Three-dimensional scanning-based measurement method, three-dimensional scanning device, and three-dimensional scanning system

By binding marker point data and adapter type to a 3D scanning system, the mapping relationship of workpiece features is obtained, which solves the accuracy and efficiency problems of not being able to directly contact the workpiece and realizes a high-precision, low-environment-dependent measurement method.

CN119756180BActive Publication Date: 2026-06-09SCANTECH (HANGZHOU) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SCANTECH (HANGZHOU) CO LTD
Filing Date
2024-12-31
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing technologies suffer from insufficient accuracy and low efficiency when measuring the geometric tolerances of workpieces, especially those that cannot be directly contacted, and also have high environmental requirements.

Method used

A measurement method based on 3D scanning is adopted. By binding the marker point data and type through an adapter, the feature type of the feature to be measured is determined, and the mapping relationship between the working surface of the adapter and the marker points is obtained. The features of the feature to be measured are then obtained using a 3D scanning system.

Benefits of technology

It improves the measurement accuracy and efficiency for workpieces that cannot be directly contacted, reduces environmental requirements, and is especially suitable for rapid measurement of large workpieces.

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Abstract

This application discloses a measurement method, a 3D scanning device, and a 3D scanning system based on 3D scanning. The measurement method is applicable to both the 3D scanning device and the 3D scanning system. The method includes: adapter fabrication, used to bind marker point data of several marker points to the adapter type, and to obtain a first mapping relationship between the working surface of the adapter and the marker points; adapter definition, used to determine the feature type of the feature to be measured; and adapter measurement, where the adapter is placed on the support of the feature to be measured, and the first feature of the feature to be measured is determined based on the marker point data, the first mapping relationship, and the feature type. Through the above setup, features that cannot be directly contacted can be scanned, and the efficiency and accuracy of obtaining the first feature of the feature to be measured are improved.
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Description

Technical Field

[0001] This application relates to the field of three-dimensional scanning technology, and in particular to measurement methods, three-dimensional scanning devices and three-dimensional scanning systems based on three-dimensional scanning. Background Technology

[0002] Current technology requires measuring the geometric tolerances of workpieces, such as thickness, flatness, and cylindricity, to verify their conformity. Before measurement, the geometric features of the workpiece need to be reconstructed. Current reconstruction methods include: scanning the workpiece's point cloud data using a 3D scanning device and fitting the point cloud data to output the required features; using a tracking measuring light pen to detect multiple feature points on the workpiece surface and fitting the workpiece features using these feature points; and using a contact coordinate measuring machine (CMM) where the measuring probe contacts the workpiece and acquires feature points on the workpiece surface to fit the required features. However, these reconstruction methods require specialized measuring equipment, and the operation of such equipment is relatively complex, resulting in low efficiency. Furthermore, these measuring equipment have high environmental requirements, and the environment significantly affects the measurement accuracy. Therefore, if the environmental requirements cannot be met, the accuracy of the reconstruction methods will be insufficient.

[0003] Finally, for workpieces that cannot be directly contacted but can only be contacted indirectly, the existing technology cannot achieve the measurement of the aforementioned workpieces.

[0004] Therefore, improving the accuracy and efficiency of acquiring workpiece features and measuring workpieces that cannot be directly contacted are urgent technical problems that need to be solved in this field. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this application is to provide a measurement method, a three-dimensional scanning device, and a three-dimensional scanning system based on three-dimensional scanning, which can scan features that cannot be directly contacted and improve the efficiency and accuracy of acquiring the first feature of the feature to be measured.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] A measurement method based on 3D scanning is applicable to 3D scanning systems. The method includes: adapter fabrication for binding marker point data of several marker points with the adapter type; adapter definition for determining the feature type of the feature to be measured and obtaining a first mapping relationship between the working surface of the adapter and the marker points; and adapter measurement, where the adapter is placed on the support of the feature to be measured, and a first feature of the feature to be measured is determined based on the marker point data, the first mapping relationship, and the feature type of the feature to be measured.

[0008] Furthermore, this measurement method based on three-dimensional scanning includes:

[0009] Adapter creation: Obtain the adapter type; Place several marker points on the adapter, and bind the marker point data of the marker points to the adapter type, wherein the marker point data includes positioning data and identification data bound to the adapter type;

[0010] Adapter definition: Determine the feature type of the feature to be measured; select at least one working surface on the adapter, and obtain the first mapping relationship between the working surface and the positioning data of the marker points;

[0011] Adapter measurement: The adapter is placed on the carrier of the feature to be measured, and the marker point data on the adapter is acquired; the position of the working surface in the 3D scan is determined according to the marker point data and the first mapping relationship; the first feature of the feature to be measured is determined based on the position of the working surface and the feature type of the feature to be measured.

[0012] Furthermore, the adapter definition also includes: determining a second feature of the feature to be measured, the second feature being different from the first feature; and determining a first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured, including: determining the first feature of the feature to be measured based on the position of the working surface, the second feature, and the feature type of the feature to be measured.

[0013] Furthermore, based on the location of the working surface and the feature type of the feature to be measured, the first feature of the feature to be measured is determined, including: obtaining the contact position between the feature to be measured and the working surface; determining the second mapping relationship between the contact position and the marker point according to the location of the working surface, the second feature and the first mapping relationship; and determining the first feature of the feature to be measured based on the second mapping relationship and the feature type of the feature to be measured.

