A quality monitoring method for a pure adhesive film production line

Abstract

The present invention relates to the technical field of image processing. More specifically, the present invention relates to a quality monitoring method for a pure glue film production line. The method includes: obtaining a light intensity matrix of a target area, calculating the maximum number of sampling times of a selected monitoring area based on the number of moving position points of any position point in the target area when a new light intensity matrix is collected next time, and continuously collecting the light intensity matrix corresponding to the monitoring area until the number of sampling times is equal to the maximum number of sampling times. According to the average light intensity of each position point in the monitoring area at all sampling times, the light intensity index of the corresponding position point is determined, so as to obtain a light intensity index matrix, and the quality of the monitoring area is monitored according to the comparison result between the abnormal index and a preset threshold. The present invention can accurately monitor the unevenness of the glue film thickness in the glue film production process and realize the accurate monitoring of the glue film quality.

Description

Technical Field

[0001] The present invention relates to the technical field of image processing. More specifically, the present invention relates to a quality monitoring method for a pure adhesive film production line. Background Art

[0002] Pure adhesive films are commonly used in multiple fields such as electronic products, optical devices, packaging materials, etc. In these applications, the quality of the adhesive film is directly related to the performance and reliability of the final product. For example, in optical display devices, the transparency, optical transmittance, and uniformity of the adhesive film will significantly affect the display effect and service life; in the packaging field, the thickness uniformity and mechanical strength of the adhesive film are crucial for its protective effect. Therefore, ensuring that the adhesive film has consistent quality standards during the production process, especially maintaining the thickness uniformity of the adhesive film, is the basis for improving product quality and enhancing market competitiveness.

[0003] The thickness uniformity of the adhesive film is one of the key indicators for evaluating its quality. The non-uniformity of the adhesive film thickness will not only affect its physical properties such as tensile strength, elasticity, and durability, but may also lead to the failure of the adhesive film in actual applications. For example, too thin thickness in some areas may cause the adhesive film to be easily broken or lose its protective function, while too large thickness may cause the adhesive film to not achieve the ideal effect in specific applications. Therefore, quality monitoring during the adhesive film production process, especially the monitoring of the adhesive film thickness uniformity, plays a crucial role.

[0004] However, in the prior art, the quality monitoring of the adhesive film mainly relies on the measurement of light intensity. The traditional light intensity matrix acquisition technology is to vertically irradiate the surface of the adhesive film with a light source emitter and measure the reflected light intensity to evaluate the quality of the adhesive film. The advantage of this method is that it can quickly obtain a large amount of light data, thereby reflecting the general quality of the adhesive film surface. However, the light intensity matrix acquisition method has certain limitations in actual applications, especially when dealing with wrinkles or folds that may appear on the adhesive film surface. The presence of wrinkles or folds will change the surface morphology of the adhesive film, resulting in deviations in the reflected light intensity data, and the obtained light intensity data may not accurately reflect the actual quality of the adhesive film, thereby affecting the accuracy of quality assessment. Summary of the Invention

[0005] To solve the problem that the non-uniformity degree of the adhesive film thickness cannot be accurately measured, resulting in a low accuracy of the quality assessment result, the present invention provides a quality monitoring method for a pure adhesive film production line. The method includes:

[0006] During the transmission of the adhesive film, obtaining the light intensity matrix received when a light source emitter vertically irradiates a target area in the adhesive film;

[0007] Determine the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time, select a monitoring area from the position in the target area far from the film transmission direction, obtain the number of column vectors of the light intensity matrix corresponding to the remaining area, and calculate the maximum sampling times of the monitoring area. The maximum sampling times is the largest integer less than the ratio of the number of column vectors to the number of moving position points;

[0008] Continuously collect the light intensity matrix corresponding to the monitoring area until the sampling times is equal to the maximum sampling times. Take the ratio of the average light intensity of any position point in the monitoring area at all sampling times to the preset standard light intensity as the light intensity index of this position point, and obtain the light intensity index matrix;

[0009] Calculate the anomaly index of the monitoring area : ; 、 are respectively the minimum value and the maximum value in the light intensity index matrix; is the entropy of the light intensity index matrix; is the absolute value symbol; Based on the comparison result of the anomaly index and the preset threshold, conduct quality monitoring on the monitoring area.

[0010] By calculating the light intensity index matrix corresponding to the monitoring area, the present invention can eliminate the influence of wrinkles or bending of the film on thickness monitoring, so as to accurately evaluate the light intensity of each position point in the monitoring area, provide an accurate data basis for evaluating the thickness distribution of the film in the monitoring area, and further realize the accurate monitoring of the film quality.

