A positioning structure and positioning method

Abstract

The present invention discloses a positioning structure and a positioning method, wherein the positioning structure comprises an MLO circuit board and a probe board, wherein a plurality of gold-plated points are arranged on the MLO circuit board, a plurality of probes adapted to the gold-plated points are arranged on the probe board, a plurality of positioning circles are also arranged on the MLO circuit board, a plurality of through holes adapted to the positioning circles are also arranged on the probe board, and the MLO circuit board and the probe board are detachably assembled together, and the center coincidence degree of the positioning circle and the through hole is changed by adjusting the position of the probe board, so that each probe corresponds to and contacts with different positions of a corresponding gold-plated point. The present invention can adjust the alignment contact position of the probe and the gold-plated point according to the wear condition of each position on the gold-plated point, realize the reuse of the gold-plated point, avoid the problem that the same position of the gold-plated point needs to be replaced with the MLO circuit board or re-gilded due to wear caused by long-term alignment contact with the probe, can significantly reduce the manufacturing cost and use cost, and has more practical value and promotion value.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit testing, and in particular relates to a positioning structure and a positioning method. Background Art

[0002] Integrated circuits, such as chip wafers, usually need to use probe cards for various tests to detect the working performance of the integrated circuits. With the improvement of test requirements and demands, probe cards are also being rapidly updated, and the type of probe cards is gradually upgraded from cantilever probe cards to vertical probe cards.

[0003] At present, when using a probe card for testing, positioning holes are set on the opposite sides of the MLO circuit board in advance, and positioning pins or positioning columns that can be inserted into the positioning holes are set on the probe board to fix the probe board on the MLO circuit board. The probes will constantly correspond to and contact the gold-plated points. Over time, this will inevitably lead to more and more severe wear of the gold-plated points. The commonly used method is to replace the MLO circuit board or re-gild it, which increases costs. Summary of the invention

[0004] In order to solve the technical problems existing in the prior art, the purpose of the present invention is to provide a positioning structure and a positioning method.

[0005] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the present invention is:

[0006] A positioning structure includes a matching MLO circuit board and a probe board, wherein the MLO circuit board is fixed on a PCB circuit board, the MLO circuit board is connected to the PCB circuit board through a circuit designed thereon and then connected to an external tester, a plurality of gold-plated points are arranged on the MLO circuit board, a plurality of probes matching the gold-plated points are arranged on the probe board, a plurality of positioning rings are also arranged on the MLO circuit board, a plurality of through holes matching the positioning rings are also arranged on the probe board, the MLO circuit board and the probe board are detachably assembled together, and the center coincidence degree of the positioning ring and the through hole is changed by adjusting the position of the probe board, so that each probe on the probe board corresponds to and contacts with different positions of a corresponding gold-plated point.

[0007] Furthermore, a positioning circle is respectively provided at the three corners of the MLO circuit board, and there are three positioning circles in total.

[0008] Furthermore, the positioning ring is a circular structure.

[0009] Furthermore, a positioning circle is respectively provided at the upper left corner, the upper right corner, and the lower left corner of the MLO circuit board.

[0010] Furthermore, a through hole is respectively provided at the three corners of the probe plate, and there are three through holes in total, and one through hole is matched with one positioning ring.

[0011] Furthermore, the through hole is a circular structure.

[0012] Furthermore, a through hole is respectively provided at the upper left corner, the upper right corner, and the lower left corner of the probe card.

[0013] The present invention also discloses a positioning method, comprising the following steps:

[0014] 1) Setting a number of gold-plated points on the MLO circuit board and setting a number of positioning circles on the MLO circuit board;

[0015] Fix the MLO circuit board on the PCB circuit board by ball planting welding;

[0016] 2) a plurality of through holes matching the positioning rings are provided on the probe plate;

[0017] 3) The MLO circuit board and the probe board are detachably assembled together. By adjusting the position of the probe board, the center of the positioning ring and the through hole can be completely overlapped. At this time, each probe on the probe board will correspond to and contact the center position of a corresponding gold-plated point on the MLO circuit board. When the center position of the gold-plated point is worn due to long-term alignment and contact with the probe, the center overlap degree of the positioning ring and the through hole can be changed by adjusting the position of the probe board. When the center of the positioning ring and the through hole no longer overlap, the probe on the probe board can be changed from aligning with the center position of the gold-plated point to aligning with other positions of the same gold-plated point, thereby adjusting the alignment contact position of the probe on the gold-plated point according to the wear of each position on the gold-plated point, and realizing the reuse of the gold-plated point without replacing or re-gilding the gold-plated point due to wear;

[0018] There is no order of precedence for step 1) and step 2).

