IV detection mechanism for 0BB silicon wafer
By designing an IV detection mechanism for 0BB silicon wafers, using an independent dual half-piece IV detection structure and UVW bias correction alignment component, the difficulties in silicon wafer quality detection are solved, and efficient electrical performance detection and capacity improvement are achieved.
Patent Information
- Application Number
- CN202411727428.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-04-04
AI Technical Summary
The cancellation of the front main gate line in existing silicon wafers leads to difficulty in quality detection during the production process of silicon wafers, affecting the detection of yield, and requires dual half-piece IV detection.
A IV detection mechanism for 0BB silicon wafers is designed, and a dual half-piece IV detection structure on both sides is adopted, including a UVW base, a gold wire row and a silver wire test frame. The UVW deviation correction alignment component is used to align the gold wire and the silver wire and the gate wire on the half wire, and move and lift and lower independently for accurate detection.
It realizes efficient electrical performance detection of 0BB silicon wafers, reduces fragmentation rate, and improves detection efficiency and production capacity.
Smart Images
Figure CN119766146A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of silicon wafer production, and in particular to an IV detection mechanism for 0BB silicon wafers. Background Art
[0002] Photovoltaic solar silicon wafers (hereinafter referred to as silicon wafers) are the core part of the solar power generation system and also the most valuable part of the solar power generation system. The function of the silicon wafer is to convert solar energy into electrical energy, which is stored by batteries or directly loaded. In the existing silicon wafers, there are main grid lines on the front side, which will block the surface of the solar cell, affecting the cell's absorption of light, and thus affecting the power generation efficiency. In the subsequent new silicon wafers, the main grid lines on the front side are cancelled, which makes it difficult to inspect the quality of the silicon wafers during production, affecting the inspection of the yield rate. At the same time, in order to connect the production of double half-cells, IV inspection of double half-cells is required. Summary of the invention
[0003] One purpose of the present invention is to provide an IV detection mechanism for OBB silicon wafers, which reduces costs and increases efficiency during the use of silicon wafers. At the same time, a double half-wafer IV detection structure with independent two sides is adopted to realize electrical performance detection and reduce the fragmentation rate.
[0004] To achieve this object, the present invention adopts the following technical solutions:
[0005] An IV detection mechanism for 0BB silicon wafers comprises a left detection module and a right detection module, wherein the left detection module and the right detection module both comprise a UVW base, a gold wire row and a silver row test frame, a UVW deflection correction and alignment component is installed at the lower end of the UVW base, the UVW deflection correction and alignment component comprises two groups of X-axis modules and one group of Y-axis modules, the gold wire row and the silver row test frame respectively move on the UVW base in a vertical direction, the gold wire row is installed with gold wires, the silver row test frame is installed with silver rows, and the left detection module and the right detection module move independently of each other.
[0006] As a preferred technical solution, a lifting bracket is installed on the UVW base, and an upper linear module and a lower linear module are arranged on the lifting bracket. The driving end of the upper linear module is connected to an upper mounting frame, and the gold wire row is fixed in the upper mounting frame. The driving end of the lower linear module is connected to a lower mounting frame, and the silver row test frame is fixed in the lower mounting frame.
[0007] As a preferred technical solution, tension springs are provided on both sides of the gold wire row, two ends of the gold wires are fixed on the tension springs, and the gold wires are connected to upper conductive wires.
[0008] As a preferred technical solution, a circuit board is fixed to the outside of the gold wire array, and the upper wire is connected to the circuit board.
[0009] As a preferred technical solution, mounting grooves are provided on both sides of the silver bar test frame, the ends of the silver bar are inserted into the mounting grooves, a pressure strip is provided above the mounting groove, the pressure strip is pressed on the ends of the silver bar, the upper end of the silver bar is in an upwardly bent arc, and the silver bar is connected to a lower wire.
[0010] As a preferred technical solution, the upper linear module includes an upper motor, an upper screw rod and an upper nut. The upper motor is connected to the lower end of the upper screw rod, the upper screw rod is threadedly connected to the upper nut, and the upper mounting frame is fixedly connected to the upper nut after passing through the lifting bracket.
[0011] As a preferred technical solution, the lower linear module includes a lower motor, a lower screw rod and a lower nut. The lower motor is connected to the upper end of the lower screw rod, the lower screw rod is threadedly connected to the lower nut, and the lower mounting frame is fixedly connected to the lower nut after passing through the lifting bracket.
