Extended range high speed interconnect

Abstract

The present disclosure relates to extended range high speed interconnects. Embodiments may provide extended range high speed interconnects by providing a micro coaxial cable in a hybrid flexible circuit board, which may be referred to as a hybrid flex or a micro coaxial flex. Such a hybrid flex may be used to transmit signals over an extended distance within an electronic device. Multiple signals may be transmitted using a corresponding micro coaxial cable. The micro coaxial cable may include a center conductor, an insulating layer, and an outer shielding layer. The cables may be held in position relative to each other in the hybrid flex by polyimide or other insulating layers. A copper layer may be disposed on one or both of the top and bottom of the polyimide or other insulating layer. Additional conductors may be embedded in the polyimide or other insulating layers to transmit power and grounding. The micro coaxial and other conductors may be soldered to the flexible circuit board or other substrate using jet soldering.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of and priority to U.S. Provisional Application No. 63 / 541,711, filed on September 29, 2023, and U.S. Non-Provisional Application No. 18 / 378,091, filed on October 9, 2023, which are incorporated herein by reference in their entireties for all purposes. Background Art

[0003] The number of commercially available electronic devices of various types has increased dramatically over the past few years, and the rate of introduction of new devices shows no sign of slowing down. Devices such as tablet computers, laptop computers, all-in-one computers, desktop computers, cellular phones, storage devices, wearable computing devices, portable media players, portable computing devices, navigation systems, monitors, audio devices, remote controls, adapters, etc. have become ubiquitous.

[0004] These electronic devices may include several high-speed circuits that can generate or process large amounts of data. For example, connectors on electronic devices can receive and send large amounts of data at high rates. Processors can receive large amounts of data from wireless circuits, cameras, sensors, and other circuits.

[0005] These communication circuits can be placed in electronic devices spaced apart from each other. However, it is very difficult to transmit data at high speed over a distance within an electronic device. For example, conventional flexible circuit boards can degrade signals and generate a lot of electromagnetic interference even over short distances. Stripline technology can be helpful, but is generally lacking. Therefore, it may be desirable to have high-speed interconnects that can span distances in electronic devices. It is also desirable that these interconnects can also be used in external applications, such as in cables that can connect two electronic devices.

[0006] Because these communication circuits are some distance apart, there may be intermediate circuits or components physically located between them. This may require routing interconnects around the intermediate circuits or components. Therefore, it is desirable that these interconnects be highly flexible. Also, some electronic devices can be manufactured in large quantities. To meet the demand for these electronic devices, it is desirable that they be easy to manufacture.

[0007] Therefore, what is needed is an interconnect that can transmit high-speed data over long distances within an electronic device, is highly flexible, and is easy to assemble. Summary of the invention

[0008] Therefore, embodiments of the present invention can provide interconnects that can transmit high-speed data over long distances within electronic devices, are highly flexible, and are easy to assemble. Exemplary embodiments of the present invention can provide extended range high-speed interconnects by providing a micro coaxial cable (herein referred to as a micro coaxial cable) in a hybrid flexible circuit board (which can be referred to as a hybrid flexible member). Such a hybrid flexible member can be used to transmit signals over an extended distance within an electronic device. Multiple signals can be transmitted using a corresponding micro coaxial cable. The micro coaxial cable may include a center conductor, an insulating layer, and an outer shielding layer. The cables may be held in place in the hybrid flexible member relative to each other by polyimide or other insulating layers. The conductive layer may be disposed on one or both of the top and bottom of the polyimide or other insulating layer. The conductive layer may be formed of copper, copper alloy, or other conductive materials. Additional conductors may be embedded in the polyimide or other insulating layers to transmit power and grounding. Additional conductors may include bare wires that may be stranded or solid, magnet (or ceramic) wires, enameled wires, or other types of wires. The micro coaxial cable and other conductors may be welded to a printed wiring board, a flexible circuit board, or other substrate using jet welding.

[0009] Exemplary embodiments of the present invention may provide a highly flexible, high-speed interconnect structure. The interconnect structure (which may be referred to as a micro-coaxial flex or a hybrid flex) may include one, two, three, four, or more than four first micro-coaxial cables. The interconnect structure may also include one, two, three, four, or more than four power and ground conductors for power, ground, and other high current paths. The interconnect structure may include one, two, three, four, or more than four second micro-coaxial cables.

[0010] The conductors for the hybrid flexible member can be arranged in various ways. For example, four first micro-coaxial cables can be positioned on the first side, and two second micro-coaxial cables can be placed on the second side. Three power and ground conductors can be placed between the first micro-coaxial cable and the second micro-coaxial cable. The three power and ground conductors are allocated as one power conductor and two ground conductors.

[0011] The first micro coaxial cable and the second micro coaxial cable can be similar or identical, or they can be different. The first micro coaxial cable and the second micro coaxial cable can each include a center conductor, an insulating layer, and an external ground shield for transmitting a signal. The ground shield for each micro coaxial cable can be attached to the copper, copper alloy, or other conductive material layer on the bottom side. They can also be attached to the top side of the copper, copper alloy, or other conductive material layer.

[0012] The power and ground conductors may be solid wire, they may be stranded wire, they may be magnet wire, enameled wire, or they may be other types of wire.

