Package substrate shape processing method, device, equipment and medium

Abstract

The present application proposes a method, device, equipment and medium for processing the shape of a package substrate, which relates to the technical field of substrate processing. The method obtains the milling life index of the milling cutter before processing to predict the degree of wear of the milling cutter, and determines the target compensation amount required for the milling cutter to perform milling processing on the substrate to be processed based on the milling life index and the milling compensation amount corresponding to different index ranges. The travel path of the milling cutter during substrate processing is determined based on the target size of the substrate to be processed and combined with the target compensation amount, so that the substrate size obtained after the milling cutter performs milling processing according to the travel path can have a small error with the target size. The present application flexibly adjusts the compensation amount during milling according to the wear of the milling cutter, flexibly adjusts the travel path of the milling cutter, reduces the deviation between the actual processing contour of the substrate and the target contour, and effectively solves the impact of milling cutter wear on substrate processing.

Description

Technical Field

[0001] The present application relates to the technical field of substrate processing, and in particular to a method, device, equipment and medium for processing the appearance of a packaging substrate. Background Art

[0002] The contour processing is to use a milling cutter to mill the package substrate for processing. During the processing of the milling cutter, the friction between the milling cutter and the workpiece (package substrate) generates resistance and friction on the milling cutter. The longer the processing time, the greater the wear on the milling cutter, and the smaller the diameter of the milling cutter will be. Since the tool path during the processing is unchanged, the actual processing contour does not match the target contour, which affects the size of the package substrate after contour processing, such as Figure 1 As shown in the figure, there is a large deviation between the actual machining contour and the target contour.

[0003] The existing packaging substrate shape processing method is to use a more wear-resistant coated milling cutter for processing, but the replacement of the tool only reduces the impact of wear and tear, and still does not completely solve the product quality problems caused by milling cutter wear. Summary of the invention

[0004] Based on this, it is necessary to provide a packaging substrate shape processing method, device, equipment and medium to address the above technical problems, so as to solve the product quality problems caused by milling cutter wear.

[0005] A method for processing the shape of a packaging substrate, comprising: obtaining a milling life index of a milling cutter before processing a substrate to be processed, wherein the milling life index is associated with the wear condition of the milling cutter; determining a target compensation amount required when the milling cutter performs milling processing on the substrate to be processed based on the milling life index and the milling compensation amounts corresponding to different index ranges; determining a travel path of the milling cutter when milling the substrate to be processed based on the target compensation amount and the target size of the substrate to be processed, so as to control the milling cutter to perform milling processing on the substrate to be processed according to the travel path.

[0006] In an embodiment of the present application, the target compensation amount required for the milling cutter to mill the substrate to be processed is determined based on the milling life index and the milling compensation amounts corresponding to different index ranges, including: from the milling compensation amounts corresponding to different index ranges, selecting the milling compensation amount corresponding to the index range in which the milling life index is located as the target compensation amount.

[0007] In an embodiment of the present application, the target compensation amount includes a first type of compensation amount and a second type of compensation amount, and the target compensation amount required for the milling cutter to mill the substrate to be processed is determined based on the milling life index and the milling compensation amounts corresponding to different index ranges, including: from the milling compensation amounts corresponding to different index ranges, screening the milling compensation amount corresponding to the index range in which the milling life index is located as the first type of compensation amount; within the target path length, determining the milling compensation amount corresponding to the index range in which the latest milling life index of the milling cutter is located after the milling cutter travels a preset length each time, as the second type of compensation amount.

[0008] In the embodiment of the present application, the target path length is the length of the travel path of the milling cutter determined according to the first type of compensation amount and the target size of the substrate to be processed.

[0009] In an embodiment of the present application, the milling compensation amounts corresponding to different index ranges are determined in the following manner: determining a characteristic value of the index range; predicting the radius wear amount of the milling cutter when the milling life index is the characteristic value; determining the radius of the milling cutter when the milling life index is the characteristic value based on the initial radius of the milling cutter and the radius wear amount; determining the milling compensation amount within the index range based on the radius of the milling cutter when the milling life index is the characteristic value and the radius wear amount.

[0010] In an embodiment of the present application, predicting the radius wear of the milling cutter when the milling life index of the milling cutter is the characteristic value includes: inputting the characteristic value into a pre-trained wear prediction model to obtain the radius wear of the milling cutter, and the wear prediction model is trained based on historical data of the milling life index of the milling cutter and actual radius wear corresponding to different milling life indices.

