Display panel, method for manufacturing display panel, and packaging device for display panel

Abstract

The present application discloses a display panel, a method for preparing a display panel, and a packaging device for the display panel. The display panel includes: an array substrate; a light-emitting layer, which is arranged on one side of the array substrate in the thickness direction; an encapsulation layer, which is located on one side of the array substrate in the thickness direction and covers the light-emitting layer, and the encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer which are stacked, and the thickness of the organic encapsulation layer is d1, wherein d1 is less than 6 microns. The display panel, the method for preparing a display panel, and the packaging device for the display panel disclosed in the present application can reduce the thickness of the display panel without affecting the structural strength of the display panel, which is conducive to the lightweight design of the display panel.

Description

Technical Field

[0001] The present application relates to the technical field of display panel manufacturing, and in particular to a display panel, a method for preparing a display panel, and a packaging device for a display panel. Background Art

[0002] Organic light-emitting diode (OLED) display panels have the advantages of high response, high contrast, and flexibility, and are considered to be a type of display panel with broad application prospects. When making an organic light-emitting diode display panel, thin film encapsulation (TFE) technology is used to make the encapsulation layer, and the display panel is encapsulated through the encapsulation layer. The organic encapsulation layer in the encapsulation layer is made by inkjet printing (IJP). After thinning the organic encapsulation layer, the fluidity of the material during the inkjet printing process will deteriorate, affecting the flatness of the organic encapsulation layer, and thus affecting the display effect of the display panel. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a packaging device for a display panel, which can reduce the thickness of the display panel without affecting the structural strength of the display panel.

[0004] In a first aspect, an embodiment of the present application provides a display panel, comprising: an array substrate; a light-emitting layer, arranged on one side of the array substrate in a thickness direction; an encapsulation layer, located on one side of the array substrate in the thickness direction and covering the light-emitting layer, the encapsulation layer comprising an organic encapsulation layer and an inorganic encapsulation layer stacked, the thickness value of the organic encapsulation layer is d1, wherein d1 is less than 6 microns.

[0005] In a second aspect, an embodiment of the present application provides a method for preparing a display panel, comprising: providing a display panel to be packaged, the display panel to be packaged comprising an array substrate and a light-emitting layer arranged on the array substrate; forming ink droplets of a packaging material on the surface to be packaged of the display panel to be packaged; jetting the ink droplets to make the ink droplets flow on the surface to be packaged to form a packaging material layer covering the light-emitting layer; curing the packaging material layer to obtain an organic packaging layer, the thickness value of the organic packaging layer is d1, wherein d1 is less than 6 microns.

[0006] In a third aspect, an embodiment of the present application provides a packaging device for a display panel, which is used for the display panel of the embodiment of the first aspect of the present application, including: an inkjet printing component, used to form ink droplets of packaging material on the surface to be packaged of the display panel to be packaged; an air jet component, arranged downstream of the inkjet printing component, used to jet the ink droplets so that the ink droplets flow on the surface to be packaged to form a packaging material layer covering the light-emitting layer; a curing component, used to cure the packaging material layer to obtain an organic packaging layer, the thickness value of the organic packaging layer is d1, wherein d1 is less than 6 microns.

[0007] The display panel, the method for preparing the display panel, and the packaging equipment for the display panel provided in the embodiments of the present application, when making the organic packaging layer of the packaging layer, the liquid packaging material ink droplets are blown by the jet so that the ink droplets can flow on the surface to be packaged to form a flat organic packaging layer. The ink droplets are blown by the airflow so that the ink droplets can flow evenly to various positions of the surface to be packaged, and the thickness of each position of the formed organic packaging layer is the same, which can release stress and improve the structural strength of the display panel. When forming the ink droplets of the packaging material, the amount of packaging material can be reduced, and the thickness of the formed organic packaging layer is less than 6 microns, which reduces the thickness of the organic packaging layer, and then reduces the thickness of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 A schematic diagram of the structure of a display panel according to an embodiment of the present application.

[0010] Figure 2 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0011] Figure 3 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0012] Figure 4 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0013] Figure 5 A flow chart of a method for preparing a display panel according to an embodiment of the present application.