[0013] The first micro-coaxial cable, the power and ground conductors, and the second micro-coaxial cable may be fixed to each other in an insulating layer. The insulating layer may be formed of polyimide or other flexible insulating materials. Copper, copper alloy, or other conductive layer may be attached to either or both of the top and bottom sides of the insulating material. The copper, copper alloy, or other conductive layer may contact or be connected to the shielding for the first micro-coaxial cable and the second micro-coaxial cable. The copper, copper alloy, or other conductive layer may contact or be connected to the ground conductor. An insulator or insulating layer may be used to isolate the power conductor from the copper, copper alloy, or other conductive layer.

[0014] These and other embodiments of the present invention can utilize various miniature coaxial cables. These miniature coaxial cables can have a center conductor. The center conductor can be a solid wire or a stranded wire, such as a Litz wire. The center conductor can be insulated with an insulating layer, which can be formed of polyethylene or other flexible insulating materials. The outside of the insulating layer can be covered with a metal shield. For example, the insulating layer can be covered in a shield formed by a conductive braid, foil or other type of layer. The shield can be formed of copper, copper alloy, aluminum or other materials.

[0015] These micro coaxial cables can be soldered to a circuit board or other substrate using jet soldering. For example, the center conductor can be soldered to a trace of the board using jet soldering. One or both sides of the shield can be soldered to one or more ground pads of the circuit board or other substrate using jet soldering.

[0016] This jet welding may include feeding solder balls to a nozzle. The solder balls may be stored in a hopper waiting to be turned. The solder balls may be heated with a laser or by other methods. The solder balls may be heated with a laser and then expelled toward a target by pressurized nitrogen.

[0017] These and other embodiments of the present invention may include various passive and active components in a hybrid flexible member. For example, components for filtering power supply voltage, termination cables, and other components may be included. These components may be formed of thin film multiferroic materials. For example, ferroelectric tunable film capacitors may be included. These film capacitors may decouple the power supply voltage transmitted on one of the power supply and ground conductors. Such capacitors may be connected between the power supply conductor and the ground conductor. The control voltage may be transmitted to the film capacitor via a conductor in the hybrid flexible member. Other components may be included, such as chokes. Filter circuits such as Pi filters, voltage tunable pi filters, and other power line noise filters may be implemented. Chokes may be implemented using ferromagnetic thin film ferrites. These structures may be manufactured in hybrid flexible members using planar manufacturing techniques.

[0018] For example, multiple micro-coaxial cables and other conductors can be partially molded into an insulator such that the bottom of the micro-coaxial cable is molded and the top is not. Conductive traces or other conduits for power and ground can be placed in the middle layer of the insulator. Thin film multiferroic structures, such as capacitors and chokes, can be formed in contact with these conductive traces or other conduits. The remaining exposed portion of the micro-coaxial cable can then be molded.

[0019] These and other embodiments of the present invention can provide a low profile hybrid flexible connector. The connector can include a hybrid flexible member having a conductor that terminates in a solder connection to a pad on the top of a first board. A polyimide mold or a ferrite load mold (EMI shield) can be placed over the solder terminals and pads on the first board. The first board can have a through connection to the pads on the bottom of the first board. The pads on the bottom of the board can be connected to the pads on the second board. The second board can be a main logic board or other board. The pads on the bottom of the first board can be connected to the pads on the second board using an anisotropic conductive film. The first board and the second board can be connected to each other using interlocking screws or other fasteners.

[0020] Embodiments of the present invention may provide hybrid flexible members that may be located in various types of devices, such as tablets, laptop computers, desktop computers, all-in-one computers, smart phones, storage devices, wearable computing devices, portable computing devices, portable media players, navigation systems, monitors, audio devices, remote controls, adapters, and other devices.

[0021] Various embodiments of the present invention may include one or more of these and other features described herein.The nature and advantages of the present invention may be better understood by referring to the following detailed description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Electronic devices that may be improved by incorporating embodiments of the present invention are illustrated.

[0023] Figure 2 is a top view of a hybrid flexure according to an embodiment of the present invention.

[0024] Figure 3 yes Figure 2 A cross-sectional side view of a hybrid flexible member;

[0025] Figure 4A and Figure 4B illustrates a micro coaxial cable used in an embodiment of the present invention;

[0026] Figure 5 illustrates a welded structure formed using spray welding according to an embodiment of the present invention;

[0027] Figure 6 An apparatus and method for forming a solder jet connection according to an embodiment of the present invention are illustrated;

[0028] Figure 7 An apparatus and method for forming a solder jet connection according to an embodiment of the present invention are illustrated;

[0029] Figure 8 An eye diagram of a PAM4 signal transmitted by a hybrid flex according to an embodiment of the present invention is illustrated;

[0030] Fig. 9 Illustrate that can be used to send Fig.18 Pre-emphasis of PAM4 signal;

[0031] Fig.10 illustrates the insertion loss of a hybrid flexure according to an embodiment of the present invention;

[0032] Fig.11 illustrates electromagnetic interference generated by a hybrid flexure according to an embodiment of the present invention;

[0033] Fig.12 is a top view of a hybrid flexible member according to an embodiment of the present invention;

[0034] Fig.13 yes Fig.12 A side view of a hybrid flexible member;

[0035] Fig.14 is a top view of a hybrid flexible member including a thin film multiferromagnetic structure according to an embodiment of the present invention;

[0036] Fig.15 yes Fig.14 A side view of a hybrid flexible member;

[0037] Fig.16A and Fig. 16B A thin film multiferromagnetic structure according to an embodiment of the present invention is illustrated;

