Imaging element unit and imaging device

Abstract

This imaging element unit is housed in a housing of an imaging device, and is provided with: an imaging element that captures an image of a subject; at least two heat conduction members to which heat of the imaging element is conducted and which are connected to each other in the member connection portion; and a reinforcing member that reinforces the connection between the two heat transfer members in the member connection portion.

Description

Technical Field

[0001] The technology of the present invention relates to an imaging element unit and an imaging device. Background Art

[0002] International Publication No. 2020 / 202811 discloses an image shake correction device having:

[0003] A fixed body is fixed inside the housing; a movable body has an imaging element and moves relative to the fixed body in a direction perpendicular to the optical axis; and a heat transfer sheet. The heat transfer sheet is a bendable sheet that is partially mounted on the fixed body and the movable body and transfers heat generated in the movable body to the fixed body. The thickness direction of the heat transfer sheet is set to be perpendicular to the optical axis direction. Summary of the invention

[0004] One embodiment of the technology according to the present invention provides an image pickup element unit and an image pickup device capable of preventing thermally conductive members to which heat of an image pickup element is transferred from being easily disconnected.

[0005] An embodiment of the technology involved in the present invention provides an imaging element unit and an imaging device that can reduce the movable load of a heat-conducting member that is a heat-conducting member to which heat of the imaging element is transferred and can deform to follow the movement of the imaging element due to a vibration-proof function.

[0006] An embodiment of the technology involved in the present invention provides an imaging element unit and an imaging device, which can maintain the thermal conductivity and mobility of a thermally conductive component in a balanced manner, wherein the thermally conductive component is a thermally conductive component to which the heat of the imaging element is conducted and can deform to follow the movement of the imaging element based on the vibration-proof function.

[0007] An embodiment of the technology involved in the present invention provides an imaging element unit and an imaging device, which can further improve the thermal conductivity of a thermally conductive component to which heat of the imaging element is conducted, the thermally conductive component being made by stacking a plurality of thermally conductive layers containing a thermally conductive material.

[0008] One embodiment of the technology according to the present invention provides an image pickup element unit and an image pickup device capable of more effectively dissipating heat of an image pickup element.

[0009] Means for solving technical problems

[0010] The imaging element unit of the present invention is an imaging element unit built into a frame of an imaging device, and comprises: an imaging element for photographing a subject; at least two heat-conducting components for conducting heat of the imaging element and being connected to each other in a component connecting portion; and a reinforcing component for reinforcing the connection between the two heat-conducting components in the component connecting portion.

[0011] Preferably, a vibration-proofing function is provided to move the imaging element in the plane direction of the imaging surface, and one of the two heat transfer members is deformable to follow the movement of the imaging element due to the vibration-proofing function.

[0012] Preferably, the reinforcing member is bonded to the two heat conducting members by an adhesive in the member connecting portion.

[0013] Preferably, the reinforcing member includes a thermally conductive material having a thermal conductivity of 500 W / m·K or more.

[0014] An imaging device according to the present invention includes a housing and any one of the above-described imaging element units incorporated in the housing.

[0015] The imaging device unit of the present invention is an imaging device unit built into a frame of an imaging device, and comprises:

[0016] An imaging element having an imaging surface for capturing an object;

[0017] Anti-vibration function, which moves the imaging element along the plane direction of the imaging surface; and

[0018] The heat-conducting member is a heat-conducting member to which the heat of the imaging element is conducted, and can be deformed to follow the movement of the imaging element based on the anti-vibration function.

[0019] The thermally conductive components have:

[0020] the outer part; and

[0021] at least one inner layer portion, arranged inside the outer layer portion,

[0022] The outer layer and the inner layer each have a deformable bending portion.

[0023] The bending angle of the bent portion of the inner layer portion is smaller than that of the bent portion of the outer layer portion.

[0024] Preferably, the inner layer portion is arranged in a space formed by the outer layer portion.

[0025] Preferably, the curved portion of the outer layer portion and the curved portion of the inner layer portion extend outward.

[0026] An imaging device according to the present invention includes a housing and any one of the above-described imaging element units incorporated in the housing.

[0027] The imaging device unit of the present invention is an imaging device unit that is not built into a frame of an imaging device, and comprises:

[0028] An imaging element having an imaging surface for capturing an object;

[0029] Anti-vibration function, which moves the imaging element along the plane direction of the imaging surface; and

[0030] The heat-conducting member is a heat-conducting member to which the heat of the imaging element is conducted, and can be deformed to follow the movement of the imaging element based on the anti-vibration function.

[0031] The thermally conductive components have:

[0032] the outer part; and

[0033] at least one inner layer portion, arranged inside the outer layer portion,

[0034] The outer layer portion has a structure with higher thermal conductivity than the inner layer portion, and the inner layer portion has a structure with higher mobility than the outer layer portion.

[0035] Preferably, the inner layer portion is arranged in a space formed by the outer layer portion.

[0036] The outer layer portion is preferably thicker than the inner layer portion.

[0037] Preferably, the outer layer portion is formed by laminating a plurality of heat conductive layers containing a heat conductive material.

[0038] Preferably, the inner layer portion has a heat conductive layer containing a heat conductive material, and the outer layer portion preferably has a larger number of laminated heat conductive layers than the inner layer portion.

[0039] Preferably, the density of the heat conductive material in the outer layer portion is higher than that in the inner layer portion.

[0040] An imaging device according to the present invention includes a housing and any one of the above-described imaging element units incorporated in the housing.

[0041] The imaging device unit of the present invention is an imaging device unit built into a frame of an imaging device, and comprises:

[0042] An imaging device for capturing an object; and

[0043] The heat conducting member conducts the heat of the imaging element.

[0044] The thermally conductive component is stacked with multiple thermally conductive layers containing thermally conductive materials.

[0045] Two adjacent heat conductive layers among the plurality of heat conductive layers are connected by a connecting portion and are stacked by being bent at the connecting portion.

[0046] Preferably, two adjacent heat conducting layers are bonded together by an adhesive.

[0047] Preferably, the imaging device has an anti-vibration function for moving the imaging element in the plane direction of the imaging plane.

[0048] The heat conducting member has a curved portion that can deform in accordance with the movement of the imaging element due to the anti-vibration function.

[0049] The connecting portion is provided at a non-bending portion other than the bending portion.

[0050] An imaging device according to the present invention includes a housing and any one of the above-described imaging element units incorporated in the housing.

[0051] The imaging device unit of the present invention is an imaging device unit built into a frame of an imaging device, and comprises:

[0052] An imaging element having an imaging surface for capturing an object; and

[0053] An anti-vibration function is achieved by a movable member that holds an imaging element and moves the imaging element in a plane direction of an imaging plane, and a fixed member that movably holds the movable member and fixes the position of the movable member in a frame; and

[0054] The first heat conducting member is connected to the movable member and the fixed member, and conducts the heat of the imaging element stored in the movable member to the fixed member, and has a flexible portion that can move the movable member.

[0055] Preferably, the flexible substrate is provided, the flexible substrate is connected to the imaging element and has a flexible portion that can move the movable member.

[0056] The first heat conduction member is arranged in a space formed by the flexible portion of the flexible substrate.

[0057] Preferably, the first heat conduction member has a shape along the flexible substrate.

[0058] Preferably, the fixing member is connected to the frame body via a second heat conduction member.

[0059] An imaging device according to the present invention includes a housing and any one of the above-described imaging element units incorporated in the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 A diagram showing a digital camera.

[0061] Figure 2 This is an exploded perspective view of the front side of the imaging device unit.

[0062] Figure 3 This is an exploded perspective view of the back side of the image pickup device unit.

[0063] Figure 4 This is an exploded perspective view of the main parts of the image pickup device unit from the back.

[0064] Figure 5 It is a diagram showing the structure of a heat conduction member.

[0065] Figure 6 It is a three-dimensional diagram of a heat conducting component.

[0066] Figure 7 It is a top view of the heat conducting component.

[0067] Figure 8 It is a three-dimensional diagram of the reinforcement component.

[0068] Fig. 9 This is a diagram showing the vicinity of a component connection portion.

[0069] Fig.10 It is a three-dimensional diagram of heat-conducting components and connecting components.

[0070] Fig.11 It is a simple top view of the heat conducting component.

[0071] Fig.12 The figures show the heat conduction member before and after being bent.

[0072] Fig.13 It is a diagram showing the thickness of the bent portion and the non-bent portion.

[0073] Fig.14 It is a figure which shows the state which deformed the heat conduction member.

[0074] Fig.15 It is a figure which shows the state which deformed the heat conduction member.

[0075] Fig.16 It is a diagram showing the heat conduction path of the imaging element.

[0076] Fig.17 This is a diagram showing only the heat transfer member of the outer layer portion.

[0077] Fig.18 It is a diagram showing a heat conducting component having a triple structure.

[0078] Fig.19 It is a diagram showing an octagonal heat conducting member.

[0079] Fig. 20 The figure shows a heat transfer member in which the corners of the connecting portion of the outer layer portion and the corners of the connecting portion of the inner layer portion are recessed inward.

[0080] Fig.21 This is a diagram showing an example in which a thermally conductive member is connected to the central region of the back surface of a circuit board having no opening.

[0081] Fig. 22 This is a diagram showing a heat transfer member according to a second embodiment in which the bending angle of the bent portion of the inner layer portion is smaller than the bending angle of the bent portion of the outer layer portion.

[0082] Fig.23 This is a diagram showing a heat conduction member according to a third embodiment including an outer layer portion having a structure with higher thermal conductivity than the inner layer portion and an inner layer portion having a structure with higher mobility than the outer layer portion.

[0083] Fig.24 Yes means Fig.23 FIG. 4 is a diagram showing the vicinity of a bent portion of a heat conducting component.

[0084] Fig.25 It is a diagram showing a heat conduction member according to a fourth embodiment in which a plurality of heat conduction layers are stacked.

[0085] Fig.26 Yes means Fig.25 FIG. 4 is a diagram showing a heat conducting component before being bent.

[0086] Fig. 27 Yes means Fig.25 FIG. 4 is a diagram showing the bending sequence of the thermally conductive component.

[0087] Fig.28 This is a diagram showing how heat is transferred when there is no connecting portion.

[0088] Fig.29 It is a diagram showing the way of heat transfer when a connecting portion exists, and is a diagram for explaining the effect of the connecting portion.

[0089] Fig.30 This is a diagram showing another example of a thermally conductive member in which a plurality of thermally conductive layers are stacked.

[0090] Fig.31 It is a diagram showing an image pickup device unit according to the fifth embodiment.

[0091] Fig.32 is along Fig.31 A cross-sectional view of the imaging element unit and a cross-sectional view of the main parts cut along line AA.

[0092] Fig.33 It is a diagram showing a heat conduction path of the imaging element in the fifth embodiment.

[0093] Fig.34 It is a plan view showing a graphite sheet including graphite having recessed portions formed in a bent portion.

[0094] Fig.35 This is a perspective view showing a heat conduction member formed by bending a graphite sheet including graphite having recessed portions formed at bent portions.

[0095] Fig.36 This is a plan view showing a graphite sheet including a resin film having convex portions formed at a bent portion.

[0096] Fig.37 This is a perspective view showing a heat conduction member formed by bending a graphite sheet including a resin film having protrusions formed at bent portions.

