A new type of computer placement equipment

Abstract

The present invention provides a new type of computer placement equipment, belonging to the technical field of placement equipment, including a cabinet, a storage cavity is provided inside the cabinet, and support components are provided on the left and right sides of the storage cavity; and a heat dissipation mechanism, including a heat exchanger fixedly installed on the rear wall of the storage cavity and a heat conducting plate installed on two groups of the support components, heat conducting pipes are fixedly installed inside the two heat conducting plates, and the output ends of the upper and lower sides of the two heat conducting pipes are connected with connecting pipes, and the other ends of the four connecting pipes are connected with the pipes inside the heat exchanger, and the rear end of the heat exchanger is fixedly installed with heat dissipation fins, and the rear end of the heat dissipation fins passes through the rear wall of the cabinet and extends outside. The present invention solves the problems of low heat dissipation efficiency, dust intrusion, and inconvenient equipment installation and disassembly during the operation of the computer host, and improves the heat dissipation performance, equipment stability and operation convenience.

Description

Technical Field

[0001] The present invention relates to the technical field of placement equipment, in particular to a novel computer placement equipment. Background Art

[0002] Computer storage equipment is a device used to store computer hosts, usually in the form of storage boxes or cabinets. Its main function is to provide a stable and safe storage environment for computer hosts and prevent the hosts from being directly affected by the external environment. These devices are widely used in homes, offices, data centers and other scenarios. By properly storing the host, it helps to extend the service life of the computer host and improve its working performance.

[0003] However, existing computer storage cabinets have some significant defects. Their structure is usually relatively simple, and most of them adopt a sealed space design. Although this design can reduce the contact between the host and the outside world, it leads to poor heat dissipation performance of the host, which is easy to cause performance degradation or even hardware damage due to excessive internal temperature. In order to improve the heat dissipation performance, some storage cabinets are designed with vents, but the vents are easy to become channels for dust to enter, resulting in dust accumulation inside the host, which not only reduces the heat dissipation efficiency of the computer, but also may cause hardware failures, such as poor fan operation, motherboard short circuit and other problems, seriously affecting the stable operation and service life of the computer. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above problems and / or the problems existing in the prior art, the present invention is proposed.

[0006] Therefore, the technical problem to be solved by the present invention is: in a completely closed storage environment, to achieve efficient heat dissipation of the computer host while preventing the entry of external dust.

[0007] To solve the above technical problems, the present invention provides the following technical solutions: a novel computer placement device, comprising a cabinet, a storage cavity is provided inside the cabinet, and support components are provided on both sides of the storage cavity; and

[0008] The heat dissipation mechanism includes a heat exchanger fixedly mounted on the rear wall of the storage cavity and a heat conducting plate mounted on the two groups of supporting assemblies, heat conducting pipes are fixedly mounted inside the two heat conducting plates, connecting pipes are connected to the output ends on the upper and lower sides of the two heat conducting pipes, and the other ends of the four connecting pipes are connected to the pipes inside the heat exchanger, and cooling fins are fixedly mounted on the rear end of the heat exchanger, and the rear end of the cooling fins passes through the rear wall of the cabinet and extends to the outside thereof.

[0009] As a preferred solution of the new computer placement device described in the present invention, a limiting groove is opened on the inner side of the cabinet, the supporting assembly includes a limiting block slidably connected to the inside of the limiting groove, a section of the limiting block is fixedly connected to a telescopic rod, the other end of the telescopic rod is fixedly connected to the outer wall of the heat conducting plate, a telescopic spring is sleeved on the outer surface of the telescopic rod, one end of the telescopic spring is fixedly connected to the outer wall of the storage cavity, and the other end is fixedly connected to the outer wall of the heat conducting plate.

[0010] As a preferred solution of the new computer placement device described in the present invention, among the four connecting tubes, two connecting tubes are respectively installed with coolant pumps, one of which is fixedly installed on the connecting tube at the top end on the left side, and the other is fixedly installed on the connecting tube at the bottom end on the right side.