[0014] Furthermore, based on the location of the working surface and the feature type of the feature to be measured, the first feature of the feature to be measured is determined, including: obtaining the contact position between the feature to be measured and the working surface; determining the second mapping relationship between the contact position and the marker point according to the location of the working surface and the first mapping relationship; and determining the first feature of the feature to be measured based on the second mapping relationship and the feature type of the feature to be measured.

[0015] Furthermore, obtaining the adapter type includes: scanning the adapter to obtain the adapter type; or configuring the adapter as a preset model with a known type to obtain the adapter type.

[0016] Furthermore, binding the marker data of several marker points to the type of the adapter includes: scanning and acquiring the identification data of several marker points; matching the acquired adapter type with the identification data of several marker points to bind the identification data of several marker points to the type of the adapter.

[0017] To achieve the above objectives, this application adopts the following technical solution:

[0018] A three-dimensional scanning device includes an adapter manufacturing module, an adapter definition module, and an adapter measurement module. The adapter manufacturing module is used to bind the marker point data of several marker points to the type of the adapter. The adapter definition module is used to determine the feature type of the feature to be measured and obtain the first mapping relationship between the working surface of the adapter and the marker points. When the adapter is placed on the carrier of the feature to be measured, the adapter measurement module determines the first feature of the feature to be measured based on the marker point data, the first mapping relationship, and the feature type of the feature to be measured.

[0019] Furthermore, the adapter manufacturing module can acquire the adapter type; and / or, the adapter manufacturing module can bind the marker point data of several marker points to the adapter type, wherein the marker point data includes positioning data and identification data bound to the adapter type; and / or, the adapter definition module can select at least one working surface on the adapter and acquire a first mapping relationship between the working surface and the positioning data of the marker points; and / or, the adapter definition module can determine the feature type of the feature to be measured; and / or, the adapter definition module can determine a second feature of the feature to be measured, the second feature being different from the first feature; and / or, the adapter measurement module can acquire the marker point data on the adapter when the adapter is placed on the carrier of the feature to be measured; and / or, the adapter measurement module can determine the position of the working surface in the 3D scan based on the marker point data and the first mapping relationship; and / or, the adapter measurement module can determine the first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured; and / or, the adapter measurement module can determine the first feature of the feature to be measured based on the position of the working surface, the second feature, and the feature type of the feature to be measured.

[0020] To achieve the above objectives, this application adopts the following technical solution:

[0021] A three-dimensional scanning system includes the three-dimensional scanning device described above.

[0022] The aforementioned 3D scanning-based measurement method, 3D scanning device, and 3D scanning system can scan features that cannot be directly contacted, i.e., they can scan features that can only be indirectly contacted. Secondly, the 3D scanning-based measurement method of this application has lower environmental requirements, thereby improving the accuracy of acquiring the first feature of the feature to be measured. Finally, for 3D point cloud measurement systems, the 3D scanning-based measurement method of this application does not require fitting the point cloud into a feature before measuring the feature, which is especially beneficial for large features to be measured, thus improving the efficiency of acquiring the first feature of the feature to be measured. Attached Figure Description

[0023] Figure 1A hardware structure block diagram of a terminal for a measurement method based on three-dimensional scanning provided in an embodiment of this application.

[0024] Figure 2 A flowchart of a measurement method based on three-dimensional scanning provided in an embodiment of this application.

[0025] Figure 3 The flowchart below shows the specific steps of step S1 in the measurement method based on three-dimensional scanning provided in the embodiments of this application.

[0026] Figure 4 This is a first specific flowchart of a measurement method based on three-dimensional scanning provided in an embodiment of this application.

[0027] Figure 5 This is a second specific flowchart of a measurement method based on three-dimensional scanning provided in an embodiment of this application.

[0028] Figure 6 The flowchart below shows the specific steps of step S2 in the measurement method based on three-dimensional scanning provided in the embodiments of this application.

[0029] Figure 7 The flowchart below shows the specific steps of step S3 in the measurement method based on three-dimensional scanning provided in the embodiments of this application.

[0030] Figure 8 This is a first specific flowchart of step S33 in the measurement method based on three-dimensional scanning provided in the embodiments of this application.

[0031] Figure 9 This is a second specific flowchart of step S33 in the measurement method based on three-dimensional scanning provided in the embodiments of this application.

[0032] Figure 10 This is a schematic diagram of the adapter provided in an embodiment of this application.

[0033] Figure 11 A cross-sectional view of the adapter provided in an embodiment of this application.

[0034] Figure 12 This is a schematic diagram of another structure of the adapter provided in an embodiment of this application.

[0035] Figure 13 This is a structural cross-sectional view of the fastener of the adapter provided in an embodiment of this application.

[0036] Figure 14 This is a structural block diagram of a three-dimensional scanning device according to an embodiment of this application. Detailed Implementation

[0037] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0038] It should be noted that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. "A plurality" or "several" indicates at least two. Unless otherwise stated, terms such as "front," "back," "left," "right," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0039] The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0040] The method embodiments provided in this example can be executed on terminal 100, a computer, or a similar computing device. For example, it can be run on terminal 100. Figure 1 This is a hardware structure block diagram of a terminal 100 that executes a measurement method based on three-dimensional scanning according to an embodiment of this application. Figure 1 As shown, terminal 100 may include one or more ( Figure 1 Only one is shown in the diagram. A processor 11 and a memory 12 for storing data are also shown. The processor 11 may be, but is not limited to, a microprocessor unit (MCU) or a field-programmable gate array (FPGA). The terminal 100 may also include a transmission device 13 for communication functions and an input / output device 14. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the terminal 100 described above. For example, the terminal 100 may also include components that are larger than those described above. Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown are illustrated.