[0011] In an embodiment of the present application, the milling life index is the length of a historical travel path of a preset position point on the milling cutter after the milling cutter performs milling processing on the substrate.

[0012] A device for processing the appearance of a packaging substrate, the device comprising: an acquisition module, used to acquire the milling life index of a milling cutter before processing a substrate to be processed; a first determination module, used to determine the target compensation amount required when the milling cutter performs milling processing on the substrate to be processed based on the milling life index and the milling compensation amounts corresponding to different index ranges; a second determination module, used to determine the travel path of the milling cutter when milling the substrate to be processed based on the target compensation amount and the target size of the substrate to be processed, so as to control the milling cutter to perform milling processing on the substrate to be processed according to the travel path.

[0013] In an embodiment of the present application, the first determination module is used to: select the milling compensation amount corresponding to the index range in which the milling life index is located from the milling compensation amounts corresponding to different index ranges, as the target compensation amount.

[0014] In an embodiment of the present application, the target compensation amount includes a first type of compensation amount and a second type of compensation amount, and the first determination module is used to: screen the milling compensation amount corresponding to the index range in which the milling life index is located from the milling compensation amounts corresponding to different index ranges, as the first type of compensation amount; within the target path length, determine the milling compensation amount corresponding to the index range in which the latest milling life index of the milling cutter is located after the milling cutter travels a preset length each time, as the second type of compensation amount.

[0015] In the embodiment of the present application, the target path length is the length of the travel path of the milling cutter determined according to the first type of compensation amount and the target size of the substrate to be processed.

[0016] In an embodiment of the present application, the device is also used to determine the milling compensation amount corresponding to different index ranges in the following manner: determine the characteristic value of the index range; predict the radius wear of the milling cutter when the milling life index is the characteristic value; determine the radius of the milling cutter when the milling life index is the characteristic value based on the initial radius of the milling cutter and the radius wear; determine the milling compensation amount within the index range based on the radius of the milling cutter when the milling life index is the characteristic value and the radius wear.

[0017] In an embodiment of the present application, the device is also used to: input the characteristic value into a pre-trained wear prediction model to obtain the radius wear of the milling cutter, and the wear prediction model is trained based on historical data of the milling life index of the milling cutter and actual radius wear corresponding to different milling life indices.

[0018] In an embodiment of the present application, the milling life index is the length of a historical travel path of a preset position point on the milling cutter after the milling cutter performs milling processing on the substrate.

[0019] An electronic device comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the method for processing the outer shape of a packaging substrate as described in the above embodiment are implemented.

[0020] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the method for processing the outer shape of a packaging substrate as described in the above embodiment.

[0021] In summary, the present application proposes a method, device, equipment and medium for processing the shape of a package substrate. The method obtains the milling life index of the milling cutter before processing to predict the degree of wear of the milling cutter, and determines the target compensation amount required for the milling cutter to perform milling processing on the substrate to be processed based on the milling life index and the milling compensation amount corresponding to different index ranges. The travel path of the milling cutter during substrate processing is determined based on the target size of the substrate to be processed and combined with the target compensation amount, so that the substrate size obtained after the milling cutter performs milling processing according to the travel path can have a small error with the target size. The present application flexibly adjusts the compensation amount during milling according to the wear of the milling cutter, flexibly adjusts the travel path of the milling cutter, reduces the deviation between the actual processing contour of the substrate and the target contour, and effectively solves the impact of milling cutter wear on substrate processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0023] Figure 1 It is a comparative diagram of the center line of the milling cutter, the actual processing contour and the target contour in the substrate shape processing; Figure 2 is a flow chart of a method for processing the outer shape of a packaging substrate according to an exemplary embodiment of the present application; Figure 3 It is a schematic diagram of the path of the milling cutter when milling the substrate; Figure 4 is a flow chart of a method for processing the outer shape of a packaging substrate according to another exemplary embodiment of the present application; Figure 5 is a flow chart of a method for processing the outer shape of a packaging substrate according to another exemplary embodiment of the present application; Figure 6 is a schematic block diagram of a packaging substrate appearance processing device according to an exemplary embodiment of the present application; Figure 7 It is a block diagram of an electronic device according to an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described by reference to the drawings are exemplary and are intended to be used to explain the present application, and cannot be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0025] Figure 2 is a flow chart of a method for processing the appearance of a packaging substrate according to an exemplary embodiment of the present application. Figure 2 As shown, the method comprises the following steps: S201, obtaining a milling life index of a milling cutter before processing a substrate to be processed, wherein the milling life index is associated with the wear condition of the milling cutter.