[0097] Fig.38It is a diagram showing the thickness of the circuit board at a position facing the bent portion and the thickness of the circuit board at a position facing the non-bent portion.

[0098] Fig.39 It is a diagram showing a heat transfer member having slits formed in a bent portion. DETAILED DESCRIPTION

[0099] Hereinafter, an example of an embodiment of the technology of the present invention will be described with reference to the drawings.

[0100] [First embodiment]

[0101] As an example, Figure 1 As shown, the digital camera 2 includes a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular imaging opening 12. An interchangeable imaging lens (not shown) is detachably mounted on the lens mount 11. The digital camera 2 is an example of the "imaging device" involved in the technology of the present invention. Furthermore, the camera body 10 is an example of the "frame" involved in the technology of the present invention.

[0102] An imaging element unit 15 is built into the camera body 10. A rectangular imaging element 16 is mounted in the imaging element unit 15. The imaging element 16 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The imaging element 16 has a rectangular imaging surface 17 for photographing a subject. The imaging surface 17 receives subject light representing the subject. As is well known, on the imaging surface 17, pixels that perform photoelectric conversion on the received subject light and output electrical signals are arranged in a two-dimensional shape. The entire imaging surface 17 is exposed to the outside through the imaging opening 12.

[0103] The image sensor unit 15 is connected to a CPU (Central Processing Unit) 18. The CPU 18 controls the operation of the image sensor unit 15. Although not shown in the figure, a memory, namely a ROM (Read Only Memory) and / or a RAM (Random Access Memory), is connected to the CPU 18 via a bus. The CPU 18, the memory, and the bus constitute a computer.

[0104] The image sensor unit 15 has an anti-vibration function. The anti-vibration function is a function for suppressing positional deviation caused by vibration applied to the camera body 10 and relative positional deviation between the subject light incident on the imaging surface 17 and the digital camera 2. The vibration applied to the camera body 10 includes hand shaking of a user holding the camera body 10 to shoot a subject, etc.

[0105] Under the control of the CPU 18, the image pickup element 16 moves in the direction of canceling the positional deviation by the anti-vibration function only by the amount of the positional deviation. More specifically, the image pickup element 16 moves in the X-axis direction parallel to the side 19 of the image pickup surface 17 of the image pickup element 16 and / or in the Y-axis direction parallel to the side 20 orthogonal to the side 19, that is, intersecting the side 19 at an angle of 90°. The X-axis direction and the Y-axis direction are examples of the "plane direction" involved in the technology of the present invention. In addition, the terms related to the angle of "orthogonal" and "90°" include, in addition to the meanings of completely orthogonal and 90°, the meanings of approximately orthogonal and approximately 90°, which are allowed in design and manufacturing (for example, an error of about ±10% of the design value). In addition, in the term of "parallel", in addition to the meaning of completely parallel, the meaning of approximately parallel is included, which is allowed in design and manufacturing (for example, an error of about ±10% of the design value). Hereinafter, the side of side 19 is expressed as "lower", and the side opposite to side 19 in the Y-axis direction is expressed as "upper". Furthermore, the side of side 20 is expressed as "left", and the side opposite to side 20 in the X-axis direction is expressed as "right".

[0106] Here, in this specification, "position shift" refers to a phenomenon caused by the optical axis OA changing relative to the subject due to vibration. "Optical axis OA" refers to the optical axis of the subject light incident on the imaging surface 17 through the imaging lens. The change of the optical axis OA means that the optical axis OA is tilted relative to the reference axis (for example, the optical axis OA before the position shift occurs) due to the position shift. In addition, in this specification, offsetting the position shift includes not only the meaning of eliminating the position shift but also the meaning of reducing the position shift.

[0107] exist Figure 2 and Figure 3In the embodiment, the image pickup element unit 15 includes a fixed component 30, a movable component 31, and a yoke 32. The fixed component 30 is arranged on the back side of the camera body 10, and the yoke 32 is arranged on the front side of the camera body 10. The fixed component 30 is fixed to the camera body 10. That is, the fixed component 30 is fixed in position in the camera body 10. In addition, the fixed component 30 and the yoke 32 are fixed at intervals in the Z-axis direction orthogonal to the X-axis and the Y-axis. The movable component 31 is arranged between the fixed component 30 and the yoke 32 via three balls 35, 36, and 37 of the same size. The movable component 31 can move in the X-axis direction and the Y-axis direction (rotate around the Z-axis) relative to the fixed component 30 and the yoke 32 through the balls 35 to 37. The aforementioned anti-vibration function is realized by these fixed components 30 and the movable component 31. In addition, the Z-axis is parallel to the optical axis OA.

[0108] The fixed part 30 holds the magnet 40, the magnet 41 and the magnet 42. The magnets 40 to 42 are mounted on the front side of the fixed part 30 opposite to the movable part 31. The magnets 40 to 42 are a group of an extended plate-shaped magnet with the N pole facing the movable part 31 side and an extended plate-shaped magnet with the S pole facing the movable part 31 side. The magnet 40 is arranged at the lower center of the fixed part 30 with its long side along the X-axis direction. The magnets 41 and the magnets 42 are arranged along the Y-axis direction. The magnet 41 is arranged at the upper left corner of the fixed part 30 with its long side along the Y-axis direction. The magnet 42 is arranged at the lower left corner of the fixed part 30 with its long side along the Y-axis direction.

[0109] In addition to the magnets 40 to 42, the plate 45, the plate 46, and the plate 47 are arranged on the front side of the fixing member 30. The plate 45 is arranged at the lower right corner of the fixing member 30 and above the magnet 40. The plate 46 is arranged on the left side of the fixing member 30 and between the magnets 41 and 42. The plate 47 is arranged at the upper right corner of the fixing member 30. The plate 45 rollably supports the ball 35, the plate 46 rollably supports the ball 36, and the plate 47 rollably supports the ball 37.

[0110] A square-shaped limiting opening 50 and a limiting opening 51 are formed in the fixed member 30 to limit the range of movement of the movable member 31 on the XY plane. The limiting opening 50 and the limiting opening 51 are substantially the same size when viewed from the Z-axis direction. The limiting opening 50 is formed between the magnet 42 and the plate 45 in the lower left corner of the fixed member 30. The limiting opening 51 is formed on the left side of the plate 47 in the upper right corner of the fixed member 30. That is, the limiting opening 50 and the limiting opening 51 are arranged in substantially diagonal positions in the fixed member 30.

[0111] In the fixing member 30, an internal thread 55, an internal thread 56, an internal thread 57, and an internal thread 58 are provided via a spacer. The internal thread 55 is provided at the lower right corner of the fixing member 30. The internal thread 56 is provided at the upper left corner of the fixing member 30. The internal thread 57 is provided at the lower left corner of the fixing member 30. The internal thread 58 is provided at the upper right corner of the fixing member 30.

[0112] A rectangular large access opening 59 is formed in the center of the fixed member 30. The access opening 59 is provided for access to the back surface of the movable member 31 from the back surface of the fixed member 30.

[0113] The movable part 31 holds the imaging element 16, and holds the coil 60, the coil 61, and the coil 62. The imaging element 16 is arranged in the central part of the movable part 31. The coil 60 is arranged in the lower center of the movable part 31 and is opposite to the magnet 40 in the Z-axis direction. The coil 61 is arranged in the upper left corner of the movable part 31 and is opposite to the magnet 41 in the Z-axis direction. The coil 62 is arranged in the lower left corner of the movable part 31 and is opposite to the magnet 42 in the Z-axis direction. The coil 60 is arranged so that its long side is along the X-axis direction. The coil 61 and the coil 62 are arranged along the Y-axis direction. The coil 61 and the coil 62 are respectively arranged so that their long sides are along the Y-axis direction.

[0114] A magnet 65 is held in the yoke 32. A magnetic body 66 is installed in the coil 61, and a magnetic body 67 is installed in the coil 62. The magnet 65 is, for example, a neodymium magnet. The magnetic body 66 and the magnetic body 67 are, for example, thin iron plates. The magnet 65 is arranged to cover the coil 60 so as to increase the driving force of the coil 60. The magnetic body 66 and the magnetic body 67 are arranged along the Y-axis direction. The magnetic body 66 is arranged on the upper end side of the coil 61, and the magnetic body 67 is arranged on the lower end side of the coil 62.

[0115] As described above, since the coil 60 is disposed at a position facing the magnet 40 in the Z-axis direction, the magnet 65 is also disposed at a position facing the magnet 40 in the Z-axis direction. Therefore, the magnet 65 is attracted by the magnet 40 while being fixed to the yoke 32.

[0116] Similarly, as described above, since the coil 61 is arranged at a position opposite to the magnet 41 in the Z-axis direction, the magnetic body 66 is also arranged at a position opposite to the magnet 41 in the Z-axis direction. Therefore, the magnetic body 66 is attracted by the magnet 41. And, as described above, since the coil 62 is arranged at a position opposite to the magnet 42 in the Z-axis direction, the magnetic body 67 is also arranged at a position opposite to the magnet 42 in the Z-axis direction. Therefore, the magnetic body 67 is attracted by the magnet 42.

[0117] A recess 70, a recess 71, and a recess 72 are formed on the back side of the movable member 31 that is opposite to the fixed member 30. The recess 70 is arranged at the lower right corner of the movable member 31 and at a position opposite to the plate 45 in the Z-axis direction. The recess 71 is arranged between the coil 61 and the coil 62 on the left side of the movable member 31 and at a position opposite to the plate 46 in the Z-axis direction. The recess 72 is arranged at the upper right corner of the movable member 31 and at a position opposite to the plate 47 in the Z-axis direction. The recess 70 rollably accommodates the ball 35, the recess 71 rollably accommodates the ball 36, and the recess 72 rollably accommodates the ball 37. The size of the recesses 70 to 72 when viewed from the Z-axis direction is one size larger than the diameter of the balls 35 to 37. In addition, the depth of the recesses 70 to 72 in the Z-axis direction is slightly smaller than the diameter of the balls 35 to 37.

[0118] A cylindrical protrusion 80 protruding toward the fixed member 30 is provided on the back of the movable member 31 at a position opposite to the limiting opening 50 in the Z-axis direction. Also, a cylindrical protrusion 81 protruding toward the fixed member 30 is provided on the back of the movable member 31 at a position opposite to the limiting opening 51 in the Z-axis direction. The protrusion 80 is inserted through the limiting opening 50. Also, the protrusion 81 is inserted through the limiting opening 51. Therefore, the protrusion 80 and the protrusion 81 function as limiting pins that limit the movement of the movable member 31 in the XY plane.

[0119] The yoke 32 is a magnetic body such as an iron thin plate, and has a substantially C-shape. The yoke 32 forms a magnetic circuit with the magnets 40 to 42 , and increases the magnetic flux received by the coils 60 to 62 .

[0120] The yoke 32 is provided with external threads 85, 86, 87, and 88. The external threads 85 to 88 are fastened to the internal threads 55 to 58 of the fixing member 30. Thus, the fixing member 30 and the yoke 32 are fixed, and the movable member 31 is movably held between the fixing member 30 and the yoke 32.

