Current fluctuation resistant electrode and preparation method thereof

Abstract

The invention provides a current fluctuation resistant electrode and a preparation method thereof. The current fluctuation resistant electrode comprises an electrode substrate; a bonding layer formed on the electrode substrate; an active coating layer including a first active coating layer, a second active coating layer, and a third active coating layer sequentially formed on the adhesive layer, and wherein the first active coating layer, the second active coating layer, and the third active coating layer each independently contain a metal oxide, and compositions of the first active coating layer, the second active coating layer, and the third active coating layer are different from each other; and a surface protection layer formed on the third active coating layer. The active coating has different electrochemical properties. The bonding layer and the active coating on the bonding layer are included in the electrode together, so that the performance stability of the electrode under high current fluctuation can be effectively improved. And the surface protection layer formed on the third active coating can further enhance the corrosion resistance and impact resistance of the electrode.

Description

Technical Field

[0001] The present invention relates to the field of electrochemistry, and in particular to an electrode resistant to current fluctuation and a preparation method thereof. Background Art

[0002] Electrochemical reactions play a vital role in the conversion and storage of sustainable energy, especially in the fields of water electrolysis to produce hydrogen, supercapacitors and batteries. As the core component of electrochemical reactions, the performance of electrode materials directly affects the efficiency and durability of electrochemical systems. However, in practical applications, electrodes often face severe challenges of high current density and current fluctuations, which not only tests the stability of the electrodes, but is also a difficult problem in electrode material research.

[0003] In the process of hydrogen production by water electrolysis, electrodes need to work at higher current density to achieve efficient hydrogen generation. However, severe electrochemical stress is easily generated on the electrode surface when operating at high current density, resulting in peeling of electrode materials, structural damage and reduction of active sites. In energy storage devices such as supercapacitors and batteries, electrode materials also need to maintain stable electrochemical properties under variable load conditions to ensure efficient storage and release of energy.

[0004] Traditional electrode materials, such as single metal oxides or precious metal coatings, have certain electrocatalytic activity, but their stability is often difficult to meet the requirements of long-term operation under high current density and current fluctuation environments. For example, when the electrode works under high current density, the bonding force between the active coating and the substrate may be insufficient, causing the coating to fall off; and under conditions of frequent current fluctuations, the electrode material is prone to structural changes due to electrochemical stress, reducing the catalytic efficiency. At the same time, corrosive substances in the electrolyte environment will also corrode the electrode material and shorten the electrode life.

[0005] In view of the above problems, the industry has been exploring and researching new electrode materials that can effectively resist current fluctuations and improve electrochemical stability. Ideal electrode materials should have the following characteristics: maintain structural stability at high current density, be able to resist mechanical and electrochemical stress caused by current fluctuations, and have excellent electrocatalytic performance and corrosion resistance. However, the electrode materials currently on the market experience electrode material peeling and reduced catalytic activity under current fluctuations, resulting in particularly prominent problems with electrode performance and lifespan.

[0006] Therefore, researching and developing an electrode that is resistant to current fluctuations and can suppress the peeling of electrode materials under current fluctuations is of great significance for improving the service life of the electrode and enhancing the stability of the electrode. Summary of the invention

[0007] The main purpose of the present invention is to provide an electrode resistant to current fluctuations and a preparation method thereof, so as to solve the problem in the prior art that the electrode material peels off under current fluctuations, resulting in shortened electrode life and unstable performance.

[0008] In order to achieve the above-mentioned objectives, the present invention provides an electrode resistant to current fluctuations on one hand, which comprises: an electrode substrate; a bonding layer formed on the electrode substrate; an active coating comprising a first active coating, a second active coating and a third active coating formed in sequence on the bonding layer, wherein the first active coating, the second active coating and the third active coating each independently contain a metal oxide, and the compositions of the first active coating, the second active coating and the third active coating are different; and a surface protective layer formed on the third active coating.