[0014] Figure 6 A flow chart of step S3 of the method for preparing a display panel according to an embodiment of the present application.

[0015] Figure 7 A structural schematic diagram of step S3 of the method for preparing a display panel according to an embodiment of the present application.

[0016] Figure 8 A flow chart of step S3.3 of the method for preparing a display panel according to an embodiment of the present application.

[0017] Fig. 9 A schematic diagram of a principle of a packaging device for a display panel according to an embodiment of the present application.

[0018] Fig.10A schematic diagram of the principle of the jetting component of the display panel packaging device according to an embodiment of the present application.

[0019] Fig.11 A schematic structural diagram of a nozzle of a jetting assembly of a display panel packaging device according to an embodiment of the present application.

[0020] Fig.12 A schematic diagram of the structure of an injection component of a display panel packaging device according to an embodiment of the present application.

[0021] Fig.13 A schematic structural diagram of a nozzle and a detector of a jetting assembly of a display panel packaging device according to an embodiment of the present application.

[0022] Fig.14 A schematic diagram of the principles of the jet assembly, controller, detector and heater of the display panel packaging device of the embodiment of the present application.

[0023] Reference numerals:

[0024] 1. array substrate; 11. substrate; 12. array layer; 121. thin film transistor;

[0025] 2. light-emitting layer; 21. light-emitting device; 22. pixel definition layer; 221. pixel definition opening;

[0026] 3. Encapsulation layer; 31. Inorganic encapsulation layer; 32. Organic encapsulation layer;

[0027] 100. Inkjet printing assembly;

[0028] 200, jet assembly; 201, gas generator; 201a, gas source; 201b, air pump; 202, nozzle; 202a, micro nozzle array; 203, frame; 204, position adjustment member;

[0029] 300, curing components;

[0030] 400, controller;

[0031] 500, detector;

[0032] 600. Heating element. DETAILED DESCRIPTION

[0033] The features and exemplary embodiments of various aspects of the application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the application. However, it is obvious to those skilled in the art that the application can be implemented when some details in these specific details are not needed. The following description of the embodiments is only to provide a better understanding of the application by illustrating the example of the application.

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0035] Relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article, or device. In the absence of further restrictions, the elements defined by the statement "comprising ..." do not exclude the presence of additional identical elements in the process, method, article, or device that includes the elements.

[0036] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0037] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0038] It should be understood that in the embodiment of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0039] The applicant discovered that in the process of making a display panel, the organic encapsulation material will be formed on the surface to be encapsulated in the form of ink droplets. The liquid ink droplets themselves have fluidity and will flow to various positions on the surface to be encapsulated, and form an organic encapsulation layer after solidification. In order to reduce the thickness of the display panel, it is necessary to reduce the thickness of the organic encapsulation layer. Therefore, when making the organic encapsulation layer, it is necessary to reduce the amount of organic encapsulation layer material. At this time, the ink droplets are smaller, and under the influence of the surface tension of the ink droplets, smaller ink droplets are more difficult to flow, so it is difficult for the ink droplets to flow evenly to various positions on the surface to be encapsulated. Therefore, the organic encapsulation layer formed after solidification is uneven and has a low flatness, which can easily cause stress concentration in the display panel and affect the structural strength of the display panel.

[0040] In view of the above analysis, the applicant proposed a display panel, including: an array substrate, a light-emitting layer and an encapsulation layer. When making the organic encapsulation layer of the encapsulation layer, the liquid encapsulation material ink droplets are blown by a jet so that the ink droplets can flow on the surface to be encapsulated to form a flat organic encapsulation layer. The ink droplets are blown by the airflow so that the ink droplets can flow evenly to various positions of the surface to be encapsulated, and the thickness of the organic encapsulation layer formed at various positions is the same, which can release stress and improve the structural strength of the display panel. When forming the ink droplets of the encapsulation material, the amount of encapsulation material can be reduced, and the thickness of the formed organic encapsulation layer is less than 6 microns, which reduces the thickness of the organic encapsulation layer, and thus reduces the thickness of the display panel.

