Correction method of LCD copper target material assembly

Abstract

The invention provides a correction method of an LCD copper target material assembly. The correction method comprises the following steps: sequentially pressurizing the central point and the two ends of the LCD copper target material assembly, releasing the pressure, and standing. According to the correction method provided by the invention, the central point and the two ends of the LCD copper target material assembly are pressurized and released respectively, so that the problem of deformation of different degrees of the copper target material due to thermal expansion and cold contraction effects can be effectively solved, the overall flatness of the LCD copper target material assembly is ensured to be within a qualified range, the correction efficiency is greatly improved, and the rate of finished products is relatively high.

Description

Technical Field

[0001] The invention belongs to the technical field of liquid crystal display panels, and in particular relates to a correction method for an LCD copper target assembly. Background Art

[0002] Metal sputtering target is a material used as cathode in sputtering deposition technology. Under the impact of positively charged cations in the sputtering machine, the metal on the surface of the metal sputtering target is separated from the cathode in the form of molecules, atoms or ions and re-deposited on the anode surface. Since metal sputtering targets are often made of relatively expensive metal materials such as high-purity aluminum, copper, titanium, nickel, tantalum, etc., and the strength of metal sputtering targets varies, in actual application, it is necessary to combine metal sputtering targets that meet performance requirements with backing plates with a certain strength to form target components, and then install them on the sputtering machine to effectively control sputtering under the action of magnetic and electric fields. The backing plate can not only support and cool the metal sputtering target, but also reduce the raw material cost of the production process. Commonly used backing plate materials include high-purity aluminum, high-purity copper, aluminum alloys and copper alloys.

[0003] At present, the metal sputtering target and the back plate need to be processed and welded to ensure the success of subsequent sputtering. If the welding degree between the metal sputtering target and the back plate is poor, the metal sputtering target will deform, crack, or even fall off the back plate under heating conditions, which will not only fail to achieve uniform sputtering, but may also damage the sputtering base.

[0004] After the metal target is welded to the back plate, due to the thermal expansion and contraction effect of the metal target, different areas of the target will deform to different degrees relative to the back plate, resulting in uneven sputtering surface of the target, affecting the quality of the film layer on the substrate during the sputtering process. Therefore, the metal target needs to be corrected before being used as a sputtering source so that it has a suitable flatness. For example, CN 111468563A discloses a correction method for a titanium tungsten square target assembly, the correction method comprising: pressurizing a titanium tungsten square target assembly at a temperature of 100 to 120°C to a depression of 2 to 2.2 mm, then cooling to room temperature and removing the pressure. The correction method of the present invention, based on the mechanical properties of the titanium tungsten square target assembly, relies on the synergistic effect between the maintained temperature and the degree of depression, and adopts a thermal correction method to not only avoid the cracking of the titanium tungsten square target assembly, but also make the flatness of the titanium tungsten square target assembly ≤0.3 mm.

[0005] CN 112453623A discloses a welding and shaping integration method for a circular titanium target and a back plate, the integration method comprising: respectively infiltrating the molten solder on the welding surface of the circular titanium target and the welding surface of the back plate, and fitting the welding surfaces of the two, and the circular titanium target is located above the back plate; placing a pad on the circular titanium target, and performing a pressurizing operation on the pad; after cooling, the pressurizing operation is removed to obtain a circular titanium target assembly. The integration method of the present invention can correct the flatness of the circular titanium target while welding, avoiding subsequent additional shaping operations, and at the same time meet the welding bonding degree and flatness requirements of the circular titanium target assembly, so that the welding bonding degree is ≥99% and the flatness is ≤0.3mm, and at the same time improves the welding qualification rate and shaping qualification rate.

[0006] It can be seen that the above-mentioned disclosed target assembly correction methods all apply pressure at a certain point of the target material to achieve the flatness requirement of the metal target sputtering surface. However, in the current LCD industry, the targets used are all relatively large-sized bar target assemblies, and the bar target assemblies are often welded from copper back plates and metal materials (aluminum, titanium, copper, tungsten, etc.). The thermal expansion coefficients of different metals are quite different. During the welding process, the ends or center parts of the target material will be lifted up. Therefore, it is necessary to correct the target material after welding. Taking the G6 bar titanium target assembly commonly used in the liquid crystal display panel industry as an example, the target material is as long as 3000mm and only 230mm wide. If pressure is applied at the center for shaping, it is often not corrected successfully in one go, which greatly wastes manpower and material resources and reduces the correction efficiency.

