A method for detecting sample temperature uniformity of vacuum equipment
By keeping the sample stationary in the vacuum equipment and detecting the sample temperature with a rotating heater and an external monitor, the problem of inability to measure the sample temperature in the prior art is solved, and the detection of temperature uniformity and accurate confirmation of process parameters are achieved.
Patent Information
- Application Number
- CN202411958655.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-04-04
AI Technical Summary
The temperature detection of existing vacuum equipment cannot measure the sample temperature, resulting in inaccurate process expectations, and the temperature index needs to be reconfirmed after use of different equipment or equipment for a long time.
By keeping the sample stationary in the vacuum cavity, the sample surface temperature is detected using a rotary heater and an external real-time monitor to ensure temperature uniformity.
Accurate measurement of the actual temperature and temperature uniformity of the sample in a vacuum state, helping to confirm process temperature parameters, ensure consistent process results, and reducing customer exploration process time.
Smart Images
Figure CN119756615A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of vacuum equipment sample temperature detection, in particular to a method for detecting sample temperature uniformity of vacuum equipment. Background Art
[0002] Traditional vacuum equipment temperature detection systems can only test the temperature of the heater, that is, the furnace temperature. Since the sample is in a rotating motion during operation, the sample temperature cannot be measured. However, in actual applications, the process requirement is not the furnace temperature, but the actual temperature of the sample, which is also the key technical parameter for whether the process is achieved. There will be different process temperature conditions, and it is often necessary to know the actual parameter settings of the sample at different temperatures.
[0003] In the prior art, multiple furnace temperature processes are measured on existing equipment, and the furnace temperature to be used is determined based on the sample test results. The problem that arises is that due to different design structures, the furnace temperature and the sample temperature are quite different. Therefore, if other equipment is used for the process, the temperature index needs to be re-explored and confirmed; or after the equipment has been used for a long time, it may also lead to inaccurate expectations for the later process. Summary of the invention
[0004] In view of the problem that the existing temperature detection of vacuum equipment cannot measure the temperature of a sample, the object of the present invention is to provide a method for detecting the temperature uniformity of a sample of a vacuum equipment.
[0005] The objective of the present invention is achieved through the following technical solutions:
[0006] The detection method of the present invention is to keep the sample to be detected still in a vacuum chamber, and a heater for heating the sample to be detected is placed in the vacuum chamber. The heater rotates during the detection process, and the surface temperature of the sample is detected in real time by a real-time monitor arranged in the atmospheric environment outside the vacuum chamber, and the uniformity of the surface temperature of the sample is obtained.
[0007] Wherein: the magnetic fluid is sealed and connected to the vacuum chamber, the heater is fixed at one end of the magnetic fluid located in the vacuum chamber, and a conductive slip ring is provided at the other end of the magnetic fluid in the atmospheric environment; the sample holder is located in the vacuum chamber and below the heater, a temperature measuring wafer end with a temperature measuring sensor as a sample to be detected is placed in the sample holder, and the temperature measuring sensor on the temperature measuring wafer end is connected to a real-time monitor located outside the vacuum chamber and in the atmospheric environment; a temperature control couple with a temperature control heater is provided in the magnetic fluid, and the temperature control couple wire and the heater wire pass through the magnetic fluid and are sealed, and are connected to the conductive slip ring; the other end of the magnetic fluid in the atmospheric environment is driven by a power source to rotate, driving the heater to rotate, the heater is powered on to heat the temperature measuring wafer end, and the temperature measuring wafer end placed on the sample holder remains stationary during the detection process, and the real-time monitor performs real-time detection of the temperature of each point on the wafer surface corresponding to each temperature measuring sensor in the atmospheric environment to obtain temperature uniformity.
[0008] The wires of each temperature sensor pass through the chamber door of the vacuum chamber, and the vacuum is sealed by the deformation of the door rubber ring.
[0009] The temperature control couple and the heater wire are connected to the conductive slip ring to solve the winding problem.
[0010] Since the temperature measuring wafer end is integrated with the real-time monitoring device outside the vacuum chamber, it cannot participate in the rotation action.
[0011] The temperature control couple controls the heating temperature of the heater.
[0012] The advantages and positive effects of the present invention are:
[0013] The present invention can measure the actual temperature of the sample and its temperature uniformity at different furnace temperatures under a vacuum state and in actual working conditions, that is, when the heater and the sample have relative rotational motion, to help accurately confirm the sample process temperature parameters and ensure consistent process results. The sample temperature during the sample coating process can be quickly and accurately grasped, effectively reducing the customer's time to explore the process, and can be used for process development and optimization. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the vacuum equipment of the present invention;
[0015] Among them: 1 is a conductive slip ring, 2 is a temperature control couple and a heater wire, 3 is a magnetic fluid, 4 is a heater, 5 is a sample holder, 601 is a temperature measuring wafer end, 602 is a real-time monitor, and 7 is a vacuum chamber. DETAILED DESCRIPTION
[0016] The present invention will be further described below in conjunction with the accompanying drawings.
