Color filter substrate, display device, and method for manufacturing color filter substrate

Abstract

The present invention realizes the miniaturization of a light-shielding part. A color filter substrate (20) is provided with a first color filter (29G), a second color filter (29B), and a light-shielding part (40) disposed at the boundary between the first color filter (29G) and the second color filter (29B). The light-shielding part (40) has: a first transmissive film (41); a first reflective film (42) disposed on the upper layer side of the first transmissive film (41); a second transmissive film (43) disposed on the upper layer side of the first reflective film (42); and a second reflective film (44) disposed on the upper layer side of the second transmissive film (43) and having a film thickness larger than that of the first reflective film (42). The first transmissive film (41) has: a first bottom surface (41A) located on the opposite side from the first reflective film (42) side; and a first side surface (41B) that forms a first angle ([theta] 1), which is an acute angle, with the first bottom surface (41A). The second reflective film (44) has: a second bottom surface (44A) that is in contact with the upper surface (43C) of the second transmissive film (43C) and is parallel to the first bottom surface (41A); and a second side surface (44B) that forms a second angle ([theta] 2), which is an acute angle, with the second bottom surface (44A).

Description

Technical Field

[0001] The technology disclosed in this specification relates to a color filter substrate, a display device, and a method for manufacturing a color filter substrate. Background Art

[0002] Conventionally, as an example of a color filter substrate provided in an image display panel such as a liquid crystal panel, there is known a color filter substrate described in the following Patent Document 1. In Patent Document 1, an oxime ester compound of a specific structure is used as a photopolymerization initiator in a photosensitive composition containing a light-shielding agent constituting a black matrix provided in the color filter substrate, and resin-coated carbon black is used as a light-shielding agent. Prior art literature Patent Literature

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-120768 Summary of the invention Technical Problems to be Solved by the Invention

[0004] In the above-mentioned Patent Document 1, a resin material is used as the material of the black matrix. Therefore, when the pixel density of the image display panel is highly refined, such as 1000 ppi or more (especially 1200 ppi or more), there is a problem that the exposure accuracy when exposing the black matrix using an exposure device cannot be fully obtained, and it is difficult to miniaturize the black matrix.

[0005] The technology described in this specification is a technology that has been accomplished based on the above-mentioned circumstances, and its purpose is to achieve miniaturization of the light shielding portion. Technical solutions for solving technical problems

[0006] (1) A color filter substrate related to the technology described in this specification includes: a first color filter; a second color filter that presents a color different from that of the first color filter; and a light shielding portion that is arranged at a boundary between the first color filter and the second color filter on the lower layer side of the first color filter and the second color filter, the light shielding portion having: a first transmissive film; a first reflective film that is arranged on the upper layer side of the first transmissive film; a second transmissive film that is arranged on the upper layer side of the first reflective film; and a second reflective film that is arranged on the upper layer side of the second transmissive film and has a film thickness greater than that of the first reflective film, the first transmissive film having: a first bottom surface that is located on the side opposite to the first reflective film side; and a first side surface that forms an acute angle, i.e., a first angle, with the first bottom surface, the second reflective film having: a second bottom surface that is in contact with an upper surface of the second transmissive film and is parallel to the first bottom surface; and a second side surface that forms an acute angle, i.e., a second angle, with the second bottom surface.

[0007] (2) In addition, the color filter substrate may be configured in the manner described in (1) above, wherein the first reflective film comprises: a third bottom surface that is in contact with the top surface of the first transparent film and is parallel to the first bottom surface; and a third side surface that forms a third angle with the third bottom surface; and the second transparent film comprises: a fourth bottom surface that is in contact with the top surface of the first reflective film and is parallel to the first bottom surface; and a fourth side surface that forms a fourth angle with the fourth bottom surface; and the first reflective film is configured in such a manner that the third side surface is in contact with the top surface of the first transparent film but is not in contact with the first side surface.

[0008] (3) Furthermore, in the color filter substrate according to the above (2), the light shielding portion may be configured such that the third angle and the fourth angle are larger than the first angle.

[0009] (4) In addition, the color filter substrate may be configured in accordance with (2) or (3) above, wherein the second reflective film has a fifth side surface, the fifth side surface forms an obtuse angle, i.e., a fifth angle, with the second bottom surface, and is in contact with the second bottom surface.

