Expansion section material analysis method, device, equipment, medium and program product

Abstract

The invention provides an expansion section material analysis method, device and equipment, a medium and a program product, and the method comprises the steps: constructing a microscopic model of an expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determining a representative volume unit of the microscopic model; determining thermal boundary conditions and mechanical boundary conditions of the representative volume element based on the expansion section material; applying the mechanical boundary conditions to the microscopic model to obtain a mechanical analysis result of the expansion section material; and determining a thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary conditions. The invention provides a detailed and accurate thermodynamic analysis method for the expansion section material by performing thermal and mechanical analysis on the microscopic model of the expansion section material.

Description

Technical Field

[0001] The present invention relates to the technical field of material analysis, and in particular to an expansion section material analysis method, device, equipment, medium and program product. Background Art

[0002] In the material analysis of the expansion section under high temperature and high pressure, it is assumed that the expansion section material will be subjected to continuous high temperature and high pressure, resulting in ablation or micro deformation. Because the use environment of the expansion section material is extremely demanding, the slight feedback under the effect of the environment will also have a great impact on the expansion section material, resulting in larger product defects. Therefore, how to conduct an intuitive and detailed analysis of the expansion section material has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] The present invention provides an expansion section material analysis method, device, equipment, medium and program product, which are used to solve the defect of insufficiently detailed and accurate analysis in the existing expansion section material analysis technology, and realize more detailed and accurate expansion section material analysis.

[0004] The present invention provides an expansion section material analysis method, comprising the following steps.

[0005] Based on a scanning electron microscope image of the expansion section material to be analyzed, construct a microscopic model of the expansion section material, and determine a representative volume unit of the microscopic model; Determining thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the expansion section material; Applying the mechanical boundary conditions to the microscopic model to obtain mechanical analysis results of the expansion section material; Based on the microscopic model and the thermal boundary conditions, a thermal analysis result of the expansion section material is determined.

[0006] According to a method for analyzing expansion section materials provided by the present invention, the step of constructing a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed and determining a representative volume unit of the microscopic model comprises: Performing structural analysis on the scanning electron microscope image of the expansion section material to be analyzed, and obtaining the structural distribution period; Constructing a microscopic model of the expansion section material based on the structural distribution period; Based on the material properties of the expansion section material, a representative volume unit of the microscopic model is determined.

[0007] According to a method for analyzing expansion section materials provided by the present invention, determining the thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the expansion section material includes: Meshing the representative volume unit to obtain a thermal unit set and a mechanical unit set; Based on the thermal unit set and the mechanical unit set, thermal boundary conditions and mechanical boundary conditions are determined.

[0008] According to a method for analyzing expansion section materials provided by the present invention, applying the mechanical boundary conditions to the microscopic model to obtain the mechanical analysis results of the expansion section materials includes: Applying the mechanical boundary conditions to the microscopic model to obtain a stress cloud map of the expansion section material; the stress cloud map is used to characterize stress information at each position of the microscopic model; The mechanical analysis result of the expansion section material is determined based on the stress cloud map.

[0009] According to a method for analyzing expansion section materials provided by the present invention, determining the thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary condition includes: determining a heat transfer parameter based on the thermal boundary condition; Constructing a heat transfer model according to the heat conduction parameters; Based on the microscopic model and the heat transfer model, a thermal analysis result of the expansion section material is determined.

[0010] According to an expansion section material analysis method provided by the present invention, the mechanical boundary conditions include multiple types of stresses; the expansion section material analysis method further includes: Applying multiple types of stress to the microscopic model to obtain the magnitudes of principal stresses in multiple directions of the microscopic model; Determining the stress transfer path and stress concentration point of the micromodel based on the magnitude of the principal stresses in multiple directions of the micromodel; A stress optimization scheme is determined based on the stress transfer path and the stress concentration point.