[0007] In summary, there is an urgent need to develop a new correction method for LCD bar target assemblies, which can effectively solve the problem of different degrees of deformation of metal targets due to thermal expansion and contraction effects, ensure that the overall flatness of the LCD bar target assembly is within the qualified range, greatly improve the correction efficiency, and have a high yield rate. Summary of the invention

[0008] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a correction method for an LCD copper target assembly. The present invention can effectively solve the problem of different degrees of deformation of the copper target due to thermal expansion and contraction effects by respectively applying pressure and releasing pressure to the center point and both ends of the LCD copper target assembly, ensuring that the overall flatness of the LCD copper target assembly is within a qualified range, greatly improving the correction efficiency, and having a high yield rate.

[0009] To achieve this object, the present invention adopts the following technical solutions:

[0010] The invention provides a correction method for an LCD copper target assembly, the correction method comprising: applying pressure to the center point and two ends of the LCD copper target assembly in sequence, and performing a static treatment after releasing the pressure.

[0011] The present invention can effectively solve the problem of different degrees of deformation of the metal target due to thermal expansion and contraction effects by pressurizing the center point and both ends of the LCD copper target assembly, ensure that the overall flatness of the LCD copper target assembly is within a qualified range, and greatly improve the correction efficiency and yield rate.

[0012] It is worth noting that due to the different thermal expansion and contraction effects between the metal target and the backplane corresponding to different LCD bar target assemblies, some LCD bar target assemblies will arch toward the metal target after welding. If only the two ends of the target assembly are pressurized, the target assembly is prone to M-shaped arching or arching in the middle during the correction process, which cannot meet the use requirements of semiconductor companies' sputtering products. Therefore, it is necessary to pressurize the center point of the target assembly.

[0013] In addition, before the correction method of the present invention is implemented, the solder and impurities on the surface of the LCD copper target assembly need to be removed to avoid causing large errors.

[0014] As a preferred technical solution of the present invention, the correction method comprises the following steps:

[0015] (1) placing the LCD copper target assembly flat on a calibration platform, and arranging pads symmetrically along the length direction of the LCD copper target assembly, near the end and along the center line;

[0016] (2) Detect the flatness of the copper target assembly to be corrected, and lay a buffer pad after obtaining the target warping degree;

[0017] (3) According to the target warping degree obtained in step (2), pressure is applied to the center point and both ends of the LCD copper target assembly in turn, and then the pressure is released and the target assembly is allowed to stand for a while.

[0018] The LCD copper target assembly described in the present invention is a strip target whose length is much greater than its width. A pad needs to be placed between the LCD copper target assembly and the correction platform, which helps in the subsequent pressurization process of the two ends of the LCD copper target assembly. The metal target and the back plate that were originally arched in the direction of the metal target are both subjected to forces in the opposite direction, thereby effectively solving the problem of different degrees of deformation of the metal target due to thermal expansion and contraction effects, ensuring that the overall flatness of the LCD copper target assembly is within an acceptable range, and greatly improving the correction efficiency and yield rate.

[0019] As a preferred technical solution of the present invention, the model of the LCD copper target assembly includes any one of G8, G8.5, G10.5 or G11.

[0020] Preferably, the back plate of the LCD copper target assembly comprises a copper alloy back plate.

[0021] As a preferred technical solution of the present invention, the pad block in step (1) is arranged between the correction platform and the back plate of the LCD copper target assembly.

[0022] Preferably, the thickness of the cushion block is 30-50 mm, for example, 30 mm, 34 mm, 38 mm, 42 mm, 46 mm or 50 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0023] Preferably, the width of the cushion block is 30-50 mm, for example, 30 mm, 34 mm, 38 mm, 42 mm, 46 mm or 50 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0024] Preferably, the cushion block is made of wood.