[0026] The milling life index is the length of the historical path of the preset position point on the milling cutter after the milling cutter performs the milling process on the substrate. For example, the historical path of the center point on the center axis of the milling cutter, such as Figure 1 The center line of the milling cutter in.

[0027] The milling life index is used to characterize the use degree of the milling cutter. For example, the milling life index may be the use time of the milling cutter, or the length of the milling path traveled by the milling cutter during substrate processing, or the length of the outer contour of the substrate processed by the milling cutter.

[0028] For example, a brand new milling cutter travels a total of 0.2 m when milling the substrate 1 . After the outer shape of the substrate 1 is processed, the milling life index of the milling cutter is 0.2 m.

[0029] It is not difficult to understand that the more the milling cutter is used, the more serious the wear of the milling cutter is, and the less the milling cutter is used, the lighter the wear of the milling cutter is.

[0030] Therefore, the milling life index of the milling cutter is associated with the wear condition of the milling cutter. When calculating the target compensation amount, the wear condition of the milling cutter is introduced into the calculation of the target compensation amount by introducing the milling life index.

[0031] S202, determining a target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amounts corresponding to different index ranges.

[0032] For example, the length of the historical milling path of the milling cutter is used as the milling life index. If the milling life index of the milling cutter is 0.2m, and the milling compensation amount in the range of 0.1m-0.3m is 0.62mm, then the target compensation amount required for the milling cutter with a milling life index of 0.2m to mill the substrate to be processed is 0.62mm.

[0033] It should be noted that the milling compensation can be understood as the radius compensation of the milling cutter, which is used to determine the position of the milling cutter during substrate processing to ensure that the tool can cut according to the predetermined trajectory during the processing. For example, the vertical distance between the center of the milling cutter and the target contour line of the substrate is the value of the milling compensation, so as to reduce the deviation between the actual contour finally processed and the target contour line of the substrate.

[0034] In the embodiment of the present application, the milling compensation amounts corresponding to different index ranges can be pre-set.

[0035] The granularity of the index range division can be adjusted as needed. For example, taking the length of the historical milling path of the milling cutter as an example, the range can be divided into meters, and the milling compensation amount required for each meter of travel of the milling cutter can be preset.

[0036] S203, determining a travel path of the milling cutter when milling the substrate to be processed according to the target compensation amount and the target size of the substrate to be processed, so as to control the milling cutter to mill the substrate to be processed according to the travel path.

[0037] Taking the target size of the substrate to be processed as a reference, a target compensation amount is superimposed outside the target contour corresponding to the target size to determine the travel path of the milling cutter when milling the substrate to be processed.

[0038] The milling cutter is controlled according to the travel path to perform milling processing on the substrate to be processed, so that there is a small error between the actual contour of the processed substrate and the target contour, and there is a small error between the actual size of the processed substrate and the target size.

[0039] In summary, the contour processing method of the package substrate proposed in the embodiment of the present application obtains the milling life index of the milling cutter before processing to predict the wear degree of the milling cutter, determines the target compensation amount required for the milling cutter to perform milling processing on the substrate to be processed based on the milling life index and the milling compensation amount corresponding to different index ranges, and determines the travel path of the milling cutter when processing the substrate based on the target size of the substrate to be processed in combination with the target compensation amount, so that the substrate size obtained after the milling cutter performs milling processing according to the travel path can have a small error with the target size. The present application flexibly adjusts the compensation amount during milling according to the wear of the milling cutter, flexibly adjusts the travel path of the milling cutter, reduces the deviation between the actual processing contour of the substrate and the target contour, effectively solves the influence of milling cutter wear on substrate processing, and improves the effect of contour processing of the package substrate.

[0040] On the basis of the above embodiment, the above step S202 of "determining the target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amount corresponding to different index ranges" includes the following steps: From the milling compensation amounts corresponding to different index ranges, the milling compensation amount corresponding to the index range in which the milling life index is located is selected as the target compensation amount.

[0041] like Figure 3 As shown, when a substrate is subjected to contour processing, the milling cutter moves in the order of 1-2-3-4 in the figure, starting from the lowering point and ending at the closing point.