[0010] (5) In addition, the color filter substrate described above may be configured, based on any one of the above (1) to (4), such that the light shielding portion is configured such that an angle formed by a line segment connecting an outer end of the first transparent film and an outer end of the second reflective film and the first bottom surface is within a range of greater than 70° and less than 90°.

[0011] (6) A display device related to the technology described in this specification includes: a color filter substrate as described in any one of (1) to (5) above; and an array substrate arranged opposite to the color filter substrate.

[0012] (7) A method for manufacturing a color filter substrate related to the technology described in this specification, the method comprising: forming a first transmissive film on a substrate; forming a first reflective film on the upper side of the first transmissive film; forming a second transmissive film on the upper side of the first reflective film; forming a second reflective film on the upper side of the second transmissive film, the second reflective film having a thickness greater than that of the first reflective film; forming a photosensitive resist film on the upper side of the second reflective film; exposing and developing the resist film; and etching at least the A first etching of the second reflective film; a second etching of the second reflective film, the second transparent film, the first reflective film and the first transparent film at a slower etching speed than the first etching by using the resist film as a mask to form a shading portion composed of the first transparent film, the first reflective film, the second transparent film and the second reflective film; a first color filter having an end portion arranged on the upper side of the shading portion; and a second color filter having a color different from that of the first color filter and having an end portion located on the upper side of the shading portion and adjacent to the first color filter.

[0013] (8) In addition, the method for manufacturing the color filter substrate may be configured in the above-mentioned manner (7), wherein at least SF6 gas is used in the first etching, and at least CF4 gas and O2 gas are used in the second etching.

[0014] (9) In addition, the manufacturing method of the above-mentioned color filter substrate can also be constructed based on the above-mentioned (7) or (8), that is, an etching device is used in the first etching and the second etching, and the etching device has: a vacuum chamber, which accommodates the substrate; and a substrate supporting portion, which is arranged in the vacuum chamber and has a plurality of protrusions, and the plurality of protrusions are arranged at intervals in the main surface of the substrate to support the substrate. Beneficial Effects

[0015] According to the technology described in this specification, it is possible to achieve miniaturization of the light shielding portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic perspective view showing a state in which a user wears the head mounted display according to the first embodiment on his head. Figure 2 This is a schematic side view showing an optical relationship between a liquid crystal display device and a lens unit included in the head mounted device constituting the head mounted display according to the first embodiment, and an eyeball of a user. Figure 3 It is a schematic plan view of a liquid crystal panel and a flexible substrate included in the liquid crystal display device of the first embodiment. Figure 4This is a schematic cross-sectional view of the liquid crystal panel according to the first embodiment. Figure 5 This is a circuit diagram showing a pixel arrangement in a display region of an array substrate included in the liquid crystal panel of the first embodiment. Figure 6 It is a cross-sectional view showing a pixel arrangement in a display region of a liquid crystal panel according to the first embodiment. Figure 7 It is a cross-sectional view of a color filter substrate included in the liquid crystal panel of the first embodiment. Figure 8 This is an enlarged cross-sectional view of a second light shielding portion included in the color filter substrate of the first embodiment. Fig. 9 This is a diagram showing a schematic configuration of an etching device used in the first step of the color filter substrate manufacturing process according to the first embodiment. Fig.10 It is a cross-sectional view showing a state where a glass substrate is supported by the protrusions of the substrate supporting portion included in the etching apparatus according to the first embodiment. Fig.11 This is a cross-sectional view showing a state where a resist film is exposed and developed in the first step of the color filter substrate manufacturing process according to the first embodiment. Fig.12 This is a cross-sectional view showing a state where the first etching is performed in the first step of the color filter substrate manufacturing process according to the first embodiment. Fig.13 This is a cross-sectional view showing a state where the second etching is performed in the first step of the color filter substrate manufacturing process according to the first embodiment. Fig.14 This is a table showing the experimental results of Comparative Example 1 of Comparative Experiment 1 of the first embodiment. Fig.15 This is a table showing the experimental results of Comparative Example 2 of Comparative Experiment 1 of the first embodiment. Fig.16 This is a table showing the experimental results of Comparative Example 3 of Comparative Experiment 1 of the first embodiment. Fig.17 This is a table showing the experimental results of Comparative Example 4 of Comparative Experiment 1 of the first embodiment. Fig.18 This is a table showing the experimental results of Example 1 of Comparative Experiment 1 of the first embodiment. Fig.19 This is a table showing the experimental results of Example 2 of Comparative Experiment 1 of the first embodiment. Fig. 20 This is a table showing the experimental results of Example 3 of Comparative Experiment 1 of the first embodiment. Fig.21This is a table showing the experimental results of Example 4 of Comparative Experiment 1 of the first embodiment. Fig. 22 This is a table showing the experimental results of Example 5 of Comparative Experiment 1 of the first embodiment. Fig.23 This is a table showing the experimental results of Example 6 of Comparative Experiment 1 of the first embodiment. Fig.24 This is a table showing the experimental results of Example 7 of Comparative Experiment 1 of the first embodiment. DETAILED DESCRIPTION

