Method for detecting gap in photomask and photomask detection equipment

Abstract

The invention provides a method for detecting gaps in a photomask and photomask detection equipment. The method comprises the following steps: acquiring key features among chips in a design pattern according to a photomask exposure file; if the key feature meets a preset reference value condition, detecting a normal gap; determining a gap region corresponding to the normal gap, and generating a coordinate file of the gap region; and after the coordinate file is imported into the inspection machine, the machine detects other areas except the area corresponding to the coordinate file. A technique for generating a photomask GAP region coordinate using a data processing method is provided. According to the method, various GAPs caused by data processing are processed, the inspection time of the photomask is remarkably shortened, and the yield of photomask manufacturing is improved. By automatically identifying and processing the GAP area, the photomask manufacturing process is effectively optimized, and the production efficiency and the quality are improved.

Description

Technical Field

[0001] The present application relates to the field of photomask technology, and in particular to a method for detecting gaps in a photomask and a photomask detection device. Background Art

[0002] Photomasks are very important in the manufacturing process. However, during the photomask manufacturing process, gaps may appear between two adjacent patterns. Generally, the existence of gaps does not affect the instructions and performance of the product, but manual confirmation and inspection are required to ensure that the existence of the gap is in line with expectations, which will affect the inspection efficiency of the product.

[0003] However, the existing technology requires manual intervention and open-drawing inspection for detecting gaps in photomasks, which increases production time and cost, and also introduces human errors that affect manufacturing efficiency and accuracy.

[0004] Therefore, a new scheme for gap detection in photomasks is needed. Summary of the invention

[0005] In view of this, embodiments of the present specification provide a method for detecting gaps in a photomask and a photomask detecting device.

[0006] The embodiments of this specification provide the following technical solutions:

[0007] The embodiment of the present specification provides a method for detecting gaps in a photomask, including:

[0008] Obtain key features between chips in the design pattern according to the photomask exposure file;

[0009] If the key feature meets the preset reference value condition, a normal gap is detected;

[0010] The gap area corresponding to the normal gap is determined, and a coordinate file of the gap area is generated, so that after the coordinate file is imported into the inspection machine, the machine detects other areas except the area corresponding to the coordinate file.

[0011] The embodiment of the present specification provides a photomask gap detection module, which applies the photomask gap detection method in the above technical solution.

[0012] The embodiments of the present specification also provide a photomask inspection device, including a photomask gap inspection module as in the above technical solution, or using a photomask gap inspection method as in the above technical solution.

[0013] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0014] The embodiments of this specification provide a technology for generating the coordinates of the GAP area of ​​a photomask using a data processing method. The method processes various GAPs caused by data processing, significantly reduces the inspection time of the photomask, and improves the yield of photomask manufacturing. By automatically identifying and processing the GAP area, the present invention effectively optimizes the photomask manufacturing process and ensures the improvement of production efficiency and quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 is a schematic diagram of an anomaly in a photomask in the prior art;

[0017] Figure 2 It is a schematic diagram comparing the gap between the photomask design and the actual gap after exposure;

[0018] Figure 3 is a schematic diagram of the actual gap in the photomask;

[0019] Figure 4 is a schematic diagram of gap detection in a photomask provided by the present application;

[0020] Figure 5 This is a flow chart of gap detection in a photomask provided by the present application. DETAILED DESCRIPTION

[0021] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0022] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0023] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0024] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0025] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.

[0026] In the chip manufacturing process, the production of photomasks plays a vital role.

[0027] After the photomask is exposed, an inspection machine is usually required to inspect the defects on the photomask surface, such as stains, scratches, bad spots, etc. These defects may affect the quality and performance of the photomask during the manufacturing process, so it is critical to detect and repair defects as early as possible. Figure 1 The example is that an abnormal defect is found in the inspection machine.

[0028] However, gap (GAP) problems often occur during the photomask manufacturing process. GAP usually refers to the space or interval between two adjacent patterns. Figure 1 After the design is completed, the gap position needs to be manually checked, and then the difference between the design pattern and the actual pattern needs to be compared. In particular, it is necessary to determine whether the gap appears at the junction of the chip and the cutting path (such as Figure 2 As shown, Figure 2 There is no GAP in the sample design graph in Part A. Figure 2 (Part B of the example shows that there is a GAP in the actual graph).

[0029] In the current manufacturing environment, solving this problem usually requires manual intervention and open drawing inspection to verify and adjust the manufactured photomask. This not only increases the time and cost in the production process, resulting in inefficiency, but is also easily affected by subjective factors, introducing human errors, and affecting the efficiency and accuracy of manufacturing.