[0041] Figure 1 A schematic diagram of the structure of a display panel according to an embodiment of the present application. Figure 2 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0042] See also Figure 1 and Figure 2 The embodiment of the present application provides a display panel, comprising: an array substrate 1, a light-emitting layer 2 and an encapsulation layer 3. The light-emitting layer 2 is arranged on one side of the array substrate 1 in the thickness direction; the encapsulation layer 3 is located on one side of the array substrate 1 in the thickness direction and covers the light-emitting layer 2, and the encapsulation layer 3 comprises an organic encapsulation layer 32 and an inorganic encapsulation layer 31 which are stacked, and the thickness value of the organic encapsulation layer 32 is d1, wherein d1 is less than 6 microns.

[0043] The display panel of the embodiment of the present application may be an organic light emitting diode (OLED) display panel, a micro light emitting diode (Micro-LED) display panel, or a liquid crystal (LCD) display panel. For ease of description, the embodiment of the present application takes the organic light emitting diode display panel as an example for description.

[0044] The array substrate 1 includes a substrate 11 and an array layer 12. The substrate 11 may be formed of a polymer material such as glass, polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP). The substrate 11 may be transparent, translucent or opaque. The array layer 12 includes a plurality of thin film transistors 121 (TFT) and a pixel circuit composed of the thin film transistors 121, and the pixel circuit is used to control the light emission of the light emitting device 21 of the light emitting layer 2. Exemplarily, the thin film transistor 121 may be in the form of a top gate thin film transistor 121. The light emitting device 21 of the light emitting layer 2 may be an organic light emitting diode (OLED). The light emitting layer 2 also includes a pixel definition layer 22, the pixel definition layer 22 is provided with a plurality of pixel definition openings 221, and the light emitting device 21 is arranged with the pixel definition openings 221. The pixel definition layer 22 may be formed of an organic material such as polyimide (PI), polyamide, benzocyclobutene (BCB), acrylic resin, or phenolic resin, or a polyimide such as SiN x formed by inorganic materials.

[0045] The encapsulation layer 3 is located on one side of the array substrate 1 in the thickness direction and covers the light-emitting layer 2. The encapsulation layer 3 is used to encapsulate the light-emitting layer 2 and prevent water vapor from entering the light-emitting layer 2, thereby protecting the light-emitting device 21. The encapsulation layer 3 is in the form of a multi-layer stack, including an organic encapsulation layer 32 and an inorganic encapsulation layer 31. The thickness d1 of the organic encapsulation layer 32 is less than 6 μm, which can significantly reduce the thickness of the organic encapsulation layer 32, thereby reducing the thickness of the display panel, and facilitating the thin and light design of the display panel. In addition, the organic encapsulation layer 32 can also have good flatness and fully release stress, so that the display panel of the embodiment of the present application can have good structural strength.

[0046] For further information, see Figure 1 and Figure 2, the ratio of the thickness value d1 of the organic encapsulation layer 32 to the thickness value d2 of the inorganic encapsulation layer 31 is less than or equal to 6. Considering that the inorganic encapsulation layer 31 is usually made by vapor deposition, and the organic encapsulation layer 32 is usually made by inkjet printing, the thickness of the organic encapsulation layer 32 is usually significantly greater than the thickness of the inorganic encapsulation layer 31. In the embodiment of the present application, the thickness of the organic encapsulation layer 32 is greatly reduced, and the inorganic encapsulation layer 31 retains its original thickness. Therefore, the ratio of the thickness value d1 of the organic encapsulation layer 32 to the thickness value d2 of the inorganic encapsulation layer 31 is greatly reduced, that is, the ratio of the thickness value d1 of the organic encapsulation layer 32 to the thickness value d2 of the inorganic encapsulation layer 31 is less than or equal to 6. Under the premise that the thickness of the inorganic encapsulation layer 31 is determined, the display panel of the embodiment of the present application can significantly reduce the thickness of the organic encapsulation layer 32, thereby reducing the total thickness of the display panel of the embodiment of the present application, which is convenient for the light and thin design of the display panel.