[0011] As a preferred solution of the novel computer placement device of the present invention, wherein: a cooling liquid is arranged inside the heat-conducting pipe, and the cooling liquid is preferably an ethylene glycol aqueous solution.

[0012] As a preferred solution of the novel computer placement device described in the present invention, one end of the four connecting pipes connected to the heat exchanger is configured as a retractable hose, and the hose is made of a high temperature resistant and corrosion resistant elastic material.

[0013] As a preferred solution of the novel computer placement device described in the present invention, the heat conducting pipe, connecting pipe, coolant pump, hose, heat exchanger and heat dissipation fins together constitute a complete cooling circulation system.

[0014] As a preferred solution of the novel computer placement device of the present invention, a slide groove is provided at the top of the storage cavity, a roller is rollingly connected to the top of the heat conducting plate, and the roller is rollingly connected in the slide groove.

[0015] Beneficial effects of the present invention:

[0016] (1) The present invention constructs a complete cooling circulation system through a heat exchanger and a heat conduction plate, a heat conduction pipe, a coolant pump, and heat dissipation fins. The coolant efficiently conducts and dissipates the heat generated by the host during the circulation process. The heat dissipation fins extend to the outside of the cabinet, completely isolating the possibility of dust intrusion. The coolant is preferably an ethylene glycol aqueous solution, which has good thermal conductivity, antifreeze and corrosion resistance, ensuring stability and high efficiency in long-term operation. In addition, the two coolant pumps configured in the system are respectively located on the upper left and lower right connecting pipes. This layout can evenly distribute the flow rate and pressure of the coolant, ensuring the smooth operation of the cooling cycle. The overall heat dissipation system solves the problems of insufficient heat dissipation performance and dust intrusion in traditional closed storage equipment, and ensures the operating stability and hardware safety of the host.

[0017] (2) The present invention designs a limit groove, a limit block, a telescopic rod and a telescopic spring in the storage cavity, so that the position of the heat conduction plate can be adjusted according to the different specifications of the host to meet different storage requirements. The connection between the connecting pipe and the heat exchanger adopts a retractable hose design, which is made of high-temperature, corrosion-resistant elastic materials, which not only improves the convenience of installation, but also enhances the diversity of the applicable environment of the equipment. In general, the present invention provides a new type of computer placement equipment that is efficient, flexible and easy to maintain through innovative design concepts. It is widely applicable to scenes such as homes, offices and data centers, and can effectively extend the service life of the host and improve working performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0019] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0020] Figure 2 It is a front view of the present invention;

[0021] Figure 3 A top sectional view of the present invention;

[0022] Figure 4 For the present invention Figure 3 A schematic diagram of the structure enlargement at the center A;

[0023] Figure 5 is a side sectional view of the present invention;

[0024] Figure 6 It is a three-dimensional diagram of the cooling circulation system structure of the present invention. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0028] Example

[0029] Reference Figure 1 to Figure 6 , which is the first embodiment of the present invention, provides a new type of computer placement device, including a cabinet 100, and a heat dissipation mechanism 200 arranged inside the cabinet 100. The heat dissipation mechanism 200 can not only quickly reduce the temperature in the storage cavity through efficient heat conduction and heat dissipation design, but also prevent external dust from entering, thereby ensuring normal heat dissipation of the computer host while protecting it from the influence of dust, thereby improving the operating stability and service life of the equipment.

[0030] Specifically, a storage cavity 101 is opened inside the cabinet 100, and support components 102 are provided on the left and right sides of the storage cavity 101. The support components 102 are used to fix and support the heat conducting plate 202 to stabilize its position and maintain contact with the host to facilitate heat conduction. In addition, the heat exchanger 201 fixedly installed on the rear wall of the storage cavity 101 by the heat dissipation mechanism 200 is the core component of the entire heat dissipation cycle. The model can be Tongfang T-200 high-efficiency heat exchanger, which mainly receives the heat conducted by the heat pipe 203, and dissipates the heat efficiently to the outside through its internal pipes and the circulation transfer of the coolant.