[0041] The memory 12 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to a measurement method based on three-dimensional scanning in this embodiment. The processor 11 executes various functional applications and data processing by running the computer program stored in the memory 12, thereby implementing the aforementioned method. The memory 12 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 12 may further include remotely located memories 12 relative to the processor 11, which can be connected to the terminal 100 via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0042] The transmission device 13 is used to receive or send data via a network. This network includes a wireless network provided by the communication provider of terminal 100. In one example, the transmission device 13 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 13 can be a Radio Frequency (RF) module for wireless communication with the Internet.

[0043] This embodiment provides a measurement method based on three-dimensional scanning. Figure 2 This is a flowchart of a measurement method based on three-dimensional scanning according to an embodiment of this application. The measurement method based on three-dimensional scanning is applicable to a three-dimensional scanning system and is used to scan the feature to be measured that cannot be directly contacted, that is, the measurement method based on three-dimensional scanning is used to scan the feature to be measured that can only be indirectly contacted.

[0044] It should be noted that the measurement method based on three-dimensional scanning in this application embodiment can also be applied to the features to be measured that can be directly contacted.

[0045] It should be noted that the measurement method based on three-dimensional scanning in this application embodiment is described using an example of a feature to be measured that can be applied to indirect contact.

[0046] like Figure 2 As shown, this measurement method based on 3D scanning includes the following steps:

[0047] S1: Adapter creation, used to bind the marker data of several marker points to the adapter type.

[0048] S2: Adapter definition, used to determine the feature type of the feature to be tested and to obtain the first mapping relationship between the working surface of the adapter and the marker points.

[0049] For example, in step S1, the number of marker points can be one, in which case the marker point is an coded marker point. Alternatively, the number of marker points can be at least four, in which case the marker points are ordinary circular marker points.

[0050] For example, the markers can be reflective or self-illuminating. That is, this application does not limit the number or type of markers.

[0051] For example, in step S1, the marker data includes, but is not limited to, the number of markers, the relative positions between markers, the size of markers, and the shape of markers.

[0052] For example, in step S1, after binding the marker data of several marker points with the adapter type, the marker data can be mapped to the corresponding adapter type, thereby improving the efficiency of adapter type identification. Specifically, after binding the marker data with the adapter type, the binding relationship can be stored in the memory 12, which facilitates subsequent operations such as calling or identifying the binding relationship by the processor 11.

[0053] For example, in step S2, the marker point data can be acquired through the input / output device 14 and transmitted to the memory 12 through the transmission device 13, thereby enabling the processor 11 to access the data acquired by the input / output device 14. The transmission device 13 and the input / output device 14 can be components of a 3D scanning system. Alternatively, the input / output device 14 can be the 3D scanning system itself, and the transmission device 13 can be other wireless transmission devices.

[0054] For example, in step S2, the adapter includes at least one working surface for contacting the feature to be measured to form a contact position. In this application, a first mapping relationship between the working surface of the adapter and the marker point can be obtained through the input / output device 14. Specifically, this application obtains the first mapping relationship between the working surface of the adapter and the marker point through a three-dimensional scanning system. Through the above settings, the relative relationship between the working surface of the adapter and the marker point can be converted through the first mapping relationship.

[0055] As one implementation method, a 3D scanning system includes a monocular vision camera or a multi-view vision camera. The monocular vision camera or multi-view vision camera is used to perform spatial 3D reconstruction of the adapter to obtain marker point data such as the coordinates and number of marker points on the adapter.

[0056] Similarly, using a monocular or multi-view camera, the first mapping relationship between the adapter's working surface and the marker points can also be obtained.

[0057] In step S2, the feature type of the feature to be measured is input into the memory 12, enabling the processor 11 to obtain the feature to be measured, such as a point, line, surface, circle, cylinder, cone, sphere, threaded hole, stud, etc., using the 3D scanning-based measurement method of this application. This facilitates subsequent feature acquisition of the feature to be measured. Specifically, after the processor 11 obtains the feature type and adapter type of the feature to be measured from the memory 12, the processor 11 can obtain the specific feature type of the feature to be measured using the 3D scanning-based measurement method of this application.

[0058] S3: Adapter measurement, the adapter is placed on the carrier of the feature to be measured, and the first feature of the feature to be measured is determined based on the marker point data, the first mapping relationship and the feature type of the feature to be measured.

[0059] In step S3, since the feature to be measured can be a virtual body, such as a threaded hole, the adapter needs to be placed on the carrier of the feature to be measured so that the carrier can support the adapter, which is beneficial to the measurement of the feature to be measured.

[0060] It is understandable that when the feature to be measured is a solid, such as a cylinder or a cone, then the carrier of the feature to be measured is itself.