[0038] Fig.17A and Fig. 17B A thin film multiferromagnetic structure according to an embodiment of the present invention is illustrated; and

[0039] Fig.18 A low profile hybrid flex connector according to an embodiment of the present invention is illustrated. DETAILED DESCRIPTION

[0040] Figure 1An electronic device that can be improved by combining embodiments of the present invention is illustrated. The electronic device 100 may include a housing 120 that supports a screen 110. The electronic device 100 may include a connector, a processor, a sensor, a wireless communication circuit, a camera, a memory, and other electronic circuits and components (not shown). These circuits can share a large amount of data at a very high speed. These circuits can also be placed away from each other inside the electronic device 100. Other circuits and components can also be placed between these communication circuits. Therefore, embodiments of the present invention can provide a communication path that can transmit high-speed signals over a certain distance in an electronic device, and have a high degree of flexibility so that they can be routed around an intermediate structure.

[0041] Although the electronic device 100 is shown as a tablet computer, the electronic device 100 may be another type of electronic device, such as a laptop computer, a desktop computer, an all-in-one computer, a cellular phone, a storage device, a wearable computing device, a portable computing device, a portable media player, a navigation system, a monitor, an audio device, a remote control, an adapter, and other devices.

[0042] While embodiments of the present invention are well suited for communication between two circuits in an electronic device, they can also be used to transmit data and power between two electronic devices. For example, embodiments of the present invention can be used in cables and other structures.

[0043] Exemplary embodiments of the present invention may provide a highly flexible, high-speed interconnect structure. The interconnect structure, which may be referred to as a hybrid flexible circuit board or simply a hybrid flexible member, may include one, two, three, four, or more than four first micro-coaxial cables, referred to herein as micro-coaxial cables. The interconnect structure may also include one, two, three, four, or more than four power and ground conductors for power, ground, and other high current paths. The interconnect structure may include one, two, three, four, or more than four second micro-coaxial cables.

[0044] The conductors for the hybrid flexible member can be arranged in various ways. For example, four first micro-coaxial cables can be positioned on the first side, and two second micro-coaxial cables can be placed on the second side. Three power and ground conductors can be placed between the first micro-coaxial cable and the second micro-coaxial cable. The three power and ground conductors are allocated as one power conductor and two ground conductors.

[0045] The first micro coaxial cable and the second micro coaxial cable can be similar or identical, or they can be different. The first micro coaxial cable and the second micro coaxial cable can each include a center conductor, an insulating layer, and an external ground shield for transmitting signals. The ground shield for each micro coaxial cable can be attached to the copper, copper alloy, or other conductive material layer on the bottom side. They can also be attached to the copper, copper alloy, or other conductive material layer on the top side.

[0046] The power and ground conductors may be solid wire, they may be stranded wire, they may be magnet wire, enameled wire, or they may be other types of wire.

[0047] The first micro-coaxial cable, the power and ground conductors, and the second micro-coaxial cable can be fixed to each other in an insulating layer. The insulating layer can be formed of polyimide or other flexible insulating materials. Copper, copper alloy or other conductive layers can be attached to either or both of the top side and bottom side of the insulating material. The copper, copper alloy or other conductive layer can contact or be connected to the ground shield for the first micro-coaxial cable and the second micro-coaxial cable. The copper, copper alloy or other conductive layer can contact or be connected to the ground conductor. The power conductor can be isolated from the copper, copper alloy or other conductive layer using an insulator or insulating layer. An example is shown in the figure below.

[0048] Figure 2 2 is a top view of a hybrid flexible member according to an embodiment of the present invention. The hybrid flexible member 200 may include one, two, three, four, or more first micro-coaxial cables, shown here as micro-coaxial cable 210, micro-coaxial cable 212, micro-coaxial cable 214, and micro-coaxial cable 216 (collectively referred to as first micro-coaxial cables 210). The hybrid flexible member 200 may also include one, two, three, four, or more than four power and ground conductors for power, ground, and other high current paths, shown here as conductor 220, conductor 222, and conductor 224 (collectively referred to as power and ground conductors 220 or conductors 220). The hybrid flexible member 200 may also include one, two, three, four, or more than one second first micro-coaxial cables, shown here as micro-coaxial cable 230 and micro-coaxial cable 232 (collectively referred to as second micro-coaxial cables 230). The power and ground conductor 220 may be positioned between the first micro-coaxial cable 210 and the second micro-coaxial cable 230. The power and ground conductors 220 may be solid wires, they may be stranded wires, they may be magnet wire (magnet wire), enameled wire, or they may be other types of wires.