[0121] The imaging element unit 15 includes a pair of voice coil motors (VCM). The pair of VCMs is a pair of a first VCM and a second VCM. The first VCM includes a pair of a magnet 40 and a coil 60 and a yoke 32, and generates a power to move the movable part 31 in the Y-axis direction. On the other hand, the second VCM includes a pair of a magnet 41 and a coil 61, a pair of a magnet 42 and a coil 62, and a yoke 32, and generates a power to move the movable part 31 in the X-axis direction. More specifically, the first VCM generates a power to move the movable part 31 in the Y-axis direction through the magnetic force of the magnet 40 and the current flowing through the coil 60. Furthermore, the second VCM generates a power to move the movable part 31 in the X-axis direction through the magnetic force of the magnet 41 and the current flowing through the coil 61, and the magnetic force of the magnet 42 and the current flowing through the coil 62.

[0122] like Figure 4 As shown, a rectangular circuit board 90 having substantially the same size as the imaging element 16 is mounted on the back surface 89 of the imaging element 16 facing the imaging surface 17. The circuit board 90 is formed of, for example, a resin such as epoxy resin. A rectangular opening 91 is formed on the circuit board 90. The opening 91 is formed in the center of the circuit board 90 so that a central area 92 of the back surface 89 of the imaging element 16 is exposed. The central area 92 is an area of ​​a predetermined size centered on the central point C of the back surface 89 of the imaging element 16 and surrounding the central point C. Identification information 99 of the imaging element 16 is recorded in the central area 92. The opening 91 is formed for visually recognizing the identification information 99. The identification information 99 is, for example, a two-dimensional code for moving to an Internet page on which a management number and / or management information is recorded.

[0123] Circuits such as a control circuit, a drive circuit, and a power supply circuit of the imaging element 16 are mounted on the circuit board 90. Connectors 94 and 95 are provided at the lower end of the back surface 93 of the circuit board 90. A connector 96 is provided at the left end of the back surface 93 of the circuit board 90.

[0124] The connectors 94 and 95 are connected to a flexible substrate 97 (see Figure 2 and Figure 3 ). The other end of the flexible substrate 97 is led out to the back side of the fixed component 30 through the access opening 59. The other end of the flexible substrate 97 is connected to the CPU 18 and a power supply circuit (not shown) that supplies power from a battery. In addition, a flexible substrate 98 (see FIG. 1 ) is connected to the connector 96. Figure 1). The other end of the flexible substrate 98 wraps around the front face of the movable component 31 and is connected to the imaging element 16. In summary, the other end of the flexible substrate 98 is connected to the imaging element 16, and one end of the flexible substrate 98 is connected to the connector 96. Furthermore, one end of the flexible substrate 97 is connected to the connector 94 and the connector 95, and the CPU 18 and the like are connected to the other end of the flexible substrate 97. Therefore, the imaging element 16, the circuit board 90, the CPU 18 and the like are connected via the flexible substrate 98, the connector 96, the connectors 94 and the connector 95, and the flexible substrate 97.

[0125] The image pickup element unit 15 further includes a heat conducting member 100A1 , a heat conducting member 100B, a heat conducting member 100C, and a reinforcing member 101 to which heat (drive heat) of the image pickup element 16 is conducted.

[0126] The heat conducting member 100B and the heat conducting member 100C are connected to the heat conducting member 100A1. The heat conducting member 100A1 is heat-transmitted from the heat conducting member 100B. In addition, the heat conducting member 100A1 conducts heat to the heat conducting member 100C. The heat conducting member 100B is connected to the central area 92 of the back surface 89 of the imaging element 16 exposed through the opening 91. The heat conducting member 100B is heat-transmitted from the central area 92.

[0127] The heat conducting member 100A1 and the heat conducting member 100B are fixed by an adhesive. An internal thread 68 is formed on the fixing member 30 (see Figure 3 ). The heat conducting component 100A1 is provided with an insertion hole 103. The heat conducting component 100C is provided with an external thread 104. The external thread 104 passes through the insertion hole 103 of the heat conducting component 100A1 and is fastened to the internal thread 68 of the fixing component 30. Thus, the heat conducting component 100A1 and the heat conducting component 100C are fixed.

[0128] As an example, Figure 5 As shown, the heat-conducting component 100A1 is formed of a graphite sheet 105. Therefore, the heat-conducting component 100A1 can have appropriate elasticity. The graphite sheet 105 is a structure in which the graphite 106 is encapsulated in a resin film 107 such as a PET (PolyethyleneTerephthalate) film that is wider than the graphite 106. The thickness of the graphite 106 is, for example, 70 μm, and the thickness of the resin film 107 is, for example, 5 μm. The graphite sheet 105 is an example of a "heat-conducting layer" involved in the technology of the present invention. The graphite 106 is an example of a "heat-conducting material" involved in the technology of the present invention.

[0129] The heat conducting components 100B and 100C are metal plates, such as copper plates, and therefore, the heat conducting components 100B and 100C have higher rigidity than the heat conducting component 100A1 formed of the graphite sheet 105. In other words, the heat conducting component 100A1 has higher elasticity than the heat conducting components 100B and 100C.

[0130] As an example, Figure 6 and Figure 7 As shown, the heat conducting component 100A1 has a double structure including an outer layer portion 110 and an inner layer portion 111. The inner layer portion 111 is connected to the outer layer portion 110 via a connecting portion 112 (see also Fig.11 and Fig.12 ) is connected to the outer layer portion 110 and is arranged inside the outer layer portion 110. More specifically, the inner layer portion 111 is arranged in a space surrounded by the outer layer portion 110. A mounting portion 113 having an insertion hole 103 is provided on the upper portion of the outer layer portion 110.

[0131] The outer layer portion 110 and the inner layer portion 111 are both hexagonal in shape when viewed from the Z-axis direction. The outer layer portion 110 is composed of a first sheet portion 115, a second sheet portion 116 having the same length as the first sheet portion 115 and facing the first sheet portion 115, and a pair of V-shaped connecting portions 117 connecting the first sheet portion 115 and the second sheet portion 116. Similarly, the inner layer portion 111 is composed of a first sheet portion 118, a second sheet portion 119 having the same length as the first sheet portion 118 and facing the first sheet portion 118, and a pair of V-shaped connecting portions 120 connecting the first sheet portion 118 and the second sheet portion 119. The first sheet portion 115 and the second sheet portion 116, and the first sheet portion 118 and the second sheet portion 119 are planar.

[0132] The heat-conducting member 100B includes a first sheet 125 and a second sheet 126. The first sheet 125 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16, and is opposite to the back surface 89 of the imaging element 16. The first sheet 125 is connected to the central area 92 of the back surface 89. The second sheet 126 is bent 90° from the first sheet 125, and extends along the normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16. The normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16 is the Z-axis direction (the direction of the optical axis OA). The second sheet 126 has a size that is substantially the same as the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111.

[0133] In the component connection portion 130 where the heat-conducting component 100A1 and the heat-conducting component 100B are connected, the heat-conducting component 100B is connected to the heat-conducting component 100A1 through the second sheet 126. More specifically, the second sheet 126 is inserted into the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111, and is held in a state of being sandwiched between the first sheet portion 115 and the first sheet portion 118. A double-sided adhesive tape is attached to the portions of the first sheet portion 115 and the first sheet portion 118 that are in contact with the second sheet 126. The first sheet portion 115, the first sheet portion 118, and the second sheet 126, and thus the heat-conducting component 100A1 and the heat-conducting component 100B, are fixed by the adhesive of the double-sided adhesive tape. The component connecting portion 130 is a portion where the second sheet 126 of the thermally conductive component 100B is inserted into a space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111 of the thermally conductive component 100A1 and is held in a state of being sandwiched between the first sheet portion 115 and the first sheet portion 118 .

[0134] The heat conducting member 100C includes a first sheet 127 and a second sheet 128. Similar to the first sheet 125 of the heat conducting member 100B, the first sheet 127 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16 and is in a wing shape that is long in the X-axis direction. Similar to the second sheet 126 of the heat conducting member 100B, the second sheet 128 is bent 90° from the first sheet 127 and extends in the normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16.

[0135] The heat conducting component 100A1 and the heat conducting component 100C are connected to each other at the component connection portion 131. The component connection portion 131 is a portion where the second sheet 128 of the heat conducting component 100C is inserted into the space between the second sheet portion 116 of the outer layer portion 110 and the second sheet portion 119 of the inner layer portion 111 of the heat conducting component 100A1 and is held in a state of being sandwiched between the second sheet portion 116 and the second sheet portion 119. The second sheet 128 is provided with a claw portion 129 that is hooked on the edge of the second sheet portion 119. The claw portion 129 positions the second sheet portion 119.

[0136] As an example, Figure 8 As shown in FIG. 1 , the reinforcing member 101 includes a first piece 135 and a second piece 136. Similar to the first piece 127 of the heat-conducting member 100C, the first piece 135 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16 and is in a wing shape that is long in the X-axis direction. The first piece 135 is formed with an insertion hole 137 through which the external thread 104 is inserted. Similar to the second piece 128 of the heat-conducting member 100C, the second piece 136 is bent 90° from the first piece 135 and extends in the normal direction of the imaging surface 17 and the back surface 89 of the imaging element 16.

[0137] The reinforcing member 101 is composed of a graphite sheet 105 in the same manner as the heat-conducting member 100A1. Therefore, the reinforcing member 101 can have appropriate elasticity. The thermal conductivity of the heat-conducting material (here, graphite 106) contained in the reinforcing member 101 is 500 W / m·K or more, and more preferably 1000 W / m·K or more. In addition, the thermal conductivity of the heat-conducting material (here, graphite 106) contained in the reinforcing member 101 is 5000 W / m·K or less. In addition, the thermal conductivity can be measured using a thermal wave analyzer TA manufactured by BETEL Co., Ltd., etc.

[0138] Furthermore, the reinforcing member 101 has adhesiveness. More specifically, the reinforcing member 101 is formed between the second sheet portion 119 of the heat conducting member 100A1 and the first sheet portion 127 of the heat conducting member 100C. Figure 8 Single-sided adhesive seal with an adhesive layer on the visible side.

[0139] As an example, Fig. 9 As shown, in the component connection portion 131, a double-sided adhesive tape 140 is attached to the second sheet portion 119 of the inner layer portion 111 of the heat-conducting component 100A1 and the second sheet 128 of the heat-conducting component 100C. In more detail, the second sheet portion 119 is divided into two at the center, and the double-sided adhesive tape 140 is respectively attached to the second sheet portion 119 divided into two. The second sheet portion 119 and the second sheet 128, and then the heat-conducting component 100A1 and the heat-conducting component 100C are fixed by the adhesive of the double-sided adhesive tape 140. In addition, the reinforcing component 101 is only provided in the component connection portion 131, but it is not limited to this. The reinforcing component 101 can be provided in the component connection portion 130 instead of the component connection portion 131, or can be provided in the component connection portion 130 in addition thereto.