[0042] The milling life index of the milling cutter will continue to change as it moves forward. In some embodiments, only the milling life index of the milling cutter at the lower cutting point can be used as a basis to determine the milling compensation amount corresponding to the index range of the milling life index of the milling cutter at the lower cutting point, and the milling compensation amount is used as the milling compensation amount for the entire substrate processing process, that is, when the milling cutter is processing the substrate to be processed, the milling compensation amount at any point is the same as the milling compensation amount of the milling cutter at the lower cutting point.

[0043] In this way, when processing a certain substrate, it is only necessary to calculate the milling compensation amount at the cutting point as the target compensation amount, thereby reducing the calculation amount of the target compensation amount.

[0044] Based on the above embodiment, the target compensation amount includes a first type of compensation amount and a second type of compensation amount, such as Figure 4 As shown, the above step S202 of "determining the target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amount corresponding to different index ranges" includes the following steps: S401, from the milling compensation amounts corresponding to different index ranges, select the milling compensation amount corresponding to the index range in which the milling life index is located as the first type of compensation amount.

[0045] S402, within the target path length, determine the milling compensation amount corresponding to the index range of the latest milling life index of the milling cutter after the milling cutter travels a preset length each time, as the second type of compensation amount. The milling life index is the milling life index of the milling cutter before processing, that is, the milling life index of the milling cutter at the above-mentioned cutting point; The target path length can be set as needed. Since the milling life index of the milling cutter increases continuously as the milling cutter moves continuously during the substrate processing, the embodiment of the present application pre-sets multiple locations for obtaining milling compensation within the target path length range to improve the accuracy of the final generated path. For example, the milling compensation is obtained once at the cutter point, and the milling compensation is obtained again after moving 0.5 meters from the cutter point. The 0.5 meters here is the above-mentioned preset length.

[0046] Except for the milling compensation determined by the milling life index at the following tool point, the milling compensation determined based on other milling life indices are all recorded as the second type of compensation.

[0047] The target path is the travel path of the milling cutter. After the milling cutter travels a preset length, the latest milling life index of the milling cutter can be predicted by the following example: If the milling life index is the length of the milling path that the milling machine travels during the substrate processing, the latest milling life index is the sum of the milling life index at the cutting point and the preset length; If the milling life index is the length of time the milling cutter is used, the latest milling life index = the milling life index at the cutting point + (preset length / milling cutter travel speed).

[0048] The embodiment of the present application selects multiple milling life indices that may appear in the future, determines multiple milling compensation amounts as target compensation amounts based on these milling life indices, and also takes into account the wear that will occur when the milling cutter processes the substrate to be processed in the process of determining the milling cutter's travel path. This allows the milling cutter to reduce the deviation between the actual processing contour of the substrate and the target contour when performing milling processing with the finally determined travel path.

[0049] Based on the above embodiment, the target path length is the length of the travel path of the milling cutter determined according to the first type of compensation amount and the target size of the substrate to be processed.

[0050] Alternatively, the outer contour circumference corresponding to the target size of the substrate to be processed may be directly used as the length of the target path.

[0051] In an embodiment of the present application, the length of the milling cutter's travel path determined based on the milling compensation amount at the cutting point is used as the target path length, so that the determined target path length is more consistent with the actual final travel path length of the milling cutter.

[0052] Based on the above embodiments, Figure 5 As shown, the milling compensation amount corresponding to the different index ranges is determined by the following method: S501, determining the characteristic value of the index range.

[0053] S502, predicting the radius wear of the milling cutter when the milling life index of the milling cutter is a characteristic value; S503, determining the radius of the milling cutter when the milling life index is a characteristic value according to the initial radius and radius wear of the milling cutter; S504, determining a milling compensation amount within an index range according to the radius and radius wear of the milling cutter when the milling life index is a characteristic value.

[0054] The characteristic value can be the minimum value or mean value of the index range, etc.

[0055] In some embodiments, the radius wear corresponding to different milling life indices during the process of the milling life index increasing from a minimum value to a maximum value when the same type of milling cutter (such as the same material, the same size, and the same specification) processes a substrate of a certain material can be recorded and stored in advance.

[0056] Therefore, before using a certain milling cutter to process a substrate, the radius wear of a milling cutter of the same type as the milling cutter when the milling life index is the above characteristic value can be found from the correspondence table storing the milling life index and the radius wear.

[0057] Subtract the radius wear amount from the initial radius of the milling cutter to determine the radius of the milling cutter when the milling life index is a characteristic value.