[0012] As a preferred technical solution, the outer sides of the upper installation frame and the lower installation frame are both connected with vertical slide blocks, and the lifting bracket is fixed with vertical slide rails along the vertical direction, and the vertical slide blocks slide on the vertical slide rails.
[0013] As a preferred technical solution, the X-axis module and the Y-axis module both include a motor mounting seat, a module motor, an adjustment screw and an adjustment slide, the module motor is fixed on the motor mounting seat, the driving end of the module motor is transmission-connected to the adjustment screw, the adjustment screw is threadedly connected to the adjustment nut of the adjustment slide, the adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide has a connecting bearing, the connecting bearing slides on the adjustment slide, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, the edge of the UVW base is locked in the connecting bearing, and the two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.
[0014] As a preferred technical solution, linear guide rails and linear sliders are used to slide between the adjustment slide and the connecting bearing, and between the adjustment slide and the motor mounting seat.
[0015] The beneficial effects of the present invention are as follows: an IV detection mechanism for 0BB silicon wafers is provided, in which two half-wafers are independently subjected to IV detection of 0BB, and both sides can not only be independently raised and lowered, but also be corrected and aligned in the UVW directions, so that the gold wires and silver rows are accurately aligned with the gate lines on the half-wafer, the detection efficiency is improved, and the production capacity is increased accordingly. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present invention is further described in detail below based on the accompanying drawings and embodiments.
[0017] Figure 1 This is a schematic diagram of the overall structure of an IV detection mechanism for 0BB silicon wafers described in an embodiment;
[0018] Figure 2 It is a structural schematic diagram of the gold wire array described in the embodiment;
[0019] Figure 3 It is a structural schematic diagram of the silver bar test stand described in the embodiment;
[0020] Figure 4 It is a schematic diagram of the structure of the X-axis module (or Y-axis module) described in the embodiment.
[0021] Figures 1 to 4 middle:
[0022] 1. Left detection module; 2. Right detection module; 3. UVW base; 4. Gold wire row; 5. Silver row test frame; 6. X-axis module; 7. Y-axis module; 8. Gold wire; 9. Silver row; 10. Lifting bracket; 11. Upper mounting frame; 12. Lower mounting frame; 13. Tension spring; 14. Upper wire; 15. Circuit board; 16. Pressure strip; 17. Lower wire; 18. Upper motor; 19. Upper nut; 20. Lower motor; 21. Lower nut; 22. Vertical slider; 23. Vertical slide rail; 24. Motor mounting seat; 25. Module motor; 26. Adjustment screw; 27. Adjustment slide; 28. Connecting bearing. DETAILED DESCRIPTION
[0023] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.
[0024] like Figures 1 to 4As shown, in this embodiment, an IV detection mechanism for 0BB silicon wafers includes a left detection module 1 and a right detection module 2. Both the left detection module 1 and the right detection module 2 include a UVW base 3, a gold wire row 4 and a silver row test frame 5. A UVW deviation correction and alignment component is installed at the lower end of the UVW base 3. The UVW deviation correction and alignment component includes two groups of X-axis modules 6 and one group of Y-axis modules 7. The gold wire row 4 and the silver row test frame 5 are respectively movable on the UVW base 3 along the vertical direction. The gold wire row 4 is installed with gold wires 8, and the silver row test frame 5 is installed with silver rows 9. The left detection module 1 and the right detection module 2 move independently of each other.
[0025] The double half-chip 0BB silicon wafers come to the left detection module 1 and the right detection module 2 respectively. Under the action of the UVW deflection correction and alignment component, two groups of X-axis modules 6 and one group of Y-axis modules 7 work together, so that the UVW base 3 can move in the X-axis direction, the Y-axis direction and the T-axis rotation angle, and then control the gold wire row 4 and the silver row test frame 5 to align with the position of the half-chip silicon wafer, and then the gold wire row 4 moves downward, the silver row test frame 5 moves upward, the gold wire 8 is pressed on the auxiliary grid, and the silver row 9 is pressed under the auxiliary grid of the half-chip 0BB silicon wafer. After the passage is formed, the electrical performance can be tested.