[0049] The first micro-coaxial cable 210, the power and ground conductors 220, and the second micro-coaxial cable 230 can be placed on the bottom conductive layer 240. The center conductor 310 and the center conductor 330 can be outside the edge of the bottom conductive layer 240 for soldering to a board or other structure. The bottom conductive layer 240 can be connected to the ground shield or outer shield 414 (such as the outer shield 414 of each of the first micro-coaxial cable 210 and the second micro-coaxial cable 230) Figure 4A and Figure 4B The bottom conductive layer 240 can be electrically connected to the insulating member 242 (as shown). Figure 3 2) is insulated from the power conductor 220. The insulating member 242 may be formed of polyethylene or other flexible insulators. The bottom conductive layer 240 may be formed of copper, copper alloy or other conductive materials. The insulating layer 350 (as shown) is insulated from the power conductor 220. The insulating member 242 may be formed of polyethylene or other flexible insulators. The bottom conductive layer 240 may be formed of copper, copper alloy or other conductive materials. Figure 3 ) may be formed on the bottom conductive layer 240. The insulating layer 350 may be formed of polyimide or other materials. The insulating layer 350 may secure the first micro coaxial cable 210, the power and ground conductors 220, and the second micro coaxial cable 230 in place on the bottom conductive layer 240. The top conductive layer 340 (as shown) may be formed on the bottom conductive layer 240. The insulating layer 350 may be formed of polyimide or other materials. The insulating layer 350 may secure the first micro coaxial cable 210, the power and ground conductors 220, and the second micro coaxial cable 230 in place on the bottom conductive layer 240. Figure 3 20) can be placed on the first micro-coaxial cable 210, the power and ground conductors 220, and the second micro-coaxial cable 230. The top conductive layer 340 can be electrically connected to the outer shield 414 of each of the first micro-coaxial cable 210 and the second micro-coaxial cable 230. The top conductive layer 340 can be insulated from the power conductor 220 by the insulating member 242. The top conductive layer 340 can be formed of copper, copper alloy, or other conductive materials. The optional protective cover layer 342 (such as Figure 3 As shown) may be formed on one or both of the bottom conductive layer 240 and the top conductive layer 340.

[0050] Figure 3 Shows Figure 2 A cross-sectional side view of a hybrid flexible member. The hybrid flexible member 200 may include a first micro coaxial cable 210. The hybrid flexible member 200 may also include a power and ground conductor 220. The hybrid flexible member 200 may also include a second micro coaxial cable 230. The power and ground conductor 220 may be positioned between the first micro coaxial cable 210 and the second micro coaxial cable 230. The first micro coaxial cable 210, the power and ground conductor 220, and the second micro coaxial cable 230 may be placed on a bottom conductive layer 240. The bottom conductive layer 240 may be electrically connected to an outer shield 314 of each first micro coaxial cable 210 and an outer shield 334 of each second micro coaxial cable 230. The outer shield 314 and the outer shield 334 may be connected to an outer shield 414 (such as Figure 4A and Figure 4BThe bottom conductive layer 240 may contact the ground conductor 222 and may be connected to the power conductors 220 and 224 (all as shown) by the insulating member 242. Figure 2 The bottom conductive layer 240 may be formed of copper, copper alloy, or other conductive materials. The insulating layer 350 may be formed on the bottom conductive layer 240. The insulating layer 350 may fix the first micro-coaxial cable 210, the power and ground conductors 220, and the second micro-coaxial cable 230 in place on the bottom conductive layer 240. The top conductive layer 340 may be placed on the first micro-coaxial cable 210, the power and ground conductors 220, and the second micro-coaxial cable 230. The top conductive layer 340 may be electrically connected to the outer shield 314 of each first micro-coaxial cable 210 and the outer shield 334 of each second micro-coaxial cable 230. The top conductive layer 340 may contact the ground conductor 222 and may be insulated from the power conductors 220 and 224 by the insulating member 242. The top conductive layer 340 may be formed of copper, copper alloy, or other conductive materials. An optional protective cover layer 342 may be formed over either or both of the bottom conductive layer 240 and the top conductive layer 340. A conductive adhesive such as a conductive adhesive 1270 (eg, Fig.12 A conductive adhesive (shown) may be used to adhere the first micro-coaxial cable 210, the power and ground conductors 220, and the second micro-coaxial cable 230 to either or both of the bottom conductive layer 240 and the top conductive layer 340.

[0051] The first micro-coaxial cable 210 may include a center conductor 310, an insulating layer 312, and an outer shield 314. The second micro-coaxial cable 230 may include a center conductor 330, an insulating layer 332, and an outer shield 334. The first micro-coaxial cable 210 and the second micro-coaxial cable 230 may be similar or identical, or they may be different. The center conductor 310 and the center conductor 330 may be similar or identical, or they may be different. The first micro-coaxial cable 210 and the second micro-coaxial cable 230 may be similar or identical. Figure 4A and Figure 4B The micro-coaxial cable 400 shown in FIG.

[0052] The first micro-coaxial cable 210, the power and ground conductors 220, and the second micro-coaxial cable 230 can have various gauges. Using higher gauge, narrower wires can result in a more flexible hybrid flex. For example, a gauge less than 38, 38, 43, 46, or greater than 46 can be used. The term gauge as used herein refers to the American Wire Gauge (AWG) or Brown Sharpe gauge. These gauges can be used for conductors in each of these and other embodiments of the present invention.

[0053] These and other embodiments of the present invention can utilize various miniature coaxial cables. These miniature coaxial cables can have a center conductor. The center conductor can be a solid wire or a stranded wire, such as a Litz wire. The center conductor can be insulated with an insulating layer. The outside of the insulating layer can be covered with a metallized shield. For example, the insulating layer can be covered in a shield formed by a conductive braid, foil or other type of layer. The shield can be formed of copper, copper alloy, aluminum or other materials. Examples are shown in the following figure.

[0054] Figure 4A and Figure 4B The micro coaxial cable used in the embodiment of the present invention is illustrated. Figure 4A In the present invention, the micro coaxial cable 400 may have a twisted core or center conductor 410, a jacket or insulation layer 412, and an outer shield 414. The insulation layer 412 may be formed of polyethylene or other flexible insulating materials. The outer shield 414 may be formed of copper, copper alloys, aluminum, or other conductive materials. The outer shield 414 may be a braid, foil, or other type of layer. Figure 4B In preparation for soldering to a board or other substrate, the outer shield 414 can be stripped or removed to expose the insulation layer 412 and the center conductor 410. The insulation layer 412 can be stripped or removed to expose the center conductor 410.