[0140] The first sheet 135 of the reinforcing member 101 is bonded to the first sheet 127 of the thermally conductive member 100C (see also Figure 7 ). In addition, the second sheet 136 of the reinforcing member 101 is bonded to the surface 119A of the second sheet portion 119 of the thermally conductive member 100A1 (see also Figure 7). The first piece 135 has a size that covers the lower half of the first piece 127 of the heat-conducting component 100C. And, the second piece 136 has a size that covers the entire second sheet portion 119. The surface 119A of the second sheet portion 119 to which the second piece 136 is bonded is a surface on the side opposite to the bonding surfaces of the heat-conducting component 100A1 and the heat-conducting component 100C based on the double-sided adhesive tape 140. In this way, the first piece 135 and the second piece 136 are respectively bonded to the first piece 127 and the second piece 119, whereby the reinforcing component 101 reinforces the connection between the heat-conducting component 100A1 and the heat-conducting component 100C in the component connecting portion 131. That is, the heat-conducting component 100A1 and the heat-conducting component 100C are an example of the "two heat-conducting components" involved in the technology of the present invention. Furthermore, the heat conduction member 100A1 is an example of “one of the two heat conduction members” involved in the technique of the present invention.

[0141] The thickness of the heat conducting member 100B is thicker than that of the heat conducting member 100A1. The thickness of the heat conducting member 100A1 is, for example, 80 μm, and the thickness of the heat conducting member 100B is, for example, 1 mm. The thickness of the heat conducting member 100C is also thicker than that of the heat conducting member 100A1, for example, 1 mm.

[0142] As an example, Fig.10 As shown, a heat-conducting component 100D is attached to the heat-conducting component 100C by an adhesive. The heat-conducting component 100D is formed of a graphite sheet 105 similarly to the heat-conducting component 100A1. Therefore, the heat-conducting component 100D can have appropriate elasticity. The thickness of the heat-conducting component 100D is thicker than that of the heat-conducting component 100A1. The thickness of the heat-conducting component 100D is, for example, 500 μm.

[0143] The heat conducting member 100D is further attached with a connecting member 145 by an adhesive. As with the heat conducting member 100B and the heat conducting member 100C, the connecting member 145 is a metal plate, such as a copper plate. The connecting member 145 is connected to the top plate 146 of the camera body 10. The top plate 146 of the camera body 10 is, for example, a magnesium plate or an aluminum plate.

[0144] As an example, Fig.11As shown, the outer layer 110 of the heat conducting member 100A1 has a hexagonal shape when viewed from the Z-axis direction as described above, and therefore has six corners 150, 151, 152, 153, 154, and 155. The inner layer 111 also has a hexagonal shape when viewed from the Z-axis direction, and therefore has six corners 156, 157, 158, 159, 160, and 161. Corners 150 to 155 and corners 156 to 161 function as curved portions that can produce deformation that follows the movement of the imaging element 16 based on the anti-vibration function. Hereinafter, corners 150 to 161 may be referred to as curved portions 150 to 161.

[0145] The bent portions 150 to 155 of the outer layer portion 110 extend outward. Similarly, the bent portions 156 to 161 of the inner layer portion 111 also extend outward. That is, the heat conducting component 100A1 is shaped like a pantograph. Fig.11 In the figure, the heat conduction member 100A1 is simplified by omitting the illustration of the mounting portion 113 and the like. Fig.14 and Fig.15 The same goes for etc.

[0146] As an example, Fig.12 As shown, the heat conducting component 100A1 is formed by bending the dotted line portion of a sheet material 170. Specifically, first, the portion of the connecting portion 112 is bent 180 degrees so that the portion that will become the outer layer portion 110 and the portion that will become the inner layer portion 111 are opposite to each other. Then, after the portions of the bent portions 156 to 161 are bent to form the inner layer portion 111, the portions of the bent portions 150 to 155 are bent to form the outer layer portion 110. Finally, the portion that will become the mounting portion 113 is bent to complete the heat conducting component 100A1.

[0147] The heat conducting component 100A1 has a reinforcing graphite sheet 171. Similar to the graphite sheet 105, the reinforcing graphite sheet 171 is made of graphite and a resin film. The reinforcing graphite sheet 171 is provided on both sides constituting the connection portion 117 and the connection portion 120, and is not provided on the bends 154, 155, 160, and 161. That is, both sides constituting the connection portion 117 and the connection portion 120 are structures in which the graphite sheet 105 and the reinforcing graphite sheet 171 are stacked. On the other hand, the bends 154, 155, 160, and 161 are constituted by only one graphite sheet 105. Therefore, the number of stacked graphite sheets constituting both sides of the connection portion 117 and the connection portion 120 is greater than that of the bends 154, 155, 160, and 161.

[0148] So, as an example, Fig.13As shown, the thickness THUB of the two sides constituting the connection part 117 and the connection part 120 is thicker than the thickness THB of the bends 154, 155, 160 and 161 of the reinforcing graphite sheet 171 (THB<THUB). In other words, the bends 154, 155, 160 and 161 are thinner than the two sides constituting the other connection parts 117 and 120. The graphite sheet 105 that reinforces the graphite sheet 171 and the connection parts 117 and 120 is an example of a "heat conductive layer" involved in the technology of the present invention. Furthermore, the two sides that constitute the connection parts 117 and 120 are an example of a "non-bending part" involved in the technology of the present invention. In addition, in Fig.13 In FIG. 1 , the connection portion 117 and the bent portion 154 are depicted as representatives.

[0149] As an example, Fig.14 and Fig.15 As shown, the heat conductive member 100A1 can be deformed to follow the movement of the imaging element 16 based on the anti-vibration function. Fig.14 The figure shows a state where the heat conduction member 100A1 is expanded and contracted in the vertical direction in response to the movement of the imaging element 16 in the Y-axis direction due to the vibration-proofing function. Fig.15 The heat conduction member 100A1 is shown to be tilted and deformed in the left-right direction following the movement of the imaging element 16 in the X-axis direction by the vibration-proofing function.

[0150] Next, the effect based on the above structure is described. In the digital camera 2, for example, when shooting a moving image at 120 frames per second (4K / 120p) with a picture quality equivalent to 4K resolution, when shooting that imposes a large load on the imaging element 16, non-negligible heat is generated in the imaging element 16.

[0151] In the imaging device unit 15 of the present embodiment, as an example, the thermal tracking of the imaging device 16 Fig.16 That is, the heat of the imaging element 16 is first conducted from the back surface 89 of the imaging element 16 to the thermally conductive member 100B connected to the central region 92 of the back surface 89. Then, the heat is conducted from the thermally conductive member 100B to the thermally conductive member 100A1 connected via the second sheet 126 of the thermally conductive member 100B.

[0152] The heat conducted to the heat-conducting member 100A1 is conducted to the heat-conducting member 100C connected via the second sheet 128. Furthermore, the heat is conducted from the heat-conducting member 100C to the heat-conducting member 100D, and from the heat-conducting member 100D to the connecting member 145. Then, the heat is conducted to the top plate 146 of the camera body 10 through the connecting member 145, and is radiated to the outside through the top plate 146.

[0153] In the imaging element unit 15, the movable member 31 is movable relative to the fixed member 30 and the yoke 32. The movable member 31 holds the imaging element 16. Therefore, the imaging element 16 also moves with the movement of the movable member 31. When the position of the subject light incident on the imaging surface 17 is shifted due to the hand shaking of the user, the movable member 31 and the imaging element 16 are moved in the direction to cancel the position shift by the amount of the position shift under the control of the CPU 18. Fig.14 and Fig.15 As shown, the heat conduction member 100A1 is deformed following the movement of the imaging element 16 due to the anti-vibration function.

[0154] As described above, the imaging element unit 15 includes the imaging element 16 for capturing an image of an object, the heat-conducting component 100A1 and the heat-conducting component 100C to which the heat of the imaging element 16 is transferred and which are connected to each other in the component connection portion 131, and the reinforcing component 101. The reinforcing component 101 reinforces the connection between the heat-conducting component 100A1 and the heat-conducting component 100C in the component connection portion 131. Therefore, the connection between the heat-conducting component 100A1 and the heat-conducting component 100C can be made less likely to fall off. In addition, as described above, the reinforcing component 101 can also be provided in the component connection portion 130, and the connection between the heat-conducting component 100A1 and the heat-conducting component 100B can be reinforced by the reinforcing component 101.

[0155] The heat-conducting component 100A1 and the heat-conducting component 100C are bonded by the double-sided adhesive tape 140 attached to the second sheet portion 119 of the inner layer portion 111 of the heat-conducting component 100A1 and the second sheet 128 of the heat-conducting component 100C. However, if the adhesive force of the double-sided adhesive tape 140 is increased, the thermal conductivity from the heat-conducting component 100A1 to the heat-conducting component 100C will be correspondingly deteriorated, so the adhesive force of the double-sided adhesive tape 140 cannot be greatly increased. Therefore, the connection between the heat-conducting component 100A1 and the heat-conducting component 100C may fall off due to the adhesive force of the double-sided adhesive tape 140 alone. Therefore, by reinforcing the connection between the heat-conducting component 100A1 and the heat-conducting component 100C by the reinforcing component 101, the connection between the heat-conducting component 100A1 and the heat-conducting component 100C is not easily removed.

[0156] In addition, a reinforcing member may be provided to reinforce the connection between the first sheet portions 115 and 118 of the heat-conducting component 100A1 and the second sheet 126 of the heat-conducting component 100B. In this case, the heat-conducting component 100A1 and the heat-conducting component 100B become an example of "two heat-conducting components" involved in the technology of the present invention. However, the second sheet portion 119 is divided into two. Therefore, the connection between the second sheet portion 119 and the second sheet 128 of the heat-conducting component 100C is weaker than the connection between the undivided first sheet portions 115 and 118 and the second sheet 126 of the heat-conducting component 100B. Therefore, as shown in this example, it is highly necessary to reinforce the connection between the heat-conducting component 100A1 and the heat-conducting component 100C by the reinforcing member 101.

[0157] The imaging element unit 15 has a vibration-proof function for moving the imaging element 16 along the surface direction of the imaging surface 17. Fig.14 and Fig.15 As shown in FIG. 1 , the heat conductive member 100A1 can be deformed to follow the movement of the image pickup element 16 based on the vibration-proof function. Due to the deformation of the heat conductive member 100A1, the connection between the heat conductive member 100A1 and the heat conductive member 100C becomes more likely to fall off. Therefore, the effect of making the connection between the heat conductive member 100A1 and the heat conductive member 100C less likely to fall off can be further exerted.

[0158] The reinforcing member 101 is bonded to the thermally conductive member 100A1 and the thermally conductive member 100C by an adhesive in the member connecting portion 131. The connection between the thermally conductive member 100A1 and the thermally conductive member 100C can be reinforced more firmly by the reinforcing member 101.

[0159] The reinforcing member 101 includes a thermally conductive material having a thermal conductivity of 500 W / m·K or more. Therefore, the reinforcing member 101 not only reinforces the connection between the thermally conductive member 100A1 and the thermally conductive member 100C but also plays a role in conducting heat of the imaging element 16 .

[0160] The inner layer portion 111 is arranged in a space formed by the outer layer portion 110. Therefore, the space formed by the outer layer portion 110 can be effectively used as a position for arranging the inner layer portion 111.