[0017] <First Embodiment> pass Figures 1 to 24 The first embodiment is described. In this embodiment, a goggle-type head-mounted display (HMD: Head-Mounted Display) 10HMD and a liquid crystal display device 10 used therefor are exemplified. In addition, the X-axis, Y-axis, and Z-axis are shown in a part of each drawing, and the directions of each axis are described in a manner that is shown in each drawing.

[0018] use Figure 1 The appearance of the goggle-type head mounted display 10HMD is described below. Figure 1 As shown in FIG. 1 , the head mounted display 10HMD includes a head mounted device 10HMDa mounted on a head 10HD of a user. The head mounted device 10HMDa surrounds both eyes of the user.

[0019] use Figure 2 The structure of the head mounted device 10HMDa will be described. Figure 2As shown, the head mounted device 10HMDa includes at least a liquid crystal display device 10 for displaying an image and a lens unit 10RE for forming an image displayed on the liquid crystal display device 10 on the eyeball 10EY of the user. The liquid crystal display device 10 includes at least a liquid crystal panel (display device) 11 and a backlight device (illumination device) 12 for irradiating light to the liquid crystal panel 11. The main surface of the liquid crystal panel 11 on the lens unit 10RE side is a display surface 11DS for displaying an image. The lens unit 10RE is arranged so as to be interposed between the liquid crystal display device 10 and the eyeball 10EY of the user. The lens unit 10RE provides a light refraction effect. By adjusting the focal length of the lens unit 10RE, the user can recognize that the image formed on the retina 10EYb via the lens 10EYa of the eyeball 10EY is displayed on the virtual display 10VD that appears to exist at a distance L2 from the eyeball 10EY. The distance L2 is much larger than the actual distance L1 from the eyeball 10EY to the liquid crystal display device 10. Thus, the user can visually recognize a virtual image, i.e., an enlarged image, displayed by the virtual display 10VD having a screen size (e.g., tens of inches to hundreds of inches) much larger than the screen size of the liquid crystal display device 10 (e.g., about 0.1 inches to several inches).

[0020] In addition, one liquid crystal display device 10 is mounted on the head mounted device 10HMDa, and the right eye image and the left eye image can be displayed on the liquid crystal display device 10. Alternatively, two liquid crystal display devices 10 may be mounted on the head mounted device 10HMDa, and the right eye image may be displayed on one liquid crystal display device 10, and the left eye image may be displayed on the other liquid crystal display device 10. Furthermore, the head mounted device 10HMDa may include headphones or the like that emit sound toward the ears of the user.

[0021] use Figure 3 The structure of the liquid crystal panel 11 of the liquid crystal display device 10 is described in detail. In addition, the structure of the backlight device 12 is known, for example, it has an optical component that converts light from a light source such as an LED into planar light by applying an optical effect to the light from the light source. Figure 3 As shown in FIG. 1 , the liquid crystal panel 11 is in a square shape when viewed from above. The central portion of the screen of the liquid crystal panel 11 is a display area AA for displaying images. The peripheral portion of the liquid crystal panel 11 that surrounds the display area AA in the screen is a non-display area NAA where no images are displayed. Figure 3 In FIG. 1 , the range surrounded by the single-dot chain line is the display area AA. In addition, since the liquid crystal panel 11 according to this embodiment is used in the head mounted display 10HMD, it has extremely high resolution, and its pixel density is, for example, 1000 ppi or more, particularly 1200 ppi or more.