[0055] The micro-coaxial cable 400 can be used as the first micro-coaxial cable 210, the second micro-coaxial cable 230, and other micro-coaxial cables shown herein. For example, the center conductor 410 can be connected to the center conductors 310 and 330 (such as Figure 2 shown) are the same or similar.

[0056] These micro coaxial cables can be soldered to a circuit board or other substrate using jet soldering. For example, the center conductor can be soldered to a trace of the board using jet soldering. One or both sides of the shield can be soldered to one or more ground pads of the circuit board or other substrate using jet soldering. An example is shown in the figure below.

[0057] Figure 5 A welded structure formed using jet welding according to an embodiment of the present invention is illustrated. In system 500, outer shield 414 of micro sync cable 400 can be welded to ground pad 550 on board 510 via weld bead 530. Center conductor 410 can be welded to signal pad (not shown) on board 510 via weld bead 540. Weld bead 530 and weld bead 540 (collectively referred to as weld bead 530) can be formed by jet welding or other techniques. Insulation layer 412 can help isolate weld bead 540 from weld bead 530.

[0058] This jet welding can include feeding solder balls to a nozzle. Solder balls can be stored in a hopper waiting to be turned. Solder balls can be heated with a laser or other method. Solder balls can be heated with a laser and then expelled toward a target by pressurized nitrogen. An example is shown in the figure below.

[0059] Figure 6 The apparatus and method for forming a solder jet connection according to an embodiment of the present invention are illustrated. In the system 600, the solder ball 720 (such as Figure 7 The solder balls (shown) may be fed into the nozzle 610, heated, and discharged from the opening 612 at a height 620. The solder balls may then form solder beads 530 (shown) that may solder the center conductor 410 to a pad (not shown) on the board 510. Figure 5 510 ). The outer shield 414 may be soldered to the ground pad in the same or similar manner. The insulating layer 412 may primarily set the height of the center conductor 410 relative to the top surface of the board 510 .

[0060] Figure 7 An apparatus and method for forming a solder jet connection according to an embodiment of the present invention is illustrated. Solder balls 720 can be stored in a hopper 730 in system 700. Solder balls 720 are fed through mechanism 740 as solder balls 722 and fed into nozzle 610 as solder balls 724. Solder balls 724 can be heated, for example, by laser 750. Solder balls 724 can then be discharged from opening 612 toward target 710 on board 510 by pressurized nitrogen.

[0061] The measured performance of the hybrid flex cable shows a greatly improved structure for transmitting high speed signals over distances. The figure below shows an example.

[0062] Figure 8 An eye diagram of a PAM4 signal transmitted by a hybrid flexure according to an embodiment of the present invention is illustrated. Graph 800 shows a PAM4 output signal 830 as a function of amplitude 810 and time 820. The PAM4 output signal 830 has a wide eye 840 and can provide accurate data recovery. The PAM4 output signal 830 can be data received through a 30 cm hybrid flexure provided by an embodiment of the present invention. In one example, data rates greater than 400 Gbit / sec for 4 channels at a distance of 30 cm can be achieved. This example can achieve these data rates using a fraction of the power consumption required by conventional techniques with a large amount of equalization.

[0063] Fig. 9 Illustrate that can be used to send Figure 8 Pre-emphasis 930 is shown in graph 900 as a function of attenuation 910 and frequency 920. In one example, a low frequency equalization of -14 dB may be used.

[0064] Fig.10 Insertion loss of a hybrid flex according to an embodiment of the present invention is illustrated. Graph 1000 may show insertion loss as a function of attenuation 1010 at frequency 1020. Insertion loss 1030 may be the insertion loss of a 30 cm hybrid flex provided by an embodiment of the present invention using a 43 AWG (gauge) micro coaxial cable. Insertion loss 1040 may be the insertion loss of a 30 cm hybrid flex provided by an embodiment of the present invention using a narrower 46 gauge micro coaxial cable. Insertion loss 1050 is shown for comparison and may be the insertion loss of a much shorter 11.4 cm conventional flex circuit board.

[0065] Fig.11 Electromagnetic interference generated by a hybrid flexure according to an embodiment of the present invention is illustrated. Graph 1100 shows interference as a function of amplitude 1110 and frequency 1120. Interference 1130 may be interference from a 30 cm hybrid flexure provided by an embodiment of the present invention. A higher amount of interference 1140 is shown for comparison and may be interference from a much shorter 11.4 cm conventional flexible circuit board.

[0066] These hybrid flexes can be arranged in various ways. An example is shown in the figure below.

[0067] Fig.12 is a side view of another hybrid flexible member according to an embodiment of the present invention. The hybrid flexible member 1200 may include a first micro-coaxial cable 1210. In this embodiment, four first micro-coaxial cables 1210 may be included, but one, two, three, or more than four first micro-coaxial cables 1210 may be included in these and other embodiments of the present invention. Four power and ground conductors 1220 may be included in the hybrid flexible member 1200, but one, two, three, or more than four power and ground conductors 1220 may be included in the hybrid flexible member 1200. The power and ground conductors 1220 may include two power conductors 1222, but other numbers of power conductors 1222 may be included, such as one or more than two power conductors 1222. The power and ground conductors 1220 may include two ground conductors 1224, but other numbers of ground conductors 1224 may be included, such as one or more than two ground conductors 1224.