[0011] Preferably, the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time satisfies the following relational expression:

[0012] ;

[0013] In the formula, is the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time; is the transmission speed of the film; is the sampling frequency of the light intensity matrix; is the length of the light source emitter; is the number of column vectors in the light intensity matrix corresponding to the target area; is the ceiling symbol.

[0014] By calculating the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time, the present invention provides a data basis for subsequent calculation of the maximum sampling times of the monitoring area.

[0015] Preferably, the length of the monitoring area is half of the length of the target area.

[0016] The present invention can not only ensure the data volume of the light intensity matrix corresponding to the collected monitoring area, but also ensure that the size of the film area monitored each time is at a relatively high level, thereby ensuring the accuracy and efficiency of the film quality monitoring.

[0017] Preferably, the maximum number of sampling times of the monitoring area satisfies the following relational expression:

[0018] ;

[0019] In the formula, is the maximum number of sampling times of the monitoring area; is the number of column vectors in the light intensity matrix corresponding to the target area; is the number of moving position points of any position point in the target area when a new light intensity matrix is collected next time; is the number of sampling times; is the positive integer symbol; is the function with the return value of the maximum value.

[0020] Preferably, the light intensity index of any position point in the monitoring area satisfies the following relational expression:

[0021] ;

[0022] In the formula, is the light intensity index of the position point with the abscissa of and the ordinate of in the monitoring area; is the number of moving position points of any position point in the target area when a new light intensity matrix is collected next time; is the sampling order of the monitoring area; is the maximum number of sampling times of the monitoring area; is the preset standard light intensity; wherein, the transmission direction of the film is the positive direction of the abscissa.

[0023] The present invention eliminates the influence of wrinkles or bending in the monitoring area on the obtained light intensity, so as to accurately measure the light intensity of each position point in the monitoring area, providing an accurate data basis for subsequent evaluation of the thickness uniformity of the film in the monitoring area.

[0024] Preferably, the entropy of the light intensity index matrix satisfies the following relational expression:

[0025] ;

[0026] In the formula, is the entropy of the light intensity index matrix; is the proportion of the value in the light intensity index matrix; ; is the exponential function with base 2 of natural numbers; is the length of the light source emitter.

[0027] Preferably, according to the comparison result between the anomaly index and the preset threshold, quality monitoring is performed on the monitoring area, including:

[0028] Obtain the preset threshold. If the anomaly index of the monitoring area is greater than the threshold, it is determined that the quality of the glue film in the monitoring area does not meet the standard;

[0029] If the anomaly index of the monitoring area is less than or equal to the threshold, it is determined that the quality of the glue film in the monitoring area meets the standard.

[0030] The present invention can achieve precise monitoring of the quality of the glue film.

[0031] Preferably, the number of row and column vectors in the light intensity matrix corresponding to the target area corresponds to the dimension of the light source arrangement in the light source emitter.

[0032] Preferably, the step size between adjacent position points in the target area is the interval length between adjacent light sources in the light source emitter.

[0033] Preferably, during the transmission of the glue film, the abscissa of each position point in the monitoring area gradually increases along the transmission direction, while the ordinate remains unchanged.

[0034] The present invention has the following effects:

[0035] 1. By calculating the light intensity index matrix corresponding to the monitoring area, the present invention can accurately measure the light intensity of each position point in the monitoring area, thereby providing an accurate data basis for subsequent evaluation of the quality of the glue film in the monitoring area.

[0036] 2. The present invention calculates the anomaly index of the monitoring area by integrating various data, ensuring the accuracy of the calculation result, thereby being able to accurately measure the unevenness of the thickness of the glue film in the monitoring area and achieving precise monitoring of the quality of the glue film in the monitoring area. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] By referring to the accompanying drawings and reading the following detailed description, the above and other objects, features, and advantages of the exemplary embodiments of the present invention will become easily understood. In the drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0038] Figure 1 is a schematic flow chart of the steps of a quality monitoring method for a pure glue film production line according to an embodiment of the present invention.

[0039] Figure 2 It is a schematic diagram of the placement positions of the light source emitter and the receiver when obtaining the light intensity matrix in the embodiments of the present invention. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0041] Next, the detailed implementation manners of the present invention will be described in conjunction with the accompanying drawings.

[0042] Referring to Figure 1 , a quality monitoring method for a pure adhesive film production line includes steps S1 - S5, specifically as follows:

[0043] S1: During the transmission of the adhesive film, obtain the light intensity matrix received when the light source emitter vertically irradiates the target area in the adhesive film.

