PCB substrate dust removal equipment and dust removal process

Abstract

The present invention belongs to the general field of cleaning technology, and in particular relates to PCB substrate dust removal equipment and a dust removal process thereof; the present invention provides a PCB substrate dust removal equipment, comprising: a dust removal device, which is slidably arranged on a workbench, and two dust removal devices are relatively arranged on two sides of a conveyor line; a collecting device, which is lifted and arranged on the workbench, and one collecting device corresponds to one dust removal device; wherein, after the dust removal device approaches the substrate, the dust removal device is suitable for negative pressure suction of dust on the surface of the substrate; after the dust removal is completed, the collecting device moves upward and delivers compressed air into the dust removal device to blow the dust into the collecting device; after the dust discharge is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified; through the arrangement of the dust removal device, the dust on the surface of the substrate can be adsorbed and removed when the internal pressure is negative; when the internal pressure is positive, it is suitable for detecting whether the smoothness of the substrate surface is qualified.

Description

Technical Field

[0001] The present invention belongs to the general field of cleaning technology, and specifically relates to a cleaning method utilizing air flow, and more particularly to a PCB substrate dust removal device and a dust removal process thereof. Background Art

[0002] After the PCB substrate is cut, it needs to be dust-removed to facilitate subsequent processing.

[0003] In the prior art, a negative pressure dust removal device is often used. When its movable plate approaches the substrate to be cleaned, negative pressure suction is applied to remove dust from the substrate's outer surface. However, dust is sucked into the negative pressure dust removal device over time, and some dust remains in the device's piping, making it difficult to clean and shortening the device's service life.

[0004] Moreover, after dust removal, the PCB substrate needs to be tested for surface smoothness. However, the existing test requires the PCB substrate to be transferred to other inspection conveyor lines, which is not only time-consuming and labor-intensive, but also the PCB substrate may be scratched or damaged during the transfer process.

[0005] Therefore, how to prevent dust from falling on the surface of the PCB substrate again when the PCB substrate is first dust-removed and then inspected is a technical problem that urgently needs to be solved in this field.

[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the Invention

[0007] The embodiments of the present disclosure at least provide PCB substrate dust removal equipment and a dust removal process thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides a PCB substrate dust removal device, comprising:

[0009] Workbench;

[0010] A conveying line, which is arranged on the workbench and is suitable for driving the substrate to move horizontally back and forth;

[0011] At least one dust removal device is slidably mounted on the workbench, and two dust removal devices are disposed oppositely on both sides of the conveyor line;

[0012] At least one collecting device, which is arranged on the workbench in a lifting manner and is paired with the dust removal device;

[0013] Wherein, after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate under negative pressure;

[0014] After the dust removal is completed, the collection device moves upward and compressed air is delivered into the dust removal device to blow the dust to the collection device;

[0015] After the dust removal is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified.

[0016] In an optional embodiment, the dust removal device includes: a horizontal moving pair, which is arranged on the workbench;

[0017] A connecting air pipe is vertically arranged at the movable end of the horizontal moving pair and is connected to the air pump;

[0018] A detection dust removal component is provided at the upper end of the connecting air pipe, is hollow inside, and faces the base plate;

[0019] When the dust removal component is in contact with the substrate, it is suitable for sucking dust on the surface of the substrate with negative pressure.

[0020] In an optional embodiment, the detection dust removal assembly includes: a sealing plate fixed to the end of the connecting air pipe and communicated with the connecting air pipe;

[0021] a detection frame, which is slidably disposed in the sealing plate, with a gap being provided between the outer wall of the detection frame and the inner wall of the sealing plate;

[0022] A filter cloth is provided on a side of the detection frame away from the substrate and is suitable for filtering and intercepting dust;

[0023] The connecting piece is circumferentially arranged with a ring detection frame, and one end of the connecting piece is fixed to the inner wall of the sealing plate; wherein, when the sealing plate is in a negative pressure state, the detection frame is suitable for moving into the sealing plate, and the detection frame is suitable for squeezing the connecting piece to shrink and deform.

[0024] In an optional embodiment, a plurality of spray heads are fixed in the detection frame, which are connected to the water pipe, and the spray heads are suitable for spraying water to wet the surface of the filter cloth.