[0068] The first micro-coaxial cable 1210 and the power and ground conductors 1220 may be attached to the bottom conductive layer 1260 using a conductive adhesive 1270. The bottom conductive layer 1260 may be connected to the outer shield 1226 and the ground conductor 1224 of the first micro-coaxial cable 1210. The power conductor 1222 may be insulated by a coating 1225. The power conductor 1222 and the coating 1225 may be magnet wire, magnet wire, enameled wire, or other types of protected wires. The first micro-coaxial cable 1210 and the power and ground conductors 1220 may be covered with an insulating layer 1250. The insulating layer 1250 may be formed of polyimide or other materials.

[0069] The first micro coaxial cable 1210 can be connected to the micro coaxial cable 400 (such as Figure 4A and Figure 4B For example, the outer shield 1226 can be the same as or similar to the outer shield 414 (as shown in FIG. Figure 4A and Figure 4B The bottom conductive layer 1260 may be formed of copper, copper alloy or other flexible conductive material and may be the same as or similar to the bottom conductive layer 1260. Figure 2 The top conductive layer 340 and the bottom conductive layer 240 in FIG. 1 are the same or similar. The insulating layer 1250 may be formed of polyimide or other materials and may be Figure 3 The insulating layer 350 in is the same or similar.

[0070] The first micro-coaxial cable 1210 and the power and ground conductors 1220 can have various gauges. Using higher gauge, narrower wires can result in a more flexible hybrid flex. For example, gauges less than 38, 38, 43, 46, or greater than 46 can be used. The term gauge as used herein refers to American Wire Gauge (AWG) or Brown Sharpe gauge. These gauges can be used for conductors in each of these and other embodiments of the present invention.

[0071] Fig.13 yes Fig.12 12 is a side view of a hybrid flexible member. The hybrid flexible member 1200 may include a first micro coaxial cable 1210 and a bottom conductive layer 1260. A conductive adhesive 1270 (such as Fig.12 Attach the first micro coaxial cable 1210 to the bottom conductive layer 1260 as shown. The first micro coaxial cable 1210 may include a center conductor 1212, which may be connected to the center conductor 410 (as shown). Figure 4A and Figure 4B The first micro coaxial cable 1210 may be covered by an insulating layer 1250. The outer shield 1226 may be electrically connected to the bottom conductive layer 1260.

[0072] These and other embodiments of the present invention may include various passive and active components in a hybrid flexible member. For example, components for filtering power supply voltage, termination cables, and other components may be included. These components may be surface mounted contact capacitors, resistors, or other types of passive or active devices. These components may be formed of thin film multiferroic materials. For example, ferroelectric tunable film capacitors may be included. These film capacitors may decouple the power supply voltage transmitted on one of the power supply and ground conductors. Such capacitors may be connected between the power supply conductor and the ground conductor. The control voltage may be transmitted to the film capacitor via a conductor in the hybrid flexible member. Other components may be included, such as chokes. Filter circuits such as Pi filters, voltage tunable pi filters, and other power line noise filters may be implemented. Chokes may be implemented using ferromagnetic thin film ferrites. These structures may be manufactured in hybrid flexible members using planar manufacturing techniques.

[0073] For example, multiple micro-coaxial cables and other conductors can be partially molded into an insulator such that the bottom of the micro-coaxial cable is molded and the top is not. Conductive traces or other conduits for power and ground can be placed in the middle layer of the insulator. Thin film multiferroic structures such as capacitors and chokes can be formed to contact these conductive traces or other conduits. The remaining exposed portion of the micro-coaxial cable can be molded. An example is shown in the figure below.

[0074] Fig.14 1 is a top view of a hybrid flexible member including a thin film multiferroic structure according to an embodiment of the present invention. The hybrid flexible member 1400 can transmit a signal from a first plate 1480 to a second plate 1490. The hybrid flexible member 1400 can include a plurality of first micro-coaxial cables 1410. In this embodiment, four first micro-coaxial cables 1410 are shown, but other numbers of first micro-coaxial cables 1410 may be included, such as one, two, three, or more than four first micro-coaxial cables 1410. The hybrid flexible member 1400 can include one power conductor 1422, but other numbers of power conductors 1422 may also be included. For example, more than one power conductor 1422 may be included. Two ground conductors 1424 may be included, but other numbers of ground conductors may also be included, such as one, three, or more than three ground conductors. A variable capacitor 1460 may also be included. The variable capacitor 1460 may be connected to the power conductor 1422 and the ground conductor 1424. Variable capacitor 1460 may help filter and remove power supply noise from power supply conductor 1422 by coupling the voltage on power supply conductor 1422 to ground.

[0075] The first micro-coaxial cable 1410 may include a center conductor 1428, which may be soldered to a pad 1482 on a first board 1480 and a pad 1492 on a board 1490 using a solder bead 1470. An outer shield 1426 may be soldered to a pad 1484 on the first board 1480 and a pad 1494 on the second board 1490 using a solder bead 1472. A power conductor 1422 and a ground conductor 1424 may be soldered to a pad 1486 on the first board 1480 and a pad 1496 on the second board 1490 using a solder bead 1474. The solder beads 1470, 1472, and 1474 may be soldered to a pad 1484 on the first board 1480 and a pad 1494 on the second board 1490 using a solder bead 1472. Figure 6 and Figure 7 and the techniques described elsewhere herein.