[0030] The inventors discovered that gaps (GAPs) appear during the photomask manufacturing process, which is different from traditional surface defect detection. On the one hand, due to the conversion relationship set by the process bi as during the photomask manufacturing process, GAPs may appear in the innerframe area. However, these GAPs are expected and do not affect the quality and performance of the final product. On the other hand, although the gaps existing in the photomask manufacturing process do not affect the quality and performance of the final product, they require additional manual confirmation or corresponding inspection steps to inspect, which affects the inspection efficiency after the photomask is exposed. Therefore, how to effectively ignore these normal gaps during inspection without cumbersome inspection steps, but ensure that the quality and performance of the final product meet the requirements. That is, effectively handle the normal gaps in the photomask manufacturing process, improve product quality and reduce production costs.

[0031] Based on this, the embodiments of this specification propose a new solution for gap detection in photomasks, which uses data processing methods to generate the coordinates of the GAP area of ​​the photomask, significantly reducing the inspection time of the photomask and improving the yield of photomask manufacturing. By automatically identifying and processing the GAP area, the photomask manufacturing process is effectively optimized, ensuring the improvement of production efficiency and quality.

[0032] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0033] like Figure 3-Figure 5 As shown, the embodiment of this specification provides a method for detecting gaps in a photomask, including steps S501 to S503. In step S501, the key features between chips in the design pattern are obtained according to the photomask exposure file. In step S502, if the key features meet the preset reference value conditions, a normal gap is detected. In step S503, the gap area corresponding to the normal gap is determined, and a coordinate file of the gap area is generated, so that after the coordinate file is imported into the inspection machine, the machine detects other areas except the area corresponding to the coordinate file.

[0034] In photomask manufacturing, "internal frame" refers to the boundary line or frame used to locate and delimit each specific chip area in the photomask pattern. When the chip pattern is adjacent to the cutting path pattern, due to the conversion relationship set by the process bias, gaps may appear in the internal frame area. These gaps are expected and do not affect the quality and performance of the final product, but they may require additional manual confirmation or inspection steps, affecting inspection efficiency. The key issue is how to effectively ignore these normal gaps during inspection to ensure that the quality and performance of the final product meet the requirements.

[0035] During the data processing, for edge-fitting graphics, such as when the chip graphics and the cutting path graphics are edge-fitting, a GAP will appear in the inner frame area due to the conversion relationship set by the process bi as. Figure 3 As shown in the figure, a GAP area appears between the indentation boundary of the dicing lane and the boundary of the main chip. Although these GAPs are expected and do not affect the quality and performance of the product, they require additional manual confirmation or inspection steps, which prolongs the inspection time and affects the inspection efficiency.

[0036] Specifically, in step S501, the key features between chips in the design pattern in the photomask manufacturing are used to realize positioning and boundary for the photomask pattern, and the exposure file is scanned after exposure for automatic detection of the gap in the photomask, and the key features between chips in the design pattern are obtained to provide a basis for the detection of the gap in the photomask. In some embodiments, the key features between the chips in the design pattern are obtained, and the exposure file is scanned or photographed using a high-precision scanning device or camera, and the key features between adjacent CH IPs are measured by preprocessing the acquired image and performing image analysis algorithms such as image segmentation and feature extraction.

[0037] In step S502, in combination with the above embodiments, after exposure, key feature information between chips is obtained, and by detecting the key feature information, if it is detected that the key information meets the preset reference value condition, a normal gap is detected. In some embodiments, the most directly obtained key feature between chips, such as width, is detected, and if the width meets the preset reference value condition, a normal gap is detected. The normal gap is expected, but does not affect the quality and performance of the product.

[0038] In step S503, after the normal gap is detected, the gap area corresponding to the normal gap is determined, and a coordinate file of the gap area is generated. After the coordinate file is imported into the inspection machine, the machine detects other areas except the area corresponding to the coordinate file.

[0039] In some embodiments, image analysis is continued to be used to identify and mark the GAP area, such as determining the gap area through edge detection, contour tracking, etc.; and then a GAP area coordinate file is generated, which records in detail the position, starting point, and end point coordinates of each GAP. When the generated coordinate file is finally inspected by the inspection machine, the normal gap area corresponding to the coordinate area can be excluded, and other areas can be inspected instead. This not only shortens the time for normal gap inspection, but also excludes the normal gap that has been detected when the inspection machine detects other defects, thereby improving the efficiency and accuracy of photomask defect detection as a whole.

[0040] Of course, if the key features cannot meet the preset reference value conditions, both gaps and other defects must be inspected during subsequent machine inspections.

[0041] In combination with the above embodiments, on the first aspect, the embodiments of this specification obtain key features between adjacent chips, and when the key features meet the preset reference value conditions, the normal gap is efficiently detected, and the detection range is relatively small compared to other defect detections of the photomask. It mainly processes less data between adjacent chips and will not affect other defect detections of the photomask. Therefore, a faster and more accurate implementation method is adopted to obtain the key features between chips and locate the GAP area, and generate a coordinate file of the GAP.