[0011] The present invention also provides an expansion section material analysis device, comprising the following modules: A representative volume unit determination module is used to construct a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determine a representative volume unit of the microscopic model; A boundary condition determination module, used for determining the thermal boundary condition and the mechanical boundary condition of the representative volume unit based on the material of the expansion section; A material mechanics analysis module, used for applying the mechanical boundary conditions to the microscopic model to obtain a mechanical analysis result of the expansion section material; The material thermal analysis module is used to determine the thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary conditions.

[0012] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, any of the above-described expansion section material analysis methods is implemented.

[0013] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the expansion section material analysis method as described in any one of the above is implemented.

[0014] The present invention also provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the expansion section material analysis method as described above is implemented.

[0015] The expansion section material analysis method, device, equipment, medium and program product provided by the present invention obtains a scanning electron microscope image of the expansion section material to be analyzed, constructs a microscopic model of the expansion section material, further determines a representative volume unit of the microscopic model, and determines the thermal boundary conditions and mechanical boundary conditions of the expansion section material on the basis of the representative volume unit, and then applies the determined thermal boundary conditions and mechanical boundary conditions to the microscopic model respectively, and finally obtains the mechanical analysis results and thermal analysis results of the expansion section material. The present invention provides a detailed and accurate analysis method of the thermodynamics of the expansion section material by performing thermal and mechanical analysis on the microscopic model of the expansion section material. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic flow chart of the expansion section material analysis method provided by the present invention.

[0018] Figure 2 It is a two-dimensional schematic diagram of a representative volume unit in the expansion section material analysis method provided by the present invention.

[0019] Figure 3 It is a three-dimensional schematic diagram of a representative volume unit in the expansion section material analysis method provided by the present invention.

[0020] Figure 4It is a schematic diagram of the grid division of the microscopic model in the expansion section material analysis method provided by the present invention.

[0021] Figure 5 It is a schematic diagram of node temperature distribution of the microscopic model in the expansion section material analysis method provided by the present invention.

[0022] Figure 6 It is a finite element stress cloud diagram of a microscopic model in the expansion section material analysis method provided by the present invention.

[0023] Figure 7 It is a structural schematic diagram of the expansion section material analysis device provided by the present invention.

[0024] Figure 8 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] The present invention provides an analysis method for expansion section materials. For the structure of the expansion section material, a representative volume unit of a microscopic model is extracted, and a finite element calculation method is used to perform thermal and mechanical analysis and calculation on the expansion section material, so as to formulate a thermal protection plan and a mechanical protection plan for the expansion section material according to the analysis results.

[0027] Combine the following Figure 1-Figure 8 The expansion section material analysis method, device, equipment, medium and program product of the present invention are described.

[0028] Figure 1 It is one of the flow diagrams of the expansion section material analysis method provided by the present invention, such as Figure 1 As shown, the method includes the following: Step 100: construct a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determine a representative volume unit of the microscopic model; Specifically, based on obtaining a scanning electron microscope image of the expansion section material to be analyzed, the finite element method is used to solve the representative volume unit of the microscopic model, and the process is as follows.

[0029] Solving the representative volume unit of the microscopic model using numerical solution methods (such as the finite element method) requires that the periodic structure under study is a fiber composite material. The structure of the expansion section material is usually composed of a series of repeated units, each of which has the same position in the entire structure and has the same geometry and material properties.

[0030] This can be achieved by solving a periodic boundary value problem, in which the physical quantity is assumed to be periodic within the period and the solution is based on this condition. In order to extract the representative volume unit of the expansion section material, a group of fiber filaments need to be randomly sampled from the periodic structure. As data points, these fiber filaments need to be evenly distributed in the periodic structure, and the number of sampled data must be large enough to capture the key information in the structure. Using the sampled data points, the representative volume unit of the expansion section material is extracted through statistical analysis and other methods. The generated three-dimensional model (micro model) is meshed and discretized into small C3D4T units (a finite element thermal unit) and C3D4 units (another finite element mechanical unit), and the accuracy and density of the meshing can be determined according to the specific simulation requirements.