[0019] Furthermore, a positioning ring is respectively provided at the upper left corner, the upper right corner, and the lower left corner of the MLO circuit board, and a through hole is respectively provided at the three corners of the probe board.

[0020] Furthermore, a positioning circle is first made at the upper left corner of the MLO circuit board, and then according to the position of the positioning circle, an identical positioning circle is made at the upper right corner and the lower left corner of the MLO circuit board respectively. The position of the first gold-plated point is determined by the position of the positioning circle. After the position of the first gold-plated point is found, the positions of all the gold-plated points can be drawn in sequence; the through-hole position is obtained by overlaying the positioning circle position on the MLO circuit board.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention discloses a positioning structure and a positioning method. By arranging a plurality of positioning rings on an MLO circuit board and arranging a plurality of through holes matched with the positioning rings on a probe board, the center coincidence degree of the positioning rings and the through holes can be adjusted according to the wear conditions of each position on the gold-plated point, so that each probe on the probe board corresponds to and contacts with different positions of a corresponding gold-plated point, thereby realizing the reuse of the gold-plated points, avoiding the problem that the same position of the gold-plated point needs to be replaced with the MLO circuit board or re-gilded due to wear caused by long-term alignment contact with the probe, and at the same time avoiding the problem that the probe board is stuck and cannot be adjusted due to the use of positioning pins, positioning columns and other fixing methods in the prior art. The overall structural design is ingenious, can significantly reduce the manufacturing cost and the use cost, and has more practical value and promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the MLO circuit board of the present invention;

[0024] Figure 2 A physical picture of the MLO circuit board of the present invention;

[0025] Figure 3 An optical microscope image of the positioning ring of the present invention;

[0026] Figure 4 It is a schematic diagram of assembling the MLO circuit board and the probe card of the present invention;

[0027] Figure 5 This is a physical diagram of the assembly of the MLO circuit board and the probe card of the present invention;

[0028] Figure 6 An optical microscope image when the center of the positioning ring of the present invention coincides with the center of the through hole;

[0029] Figure 7 This is an optical microscope image when the center of the positioning ring of the present invention does not coincide with the center of the through hole. DETAILED DESCRIPTION

[0030] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0031] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0032] like Figure 1-7 As shown, the present invention discloses a positioning structure, including a matching MLO circuit board 1 and a probe board 2, wherein the MLO circuit board 1 is fixed on a PCB circuit board 3 by ball implantation welding, the MLO circuit board 1 is connected to the PCB circuit board 3 through the circuit designed thereon and then connected to an external tester, a plurality of gold-plated points 4 are arranged on the MLO circuit board 1 according to a certain rule, a plurality of positioning rings 5 ​​are also arranged on the MLO circuit board 1, a plurality of probes matching the gold-plated points 4 are arranged on the probe board 2, a plurality of through holes 6 matching the positioning rings 5 ​​are also arranged on the probe board 2, and in order to avoid assembly errors, anti-reverse installation screws and the like are arranged on the probe board 2.

[0033] When in use, the MLO circuit board 1 and the probe board 2 are detachably assembled together, and the center of the positioning circle 5 and the through hole 6 can be completely overlapped by adjusting the position of the probe board 2. At this time, each probe on the probe board 2 will correspond to and contact the center position of a gold-plated point 4 that is adapted on the MLO circuit board 1. When the center position of the gold-plated point 4 is worn due to long-term alignment and contact with the probe, the present invention can change the center overlap of the positioning circle 5 and the through hole 6 by designing a positioning structure, so that the center of the positioning circle 5 and the through hole 6 no longer overlaps with the center of the through hole 6, and eccentricity is generated, thereby realizing that the probe on the probe board 2 is changed from the center position of the gold-plated point 4 to other positions of the same gold-plated point 4. When a certain position of the gold-plated point 4 is worn due to long-term alignment and contact with the probe, the present invention can change the center overlap of the positioning circle 5 and the through hole 6 by adjusting the position of the probe board 2. In this way, the probe can correspond to and contact different positions of the gold-plated point, and the gold-plated point 4 can be reused, without replacing the MLO circuit board or re-gilding due to wear of the gold-plated point 4.

[0034] In some embodiments, the number of the positioning rings 5 ​​and the number of the through holes 6 are the same.

[0035] In some more preferred embodiments, there are three positioning rings 5 ​​, which are respectively arranged at the three corners of the MLO circuit board 1 , and there are three through holes 6 , which are respectively arranged at the three corners of the probe board 2 , and one through hole 6 is matched with one positioning ring 5 .

[0036] In some more preferred embodiments, the positioning ring 5 is a circular structure, and the through hole 6 is a circular structure.

