Low-delay memory module socket

Abstract

The invention discloses a low-delay memory module socket, and relates to the technical field of memory testing, the low-delay memory module socket comprises a base body, a circuit board, a slot body and two action elements, the inner bottom surface of the base body is provided with a mounting groove, the slot body is plugged in the mounting groove, the slot body corresponds to the mounting groove in shape, the circuit board is mounted in the base body, and the circuit board is connected with the two action elements. The circuit board is located at the upper end of the slot body, the upper end of the circuit board is used for being connected with the memory module in an inserted mode, the two action elements are installed at the two ends of the base body in the length direction respectively, the operation ends of the action elements are located outside the base body, the action ends of the action elements extend into the base body and are located at the ends of the circuit board, and the operation ends can drive the action ends to act. And the action end pushes the memory module to be separated from the circuit board. When the slot body of the memory module is damaged, the slot body is convenient to replace, the cost is reduced, and the test benefit is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of memory testing, and in particular to a low-latency memory module socket. Background Art

[0002] Computer and server motherboards have memory module slots that are only used by consumers to update and replace memory. Their applicability and reliability cannot meet the needs of long-term testing of memory modules. For example, when a memory module slot fails and cannot be replaced or repaired, the entire motherboard can only be scrapped, resulting in high costs. Summary of the invention

[0003] The purpose of the present invention is to provide a low-latency memory module socket to solve the problems existing in the above-mentioned prior art, facilitate replacement when the slot body of the memory module is damaged, reduce costs and improve test efficiency.

[0004] To achieve the above object, the present invention provides the following solutions: The present invention provides a low-latency memory module socket, comprising a base, a circuit board, a slot body and two action elements, wherein the inner bottom surface of the base is provided with a mounting groove, the slot body is inserted into the mounting groove, and the slot body corresponds to the shape of the mounting groove, the circuit board is installed in the base, and the circuit board is located at the upper end of the slot body, the upper end of the circuit board is used for plugging in the memory module, the two action elements are respectively installed at the two ends of the base in the length direction, and the operating end of the action element is located outside the base, the action end of the action element extends into the base and is located at the end of the circuit board, and the operating end can drive the action end to move, and enable the action end to push the memory module out of the circuit board.

[0005] In one embodiment, an open slot is provided at the upper end of the circuit board, and the memory module is plugged into the open slot. A limit point is provided in the middle of the open slot, and the limit point corresponds to the limit opening position at the lower end of the memory module.

[0006] In one embodiment, the height of the circuit board is less than 5 mm.

[0007] In one embodiment, a copper sheet contact surface is provided on the slot body, and an electroplating coating is attached to the surface of the copper sheet contact surface.

[0008] In one embodiment, the base includes an outer body, an inner body and two bases, the two bases are respectively connected to the two ends of the outer body by bolts, the ends of the two bases close to each other extend into the two ends of the inner body respectively, and the ends of the two bases close to each other are respectively connected to the two ends of the slot body, the outer body is sleeved on the outer periphery of the inner body, and the lower end of the inner body extends out of the outer body.

[0009] In one embodiment, each of the bases is provided with a semicircular protrusion on one side close to the slot body, and both ends of the slot are provided with a semicircular groove, and the semicircular protrusion can be embedded in the corresponding semicircular groove.

[0010] In one embodiment, each of the bases is provided with an action groove at one end close to the slot body, and the opening of the action groove is arranged toward the slot body. The base is also provided with a long hole, and the long hole can penetrate the two side walls of the action groove. The action end extends into the action groove, and the action element is installed on the base by passing a pin shaft through the long hole and the action end.

[0011] In one embodiment, the action element includes a horizontal plate, a vertical plate, a hook and a return spring, the first end of the horizontal plate forms the operating end, the second end of the horizontal plate is connected to the upper end of the vertical plate, the lower end of the vertical plate is connected to the first end of the hook, the second end of the hook extends toward the direction close to the slot body and bends upward, and the second end of the hook forms the action end, the pin shaft passes through the connection between the lower end of the vertical plate and the first end of the hook, the upper end of the return spring is connected to the lower end surface of the first end of the horizontal plate, and the lower end of the return spring is connected to the base.

[0012] In one embodiment, a spring slot is provided on the base at a position corresponding to the return spring, and the lower end of the return spring extends into the spring slot.

[0013] In one embodiment, an anti-slip groove is provided on the upper surface of the transverse plate.