[0042] The traditional method mainly focuses on the defects that affect the performance of the photomask, so as to detect and repair these defects early. The inventor has the opposite idea, and believes that even if the normal detection will not affect the performance and quality of the photomask in the end, compared with other large-scale data processing, the embodiment of this specification also uses the same sampling data processing method for the detection of the normal gap between chips, which improves the efficiency and accuracy of the normal gap detection on the one hand, and does not affect the detection of other defects on the other hand. However, while not affecting the defect detection of the inspection machine, there is no need to repeat the normal gap area that has been found, resulting in low inspection efficiency, which affects the overall inspection efficiency and accuracy of the photomask.

[0043] Secondly, for gaps that do not affect the final quality and performance of the photomask, the traditional method uses manual intervention and open-drawing inspection, but the embodiments of this specification adopt a different approach from the traditional method (for gaps in the photomask that do not affect product quality, an inspection machine is still used for inspection, and only the normal gaps that have been detected are excluded in the inspection machine, but it will not affect the detection of defects, which is completely different from the traditional method that does not affect quality and performance and does not require excessive emphasis on inspection). As described above, based on more efficient and accurate acquisition of the GAP area and generation of the GAP coordinate file, the coordinate file about the gap is obtained and imported into the inspection machine so that the inspection machine can exclude this part of the normal gap area for other defect detection.

[0044] In other words, the use of gap coordinate files during inspection can avoid affecting the detection of other defects while avoiding the detection of normal gaps to achieve inspections with high requirements for product quality and performance.

[0045] In summary, the method for detecting gaps in photomasks provided in the embodiments of this specification not only does not affect the detection of other defects by the photomask, but also requires almost no additional complex detection steps, while completely improving the efficiency and accuracy of the overall inspection of the photomask, greatly improving production efficiency and improving product yield.

[0046] like Figure 4 As shown, a design principle of the embodiment of this specification is: the width between CH IPs on the scan exposure file is consistent with the bi as (i.e., the preset reference value) as a GAP, the corresponding GAP area is located, and the coordinate file of the GAP area is generated. These coordinate files are imported into the inspection machine, and the machine will not inspect the specified area.

[0047] Therefore, the normal GAP between the design graphics and the exposure file caused by data processing will not be detected, and there is no need for manual reconfirmation. This method effectively improves the inspection efficiency without affecting the accuracy of the inspection results.

[0048] In some embodiments, the preset reference value is obtained according to the systematic deviation between the actual result and the design expectation caused by the process factors, and the preset reference value does not affect the product quality and performance.

[0049] Specifically, the preset reference value is based on the analysis of historical production data, and the systematic deviation between the actual result caused by process factors and the design expectation is used as the preset reference value, such as the conversion relationship set by process bi as (i.e., adjusting the manufacturing parameters in real time to compensate for the deviation), which may lead to GAP. However, these GAPs are expected and do not affect the quality and performance of the final product.

[0050] In some embodiments, the gap area includes a gap area formed by a portion of the chip pattern, the cutting road, and the detected normal gap.

[0051] like Figure 3 and 4 As shown, a normal gap is detected, and the gap area obtained includes a portion of the chip pattern, the cutting path and the detected normal gap.

[0052] like Figure 4 As shown, the gap region includes part of the chip pattern, such as Figure 3 As shown, when the CH IP pattern is adjacent to the cutting road pattern, the gap area includes the cutting road.

[0053] It should be noted that the gap area not only includes the detected normal gap, but also appropriately expands its area to exclude the detection of normal gaps during subsequent machine inspection, thereby improving the efficiency of machine inspection.

[0054] In some embodiments, the critical features include width, aspect ratio or angle between adjacent chips.

[0055] Specifically, the key features between the chips in the design pattern are obtained according to the photomask exposure file, and the key features include but are not limited to width, aspect ratio or angle between adjacent chips. In some embodiments, the width is more intuitive and can be used to detect the gap. In other embodiments, the aspect ratio or angle between adjacent chips can be converted into width to detect the gap.

[0056] In some embodiments, the coordinate file of the gap area is displayed and stored on the operation interface, wherein the coordinate file of the gap area includes the position, size and number of the gap area.

[0057] In combination with the above embodiment, after obtaining the coordinate file of the gap area, the coordinate file of the gap area is displayed and stored on the operation interface, and the position, size and number of the gap area in the coordinate file of the gap area can be displayed.

[0058] In some embodiments, it also includes: obtaining key features between chips in different arrangement forms according to different design patterns in the photomask; wherein the arrangement of adjacent chips includes straight line arrangement, grid arrangement, ring arrangement, staggered arrangement and mixed arrangement.