[0161] like Fig.12 and Fig.13As shown, the structures of the curved portions 154, 155, 160, and 161 are different from those of the two sides of the connecting portion 117 and the connecting portion 120 as the non-curved portions. Specifically, the curved portions 154, 155, 160, and 161 have a single graphite sheet 105 containing graphite 106. Moreover, by reinforcing the graphite sheet 171, the number of stacked graphite sheets on the two sides of the connecting portion 117 and the connecting portion 120 as the non-curved portions is greater than that of the curved portions 154, 155, 160, and 161. Furthermore, the curved portions 154, 155, 160, and 161 are thinner than the two sides of the connecting portion 117 and the connecting portion 120 as the non-curved portions. Therefore, the heat conducting member 100A1 can be set to an appropriate structure. Specifically, the resistance when the bending portion 154, the bending portion 155, the bending portion 160 and the bending portion 161 are bent can be reduced. The heat-conducting component 100A1 can follow the movement of the imaging element 16 based on the anti-vibration function without any effort. That is, the movable load of the heat-conducting component 100A1 can be reduced. In addition, according to the reinforcing graphite sheet 171, it is possible to prevent the accidental deformation of the two sides constituting the connecting portion 117 and the connecting portion 120. In addition, in addition to the two sides constituting the connecting portion 117 and the connecting portion 120, the reinforcing graphite sheet 171 can also be provided on the first sheet portion 115 and the first sheet portion 118, and the second sheet portion 116 and the second sheet portion 119.

[0162] On both sides constituting the connection portion 117 and the connection portion 120, after a plurality of graphites 106 are stacked, the plurality of graphites 106 are collectively encapsulated by the resin film 107, thereby making the both sides constituting the connection portion 117 and the connection portion 120 thicker than the curved portion 154, the curved portion 155, the curved portion 160, and the curved portion 161. In this case, the graphite 106 is an example of the "heat conductive layer" involved in the technology of the present invention.

[0163] The heat conducting component 100A1 having a double structure of an outer layer portion 110 and an inner layer portion 111 is illustrated, but the invention is not limited thereto. Fig.17 As shown in FIG. 1 , the heat conducting component 100A2 may have only one outer layer portion 175. In addition, the inner layer portion 111 is not limited to one. Fig.18 As shown in the heat conduction component 100A3, a triple structure including one outer layer portion 180 and two inner layer portions 181 and 182 arranged inside the outer layer portion 180 (in a space surrounded by the outer layer portion 180) may be provided.

[0164] Furthermore, the shape of the heat conducting component when viewed from the Z-axis direction is not limited to a hexagon. Fig.19As shown in the heat conducting member 100A4, the outer layer portion 185 and the inner layer portion 186 may be octagonal in shape when viewed from the Z-axis direction. Fig. 20 As shown, the heat-conducting component 100A5 may be one in which corners 194 and 195 of the connecting portion 192 of the outer layer portion 190 and corners 196 and 197 of the connecting portion 193 of the inner layer portion 191 are recessed inward. Corners 194 to 197 function as curved portions. The heat-conducting component 100A5 is a shape in which the so-called "Σ" is combined with its mirror image. However, as in the heat-conducting component 100A1 of the first embodiment described above, when the curved portions 154, 155, 160, and 161 extend outward, the space surrounded by the outer layer portion 110 can be enlarged, and the inner layer portion 111 can be easily formed, so it is preferred.

[0165] In the first embodiment, the opening 91 for exposing the central area 92 of the back surface 89 of the imaging element 16 is formed in the circuit board 90, and the first sheet 125 of the heat conducting member 100B is connected to the central area 92 via the opening 91, but the present invention is not limited to this. Fig.21 As shown, the thermally conductive component 100B may be connected to the central region 202 of the back surface 201 of the circuit board 200 without the opening 91 .

[0166] Although not shown in the figure, a circuit board without the opening 91 and the thermally conductive member 100B may be connected via a thermally conductive gel or the like.

[0167] [Second embodiment]

[0168] As an example, Fig. 22 As shown, the heat conducting component 100A6 of the second embodiment includes an outer layer portion 205 and an inner layer portion 206 arranged on the inner side of the outer layer portion 205 (a space surrounded by the outer layer portion 205). The shapes of the outer layer portion 205 and the inner layer portion 206 as viewed from the Z-axis direction are both hexagonal. The outer layer portion 205 and the inner layer portion 206 are connected via a connecting portion 207. The outer layer portion 205 is composed of a first sheet portion 208, a second sheet portion 209 having the same length as the first sheet portion 208 and facing the first sheet portion 208, and a pair of V-shaped connecting portions 210 connecting the first sheet portion 208 and the second sheet portion 209. Similarly, the inner layer portion 206 is composed of a first sheet portion 211 , a second sheet portion 212 having the same length as the first sheet portion 211 and opposite to the first sheet portion 211 , and a pair of V-shaped connecting portions 213 connecting the first sheet portion 211 and the second sheet portion 212 .

[0169] The connection portion 210 has a curved portion 214, and the connection portion 213 has a curved portion 215. The curved portion 214 is a corner of two sides of the connection portion 210, and the curved portion 215 is a corner of two sides of the connection portion 213. The curved portion 214 and the curved portion 215 both extend outward. When the anti-vibration function does not work and the imaging element 16 is in the original position, the curved angle θ1 of the curved portion 214 is greater than the curved angle θ2 of the curved portion 215 (θ1>θ2).

[0170] Therefore, compared with the case where the bending angle θ2 is greater than the bending angle θ1, the inner layer 206 can obtain a large amount of expansion and contraction in the vertical direction with a small change in the bending portion 215. As a result, the movable load of the heat conductive component 100A6 can be reduced. In addition, since the bending portions 214 and 215 extend outward, the space surrounded by the outer layer 205 can be expanded, and the bending angle θ2 of the bending portion 215 can be made smaller. In addition, as Fig. 20 As shown in the heat conducting member 100A5, the bent portions 214 and 215 may be recessed inward. However, in this case, the bending angle θ2 of the bent portion 215 cannot be too small, so the bent portions 214 and 215 are preferably extended outward.

[0171] [Third Embodiment]

[0172] As an example, Fig.23 As shown, the heat-conducting component 100A7 of the third embodiment includes an outer layer portion 220 and an inner layer portion 221 disposed inside the outer layer portion 220 (a space surrounded by the outer layer portion 220). The outer layer portion 220 and the inner layer portion 221 are both hexagonal in shape when viewed from the Z-axis direction. The outer layer portion 220 and the inner layer portion 221 are not formed of a sheet-like material 170 as in the heat-conducting component 100A1 of the first embodiment, but are formed separately. Therefore, the outer layer portion 220 and the inner layer portion 221 are not connected by a connecting portion as in the heat-conducting component 100A1 of the first embodiment.

[0173] The outer layer portion 220 is composed of a first sheet portion 222, a second sheet portion 223 having the same length as the first sheet portion 222 and opposite to the first sheet portion 222, and a pair of V-shaped connecting portions 224 connecting the first sheet portion 222 and the second sheet portion 223. Similarly, the inner layer portion 221 is composed of a first sheet portion 225, a second sheet portion 226 having the same length as the first sheet portion 225 and opposite to the first sheet portion 225, and a pair of V-shaped connecting portions 227 connecting the first sheet portion 225 and the second sheet portion 226.

[0174] The connection part 224 has a bent part 228, and the connection part 227 has a bent part 229. The bent part 228 is a corner of two sides of the connection part 224, and the bent part 229 is a corner of two sides of the connection part 227. Both the bent part 228 and the bent part 229 extend outward.

[0175] The thickness THO of the outer layer 220 is thicker than the thickness THI of the inner layer 221 (THO>THI). The outer layer 220 is formed by stacking four graphite sheets 232O composed of graphite 230O and resin films 231O. On the other hand, the inner layer 221 is formed by stacking two graphite sheets 232I composed of graphite 230I and resin films 231I.

[0176] Graphite 230O is thinner than graphite 230I. Generally, the thinner the graphite is, the higher its density is. Therefore, the density ρO of graphite 230O is higher than the density ρI of graphite 230I (ρO>ρI). The densities ρO and ρI are obtained, for example, by measuring the thickness and weight of 50 cm×50 cm fragments of graphite 230O and graphite 230I, and dividing the weight by the volume of the fragment. Therefore, the units of density ρO and ρI are g / cm 3 Graphites 230O and 230I are examples of “heat-conducting materials” involved in the technology of the present invention. Also, graphite sheets 232O and 232I are examples of “heat-conducting layers” involved in the technology of the present invention. In addition, graphite sheets 232O and 232I are sometimes collectively referred to as graphite sheets 232 hereinafter.

[0177] As an example, Fig.24 As shown in the figure, the four graphite sheets 232O constituting the outer layer 220 are not bonded in the curved portion 228, but are bonded by double-sided adhesive tape 235 on both sides constituting the connecting portion 224. The two sides constituting the connecting portion 224 are an example of the "non-bending portion" involved in the technology of the present invention. In addition, although omitted from the figure, the two graphite sheets 232I constituting the inner layer 221 are also not bonded in the curved portion 229, but are bonded on both sides constituting the connecting portion 227.

[0178] Thus, in the third embodiment, the outer layer portion 220 has a structure with higher thermal conductivity than the inner layer portion 221, and the inner layer portion 221 has a structure with higher mobility than the outer layer portion 220. Therefore, the thermal conductivity and mobility of the heat conduction member 100A7 can be kept in balance.

[0179] The outer layer 220 is thicker than the inner layer 221. Therefore, the heat transfer efficiency of the outer layer 220 can be improved more easily than that of the inner layer 221. Furthermore, the resistance of the curved portion 229 of the inner layer 221 when bending can be reduced more easily than the resistance of the curved portion 228 of the outer layer 220 when bending.

[0180] The outer layer 220 is stacked with a plurality of graphite sheets 232O including graphite 230O. In addition, the inner layer 221 has a graphite sheet 232I including graphite 230I. In addition, there are four graphite sheets 232O constituting the outer layer 220, and two graphite sheets 232I constituting the inner layer 221, and the number of stacked layers of the outer layer 220 is greater than that of the inner layer 221. Therefore, the heat conduction efficiency of the outer layer 220 can be improved more easily than that of the inner layer 221. In addition, the resistance of the bent portion 229 of the inner layer 221 when bending can be reduced more easily than the resistance of the bent portion 228 of the outer layer 220 when bending.

[0181] The density of graphite 230O included in the graphite sheet 232O constituting the outer layer portion 220 is higher than that of graphite 230I included in the graphite sheet 232I constituting the inner layer portion 221. Therefore, the thermal conductivity of the outer layer portion 220 can be improved more easily than that of the inner layer portion 221. In addition, the resistance when the curved portion 229 of the inner layer portion 221 is bent can be reduced more easily than the resistance when the curved portion 228 of the outer layer portion 220 is bent.

[0182] The graphite sheet 232 is not bonded in the curved portions 228 and 229, but is bonded to both sides of the connecting portion 224 and both sides of the connecting portion 227, which are non-curved portions. Therefore, it is possible to reduce resistance when the curved portions 228 and 229 are bent. In addition, not only the curved portions 228 and 229, but also other curved portions such as the curved portion at the corner between the first sheet portion 222 and the connecting portion 224, and the curved portion at the corner between the second sheet portion 226 and the connecting portion 227 may be configured to be non-bonded.