[0076] The first micro-coaxial cable 1410 can have various specifications. Using higher specifications, narrower wires can result in more flexible hybrid flexible parts. For example, specifications less than 38, 38, 43, 46 or greater than 46 can be used. The term specification used herein refers to American Wire Gauge (AWG) or Brown Sharpe wire gauge. These specifications can be used for conductors in each of these and other embodiments of the present invention.

[0077] Fig.15 yes Fig.14 14. A side view of a hybrid flexible member 1400. The hybrid flexible member 1400 may include a plurality of first micro-coaxial cables 1410. The first micro-coaxial cables 1410 may include a center conductor 1428 and an outer shield 1426. The outer shield 1426 may be electrically connected to the bottom conductive layer 1420. The center conductor 1428 may be the same or similar to the center conductor 410, and the outer shield 1426 may be the same or similar to the outer shield 414 (both in FIG. 14). Figure 4A and Figure 4B ). The outer shield 1426 of the first micro-coaxial cable 1410 may be attached to and electrically connected to the bottom conductive layer 1420. The hybrid flexible member 1400 may be encapsulated in an insulating layer 1450. The insulating layer 1450 may be formed of polyimide or other insulating materials.

[0078] The hybrid flexible member 1400 may also include a variable capacitor 1460. The variable capacitor 1460 may be connected between the power conductor 1422 and the ground conductor 1424. During manufacturing, the insulating layer 1450 may be applied until the middle layer of the hybrid flexible member 1400 is reached. At this point, the power conductor 1422 and the ground conductor 1424 may also be configured on the insulating layer 1450. The variable capacitor 1460 may be formed on the middle layer of the insulating layer 1450 using planar manufacturing techniques. After the variable capacitor 1460 is formed, the remainder of the insulating layer 1450 may be applied. Optional conductive layers and cover layers may also be added.

[0079] Fig.16A and Fig. 16B The thin film multiferroic structure according to an embodiment of the present invention is illustrated. The variable capacitor 1460 may include a contact 1610 and a contact 1612. The contact 1610 may be connected to the ground conductor 1424 (eg, Fig.14 ), and contact 1612 can be connected to a filtered voltage 1650 on power conductor 1422 (as shown). Fig.14 1460). A DC control voltage 1660 can be applied to a thin film 1630 at a contact 1620, and the thin film 1630 can be located on a substrate 1640. The DC voltage can be varied to adjust the value of the variable capacitor 1460. The thin film 1630 can be made of bismuth iron oxide or multiferroic Ga x Fe 2-x O3. The film 1630 may be made of CoFe2O4 (CFO) or LSMO / 0.68Pb (Mg 1 / 3 Nb 2 / 3 )O3-0.32PbTiO3 (PMN-PT). Film 1630 can exhibit ferroelectric as well as ferromagnetic properties and can help filter medium and high frequency noise. Film 1630, substrate 1640, and contacts 1610, 1612, and 1620 can be formed using planar manufacturing techniques. Variable capacitor 1460 and other thin film structures can be used to form filter circuits such as Pi filters, voltage tunable Pi filters, and other power line noise and other filters.

[0080] Fig.17A and Fig. 17B A thin film multiferromagnetic structure according to an embodiment of the present invention is illustrated. Ferrite 1700 may include contact 1710 and contact 1720. Contact 1710 may be connected to a voltage to be filtered 1750, and contact 1720 may provide a filtered voltage 1760. Contacts 1710 and 1720 may be located on a thin film 1730, which may be located on a substrate 1740. Thin film 1730 may be made of bismuth iron oxide or multiferroic Ga x Fe 2-x O3. The film 1730 may be made of CoFe2O4 (CFO) or LSMO / 0.68Pb (Mg 1 / 3 Nb 2 / 3 )O3-0.32PbTiO3 (PMN-PT). Film 1730 can exhibit ferroelectric as well as ferromagnetic properties and can help filter mid-frequency noise. Film 1730, substrate 1740, and contacts 1710 and 1720 can be formed using planar manufacturing techniques. Ferrite 1700 can be used as a choke. Ferrite 1700 and other thin film structures can be used to form filter circuits such as Pi filters, voltage tunable Pi filters, and other power line noise and other filters.

[0081] These and other embodiments of the present invention can provide a low-profile hybrid flexible connector. The connector may include a hybrid flexible member having a conductor that terminates in a solder connection to a pad on the top of the first board. A polyimide mold (or ferrite loaded mold / EMI absorber) may be placed on the solder terminals and pads on the first board. That is, the solder terminals (or solder-micro coaxial-board interface) may be coated with polyimide or nano powder spinel ferrite loaded acrylic or other suitable molded absorbent films as EMI absorbers. The first board may have a through connection to the pads on the bottom of the first board. The pads on the bottom of the board may be connected to the pads on the second board. The second board may be a main logic board or other board. The pads on the bottom of the first board may be connected to the pads on the second board using anisotropic conductive film. The first board and the second board may be connected to each other using interlocking screws or other fasteners. Examples are shown in the following figures.