[0009] Furthermore, the metal oxide is selected from one or more of the group consisting of iridium dioxide, ruthenium dioxide, manganese dioxide and cobalt tetroxide.

[0010] Further, the thickness of each of the first active coating layer, the second active coating layer and the third active coating layer is in the range of 10 to 100 nm.

[0011] Further, the first active coating contains iridium dioxide with a thickness of 10 to 100 nm; the second active coating contains ruthenium dioxide with a thickness of 10 to 100 nm, and the third active coating contains manganese dioxide or a mixture of manganese dioxide and cobalt tetroxide with a thickness of 10 to 100 nm.

[0012] Further, the surface protection layer comprises a material selected from conductive polyvinylidene fluoride and / or conductive polytetrafluoroethylene.

[0013] Further, the conductive polyvinylidene fluoride is selected from carbon nanotube-polyvinylidene fluoride composite materials and / or graphene-polyvinylidene fluoride composite materials, and the conductive polytetrafluoroethylene is selected from carbon nanotube-polytetrafluoroethylene composite materials and / or graphene-polytetrafluoroethylene composite materials.

[0014] Furthermore, the electrode substrate is titanium, nickel or stainless steel.

[0015] Furthermore, the electrode substrate is titanium.

[0016] Furthermore, the material of the bonding layer is selected from titanium dioxide and / or aluminum oxide.

[0017] In order to achieve the above-mentioned purpose, another aspect of the present invention provides a method for preparing the above-mentioned electrode resistant to current fluctuations provided in the present application, and the method for preparing the electrode resistant to current fluctuations includes: step S1, pretreatment of the electrode substrate, wherein the pretreatment includes pickling treatment; step S2, coating or depositing a bonding layer material on the pretreated electrode substrate, and sintering to form a bonding layer; step S3, sequentially forming a first active coating, a second active coating and a third active coating on the bonding layer; step S4, coating a surface protection layer on the third active coating.

[0018] Further, in step S2, coating or deposition is performed by a sol-gel method or a physical vapor deposition method.

[0019] Furthermore, in step S2, sintering is performed at a temperature of 350-400°C.

[0020] Furthermore, in step S2, the thickness of the adhesive layer is 100-300 nm.

[0021] Further, in step S3, the formation is performed by electrochemical deposition or chemical vapor deposition.

[0022] Further, in step S4, coating is performed by spin coating, dip coating or vacuum spray coating.

[0023] Further, in step S4, the thickness of the surface protection layer is 100-300 nm.

[0024] Furthermore, the method for preparing the electrode resistant to current fluctuations further includes: after step S4, performing annealing treatment on the electrode resistant to current fluctuations.

[0025] Furthermore, the annealing treatment temperature is 200-250° C., and the time is 1-2 hours.

[0026] By applying the technical solution of the present invention, the bonding layer on the electrode substrate provided by the present application can provide a strong bridge with excellent adhesion between the electrode substrate and the active coating, so that the active coating can be inhibited from falling off under high current fluctuations. The first active coating, the second active coating and the third active coating of the above-mentioned type formed on the bonding layer in sequence can construct a gradient structure due to different compositions, so that the first active coating, the second active coating and the third active coating can have different electrochemical properties, such as different catalytic activities, impact resistance, conductivity and corrosion resistance. By including the bonding layer and the active coating thereon at the same time, the performance stability of the electrode under high current fluctuations can be effectively improved. The surface protection layer formed on the third active coating can further enhance the corrosion resistance and impact resistance of the electrode.

[0027] In summary, the above-mentioned electrode resistant to current fluctuation provided by the present application can have improved lifespan characteristics and improved electrochemical stability. DETAILED DESCRIPTION

[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below in conjunction with the embodiments.