[0183] On the basis of stacking a plurality of graphites 230O, the plurality of graphites 230O may be encapsulated by a resin film 231O. Similarly, on the basis of stacking a plurality of graphites 230I, the plurality of graphites 230I may be encapsulated by a resin film 231I. In these cases, the graphites 230O and 230I are examples of the "heat conductive layer" involved in the technology of the present invention.

[0184] [Fourth embodiment]

[0185] As an example, Fig.25 As shown, the heat conducting component 100A8 of the fourth embodiment includes an outer layer portion 240 and an inner layer portion 241 disposed inside the outer layer portion 240 (a space surrounded by the outer layer portion 240). The outer layer portion 240 and the inner layer portion 241 are both hexagonal in shape when viewed from the Z-axis direction. The outer layer portion 240 and the inner layer portion 241 are connected via a connecting portion 242.

[0186] The outer layer portion 240 is composed of a first sheet portion 243, a second sheet portion 244 having the same length as the first sheet portion 243 and opposite to the first sheet portion 243, and a pair of V-shaped connecting portions 245 connecting the first sheet portion 243 and the second sheet portion 244. Similarly, the inner layer portion 241 is composed of a first sheet portion 246, a second sheet portion 247 having the same length as the first sheet portion 246 and opposite to the first sheet portion 246, and a pair of V-shaped connecting portions 248 connecting the first sheet portion 246 and the second sheet portion 247.

[0187] The connection part 245 has a bent part 249, and the connection part 248 has a bent part 250. The bent part 249 is a corner of two sides of the connection part 245, and the bent part 250 is a corner of two sides of the connection part 248. Both the bent part 249 and the bent part 250 extend outward.

[0188] The outer layer 240 and the inner layer 241 are each formed by stacking two graphite sheets 251. The graphite sheet 251 constituting the outer layer 240 and the graphite sheet 251 constituting the inner layer 241 are different from the graphite sheets 232O and 232I of the third embodiment described above, and the thickness and density of the graphite contained therein are the same. Hereinafter, for the sake of convenience of explanation, the graphite sheet 251 constituting the outer layer 240 is expressed as a graphite sheet 251O, and the graphite sheet 251 constituting the inner layer 241 is expressed as a graphite sheet 251I for distinction. The graphite sheet 251 is an example of a "heat conductive layer" involved in the technology of the present invention.

[0189] As an example, Fig.26 As shown, the heat conducting component 100A8 is formed of a sheet of material 255. The material 255 includes two graphite sheets 251O constituting the outer layer 240 and two graphite sheets 251I constituting the inner layer 241. The two graphite sheets 251O are connected by a connecting portion 256O. In addition, the two graphite sheets 251I are connected by a connecting portion 256I. In addition, the connecting portions 256O and 256I are sometimes collectively referred to as the connecting portion 256 below.

[0190] The connecting portion 256O is provided at the center of the graphite sheet 251O and is a portion of the first sheet portion 243 of the outer layer portion 240. That is, the connecting portion 256O is provided at a portion other than the bent portion 249. The first sheet portion 243 is an example of a "non-bent portion" involved in the technology of the present invention.

[0191] The connecting portion 256I is provided at the center of the graphite sheet 251I and is a portion of the first sheet portion 246 of the inner layer portion 241. That is, the connecting portion 256I is provided at a portion other than the curved portion 250. The first sheet portion 246 is an example of a "non-curved portion" according to the present invention.

[0192] In the two graphite sheets 251O, double-sided adhesive tape 257 is attached to the first sheet portion 243 and the second sheet portion 244 of the graphite sheet 251O on the connection portion 242 side. In addition, in the two graphite sheets 251I, double-sided adhesive tape 257 is also attached to the first sheet portion 246 and the second sheet portion 247 of the graphite sheet 251I on the connection portion 242 side.

[0193] As an example, Fig. 27 As shown, the heat conducting component 100A8 is bent Fig.26 251I. Specifically, first, as shown in the upper and middle sections, the portion of the connecting portion 256I is bent 180° so that the two graphite sheets 251I are opposite to each other. Then, the two graphite sheets 251I are overlapped and bonded by the adhesive of the double-sided adhesive tape 257. Next, as shown in the middle and lower sections, the portion of the connecting portion 256O is bent 180° so that the two graphite sheets 251O are opposite to each other. Then, the two graphite sheets 251O are overlapped and bonded by the adhesive of the double-sided adhesive tape 257. Then, the portion of the connecting portion 242 is bent 180° so that the portion that becomes the outer layer portion 240 and the portion that becomes the inner layer portion 241 are opposite to each other. Then, after the bent portion 250 and other portions are bent to form the inner layer portion 241, the bent portion 249 and other portions are bent to form the outer layer portion 240.

[0194] As an example, Fig.28 As shown, a case where there are no connecting parts 256O and 256I and only a plurality of graphite sheets 251O and 251I are stacked is considered as a comparative example. In this case, a large amount of heat from the imaging element 16 is conducted to the first graphite sheets 251O and 251I in contact with the second sheet 126 of the heat-conducting component 100B. However, not much heat is conducted from the first graphite sheets 251O and 251I to the second graphite sheets 251O and 251I that are not in contact with the second sheet 126. Therefore, the effect produced by stacking a plurality of graphite sheets 251 cannot be fully exerted. And, in this case, if the adhesive force of the double-sided adhesive tape 257 is weakened and the two adjacent graphite sheets 251 are peeled off, the heat conduction path of the imaging element 16 is cut off.

[0195] In contrast, as an example, Fig.29As shown, in the fourth embodiment, the heat-conducting component 100A8 is stacked with a plurality of graphite sheets 251, and two adjacent graphite sheets 251 of the plurality of graphite sheets 251 are connected by a connecting portion 256, and are stacked by bending in the connecting portion 256. Therefore, heat is conducted from the first graphite sheets 251O and 251I in contact with the second sheet 126 to the second graphite sheets 251O and 251I not in contact with the second sheet 126 via the connecting portions 256O and 256I. Therefore, the effect of stacking a plurality of graphite sheets 251 can be fully exerted, and the thermal conductivity of the heat-conducting component 100A8 can be further improved. In addition, even if the adhesive force of the double-sided adhesive tape 257 is weakened and the two adjacent graphite sheets 251 are peeled off, the heat conduction path of the imaging element 16 can be ensured through the connecting portions 256O and 256I. Furthermore, even if two adjacent graphite sheets 251 are peeled off, the two graphite sheets 251 can be prevented from being separated from each other by the connecting portions 256O and 256I.

[0196] The two adjacent graphite sheets 251 are bonded together by the adhesive of the double-sided adhesive tape 257. Therefore, the heat transfer efficiency can be improved compared to the case where the two adjacent graphite sheets 251 are not bonded together.

[0197] The connection portion 256 is provided in a non-bending portion other than the bending portions 249 and 250. Therefore, the bending of the bending portions 249 and 250 is not hindered by the connection portion 256.

[0198] As the number of stacked graphite sheets 251, two sheets are shown, but the present invention is not limited to this. Also, the case where there is one connecting portion 256 is shown, but the present invention is not limited to this. As an example, Fig.30 The material 260 shown may include four graphite sheets 251O and 251I, and five connecting portions 256O and 256I. In this case, the connecting portions 256O and 256I are also provided at portions other than the bent portions 249 and 250.

[0199] [Fifth embodiment]

[0200] As an example, Fig.31 As shown, the imaging element unit 270 of the fifth embodiment includes a heat conducting member 100E. The heat conducting member 100E is connected to the fixing member 30 and the camera body 10. The heat conducting member 100E is a metal plate, such as a copper plate. The heat conducting member 100E is an example of the "second heat conducting member" involved in the technology of the present invention.

[0201] In the figure, the image pickup element unit 270 is Fig.31 The cross-sectional view of the AA line cutting Fig.32In the embodiment, a flexible substrate 275 and a heat-conducting component 100F are connected to a fixed component 30 and a movable component 31. The flexible substrate 275 is connected to the imaging element 16 via the movable component 31. The flexible substrate 275 and the heat-conducting component 100F are arranged between the fixed component 30 and the movable component 31. The flexible substrate 275 has a C-shaped flexure 276 that enables the movable component 31 to move. Similarly, the heat-conducting component 100F has a C-shaped flexure 277 that enables the movable component 31 to move. The flexible substrate 275 and the heat-conducting component 100F are bonded to each other by a double-sided adhesive tape in the portion other than the flexures 276 and 277.

[0202] The heat conducting member 100F is disposed in a space SP formed by the flexure 276 of the flexible substrate 275. The heat conducting member 100F is slightly smaller than the flexible substrate 275 so as not to hinder the movement of the flexible substrate 275, but is generally shaped along the flexible substrate 275. In addition, the shape “along” the flexible substrate 275 includes not only a shape that is completely consistent with the flexible substrate 275, but also a shape that is not identical to the flexible substrate 275. Fig.32 The shape of the flexible substrate 275 is roughly the same as that of the thermally conductive component 100F.

[0203] The heat-conducting member 100F conducts the heat of the imaging element 16 stored in the movable member 31 to the fixed member 30. The heat-conducting member 100F is formed of, for example, a graphite sheet, similarly to the heat-conducting member 100A1 and the like. Therefore, the heat-conducting member 100F can have appropriate elasticity. The heat-conducting member 100F is an example of the "first heat-conducting member" involved in the technology of the present invention.

[0204] In the imaging element unit 270 of the present embodiment, as an example, the thermal tracking of the imaging element 16 is as follows: Fig.33 The heat of the imaging element 16 is first conducted to the movable member 31. Then, the heat is conducted from the movable member 31 to the heat-conducting member 100F. The heat conducted to the heat-conducting member 100F is conducted to the fixed member 30. The heat conducted to the fixed member 30 is conducted to the heat-conducting member 100E. Furthermore, the heat is conducted to the camera body 10 through the heat-conducting member 100E, and is dissipated to the outside through the camera body 10.

[0205] Thus, in the fifth embodiment, the imaging element unit 270 includes the heat conducting member 100F which is connected to the fixed member 30 and the movable member 31 and conducts the heat of the imaging element 16 stored in the movable member 31 to the fixed member 30, and includes the flexible portion 277 which enables the movable member 31 to move. Therefore, the heat of the imaging element 16 can be dissipated more effectively.

[0206] The imaging element unit 270 includes a flexible substrate 275 having a flexible portion 276 connected to the imaging element 16 and capable of moving the movable member 31. The thermal conductive member 100F is disposed in a space SP formed by the flexible portion 276 of the flexible substrate 275. Therefore, the space SP can be effectively used as a location for disposing the thermal conductive member 100F.

[0207] The heat conducting member 100F has a shape along the flexible substrate 275. Therefore, the heat conducting member 100F can follow the deformation of the flexible substrate 275 caused by the movement of the movable member 31 and deform without much effort.

[0208] The fixing member 30 is connected to the camera body 10 via the heat-conducting member 100E. Therefore, the heat of the imaging element 16 conducted to the fixing member 30 via the heat-conducting member 100F can be efficiently dissipated to the camera body 10.