[0082] Fig.18 A low profile hybrid flexible connector according to an embodiment of the present invention is illustrated. The hybrid flexible connector 1800 may include a plurality of micro coaxial cables, power and ground conductors, and other conductors, generally shown here as conductors 1830. The conductors 1830 may be soldered to pads 1812. The hybrid flexible connector 1800 may include pads (not shown) on the bottom side. These bottom side pads may be attached to pads 1822 on the surface of the board 1820 using an anisotropic conductive film 1824. The hybrid flexible connector 1800 may be attached to the board 1820 using fasteners 1840. The fasteners 1840 may be interlocking screws or other fasteners.

[0083] Embodiments of the present invention may provide hybrid flexible members that may be located in various types of devices, such as tablet computers, laptop computers, desktop computers, all-in-one computers, cellular phones, storage devices, wearable computing devices, portable computing devices, portable media players, navigation systems, monitors, audio devices, remote controls, adapters, and other devices.

[0084] While embodiments of the present invention are well suited for use in connector receptacles, these and other embodiments of the present invention may also be used in connector inserts and other types of connectors.

[0085] It is understood that the use of personally identifiable information should be subject to privacy policies and practices that are generally recognized to meet or exceed industry or government requirements for maintaining user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of the authorized use should be clearly stated to users.

[0086] For the purpose of illustration and description, the above description of the embodiment of the present invention is presented. It is not intended to be exhaustive, nor is it intended to limit the present invention to the precise form, and many modifications and variations are possible according to the above teachings. This embodiment is selected and described to fully illustrate the principle of the present invention and its practical application, so that other technical personnel in the field can make full use of the present invention in various embodiments and in the case of various modifications suitable for the specific purpose envisioned. Therefore, it should be understood that the present invention is intended to cover all modifications and equivalents within the scope of the following claims.

Claims

1. A hybrid flexible cable comprising: a first conductive material layer; the first multiple micro-coaxial cables; a first plurality of power and ground conductors; a second plurality of micro-coaxial cables, wherein the first plurality of micro-coaxial cables, the first plurality of power and ground conductors, and the second plurality of micro-coaxial cables are arranged in a plane on or near the first layer of conductive material; and An insulating layer is formed on the first conductive material layer and surrounds the first plurality of micro-coaxial cables, the first plurality of power and ground conductors, and the second plurality of micro-coaxial cables.

2. The hybrid flexible cable of claim 1, wherein the first conductive material layer comprises copper.

3. The hybrid flexible cable of claim 1, wherein the first conductive material layer comprises a copper alloy.

4. The hybrid flexible cable of claim 2, wherein the insulating layer comprises polyimide.

5. The hybrid flexible cable of claim 2, wherein the first plurality of power and ground conductors includes two conductors for ground and one conductor for power, wherein the one conductor for power is insulated from the first layer of conductive material.

6. The hybrid flexible cable of claim 5, wherein the first plurality of power and ground conductors are formed from twisted wires.

7. The hybrid flexible cable of claim 6, wherein the hybrid flexible cable comprises four first plurality of micro-coaxial cables and two second plurality of micro-coaxial cables.

8. The hybrid flexible cable of claim 2, wherein the first plurality of power and ground conductors are located in a plane with the first plurality of micro-coaxial cables and the second plurality of micro-coaxial cables and are located between the first plurality of micro-coaxial cables and the second plurality of micro-coaxial cables.

9. The hybrid flexible cable of claim 2, wherein the first plurality of micro-coaxial cables comprises a first micro-coaxial cable comprising a center conductor, an insulation layer, and an outer shield.

10. The hybrid flex cable of claim 9, wherein the first micro-coaxial cable is attached to the board by soldering a first side of the outer shield to a ground pad on the board and soldering a second side of the outer shield to the ground pad using jet soldering.

11. The hybrid flex cable of claim 9, wherein the first micro-coaxial cable is attached to the board by soldering the center conductor to a signal pad on the board using jet soldering.

12. The hybrid flexible cable of claim 2, further comprising a second layer of conductive material on the insulating layer.

13. The hybrid flexible cable of claim 12, wherein the first layer of conductive material electrically and physically contacts an outer shield on each of the first plurality of micro-coaxial cables and each of the second plurality of micro-coaxial cables.

14. The hybrid flexible cable of claim 13, wherein the second layer of conductive material electrically and physically contacts an outer shield on each of the first plurality of micro-coaxial cables and each of the second plurality of micro-coaxial cables.

15. A hybrid flexible cable comprising: a first conductive material layer; a first plurality of micro-coaxial cables, wherein the first plurality of micro-coaxial cables are arranged in a plane on or near the first layer of conductive material; a first power supply conductor; a first grounding conductor; a first multiferroic thin film structure, the first multiferroic thin film structure being connected to the first power conductor and the first ground conductor; and An insulating layer is formed on the first conductive material layer and surrounds the first plurality of micro-coaxial cables, the first power conductor, the first ground conductor and the first multiferroic film structure.

16. The hybrid flexible cable of claim 15, wherein the first multiferroic thin film structure is a tunable capacitor.

17. The hybrid flexible cable of claim 15, wherein the first multiferroic thin film structure is ferrite.

18. The hybrid flexible cable according to claim 15, further comprising: a second power supply conductor; a second grounding conductor; and A second multiferroic film structure is provided, wherein the second multiferroic film structure is connected to the second power conductor and the second ground conductor.

19. The hybrid flexible cable of claim 18, wherein the second multiferroic thin film structure is a tunable capacitor.

20. The hybrid flexible cable of claim 18, wherein the first multiferroic thin film structure is a ferrite.

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