[0025] As a preferred technical solution of the present invention, the buffer pad in step (2) includes a silicone pad.

[0026] Preferably, the thickness of the buffer pad is 8 to 12 mm, for example, 8 mm, 9 mm, 10 mm, 11 mm or 12 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0027] In the present invention, the buffer pad is laid on the upper surface of the metal target material, and its function is to reduce the surface pressure, increase the pressure contact area, and reduce the possibility of crushing the target material surface.

[0028] As a preferred technical solution of the present invention, the pressurizing device in step (3) includes a single-point hydraulic press.

[0029] Preferably, a buffer block is provided at one end of the hydraulic head of the single-point hydraulic press close to the LCD copper target assembly.

[0030] Preferably, the thickness of the buffer block is 30-50 mm, for example, 30 mm, 34 mm, 38 mm, 42 mm, 46 mm or 50 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0031] Preferably, the width of the buffer block is 30-50 mm, for example, 30 mm, 34 mm, 38 mm, 42 mm, 46 mm or 50 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0032] Preferably, the buffer block is made of wood.

[0033] The buffer block of the present invention is arranged at the place where the hydraulic head contacts the LCD copper target assembly, which can effectively buffer the pressure of the pressurization operation and prevent the target assembly from being subjected to high pressure at one time, resulting in product cracking.

[0034] As a preferred technical solution of the present invention, the ambient temperature for the static treatment in step (3) is 20-30°C, for example, it can be 20°C, 22°C, 24°C, 26°C, 28°C or 30°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0035] Preferably, the standing treatment time in step (3) is 10 to 14 hours, for example, 10 hours, 11 hours, 12 hours, 13 hours or 14 hours, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0036] As a preferred technical solution of the present invention, the pressing depth of the center point in step (3) is 18 to 23 mm, for example, it can be 18 mm, 19 mm, 20 mm, 21 mm, 22 mm or 23 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0037] Preferably, the holding time of the center point in step (3) is 7 to 10 minutes, for example, it can be 7.5 minutes, 7.8 minutes, 8.3 minutes, 8.6 minutes, 9.4 minutes or 10 minutes, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0038] As a preferred technical solution of the present invention, the pressing depth at both ends in step (3) is 12 to 17 mm, for example, it can be 12 mm, 13 mm, 14 mm, 15 mm, 16 mm or 17 mm, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0039] Preferably, the holding time at both ends of step (3) is 5 to 8 minutes, for example, 5 minutes, 5.4 minutes, 5.8 minutes, 6.2 minutes, 7.6 minutes or 8 minutes, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0040] Preferably, the two ends of step (3) are 95 to 105 mm away from the end of the LCD copper target assembly, for example, 95 mm, 97 mm, 99 mm, 101 mm, 103 mm or 105 mm, but are not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0041] As a preferred technical solution of the present invention, if after the static treatment in step (3), the flatness of the LCD copper target assembly is detected to be not -1 to 0.5 mm, the correction method further comprises step (4),

[0042] Preferably, the step (4) comprises: according to the flatness obtained by detection, repeating the pressurization, pressure release and static treatment of step (3) until the flatness of the LCD copper target assembly meets -1 to 0.5 mm.

[0043] As a preferred technical solution of the present invention, the correction method of the LCD copper target assembly provided by the present invention comprises the following steps:

[0044] (1) placing the LCD copper target assembly flat on a calibration platform, and symmetrically arranging a pad with a thickness of 30 to 50 mm and a length of 30 to 50 mm near the end and along the center line along the length direction of the LCD copper target assembly;

[0045] Wherein, the back plate of the LCD copper target assembly comprises a copper alloy back plate; the pad is arranged between the correction platform and the back plate of the LCD copper target assembly;

[0046] (2) Detect the flatness of the copper target assembly to be corrected, and after obtaining the target warping degree, lay a silicone pad with a thickness of mm;

[0047] (3) According to the target tilting degree obtained in step (2), a single-point hydraulic press is used to pressurize the center point and both ends of the LCD copper target assembly in sequence, and after the pressure is released, the assembly is allowed to stand at 20 to 30° C. for 10 to 14 hours; and then the flatness of the LCD copper target assembly is detected;