[0022] like Figure 3As shown, the liquid crystal panel 11 is formed by bonding a pair of substrates 20 and 21. The substrate arranged on the front side of the pair of substrates 20 and 21 is a color filter substrate (counter substrate, CF substrate) 20, and the substrate arranged on the back side is an array substrate (active matrix substrate) 21. Both the color filter substrate 20 and the array substrate 21 are formed by stacking various films on the inner surface side of a glass substrate 20GS, 21GS that is roughly transparent and has excellent light transmittance. The substrates 20GS and 21GS include, for example, alkali-free glass as a main material. Among them, the array substrate 21 is larger than the color filter substrate 20, and a part of it protrudes laterally relative to the color filter substrate 20. A flexible substrate 13 is mounted on the protruding portion 21A of the array substrate 21. The flexible substrate 13 is configured to form a plurality of wiring patterns on a base material having insulation and flexibility. One end side of the flexible substrate 13 is connected to the array substrate 21, and the other end side is connected to an external control substrate (signal supply source). Various signals supplied from the control substrate are transmitted to the liquid crystal panel 11 via the flexible substrate 13 .

[0023] like Figure 3 As shown, a circuit unit (peripheral circuit unit) 14 is provided in the non-display area NAA of the liquid crystal panel 11. The circuit unit 14 includes a first circuit unit 14A and a second circuit unit 14B. The first circuit unit 14A is configured in a pair in the X-axis direction in the form of sandwiching the display area AA from both sides. The first circuit unit 14A is arranged in a strip-shaped range extending in the Y-axis direction. The first circuit unit 14A is used to supply a scan signal to the gate wiring 25 described later, and is arranged on the array substrate 21 in a monolithic manner. The first circuit unit 14A is a GDM (Gate Driver Monolithic) circuit. The first circuit unit 14A includes a shift register circuit that outputs a scan signal at a predetermined timing, a buffer circuit for amplifying the scan signal, etc. The second circuit unit 14B is arranged in a position sandwiched between the display area AA and the flexible substrate 13 in the Y-axis direction. The second circuit unit 14B is arranged in a strip-shaped range extending in the X-axis direction. The second circuit unit 14B is used to supply an image signal (data signal) to the source wiring 26 described later, and is arranged monolithically with the array substrate 21. The second circuit section 14B includes an SSD (Source Shared Driving) circuit, etc. The second circuit section 14B has a switch function for distributing an image signal supplied from the flexible substrate 13 to each source wiring 26 .

[0024] Next, use Figure 4 The cross-sectional structure of the liquid crystal panel 11 is briefly described. Figure 4Indicates that a pair of substrates 20 and 21 are arranged relative to each other with a gap in the normal direction of the main surfaces of the substrates 20 and 21, that is, in the Z-axis direction. At least a liquid crystal layer 22 and a sealing portion 23 that seals the liquid crystal layer 22 are sandwiched between the pair of substrates 20 and 21. The liquid crystal layer 22 contains liquid crystal molecules, which are substances whose optical properties change with the application of an electric field. The sealing portion 23 is a square frame (endless ring) when viewed from above as a whole, and surrounds the liquid crystal layer 22 all around in the non-display area NAA. The thickness gap (cell gap) of the liquid crystal layer 22 is maintained by the sealing portion 23. Polarizers 24 are respectively attached to the outer surface sides of a pair of substrates 20 and 21.

[0025] use Figure 5 The following is a summary of the pixel arrangement in the display area AA of the array substrate 21. Figure 5 As shown, a plurality of gate wirings (scanning wirings) 25 and source wirings (image wirings) 26 are arranged in a grid shape on the inner surface side of the display area AA of the array substrate 21. The gate wiring 25 extends in the X-axis direction in the form of crossing the display area AA. A plurality of gate wirings 25 are arranged at intervals in the Y-axis direction. The scanning signal output from the first circuit unit 14A is supplied to the plurality of gate wirings 25. The source wiring 26 extends in the Y-axis direction in the form of vertically crossing the display area AA and intersects with the gate wiring 25. A plurality of source wirings 26 are arranged at intervals in the X-axis direction. The image signal output from the second circuit unit 14B is distributed on the source wiring 26. TFTs (switching elements) 27 and pixel electrodes 28 are provided near the intersection of the gate wiring 25 and the source wiring 26. A plurality of TFTs 27 and pixel electrodes 28 are regularly arranged in the X-axis direction and the Y-axis direction, respectively. TFTs 27 are connected to the gate wiring 25, the source wiring 26 and the pixel electrode 28. TFT27 has a gate 27A connected to the gate wiring 25, a source 27B connected to the source wiring 26, a drain 27C connected to the pixel electrode 28, and a semiconductor portion 27D connected to the source 27B and the drain 27C. The semiconductor portion 27D is made of a semiconductor material and is arranged to overlap with the gate 27A. When driven by a scanning signal supplied from the gate wiring 25 to the gate electrode 27A, the pixel electrode 28 is charged to a potential based on an image signal supplied from the source wiring 26 to the source electrode 27B. The pixel electrode 28 is in a strip shape with the Y-axis direction as the long side direction.