[0031] Step 200: Determine the thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the material of the expansion section; On the basis of determining the representative volume unit of the microscopic model, its thermal boundary conditions and mechanical boundary conditions are further determined. Among them, the thermal boundary conditions and mechanical boundary conditions are related to the material properties of the expansion section material (including material composition and material usage scenarios, etc.). Taking carbon fiber composite materials and phenolic resin composite materials as examples, the mechanical parameters of carbon fiber and phenolic resin are elastic modulus 250GPa and 4.1GPa, Poisson's ratio is 0.35 and 0.36, thermal parameters specific heat capacity is 1500J / (kg.K) and 1200J / (kg.K), thermal conductivity coefficient is 0.5W / (mk) and 8W / (mk), respectively, to determine the material properties of the microscopic model of the representative volume unit of the expansion section material.

[0032] Step 300: applying the mechanical boundary conditions to the microscopic model to obtain mechanical analysis results of the expansion section material; Specifically, before applying the mechanical boundary conditions to the microscopic model, the boundary conditions of the microscopic model need to be determined first. The periodic structure of the expansion section material is regarded as an infinitely extended structure, and its boundary conditions are solved within one period, as shown in the following formula 1.

[0033] ; (1)

[0034] Among them, F is the spatial function, f is the time period function, x, y and z are the spatial position coordinates, T is the period, and n is a natural constant. Formula 1 illustrates the spatial function of the two-dimensional model and 3D model space functions The periodic law of degrees of freedom to be followed during extraction.

[0035] Step 400: Determine the thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary conditions.

[0036] Specifically, in the 60 seconds after the thermal boundary conditions were applied, the results of applying the thermal boundary conditions for 10s, 20s, 30s, 40s, 50s and 60s were given respectively. Taking the carbon fiber phenolic resin-based material as an example, it can be determined that the node temperature conduction rate of the fiber is higher than that of the matrix. At the same time, it is also verified that the carbon fiber has better thermal conductivity. It is a high-strength and low-density material with a higher thermal conductivity than metal and excellent high temperature resistance. Phenolic is a plastic material with poor thermal conductivity. Therefore, in applications that require high thermal conductivity, carbon fiber is usually more suitable than phenolic. The composite of the two also plays a good protective role for the structure at different temperature stages. Thermal protection measures can be determined based on the thermal analysis results of the expansion section material.

[0037] This embodiment obtains a scanning electron microscope image of the expansion section material to be analyzed, constructs a microscopic model of the expansion section material, further determines a representative volume unit of the microscopic model, determines the thermal boundary conditions and mechanical boundary conditions of the expansion section material on the basis of the representative volume unit, and then applies the determined thermal boundary conditions and mechanical boundary conditions to the microscopic model, and finally obtains the mechanical analysis results and thermal analysis results of the expansion section material. The present invention provides a detailed and accurate analysis method of the thermodynamics of the expansion section material by performing thermal and mechanical analysis on the microscopic model of the expansion section material.

[0038] In one embodiment, the expansion section material analysis method provided in the embodiment of the present application may further include: Step 110, performing structural analysis on the scanning electron microscope image of the expansion section material to be analyzed to obtain a structural distribution period; Step 120: constructing a microscopic model of the expansion section material based on the structural distribution period; Step 130: Determine a representative volume unit of the microscopic model based on the material properties of the expansion section material.

[0039] Specifically, the process of determining the representative volume unit of the microscopic model of the expansion section material includes the following steps.

[0040] Step 1: Characterize the expansion section material. First, take a photo of the expansion section material and obtain its scanning electron microscope (SEM) image. Taking the new phenolic resin-based reinforced fiber composite material as an example, its SEM image can clearly observe the unidirectional distribution state of the carbon fiber monofilaments and the composite state of the matrix and the carbon fiber.

[0041] Step 2: According to the structural distribution law of the scanning electron microscope image of the expansion section material, the microscopic model of the expansion section material is determined, and then the structure of the analysis method of the expansion section material is determined to be randomly distributed unidirectional fibers. The entire microscopic model is a periodic structure. The two-dimensional image of the representative volume unit is as follows: Figure 2 The three-dimensional image of the representative volume unit is shown in Figure 3 As shown, the diameter of the fiber monofilament is uniformly 7 microns, and a cube with a side length of 66 microns can be selected as the geometric size of the representative volume unit. That is, the representative volume unit of the microscopic model of the expansion section material is determined based on the material properties of the expansion section material.