[0025] In an optional embodiment, the spray head is arranged on the outside of the filter cloth, and when the air pipe is connected to deliver compressed air into the sealing plate, the spray head is suitable for limiting the position of the filter cloth.

[0026] In an optional embodiment, the connecting member is a flexible member, and when it contracts and deforms, it is suitable for sealing the gap between the detection frame and the sealing plate.

[0027] In an optional embodiment, a pressure sensor is provided in the sealing plate, and the pressure sensor is suitable for detecting the air pressure in the sealing plate; wherein, when the detection frame is pushed outward by compressed air to abut against the substrate, the pressure sensor monitors the pressure range in the sealing plate to detect whether the surface of the substrate is qualified.

[0028] In an optional embodiment, two sliding grooves are provided in parallel on the side wall of the sealing plate, and a slider adapted to the sliding groove is fixed on the outer wall of the detection frame, and the slider slides and the sliding groove in a sealed manner.

[0029] In an optional embodiment, the method includes:

[0030] A dust removal device is slidably arranged on the workbench, and two dust removal devices are arranged oppositely on both sides of the conveyor line;

[0031] Wherein, after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate under negative pressure;

[0032] After the dust removal is completed, compressed air is delivered to the dust removal device to clean the dust collected in the dust removal device;

[0033] After the dust removal is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified;

[0034] The dust removal device includes: a horizontal moving pair, which is arranged on the workbench;

[0035] A connecting air pipe is vertically arranged at the movable end of the horizontal moving pair and is connected to the air pump;

[0036] A detection dust removal component is provided at the upper end of the connecting air pipe, is hollow inside, and faces the base plate;

[0037] When the dust removal component is in contact with the substrate, it is suitable for sucking dust on the surface of the substrate with negative pressure.

[0038] In an optional embodiment, the detection dust removal assembly includes: a sealing plate fixed to the end of the connecting air pipe and communicated with the connecting air pipe;

[0039] a detection frame, which is slidably disposed in the sealing plate, with a gap being provided between the outer wall of the detection frame and the inner wall of the sealing plate;

[0040] A filter cloth is provided on a side of the detection frame away from the substrate and is suitable for filtering and intercepting dust;

[0041] The connecting piece is circumferentially arranged with a ring detection frame, and one end of the connecting piece is fixed to the inner wall of the sealing plate; wherein, when the sealing plate is in a negative pressure state, the detection frame is suitable for moving into the sealing plate, and the detection frame is suitable for squeezing the connecting piece to shrink and deform.

[0042] In a second aspect, the present disclosure also provides a dust removal process for a dust removal device, including:

[0043] During dust removal, after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate with negative pressure;

[0044] After the dust removal is completed, the collection device moves upward and compressed air is delivered into the dust removal device to blow the dust to the collection device;

[0045] After the dust removal is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified.

[0046] The beneficial effects of the present invention are as follows: the PCB substrate dust removal device of the present invention, through the provision of a dust removal device, can absorb and remove dust from the substrate surface when the internal pressure is negative; after dust removal is completed, the collection device can collect dust intercepted by the filter cloth; and the provision of a spray head can prevent dust on the filter cloth from being blown back onto the substrate. When the internal pressure is positive, it is suitable for detecting whether the substrate surface smoothness is acceptable, thereby improving work efficiency.

[0047] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purposes and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0048] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0050] Figure 1 A three-dimensional diagram of a PCB substrate dust removal device provided in an embodiment of the present disclosure;

[0051] Figure 2 A partial perspective view of a conveyor line and two detection and dust removal components provided in an embodiment of the present disclosure;

[0052] Figure 3 A sectional perspective view of a detection and dust removal assembly provided in an embodiment of the present disclosure;

[0053] Figure 4 A schematic diagram of a positive pressure state inside a sealing plate provided in an embodiment of the present disclosure;

[0054] Figure 5 Schematic diagram of the negative pressure state inside the sealing plate provided in an embodiment of the present disclosure.

[0055] In the picture:

[0056] 1. Workbench;

[0057] 2. Conveyor line;

[0058] 3. Dust removal device; 31. Horizontal moving pair; 32. Connecting air pipe;

[0059] 33. Detection dust removal assembly; 331. Sealing plate; 332. Detection frame; 333. Filter cloth; 334. Connector; 335. Sprinkler head; 336. Slide;

[0060] 4. Collection device. DETAILED DESCRIPTION

[0061] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0062] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of components may be exaggerated or reduced in order to effectively describe technical content.