[0061] For example, since the memory 12 can record marker point data, in step S3, the 3D scanning system first identifies the marker points, and then registers the identified marker point data with the marker point data recorded by the memory 12 in step S1. This results in a coordinate transformation matrix based on the marker point data and the first mapping relationship. The coordinate transformation matrix determines the mapping relationship between the adapter's working surface and the marker points during the measurement process, and further determines the first feature of the feature to be measured based on its feature type. The coordinate transformation matrix includes a translation matrix and a rotation matrix.

[0062] Through the above settings, the 3D scanning-based measurement method of this application can scan features that cannot be directly contacted, i.e., it can scan features that can only be indirectly contacted. Secondly, the 3D scanning-based measurement method of this application has low environmental requirements, meaning it can be applied to on-site measurements. Therefore, the environment has a lower impact on the method, resulting in higher accuracy in acquiring the first feature of the target feature. Finally, for 3D point cloud measurement systems, the 3D scanning-based measurement method of this application does not require fitting the point cloud into a feature structure before measuring the feature. Especially for large features, the efficiency of acquiring the feature structure is high, which helps improve the efficiency of acquiring the first feature of the target feature.

[0063] As one implementation method, let's take a threaded hole as an example, where the feature to be measured is the central axis of the threaded hole, and the feature parameter to be measured is the central axis of the threaded hole. In this case, the adapter can be a hemispherical structure, with the marker point located at the center of the adapter. Specifically, the hemispherical adapter is placed on the support where the threaded hole is located, so that the spherical surface of the hemisphere contacts the threaded hole. The spherical surface of the hemisphere is the working surface of the adapter. At this point, regardless of the position of the hemispherical structure, its center is always located on the central axis of the threaded hole. Furthermore, the first mapping relationship between the working surface of the adapter and the marker point, the feature type of the feature to be measured, and the marker point data are known. Therefore, by obtaining the position of the marker point, the position of the central axis of the threaded hole can be obtained, thus obtaining the first feature.

[0064] like Figure 3 , Figure 4 and Figure 5 As shown, as one implementation method, step S1 includes the following steps:

[0065] S11: Get the type of the adapter.

[0066] The type of adapter obtained is not unique. For example, such as Figure 4 As shown, step S11 includes:

[0067] S111: Scan adapters to obtain the adapter type.

[0068] In step S111, a monocular vision camera or a multi-view vision camera can be used to perform spatial three-dimensional reconstruction of the adapter to obtain the type of the adapter.

[0069] Or, such as Figure 5 As shown, step S11 includes:

[0070] S112: Configure the adapter as a preset model of known type to obtain the type of the adapter.

[0071] The adapter type can be stored in memory 12 first, so that processor 11 can obtain the adapter type through the preset model of the adapter in memory 12.

[0072] It should be noted that the methods for obtaining adapter types are not limited to those described above.

[0073] S12: Place several marker points on the adapter and bind the marker point data of the several marker points to the type of the adapter. The marker point data includes positioning data and identification data bound to the type of the adapter.

[0074] In step S12, a common circular marker point is used as an example. At least four marker points are placed on the adapter, enabling the 3D scanning system to acquire marker point data for several marker points. Combined with the adapter type obtained in step S11, the identification data of several marker points and the adapter type can be bound together; that is, the adapter type can be obtained through the identification data of several marker points.

[0075] More specifically, step S12 includes the following steps:

[0076] S121: Scan and acquire identification data for several marker points;

[0077] S122: Match the acquired adapter type with the identification data of several marker points to bind the identification data of several marker points to the adapter type.

[0078] In step S121, a 3D scanning system is used to scan and acquire identification data of several marker points. This identification data includes, but is not limited to, the distribution, shape, and size of the marker points. Specifically, identification data of the marker points is acquired using a monocular vision camera or a multi-view vision camera.

[0079] In step S122, the identification data of several marker points and the type of the adapter can be matched one by one and stored in the memory 12, so that the type of the adapter can be obtained through the identification data.

[0080] like Figure 6 As shown, as one implementation method, step S2 includes the following steps:

[0081] S21: Determine the feature type of the feature to be tested. Step S21 is basically the same as step S2, and will not be described again here.

[0082] S22: Select at least one working surface on the adapter and obtain the first mapping relationship between the working surface and the positioning data of the marker point.

[0083] In step S22, the number of working surfaces on the adapter that contact the feature to be measured varies depending on the type of the feature being measured. For example, when the feature to be measured is a point, line, edge, etc., the feature to be measured contacts only one working surface. When the feature to be measured is a cylinder, etc., the feature to be measured contacts at least two working surfaces.

[0084] For example, in step S22, a first mapping relationship between the working surface and the positioning data of the marker points can be obtained through a 3D scanning system. Specifically, a monocular vision camera or a multi-view vision camera can be used to perform spatial 3D reconstruction of the adapter to obtain marker point data such as the coordinates of the marker points on the adapter.

[0085] like Figure 7 As shown, as one implementation method, step S3 includes the following steps:

[0086] S31: The adapter is placed on the support of the feature to be measured, and the data of the marker points on the adapter is acquired;

[0087] S32: Determine the position of the working surface in the 3D scan based on the marker point data and the first mapping relationship;

[0088] S33: Based on the location of the working surface and the feature type of the feature to be measured, determine the first feature of the feature to be measured.

[0089] In step S32, the location of the working surface in the three-dimensional scan can be transformed by the marker point data obtained by the three-dimensional scanning system in step S31 and the first mapping relationship obtained in step S1.