[0042] This embodiment provides a model basis for subsequent thermal analysis and mechanical analysis by constructing a microscopic model of the expansion section material and determining a representative volume unit of the microscopic model.

[0043] In one embodiment, the expansion section material analysis method provided in the embodiment of the present application may further include: Step 210, meshing the representative volume unit to obtain a thermal unit set and a mechanical unit set; Step 220: Determine thermal boundary conditions and mechanical boundary conditions based on the thermal unit set and the mechanical unit set.

[0044] Specifically, the specific steps for determining thermal boundary conditions and mechanical boundary conditions based on representative volume units are as follows.

[0045] Step 3: Mesh the microscopic model of the representative volume unit of the expansion section material (for example, by using meshing software Hypermesh). After meshing the representative volume unit, the following is obtained: Figure 4 The image shown in the figure shows that the thermal unit selects the C3D8T partitioning mode in Hypermesh, and the mechanical unit selects the C3D8 partitioning mode in Hypermesh. The thermal unit set and the mechanical unit set are obtained respectively.

[0046] Step 4: Further determine the thermal boundary conditions of the micro-model of the representative volume unit of the expansion section material (for example, temperature 1000°C and heating direction), and the mechanical periodic boundary conditions are completely fixed around the micro-model, so as to determine the direction and magnitude of the force in the micro-model. In summary, the thermal boundary conditions (including temperature and heating direction) and mechanical boundary conditions (including the magnitude and direction of force) of the micro-model are determined.

[0047] This embodiment further determines thermal boundary conditions and mechanical boundary conditions based on the representative volume unit of the microscopic model of the expansion section material, so as to provide analysis conditions for thermal analysis and mechanical analysis of the expansion section material.

[0048] In one embodiment, the expansion section material analysis method provided in the embodiment of the present application may further include: Step 310: applying the mechanical boundary condition to the microscopic model to obtain a stress cloud map of the expansion section material; the stress cloud map is used to characterize stress information at each position of the microscopic model; Step 320: Determine the mechanical analysis result of the expansion section material based on the stress cloud map.

[0049] Based on the mechanical boundary conditions determined above, the finite element stress cloud diagram of the micro model can be obtained by applying them to the micro model. The finite element stress cloud diagram reflects the stress conditions of the internal units (nodes) of the micro model over a period of time after the mechanical boundary conditions are applied. The stress conditions include the magnitude and direction of the force. This is to facilitate the determination of the concentrated stress points in the micro model based on the node stress conditions, and further make corresponding improvements to the expansion section material based on the concentrated stress points.

[0050] This embodiment obtains intuitive and accurate mechanical analysis results of the expansion section material by applying mechanical boundary conditions to the microscopic model.

[0051] In one embodiment, the expansion section material analysis method provided in the embodiment of the present application may further include: Step 410: determining heat conduction parameters based on the thermal boundary conditions; Step 420: construct a heat transfer model according to the heat conduction parameters; Step 430: Determine the thermal analysis result of the expansion section material based on the microscopic model and the heat transfer model.

[0052] Specifically, Figure 5 As shown, Figure 5The temperature distribution images of the nodes of the microscopic model at different times are given. The whole process is to solve and calculate the representative volume unit (of the microscopic model) of the expansion section material. For example, the problem to be analyzed is material ablation, and its process is the result of the interaction between the external thermal flow field and the heat-resistant material. Ablation is the external heating that causes the material temperature to rise. When the surface temperature reaches a certain value, a surface ablation chemical reaction occurs. The oxidant required for the reaction comes from the boundary layer diffusion of the external airflow, and the reaction products such as the generated gas diffuse outward through the boundary layer. The ablation rate depends on the combined effect of the surface chemical reaction kinetics and the boundary layer diffusion.