[0047] Figure 3 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0048] For further information, see Figure 3 The number of inorganic encapsulation layers 31 is more than two, an organic encapsulation layer 32 is arranged between two adjacent inorganic encapsulation layers 31, and the ratio of the thickness value d1 of the organic encapsulation layer 32 to the thickness value d2 of any inorganic encapsulation layer 31 is less than or equal to 6.

[0049] Considering that the encapsulation layer 3 is in the form of a multi-layer stack, the number of inorganic encapsulation layers 31 can be greater than the number of organic encapsulation layers 32, and an organic encapsulation layer 32 is arranged between two adjacent inorganic encapsulation layers 31, so that in the encapsulation layer 3, the organic encapsulation layer 32 and the inorganic encapsulation layer 31 are alternately stacked. Each inorganic encapsulation layer 31 can be made by vapor deposition, and each organic encapsulation layer 32 can be made by inkjet printing. The ratio of the thickness value d1 of the organic encapsulation layer 32 to the thickness value d2 of any layer of the inorganic encapsulation layer 31 is less than or equal to 6. Under the premise that the thickness of the inorganic encapsulation layer 31 is determined, the thickness of the organic encapsulation layer 32 can be reduced, thereby reducing the total thickness of the display panel of the embodiment of the present application, which is convenient for the light and thin design of the display panel. Exemplarily, the encapsulation layer 3 can adopt a three-layer structure, and an organic encapsulation layer 32 is arranged between two inorganic encapsulation layers 31.

[0050] Figure 4 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0051] For further information, see Figure 4, the maximum value of the total thickness of the encapsulation layer 3 is D, where d1 / D≤0.75. In the embodiment of the present application, when the encapsulation layer 3 can adopt a three-layer structure, the thicknesses of the two inorganic encapsulation layers 31 can be equal. Since the ratio of the thickness d1 of the organic encapsulation layer 32 to the total thickness D of the encapsulation layer 3 is less than or equal to 0.75, the ratio of the thickness of the two inorganic encapsulation layers 31 to the thickness d1 of the organic encapsulation layer 32 is less than or equal to 1 / 3, that is, the ratio of the thickness of a single inorganic encapsulation layer 31 to the thickness d1 of the organic encapsulation layer 32 is less than or equal to 1 / 6. Under the premise that the thickness of the inorganic encapsulation layer 31 is determined, the display panel of the embodiment of the present application can significantly reduce the thickness of the organic encapsulation layer 32, thereby reducing the total thickness of the display panel of the embodiment of the present application, which is convenient for the lightweight design of the display panel.

[0052] Figure 5 A flow chart of a method for preparing a display panel according to an embodiment of the present application.

[0053] See also Figure 5 The present application also provides a method for preparing a display panel. Exemplarily, the method for preparing a display panel in the present application can be used to prepare the display panel in the foregoing embodiment of the present application.

[0054] Specifically, the method for preparing the display panel of the embodiment of the present application includes:

[0055] Step S1: providing a display panel to be packaged.

[0056] The display panel to be packaged includes an array substrate 1 and a light emitting layer 2 disposed on the array substrate 1. It is understandable that the display panel to be packaged can be prepared or the display panel to be packaged can be directly obtained.

[0057] Step S2: forming ink droplets of packaging material.

[0058] The material of the organic encapsulation layer 32 can be formed on the to-be-encapsulated surface of the to-be-encapsulated display panel in the form of inkjet, and at this time, the encapsulation material is in the state of ink droplets.

[0059] Step S3: jetting the ink droplets to form a packaging material layer.

[0060] In the embodiment of the present application, the amount of packaging material is reduced, so the fluidity of the ink droplets formed by the packaging material becomes poor, and it is difficult to evenly cover all positions of the surface to be packaged. By jetting, the ink droplets are blown so that the ink droplets flow on the surface to be packaged, and can evenly cover all positions with the packaging layer 3, that is, to form a packaging material layer covering the light-emitting layer 2. It can be understood that at this time, the packaging material layer has not been solidified and still has a certain fluidity. After jetting, the surface of the packaging material layer is basically flat.