[0026] A lifting bracket 10 is installed on the UVW base 3, and an upper linear module and a lower linear module are arranged on the lifting bracket 10. The driving end of the upper linear module is connected to the upper mounting frame 11, and the gold wire row 4 is fixed in the upper mounting frame 11. The driving end of the lower linear module is connected to the lower mounting frame 12, and the silver row test frame 5 is fixed in the lower mounting frame 12. When controlling the lifting of the gold wire row 4, it moves up and down by relying on the upper linear module. When controlling the lifting of the silver row test frame 5, it moves up and down by relying on the lower linear module. The upper linear module and the lower linear module are both installed in the middle of the lifting bracket 10.
[0027] There are tension springs 13 on both sides of the gold wire row 4, both ends of the gold wire 8 are fixed on the tension springs 13, the gold wire 8 is connected to the upper conductor 14, a circuit board 15 is fixed to the outside of the gold wire row 4, and the upper conductor 14 is connected to the circuit board 15. Under the action of the tension spring 13, the gold wire 8 is in an elastic state and is tightened on the gold wire row 4 by screws to prevent hard contact with the half-chip. The connection of the electrical signal relies on the circuit board 15 for reception.
[0028] Both sides of the silver bar test frame 5 are provided with mounting grooves, the ends of the silver bar 9 are inserted into the mounting grooves, and a pressure strip 16 is provided above the mounting grooves. The pressure strip 16 is pressed on the ends of the silver bar 9. The upper end of the silver bar 9 is in an arc shape that bends upward. The silver bar 9 is connected to a lower wire 17. The upwardly bent arc structure can allow the silver bar 9 to accurately press against the middle of the auxiliary grid. During installation, the silver bar 9 is fixed by the pressure strips 16 on both sides.
[0029] The upper linear module includes an upper motor 18, an upper screw and an upper nut 19. The upper motor 18 is connected to the lower end of the upper screw, and the upper screw is threadedly connected to the upper nut 19. The upper mounting frame 11 passes through the lifting bracket 10 and is fixedly connected to the upper nut 19; the lower linear module includes a lower motor 20, a lower screw and a lower nut 21. The lower motor 20 is connected to the upper end of the lower screw, and the lower screw is threadedly connected to the lower nut 21. The lower mounting frame 12 passes through the lifting bracket 10 and is fixedly connected to the lower nut 21; the upper and lower installations of the upper linear module and the lower linear module are exactly symmetrical and opposite. The motor controls the rotation of the nut through the screw to realize the lifting and lowering of the mounting frame, and the corresponding gold wire row 4 and silver row test frame 5 can be lifted and lowered.
[0030] The outer side of the upper mounting frame 11 and the outer side of the lower mounting frame 12 are both connected with a vertical slider 22. A vertical slide rail 23 is fixed on the lifting bracket 10 along the vertical direction. The vertical slider 22 slides on the vertical slide rail 23. When the upper mounting frame 11 and the lower mounting frame 12 are lifted or lowered, the vertical slider 22 and the vertical slide rail 23 are used to guide the wires in the vertical direction and reduce friction.
[0031] The X-axis module 6 and the Y-axis module 7 both include a motor mounting seat 24, a module motor 25, an adjustment screw 26 and an adjustment slide 27. The module motor 25 is fixed on the motor mounting seat 24. The driving end of the module motor 25 is transmission-connected with the adjustment screw 26. The adjustment screw 26 is threadedly connected with the adjustment nut of the adjustment slide 27. The adjustment slide 27 slides along the length direction of the adjustment screw 26. The adjustment slide 27 is provided with a connecting bearing 28. The connecting bearing 28 slides on the adjustment slide 27. The moving direction of the connecting bearing 28 is perpendicular to the moving direction of the adjustment slide 27. The edge of the UVW base 3 is locked in the connecting bearing 28. Two groups of X-axis modules 6 plus one group of Y-axis modules 7 jointly control the T-axis steering of the UVW base 3 on one side. Linear guides and linear sliders are used to slide the adjustment slide 27 and the connecting bearing 28, as well as the adjustment slide 27 and the motor mounting seat 24.
[0032] The UVW deflection correction and alignment component is a high-precision mobile structure specially designed for high-precision alignment equipment. It is also commonly called the XXY platform. As a three-axis parallel motion mechanism, it can realize rotational motion centered on any point on the plane and translation in any direction (X, Y, and θ three-axis motion in the plane) by controlling the parallel motion of three linear moving structures. The UVW deflection correction and alignment component, in conjunction with the visual module, can realize high-precision alignment functions and can be used in the silicon wafer printing industry.