[0053] Surface chemical reactions will absorb some heat and reduce heat conduction into the material. At the same time, the diffusion of ablation products outward from the boundary layer will produce a heat blocking effect. Non-uniform ablation of the composite surface will produce roughness, and the ablated surface may experience mechanical erosion under the action of aerodynamic forces. The calculation follows the conservation of energy, momentum and mass. The energy conversion within the system and between it and the outside world should be balanced to ensure that the total momentum between the inside and the outside world remains unchanged during movement, transfer and conversion. The essence of heat conduction is the transfer of heat energy caused by temperature difference from a high temperature to a low temperature. Heat transfer can be carried by molecules, electromagnetic waves or photons. Energy flux of heat conduction , temperature gradient and thermal conductivity Satisfies Fourier's law .

[0054] However, from the perspective of engineering applications, some dimensionless parameters are usually used to facilitate calculations and experimental applications. At this time, for the high-temperature boundary layer, various heat transfer forms such as heat conduction, convection, diffusion and radiation are usually not strictly distinguished, but a unified heat transfer coefficient is used to represent it, as shown in the following formula 2.

[0055] ; (2)

[0056] in is the contact surface temperature, is the recovery temperature. However, at very high temperatures, enthalpy is a better characteristic parameter of energy level than temperature. Therefore, the present application proposes to change the definition of heat transfer coefficient and calculate it based on enthalpy difference, as shown in the following formula 3.

[0057] ; (3)

[0058] in is the contact surface enthalpy, is the enthalpy of recovery, is the enthalpy difference. The first law of thermodynamics is the law of conservation of energy. Assume that the internal energy of a system is E, which is the sum of the internal energies of all molecules in the system. If the work done by the outside world on a closed system is W, and the heat transferred to the system through the boundary is Q, the change in the internal energy of the system is , then the mathematical expression of the first law of thermodynamics is shown in Formula 4.

[0059] ; (4)

[0060] Assuming the process is infinitesimal, its differential form can be used, as shown in Formula 5.

[0061] ; (5)

[0062] In this embodiment, a thermal analysis result of the expansion section material is obtained by performing a thermal analysis on the expansion section material, and a stress optimization scheme can be further determined.

[0063] In one embodiment, the expansion section material analysis method provided in the embodiment of the present application may further include: Step 500: applying multiple types of stress to the micro model to obtain the magnitudes of principal stresses in multiple directions of the micro model; Step 600: determining the stress transfer path and stress concentration point of the micro model based on the magnitudes of the principal stresses in multiple directions of the micro model; Step 700: Determine a stress optimization solution based on the stress transfer path and the stress concentration point.

[0064] Specifically, Figure 6 The stress cloud diagram shown can show the stress magnitude at each position in the micro-model structure, which can be used to determine which specific parts (nodes) in the micro-model structure are subject to greater stress, thereby optimizing the structural design of the expansion section material or performing appropriate strengthening. At the same time, it can show the stress distribution between different regions of the micro-model, which can be used to understand the stress transfer path in the micro-model structure, and then determine the stress concentration points that may exist in the micro-model, and then take corresponding measures to eliminate the concentrated stress and improve the stability of the expansion section material structure.

[0065] like Figure 6The stress cloud diagram shown also shows different types of stress equivalent stress or von Mises stress (paradigm equivalent stress) used to evaluate the failure criteria of materials. It is a hypothetical stress derived from the linear elastic theory, which takes multiple stress components into consideration and represents the equivalent stress state inside the material. Tresca stress (also known as yield condition I, which refers to the difference between the maximum normal stress and the minimum normal stress in the material) is also called maximum shear stress or upper yield criterion. It is a failure criterion with local characteristics of stress concentration in the plastic deformation area. Tresca stress is related to the yield strength of the material and is used to evaluate whether the material has plastic failure. Pressure stress refers to the pressure distribution inside an object, that is, the normal stress acting on each surface inside the object is equal.