[0061] Step S4 , curing the encapsulation material layer to form an organic encapsulation layer 32 .

[0062] The encapsulation material layer is cured so that the encapsulation material solidifies to form an organic encapsulation layer 32 with a certain structural strength. At this time, the surface of the organic encapsulation layer 32 facing away from the light-emitting layer 2 is flat. When other film layers such as the inorganic encapsulation layer 31 are subsequently made, the stress concentration phenomenon generated on the surface of the organic encapsulation layer 32 can be alleviated, so that the prepared display panel can have good structural strength. In addition, the thickness value d1 of the organic encapsulation layer 32 is less than 6 microns. Under the premise that the thickness of the inorganic encapsulation layer 31 is determined, the thickness of the organic encapsulation layer 32 can be reduced, thereby reducing the total thickness of the display panel of the embodiment of the present application, which is convenient for the light and thin design of the display panel.

[0063] Figure 6 A flow chart of step S3 of the method for preparing a display panel according to an embodiment of the present application.

[0064] For further information, see Figure 6 In step S3, the preparation method further comprises:

[0065] Step S3.1, obtaining the image to be inspected of the surface to be packaged.

[0066] The surface to be packaged with ink droplets is imaged to obtain an image to be detected, which includes position information of each light emitting device 21 in the light emitting layer 2 and actual height information corresponding to the position information.

[0067] Step S3.2: Compare the image to be detected with the preset image.

[0068] The preset image includes the position information of each light emitting device 21 in the light emitting layer 2 and the standard height threshold corresponding to the position information. When comparing the image to be detected with the preset image, it is necessary to compare the actual height information corresponding to each position on the surface to be packaged and the standard height threshold.

[0069] Step S3.3: If the actual height information is outside the standard height threshold range, it means that the corresponding packaging material at that position is too thick. The ink droplets on the light-emitting device 21 at that position are sprayed to make the packaging material at that position flow around so that the actual height information of each position is equal to the standard height threshold, that is, the surface of the packaging material layer facing away from the light-emitting layer 2 is basically flat.

[0070] Figure 7 A structural schematic diagram of step S3 of the method for preparing a display panel according to an embodiment of the present application. Figure 8 A flow chart of step S3.3 of the method for preparing a display panel according to an embodiment of the present application.

[0071] For further information, see Figure 7 and Figure 8 The gas for the jet operation is generated by the nozzle 202, which includes a plurality of switches and a multi-row and multi-column micro-nozzle array 202a, and the plurality of switches correspond to and control a row or a column in the multi-row and multi-column micro-nozzle array 202a. The plurality of nozzle arrays are arranged so that the jet force of the nozzle 202 is uniform, and the risk of excessive jetting at a local position causing the surface of the packaging material layer to be concave on the side away from the light-emitting layer 2 is reduced. The plurality of switches correspond to and control a row or a column in the multi-row and multi-column micro-nozzle array 202a, and whether the switch is turned on can be controlled according to the actual thickness of the packaging material layer in the corresponding range of the nozzle 202, so that the surface of the packaging material layer on the side away from the light-emitting layer 2 is smoother.

[0072] Step S3.3 also includes:

[0073] Step S3.3.1, determining the coordinate information of the light emitting device 21 to be sprayed;

[0074] Step S3.3.2: Based on the coordinate information, turn on the switch corresponding to the coordinate information, and the switch controls the nozzles in the micro nozzle array 202a to eject ink droplets.

[0075] Furthermore, the gas injection rate of the jet operation is 0 liters / minute to 100 liters / minute, and the gas injection rate is positively correlated with the force causing the packaging material to flow. When the actual height of the packaging material layer at a certain location is too large, the gas injection rate can be appropriately increased to allow the packaging material at that location to flow more smoothly to the surrounding area.

[0076] Furthermore, the gas temperature of the jet operation is 20°C to 50°C. By adding gas, the temperature of the packaging material at the jet location is increased, thereby increasing the fluidity of the packaging material at this location, allowing the packaging material at this location to flow more smoothly to the surrounding area.

[0077] Furthermore, the gas used in the jetting operation includes an inert gas, which can reduce the impact on the light-emitting layer 2 and the packaging material layer.