[0058] In some embodiments, a large amount of sample data may be used in advance to fit the expression between the radius of the milling cutter, the radius wear amount corresponding to the radius, and the milling compensation amount.

[0059] For example, the following expression is fitted using the historical radius of the milling cutter and the difference between the historical radius and the initial radius of the milling cutter, that is, the radius wear amount corresponding to the historical radius: ; The embodiment of the present application substitutes the radius and radius wear of the milling cutter when the milling life index is a characteristic value into the above expression to obtain the milling compensation amount when the milling life index is a characteristic value, which is used as the milling compensation amount in the index range corresponding to the characteristic value. This method is more accurate.

[0060] In other embodiments, the radius wear amount can be directly superimposed on the radius of the milling cutter to obtain the milling compensation amount, which is more convenient.

[0061] The embodiment of the present application calculates a characteristic value for each index range that can represent each numerical value within the index range, and calculates the milling compensation amount corresponding to the entire index range based on the characteristic value, thereby reducing the overall calculation amount and ensuring the effectiveness of the milling compensation amount corresponding to the index range for each index value within the index range.

[0062] Based on the above embodiment, the above step S502 of “predicting the radius wear of the milling cutter when the milling life index of the milling cutter is a characteristic value” includes: The characteristic value is input into a pre-trained wear prediction model to obtain the radius wear of the milling cutter. The wear prediction model is trained based on the historical data of the milling life index of the milling cutter and the actual radius wear corresponding to different milling life indices.

[0063] A wear prediction model can be built based on deep learning models, such as convolutional neural networks. For the same type of milling cutter, the wear prediction model can be trained using a large amount of historical data on the milling life index and the actual radius wear corresponding to different milling life indices.

[0064] In the application, the characteristic values ​​corresponding to different index ranges are input into the trained wear prediction model to obtain the radius wear of the milling cutter when the milling life index is the characteristic value.

[0065] The embodiment of the present application uses a trained wear prediction model to obtain the radius wear corresponding to different characteristic values, which is more efficient.

[0066] Figure 6 is a block diagram of a packaging substrate appearance processing device according to an exemplary embodiment of the present application, such as Figure 6 As shown, the apparatus 600 includes: an acquisition module 601 , a first determination module 602 , and a second determination module 603 .

[0067] An acquisition module 601 is used to acquire a milling life index of a milling cutter before processing a substrate to be processed; A first determination module 602 is used to determine a target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amounts corresponding to different index ranges; The second determination module 603 is used to determine a travel path of the milling cutter when milling the substrate to be processed according to the target compensation amount and the target size of the substrate to be processed, so as to control the milling cutter to mill the substrate to be processed according to the travel path.

[0068] In an embodiment of the present application, the first determination module is used to: select the milling compensation amount corresponding to the index range in which the milling life index is located from the milling compensation amounts corresponding to different index ranges, as the target compensation amount.

[0069] In an embodiment of the present application, the target compensation amount includes a first type of compensation amount and a second type of compensation amount. The first determination module is used to: screen the milling compensation amount corresponding to the index range in which the milling life index is located from the milling compensation amounts corresponding to different index ranges, as the first type of compensation amount; within the target path length, determine the milling compensation amount corresponding to the index range in which the latest milling life index of the milling cutter is located after the milling cutter travels a preset length each time, as the second type of compensation amount.

[0070] In the embodiment of the present application, the target path length is the length of the travel path of the milling cutter determined according to the first type of compensation amount and the target size of the substrate to be processed.

[0071] In an embodiment of the present application, the device is also used to determine the milling compensation amount corresponding to different index ranges in the following manner: determine the characteristic value of the index range; predict the radius wear of the milling cutter when the milling life index is the characteristic value; determine the radius of the milling cutter when the milling life index is the characteristic value based on the initial radius and radius wear of the milling cutter; determine the milling compensation amount within the index range based on the radius and radius wear of the milling cutter when the milling life index is the characteristic value.

[0072] In an embodiment of the present application, the device is also used to: input the characteristic value into a pre-trained wear prediction model to obtain the radius wear of the milling cutter. The wear prediction model is trained based on the historical data of the milling life index of the milling cutter and the actual radius wear corresponding to different milling life indices.

[0073] In the embodiment of the present application, the milling life index is the length of the historical travel path of a preset position point on the milling cutter after the milling cutter performs milling processing on the substrate.