[0066] Figure 6 The S11 stress, S12 stress and S22 stress in the figure represent the principal stress components of the object under the two-dimensional plane stress state. S11 is the principal stress along the x-axis, S22 is the principal stress along the y-axis, and S12 is the shear stress along the xy plane. The distribution of the stress in the microscopic model structure can be used to determine whether there are problems such as excessive shearing or stretching in the expansion section material structure, and to take corresponding measures to strengthen the structure. That is, to determine the stress optimization plan.

[0067] This embodiment analyzes the obtained stress cloud map to obtain the mechanical analysis results of the expansion section material and further determine the stress optimization scheme.

[0068] The expansion section material analysis device provided by the present invention is described below. The expansion section material analysis device described below and the expansion section material analysis method described above can be referenced to each other.

[0069] Please refer to Figure 7 The present invention also provides an expansion section material analysis device, comprising: A representative volume unit determination module 301 is used to construct a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determine a representative volume unit of the microscopic model; A boundary condition determination module 302 is used to apply boundary conditions of finite element calculation to the representative volume unit based on the determined thermal boundary conditions and mechanical boundary conditions; A material mechanics analysis module 303 is used to apply the mechanical boundary conditions to the microscopic model to obtain a mechanical analysis result of the expansion section material; The material thermal analysis module 304 is used to determine the thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary conditions.

[0070] Optionally, the representative volume unit determination module includes: A material structure analysis unit, used to perform structural analysis on a scanning electron microscope image of the expansion section material to be analyzed, and obtain a structural distribution period; A microscopic model building unit, used for building a microscopic model of the expansion section material based on the structural distribution period; The representative volume unit determining unit is used to determine the representative volume unit of the microscopic model based on the material properties of the expansion section material.

[0071] Optionally, the boundary condition determination module includes: A mesh division unit, used for meshing the representative volume unit to obtain a thermal unit set and a mechanical unit set; The boundary condition determination unit is used to determine the thermal boundary conditions and the mechanical boundary conditions based on the thermal unit set and the mechanical unit set.

[0072] Optionally, the material mechanics analysis module includes: A stress cloud map determining unit, used for applying the mechanical boundary condition to the microscopic model to obtain a stress cloud map of the expansion section material; the stress cloud map is used to characterize stress information at each position of the microscopic model; A material mechanics analysis unit is used to determine a mechanics analysis result of the expansion section material based on the stress cloud map.

[0073] Optionally, the material thermal analysis module includes: a heat conduction parameter determination unit, configured to determine the heat conduction parameter based on the thermal boundary condition; A heat transfer model building unit, used to build a heat transfer model according to the heat conduction parameters; The material thermal analysis unit is used to determine the thermal analysis result of the expansion section material based on the microscopic model and the heat transfer model.

[0074] Optionally, the mechanical boundary conditions include multiple types of stress; the expansion section material analysis device further includes: A principal stress magnitude acquisition module, used for applying multiple types of stresses to the microscopic model to obtain principal stress magnitudes in multiple directions of the microscopic model; A stress transfer path and stress concentration point acquisition module, used to determine the stress transfer path and stress concentration point of the micro model based on the magnitude of the principal stress in multiple directions of the micro model; The stress optimization scheme determination module is used to determine the stress optimization scheme based on the stress transfer path and the stress concentration point.

[0075] Figure 8An example of a physical structure diagram of an electronic device is shown in FIG. Figure 8 As shown, the electronic device may include: a processor 410, a communication interface 420, a memory 430 and a communication bus 440, wherein the processor 410, the communication interface 420 and the memory 430 communicate with each other through the communication bus 440. The processor 410 may call the logic instructions in the memory 430 to execute the expansion section material analysis method, which includes: constructing a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determining a representative volume unit of the microscopic model; determining the thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the expansion section material; applying the mechanical boundary conditions to the microscopic model to obtain the mechanical analysis results of the expansion section material; and determining the thermal analysis results of the expansion section material based on the microscopic model and the thermal boundary conditions.