[0063] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." when following a list of elements modify the entire list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0064] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a", "an" and "the" may also be intended to include plural forms, unless otherwise clearly indicated herein. The terms "comprise", "include" and "have" are inclusive and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the particular order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0065] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0066] Research has found that the shortcomings of the existing technology are: dust is sucked into the negative pressure dust removal device for a long time, and some dust will remain in the pipeline of the negative pressure device, which is not only difficult to clean, but also affects the service life of the equipment.

[0067] Moreover, after dust removal, the PCB substrate needs to be tested for surface smoothness. However, the existing test requires the PCB substrate to be transferred to other inspection conveyor lines, which is not only time-consuming and labor-intensive, but also the PCB substrate may be scratched or damaged during the transfer process.

[0068] Therefore, how to solve the problem of first removing dust from PCB substrates and then inspecting them in a conveying system is a technical problem that needs to be solved urgently in this field.

[0069] The defects in the above solutions are the results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure in this article should be the contributions made by the inventors to the present disclosure during the disclosure process.

[0070] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0071] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0072] like Figures 1 to 5 As shown, some embodiments provide a PCB substrate dust removal device, comprising: a workbench 1; a conveyor line 2, which is arranged on the workbench 1 and is suitable for driving the substrate to move back and forth horizontally; the conveyor line 2 is suitable for driving the substrate to move horizontally. In this embodiment, the substrate is placed vertically on the conveyor line 2, and a clamping base for limiting the position of the substrate is provided on the conveyor line 2, and the substrate is vertically fixed on the upper section of the clamping base. At least one dust removal device 3 is slidably arranged on the workbench 1, and two dust removal devices 3 are relatively arranged on both sides of the conveyor line 2; when the substrate moves horizontally to the dust removal station, the two dust removal devices 3 move toward the conveyor line 2 until the dust removal detection component 33 abuts against the side wall of the substrate. At least one collecting device 4 is lifted and lowered on the workbench 1, and one collecting device 4 corresponds to one dust removal device 3; the collecting device 4 faces the dust removal device 3, and its opening size is larger than the size of the sealing plate 331. When the dust removal device 3 approaches the substrate, it vacuums dust from the substrate surface using negative pressure. After dust removal is complete, the collection device 4 moves upward, delivering compressed air into the dust removal device 3 to spray the dust onto the collection device 4. After dust removal is complete, the retaining frame of the dust removal device 3 engages the outer wall of the substrate, and compressed air is delivered into the dust removal device 3 to inspect the substrate surface for compliance. This configuration allows the dust removal device 3 to absorb and remove dust from the substrate surface when the pressure inside the device is negative. After dust removal is complete, the collection device 4 collects dust trapped by the filter cloth 333. The shower head 335 prevents dust on the filter cloth 333 from being blown back onto the substrate. When the pressure inside the device is positive, it is suitable for inspecting the smoothness of the substrate surface, improving work efficiency.

[0073] Reference Attachment Figure 2The dust removal device 3 includes: a horizontal moving pair 31, which is arranged on the workbench 1; the horizontal moving pair 31 is perpendicular to the moving direction of the conveyor line 2, and a connecting air pipe 32 is vertically arranged at the movable end of the horizontal moving pair 31, and is connected to the air pump; the horizontal moving pair 31 is suitable for driving the connecting cylinder to move in the direction of the conveyor line 2; preferably, the connecting air pipe 32 is vertically arranged, and a detection dust removal component 33 is arranged at the upper end of the connecting air pipe 32, which is hollow inside and faces the substrate; the size of the detection dust removal component 33 is consistent with the size of the substrate, that is, after the substrate is clamped and fixed by the conveyor line 2, the height of the substrate is consistent with the height of the sealing plate 331, therefore, when the conveyor line 2 drives the substrate to move horizontally, the detection dust removal component 33 is suitable for negative pressure suction to remove dust on the surface of the substrate. Wherein, when the detection dust removal component 33 abuts against the substrate, it is suitable for negative pressure suction of dust on the surface of the substrate. When the dust on the surface of the substrate is cleaned, the conveyor belt drives the substrate to move horizontally in the opposite direction, and delivers compressed air into the detection dust removal component 33. The detection dust removal component 33 is suitable for detecting whether the smoothness of the substrate surface is qualified.