[0044] It should be noted that since the light intensity images received by the receiver are inconsistent when adhesive films of different thicknesses are irradiated by light, that is, the light transmittance of the thicker adhesive film is low and the received light intensity is relatively small, while the light transmittance of the thinner adhesive film is high and the corresponding light intensity is relatively large. Therefore, the present invention analyzes based on the light intensity matrix, which can evaluate the uniformity of the adhesive film thickness and thus evaluate the quality of the adhesive film.

[0045] Specifically, referring to Figure 2 as shown, a light source emitter can be placed below the adhesive film transmission device and at a position between two rollers, and the position is fixed to vertically irradiate the adhesive film, and a receiver is arranged on the other side to receive the light intensity after the light source vertically irradiates the corresponding position of the adhesive film, so as to obtain the light intensity matrix of the target area irradiated by the light source emitter. Among them, the target area is the area of the adhesive film irradiated by the light source emitter, and the light intensity matrix refers to a two-dimensional matrix composed of the light intensities at each position received by the receiver when the light source emitter irradiates the target area.

[0046] In an exemplary embodiment of the present invention, the number of row and column vectors in the light intensity matrix corresponding to the target area corresponds to the dimension of the light source arrangement in the light source emitter.

[0047] For example, if the light sources in the light source emitter are arranged in a 3 (rows) × 4 (columns) manner, the number of row vectors in the light intensity matrix corresponding to the target area is 3, and the number of column vectors is 4.

[0048] S2: Determine the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time.

[0049] In an exemplary embodiment of the present invention, the position point refers to the coordinate position of the light source emitter irradiating the corresponding film area in the target area. It should be noted that the step length between adjacent position points is the interval length between adjacent light sources in the light source emitter.

[0050] Specifically, the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time satisfies the following relational expression:

[0051] ;

[0052] In the formula, is the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time; is the transmission speed of the film; is the sampling frequency of the light intensity matrix; is the length of the light source emitter; is the number of column vectors in the light intensity matrix corresponding to the target area; is the ceiling symbol.

[0053] Among them, reflects the sampling interval of the light intensity matrix; reflects the displacement of any position point in the target area when collecting a new light intensity matrix next time; reflects the proportion of this displacement in the length of the light source emitter. Multiplying this value by the number of column vectors in the light intensity matrix corresponding to the target area can reflect the number of position points corresponding to this displacement, so as to obtain the number of moving position points of this position point when collecting a new light intensity matrix next time.

[0054] It should be noted that by calculating the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time, it is convenient to find the moving positions of each position point in the target area when continuously collecting the light intensity matrix, thus providing a data basis for subsequent evaluation of the quality of the film.

[0055] S3: Select a monitoring area from the positions in the target area far from the film transmission direction, obtain the number of column vectors of the light intensity matrix corresponding to the remaining area, and calculate the maximum sampling times of the monitoring area. The maximum sampling times is the largest integer less than the ratio of the number of column vectors to the number of moving position points.

[0056] It should be noted that during the acquisition of the light intensity matrix, the tension on the adhesive film may cause the adhesive film to curl, resulting in a change in the thickness of the adhesive film. Therefore, the present invention continuously monitors the light intensity at each position point in the monitoring area to ensure the accuracy of the determined light intensity.

[0057] In an exemplary embodiment of the present invention, the length of the monitoring area is half of the length of the target area.

[0058] Optionally, when the left side of the target area is close to the transmission direction of the adhesive film, the right half of the target area is used as the monitoring area, so that the light intensity matrix corresponding to the monitoring area can be continuously acquired during the transmission of the adhesive film, in order to accurately evaluate the non-uniformity of the adhesive film in the monitoring area. It should be noted that selecting half of the target area as the monitoring area can ensure the sampling times of the light intensity matrix corresponding to the monitoring area while covering a relatively large area of the adhesive film to be monitored, thus guaranteeing the accuracy and efficiency of the adhesive film quality monitoring.

[0059] In another embodiment, the length of the selected monitoring area can also be less than or greater than half of the length of the target area.

[0060] Furthermore, after determining the monitoring area, the maximum sampling times of the monitoring area can be calculated. Specifically, the maximum sampling times of the monitoring area satisfy the following relational expression:

[0061] ;

[0062] In the formula, is the maximum sampling times of the monitoring area; is the number of column vectors in the light intensity matrix corresponding to the target area; is the number of moving position points of any position point in the target area when a new light intensity matrix is acquired next time; is the sampling times; is the positive integer symbol, indicating the positive integer part of; is the function that returns the maximum value.