[0029] As described in the background technology section of the present application, the existing electrodes have the problem of electrode material peeling under current fluctuations, resulting in a shortened electrode life and unstable performance. In order to solve the above technical problems, the first aspect of the present application provides an electrode resistant to current fluctuations, wherein the electrode resistant to current fluctuations includes: an electrode substrate; an adhesive layer formed on the electrode substrate; an active coating, including a first active coating, a second active coating and a third active coating formed on the adhesive layer in sequence, and wherein the first active coating, the second active coating and the third active coating each independently contain a metal oxide, and the compositions of the first active coating, the second active coating and the third active coating are different; and a surface protective layer formed on the third active coating.

[0030] The bonding layer on the electrode substrate provided by the present application can provide a solid bridge with excellent adhesion between the electrode substrate and the active coating, so that the active coating can be inhibited from falling off under high current fluctuations. The first active coating, the second active coating and the third active coating of the above-mentioned type formed on the bonding layer in sequence can construct a gradient structure due to different compositions, so that different electrochemical properties, such as different catalytic activities, impact resistance, conductivity and corrosion resistance, can be made between the first active coating, the second active coating and the third active coating. The performance stability of the electrode under high current fluctuations can be effectively improved by including the bonding layer and the active coating thereon at the same time. The surface protection layer formed on the third active coating can further enhance the corrosion resistance and impact resistance of the electrode.

[0031] In summary, the above-mentioned electrode resistant to current fluctuation provided by the present application can have improved lifespan characteristics and improved electrochemical stability.

[0032] In a preferred embodiment, the metal oxide includes but is not limited to one or more of the group consisting of iridium dioxide (IrO2), ruthenium dioxide (RuO2), manganese dioxide (MnO2) and cobalt trioxide (Co3O4). The above-mentioned types of metal oxides have excellent catalytic activity and corrosion resistance, which are beneficial to improving the stability of the electrode. Among them, iridium dioxide and ruthenium dioxide are common electrocatalytic materials with high activity and good stability, and are particularly suitable for use in water decomposition reactions; manganese dioxide can provide good electrochemical performance at a low cost and is suitable for electrolysis applications in acidic and alkaline environments.

[0033] In a preferred embodiment, the thickness of each of the first active coating, the second active coating and the third active coating is in the range of 10 to 100 nm. The thickness of each of the first active coating, the second active coating and the third active coating includes but is not limited to the above range, and limiting it within the above range is conducive to suppressing the peeling of the electrode material, thereby improving the impact resistance of the electrode under current fluctuations, and further improving the life and stability of the electrode.

[0034] In order to further inhibit the peeling of the electrode material, thereby improving the impact resistance of the electrode under current fluctuations, improving the corrosion resistance and overall structural strength of the electrode, and thus significantly improving the service life of the electrode, in a preferred embodiment, the first active coating contains iridium dioxide with a thickness of 10 to 100 nm; the second active coating contains ruthenium dioxide with a thickness of 10 to 100 nm, and the third active coating contains manganese dioxide or a mixture of manganese dioxide and cobalt tetraoxide with a thickness of 10 to 100 nm. By controlling the composition and thickness of the first active coating, the second active coating and the third active coating within the above range, it is beneficial to effectively alleviate the impact of current fluctuations on the electrode, thereby improving the service life of the electrode. In addition, it is also beneficial to achieve improved electrolytic activity and current response speed, thereby improving electrolytic efficiency. There is no particular restriction on the molar ratio of manganese dioxide to cobalt tetraoxide in the mixture of manganese dioxide and cobalt tetraoxide, and the ratio commonly used in the art can be adopted.

[0035] In a preferred embodiment, the surface protection layer includes but is not limited to conductive polyvinylidene fluoride and / or conductive polytetrafluoroethylene. The above-mentioned surface protection layer materials have high toughness and good corrosion resistance, which is conducive to effectively alleviating the erosion of the electrode active coating by current fluctuations and environmental media.