[0033] More specifically, the implementation process of the UVW correction and alignment component includes determining the transformation matrix from the camera coordinate system to the UVW platform coordinate system through a visual calibration method, as well as the coordinate value of the marker template based on the origin coordinate system on the UVW correction and alignment component, and obtaining the x, y, and θ offsets between the marker template position and the marker to be corrected (based on the origin coordinate system of the UVW correction and alignment component) through the visual module. Then, the initial coordinates of the three axes are entered according to the formula, the rotation center is set to (0, 0), and the θ offset is entered to obtain the new coordinate values of the UVW three axes, the new coordinates of the object to be corrected, and the corresponding feed amounts of the three motors. This series of operations decomposes the motion process into translation and rotation parts, and calculates the motor feed amounts separately, thereby achieving precise automatic positioning, and the alignment accuracy can reach the micron level.
[0034] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.
Claims
1. An IV detection mechanism for 0BB silicon wafers, characterized in that: The invention comprises a left detection module and a right detection module, wherein the left detection module and the right detection module both comprise a UVW base, a gold wire row and a silver row test frame, a UVW deviation correction and alignment component is installed at the lower end of the UVW base, and the UVW deviation correction and alignment component comprises two groups of X-axis modules and one group of Y-axis modules, the gold wire row and the silver row test frame respectively move on the UVW base along the vertical direction, the gold wire row is installed with gold wire, the silver row test frame is installed with silver row, and the left detection module and the right detection module move independently of each other.
2. An IV detection mechanism for OBB silicon wafer according to claim 1, characterized in that: A lifting bracket is installed on the UVW base, and an upper linear module and a lower linear module are arranged on the lifting bracket. The driving end of the upper linear module is connected to an upper mounting frame, and the gold wire row is fixed in the upper mounting frame. The driving end of the lower linear module is connected to a lower mounting frame, and the silver row test frame is fixed in the lower mounting frame.
3. An IV detection mechanism for OBB silicon wafer according to claim 1, characterized in that: The two sides of the gold wire row are provided with tension springs, the two ends of the gold wires are fixed on the tension springs, and the gold wires are connected with upper conductive wires.
4. An IV detection mechanism for OBB silicon wafer according to claim 3, characterized in that: A circuit board is fixed on the outer side of the gold wire row, and the upper conductive wire is connected to the circuit board.
5. An IV detection mechanism for OBB silicon wafer according to claim 1, characterized in that, Both sides of the silver bar test frame are provided with mounting grooves, the ends of the silver bar are inserted into the mounting grooves, a pressure strip is provided above the mounting groove, the pressure strip is pressed on the ends of the silver bar, the upper end of the silver bar is in an arc shape bent upward, and the silver bar is connected to a lower wire.
6. An IV detection mechanism for OBB silicon wafer according to claim 2, characterized in that, The upper linear module includes an upper motor, an upper screw rod and an upper nut. The upper motor is connected to the lower end of the upper screw rod. The upper screw rod is threadedly connected to the upper nut. The upper mounting frame passes through the lifting bracket and is fixedly connected to the upper nut.
7. An IV detection mechanism for OBB silicon wafer according to claim 2, characterized in that: The lower linear module includes a lower motor, a lower screw rod and a lower nut. The lower motor is connected to the upper end of the lower screw rod. The lower screw rod is threadedly connected to the lower nut. The lower mounting frame passes through the lifting bracket and is fixedly connected to the lower nut.
8. An IV detection mechanism for OBB silicon wafer according to claim 2, characterized in that: The outer sides of the upper installation frame and the lower installation frame are both connected with vertical slide blocks, and the lifting bracket is fixed with vertical slide rails along the vertical direction, and the vertical slide blocks slide on the vertical slide rails.
9. An IV detection mechanism for OBB silicon wafer according to claim 1, characterized in that: The X-axis module and the Y-axis module both include a motor mounting seat, a module motor, an adjustment screw and an adjustment slide. The module motor is fixed on the motor mounting seat. The driving end of the module motor is transmission-connected to the adjustment screw. The adjustment screw is threadedly connected to the adjustment nut of the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw. The adjustment slide is provided with a connecting bearing. The connecting bearing slides on the adjustment slide. The moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide. The edge of the UVW base is locked in the connecting bearing. The two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.
10. An IV detection mechanism for OBB silicon wafer according to claim 9, characterized in that: The adjusting slide table and the connecting bearing, as well as the adjusting slide table and the motor mounting seat are slidably connected by linear guide rails and linear sliders.