[0076] In addition, the logic instructions in the above-mentioned memory 430 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0077] On the other hand, the present invention also provides a computer program product, which includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the expansion section material analysis method provided by the above-mentioned methods, which includes: based on a scanning electron microscope image of the expansion section material to be analyzed, constructing a microscopic model of the expansion section material, and determining a representative volume unit of the microscopic model; based on the expansion section material, determining the thermal boundary conditions and mechanical boundary conditions of the representative volume unit; applying the mechanical boundary conditions to the microscopic model to obtain the mechanical analysis results of the expansion section material; and determining the thermal analysis results of the expansion section material based on the microscopic model and the thermal boundary conditions.

[0078] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to execute the expansion section material analysis method provided by the above-mentioned methods, the method comprising: constructing a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determining a representative volume unit of the microscopic model; determining thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the expansion section material; applying the mechanical boundary conditions to the microscopic model to obtain mechanical analysis results of the expansion section material; and determining thermal analysis results of the expansion section material based on the microscopic model and the thermal boundary conditions.

[0079] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0080] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for analyzing expansion section materials, characterized in that: include: Based on a scanning electron microscope image of the expansion section material to be analyzed, construct a microscopic model of the expansion section material, and determine a representative volume unit of the microscopic model; Determining thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the expansion section material; Applying the mechanical boundary conditions to the microscopic model to obtain mechanical analysis results of the expansion section material; Based on the microscopic model and the thermal boundary conditions, a thermal analysis result of the expansion section material is determined.

2. The expansion section material analysis method according to claim 1, characterized in that: The step of constructing a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed and determining a representative volume unit of the microscopic model comprises: Performing structural analysis on the scanning electron microscope image of the expansion section material to be analyzed, and obtaining the structural distribution period; Constructing a microscopic model of the expansion section material based on the structural distribution period; Based on the material properties of the expansion section material, a representative volume unit of the microscopic model is determined.

3. The expansion section material analysis method according to claim 1, characterized in that: The determining of the thermal boundary conditions and mechanical boundary conditions of the representative volume unit based on the expansion section material includes: Meshing the representative volume unit to obtain a thermal unit set and a mechanical unit set; Based on the thermal unit set and the mechanical unit set, thermal boundary conditions and mechanical boundary conditions of the representative volume unit are determined.

4. The expansion section material analysis method according to claim 1, characterized in that: Applying the mechanical boundary condition to the microscopic model to obtain the mechanical analysis result of the expansion section material includes: Applying the mechanical boundary conditions to the microscopic model to obtain a stress cloud map of the expansion section material; the stress cloud map is used to characterize stress information at each position of the microscopic model; The mechanical analysis result of the expansion section material is determined based on the stress cloud map.

5. The expansion section material analysis method according to claim 1, characterized in that: Determining the thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary condition includes: determining a heat transfer parameter based on the thermal boundary condition; Constructing a heat transfer model according to the heat conduction parameters; Based on the microscopic model and the heat transfer model, a thermal analysis result of the expansion section material is determined.

6. The expansion section material analysis method according to claim 4, characterized in that: The mechanical boundary conditions include multiple types of stress; the expansion section material analysis method also includes: Applying multiple types of stress to the microscopic model to obtain the magnitudes of principal stresses in multiple directions of the microscopic model; Determining the stress transfer path and stress concentration point of the micromodel based on the magnitude of the principal stresses in multiple directions of the micromodel; A stress optimization scheme is determined based on the stress transfer path and the stress concentration point.

7. An expansion section material analysis device, characterized in that: include: A representative volume unit determination module is used to construct a microscopic model of the expansion section material based on a scanning electron microscope image of the expansion section material to be analyzed, and determine a representative volume unit of the microscopic model; A boundary condition determination module, used for determining the thermal boundary condition and the mechanical boundary condition of the representative volume unit based on the material of the expansion section; A material mechanics analysis module, used for applying the mechanical boundary conditions to the microscopic model to obtain a mechanical analysis result of the expansion section material; The material thermal analysis module is used to determine the thermal analysis result of the expansion section material based on the microscopic model and the thermal boundary conditions.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the expansion section material analysis method according to any one of claims 1 to 6 is implemented.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the expansion section material analysis method according to any one of claims 1 to 6 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the expansion section material analysis method according to any one of claims 1 to 6 is implemented.

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