[0063] Among them, reflects the number of column vectors in the light intensity matrix corresponding to the area in the target area other than the monitoring area; reflects the number of times the light intensity matrix corresponding to the monitoring area can be acquired; it should be noted that since the value of may not be an integer, the present invention takes the largest positive integer less than this value as the maximum sampling times of the monitoring area, so that the light intensity matrix corresponding to the monitoring area can be continuously acquired multiple times to continuously monitor the light intensity at each position point in the monitoring area.

[0064] S4: Continuously collect the light intensity matrix corresponding to the monitoring area until the number of sampling times is equal to the maximum number of sampling times. Take the ratio of the average light intensity of any position point in the monitoring area at all sampling times to the preset standard light intensity as the light intensity index of this position point, and obtain the light intensity index matrix.

[0065] In an exemplary embodiment of the present invention, the light intensity index is a parameter used to measure the light intensity level of any position point in the monitoring area under continuous multiple samplings. For example, when the light intensity of any position point in the monitoring area is relatively large under continuous multiple samplings, it indicates that the light transmittance of this position point is relatively high, and the thickness of the glue film area corresponding to this position point is relatively thin; on the contrary, it indicates that the light transmittance of this position point is relatively low, and the thickness of the glue film area corresponding to this position point is relatively thick. Therefore, according to the light intensity indexes of each position point in the monitoring area, the thickness uniformity of the glue film areas of each position point in the monitoring area can be measured to realize the quality monitoring of the monitoring area.

[0066] Specifically, the light intensity index of any position point in the monitoring area satisfies the following relational expression:

[0067] ;

[0068] In the formula, is the light intensity index of the position point with abscissa and ordinate in the monitoring area; is the number of moving position points of any position point in the target area when collecting a new light intensity matrix next time; is the sampling order of the monitoring area; is the maximum number of sampling times of the monitoring area; is the preset standard light intensity, which is used as the reference value for the value. It can be set according to specific circumstances, and the present embodiment does not make special limitations on the value; among them, the transmission direction of the glue film is the positive direction of the abscissa.

[0069] It should be noted that since the present invention defines the transmission direction of the glue film as the positive direction of the abscissa of the position point, during the transmission of the glue film, the abscissa of each position point in the monitoring area will gradually increase along the transmission direction, while the ordinate remains unchanged.

[0070] Furthermore, the light intensity indexes of each position point in the monitoring area can be calculated using the calculation formula of the light intensity index, so as to obtain the light intensity index matrix corresponding to the monitoring area.

[0071] S5: Calculate the anomaly index of the monitoring area, and perform quality monitoring on the monitoring area according to the comparison result between the anomaly index and the preset threshold.

[0072] In an exemplary embodiment of the present invention, the anomaly index refers to the data for measuring the quality of the glue film in the monitoring area. For example, when the thickness of the glue film in the monitoring area is uneven, it indicates that the quality of the glue film in the monitoring area is poor, and the anomaly index of the corresponding monitoring area is relatively large; on the contrary, the anomaly index of the monitoring area is relatively small. Therefore, the quality of the glue film in the monitoring area can be monitored by comparing the anomaly index of the monitoring area with the preset threshold.

[0073] Specifically, the anomaly index of the monitoring area satisfies the following relational expression:

[0074] ;

[0075] In the formula, is the anomaly index of the monitoring area; , are respectively the minimum value and the maximum value in the light intensity index matrix; is the entropy of the light intensity index matrix; is the absolute value symbol.

[0076] Among them, reflects the ratio of the minimum value to the maximum value in the light intensity index matrix. The smaller this value is, the relatively larger the difference in the data in the light intensity index matrix is, and further indicates that the uniformity of the thickness of the glue film in the monitoring area is poor, and the corresponding anomaly index of the monitoring area is relatively large.

[0077] reflects the degree of chaos of the light intensity index matrix. The larger this value is, the more chaotic the difference in the thickness of the glue film in the monitoring area is, and there may be a situation of alternating thin and thick, and further indicates that the quality of the glue film in the monitoring area is poor, and the corresponding anomaly index of the monitoring area is relatively large.

[0078] Among them, ; is the proportion of the value in the light intensity index matrix; is the exponential function with the natural number 2 as the base; is the length of the light source emitter. It should be noted that the calculation process of entropy is a prior art, and this embodiment will not be described in detail here.