[0090] In step S33, since the location of the working surface has been obtained in step S32 and the feature type of the feature to be measured has been determined in step S2, the first feature of the feature to be measured can be determined based on the above data.

[0091] For example, let's take a scenario where the feature to be measured is a circle, the two working surfaces of the adapter that contact the circle are perpendicular to each other, and the first feature is the center of the circle. First, the 3D scanning system can identify marker points to obtain their identification and positioning data. Second, the type of adapter can be confirmed using the marker point identification data. Then, the adapter is placed on the feature to be measured. At this point, the feature to be measured contacts the two working surfaces of the adapter, thus forming two contact positions. Since the two working surfaces are perpendicular to each other, and the feature to be measured is a circle, the position of the circle's center can be determined. Specifically, since the positioning data of the marker points is known, the positions of the two working surfaces can be obtained through the marker point data and the first mapping relationship. Furthermore, through a coordinate transformation matrix, the positions of the two contact positions between the two working surfaces and the circle can be obtained, and thus the position of the circle's center can be determined.

[0092] It should be noted that, since the two working surfaces in the above embodiments may not be perpendicular to each other, and only the type of the feature to be measured is known (i.e., the type of the feature to be measured is a circle), the location of the circle's center cannot be determined. Therefore, to obtain the location of the circle's center in the above situation, as follows... Figure 6 As shown, step S2 in this application further includes the following steps:

[0093] S23: Determine the second feature of the feature to be tested, which is different from the first feature;

[0094] For example, let's take a circle as the feature to be measured and the first feature as the center of the circle. The second feature can be the diameter of the circle, etc. Thus, the first feature of the feature to be measured, i.e., the position of the center of the circle, can be determined by the second feature (the diameter of the circle, etc.), the position of the working surface, and the feature type of the feature to be measured.

[0095] At this point, step S33 can be the following steps:

[0096] Based on the location of the working face, the second feature, and the feature type of the feature to be measured, the first feature of the feature to be measured is determined.

[0097] like Figure 8 As shown, more specifically, step S33 includes the following steps:

[0098] S331: Obtain the contact position between the feature to be measured and the working surface;

[0099] S332: Determine the second mapping relationship between the contact position and the marker point based on the position of the working surface, the second feature, and the first mapping relationship;

[0100] S333: Based on the second mapping relationship and the feature type of the feature to be tested, determine the first feature of the feature to be tested.

[0101] Or, such as Figure 9 As shown, when step S2 does not include step S22, step S33 may include the following steps:

[0102] S331: Obtain the contact position between the feature to be measured and the working surface;

[0103] S332: Determine the second mapping relationship between the contact position and the marker point based on the position of the working surface and the first mapping relationship;

[0104] S333: Based on the second mapping relationship and the feature type of the feature to be tested, determine the first feature of the feature to be tested.

[0105] That is, this application does not restrict whether the second feature is known, only that the first feature can be obtained.

[0106] like Figure 10 and Figure 11 As shown, as one implementation, this application also provides an adapter 300 for measuring parameters of a cylindrical object under test in a 3D scan.

[0107] The adapter 300 includes an adapter body 31 and a fastener 32.

[0108] The adapter 31 includes a first contact surface 311 and a second contact surface 312, both of which are in contact with the object to be measured. The angle between the first contact surface 311 and the second contact surface 312 is a preset angle, which facilitates obtaining the mapping relationship between the first contact surface 311 and the marker point 34, and the mapping relationship between the second contact surface 312 and the marker point 34, through the aforementioned measurement method based on three-dimensional scanning. The first contact surface 311 and the second contact surface 312 are the working surfaces in the three-dimensional scanning method.

[0109] The fixing member 32 is movably connected to the adapter body 31. The fixing member 32 includes a fixed position and a separation position that separates it from the object to be measured. When the fixing member 32 is in the fixed position, the fixing member 32, the first contact surface 311, and the second contact surface 312 cooperate to fix the object to be measured. Through the above settings, the object to be measured can be fixed, thereby preventing the object to be measured from shifting during the measurement process and improving the accuracy of acquiring the first feature of the object to be measured. In addition, the 3D scanning system can simplify the scanning steps and scanning data through this adapter 300. That is, the 3D scanning system can measure the first feature of the object to be measured without scanning the entire object to be measured, thereby improving the efficiency of acquiring the first feature of the object to be measured.

[0110] As one implementation, the fixing member 32 has an external thread 33, and the adapter body 31 has a threaded hole 313. The fixing member 32 is movably connected to the threaded hole 313 via the external thread 33. This configuration allows the adapter 300 to be adapted to objects of different diameters, thereby improving the versatility of the adapter 300. Furthermore, the threaded connection improves the movement accuracy of the fixing member 32, thus improving the accuracy of acquiring the first feature of the object under test.

[0111] It should be noted that the movable connection between the fastener 32 and the adapter 31 can also be:

[0112] A cylinder is provided on the adapter body 31, and the movable end of the cylinder is fixedly connected to the fixing part 32, thereby realizing the movement of the fixing part 32.

[0113] Alternatively, the fastener 32 is a pin, and the adapter body 31 has a through hole. The pin and the through hole are interference-fitted so that the pin can be fixed relative to the adapter body 31. The interference fit can cause the through hole and the pin to move relative to each other when a force is applied, thereby causing the pin to move.