[0037] In some embodiments, the present invention first draws a positioning circle 5 at the upper left corner of the MLO circuit board 1. The smaller the size, the more accurate the position, and it must be drawn in the corner. Then, according to the position of this positioning circle 5, a same positioning circle 5 is translated to the upper right corner and the lower left corner. The position of the first gold-plated point is determined by the position of the positioning circle. After finding the position of the first gold-plated point, all the gold-plated point positions can be drawn in sequence (the position of each gold-plated point is consistent with the position of each pad of the chip, and all the gold-plated point positions can be drawn according to the position of the chip pad and the distance between each other).

[0038] In some embodiments, the position of the through hole 6 is drawn by superimposing the position of the positioning circle on the MLO circuit board 1 .

[0039] The present invention also discloses a positioning method, comprising the following steps:

[0040] 1) A plurality of gold-plated points 4 are arranged on the MLO circuit board 1 according to a certain pattern, and a plurality of positioning circles 5 are arranged on the MLO circuit board 1; the MLO circuit board 1 is fixed on the PCB circuit board 3 by ball planting welding;

[0041] 2) a plurality of through holes 6 adapted to the positioning ring 5 are provided on the probe plate 2;

[0042] 3) The MLO circuit board 1 and the probe board 2 are detachably assembled together. By adjusting the position of the probe board 2, the center of the positioning circle 5 and the through hole 6 can be completely overlapped. At this time, each probe on the probe board 2 will correspond to and contact the center position of a corresponding gold-plated point 4 on the MLO circuit board 1. When the center position of the gold-plated point 4 is worn due to long-term alignment and contact with the probe, the center overlap degree of the positioning circle 5 and the through hole 6 is changed by adjusting the position of the probe board 2, so that the center of the positioning circle 5 and the through hole 6 no longer overlaps and becomes eccentric, thereby realizing that the probe on the probe board 2 is changed from the center position of the gold-plated point 4 to other positions of the same gold-plated point 4. When a certain position of the gold-plated point 4 is worn due to long-term alignment and contact with the probe, the center overlap degree of the positioning circle 5 and the through hole 6 is still changed by adjusting the position of the probe board 2. In this way, the probe can correspond to and contact different positions of the gold-plated point, and the gold-plated point 4 can be reused. There is no need to replace the MLO circuit board or re-gild due to wear of the gold-plated point 4, which can significantly reduce manufacturing cost and use cost.

[0043] There is no order of precedence for step 1) and step 2).

[0044] Example 1

[0045] like Figure 1-7As shown, a positioning structure includes an MLO circuit board 1 and a probe board 2 that are compatible with each other, wherein the MLO circuit board 1 is fixed on a PCB circuit board 3 by ball implantation welding, the MLO circuit board 1 is connected to the PCB circuit board 3 through a circuit designed thereon and then connected to an external tester, a plurality of gold-plated points 4 are arranged on the MLO circuit board 1 according to a certain rule, and three circular positioning rings 5 ​​are also arranged on the MLO circuit board 1, and the three positioning rings 5 ​​are respectively arranged at the positions of the three corners of the MLO circuit board 1, as shown in FIG. Figure 2-3 As shown in the red circle, the probe plate 2 is provided with a plurality of probes adapted to the gold-plated points 4. The probe plate 2 is also provided with three circular through holes 6 adapted to the positioning rings 5. The three through holes 6 are respectively arranged at the three corners of the probe plate 2. One through hole 6 is adapted to one positioning ring 5. Figure 5 Shown in red circle.

[0046] A positioning method comprises the following steps:

[0047] 1) A number of gold-plated points 4 are arranged on the MLO circuit board 1 according to a certain pattern, and three positioning circles 5 are arranged at the three corners of the MLO circuit board 1; the MLO circuit board 1 is fixed on the PCB circuit board 3 by ball planting welding;

[0048] 2) three through holes 6 adapted to the positioning ring 5 are provided at the three corners of the probe plate 2;

[0049] 3) The MLO circuit board 1 and the probe board 2 are detachably assembled together by screws. Under the action of an optical microscope, the position of the probe board 2 can be adjusted so that the center of the positioning ring 5 and the through hole 6 completely coincide with each other. Figure 6 As shown, at this time, each probe on the probe plate 2 will correspond to and contact the center position of a gold-plated point 4 adapted to the MLO circuit board 1. When the center position of the gold-plated point 4 is worn due to long-term alignment contact with the probe, some screws are removed, and the center overlap degree of the positioning ring 5 and the through hole 6 is changed by adjusting the position of the probe plate 2, so that the center of the positioning ring 5 and the through hole 6 no longer overlaps, and eccentricity occurs, as shown in FIG. Figure 7 As shown, the probe on the probe board 2 can be changed from the center position of the gold-plated point 4 to other positions of the same gold-plated point 4. When a certain position of the gold-plated point 4 is worn out due to long-term alignment and contact with the probe, the center coincidence of the positioning circle 5 and the through hole 6 can be changed by adjusting the position of the probe board 2. In this way, the probe can correspond to and contact different positions of the gold-plated point, and the gold-plated point 4 can be reused. There is no need to replace the MLO circuit board or re-gild due to wear of the gold-plated point 4, which significantly reduces the manufacturing cost and use cost.