[0059] Specifically, different design patterns in the photomask are used to set different arrangements, thereby obtaining key features between chips with different arrangements. Specifically, the arrangement of adjacent chips includes but is not limited to straight line arrangement, grid arrangement, ring arrangement, staggered arrangement and mixed arrangement.

[0060] Linear arrangement, adjacent chips are arranged along a straight line, such as horizontally or vertically. Grid arrangement is arranged in a grid, forming rows and columns. Ring arrangement, the chips may be arranged in a ring around a central point or area. Staggered arrangement, the chips are arranged in a staggered manner. Hybrid arrangement, using multiple arrangements.

[0061] In summary, the embodiments of this specification utilize a data processing method to generate coordinates of a GAP region in a photomask, effectively handle various GAPs caused by data processing, reduce the deterioration of photomask inspection, and improve the yield of photomask manufacturing.

[0062] The specific beneficial effects are as follows:

[0063] Improved inspection efficiency: By automatically identifying and processing GAP areas caused by data processing, the time for manual inspection and verification is reduced.

[0064] Yield improvement: Ensuring only relevant areas are inspected and efficiently allocating resources improves the yield of photomask manufacturing.

[0065] Reliability: Ensures the integrity of the overall inspection of the photomask during the inspection process by focusing on the inspection of the main areas while ignoring the GAP areas that are not affected.

[0066] This approach represents a significant advance in photomask manufacturing, meeting industry demands for increased efficiency, accuracy and yield.

[0067] In combination with the above embodiments, an embodiment of the present specification provides a photomask gap detection module, which applies the above-mentioned photomask gap detection method.

[0068] In combination with the above embodiments, the embodiments of this specification provide a photomask inspection device, which applies the photomask gap detection module as described in the above technical solution, or adopts the photomask gap detection method as described in the above technical solution. In some embodiments, a photomask gap detection module is set in the inspection machine, that is, the photomask gap detection solution is integrated in the inspection machine, thereby reducing the inspection time of the photomask and improving the yield of photomask manufacturing. By automatically identifying and processing the GAP area, the photomask manufacturing process is effectively optimized, ensuring the improvement of production efficiency and quality. In another way, the photomask detection module is set in the photomask detection equipment, etc.

[0069] In combination with the above embodiments, the embodiments of this specification also provide a system for detecting gaps in a photomask, including: a memory, a processor, and a computer program, wherein the computer program is stored in the memory, and the processor runs the computer program to execute the method for detecting gaps in a photomask as described in the above technical solution.

[0070] In combination with the above embodiments, the embodiments of this specification further provide a readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, it is used to implement the method for detecting gaps in a photomask as described in the above technical solution.

[0071] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment described later, since it corresponds to the method, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0072] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for detecting gaps in a photomask, characterized in that: include: Obtain key features between chips in the design pattern according to the photomask exposure file; If the key feature meets the preset reference value condition, a normal gap is detected; Determine the gap area corresponding to the normal gap, and generate a coordinate file of the gap area; So that after the coordinate file is imported into the inspection machine, the machine detects other areas except the area corresponding to the coordinate file.

2. The method for detecting gaps in a photomask according to claim 1, characterized in that: The preset reference value is obtained based on the systematic deviation between the actual result and the design expectation caused by process factors, and the preset reference value does not affect the product quality and performance.

3. The method for detecting gaps in a photomask according to claim 1, characterized in that: The gap area includes: a gap area formed by a part of the chip pattern, the cutting road and the detected normal gap.

4. The method for detecting gaps in a photomask according to claim 1, characterized in that: Key features include width, aspect ratio or angle between adjacent chips.

5. The method for detecting gaps in a photomask according to claim 1, wherein: Also includes: Display and store the coordinate file of the gap area on the operation interface; The coordinate file of the gap area includes the position, size and quantity of the gap area.

6. The method for detecting gaps in a photomask according to any one of claims 1 to 5, characterized in that: Also includes: According to the different design patterns in the photomask, the key features between chips with different arrangements are obtained; The arrangement of adjacent chips includes linear arrangement, grid arrangement, ring arrangement, staggered arrangement and mixed arrangement.

7. A photomask gap detection module, characterized in that: include: The method for detecting gaps in a photomask as claimed in any one of claims 1 to 6 is applied.

8. A photomask inspection device, characterized in that: It comprises the photomask gap detection module as claimed in claim 7, or adopts the photomask gap detection method as claimed in any one of claims 1-6.

9. A photomask gap detection system, characterized in that: include: A memory, a processor and a computer program, wherein the computer program is stored in the memory, and the processor runs the computer program to execute the method for detecting gaps in a photomask according to any one of claims 1 to 6.

10. A readable storage medium, characterized in that: The readable storage medium stores a computer program, and when the computer program is executed by a processor, it is used to implement the method for detecting gaps in a photomask according to any one of claims 1 to 6.

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