[0031] The heat dissipation mechanism 200 also includes a heat conducting plate 202 mounted on two sets of support components 102. The host can be limitedly clamped between the two heat conducting plates 202. The heat conducting plate 202 is used to collect the heat generated during the operation of the host, and conduct the heat to the heat exchanger 201 through the heat conducting pipe 203 fixedly installed inside it. The model can be an aluminum-based nickel-plated heat conducting plate to improve the thermal conductivity. The upper and lower output ends of the heat conducting pipe 203 are respectively connected with connecting pipes 204. The connecting pipe 204 is responsible for circulating the coolant in the heat dissipation system to ensure the safety and stability of fluid transportation. The other ends of the four connecting pipes 204 are all connected to the pipes inside the heat exchanger 201, realizing the closed-loop circulation of the coolant. The rear end of the heat exchanger 201 is fixedly installed with a heat dissipation fin 205. The function of the heat dissipation fin 205 is to further expand the heat dissipation area. By penetrating the rear wall of the cabinet 100 and extending to the outside, the excess internal heat is quickly dissipated, thereby effectively ensuring the low temperature environment inside the storage cavity 101 and the stability of the equipment operation.

[0032] It should be noted that each end of the connecting pipe 204 is connected to the pipe inside the heat exchanger 201 using a standardized quick-connect connector to ensure the tightness and convenience of the connection. The heat exchanger 201 is indeed equipped with multiple flow-conducting pipes. These pipes are designed as parallel or series structures according to system requirements. The materials can be copper or stainless steel with corrosion resistance and high thermal conductivity. During operation, the coolant in the heat-conducting pipe 203 flows into the pipe inside the heat exchanger 201 through the connecting pipe 204. Inside the heat exchanger 201, the coolant is fully in contact with the metal plate or fin of the heat exchanger through the flow-conducting pipe, absorbing the heat generated by the host and taking it away. Subsequently, the coolant is transported back to the heat-conducting pipe 203 through the connecting pipe 204 at the other end, thereby completing the circulation cooling process. This design ensures that the coolant flows smoothly in the entire system and can dissipate heat efficiently.

[0033] Furthermore, a limiting groove 103 is provided on the inner side of the cabinet 100, which is mainly used to limit the horizontal movement range of the support assembly 102 to ensure the stability and guidance of its movement. The support assembly 102 includes a limiting block 102a slidably connected to the inside of the limiting groove 103. The limiting block 102a slides freely in the limiting groove 103, so that the support assembly 102 can adjust its position as needed to adapt to host computers of different specifications. One end of the limiting block 102a is fixedly connected to a telescopic rod 102b, and the other end of the telescopic rod 102b is fixedly connected to the outer wall of the heat conducting plate 202, which plays a role in supporting and transmitting displacement, so that the heat conducting plate 202 can move with the sliding of the support assembly 102, and the outer surface of the telescopic rod 102b A telescopic spring 102c is sleeved on the surface, one end of the telescopic spring 102c is fixedly connected to the outer wall of the storage cavity 101, and the other end is fixedly connected to the outer wall of the heat conductive plate 202. The telescopic spring 102c provides a self-resetting function, so that the heat conductive plate 202 can return to its initial position when the external force disappears. This design ensures that the two heat conductive plates 202 have a certain horizontal movement function, so that when the main unit is installed in the storage cavity 101, the heat conductive plate 202 can clamp the main unit under the action of the telescopic spring 102c, providing stable support and good thermal contact effect. At the same time, the mobility of the heat conductive plate 202 also facilitates the installation and disassembly process of the main unit, and improves the adaptability and operational convenience of the equipment.