[0026] use Figure 6 The configuration of each inner surface in the display area AA of the color filter substrate 20 and the array substrate 21 will be described. Figure 6As shown, a common electrode 30, a pixel circuit unit 31, an alignment film, etc. are provided on the inner surface side of the display area AA of the array substrate 21. In addition, the alignment film is omitted from the illustration. The pixel circuit unit 31 is composed of the above-mentioned gate wiring 25, source wiring 26, TFT27, etc., and has the function of supplying a predetermined potential to a plurality of pixel electrodes 28 at a predetermined timing. The common electrode 30 is located at a position closer to the upper layer side than the pixel electrode 28, and is arranged over a substantially entire area of ​​the display area AA. Thus, the common electrode 30 overlaps with all the pixel electrodes 28 arranged in the display area AA. In this way, in the array substrate 21 of the present embodiment, the electrode located on the upper layer side of the pixel electrode 28 and the common electrode 30, that is, the "upper electrode", is the common electrode 30, and the electrode located on the lower layer side, that is, the "lower electrode", is the pixel electrode 28. An insulating film 32 is provided between the pixel electrode 28 and the common electrode 30. A plurality of slits 30A are respectively opened and formed in the portions of the common electrode 30 that overlap with the plurality of pixel electrodes 28. A common potential signal as a common potential (reference potential) is supplied to the common electrode 30 through the pixel circuit unit 31. When the pixel electrode 28 is charged to a potential based on the image signal transmitted to the source wiring 26 as the TFT 27 is driven, a potential difference is generated between the pixel electrode 28 and the common electrode 30. Therefore, between the opening edge of the slit 30A in the common electrode 30 and the pixel electrode 28, in addition to the component along the main surface of the array substrate 21, a fringe electric field (inclined electric field) containing a component in the normal direction relative to the main surface of the array substrate 21 is also generated. Therefore, by utilizing this fringe electric field, the orientation state of the liquid crystal molecules contained in the liquid crystal layer 22 can be controlled, and a specified display is performed based on the orientation state of the liquid crystal molecules. That is, the operation mode of the liquid crystal panel 11 of this embodiment is set to the FFS (Fringe Field Switching) mode.

[0027] On the other hand, Figure 6 As shown, a color filter 29, a light shielding portion 40, and an orientation film are provided on the inner surface side of the display area AA of the color filter substrate 20. In addition, the orientation film is omitted from the figure. The orientation films respectively provided on the color filter substrate 20 and the array substrate 21 are composed of organic materials such as polyimide. Each orientation film is respectively provided on the innermost surface side (closest to the liquid crystal layer 22) of the color filter substrate 20 and the array substrate 21. Each orientation film has the function of orienting the liquid crystal molecules by performing a photo-orientation treatment on the upper surface facing the liquid crystal layer 22.

[0028] like Figure 6As shown, the color filter 29 is arranged to overlap with the pixel electrode 28 of the array substrate 21, and together with the overlapping pixel electrode 28, it constitutes a pixel as a display unit. The color filter 29 includes multiple (3) colors that are different from each other. The multiple color filters 29 that are different from each other are arranged in an adjacent manner in the extension direction (X-axis direction) of the gate wiring 25. That is, the arrangement direction of the multiple color filters 29 that are different from each other is consistent with the X-axis direction. The multiple color filters 29 that are different from each other extend along the extension direction (Y-axis direction) of the source wiring 26. In this way, the multiple color filters 29 that are different from each other are arranged as a whole in a vertical stripe shape. The multiple color filters 29 that are different from each other are arranged in such a way that their boundaries (color boundaries) overlap with the source wiring 26. The color filter 29 includes three types: a green color filter (first color filter) 29G that is green, a blue color filter (second color filter) 29B that is blue, and a red color filter (third color filter) 29R that is red. The green color filter 29G and the overlapping pixel electrode 28 together form a green pixel (first pixel) that is green. The blue color filter 29B and the overlapping pixel electrode 28 together form a blue pixel (second pixel) that is blue. The red color filter 29R and the overlapping pixel electrode 28 together form a red pixel (third pixel) that is red. Figure 6 In the figures, the colors represented by the color filter 29 are represented by the letters R (Red), G (Green), and B (Blue).

