is constructed to be powered via an electrical connector during a test operation, or the second end of at least one second electrical connection channel among the electrical connection channels is constructed to be grounded via the electrical connector during the test operation, wherein the method further includes: identifying and determining that the defective welding pad is electrically connected to the first end of the at least one first electrical connection channel or the at least one second electrical connection channel; and electrically connecting the corresponding second end of the first electrical connection channel or the second electrical connection channel corresponding to the defective welding pad to the negative pole of the power supply via the electrical connector.

3. The local metal deposition method according to claim 1, wherein: The second end of at least one third electrical connection channel in the electrical connection channel is constructed to be electrically connected to the signal terminal of the tester to transmit signals during a test operation, wherein the method also includes: identifying and determining that the defective solder pad is electrically connected to the first end of the at least one third electrical connection channel; setting an expander card to be electrically connected to the second end of the at least one third electrical connection channel; and electrically connecting the corresponding second end of the third electrical connection channel corresponding to the defective solder pad to the negative pole of the power supply via the expander card.

4. The local metal deposition method according to claim 1, wherein: The second ends of at least two fourth electrical connection channels among the electrical connection channels are constructed to be electrically connected to a capacitor during a test operation, wherein the method further includes: identifying and determining that the defective pad is electrically connected to the first end of at least one of the at least two fourth electrical connection channels; short-circuiting the capacitor associated with the fourth electrical connection channel corresponding to the defective pad; and electrically connecting the corresponding first end of another fourth electrical connection channel of the capacitor associated with the fourth electrical connection channel corresponding to the defective pad to the negative pole of the power supply.

5. The local metal deposition method according to claim 1, wherein: The second end of at least one fifth electrical connection channel in the electrical connection channel is constructed to be electrically connected to another pad in the space transformer to abut against the rear end of another probe, wherein the method further includes: identifying and determining that the defective pad is electrically connected to the first end in the at least one fifth electrical connection channel; and electrically connecting the corresponding second end of the fifth electrical connection channel corresponding to the defective pad to the negative pole of the power supply.

6. The local metal deposition method according to claim 5, wherein: The corresponding second end of the fifth electrical connection channel corresponding to the defective pad is brought into contact with the flexible pin electrically connected to the positive electrode of the power source to achieve electrical connection.

7. The local metal deposition method according to claim 1, wherein: The method further includes physically cleaning the defective pad before supplying the electroplating solution.

8. The local metal deposition method according to claim 1, wherein: The first predetermined voltage is selected to be 5 to 8 V, the first predetermined current is selected to be 0.3 to 0.5 A, and the first predetermined time period is selected to be 3 to 5 s.

9. The local metal deposition method according to claim 1, wherein: The electroplating solution is a gold ion electroplating solution for depositing gold.

10. A method for local metal deposition for a probe card assembly, wherein: The probe card assembly comprises: a probe head for supporting the probe; A space transformer including a pad on one side for electrically contacting a rear end of the probe, the space transformer including electrical connection channels therein, the first end of each of the electrical connection channels being used to electrically connect to the pad; Wherein, the method comprises: - identifying and locating defective pads on the space transformer; - electrically connecting the degreasing electrode and the second end of the corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad to a power source; - supplying an electrolytic degreasing liquid to the position of the defective pad so that the degreasing electrode and the defective pad are connected to form a continuous circuit via the electrolytic degreasing liquid; - energizing the electrolytic degreasing liquid at a second predetermined voltage and a second predetermined current for a second predetermined period of time to degrease the position of the defective pad; - isolating the degreasing electrode and the defective pad from each other and removing the remaining electroplating degreasing liquid; - electrically connecting the electroplating electrode to the positive pole of a power source and electrically connecting the second end of the corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad to the negative pole of the power source; - supplying a plating solution to the position of the defective pad so as to connect the plating electrode and the defective pad to form a continuous circuit via the plating solution; - passing electricity through the plating solution at a third predetermined voltage and a third predetermined current for a third predetermined period of time to deposit a desired material on the defective pad; - isolating the electroplating electrode and the defective pad from each other and removing the remaining electroplating solution; and - Cleaning the electroplated defective pad to obtain a completed pad.

11. The local metal deposition method according to claim 10, wherein: The method further comprises a plurality of electroplating cycles during the third predetermined time period: isolating the electroplating electrode and the defective pad from each other and removing the current residual electroplating solution in a scraping manner at predetermined intervals; Then, a new electroplating solution is supplied to the position of the defective pad and the electroplating electrode and the defective pad are connected to form a continuous circuit via the electroplating solution to restart the electroplating cycle.

12. The local metal deposition method according to claim 10, wherein: The second predetermined voltage is selected as 11V, the second predetermined current is selected as 0.02A, and the second predetermined time period is selected as 15 to 30s; and the third predetermined voltage is selected as 5 to 8V, the third predetermined current is selected as 0.1mA, and the third predetermined time period is selected as at least 2 hours.

13. The local metal deposition method according to claim 12, wherein: The predetermined time is selected to be 5 minutes.

14. A system for localized metal deposition of a probe card assembly, wherein: It is configured to implement the method as claimed in any one of the preceding claims, wherein the probe card assembly comprises: a probe head for supporting the probe; A space transformer including a pad on one side for electrically contacting a rear end of the probe, the space transformer including electrical connection channels therein, the first end of each of the electrical connection channels being used to electrically connect to the pad; Wherein, the system at least comprises: - a power supply configured to provide a desired current and a desired voltage; - a plating electrode electrically connected to the negative pole of a power supply; and - a plating solution supply source, which is configured to supply the plating solution to the location of the defective pad; Wherein, the second end of the corresponding electrical connection channel corresponding to the defective pad and electrically connected to the defective pad is configured to be electrically connected to the positive electrode of the power source via a cable.

15. The system of claim 14, wherein: The supply opening of the electroplating solution supply source is configured to be integrated with the electroplating electrode, so that the electroplating solution is supplied to the front end of the electroplating electrode and a conductive loop can be formed by the electroplating solution contacting the defective pad.

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