[0034] It should be noted that one end of the four connecting pipes 204 connected to the heat exchanger 201 is set as a retractable hose 207. The hose 207 is made of a high temperature resistant and corrosion resistant elastic material, such as silicone or fluororubber, to ensure that it can be used for a long time in a high temperature environment without performance degradation. The design of the hose 207 can adapt to the free movement of the connecting pipe 204 while ensuring the circulation stability of the coolant. Through this arrangement, when the heat conducting plate 202 drives the heat conducting pipe 203 and the connecting pipe 204 to move horizontally, the high elasticity and retractability of the hose 207 allows it to move synchronously with the connecting pipe 204, avoiding the problem of pipe damage or breakage caused by rigid connection. In addition, the retractable performance of the hose 207 not only enables the heat conducting pipe 203 and the connecting pipe 204 to smoothly cooperate with the movement of the heat conducting plate 202, but also provides a flexible connection method, effectively reducing the stress concentration phenomenon at the pipe connection, thereby extending the service life of the overall cooling system.

[0035] Furthermore, the interior of the heat pipe 203 is provided with a coolant, and the coolant is preferably an ethylene glycol aqueous solution, which has excellent thermal conductivity and a low freezing point, and can adapt to a wide operating temperature range while efficiently conducting heat, ensuring that the heat dissipation system can operate stably in various environments. Among the four connecting pipes 204, two connecting pipes 204 are respectively installed with coolant pumps 206, which are used to drive the coolant to flow in the entire cooling circulation system to provide stable circulation power. Among them, one coolant pump 206 is fixedly installed on the connecting pipe 204 at the top of the left side, responsible for supplying coolant to the heat pipe 203 and the heat exchanger 201; the other coolant pump 206 is fixedly installed on the connecting pipe 204 at the bottom of the right side, and is used to reflux the coolant to the starting point of the cooling circulation system, thereby forming a closed cooling loop.

[0036] This dual-pump setting design can ensure that the coolant circulates at a reasonable flow rate in the cooling circulation system, thereby effectively improving the thermal conductivity and heat dissipation performance. The installation position of the coolant pump 206 has been optimized. The pump at the top left is responsible for the supply of coolant, while the pump at the bottom right is responsible for reflux. This upper supply and lower return circulation method can minimize the uneven flow rate problem caused by gravity, further improving the stability and operation efficiency of the system. At the same time, the application of ethylene glycol aqueous solution, combined with the efficient operation of the coolant pump, enables the entire cooling system to quickly take away the heat transferred by the heat conduction plate 202 and dissipate it to the outside of the equipment in time, ensuring that the host is always within the ideal operating temperature range.

[0037] Preferably, a slide groove 104 is provided at the top of the storage cavity 101, and the slide groove 104 is used to provide a horizontal guide rail structure to ensure that the heat conducting plate 202 can move smoothly along a predetermined path. A roller 208 is rollingly connected to the top of the heat conducting plate 202, and the roller 208 is rollingly connected to the slide groove 104, and the friction generated during the movement is reduced by rolling, so that the heat conducting plate 202 can slide easily. This design not only enables the heat conducting plate 202 to move smoothly to the appropriate position, but also further reduces the energy loss caused by friction, thereby improving the overall operating efficiency of the system.