[0017] The present invention sets the sample to be tested in the vacuum chamber 7 and keeps it still. The heater 4 for heating the sample to be tested is in the vacuum chamber 7. The heater 4 rotates during the testing process. The real-time monitor 602 set in the atmosphere outside the vacuum chamber 7 detects the sample surface temperature in real time and obtains the sample surface temperature uniformity. Specifically:
[0018] like Figure 1 As shown, the magnetic fluid 3 is sealed and connected to the vacuum chamber 7 to ensure the vacuum degree process requirements during the rotational motion; the heater 4 is fixed to one end of the magnetic fluid 3 located in the vacuum chamber 7, and the other end of the magnetic fluid 3 in the atmospheric environment is provided with a conductive slip ring 1; the sample holder 5 is located in the vacuum chamber 7 and below the heater 4, and the sample to be detected is placed in the sample holder 5. The sample to be detected in this embodiment is a temperature measuring wafer end 601 with a temperature measuring sensor. The temperature measuring wafer end 601 is placed on the sample holder 5, that is, at the actual sample position, which is equivalent to the sample in the heating process; the wires of each temperature measuring sensor pass through the chamber door of the vacuum chamber 7, and the vacuum is sealed by the deformation of the door rubber ring. The temperature sensor on the temperature measuring wafer end 601 is connected to the real-time monitor 602 located outside the vacuum chamber 7 and in the atmospheric environment. Since the temperature measuring wafer end 601 is integrated with the real-time monitor 602 outside the vacuum chamber 7, it cannot participate in the rotational motion. The magnetic fluid 3 has a temperature-controlling couple of a temperature-controlling heater 4, which controls the heating temperature of the heater 4. The temperature-controlling couple wire and the heater wire 2 pass through the magnetic fluid 3 and are sealed, and are connected to the conductive slip ring 1 to solve the winding problem; all parts are in a relatively static state, which not only guarantees the control requirements, but also guarantees the vacuum degree process requirements when the heater rotates. The other end of the magnetic fluid 3 in the atmospheric environment is driven by a power source (the power source in this embodiment is a motor) to rotate, driving the heater 4 to rotate, and the heater 4 is powered on to heat the temperature measuring wafer end 601. The temperature measuring wafer end 601 placed on the sample holder 5 remains stationary during the detection process. The real-time monitor 602 detects the temperature of each point on the wafer surface corresponding to each temperature measuring sensor in real time under the atmospheric environment to obtain temperature uniformity.
[0019] The conductive slip ring 1, magnetic fluid 3, temperature control couple, heater 4 and real-time monitoring device 602 of this embodiment are all prior art and will not be described in detail here.
[0020] The present invention heats the heater 4 when power is turned on, the temperature control couple controls the temperature of the heater 4, the magnetic fluid 3 is driven by an external motor to rotate the heater 4, and the temperature control couple wire and the heater wire 2 are connected to the conductive slip ring 1 under the atmosphere to solve the winding problem. The temperature measuring wafer end 601 in the wafer temperature measuring system is placed in the sample holder 5 and does not participate in the rotational movement. The real-time monitor 602 in the wafer temperature measuring system monitors and records the wafer temperature in real time.
Claims
1. A method for detecting sample temperature uniformity of a vacuum device, characterized in that: The sample to be tested remains stationary in the vacuum chamber (7), and a heater (4) for heating the sample to be tested is in the vacuum chamber (7). The heater (4) rotates during the testing process. The surface temperature of the sample is detected in real time by a real-time monitor (602) arranged in the atmosphere outside the vacuum chamber (7), and the uniformity of the surface temperature of the sample is obtained.
2. The method for detecting sample temperature uniformity of vacuum equipment according to claim 1, characterized in that: The magnetic fluid (3) is sealed and connected to a vacuum chamber (7); a heater (4) is fixed to one end of the magnetic fluid (3) located in the vacuum chamber (7); and a conductive slip ring (1) is provided at the other end of the magnetic fluid (3) in an atmospheric environment; a sample holder (5) is located in the vacuum chamber (7) and below the heater (4); a temperature measuring wafer end (601) with a temperature measuring sensor as a sample to be detected is placed in the sample holder (5); the temperature measuring sensor on the temperature measuring wafer end (601) is connected to a real-time monitoring device (602) located outside the vacuum chamber (7) and in an atmospheric environment; the magnetic fluid (3) has a temperature control heater. The temperature control couple of the heater (4), the temperature control couple wire and the heater wire (2) pass through the magnetic fluid (3) and are sealed, and are connected to the conductive slip ring (1); the other end of the magnetic fluid (3) in the atmospheric environment is driven by a power source to rotate, driving the heater (4) to rotate, the heater (4) is powered to heat the temperature measuring wafer end (601), the temperature measuring wafer end (601) placed on the sample holder (5) remains stationary during the detection process, and the real-time monitoring instrument (602) performs real-time detection of the temperature of each point on the wafer surface corresponding to each temperature measuring sensor in the atmospheric environment to obtain temperature uniformity.
3. The method for detecting sample temperature uniformity of vacuum equipment according to claim 2, characterized in that: The wires of each temperature sensor pass through the chamber door of the vacuum chamber (7), and the vacuum is sealed by the deformation of the door rubber ring.
4. The method for detecting sample temperature uniformity of vacuum equipment according to claim 2, characterized in that: The temperature control couple and the heater wire (2) are connected to the conductive slip ring (1), thereby solving the winding problem.
5. The method for detecting sample temperature uniformity of vacuum equipment according to claim 2, characterized in that: Since the temperature measuring wafer end (601) is integrated with the real-time monitor (602) outside the vacuum chamber (7), it cannot participate in the rotation action.
6. The method for detecting sample temperature uniformity of vacuum equipment according to claim 2, characterized in that: The temperature control couple controls the heating temperature of the heater (4).