[0048] Wherein, a buffer block with a thickness of 30 to 50 mm and a length of 30 to 50 mm is provided at one end of the hydraulic head of the single-point hydraulic press close to the LCD copper target assembly;

[0049] The pressing depth of the center point is 18 to 23 mm; the holding time is 7 to 10 minutes;

[0050] The pressing depth of the two ends is 12-17 mm; the holding time is 5-8 min; the two ends are 95-105 mm away from the end of the LCD copper target assembly;

[0051] (4) If the flatness of the LCD copper target assembly does not meet the requirement of -1 to 0.5 mm, the pressurization, pressure release and static treatment in step (3) are repeated according to the flatness obtained by the test until the flatness of the LCD copper target assembly meets the requirement of -1 to 0.5 mm.

[0052] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0053] Compared with the prior art, the present invention has the following beneficial effects:

[0054] The correction method provided by the present invention can effectively solve the problem of different degrees of deformation of the metal target due to thermal expansion and contraction effects by pressurizing the center point and both ends of the LCD copper target assembly, ensure that the overall flatness of the LCD copper target assembly is within a qualified range, and greatly improve the correction efficiency and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 is a front view of the correction method provided by Example 1 of the present invention;

[0056] Among them, 1 is a cushion block, 2 is a back plate, 3 is a metal target material, 4 is a silicone pad, 5 is a single-point hydraulic press, and 6 is a buffer block. DETAILED DESCRIPTION

[0057] The technical solution of the present invention is further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0058] Example 1

[0059] This embodiment provides a Figure 1 The correction method of the LCD copper target assembly shown in the figure comprises the following steps:

[0060] (1) placing the LCD copper target assembly flat on a calibration platform, and symmetrically placing a pad 1 with a thickness of 40 mm and a length of 40 mm near the end and along the center line along the length direction of the LCD copper target assembly;

[0061] Wherein, the back plate 2 of the LCD copper target assembly comprises a copper alloy back plate; the pad is arranged between the correction platform and the back plate 2 of the LCD copper target assembly;

[0062] (2) Detect the flatness of the copper target assembly to be corrected, and after obtaining the target tilting degree, lay a silicone pad 4 with a thickness of mm;

[0063] (3) According to the target warping degree obtained in step (2), a single-point hydraulic press 5 is used to sequentially pressurize the center point and both ends of the metal target 3 of the LCD copper target assembly, and after the pressure is released, the metal target 3 is allowed to stand for 12 hours at 25° C.; and then the flatness of the LCD copper target assembly is detected;

[0064] Wherein, a buffer block 6 with a thickness of 40 mm and a length of 40 mm is provided at one end of the hydraulic head of the single-point hydraulic press close to the LCD copper target assembly;

[0065] The pressing depth of the center point is 20 mm; the holding time is 8.25 min;

[0066] The pressing depth of the two ends is 15 mm; the holding time is 6 min; the two ends are 100 mm away from the end of the LCD copper target assembly;

[0067] (4) If the flatness of the LCD copper target assembly does not meet the range of -1 to 0.5 mm, the pressurization, pressure release and static treatment in step (3) are repeated once according to the flatness obtained by the test.

[0068] Using a 1mm feeler gauge for testing, six test points were selected at both ends and the center area of ​​the LCD copper target. The flatness of the six test points was within -1 to 0.5mm, that is, the overall flatness of the LCD copper target assembly after being processed by the correction method described in this embodiment was within the qualified range.

[0069] Example 2

[0070] This embodiment provides a correction method for an LCD copper target assembly, the correction method comprising the following steps:

[0071] (1) placing the LCD copper target assembly flat on a calibration platform, and symmetrically setting a pad 1 with a thickness of 30 mm and a length of 30 mm near the end and along the center line along the length direction of the LCD copper target assembly;

[0072] Wherein, the back plate 2 of the LCD copper target assembly comprises a copper alloy back plate; the pad is arranged between the correction platform and the back plate 2 of the LCD copper target assembly;

[0073] (2) Detect the flatness of the copper target assembly to be corrected, and after obtaining the target tilting degree, lay a silicone pad 4 with a thickness of mm;