[0079] In an exemplary embodiment of the present invention, the quality monitoring of the monitoring area can be achieved through the following steps:

[0080] Obtain a preset threshold. If the anomaly index of the monitoring area is greater than the threshold, it is determined that the quality of the glue film in the monitoring area does not meet the standard; if the anomaly index of the monitoring area is less than or equal to the threshold, it is determined that the quality of the glue film in the monitoring area meets the standard.

[0081] Optionally, the threshold can be set to 0.3. When the anomaly index of the monitoring area is less than or equal to 0.3, it indicates that the thickness of the glue film in the monitoring area is relatively uniform, and it is determined that the quality of the glue film in the monitoring area meets the standard; while when the anomaly index of the monitoring area is greater than 0.3, it indicates that the uniformity of the thickness of the glue film in the monitoring area is poor, and it is determined that the quality of the glue film in the monitoring area is abnormal, that is, it does not meet the standard, and an alarm is issued or other means are used to remind the relevant staff that there are quality problems with the film thickness in the monitoring area to ensure the quality of the produced glue film.

[0082] In the description of this specification, the meanings of "a plurality of" and "several" are at least two, such as two, three or more, etc., unless otherwise clearly and specifically defined.

[0083] Although this specification has shown and described multiple embodiments of the present invention, it is obvious to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will think of many changes, alterations and alternative ways without departing from the spirit and idea of the present invention. It should be understood that various alternative solutions to the embodiments of the present invention described herein can be adopted in the process of practicing the present invention.

Claims

1. A quality monitoring method for a pure film production line, characterized in that: include: During the transmission of the adhesive film, the light intensity matrix received when the light source emitter vertically irradiates the target area in the adhesive film is obtained; Determine the number of moving points of any position point in the target area when collecting a new light intensity matrix next time, satisfying the following relationship: , is the number of moving positions of any position point in the target area when a new light intensity matrix is ​​collected next time. is the transmission speed of the film, is the sampling frequency of the light intensity matrix, is the length of the light emitter, is the number of column vectors in the illumination intensity matrix corresponding to the target area, The sign is rounded up; the monitoring area is selected from the position far away from the film transmission direction in the target area, and the number of column vectors of the light intensity matrix corresponding to the remaining area is obtained; the maximum sampling number of the monitoring area is calculated to satisfy the following relationship: , is the maximum number of sampling times in the monitoring area, is the sampling number, is a positive integer sign, It is a function that returns the maximum value; Continuously collecting the light intensity matrix corresponding to the monitoring area until the number of sampling times is equal to the maximum number of sampling times; Calculate the light intensity index of any point in the monitoring area to satisfy the following relationship: , The horizontal coordinate is , the vertical axis is The light intensity index at the location point, is the sampling order of the monitoring area, To preset the standard light intensity, the transmission direction of the film is the positive direction of the horizontal axis; and the light intensity index matrix is ​​obtained; Calculate the anomaly index of the monitoring area : ; , are the minimum and maximum values ​​in the light intensity index matrix respectively; is the entropy of the light intensity index matrix; It is an absolute value symbol; the quality of the monitoring area is monitored based on the comparison result between the abnormal index and the preset threshold.

2. A quality monitoring method for a pure adhesive film production line according to claim 1, characterized in that: The length of the monitoring area is half the length of the target area.

3. A quality monitoring method for a pure adhesive film production line according to claim 1, characterized in that: The entropy of the light intensity index matrix satisfies the following relationship: ； In the formula, is the entropy of the light intensity index matrix; The value in the light intensity index matrix is The proportion of is an exponential function with the natural number 2 as base; is the length of the light emitter.

4. The quality monitoring method for a pure adhesive film production line according to claim 1, characterized in that: The quality monitoring of the monitoring area according to the comparison result of the abnormal index and the preset threshold value includes: Obtaining a preset threshold value, and if the abnormality index of the monitoring area is greater than the threshold value, determining that the quality of the film in the monitoring area does not meet the standard; If the abnormality index of the monitoring area is less than or equal to the threshold, it is determined that the quality of the film in the monitoring area meets the standard.

5. The quality monitoring method for a pure adhesive film production line according to claim 1, characterized in that: The number of row and column vectors in the light intensity matrix corresponding to the target area corresponds to the dimension of the light source arrangement in the light emitter.

6. The quality monitoring method for a pure adhesive film production line according to claim 1, characterized in that: The step length between adjacent position points in the target area is the interval length between adjacent light sources in the light source emitter.

7. The quality monitoring method for a pure adhesive film production line according to claim 1, characterized in that: During the transmission of the film, the horizontal coordinate of each position point in the monitoring area will gradually increase along the transmission direction, while the vertical coordinate remains unchanged.

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