[0074] Reference Attachment Figure 3The detection and dust removal assembly 33 includes: a sealing plate 331, which is fixed to the end of the connecting air pipe 32 and is connected to the connecting air pipe 32; an opening is provided at one end of the sealing plate 331 close to the substrate; and the detection frame 332 is adapted to protrude from the sealing plate 331 until it abuts against the surface of the substrate. The detection frame 332 is slidably arranged in the sealing plate 331, and a gap is provided between its outer wall and the inner wall of the sealing plate 331; when removing dust from the substrate surface, the detection frame 332 is adapted to slide into the sealing plate 331; and when inspecting the substrate surface, the detection frame 332 is adapted to slide outward and protrude from the sealing plate 331. A filter cloth 333 is arranged on the side of the detection frame 332 away from the substrate and is adapted to filter and intercept dust; the pore size of the filter cloth 333 is smaller than the particle size of the dust on the substrate surface. When negative pressure is present in the sealing plate 331, the filter cloth 333 is adapted to filter and intercept dust to prevent it from flowing into the connecting air pipe 32. After dust removal is complete, the collection device 4 moves upward until it aligns with the sealing plate 331. At this point, a seal is established between the sealing plate 331 and the collection device 4. Compressed air is delivered into the sealing plate 331, causing the filter cloth 333 to bulge outward, forcing dust trapped on the filter cloth 333 to flow toward the collection device 4. A connecting member 334 is circumferentially arranged around the detection frame 332, with one end fixed to the inner wall of the sealing plate 331. When negative pressure is present within the sealing plate 331, the detection frame 332 is adapted to move into the sealing plate 331, compressing the connecting member 334 to cause it to contract and deform. The setting of the connecting piece 334 has the effect of sealing the detection frame 332 and the sealing plate 331 when the detection frame 332 is sucked inward by negative pressure; and when the sealing plate 331 is under positive pressure, the detection frame 332 is pushed outward by the compressed air. At this time, part of the compressed air will flow outward through the gap between the detection frame 332 and the sealing plate 331 to prevent the detection frame 332 from being sealed by the substrate, while the sealing plate 331 remains sealed, and the air pump continues to supply compressed air into the sealing plate 331, causing the air pump to overload.

[0075] Furthermore, to prevent secondary dust contamination of the substrate, several spray heads 335 are fixed within the inspection frame 332. These are connected to a water pipe and are adapted to spray water to moisten the surface of the filter cloth 333. Before the substrate is subjected to surface smoothness testing, the spray heads 335 spray water onto the surface of the filter cloth 333, thereby moistening the filter cloth 333 and preventing dust remaining on the outer surface of the filter cloth 333 from being blown back onto the substrate surface by the compressed air. In this case, the amount of water sprayed onto the surface of the filter cloth 333 by the spray heads 335 is relatively small, merely moistening the surface of the filter cloth 333 and preventing excess moisture from diffusing onto the substrate surface. Optionally, the spray heads 335 are positioned outside the filter cloth 333 and are adapted to position the filter cloth 333 when the air pipe 32 is connected to deliver compressed air into the sealing plate 331.

[0076] Furthermore, the connecting member 334 is a flexible member, and when it contracts and deforms, it is suitable for sealing the gap between the detection frame 332 and the sealing plate 331 .

[0077] In some embodiments, a pressure sensor is provided within the sealing plate 331, adapted to detect the air pressure within the sealing plate 331. When the inspection frame 332 is pushed outward by compressed air until it contacts the substrate, the pressure sensor monitors the pressure range within the sealing plate 331 to detect whether the substrate surface is qualified. An air pump delivers compressed air into the sealing plate 331, maintaining the pressure within the sealing plate 331 within a range of 0.22-0.25 MPa. After the inspection frame 332 contacts the outer wall of the substrate, if the substrate surface smoothness is qualified, the pressure within the sealing plate 331 is maintained at 0.22-0.25 MPa. If the substrate surface is uneven, some air will leak outward along the surfaces of the inspection frame 332 and the substrate. At this point, if the pressure within the sealing plate 331 is less than 0.22 MPa, the substrate is deemed unqualified.