[0029] like Figure 6 As shown, the shading portion 40 is provided on the inner surface of the glass substrate (substrate) 20GS, and is located on the lower layer side of the color filter 29. The shading portion 40 extends in the Y-axis direction and overlaps with the source wiring 26 provided on the array substrate 21. A plurality of shading portions 40 are arranged at intervals in the X-axis direction, and are arranged in a vertical stripe shape when viewed from above. The plurality of shading portions 40 are respectively arranged at the color boundaries of the plurality of color filters 29 presenting different colors from each other. In detail, the plurality of shading portions 40 include: a shading portion 40 arranged at the boundary of the green color filter 29G and the blue color filter 29B; a shading portion 40 arranged at the boundary of the blue color filter 29B and the red color filter 29R; and a shading portion 40 arranged at the boundary of the red color filter 29R and the green color filter 29G. The arrangement interval of the plurality of shading portions 40 is substantially consistent with the arrangement interval of the source wiring 26. The light shielding portion 40 can block light from moving back and forth between pixels showing different colors. This makes it difficult for color mixing to occur, thereby ensuring the display independence of each pixel showing each color.

[0030] The detailed structure of the light shielding portion 40 is described. Figure 7As shown, the light shielding portion 40 is a stacked structure (multi-layer film structure) composed of a first transmission film 41, a first reflection film (reflection transmission film) 42, a second transmission film 43, and a second reflection film 44, starting from the lower layer side. The first transmission film 41 is provided on the inner surface of the glass substrate 20GS. The first reflection film 42 is arranged on the upper layer side of the first transmission film 41. The second transmission film 43 is arranged on the upper layer side of the first reflection film 42. The second reflection film 44 is arranged on the upper layer side of the second transmission film 43.

[0031] The first transparent film 41 is preferably made of a material that is almost transparent and has a high refractive index, for example, a translucent resin material (such as SiNx (silicon nitride) etc.), and its refractive index is about 1.9. The first transparent film 41 has a function of reducing the reflection of external light by thin film interference described later. In order to exert the above-mentioned external light reflection reduction function, the film thickness of the first transparent film 41 is preferably in the range of 20nm to 100nm, specifically, about 70nm.

[0032] The first reflective film 42 is preferably made of a material with high light reflectivity and light shielding properties, and is made of a metal material (for example, W (tungsten)). The first reflective film 42 has a function of reducing the reflection of external light described later, and a function of re-reflecting the reflected light of the second reflective film 44 described later. In order to exert the above functions, it is preferable that the film thickness of the first reflective film 42 is set to a range of, for example, 3nm to 20nm, specifically, about 10nm. The film thickness of the first reflective film 42 is smaller than the film thickness of the second reflective film 44. Compared with the second reflective film 44, the first reflective film 42 has a higher light transmittance and a lower light reflectance. Compared with the first reflective films 41 and 43, the first reflective film 42 has a lower light transmittance, a higher light reflectance and a higher light shielding property. Specifically, the film thickness of the first reflective film 42 is adjusted so that the light transmittance and the light reflectance are approximately 50% each.

[0033] The second transparent film 43 is preferably made of a substantially transparent material with a high refractive index, for example, a light-transmitting resin material (such as SiNx, etc.), and its refractive index is about 1.9. The second transparent film 43 has a function of reducing the reflection of external light by thin film interference described later. In order to exert the above-mentioned external light reflection reduction function, the film thickness of the second transparent film 43 is preferably in the range of 20nm to 100nm, specifically, about 60nm. The film thickness of the second transparent film 43 is smaller than the film thickness of the first transparent film 41.