[0036] In order to further effectively alleviate the corrosion of the electrode active coating by current fluctuations and environmental media, in a preferred embodiment, the conductive polyvinylidene fluoride includes but is not limited to carbon nanotube-polyvinylidene fluoride composite materials and / or graphene-polyvinylidene fluoride composite materials, and the conductive polytetrafluoroethylene includes but is not limited to carbon nanotube-polytetrafluoroethylene composite materials and / or graphene-polytetrafluoroethylene composite materials.

[0037] In a preferred embodiment, the electrode substrate is titanium, nickel or stainless steel. The use of the above electrode substrate is conducive to maintaining the structural integrity of the electrode under high current density and current fluctuation environment. Among them, nickel has high conductivity and good alkali resistance, and is particularly stable under alkaline electrolyte conditions. Stainless steel is widely used because of its low cost and good corrosion resistance.

[0038] In order to further maintain the structural integrity of the electrode under high current density and current fluctuation environment, in a preferred embodiment, the electrode substrate is titanium. Titanium is the preferred substrate material because the titanium oxide layer formed on its surface has good self-healing and corrosion resistance.

[0039] In a preferred embodiment, the material of the bonding layer includes but is not limited to titanium dioxide and / or aluminum oxide. The material of the bonding layer has strong corrosion resistance and chemical stability, which is conducive to inhibiting the active coating from falling off under high current fluctuations. Titanium dioxide is a semiconductor material with good electrical conductivity, and its surface can adsorb hydroxide ions, which is conducive to improving the overall electrochemical activity of the electrode; aluminum oxide has good dielectric properties and thermal stability, and can maintain structural stability under high temperature conditions.

[0040] The second aspect of the present application also provides a method for preparing the above-mentioned electrode resistant to current fluctuations provided by the present application, wherein the method for preparing the electrode resistant to current fluctuations includes: step S1, pre-treating the electrode substrate, wherein the pre-treatment includes pickling treatment; step S2, coating or depositing a bonding layer material on the pre-treated electrode substrate, and sintering to form a bonding layer; step S3, sequentially forming a first active coating, a second active coating and a third active coating on the bonding layer; step S4, coating a surface protection layer on the third active coating.

[0041] Pretreatment of the electrode substrate includes pickling treatment, which can remove oxides and impurities on the surface of the electrode substrate, and can form a microscopic concavoconvex structure on the substrate surface, thereby improving the roughness of the electrode substrate surface, increasing the bonding area of ​​the bonding layer on the substrate, and thus improving the adhesion of the bonding layer. The material of the bonding layer coated or deposited on the pretreated electrode substrate provides a strong bridge with excellent adhesion between the electrode substrate and the active coating, which can inhibit the active coating from falling off under high current fluctuations. Sintering the material of the bonding layer can melt the bonding layer particles at high temperatures, and can achieve good interlayer adhesion, thereby providing a good substrate for the subsequent deposition of the active coating. Sequentially forming the first active coating, the second active coating, and the third active coating on the bonding layer can enable each layer to construct a gradient structure due to different compositions, so that the first active coating, the second active coating, and the third active coating have different electrochemical properties, such as different catalytic activity, impact resistance, conductivity, and corrosion resistance. Coating a surface protective layer on the third active coating can further enhance the corrosion resistance and impact resistance of the electrode.

[0042] In a preferred embodiment, the pretreatment further comprises: washing with deionized water after the pickling treatment. The above washing step is beneficial to inhibiting the secondary corrosion of the electrode substrate by the residual acid solution.

[0043] In a preferred embodiment, the pretreatment further comprises: drying after washing with deionized water. The above drying step is helpful to ensure that there is no water residue on the surface of the electrode substrate.

[0044] In a preferred embodiment, the active coating is formed by electrochemical deposition or chemical vapor deposition (CVD). The above method is conducive to achieving layer-by-layer deposition of different materials.