[0014] Compared with the prior art, the present invention has achieved the following technical effects: The low-latency memory module socket provided by the present invention has a mounting groove on the inner bottom surface of a base, a slot body is plugged into the mounting groove, and the slot body corresponds to the mounting groove in shape. Through the plug-in connection mode, when the slot body of the memory module is damaged, the slot body can be conveniently replaced, and the matching of the signal transmission impedance is not affected. The function of the original memory module is retained, the test cost is reduced, the test efficiency is improved, and the reliability of the overall test of the main board is improved. The circuit board is installed in the base, and the circuit board is located at the upper end of the slot body. The upper end of the circuit board is used to plug the memory module to achieve the corresponding function. Two action elements are respectively installed at two ends in the length direction of the base, and the operating end of the action element is located outside the base. The action end of the action element extends into the base and is located at the end of the circuit board. The operating end can drive the action end to move and make the action end push the memory module off the circuit board. Through the setting of the action element, the slot body of the original main board does not need to be replaced, and the insertion and removal of the memory module can be convenient. The present invention can be used for the development of memory automatic test equipment. By adding a low-latency memory module socket, the service life of the original main board can be extended without affecting the use function of the original memory module. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of the structure of a low-latency memory module socket in the present invention; Figure 2 It is a schematic diagram of the low-latency memory module socket of the present invention when part of the base is omitted; Figure 3 is a cross-sectional view of a low-latency memory module socket in the present invention; Figure 4 It is a schematic diagram of the structure of the circuit board in the present invention; Figure 5 It is a structural schematic diagram of the slot body in the present invention; Figure 6 It is a schematic diagram of the connection between the action element and the base in the present invention; Figure 7 A schematic diagram of the structure of a low-latency memory module socket and a motherboard in the present invention; Figure 8 It is a structural schematic diagram of the low-latency memory module socket and the mainboard when the memory module is plugged into the memory module in the present invention; In the figure: 1-base, 11-inner body, 12-outer body, 13-base, 14-semicircular protrusion, 15-action groove, 16-long hole, 2-circuit board, 21-opening groove, 22-limit point, 3-slot body, 31-copper sheet contact surface, 32-semicircular groove, 4-action element, 41-horizontal plate, 42-vertical plate, 43-bend hook, 44-reset spring, 45-anti-slip groove, 5-pin shaft, 100-low latency memory module socket, 200-host board, 300-memory module. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The purpose of the present invention is to provide a low-latency memory module socket to solve the problems existing in the prior art, and to facilitate replacement of the memory module socket body when it is damaged, thereby reducing costs and improving test efficiency.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] like Figure 1-Figure 8As shown, the present embodiment provides a low-latency memory module socket 100, comprising a base 1, a circuit board 2, a slot body 3 and two action elements 4. The inner bottom surface of the base 1 is provided with a mounting groove, the slot body 3 is plugged into the mounting groove, and the slot body 3 corresponds to the shape of the mounting groove. Through the plug-in connection mode, when the slot body 3 of the memory module 300 is damaged, the slot body 3 can be easily replaced, and the matching of the signal transmission impedance will not be affected. The function of the original memory module 300 is retained, the test cost is reduced, the test efficiency is improved, and the reliability of the overall test of the main board 200 is also improved. The circuit board 2 is installed in the base 1, and the circuit board 2 is located at the upper end of the slot body 3. The upper end of the circuit board 2 is used to plug the memory module 300 to achieve the corresponding function. The two action elements 4 are respectively installed at the two ends of the length direction of the base 1, and the operating end of the action element 4 is located outside the base 1, and the action end of the action element 4 extends into the base 1 and is located at the end of the circuit board 2, and the operating end can drive the action end to move, and make the action end push the memory module 300 out of the circuit board 2. Through the setting of the action element 4, there is no need to replace the slot body 3 of the original motherboard 200, so the insertion and removal of the memory module 300 can be facilitated. This embodiment can be used for the development of memory automation testing equipment. By adding a low-latency memory module socket 100 to the motherboard 200 and using it to install the memory module 300, the service life of the original motherboard 200 can be extended without affecting the use function of the original memory module 300.

[0021] Specifically, an opening groove 21 is provided at the upper end of the circuit board 2, and the memory module 300 is plugged into the opening groove 21. A limit point 22 is provided in the middle of the opening groove 21, and the limit point 22 corresponds to the limit opening position at the lower end of the memory module 300, thereby enabling stable plugging of the circuit board 2.

[0022] Circuit board 2 is a low-latency PCB, and the height of circuit board 2 is less than 5 mm. Combined with the use of low-loss PCB materials, it can effectively reduce signal loss and enable the product to operate at high frequencies.

[0023] The present embodiment designs the shortest slot body 3, and a copper sheet contact surface 31 is provided on the slot body 3. The surface of the copper sheet contact surface 31 is attached with an electroplating coating, which increases the contact area between the slot body 3 and the pins of the memory module 300, thereby effectively reducing the impedance.

[0024] The base 1 includes an outer body 12, an inner body 11 and two bases 13. The two bases 13 are respectively connected to the two ends of the outer body 12 by bolts. The ends of the two bases 13 that are close to each other extend into the two ends of the inner body 11 respectively, and the ends of the two bases 13 that are close to each other are respectively connected to the two ends of the slot body 3, thereby realizing the limitation of the slot body 3 and improving the connection stability. The outer body 12 is sleeved on the outer periphery of the inner body 11, and the lower end of the inner body 11 extends out of the outer body 12.

[0025] Each base 13 is provided with a semicircular protrusion 14 on one side close to the slot body 3, and semicircular grooves 32 are provided at both ends of the slot. The semicircular protrusion 14 can be embedded in the corresponding semicircular groove 32. Through the cooperation of the semicircular protrusion 14 and the semicircular groove 32, the base 13 can limit the end of the slot body 3.