[0034] The second reflective film 44 is preferably made of a material with high light reflectivity and light shielding properties, and is made of a metal material (such as W, etc.). The second reflective film 44 mainly plays the function of shielding the light irradiated from the backlight device 12. In other words, the second reflective film 44 can be used to shield the light alternating between the color filters 29R, 29G, and 29B that are adjacent to each other in the X-axis direction and present different colors. In order to exert the above-mentioned light shielding function, the film thickness of the second reflective film 44 is preferably, for example, more than 30nm, specifically, for example, about 100nm. The film thickness of the second reflective film 44 is greater than the film thickness of the first reflective film 42. Compared with the first reflective film 42, such a second reflective film 44 has a low light transmittance, high light shielding properties and light reflectivity. Specifically, the film thickness of the second reflective film 44 is adjusted so that the light reflectivity is approximately 100% and the light transmittance is approximately 0%.

[0035] Thus, the second reflection film 44 has the lowest light transmittance and the highest light reflectance among the films constituting the light shielding portion 40. Therefore, the amount of reflected light generated by the external light incident on the liquid crystal panel 11 from the front side and reflected by the second reflection film 44 is greater than the amount of reflected light by the first reflection film 42. If the reflected light by the second reflection film 44 is directly emitted, the display quality may be significantly reduced.

[0036] On the other hand, among the films constituting the light shielding portion 40, the first transmissive film 41, the first reflective film 42, and the second transmissive film 43 mainly play a function of suppressing the reflection of the external light incident on the liquid crystal panel 11 from the front side. Specifically, the external light is incident on the first transmissive film 41 when it passes through the glass substrate 20GS of the color filter substrate 20. A part of the light incident on the first transmissive film 41 is reflected by the interface between the glass substrate 20GS and the first transmissive film 41 (the bottom surface of the first transmissive film 41), and the rest passes through the first transmissive film 41 and reaches the first reflective film 42. A part of the light reaching the first reflective film 42 (about 50%) is reflected at the interface between the first transmissive film 41 and the first reflective film 42 (the bottom surface of the first reflective film 42), and the rest (about 50%) passes through the first reflective film 42. A part of the light passing through the first reflective film 42 is reflected at the interface between the first reflective film 42 and the second transmissive film 43 (the bottom surface of the second transmissive film 43), and the rest passes through the second transmissive film 43 and reaches the second reflective film 44. Most of the light reaching the second reflective film 44 is reflected at the interface between the second transparent film 43 and the second reflective film 44 (the bottom surface of the second reflective film 44). When the reflected light at the interface between the second transparent film 43 and the second reflective film 44 passes through the second transparent film 43 and reaches the first reflective film 42, a part (about 50%) passes through the first reflective film 42, and the remaining part (about 50%) is reflected again by the first reflective film 42 and goes toward the second reflective film 44. Thus, the reflected light at the interface between the second transparent film 43 and the second reflective film 44 can be suppressed from being emitted from the first transparent film 41 to the lower layer side.

[0037] Here, the light reflected at the interface between the first transparent film 41 and the first reflective film 42 and the light reflected at the interface between the second transparent film 43 and the second reflective film 44 and transmitted through the first reflective film 42 are offset to some extent based on the interference conditions corresponding to the refractive indexes and the film thicknesses of the first transparent film 41 and the second transparent film 43. That is, the refractive indexes and the film thicknesses of the first transparent film 41 and the second transparent film 43 are adjusted so that the reflected light at the interface between the first transparent film 41 and the first reflective film 42 and the reflected light at the interface between the second transparent film 43 and the second reflective film 44 are in opposite phases to each other. Specifically, in the present embodiment, the film thickness of the first transparent film 41 is about 70 nm, the refractive index of the first transparent film 41 is about 1.9, and the film thickness of the second transparent film 43 is about 60 nm, and the refractive index of the second transparent film 43 is about 1.9. Thus, the light reflected at the interface between the first transparent film 41 and the first reflective film 42 and the light reflected at the interface between the second transparent film 43 and the second reflective film 44 and transmitted through the first reflective film 42 become mutually opposite in phase, and these lights effectively cancel each other out, thereby reducing the external light reflected by the light shielding portion 40. In addition, part of the light reflected at the interface between the second transparent film 43 and the second reflective film 44 is repeatedly reflected between the second reflective film 44 and the first reflective film 42, and is not emitted to the outside of the front side. In this way, by realizing low reflectivity of the light shielding portion 40, the degradation of display quality associated with the provision of the light shielding portion 40 can be fully suppressed.