[0045] In order to further facilitate providing a strong bridge with excellent adhesion between the electrode substrate and the active coating, thereby inhibiting the active coating from falling off under high current fluctuations, in a preferred embodiment, in step S2, coating or deposition is performed by a sol-gel method or a physical vapor deposition (PVD) method. The advantage of the sol-gel method is that a uniform film can be formed at a lower temperature and its thickness is easy to control; the PVD method can deposit a high-purity oxide film in a vacuum environment, which is conducive to ensuring the compactness of the bonding layer.

[0046] In a preferred embodiment, in step S2, sintering is performed at a temperature of 350-400° C. The sintering temperature includes but is not limited to the above range, and limiting it to the above range is beneficial to improving the corrosion resistance and mechanical strength of the bonding layer.

[0047] In a preferred embodiment, in step S2, the thickness of the bonding layer is 100-300 nm. The thickness of the bonding layer includes but is not limited to the above range, which is conducive to achieving good interlayer adhesion, thereby providing a good substrate for the deposition of the active coating.

[0048] The present application has no particular restrictions on the method for forming the active coating, and a common method in the art can be used. In a preferred embodiment, in step S3, the active coating is formed by electrochemical deposition or chemical vapor deposition. The above method is conducive to ensuring the uniformity of the coating.

[0049] In a preferred embodiment, in step S4, coating is performed by spin coating, dip coating or vacuum spray coating. Spin coating is conducive to forming a uniform protective layer on the electrode surface, and is conducive to forming a coating with low thickness requirements; dip coating is conducive to forming a protective coating for electrodes of complex shapes, and is conducive to ensuring uniform coverage of the material on the electrode surface; vacuum spray coating (sputtering deposition) is conducive to depositing a high-density coating under low temperature conditions.

[0050] In order to further enhance the corrosion resistance and impact resistance of the electrode, in a preferred embodiment, in step S4, the thickness of the surface protection layer is 100-300 nm.

[0051] In a preferred embodiment, the method for preparing an electrode resistant to current fluctuations further includes: after step S4, annealing the electrode resistant to current fluctuations. Annealing is beneficial to eliminating the microstructural stress generated during the preparation process, thereby improving the bonding force and overall strength between the coatings. Annealing is beneficial to causing slight physical shrinkage of each layer of material, making the interlayer bonding closer, thereby significantly enhancing the impact resistance and durability of the electrode, and is particularly suitable for long-term electrochemical applications with high current density.

[0052] In order to further improve the overall structural stability of the electrode, in a preferred embodiment, the annealing temperature is 200-250° C. and the time is 1-2 h.

[0053] In a preferred embodiment, the annealing treatment is performed under the protection of nitrogen or other inert gases. Annealing treatment in a nitrogen environment is beneficial to inhibiting the oxidation reaction of the material, thereby avoiding the degradation of the performance of the coating.

[0054] In a preferred embodiment, the electrode after annealing is cleaned and dried. The above cleaning and drying processes are helpful to remove the residues on the surface of the electrode, thereby ensuring that the surface of the electrode is free of impurities.

[0055] Preferably, the cleaning is performed using deionized water and / or ethanol. Using the above-mentioned types of solvents is beneficial to ensure that the electrode surface is clean.

[0056] In a preferred embodiment, after the above cleaning and drying treatments, the electrode edge is sealed. The above sealing treatment is beneficial to inhibiting the infiltration of electrolytes in the environment, thereby improving the long-term application effect of the electrode.

[0057] In order to facilitate the application of the packaging material in high current fluctuation scenarios and to have excellent stability and service life after being installed in an electrolytic cell or energy storage device, in a preferred embodiment, the packaging material is corrosion-resistant epoxy resin or silicone rubber.

[0058] The present application is further described in detail below in conjunction with specific embodiments. These embodiments should not be construed as limiting the scope of protection claimed in the present application.