[0026] Each base 13 is provided with an action groove 15 at one end close to the slot body 3, and the opening of the action groove 15 is set toward the slot body 3. The base 13 is also provided with a long hole 16, which can penetrate the two side walls of the action groove 15, and the action end extends into the action groove 15. The action element 4 is installed on the base 13 by passing the pin shaft 5 through the long hole 16 and the action end, and the action element 4 can rotate relative to the base 13.

[0027] The action element 4 includes a horizontal plate 41, a vertical plate 42, a hook 43 and a return spring 44. The first end of the horizontal plate 41 forms an operating end, the second end of the horizontal plate 41 is connected to the upper end of the vertical plate 42, the lower end of the vertical plate 42 is connected to the first end of the hook 43, the second end of the hook 43 extends toward the direction close to the slot body 3 and bends upward, and the second end of the hook 43 forms an action end. The pin 5 passes through the connection between the lower end of the vertical plate 42 and the first end of the hook 43, and the upper end of the return spring 44 is connected to the lower end of the first end of the horizontal plate 41. The lower end of the return spring 44 is connected to the base 13. When the memory module 300 needs to be removed, the first end of the horizontal plate 41 is pressed to make the second end of the hook 43 tilt upward to lift the memory module 300 installed on the circuit board 2, thereby facilitating the removal of the memory module 300. At this time, the return spring 44 is in a compressed state, and then the pressure on the first end of the horizontal plate 41 is released. Under the action of the elastic restoring force of the return spring 44, the action element 4 is driven to reset for the next use.

[0028] A spring slot is provided on the base 13 at a position corresponding to the return spring 44 , and the lower end of the return spring 44 extends into the spring slot to provide an installation space for the return spring 44 and to limit the return spring 44 .

[0029] The upper surface of the horizontal plate 41 is provided with an anti-slip groove 45 for easy operation.

[0030] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A low latency memory module socket, characterized in that: It includes a base, a circuit board, a slot body and two action elements. The inner bottom surface of the base is provided with a mounting groove, the slot body is inserted into the mounting groove, and the slot body corresponds to the shape of the mounting groove. The circuit board is installed in the base, and the circuit board is located at the upper end of the slot body. The upper end of the circuit board is used to plug in the memory module. The two action elements are respectively installed at the two ends of the base in the length direction, and the operating end of the action element is located outside the base. The action end of the action element extends into the base and is located at the end of the circuit board, and the operating end can drive the action end to move, and make the action end push the memory module out of the circuit board.

2. The low latency memory module socket of claim 1, wherein: An open slot is provided at the upper end of the circuit board, and the memory module is inserted into the open slot. A limit point is provided in the middle of the open slot, and the limit point corresponds to the limit opening position at the lower end of the memory module.

3. The low latency memory module socket of claim 1 , wherein: The height of the circuit board is less than 5 mm.

4. The low latency memory module socket of claim 1, wherein: The slot body is provided with a copper sheet contact surface, and the surface of the copper sheet contact surface is adhered with an electroplating coating.

5. The low latency memory module socket of claim 1, wherein: The base includes an outer body, an inner body and two bases, the two bases are respectively connected to the two ends of the outer body by bolts, the ends of the two bases close to each other extend into the two ends of the inner body respectively, and the ends of the two bases close to each other are respectively connected to the two ends of the slot body, the outer body is sleeved on the outer periphery of the inner body, and the lower end of the inner body extends out of the outer body.

6. The low latency memory module socket of claim 5, wherein: Each base is provided with a semicircular protrusion on one side close to the slot body, and both ends of the slot are provided with a semicircular groove, and the semicircular protrusion can be embedded in the corresponding semicircular groove.

7. The low latency memory module socket of claim 5, wherein: Each of the bases is provided with an action groove at one end close to the slot body, and the opening of the action groove is arranged toward the slot body. The base is also provided with a long hole, and the long hole can penetrate the two side walls of the action groove. The action end extends into the action groove, and the action element is installed on the base by passing a pin shaft through the long hole and the action end.

8. The low latency memory module socket of claim 7, wherein: The action element includes a horizontal plate, a vertical plate, a hook and a return spring. The first end of the horizontal plate forms the operating end, the second end of the horizontal plate is connected to the upper end of the vertical plate, the lower end of the vertical plate is connected to the first end of the hook, the second end of the hook extends toward the direction close to the slot body and bends upward, and the second end of the hook forms the action end, the pin shaft passes through the connection between the lower end of the vertical plate and the first end of the hook, the upper end of the return spring is connected to the lower end surface of the first end of the horizontal plate, and the lower end of the return spring is connected to the base.

9. The low latency memory module socket of claim 8, wherein: A spring slot is provided on the base at a position corresponding to the return spring, and the lower end of the return spring extends into the spring slot.

10. The low latency memory module socket of claim 8, wherein: The upper surface of the horizontal plate is provided with an anti-slip groove.

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