[0114] It should be noted that the way the fastener 32 is connected to the adapter 31 is not limited to the above-mentioned method, and this application does not impose any restrictions.

[0115] like Figure 10 and Figure 12 As shown, in one implementation, the adapter body 31 includes a first body 314, a second body 315, and a third body 316. A first contact surface 311 is located on the first body 314, a second contact surface 312 is located on the second body 315, and a fixing member 32 is movably connected to the third body 316. The first body 314, the second body 315, and the third body 316 surround and form a receiving space 301 for accommodating at least a portion of the object to be tested. With this configuration, the object to be tested can be located within the receiving space 301, which facilitates the fixing member 32, the first contact surface 311, and the second contact surface 312 in cooperating to fix the object to be tested.

[0116] like Figure 12 As shown, for example, the first body 314 and the second body 315 are fixedly connected or integrally formed, and the third body 316 is fixedly connected or integrally formed with the first body 314, so that the third body 316 can be fixed to the first body 314, and the fastener 32 is fixed to the first body 314 through the third body 316.

[0117] In this embodiment, since the second body 315 and the third body 316 are not connected, a gap 317 is formed between the second body 315 and the third body 316 to allow the object to be tested to pass through, thereby enabling the object to be tested to enter the receiving space 301 through the gap 317. It should be noted that when the object to be tested is long and it is not easy to attach the adapter 300 from one end of the object to be tested, this gap 317 can facilitate the fixation between the adapter 300 and the object to be tested.

[0118] like Figure 10 As shown, exemplarily, the first body 314 and the second body 315 are fixedly connected or integrally formed, and the third body 316 is fixedly connected or integrally formed with the first body 314, and the third body 316 is fixedly connected or integrally formed with the second body 315. In this case, there is no gap 317 between the third body 316 and the second body 315. Through the above arrangement, the stability of the third body 316 can be improved, thereby making the working stability of the fixing member 32 higher, and thus improving the accuracy of acquiring the first feature of the object under test.

[0119] like Figure 13 As shown, in one implementation, the fastener 32 includes a fastening body 321, a fastening head 322, and an elastic member 323. The fastening body 321 is movably connected to the adapter body 31. The fastening head 322 is at least partially located within the fastening body 321, and the elastic member 323 is located within the fastening body 321.

[0120] The fixing head 322 is movably connected to the fixing body 321. The two ends of the elastic member 323 abut against the fixing body 321 and the fixing head 322 respectively. The elastic member 323 has a preload force acting on the fixing head 322. When the fixing member 32 is in the fixed position, the preload force keeps the fixing head 322 in the abutting position against the object to be tested. This configuration ensures that the object to be tested remains in contact with the first contact surface 311 and the second contact surface 312, thereby improving the stability of the fixation between the object to be tested and the adapter 300, and further improving the working stability of the fixing member 32, thus increasing the accuracy of acquiring the first feature of the object to be tested.

[0121] like Figure 11 As shown, as an optional implementation, the fixing member 32 moves relative to the adapting body 31 along a preset straight line 303, defining a preset plane 302 perpendicular to the preset straight line 303. The preset plane 302, the first contact surface 311, and the second contact surface 312 are not parallel to each other. Through the above settings, the directions of any two forces fixing the object under test will not be parallel, thereby preventing the object under test from moving under the action of three forces. That is, the cylindrical object under test can be fixed at three fixed points.

[0122] like Figure 10 As shown, in this application, the adapter 300 also includes a marker point 34 positioned relative to the adapter body 31 at a preset position. The marker point 34 is located on the adapter body 31 or is detachably connected to the adapter body 31. Specifically, the marker point 34 can be adhered to the adapter body 31, or the marker point 34 can be fixed to the adapter body 31 by means of plugging or other methods. This application does not limit the method by which the marker point 34 is fixed to the adapter body 31.

[0123] For example, the description will be given with the feature to be measured being a cylinder, the first contact surface 311 and the second contact surface 312 being perpendicular to each other, and the first feature being the center of the cylinder.

[0124] First, the 3D scanning system can identify the marker point 34 on the adapter 300 to obtain the identification data and positioning data of the marker point 34.

[0125] Secondly, the type of adapter 300 can be confirmed by the identification data of marker point 34, that is, it can be confirmed that the adapter 300 is capable of measuring cylinders. It should be noted that the adapter 300 includes, but is not limited to, those capable of measuring cylinders.

[0126] Then, the adapter 300 is placed on the cylinder to be measured. At this time, the cylinder contacts the first contact surface 311 and the second contact surface 312 respectively, thus forming two contact positions. Since the first contact surface 311 and the second contact surface 312 are perpendicular to each other, and the feature to be measured is a cylinder, the position of the cylinder's center can be determined. Specifically, since the positioning data of the marker point 34 is known, the positions of the first contact surface 311 and the second contact surface 312 can be obtained through the marker point data, the first mapping relationship, and the coordinate transformation matrix. Thus, the positions of the contact points between the cylinder and the first contact surface 311, and the second contact surface 312 can be obtained, and consequently, the position of the cylinder's center can be obtained.

[0127] It should be noted that, since the first contact surface 311 and the second contact surface 312 in the above embodiments may not be perpendicular to each other, only the type of the feature to be measured is known, i.e., the type of the feature to be measured is a cylinder, and therefore the position of the center of the cylinder cannot be determined. Therefore, in order to obtain the position of the center of the cylinder under the above circumstances, a second feature of the cylinder, such as the diameter of the cylinder, is also required.