[0209] [Implementation method 6_1]

[0210] As an example, Fig.34 As shown, the heat conducting component 100A9 (reference Fig.35 ) of the graphite sheet 280 at the V-shaped connection portion 283 (both refer to Fig.35 ) has a different structure of the graphite 284. Specifically, the graphite 284 has a recessed portion 286 that is recessed inward in the curved portion 285 that is the corner of both sides constituting the connecting portion 283. Therefore, in the graphite 284, the width WGB of the curved portion 285 is narrower than the width WGUB of the non-curved portions 287 on both sides constituting the connecting portion 283 (WGB<WGUB). On the other hand, the resin film 288 has the same width WC in the curved portion 285 and the non-curved portion 287. Here, the expression of "same" in the same width includes, in addition to the meaning of being exactly the same, errors allowed in design and manufacturing, for example, the meaning of being roughly the same including errors of about ±10% of the design value.

[0211] The graphite 284 has a concave portion 286 in the curved portion 285, and thus, with respect to the coverage of the graphite 284 by the resin film 288, the width MB of the curved portion 285 is wider than the width MUB of the non-curved portion 287 (MB>MUB). Therefore, the curved portion 285 has a structure with higher mechanical strength than the non-curved portion 287. Here, the coverage is the distance from the end of the graphite 284 in the width direction to the end of the resin film 288 in the width direction.

[0212] Fig.35 A three-dimensional view showing the assembled thermal conductive component 100A9. Fig.35In order to avoid complexity, the resin film 288 is not depicted.

[0213] Thus, in the 6_1st embodiment, the curved portion 285 has a structure with higher mechanical strength than the non-curved portion 287. Therefore, in the curved portion 285 that deforms multiple times following the movement of the imaging element 16, damage to the resin film 288 as a coating material can be suppressed, thereby improving the durability of the thermal conductive component 100A9.

[0214] The graphite sheet 280 includes graphite 284 and a resin film 288 covering the graphite 284, and the resin film 288 is wider than the graphite 284. With respect to the distance from the end of the width direction of the graphite 284 to the end of the width direction of the resin film 288, that is, the covering amount, the curved portion 285 is wider than the non-curved portion 287. Specifically, with respect to the width of the graphite 284, the curved portion 285 is narrower than the non-curved portion 287. Moreover, the width of the resin film 288 is the same in the curved portion 285 and the non-curved portion 287. Therefore, in the curved portion 285, the possibility of the graphite 284 leaking to the outside due to the damage of the resin film 288 can be reduced, and the mechanical strength of the curved portion 285 can be easily improved. In addition, there is no need to perform special processing on the resin film 288, and an inexpensive resin film 288 can be used.

[0215] [Implementation Method No. 6-2]

[0216] As an example, Fig.36 As shown, the heat conducting component 100A10 (reference Fig.37 ) of the graphite sheet 290, the V-shaped connecting portion 293 (both refer to Fig.37 ) has a different structure of the resin film 298. Specifically, the resin film 298 has a convex portion 296 extending outward at the corners of the two sides constituting the connection portion 293, that is, the curved portion 295. Therefore, in the resin film 298, the width WCB of the curved portion 295 is wider than the width WCUB of the non-curved portions 297 on both sides constituting the connection portion 293 (WCB>WCUB). On the other hand, the graphite 294 has the same width WG in the curved portion 295 and the non-curved portion 297. Here, the expression of "same" in the same width includes not only the meaning of "same" but also the error allowed in design and manufacturing, for example, the meaning of "approximately the same" including an error of about ±10% of the design value.

[0217] The resin film 298 has the convex portion 296 at the curved portion 295, and thus, as in the case of the sixth first embodiment, with respect to the coating amount of the graphite 294 by the resin film 298, the width MB of the curved portion 295 is wider than the width MUB of the non-curved portion 297 (MB>MUB). Therefore, the curved portion 295 has a structure with higher mechanical strength than the non-curved portion 297. Here, as in the case of the sixth first embodiment, the coating amount is the distance from the end of the graphite 294 in the width direction to the end of the resin film 298 in the width direction.

[0218] Fig.37 1 is a perspective view showing the assembled thermal conductive component 100A10. Fig.37 In order to avoid complexity, graphite 294 is not depicted.

[0219] As an example, Fig.38 As shown, a plurality of mounting components 302 are mounted on the back side 301 of the circuit board 300 of the present embodiment. The mounting components 302 are, for example, a control circuit, a drive circuit, a power supply circuit, a resistor or a capacitor of the imaging element 16. The mounting components 302 are mounted at a position opposite to the non-bending portion 297 of the thermal conductive component 100A10, but are not mounted at a position opposite to the bending portion 295. Therefore, regarding the thickness of the circuit board 300 including the mounting components 302, the thickness THCB at the position opposite to the bending portion 295 is thinner than the thickness THCUB at the position opposite to the non-bending portion 297 (THCB<THCUB).

[0220] In the sixth second embodiment, the curved portion 295 also has a structure having higher mechanical strength than the non-curved portion 297. Therefore, the curved portion 295 deformed multiple times following the movement of the imaging element 16 and the durability of the heat transfer member 100A10 can be improved.

[0221] In the 6-2nd embodiment, the width of the resin film 298 is wider in the curved portion 295 than in the non-curved portion 297. In addition, the width of the graphite 294 is the same in the curved portion 295 and the non-curved portion 297. Therefore, in the curved portion 295, the possibility of the graphite 294 leaking to the outside due to the damage of the resin film 298 can be reduced, and the mechanical strength of the curved portion 295 can be easily improved. In addition, there is no need to perform special processing on the graphite 294, and inexpensive graphite 294 can be used.

[0222] The heat-conducting component 100A10 is arranged at a position of the imaging element 16 opposite to the circuit board 300. In the circuit board 300, the thickness THCB at the position opposite to the curved portion 295 is thinner than the thickness THCUB at the position opposite to the non-curved portion 297. Therefore, the possibility that the mounting component 302 of the circuit board 300 interferes with the curved portion 295 and hinders the bending of the curved portion 295 can be reduced. In addition, the space between the heat-conducting component 100A10 formed by the protrusion 296 and the circuit board 300 can be effectively used as a mounting position for the mounting component 302. In addition, in the circuit board 300, as long as the thickness THCB at the position opposite to the curved portion 295 is thinner than the thickness THCUB at the position opposite to the non-curved portion 297 and the mounting component 302 does not interfere with the curved portion 295, the mounting component 302 can be mounted at the position opposite to the curved portion 295.

[0223] [Seventh embodiment]

[0224] As an example, Fig.39 As shown, the heat conduction member 100A11 of the seventh embodiment has a slit 306 formed in the bent portion 305. The longitudinal direction of the slit 306 is along the Y-axis direction, which is the direction in which the heat conduction member 100A11 expands and contracts due to the bending of the bent portion 305.

[0225] Thus, in the seventh embodiment, the slit 306 is formed in the curved portion 305. Therefore, the resistance when the curved portion 305 is bent can be reduced. The heat conducting member 100A11 can follow the movement of the imaging element 16 due to the vibration-proof function without much deformation. Therefore, the movable load of the heat conducting member 100A11 can be reduced.

[0226] The length direction of the slit 306 is along the Y-axis direction, which is the direction in which the heat conducting member 100A11 expands and contracts due to the bending of the bending portion 305. Therefore, compared with the case where the length direction of the slit 306 intersects with the Y-axis direction (for example, the Z-axis direction), a wider conduction path for the heat of the imaging element 16 in the Y-axis direction can be ensured. A decrease in the heat conduction efficiency of the heat conducting member 100A11 due to the formation of the slit 306 can be minimized.

[0227] In addition, the slit 306 may be formed in the bent portion at the corner between the first sheet portion and the connecting portion, and in the bent portion at the corner between the second sheet portion and the connecting portion.

[0228] The CPU 18 is exemplified as a processor for controlling the operation of the image pickup element unit 15, but the present invention is not limited thereto. Instead of or in addition to the CPU 18, a processor whose circuit structure can be changed after manufacturing, such as an FPGA (Field Programmable Gate Array), a programmable logic device (PLD), and / or an ASIC (Application Specific Integrated Circuit), which is a dedicated circuit having a circuit structure specially provided for executing specific processing, may be used.

[0229] In the first embodiment, the plates 45 to 47 are provided on the fixed member 30, and the recesses 70 to 72 are provided on the movable member 31, but the present invention is not limited to this. The plates 45 to 47 may be provided on the movable member 31, and the recesses 70 to 72 may be provided on the fixed member 30. Furthermore, in the first embodiment, the magnets 40 to 42 are provided on the fixed member 30, and the coils 60 to 62 are provided on the movable member 31, but the present invention is not limited to this. The magnets 40 to 42 may be provided on the movable member 31, and the coils 60 to 62 may be provided on the fixed member 30.

[0230] The number of groups of the balls 35 to 37 , the plates 45 to 47 , and the recesses 70 to 72 is not limited to three, and may be four or more.

[0231] The image pickup device unit of the present invention can be applied to image pickup devices other than the digital camera 2 exemplified, such as a smartphone, a tablet terminal, or a surveillance camera.

[0232] Based on the above description, the techniques described in the following supplementary notes can be understood.

[0233] [Additional item 1]

[0234] An imaging device unit is built into a frame of an imaging device, and the imaging device unit comprises:

[0235] An imaging element for photographing a subject;

[0236] at least two heat-conducting components that conduct heat of the imaging element and are connected to each other in a component connecting portion; and

[0237] The reinforcing member reinforces the connection between the two heat conducting members in the member connecting portion.

[0238] [Additional item 2]

[0239] According to the image pickup element unit described in additional item 1, it has an anti-vibration function that allows the image pickup element to move in the surface direction of the image pickup surface, and one of the two heat conduction components can be deformed to follow the movement of the image pickup element based on the anti-vibration function.

[0240] [Additional item 3]

[0241] The imaging device unit according to Supplementary item 1 or 2, wherein:

[0242] The reinforcing member is bonded to the two heat conducting members in the member connecting portion by an adhesive.

[0243] [Additional Item 4]

[0244] The imaging device unit according to any one of Supplementary Items 1 to 3, wherein:

[0245] The reinforcing member includes a thermally conductive material having a thermal conductivity of 500 W / m·K or more.

[0246] [Additional item 5]

[0247] A camera device comprising:

[0248] frame; and

[0249] The image pickup device unit according to any one of Supplementary Notes 1 to 4 is built in the housing.

[0250] [Additional item 6]

[0251] An imaging device unit is built into a frame of an imaging device, and the imaging device unit comprises:

[0252] An imaging element having an imaging surface for capturing an object;

[0253] An anti-vibration function causes the imaging element to move along the surface direction of the imaging surface; and

[0254] a heat-conducting member to which the heat of the imaging element is conducted, and which is deformable in accordance with the movement of the imaging element due to the anti-vibration function;

[0255] The heat conducting component has:

[0256] the outer part; and

[0257] at least one inner layer portion, arranged inside the outer layer portion,

[0258] The outer layer portion and the inner layer portion each have a bending portion capable of the above-mentioned deformation,

[0259] The bending angle of the bending portion of the inner layer portion is smaller than that of the bending portion of the outer layer portion.

[0260] [Additional item 7]

[0261] The imaging device unit according to supplementary item 6, wherein:

[0262] The inner layer portion is arranged in a space formed by the outer layer portion.

[0263] [Additional item 8]

[0264] The imaging device unit according to Supplementary item 6 or 7, wherein:

[0265] The curved portion of the outer layer portion and the curved portion of the inner layer portion extend outward.