[0074] (3) According to the target warping degree obtained in step (2), a single-point hydraulic press 5 is used to pressurize the center point and both ends of the metal target 3 of the LCD copper target assembly in sequence, and after the pressure is released, it is allowed to stand at 20° C. for 14 hours; and then the flatness of the LCD copper target assembly is detected;

[0075] Wherein, a buffer block 6 with a thickness of 30 mm and a length of 30 mm is provided at one end of the hydraulic head of the single-point hydraulic press close to the LCD copper target assembly;

[0076] The pressing depth of the center point is 23 mm; the holding time is 9 minutes;

[0077] The pressing depth of the two ends is 17 mm; the holding time is 7.9 min; the two ends are 105 mm away from the end of the LCD copper target assembly;

[0078] (4) If the flatness of the LCD copper target assembly does not meet the requirement of -1 to 0.5 mm, the pressurization, pressure release and static treatment in step (3) are repeated twice according to the flatness obtained by the test.

[0079] Using a 1mm feeler gauge for testing, six test points were selected at both ends and the center area of ​​the LCD copper target. The flatness of the six test points was within the range of -1 to 0.5, that is, the overall flatness of the LCD copper target assembly after being processed by the correction method described in this embodiment was within the qualified range.

[0080] Example 3

[0081] This embodiment provides a correction method for an LCD copper target assembly, the correction method comprising the following steps:

[0082] (1) placing the LCD copper target assembly flat on a calibration platform, and symmetrically placing a pad 1 with a thickness of 50 mm and a length of 50 mm near the end and along the center line along the length direction of the LCD copper target assembly;

[0083] Wherein, the back plate 2 of the LCD copper target assembly comprises a copper alloy back plate; the pad is arranged between the correction platform and the back plate 2 of the LCD copper target assembly;

[0084] (2) Detect the flatness of the copper target assembly to be corrected, and after obtaining the target tilting degree, lay a silicone pad 4 with a thickness of mm;

[0085] (3) According to the target warping degree obtained in step (2), a single-point hydraulic press 5 is used to sequentially pressurize the center point and both ends of the metal target 3 of the LCD copper target assembly, and after releasing the pressure, the metal target 3 is allowed to stand at 30° C. for 10 hours; and then the flatness of the LCD copper target assembly is detected;

[0086] Wherein, a buffer block 6 with a thickness of 50 mm and a length of 50 mm is provided at one end of the hydraulic head of the single-point hydraulic press close to the LCD copper target assembly;

[0087] The pressing depth of the center point is 18 mm; the holding time is 10 min;

[0088] The pressing depth at the two ends is 12 mm; the holding time is 6 min; and the two ends are 95 mm away from the end of the LCD copper target assembly.

[0089] Using a 1mm feeler gauge for testing, six test points were selected at both ends and the center area of ​​the LCD copper target. The flatness of the six test points was within the range of -1 to 0.5, that is, the overall flatness of the LCD copper target assembly after being processed by the correction method described in this embodiment was within the qualified range.

[0090] Example 4

[0091] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0092] In this embodiment, the silicone pad described in step (2) is omitted.

[0093] Using a 1mm feeler gauge for testing, six test points at both ends and the center area of ​​the LCD copper target were selected. The flatness of the six test points was not within the range of -1 to 0.5mm. The reason is that the force-bearing area is too concentrated, resulting in the failure to evenly distribute the force, thus affecting the flatness and yield rate of the LCD copper target assembly.

[0094] Example 5

[0095] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0096] In this embodiment, the use of the cushion block 1 is omitted.

[0097] Using a 1mm feeler gauge for detection, six detection points at both ends and the center area of ​​the LCD copper target were selected, and the flatness of the six detection points was not within the range of -1 to 0.5mm, that is, the overall flatness of the LCD copper target assembly after being treated by the correction method described in this embodiment was not within the qualified range. The reason is that the force-bearing area is too concentrated, resulting in uneven force distribution; in addition, because the pad 1 is not used, the product surface will be damaged, which will seriously affect the yield.

[0098] Example 6

[0099] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0100] In this embodiment, the pressing depth of the center point in step (3) is adjusted to 26 mm.