[0078] Fig. 9 A schematic diagram of a principle of a packaging device for a display panel according to an embodiment of the present application.

[0079] See also Fig. 9 The embodiment of the present application also provides a display panel packaging device for preparing the display panel of the aforementioned embodiment of the present application.

[0080] The packaging device of the display panel of the embodiment of the present application includes: an inkjet printing component 100, an air jet component 200 and a curing component 300. The inkjet printing component 100 is used to form ink droplets of packaging material on the surface to be packaged of the display panel to be packaged; the air jet component 200 is arranged downstream of the inkjet printing component 100, and is used to jet the ink droplets so that the ink droplets flow on the surface to be packaged to form a packaging material layer covering the light-emitting layer 2; the curing component 300 is used to cure the packaging material layer to obtain an organic packaging layer 32, and the thickness value of the organic packaging layer 32 is d1, wherein d1 is less than 6 microns.

[0081] After obtaining the display panel to be packaged, the inkjet printing component 100 can form the packaging material of the organic packaging layer 32 on the surface to be packaged of the display panel to be packaged, and the packaging material is in the form of ink droplets. The jet component 200 is arranged downstream of the inkjet printing component 100, and jets the packaging material ink droplets formed on the surface to be packaged, so that the ink droplets flow on the surface to be packaged to form a packaging material layer covering the light-emitting layer 2. After the jet treatment of the jet component 200, the side of the packaging material layer away from the light-emitting layer 2 has good flatness. The curing component 300 is arranged downstream of the jet component 200, and can cure the packaging material layer with good flatness to form an organic packaging layer 32 with good flatness. The thickness d1 of the organic packaging layer 32 formed by curing is less than 6 microns. Under the premise that the thickness of the inorganic packaging layer 31 is determined, the display panel of the embodiment of the present application can significantly reduce the thickness of the organic packaging layer 32, thereby reducing the total thickness of the display panel of the embodiment of the present application, which is convenient for the light and thin design of the display panel. It is understandable that the display panel can be moved between the inkjet printing assembly 100, the jetting assembly 200 and the curing assembly 300 by means of a conveyor belt or the like.

[0082] Fig.10 A schematic diagram of the principle of the jetting component of the display panel packaging device according to an embodiment of the present application.

[0083] For further information, see Fig.10 The jetting assembly 200 includes: a gas generator 201; and a nozzle 202, which is connected to the gas generator 201 and is used to spray the gas generated by the gas generator 201 onto the ink droplets.

[0084] The gas generator 201 is used to provide an airflow, and illustratively, may include an inert gas source 201a and an air pump 201b. The nozzle 202 is connected to the gas generator 201, and the inert gas pumped by the air pump 201b is ejected from the nozzle 202. The ejected airflow can sweep the ink droplets of the packaging material located on the surface to be packaged, so that the ink droplets flow on the surface to be packaged, forming a packaging material layer covering the light-emitting layer 2, and making the surface of the packaging material layer on the side away from the light-emitting layer 2 have good flatness.

[0085] Fig.11 A schematic structural diagram of a nozzle of a jetting assembly of a display panel packaging device according to an embodiment of the present application.

[0086] For further information, see Fig.11 The nozzle 202 includes a plurality of switches and a multi-row and multi-column micro-nozzle array 202a. The micro-nozzle array 202a is located on the surface of the nozzle 202 facing the surface to be packaged. The plurality of switches correspond to one another to control one row or one column of the multi-row and multi-column micro-nozzle array 202a. The plurality of nozzle arrays are arranged so that the jet force of the nozzle 202 is uniform, and the risk of excessive jetting at a local position causing the surface of the packaging material layer to be concave on the side away from the light-emitting layer 2 is reduced. The plurality of switches correspond to one another to control one row or one column of the multi-row and multi-column micro-nozzle array 202a. Whether the switch is turned on can be controlled according to the actual thickness of the packaging material layer in the corresponding range of the nozzle 202, so that the surface of the packaging material layer on the side away from the light-emitting layer 2 is smoother.