[0038] The novel computer placement device of the present invention realizes stable fixation and efficient heat dissipation of the host through an efficient heat dissipation structure. First, the host is placed in the storage cavity 101 of the cabinet 100, and the support components 102 on both sides are slid and positioned by the limit blocks 102a. The telescopic rod 102b cooperates with the telescopic spring 102c to enable the heat conducting plate 202 to move horizontally, thereby automatically clamping the host, ensuring that the heat conducting plate 202 is fully in contact with the surface of the host and stably fixed. The heat generated by the host during operation is quickly absorbed by the heat conducting plate 202 and conducted to the connecting pipe 204 through the heat conducting pipe 203 inside it. The connecting pipe 204 is responsible for conveying the coolant carrying heat to the pipe inside the heat exchanger 201. In this process, the coolant pump 206 drives the coolant to circulate to ensure the smooth transfer of heat. The guide pipe inside the heat exchanger 201 further transfers the heat to the external heat dissipation fins 205 through contact with the coolant. The fins 205 release the heat efficiently to the external environment by expanding the heat dissipation area. At the same time, one end of the four connecting pipes 204 is set as a hose 207, so that the connection between the heat pipe 203, the connecting pipe 204 and the heat exchanger 201 has a certain flexibility and elasticity, ensuring that the stability and sealing of the coolant circulation system are not affected when the heat conducting plate 202 moves. After the coolant dissipates heat inside the heat exchanger 201, it flows back to the heat pipe 203 through the connecting pipe 204 at the other end, thereby completing a closed-loop heat dissipation cycle.

[0039] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangement, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to numerous modifications still falling within the scope of the appended claims.

[0040] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0041] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0042] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A new type of computer placement device, characterized in that: include, A cabinet (100), wherein a storage cavity (101) is provided inside the cabinet (100), and support assemblies (102) are provided on both left and right sides of the storage cavity (101); and, The heat dissipation mechanism (200) comprises a heat exchanger (201) fixedly mounted on the rear wall of the storage cavity (101) and a heat conduction plate (202) mounted on two groups of the support assemblies (102); heat conduction pipes (203) are fixedly mounted inside the two heat conduction plates (202); the output ends on the upper and lower sides of the two heat conduction pipes (203) are connected to connecting pipes (204); the other ends of the four connecting pipes (204) are connected to the pipes inside the heat exchanger (201); a heat dissipation fin (205) is fixedly mounted at the rear end of the heat exchanger (201); and the rear end of the heat dissipation fin (205) passes through the rear wall of the cabinet (100) and extends outside thereof.

2. The novel computer placement device as claimed in claim 1, characterized in that: A limiting groove (103) is provided on the inner side of the cabinet (100); the supporting assembly (102) comprises a limiting block (102a) slidably connected to the inside of the limiting groove (103); a section of the limiting block (102a) is fixedly connected to a telescopic rod (102b); the other end of the telescopic rod (102b) is fixedly connected to the outer wall of the heat conducting plate (202); a telescopic spring (102c) is sleeved on the outer surface of the telescopic rod (102b); one end of the telescopic spring (102c) is fixedly connected to the outer wall of the storage cavity (101); and the other end is fixedly connected to the outer wall of the heat conducting plate (202).

3. The novel computer placement device as claimed in claim 2, characterized in that: Among the four connecting pipes (204), two connecting pipes (204) are respectively installed with a coolant pump (206), one of the coolant pumps (206) is fixedly installed on the connecting pipe (204) at the top end on the left side, and the other coolant pump (206) is fixedly installed on the connecting pipe (204) at the bottom end on the right side.

4. The novel computer placement device as claimed in claim 3, characterized in that: A cooling liquid is provided inside the heat conducting pipe (203), and the cooling liquid is preferably an ethylene glycol aqueous solution.

5. The novel computer placement device as claimed in claim 4, characterized in that: One end of each of the four connecting pipes (204) connected to the heat exchanger (201) is configured as a retractable hose (207), and the hose (207) is made of a high temperature resistant and corrosion resistant elastic material.

6. The novel computer placement device as claimed in claim 5, characterized in that: The heat conducting pipe (203), the connecting pipe (204), the coolant pump (206), the hose (207), the heat exchanger (201) and the heat dissipation fins (205) together constitute a complete cooling circulation system.

7. The novel computer placement device as claimed in claim 6, characterized in that: A slide groove (104) is provided at the top of the storage cavity (101), a roller (208) is rollingly connected to the top of the heat conducting plate (202), and the roller (208) is rollingly connected in the slide groove (104).

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