[0101] Compared with Example 1, the pressing depth at the center point of this embodiment is too large. A 1mm feeler gauge is used for detection, and six detection points at both ends and the center area of ​​the LCD copper target are selected. The flatness parts of the six detection points are not within the range of -1 to 0.5mm. The reason is that when the pressing depth of the center point is too large, the pressure on the LCD copper target assembly will be too large, and excessive pressing will cause reverse deformation, thereby affecting the flatness and yield rate of the product.

[0102] Example 7

[0103] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0104] In this embodiment, the pressing depth of the center point in step (3) is adjusted to 13 mm.

[0105] Compared with Example 1, the pressing depth at the center point of this embodiment is too small. A 1mm feeler gauge is used for detection, and six detection points at both ends and the center area of ​​the LCD copper target are selected. The flatness of the six detection points is not within the range of -1 to 0.5mm. The reason is that when the pressing depth of the center point is too small, the target assembly itself will be less affected by the force, and the appropriate downward force cannot be obtained, and the LCD copper target assembly cannot be effectively corrected.

[0106] Example 8

[0107] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0108] In this embodiment, the pressing depth at both ends of step (3) is adjusted to 20 mm.

[0109] Compared with Example 1, the pressing depth at both ends of this embodiment is too large. A 1mm feeler gauge is used for detection, and six detection points at both ends and the central area of ​​the LCD copper target are selected. The flatness of the six detection points is not within the range of -1 to 0.5mm. The reason is that when the pressing depth at both ends is too large, the target assembly will be subjected to excessive pressure, and excessive pressing will cause reverse deformation, thereby affecting the flatness and yield rate of the product.

[0110] Example 9

[0111] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0112] In this embodiment, the pressing depth at both ends of step (3) is adjusted to 10 mm.

[0113] Compared with Example 1, the pressing depth at both ends of this embodiment is too small. Using a 1mm feeler gauge for detection, six detection points at both ends and the center area of ​​the LCD copper target are selected. The flatness of the six detection points is not within the range of -1 to 0.5mm. The reason is that when the pressing depth at both ends is too small, the target assembly itself will be less affected by the force, and the appropriate downward force cannot be obtained, and the LCD copper target assembly cannot be effectively corrected.

[0114] Example 10

[0115] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0116] In this embodiment, the holding time of the center point in step (3) is adjusted to 15 minutes.

[0117] Using a 1mm feeler gauge for testing, six test points were selected at both ends and the center area of ​​the LCD copper target. The flatness of the six test points was not within the range of -1 to 0.5mm. The reason is that when the pressure holding time of the center point is too long, the target assembly will be under pressure for too long, and excessive pressure will cause reverse deformation.

[0118] Embodiment 11

[0119] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0120] In this embodiment, the distance between the two ends of step (3) and the end of the LCD copper target assembly is adjusted to 80 mm.

[0121] Using a 1mm feeler gauge for detection, six detection points at both ends and the center area of ​​the LCD copper target were selected. The flatness of the six detection points was not within the range of -1 to 0.5mm. The reason is that when the pressing position shifts to both ends, the target assembly cannot be pressed down reasonably, affecting the effective correction of the LCD copper target assembly.

[0122] Example 12

[0123] This embodiment provides a correction method for an LCD copper target assembly, and the correction method is different from that of Embodiment 1 only in that:

[0124] In this embodiment, the distance between the two ends of step (3) and the end of the LCD copper target assembly is adjusted to 115 mm.

[0125] Using a 1mm feeler gauge for testing, six test points at both ends and the center area of ​​the LCD copper target were selected. The flatness of the six test points was not within the range of -1 to 0.5mm. The reason is that when the pressing position shifts toward the center point, the target assembly is over-pressed and easily causes defects such as reverse deformation, which is not conducive to the correction of the LCD copper target assembly.

[0126] Comparative Example 1

[0127] This comparative example provides a correction method for an LCD copper target assembly, and the correction method is different from that of Example 1 only in that:

[0128] In this comparative example, step (3) of pressurizing the center point is omitted.