[0087] Fig.12 A schematic diagram of the structure of an injection component of a display panel packaging device according to an embodiment of the present application.

[0088] For further information, see Fig.12 The jet assembly 200 further includes a frame 203 and a position adjusting member 204 . The position adjusting member 204 is connected to the frame 203 and the nozzle 202 . The position adjusting member 204 drives the nozzle 202 to move relative to the frame 203 .

[0089] The frame 203 is used to provide support for other components of the jet assembly 200, and can be close to or away from the display panel to be packaged. The position adjustment member 204 is movably connected to the frame 203, so that the nozzle 202 connected to the position adjustment member 204 can move relative to the frame 203, and the moving direction is parallel to the plane where the display panel to be packaged is located, so that the nozzle 202 can be aligned with various positions of the display panel to be packaged. Exemplarily, the bracket is in a square frame shape, and the position adjustment component is slidably connected to a set of opposite sides of the bracket. The position adjustment component also has a slide rail slider, and the slider is connected to the nozzle 202.

[0090] Fig.13 A schematic structural diagram of a nozzle and a detector of a jetting assembly of a display panel packaging device according to an embodiment of the present application. Fig.14 A schematic diagram of the principles of the jet assembly, controller, detector and heater of the display panel packaging device of the embodiment of the present application.

[0091] For further information, see Fig.13 and Fig.14The packaging device of the display panel of the embodiment of the present application also includes a detector 500 and a controller 400. The detector 500 is configured to detect the image to be detected on the surface to be packaged where ink droplets are formed, and the controller 400 is configured to control the switch of the nozzle 202 corresponding to the coordinate information according to the coordinate information of the light-emitting device 21 to be sprayed.

[0092] The detector 500 can obtain the image to be detected of the surface to be packaged with ink droplets formed thereon, and by comparing the image to be detected with the preset image, it can determine the position on the image to be detected and the preset image where the jet needs to be ejected, that is, the coordinate information of the light emitting device 21 to be ejected. The controller 400 can control the nozzle 202 corresponding to the position to open according to the coordinate information of the light emitting device 21 to eject the jet, and eject the ink droplets at the position.

[0093] Further, this paper continues to refer to Fig.14 The packaging device of the display panel of the embodiment of the application further includes a heating element 600, which is located in the nozzle 202 and is used to heat the gas generated by the gas generator 201. By heating the gas, the temperature of the packaging material at the jet location is increased, thereby increasing the fluidity of the packaging material at this location, so that the packaging material at this location flows more smoothly to the surrounding area.

[0094] In summary, the embodiments of the present application provide a display panel, a method for preparing a display panel, and a packaging device for a display panel. When making an organic packaging layer of the packaging layer, a jet is used to blow liquid ink droplets of packaging material so that the ink droplets can flow on the surface to be packaged to form a flat organic packaging layer. The ink droplets are blown by air flow so that the ink droplets can flow evenly to various positions of the surface to be packaged, and the thickness of the organic packaging layer formed at various positions is the same, which can release stress and improve the structural strength of the display panel. When forming ink droplets of packaging material, the amount of packaging material used can be reduced, and the thickness of the formed organic packaging layer is less than 6 microns, which reduces the thickness of the organic packaging layer, thereby reducing the thickness of the display panel.

[0095] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: include: An array substrate; A light emitting layer is arranged on one side of the array substrate in a thickness direction; The encapsulation layer is located on one side of the array substrate in the thickness direction and covers the light-emitting layer. The encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer stacked together. The thickness of the organic encapsulation layer is d1, wherein d1 is less than 6 microns.

2. The display panel according to claim 1, characterized in that: A ratio of a thickness of the organic encapsulation layer to a thickness of the inorganic encapsulation layer is less than or equal to 6.

3. The display panel according to claim 2, characterized in that: The number of layers of the inorganic encapsulation layer is more than two, the organic encapsulation layer is arranged between two adjacent inorganic encapsulation layers, and the ratio of the thickness of the organic encapsulation layer to the thickness of any one of the inorganic encapsulation layers is less than or equal to 6.