[0050] There is no order of precedence for step 1) and step 2).

[0051] In step 1), first draw a positioning circle 5 at the upper left corner of the MLO circuit board 1. The smaller the size, the more accurate the position, and it must be drawn in the corner. Then, according to the position of this positioning circle 5, translate a same positioning circle 5 to the upper right corner and the lower left corner. Determine the position of the first gold-plated point by the position of the positioning circle. After finding the position of the first gold-plated point, you can draw all the gold-plated point positions in sequence (the position of each gold-plated point is consistent with the position of each pad of the chip. According to the position of the chip pad and the distance between each other, you can draw all the gold-plated point positions).

[0052] In step 2), the through hole position is drawn by overlaying the positioning circle position on the MLO circuit board 1.

[0053] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0054] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A positioning structure, comprising an MLO circuit board and a probe board adapted to each other, wherein the MLO circuit board is fixed on a PCB circuit board, the MLO circuit board is connected to the PCB circuit board through a circuit designed thereon and then connected to an external tester, the MLO circuit board is provided with a plurality of gold-plated points, and the probe board is provided with a plurality of probes adapted to the gold-plated points, characterized in that: A plurality of positioning rings are also provided on the MLO circuit board, and a plurality of through holes matched with the positioning rings are also provided on the probe board. The MLO circuit board and the probe board are detachably assembled together, and the center coincidence degree of the positioning ring and the through hole is changed by adjusting the position of the probe board, so that each probe on the probe board corresponds to and contacts with different positions of a corresponding gold-plated point.

2. A positioning structure according to claim 1, characterized in that: A positioning ring is respectively arranged at the three corners of the MLO circuit board, and there are three positioning rings in total.

3. A positioning structure according to claim 2, characterized in that: The positioning ring is a circular structure.

4. A positioning structure according to claim 2, characterized in that: A positioning circle is respectively arranged at the upper left corner, the upper right corner and the lower left corner of the MLO circuit board.

5. A positioning structure according to claim 1, characterized in that: A through hole is respectively arranged at the three corners of the probe plate, and there are three through holes in total, and one through hole is matched with one positioning ring.

6. A positioning structure according to claim 5, characterized in that: The through hole is a circular structure.

7. A positioning structure according to claim 5, characterized in that: A through hole is respectively arranged at the upper left corner, the upper right corner and the lower left corner of the probe board.

8. A positioning method, characterized in that: The following steps are involved: 1) Setting a number of gold-plated points on the MLO circuit board and setting a number of positioning circles on the MLO circuit board; Fix the MLO circuit board on the PCB circuit board by ball planting welding; 2) a plurality of through holes matching the positioning rings are provided on the probe plate; 3) The MLO circuit board and the probe board are detachably assembled together. By adjusting the position of the probe board, the center of the positioning ring and the through hole can be completely overlapped. At this time, each probe on the probe board will correspond to and contact the center position of a corresponding gold-plated point on the MLO circuit board. When the center position of the gold-plated point is worn due to long-term alignment and contact with the probe, the center overlap degree of the positioning ring and the through hole can be changed by adjusting the position of the probe board. When the center of the positioning ring and the through hole no longer overlap, the probe on the probe board can be changed from aligning with the center position of the gold-plated point to aligning with other positions of the same gold-plated point, thereby adjusting the alignment contact position of the probe on the gold-plated point according to the wear of each position on the gold-plated point, and realizing the reuse of the gold-plated point without replacing or re-gilding the gold-plated point due to wear; There is no order of precedence for step 1) and step 2).

9. A positioning method according to claim 8, characterized in that: A positioning circle is respectively arranged at the upper left corner, the upper right corner and the lower left corner of the MLO circuit board, and a through hole is respectively arranged at the three corners of the probe board.

10. A positioning method according to claim 9, characterized in that: First, make a positioning circle at the upper left corner of the MLO circuit board, and then make the same positioning circle at the upper right corner and lower left corner of the MLO circuit board according to the position of the positioning circle. Determine the position of the first gold-plated point by the position of the positioning circle. After finding the position of the first gold-plated point, you can draw the positions of all the gold-plated points in sequence; the through-hole position is obtained by overlaying the positioning circle position on the MLO circuit board.

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