[0128] As one implementation, this application also provides a three-dimensional scanning system, which includes the adapter 300 described above.

[0129] like Figure 14 As shown, as one implementation, this application also provides a three-dimensional scanning device 200, which is used to implement the above embodiments and preferred embodiments. Details already described will not be repeated. The terms "module," "unit," "subunit," etc., used below can refer to combinations of software and / or hardware that implement a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0130] like Figure 14 The diagram shown is a structural block diagram of a three-dimensional scanning device 200 according to an embodiment of this application. Figure 14 As shown, the 3D scanning device 200 includes an adapter manufacturing module 21, an adapter definition module 22, and an adapter measurement module 23.

[0131] The adapter creation module 21 is used to bind the marker point data of several marker points to the adapter type. The adapter definition module 22 is used to determine the feature type of the feature to be measured and obtain the first mapping relationship between the working surface of the adapter and the marker points. When the adapter is placed on the carrier of the feature to be measured, the adapter measurement module 23 determines the first feature of the feature to be measured based on the marker point data, the first mapping relationship, and the feature type of the feature to be measured.

[0132] It should be noted that the above modules can be functional modules or program modules, and can be implemented by software or hardware. For modules implemented by hardware, the above modules can be located in the same processor 11; or the above modules can be located in different processors 11 in any combination.

[0133] More specifically, the adapter creation module 21 is able to obtain the type of the adapter.

[0134] And / or, the adapter creation module 21 can bind the marker data of several marker points to the type of the adapter, wherein the marker data includes positioning data and identification data bound to the type of the adapter.

[0135] And / or, the adapter definition module 22 can select at least one working surface on the adapter and obtain a first mapping relationship between the positioning data of the working surface and the marker point.

[0136] And / or, the adapter definition module 22 can determine the feature type of the feature to be measured.

[0137] And / or, the adapter definition module 22 is able to determine a second feature of the feature to be tested, which is different from the first feature.

[0138] And / or, the adapter measurement module 23 is able to acquire marker point data on the adapter when the adapter is placed on the carrier of the feature to be measured.

[0139] And / or, the adapter measurement module 23 can determine the position of the working surface in the 3D scan based on the marker point data and the first mapping relationship.

[0140] And / or, the adapter measurement module 23 can determine the first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured.

[0141] And / or, the adapter measurement module 23 can determine the first feature of the feature to be measured based on the position of the working surface, the second feature, and the feature type of the feature to be measured.

[0142] like Figure 1 As shown, this embodiment also provides an electronic device, including a memory 12 and a processor 11. The memory 12 stores a computer program, and the processor 11 is configured to run the computer program to perform the steps in any of the above method embodiments.

[0143] Optionally, the electronic device may further include a transmission device 13 and an input / output device 14, wherein the transmission device 13 is connected to the processor 11 and the input / output device 14 is connected to the processor 11.

[0144] Optionally, in this embodiment, the processor 11 can be configured to perform the following steps via a computer program:

[0145] S1: Adapter creation, used to bind the marker point data of several marker points to the adapter type;

[0146] S2: Adapter definition, used to determine the feature type of the feature to be measured and to obtain the first mapping relationship between the working surface of the adapter and the marker points;

[0147] S3: Adapter measurement, the adapter is placed on the carrier of the feature to be measured, and the first feature of the feature to be measured is determined based on the marker point data, the first mapping relationship and the feature type of the feature to be measured.

[0148] Alternatively, in this embodiment, the processor 11 can be configured to perform the following steps via a computer program:

[0149] S11: Get the adapter type;

[0150] S12: Place several marker points on the adapter and bind the marker point data of the several marker points to the type of the adapter. The marker point data includes positioning data and identification data bound to the type of the adapter.

[0151] S21: Determine the feature type of the feature to be measured;

[0152] S22: Select at least one working surface on the adapter and obtain the first mapping relationship between the positioning data of the working surface and the marker point;

[0153] S31: The adapter is placed on the support of the feature to be measured, and the data of the marker points on the adapter is acquired;

[0154] S32: Determine the position of the working surface in the 3D scan based on the marker point data and the first mapping relationship;

[0155] S33: Based on the location of the working surface and the feature type of the feature to be measured, determine the first feature of the feature to be measured.

[0156] Alternatively, in this embodiment, the processor 11 can be configured to perform the following steps via a computer program:

[0157] S11: Get the adapter type;

[0158] S12: Place several marker points on the adapter and bind the marker point data of the several marker points to the type of the adapter. The marker point data includes positioning data and identification data bound to the type of the adapter.

[0159] S21: Determine the feature type of the feature to be measured;

[0160] S22: Select at least one working surface on the adapter and obtain the first mapping relationship between the positioning data of the working surface and the marker point;

[0161] S23: Determine the second feature of the feature to be tested, which is different from the first feature;

[0162] S31: The adapter is placed on the support of the feature to be measured, and the data of the marker points on the adapter is acquired;

[0163] S32: Determine the position of the working surface in the 3D scan based on the marker point data and the first mapping relationship;

[0164] S33: Based on the location of the working surface, the second feature, and the feature type of the feature to be measured, determine the first feature of the feature to be measured.