[0129] Using a 1mm feeler gauge for testing, six test points were selected at both ends and the center area of ​​the LCD copper target. The flatness of the six test points was not within the range of -1 to 0.5mm. The reason is that the lack of the center point pressing process resulted in insufficient overall pressing deformation, making it impossible to adjust the flatness of the target assembly, thereby reducing the yield rate.

[0130] Comparative Example 2

[0131] This comparative example provides a correction method for an LCD copper target assembly, and the correction method is different from that of Example 1 only in that:

[0132] In this comparative example, step (3) of applying pressure to the two ends is omitted.

[0133] Using a 1mm feeler gauge for testing, six test points were selected at both ends and the center area of ​​the LCD copper target. The flatness of the six test points was not within the range of -1 to 0.5mm. The reason is that only the center point was pressed down, resulting in excessive overall deformation, which led to a lack of pressure at both ends, causing the entire target to warp up and reduce the yield rate.

[0134] In summary, the correction method provided by the present invention can effectively solve the problem of different degrees of deformation of the copper target due to thermal expansion and contraction effects by applying pressure and releasing pressure to the center point and both ends of the LCD copper target assembly respectively, thereby ensuring that the overall flatness of the LCD copper target assembly is within a qualified range, greatly improving the correction efficiency, and achieving a high yield rate.

[0135] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A correction method for an LCD copper target assembly, characterized in that: The correction method comprises: applying pressure to the center point and both ends of the LCD copper target assembly in sequence, and performing a static treatment after releasing the pressure.

2. The correction method according to claim 1, characterized in that: The correction method comprises the following steps: (1) placing the LCD copper target assembly flat on a calibration platform, and arranging pads symmetrically along the length direction of the LCD copper target assembly, near the end and along the center line; (2) Detect the flatness of the copper target assembly to be corrected, and lay a buffer pad after obtaining the target warping degree; (3) According to the target warping degree obtained in step (2), pressure is applied to the center point and both ends of the LCD copper target assembly in turn, and then the pressure is released and the target assembly is allowed to stand for a while.

3. The correction method according to claim 1 or 2, characterized in that: The model of the LCD copper target assembly includes any one of G8, G8.5, G10.5 or G11; Preferably, the back plate of the LCD copper target assembly comprises a copper alloy back plate.

4. The correction method according to claim 2, characterized in that: The pad in step (1) is arranged between the correction platform and the back plate of the LCD copper target assembly; Preferably, the thickness of the cushion block is 30 to 50 mm; Preferably, the width of the pad is 30-50 mm; Preferably, the cushion block is made of wood.

5. The correction method according to claim 2, characterized in that: The buffer pad in step (2) comprises a silicone pad; Preferably, the thickness of the buffer pad is 8-12 mm.

6. The correction method according to any one of claims 2 to 5, characterized in that: The pressurizing device in step (3) includes a single-point hydraulic press; Preferably, a buffer block is provided at one end of the hydraulic head of the single-point hydraulic press close to the LCD copper target assembly; Preferably, the thickness of the buffer block is 30 to 50 mm; Preferably, the width of the buffer block is 30-50 mm; Preferably, the buffer block is made of wood.

7. The correction method according to any one of claims 3 to 6, characterized in that: The ambient temperature of the static treatment in step (3) is 20-30° C. Preferably, the standing treatment time in step (3) is 10 to 14 hours.

8. The correction method according to any one of claims 2 to 7, characterized in that: The pressing depth of the center point in step (3) is 18 to 23 mm; Preferably, the holding time of the center point in step (3) is 7 to 10 minutes.

9. The correction method according to any one of claims 2 to 8, characterized in that: The pressing depth of the two ends in step (3) is 12 to 17 mm; Preferably, the pressure holding time at both ends in step (3) is 5 to 8 minutes; Preferably, the two ends of step (3) are 95 to 105 mm away from the end of the LCD copper target assembly.

10. The correction method according to any one of claims 2 to 9, characterized in that: If after the static treatment in step (3), the flatness of the LCD copper target assembly is detected to be not within the range of -1 to 0.5 mm, the correction method further comprises step (4); Preferably, the step (4) comprises: according to the flatness obtained by detection, repeating the pressurization, pressure release and static treatment of step (3) until the flatness of the LCD copper target assembly meets -1 to 0.5 mm.

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