[0074] In summary, the packaging substrate contour processing device proposed in the embodiment of the present application obtains the milling life index of the milling cutter before processing to predict the wear degree of the milling cutter, determines the target compensation amount required for the milling cutter to perform milling processing on the substrate to be processed based on the milling life index and the milling compensation amount corresponding to different index ranges, and determines the travel path of the milling cutter when processing the substrate based on the target size of the substrate to be processed in combination with the target compensation amount, so that the substrate size obtained after the milling cutter performs milling processing according to the travel path can have a small error with the target size. The present application flexibly adjusts the compensation amount of the milling cutter during processing according to the wear condition of the milling cutter, flexibly adjusts the travel path of the milling cutter, reduces the deviation between the actual processing contour of the substrate and the target contour, effectively solves the influence of milling cutter wear on substrate processing, and improves the effect of packaging substrate contour processing.

[0075] To implement the above-mentioned embodiments, the embodiments of the present application also propose an electronic device 700, including a memory 701, a processor 702, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the method for processing the outer shape of the packaging substrate in the above-mentioned embodiments are implemented.

[0076] To implement the above embodiments, the embodiments of the present application further provide a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the steps of the method for processing the outer shape of a packaging substrate as described in the above embodiments are implemented.

[0077] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0078] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0079] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for processing the outer shape of a packaging substrate, characterized in that: The method comprises: Obtaining a milling life index of the milling cutter before processing the substrate to be processed, wherein the milling life index is associated with the wear condition of the milling cutter; Determining a target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amounts corresponding to different index ranges; The travel path of the milling cutter when milling the substrate to be processed is determined according to the target compensation amount and the target size of the substrate to be processed, so as to control the milling cutter to mill the substrate to be processed according to the travel path.

2. The method according to claim 1, characterized in that Determining the target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amounts corresponding to different index ranges includes: From the milling compensation amounts corresponding to different index ranges, the milling compensation amount corresponding to the index range in which the milling life index is located is selected as the target compensation amount.

3. The method according to claim 1, characterized in that The target compensation amount includes a first type of compensation amount and a second type of compensation amount. The target compensation amount required for the milling cutter to perform milling processing on the substrate to be processed is determined according to the milling life index and the milling compensation amounts corresponding to different index ranges, including: From the milling compensation amounts corresponding to different index ranges, the milling compensation amount corresponding to the index range in which the milling life index is located is selected as the first type of compensation amount; Within the target path length, a milling compensation amount corresponding to an index range of the latest milling life index of the milling cutter after the milling cutter travels a preset length is determined as the second type of compensation amount.

4. The method according to claim 3, characterized in that The target path length is the length of the travel path of the milling cutter determined according to the first type of compensation amount and the target size of the substrate to be processed.

5. The method according to claim 1, characterized in that The milling compensation corresponding to the different index ranges is determined in the following way: determining a characteristic value of the index range; Predicting the radius wear of the milling cutter when the milling life index of the milling cutter is the characteristic value; Determining the radius of the milling cutter when the milling life index is the characteristic value according to the initial radius of the milling cutter and the radius wear amount; The milling compensation amount within the index range is determined according to the radius of the milling cutter and the radius wear amount when the milling life index is the characteristic value.

6. The method according to claim 5, characterized in that The predicting of the radius wear of the milling cutter when the milling life index of the milling cutter is the characteristic value includes: The characteristic value is input into a pre-trained wear prediction model to obtain the radius wear of the milling cutter. The wear prediction model is trained based on historical data of the milling life index of the milling cutter and actual radius wear corresponding to different milling life indices.

7. The method according to any one of claims 1 to 6, characterized in that: The milling life index is the length of a historical travel path of a preset position point on the milling cutter after the milling cutter performs milling processing on the substrate.

8. A packaging substrate outer shape processing device, characterized in that: The device comprises: An acquisition module, used for acquiring a milling life index of a milling cutter before processing a substrate to be processed; A first determination module is used to determine a target compensation amount required when the milling cutter performs milling processing on the substrate to be processed according to the milling life index and the milling compensation amounts corresponding to different index ranges; The second determination module is used to determine a travel path of the milling cutter when milling the substrate to be processed according to the target compensation amount and the target size of the substrate to be processed, so as to control the milling cutter to mill the substrate to be processed according to the travel path.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the steps of the method for processing the outer shape of a packaging substrate as described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method for processing the outer shape of a packaging substrate as described in any one of claims 1 to 7 are implemented.

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