[0078] Optionally, two sliding grooves 336 are provided in parallel on the side wall of the sealing plate 331 , and a slider adapted to the sliding groove 336 is fixed on the outer wall of the detection frame 332 , and the slider and the sliding groove 336 are slidably sealed.

[0079] Some embodiments provide a PCB substrate dust removal device, comprising: a workbench 1; a conveyor line 2, which is arranged on the workbench 1 and is suitable for driving the substrate to move horizontally back and forth; a dust removal device 3, which is slidably arranged on the workbench 1, and two dust removal devices 3 are relatively arranged on both sides of the conveyor line 2; a collecting device 4, which is lifted and lowered on the workbench 1, and one collecting device 4 corresponds to one dust removal device 3; wherein, after the dust removal device 3 approaches the substrate, the dust removal device 3 is suitable for negative pressure suction of dust on the surface of the substrate; after the dust removal is completed, the collecting device 4 moves upward to transport compressed air into the dust removal device 3 , so as to blow the dust to the collecting device 4; after the dust discharge is completed, the limit frame of the dust removal device 3 is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device 3 to detect whether the surface of the substrate is qualified; the dust removal device 3 includes: a horizontal moving pair 31, which is arranged on the workbench 1; a connecting air pipe 32, which is vertically arranged at the movable end of the horizontal moving pair 31 and is connected to the air pump; a detection dust removal component 33, which is arranged at the upper end of the connecting air pipe 32, has a hollow interior, and faces the substrate; wherein, when the detection dust removal component 33 abuts against the substrate, it is suitable for negative pressure suction of dust on the surface of the substrate.

[0080] Furthermore, the detection and dust removal component 33 includes: a sealing plate 331, which is fixed at the end of the connecting air pipe 32 and is connected to the connecting air pipe 32; a detection frame 332, which is slidably arranged in the sealing plate 331, and a gap is provided between its outer wall and the inner wall of the sealing plate 331; a filter cloth 333, which is arranged on the side of the detection frame 332 away from the substrate and is suitable for filtering and intercepting dust; a connecting piece 334, which is circumferentially arranged around the detection frame 332, and one end of which is fixed to the inner wall of the sealing plate 331; wherein, when the sealing plate 331 is in a negative pressure state, the detection frame 332 is suitable for moving into the sealing plate 331, and the detection frame 332 is suitable for squeezing the connecting piece 334 to shrink and deform.

[0081] Some embodiments provide a dust removal process for a dust removal device, comprising: during dust removal, after the dust removal device 3 approaches a substrate, the dust removal device 3 is adapted to suck dust on the surface of the substrate under negative pressure;

[0082] After the dust removal is completed, the collecting device 4 moves upward and delivers compressed air into the dust removal device 3 to blow the dust into the collecting device 4;

[0083] After the dust removal is completed, the limit frame of the dust removal device 3 is fitted with the outer wall of the substrate, and compressed air is supplied into the dust removal device 3 to detect whether the surface of the substrate is qualified.

[0084] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0085] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply a sequence or order when used herein, unless expressly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0086] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A PCB substrate dust removal device, characterized in that: include: Workbench (1); A conveying line (2), which is arranged on the workbench (1) and is suitable for driving the substrate to move horizontally back and forth; At least one dust removal device (3) is slidably arranged on the workbench (1), and two dust removal devices (3) are relatively arranged on both sides of the conveying line (2); At least one collecting device (4) is arranged on the workbench (1) in a lifting manner and is paired with the dust removal device (3); The dust removal device (3) is close to the substrate and sucks dust on the surface of the substrate with negative pressure; After the dust removal is completed, the collecting device (4) moves upward; delivering compressed air into the dust removal device (3) to blow the dust to the collection device (4); After the dust removal is completed, the limit frame of the dust removal device (3) is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device (3) to detect whether the surface of the substrate is qualified; The dust removal device (3) comprises: a horizontal moving pair (31) arranged on the workbench (1); A connecting air pipe (32) is vertically arranged at the movable end of the horizontal movable pair (31) and is connected to the air pump; A detection dust removal component (33) is arranged at the upper end of the connecting air pipe (32), is hollow inside, and faces the base plate; Wherein, when the dust removal component (33) is in contact with the substrate, it is suitable for sucking dust on the surface of the substrate under negative pressure; The detection dust removal assembly (33) comprises: a sealing plate (331) fixed to the end of the connecting air pipe (32) and in communication with the connecting air pipe (32); a detection frame (332) which is slidably disposed in the sealing plate (331), with a gap being provided between the outer wall of the detection frame and the inner wall of the sealing plate (331); A filter cloth (333) is provided on a side of the detection frame (332) away from the substrate and is suitable for filtering and intercepting dust; The connecting member (334) is circumferentially arranged around the detection frame (332), and one end of the connecting member (334) is fixed to the inner wall of the sealing plate (331); wherein, when the sealing plate (331) is in a negative pressure state, the detection frame (332) is adapted to move into the sealing plate (331), and the detection frame (332) is adapted to squeeze the connecting member (334) to cause contraction and deformation.