[0059] Example 1

[0060] A method for preparing an electrode resistant to current fluctuations, comprising:

[0061] (1) immersing the titanium substrate in 10% hydrochloric acid for pickling for 2.5 hours, washing the pickled titanium substrate with deionized water, and then drying to obtain a pretreated titanium substrate;

[0062] (2) Titanium dioxide is deposited on the pretreated titanium substrate by physical vapor deposition, wherein the process parameters of the physical vapor deposition method are: the vacuum degree of the deposition chamber is 2×10 -3 Pa, the deposition temperature is 300°C, the deposition time is 30 min; then it is sintered at 350°C to form a bonding layer with a thickness of 150 nm;

[0063] (3) depositing iridium dioxide as a first active coating on the bonding layer by chemical vapor deposition, the thickness of the first active coating being 58 nm, wherein the process conditions of the chemical vapor deposition method are: a deposition temperature of 300° C. and a deposition time of 1 h; depositing ruthenium dioxide as a second active coating on the first active coating, the thickness of the second active coating being 60 nm, wherein the process conditions of the chemical vapor deposition method are: a deposition temperature of 280° C. and a deposition time of 1.5 h; and depositing manganese dioxide and cobalt oxide as a third active coating in a molar ratio of 1:1 on the second active coating, the thickness of the third active coating being 70 nm, wherein the process conditions of the chemical vapor deposition method are: a deposition temperature of 300° C. and a deposition time of 2 h;

[0064] (4) coating the graphene-polytetrafluoroethylene composite material on the third active coating layer by spin coating to form a surface protection layer with a thickness of 200 nm to obtain an electrode resistant to current fluctuations;

[0065] (5) The electrode resistant to current fluctuation is subjected to annealing treatment, wherein the annealing temperature is 200° C., the time is 2 h, and the protective gas is nitrogen.

[0066] Example 2

[0067] The difference from Example 1 is that in step (3), the first active coating is iridium dioxide with a thickness of 100 nm; the second active coating is ruthenium dioxide with a thickness of 100 nm, and the third active coating is manganese dioxide with a thickness of 100 nm.

[0068] Example 3

[0069] The difference from Example 1 is that in step (3), the thickness of the first active coating layer is 5 nm; the thickness of the second active coating layer is 7 nm, and the thickness of the third active coating layer is 9 nm.

[0070] Comparative Example 1

[0071] The difference from Example 1 is that step (3) is not performed, and the first active coating, the second active coating and the third active coating are not deposited on the above-mentioned bonding layer.

[0072] Comparative Example 2

[0073] The difference from Example 1 is that in step (3), the third active coating is not deposited on the second active coating.

[0074] Comparative Example 3

[0075] The difference from Example 1 is that step (4) is not performed and the above-mentioned surface protection layer is not formed.

[0076] Performance test methods and test results

[0077] Test method:

[0078] (1) High current density (4000~8000A / m 2 ) Fluctuation stability: before and after 1 hour of testing, the highest cell voltage V1, the lowest cell voltage V2, the average voltage V, stability = (V1-V2) / V*100%;

[0079] (2) Lifespan: 5000A / m 2 Under current density, voltage decay rate is <10%;

[0080] (3) Current response rate: the rate at which current rises and falls per unit time under stable operation conditions.

[0081] The test results are shown in Table 1.

[0082] Table 1

[0083]

[0084] From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: the bonding layer on the electrode substrate provided by the present application can provide a strong bridge with excellent adhesion between the electrode substrate and the active coating, thereby preventing the active coating from falling off under high current fluctuations. The first active coating, the second active coating and the third active coating of the above-mentioned types formed on the bonding layer in sequence can construct a gradient structure due to different compositions, so that the first active coating, the second active coating and the third active coating can have different electrochemical properties, such as different catalytic activities, impact resistance, conductivity and corrosion resistance. By including the bonding layer and the active coating thereon at the same time, the performance stability of the electrode under high current fluctuations can be effectively improved. The surface protection layer formed on the third active coating can further enhance the corrosion resistance and impact resistance of the electrode.