[0266] [Additional item 9]

[0267] A camera device comprising:

[0268] frame; and

[0269] The image pickup device unit according to any one of Supplementary Notes 6 to 8 is built in the frame.

[0270] [Additional item 10]

[0271] An imaging device unit is built into a frame of an imaging device, and the imaging device unit comprises:

[0272] An imaging element having an imaging surface for capturing an object;

[0273] An anti-vibration function causes the imaging element to move along the surface direction of the imaging surface; and

[0274] a heat-conducting member to which the heat of the imaging element is conducted, and which is deformable in accordance with the movement of the imaging element due to the anti-vibration function;

[0275] The heat conducting component has:

[0276] the outer part; and

[0277] at least one inner layer portion, arranged inside the outer layer portion,

[0278] The outer layer portion has a structure with higher thermal conductivity than the inner layer portion, and the inner layer portion has a structure with higher mobility than the outer layer portion.

[0279] [Supplementary Item 11]

[0280] The imaging device unit according to supplementary item 10, wherein:

[0281] The inner layer portion is arranged in a space formed by the outer layer portion.

[0282] [Supplementary Item 12]

[0283] The imaging device unit according to Supplementary item 10 or 11, wherein:

[0284] The outer layer portion is thicker than the inner layer portion.

[0285] [Supplementary Item 13]

[0286] The imaging device unit according to any one of supplementary items 10 to 12, wherein:

[0287] The outer layer portion is formed by stacking a plurality of heat-conducting layers including a heat-conducting material.

[0288] [Supplementary Item 14]

[0289] The imaging device unit according to supplementary item 13, wherein:

[0290] The inner layer portion has a heat conductive layer containing a heat conductive material,

[0291] The outer layer portion has a larger number of laminated heat conductive layers than the inner layer portion.

[0292] [Supplementary Item 15]

[0293] The imaging device unit according to Supplementary item 13 or 14, wherein:

[0294] The heat conductive material of the outer layer portion has a higher density than that of the inner layer portion.

[0295] [Supplementary Item 16]

[0296] A camera device comprising:

[0297] frame; and

[0298] The image pickup device unit according to any one of Supplementary Notes 10 to 15 is built in the housing.

[0299] [Supplementary Item 17]

[0300] An imaging device unit is built into a frame of an imaging device, and the imaging device unit comprises:

[0301] An imaging device for capturing an object; and

[0302] a heat conducting member to which the heat of the imaging element is conducted,

[0303] The heat-conducting component is stacked with a plurality of heat-conducting layers containing heat-conducting materials,

[0304] Two adjacent heat conductive layers among the plurality of heat conductive layers are connected by a connecting portion and are stacked by being bent at the connecting portion.

[0305] [Supplementary Item 18]

[0306] The imaging device unit according to supplementary item 17, wherein:

[0307] The two adjacent heat-conducting layers are bonded by an adhesive.

[0308] [Supplementary Item 19]

[0309] The imaging element unit according to Supplementary item 17 or 18, which has an anti-vibration function of moving the imaging element in the surface direction of the imaging surface,

[0310] The heat conducting member has a curved portion that can deform to follow the movement of the imaging element due to the vibration-proof function.

[0311] The connecting portion is provided at a non-bending portion other than the bending portion.

[0312] [Supplementary item 20]

[0313] A camera device comprising:

[0314] frame; and

[0315] The imaging device unit according to any one of Supplementary Notes 17 to 19 is built in the housing.

[0316] [Supplementary item 21]

[0317] An imaging device unit is built into a frame of an imaging device, and the imaging device unit comprises:

[0318] An imaging element having an imaging surface for capturing an object; and

[0319] an anti-vibration function, which is realized by a movable member that holds the imaging element and moves the imaging element in the plane direction of the imaging plane, and a fixed member that movably holds the movable member and fixes the position in the frame; and

[0320] The first heat conducting member is connected to the movable member and the fixed member and conducts the heat of the imaging element stored in the movable member to the fixed member, and has a flexible portion capable of moving the movable member.

[0321] [Supplementary item 22]

[0322] The imaging element unit according to appendix 21, comprising a flexible substrate connected to the imaging element and having a flexible portion capable of moving the movable member,

[0323] The first heat conduction member is arranged in a space formed by the flexible portion of the flexible substrate.

[0324] [Supplementary item 23]

[0325] The imaging device unit according to supplementary item 22, wherein:

[0326] The first heat conducting member has a shape along the flexible substrate.

[0327] [Supplementary item 24]

[0328] An image pickup device unit according to any one of Supplementary Notes 21 to 23, wherein:

[0329] The fixing member is connected to the frame body via a second heat conducting member.

[0330] [Supplementary item 25]

[0331] A camera device comprising:

[0332] frame; and

[0333] The image pickup device unit according to any one of Supplementary Notes 21 to 24 is built in the frame.

[0334] The technology of the present invention can also appropriately combine the above-mentioned various embodiments and / or various modifications. Furthermore, the technology of the present invention is not limited to the above-mentioned embodiments, and various structures can be adopted as long as they do not deviate from the gist.

[0335] The recorded contents and illustrated contents shown above are detailed descriptions of the parts involved in the technology of the present invention, and are only an example of the technology of the present invention. For example, the descriptions related to the above-mentioned structure, function, action and effect are descriptions related to an example of the structure, function, action and effect of the parts involved in the technology of the present invention. Therefore, it is self-evident that unnecessary parts can be deleted from the recorded contents and illustrated contents shown above, or new elements can be added, or replacement can be performed without departing from the main purpose of the technology of the present invention. In addition, in order to avoid complication and to make it easy to understand the parts involved in the technology of the present invention, the descriptions related to the technical common sense that does not need to be specifically explained in terms of the implementation of the technology of the present invention are omitted in the recorded contents and illustrated contents shown above.

[0336] In this specification, "A and / or B" has the same meaning as "at least one of A and B". That is, "A and / or B" means that it can be only A, only B, or a combination of A and B. Furthermore, in this specification, when three or more items are combined and expressed using "and / or", the same concept as "A and / or B" can also be applied.

[0337] All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each document, patent application, and technical standard was specifically and individually described.

Claims

1. An image pickup device unit, which is built into a frame of an image pickup device, the image pickup device unit comprising: An imaging element for photographing a subject; at least two heat-conducting components that conduct heat of the imaging element and are connected to each other in a component connecting portion; and The reinforcing member reinforces the connection between the two heat conducting members in the member connecting portion.

2. The imaging element unit according to claim 1, comprising a vibration-proof function for moving the imaging element in a plane direction of an imaging plane. One of the two heat conducting members may be deformed to follow the movement of the imaging element due to the anti-vibration function.

3. The imaging device unit according to claim 1, wherein: The reinforcing member is bonded to the two heat conducting members in the member connecting portion by an adhesive.

4. The imaging device unit according to claim 1, wherein: The reinforcing member includes a thermally conductive material having a thermal conductivity of 500 W / m·K or more.

5. A camera device comprising: frame; and The image pickup device unit according to any one of claims 1 to 4 is built into the frame.

6. An image pickup device unit, which is built into a frame of an image pickup device, the image pickup device unit comprising: An imaging element having an imaging surface for capturing an object; An anti-vibration function causes the imaging element to move along the surface direction of the imaging surface; and a heat-conducting member that conducts heat of the imaging element and is deformable to follow the movement of the imaging element due to the anti-vibration function; The heat conducting component has: the outer part; and at least one inner layer portion, arranged inside the outer layer portion, The outer layer portion and the inner layer portion each have a bending portion capable of the above-mentioned deformation, The bending angle of the bending portion of the inner layer portion is smaller than that of the bending portion of the outer layer portion.

7. The imaging device unit according to claim 6, wherein: The inner layer portion is arranged in a space formed by the outer layer portion.

8. The imaging device unit according to claim 6, wherein: The curved portion of the outer layer portion and the curved portion of the inner layer portion extend outward.

9. A camera device comprising: frame; and The imaging device unit according to any one of claims 6 to 8 is built into the frame.

10. An image pickup device unit, which is built into a frame of an image pickup device, the image pickup device unit comprising: An imaging element having an imaging surface for capturing an object; An anti-vibration function causes the imaging element to move along the surface direction of the imaging surface; and a heat-conducting member that conducts heat of the imaging element and is deformable to follow the movement of the imaging element due to the anti-vibration function; The heat conducting component has: the outer part; and at least one inner layer portion, arranged inside the outer layer portion, The outer layer portion has a structure with higher thermal conductivity than the inner layer portion, and the inner layer portion has a structure with higher mobility than the outer layer portion.

11. The imaging device unit according to claim 10, wherein: The inner layer portion is arranged in a space formed by the outer layer portion.

12. The image pickup device unit according to claim 10, wherein: The outer layer portion is thicker than the inner layer portion.

13. The image pickup device unit according to claim 10, wherein: The outer layer portion is formed by stacking a plurality of heat-conducting layers including a heat-conducting material.

14. The image pickup device unit according to claim 13, wherein: The inner layer portion has a heat conductive layer containing a heat conductive material, The outer layer portion has a larger number of laminated heat conductive layers than the inner layer portion.

15. The image pickup device unit according to claim 13, wherein: The heat conductive material of the outer layer portion has a higher density than that of the inner layer portion.

16. A camera device comprising: frame; and The imaging device unit according to any one of claims 10 to 15 is built into the frame.

17. An image pickup device unit, which is built into a frame of an image pickup device, the image pickup device unit comprising: An imaging device for capturing an object; and a heat-conducting component for conducting heat from the imaging element; The heat-conducting component is stacked with a plurality of heat-conducting layers containing heat-conducting materials, Two adjacent heat conductive layers among the plurality of heat conductive layers are connected by a connecting portion and are stacked by being bent at the connecting portion.

18. The image pickup device unit according to claim 17, wherein: The two adjacent heat-conducting layers are bonded by an adhesive.

19. The imaging element unit according to claim 17, comprising a vibration-proof function for moving the imaging element in a plane direction of an imaging plane. The heat conducting member has a curved portion that can deform to follow the movement of the imaging element due to the vibration-proof function. The connecting portion is provided at a non-bending portion other than the bending portion.

20. A camera device comprising: frame; and The imaging device unit according to any one of claims 17 to 19 is built into the frame.

21. An image pickup device unit, which is built into a frame of an image pickup device, the image pickup device unit comprising: An imaging element having an imaging surface for capturing an object; and an anti-vibration function, which is realized by a movable member that holds the imaging element and moves the imaging element in the plane direction of the imaging plane, and a fixed member that movably holds the movable member and fixes the position in the frame; and The first heat conducting member is connected to the movable member and the fixed member and conducts the heat of the imaging element stored in the movable member to the fixed member, and has a flexible portion capable of moving the movable member.

22. The imaging element unit according to claim 21, comprising a flexible substrate, the flexible substrate being connected to the imaging element and having a flexure capable of moving the movable member. The first heat conduction member is arranged in a space formed by the flexible portion of the flexible substrate.

23. The image pickup device unit according to claim 22, wherein: The first heat conducting member has a shape along the flexible substrate.

24. The image pickup device unit according to claim 21, wherein: The fixing member is connected to the frame body via a second heat conducting member.

25. A camera device comprising: frame; and The imaging device unit according to any one of claims 21 to 24 is built into the frame.

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