2. The PCB substrate dust removal device according to claim 1, characterized in that: A plurality of spray heads (335) are fixed in the detection frame (332), which are connected to the water pipe, and the spray heads (335) are suitable for spraying water to wet the surface of the filter cloth (333).

3. The PCB substrate dust removal device according to claim 2, characterized in that: The spray head (335) is arranged outside the filter cloth (333), and when the air pipe (32) is connected to deliver compressed air into the sealing plate (331), the spray head (335) is suitable for limiting the position of the filter cloth (333).

4. The PCB substrate dust removal device according to claim 1, wherein: The connecting member (334) is a flexible member, and when it contracts and deforms, it is suitable for sealing the gap between the detection frame (332) and the sealing plate (331).

5. The PCB substrate dust removal device according to claim 2, characterized in that: A pressure sensor is provided in the sealing plate (331), and the pressure sensor is suitable for detecting the air pressure in the sealing plate (331); wherein, when the detection frame (332) is pushed outward by the compressed air to abut against the substrate, the pressure sensor monitors the pressure range in the sealing plate (331) to detect whether the surface of the substrate is qualified.

6. The PCB substrate dust removal device according to claim 1, wherein: Two sliding grooves (336) are arranged in parallel on the side wall of the sealing plate (331), and a slider adapted to the sliding groove (336) is fixed on the outer wall of the detection frame (332), and the slider and the sliding groove (336) are slidably sealed.

7. A PCB substrate dust removal device, characterized in that: include: Workbench (1); A dust removal device (3) is slidably arranged on the workbench (1), and two dust removal devices (3) are relatively arranged on both sides of the conveying line (2); Wherein, after the dust removal device (3) is close to the substrate, the dust removal device (3) is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, compressed air is delivered to the dust removal device (3) to clean the dust collected in the dust removal device (3); After the dust removal is completed, the limit frame of the dust removal device (3) is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device (3) to detect whether the surface of the substrate is qualified; The dust removal device (3) comprises: a horizontal moving pair (31) arranged on the workbench (1); A connecting air pipe (32) is vertically arranged at the movable end of the horizontal movable pair (31) and is connected to the air pump; A detection dust removal component (33) is arranged at the upper end of the connecting air pipe (32), is hollow inside, and faces the base plate; Wherein, when the dust removal component (33) is in contact with the substrate, it is suitable for sucking dust on the surface of the substrate under negative pressure; The detection dust removal assembly (33) comprises: a sealing plate (331) fixed to the end of the connecting air pipe (32) and in communication with the connecting air pipe (32); a detection frame (332) which is slidably disposed in the sealing plate (331), with a gap being provided between the outer wall of the detection frame and the inner wall of the sealing plate (331); A filter cloth (333) is provided on a side of the detection frame (332) away from the substrate and is suitable for filtering and intercepting dust; The connecting member (334) is circumferentially arranged around the detection frame (332), and one end of the connecting member (334) is fixed to the inner wall of the sealing plate (331); wherein, when the sealing plate (331) is in a negative pressure state, the detection frame (332) is adapted to move into the sealing plate (331), and the detection frame (332) is adapted to squeeze the connecting member (334) to cause contraction and deformation.

8. A dust removal process for a dust removal device, using the PCB substrate dust removal device according to any one of claims 1 to 7, characterized in that: include: During dust removal, after the dust removal device (3) is close to the substrate, the dust removal device (3) is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, the collecting device (4) moves upward to deliver compressed air into the dust removal device (3) to blow the dust into the collecting device (4); After the dust removal is completed, the limit frame of the dust removal device (3) is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device (3) to detect whether the surface of the substrate is qualified.

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