4. The display panel according to claim 1, characterized in that: The maximum value of the total thickness of the encapsulation layer is D, wherein d1 / D≤0.

75.

5. A method for preparing a display panel, characterized in that: include: Providing a display panel to be packaged, the display panel to be packaged comprising an array substrate and a light-emitting layer arranged on the array substrate; forming ink droplets of packaging material on the to-be-packaged surface of the to-be-packaged display panel; Jetting the ink droplets to make them flow on the surface to be packaged to form a packaging material layer covering the light-emitting layer; The encapsulation material layer is cured to obtain an organic encapsulation layer, wherein the thickness of the organic encapsulation layer is d1, wherein d1 is less than 6 micrometers.

6. The preparation method according to claim 5, characterized in that: Before the step of jetting the ink droplets to make the ink droplets flow on the surface to be packaged to form a packaging material layer covering the light-emitting layer, the preparation method further includes: Acquire an image to be detected of the surface to be encapsulated forming the ink droplets, wherein the image to be detected includes position information of each light-emitting device in the light-emitting layer and actual height information corresponding to the position information; Comparing the image to be detected with a preset image, wherein the preset image includes position information of each light-emitting device in the light-emitting layer and a standard height threshold corresponding to the position information; If the actual height information is outside the standard height threshold range, the ink droplet on the light emitting device at the position corresponding to the actual height information is ejected.

7. The preparation method according to claim 6, characterized in that: The gas for the jet operation is generated by a nozzle, and the nozzle includes a plurality of switches and a multi-row and multi-column micro-nozzle array, and the plurality of switches control one row or one column of the multi-row and multi-column micro-nozzle array in a one-to-one correspondence; the jetting of the ink droplets on the light-emitting device at the position corresponding to the actual height information includes: Determining coordinate information of the light emitting device to be sprayed; Based on the coordinate information, the switch corresponding to the coordinate information is turned on, and the switch controls the nozzles in the micro nozzle array to eject the ink droplets.

8. The preparation method according to claim 5, characterized in that: The gas injection rate of the gas injection operation is 0 liters / minute to 100 liters / minute.

9. The preparation method according to claim 5, characterized in that: The gas temperature of the jetting operation is 20°C to 50°C.

10. The preparation method according to any one of claims 5 to 9, characterized in that: The gas for the jetting operation includes an inert gas.

11. A display panel packaging device, used for the display panel according to any one of claims 1 to 4, characterized in that: include: An inkjet printing component, used for forming ink droplets of encapsulation material on the to-be-encapsulated surface of the to-be-encapsulated display panel; An air jet assembly, disposed downstream of the inkjet printing assembly, for jetting the ink droplets so that the ink droplets flow on the surface to be encapsulated to form an encapsulation material layer covering the light-emitting layer; The curing component is used to cure the packaging material layer to obtain an organic packaging layer, and the thickness of the organic packaging layer is d1, wherein d1 is less than 6 microns.

12. The packaging device according to claim 11, characterized in that The jet assembly comprises: Gas generator; The nozzle is connected to the gas generator and is used for spraying the gas generated by the gas generator onto the ink droplets.

13. The packaging device according to claim 12, characterized in that The nozzle includes a plurality of switches and a multi-row and multi-column micro-nozzle array, wherein the micro-nozzle array is located on the surface of the nozzle facing the surface to be packaged, and the plurality of switches control one row or one column of the multi-row and multi-column micro-nozzle array in a one-to-one correspondence.

14. The packaging device according to claim 12, characterized in that The jetting assembly further comprises a frame and a position adjusting member, wherein the position adjusting member is connected to the frame and the nozzle, and the position adjusting member drives the nozzle to move relative to the frame.

15. The packaging device according to claim 12, characterized in that It also includes a detector and a controller, wherein the detector is configured to detect an image to be detected on the surface to be packaged that forms the ink droplets, and the controller is configured to control the switch of the nozzle corresponding to the coordinate information according to the coordinate information of the light-emitting device to be ejected.

16. The packaging device according to claim 12, characterized in that It also includes a heating element, which is located in the nozzle and is used to heat the gas generated by the gas generator.

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