[0085] In summary, the above-mentioned electrode resistant to current fluctuation provided by the present application can have improved lifespan characteristics and improved electrochemical stability.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electrode resistant to current fluctuations, characterized in that: The electrode resistant to current fluctuations comprises: Electrode substrate, A bonding layer is formed on the electrode substrate, an active coating layer, comprising a first active coating layer, a second active coating layer and a third active coating layer sequentially formed on the bonding layer, wherein the first active coating layer, the second active coating layer and the third active coating layer each independently contain a metal oxide, and the first active coating layer, the second active coating layer and the third active coating layer have different compositions, and A surface protection layer is formed on the third active coating layer.

2. The electrode resistant to current fluctuation according to claim 1, characterized in that: The metal oxide is selected from one or more of the group consisting of iridium dioxide, ruthenium dioxide, manganese dioxide and cobalt tetroxide.

3. The electrode resistant to current fluctuation according to claim 2, characterized in that: The thickness of each of the first active coating layer, the second active coating layer and the third active coating layer is in the range of 10 to 100 nm.

4. The electrode resistant to current fluctuation according to claim 2, characterized in that: The first active coating comprises iridium dioxide with a thickness of 10 to 100 nm; the second active coating comprises ruthenium dioxide with a thickness of 10 to 100 nm, and the third active coating comprises manganese dioxide or a mixture of manganese dioxide and cobalt tetroxide with a thickness of 10 to 100 nm.

5. The electrode resistant to current fluctuation according to any one of claims 1 to 4, characterized in that: The surface protection layer comprises a material selected from conductive polyvinylidene fluoride and / or conductive polytetrafluoroethylene; Preferably, the conductive polyvinylidene fluoride is selected from carbon nanotube-polyvinylidene fluoride composite materials and / or graphene-polyvinylidene fluoride composite materials, and the conductive polytetrafluoroethylene is selected from carbon nanotube-polytetrafluoroethylene composite materials and / or graphene-polytetrafluoroethylene composite materials.

6. The electrode resistant to current fluctuation according to any one of claims 1 to 4, characterized in that: The electrode substrate is titanium, nickel or stainless steel; Preferably, the electrode substrate is titanium.

7. The electrode resistant to current fluctuation according to any one of claims 1 to 4, characterized in that: The material of the bonding layer is selected from titanium dioxide and / or aluminum oxide.

8. A method for preparing an electrode resistant to current fluctuation according to any one of claims 1 to 7, characterized in that: The method for preparing the electrode resistant to current fluctuations comprises: Step S1, pre-treating the electrode substrate, wherein the pre-treatment includes pickling treatment, Step S2, coating or depositing a bonding layer material on the pretreated electrode substrate, and sintering to form the bonding layer, Step S3, sequentially forming a first active coating, a second active coating and a third active coating on the bonding layer, Step S4, coating a surface protection layer on the third active coating layer.

9. The method for preparing an electrode resistant to current fluctuation according to claim 8, characterized in that: In the step S2, the coating or deposition is performed by a sol-gel method or a physical vapor deposition method; Preferably, in the step S2, the sintering is performed at a temperature of 350 to 400°C; Preferably, in step S2, the thickness of the bonding layer is 100 to 300 nm; Preferably, in the step S3, the forming is performed by electrochemical deposition or chemical vapor deposition; Preferably, in the step S4, the coating is performed by spin coating, dip coating or vacuum spray coating; Preferably, in step S4, the thickness of the surface protection layer is 100-300 nm.

10. The method for preparing an electrode resistant to current fluctuation according to claim 8 or 9, characterized in that: The method for preparing the electrode resistant to current fluctuations further includes: after step S4, annealing the electrode resistant to current fluctuations; Preferably, the annealing treatment is performed at a temperature of 200 to 250° C. and for a time of 1 to 2 hours.

Images