[0165] It should be noted that the specific examples in this embodiment can refer to the examples described in the above embodiments and optional implementations, and will not be repeated in this embodiment.

[0166] Furthermore, in conjunction with the three-dimensional scanning-based measurement method provided in the above embodiments, this embodiment can also provide a storage medium for implementation. The storage medium stores a computer program; when executed by the processor 11, the computer program implements any of the three-dimensional scanning-based measurement methods described in the above embodiments.

[0167] As one implementation, this application also provides a three-dimensional scanning system, which includes the three-dimensional scanning device 200 described above.

[0168] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A measurement method based on three-dimensional scanning, wherein the measurement method based on three-dimensional scanning is applicable to a three-dimensional scanning system, characterized in that, The measurement method based on three-dimensional scanning includes: Adapter creation, used to bind the marker point data of several marker points to the adapter type; An adapter is defined to determine the feature type of the feature to be tested and to obtain the first mapping relationship between the working surface of the adapter and the marker point. Adapter measurement involves placing the adapter on a carrier of the feature to be measured, and determining the first feature of the feature to be measured based on the marker point data, the first mapping relationship, and the feature type of the feature to be measured. Adapter measurement: The adapter is placed on the carrier of the feature to be measured, and the data of the marked points on the adapter is acquired; Based on the marked point data and the first mapping relationship, the position of the working surface in the 3D scan is determined; Based on the location of the working surface and the feature type of the feature to be measured, the first feature of the feature to be measured is determined; The determination of the first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured includes: Obtain the contact position between the feature to be tested and the working surface; Based on the position of the working surface and the first mapping relationship, a second mapping relationship between the contact position and the marker point is determined; Based on the second mapping relationship and the feature type of the feature to be tested, the first feature of the feature to be tested is determined.

2. The measurement method based on three-dimensional scanning according to claim 1, characterized in that, The measurement method based on three-dimensional scanning includes: Adapter making: Obtain the type of the adapter; The adapter has several marker points placed on it, and the marker point data of the several marker points is bound to the type of the adapter. The marker point data includes positioning data and identification data bound to the type of the adapter. Adapter definition: Determine the feature type of the feature to be measured; Select at least one working surface on the adapter and obtain a first mapping relationship between the working surface and the positioning data of the marker point.

3. The measurement method based on three-dimensional scanning according to claim 2, characterized in that, The adapter definition also includes: Determine a second feature of the feature to be tested, wherein the second feature is different from the first feature; The determination of the first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured includes: Based on the position of the working surface, the second feature, and the feature type of the feature to be measured, the first feature of the feature to be measured is determined.

4. The measurement method based on three-dimensional scanning according to claim 3, characterized in that, The determination of the first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured includes: Obtain the contact position between the feature to be tested and the working surface; Based on the position of the working surface, the second feature, and the first mapping relationship, determine the second mapping relationship between the contact position and the marker point; Based on the second mapping relationship and the feature type of the feature to be tested, the first feature of the feature to be tested is determined.

5. The measurement method based on three-dimensional scanning according to claim 2, characterized in that, The step of obtaining the type of the adapter includes: Scan the adapter to determine its type; Alternatively, the adapter can be configured as a preset model of known type to obtain the type of the adapter.

6. The measurement method based on three-dimensional scanning according to claim 5, characterized in that, The step of binding the marker point data of the plurality of marker points to the type of the adapter includes: Scan and acquire identification data of several of the marked points; The type of the acquired adapter is matched with the identification data of several marker points to bind the identification data of several marker points to the type of the adapter.

7. A three-dimensional scanning device, applicable to the measurement method based on three-dimensional scanning as described in any one of claims 1 to 6, characterized in that, The three-dimensional scanning device includes: The adapter creation module is used to bind the marker data of several marker points to the adapter type. An adapter definition module is used to determine the feature type of the feature to be tested and to obtain the first mapping relationship between the working surface of the adapter and the marker point; The adapter measurement module, when the adapter is placed on the carrier of the feature to be measured, determines the first feature of the feature to be measured based on the marker point data, the first mapping relationship, and the feature type of the feature to be measured.

8. The three-dimensional scanning device according to claim 7, characterized in that, The adapter manufacturing module can obtain the type of the adapter; And / or, The adapter manufacturing module can bind the marker point data of several marker points to the type of the adapter, wherein the marker point data includes positioning data and identification data bound to the type of the adapter; And / or, The adapter definition module can select at least one working surface on the adapter and obtain a first mapping relationship between the working surface and the positioning data of the marker point; And / or, The adapter definition module can determine the feature type of the feature to be tested; And / or, The adapter definition module can determine a second feature of the feature to be tested, which is different from the first feature. And / or, The adapter measurement module is able to acquire the marker point data on the adapter when the adapter is placed on the carrier of the feature to be measured; And / or, The adapter measurement module can determine the position of the working surface in the 3D scan based on the marker point data and the first mapping relationship; And / or, The adapter measurement module can determine the first feature of the feature to be measured based on the position of the working surface and the feature type of the feature to be measured; And / or, The adapter measurement module can determine the first feature of the feature to be measured based on the position of the working surface, the second feature, and the feature type of the feature to be measured.

9. A three-dimensional scanning system, characterized in that, The three-dimensional scanning system includes the three-dimensional scanning device as described in claim 7 or 8.