[0038] As described above, the light shielding portion 40 of the present embodiment is formed into a stacked structure of the first transparent film 41, the first reflective film 42, the second transparent film 43, and the second reflective film 44. Therefore, compared with the case where the light shielding portion 40 is formed of a resin material as in the past, the exposure accuracy of the exposure device used when patterning the light shielding portion 40 in the manufacturing process can be sufficiently improved. Therefore, it is suitable to make the light shielding portion 40 finer.

[0039] The detailed structure of each film 41 to 44 constituting the light shielding portion 40 is mainly based on Figure 8 For explanation. Figure 8As shown, the first transparent film 41 has a first bottom surface 41A connected to the glass substrate 20GS and a first side surface 41B inclined relative to the first bottom surface 41A. The first bottom surface 41A is located on the surface of the first transparent film 41 opposite to the upper surface 41C, and is located on the side opposite to the first reflective film 42. The first bottom surface 41A is a plane along the X-axis direction (the width direction of the light shielding portion 40) and the Y-axis direction (the length direction of the light shielding portion 40). A pair of first side surfaces 41B are provided at both ends of the first transparent film 41 in the X-axis direction. The first side surface 41B is an inclined surface that forms an inclination of a first angle θ1 with the first bottom surface 41A. The first angle θ1 is an acute angle, which is less than 90°. That is, the first side surface 41B is an inclined surface in the shape of a positive cone relative to the first bottom surface 41A. Specifically, the first angle θ1 is set to, for example, a range of 29° to 75°, Figure 8 The figure shows a case where the angle is set to about 52 degrees. The rising base end of the first side surface 41B (the contact point between the first side surface 41B and the inner surface of the glass substrate 20GS) is the outer end 41D of the first transparent film 41 in the X-axis direction.

[0040] like Figure 8 As shown, the second reflective film 44 has a second bottom surface 44A connected to the upper surface 43C of the second transparent film 43 and a second side surface 44B inclined relative to the second bottom surface 44A. The second bottom surface 44A is the surface of the second reflective film 44 on the opposite side of the upper surface 44C and is parallel to the first bottom surface 41A. A pair of second side surfaces 44B are provided at both ends of the second reflective film 44 in the X-axis direction. The second side surface 44B is an inclined surface that forms an inclination of a second angle θ2 with the second bottom surface 44A. The second angle θ2 is an acute angle, which is less than 90°. That is, the second side surface 44B is formed as an inclined surface that is a positive cone relative to the second bottom surface 44A. Specifically, the second angle θ2 is, for example, in the range of 50° to 65°. Figure 8 The figure shows a setting of about 57°.

[0041] Thus, in the present embodiment, the first side surface 41B of the first transmissive film 41 forms an acute angle, namely, a first angle θ1, with the first bottom surface 41A, and the second side surface 44B of the second reflective film 44 forms an acute angle, namely, a second angle θ2, with the second bottom surface 44A. Therefore, assuming that the first side surface forms an obtuse angle with the first bottom surface 41A and the second side surface forms an obtuse angle with respect to the second bottom surface 44A, when the color filters 29R, 29G, and 29B are formed in the manufacturing process, the wettability of the material of the color filters 29R, 29G, and 29B near the light shielding portion 40 is good. Since the material of the color filters 29R, 29G, and 29B is not easily ejected near the light shielding portion 40, it is difficult to generate an undesired opening (non-formed portion) on the color filters 29R, 29G, and 29B.

[0042] like Figure 8As shown, the first reflective film 42 has a third bottom surface 42A connected to the upper surface 41C of the first transparent film 41 and a third side surface 42B forming a third angle θ3 with the third bottom surface 42A. The third bottom surface 42A is the surface of the first reflective film 42 on the opposite side to the upper surface 42C, is located on the side opposite to the second transparent film 43, and is parallel to the first bottom surface 41A. A pair of third side surfaces 42B are provided at both ends in the X-axis direction of the first reflective film 42. The third angle θ3 formed by the third side surface 42B and the third bottom surface 42A can be less than 90°, but can also be greater than 90°, and can also be 90°. That is, the third side surface 42B can be an inclined surface in the shape of a positive cone relative to the third bottom surface 42A, can also be an inclined surface in the shape of an inverted cone, or can also be a further vertical surface. Specifically, the third angle θ3 is, for example, in the range of 73° to 105°, Figure 8 The figure shows a case where the angle is set to about 80°. In addition, the third angle θ3 is greater than the first angle θ1 and the second angle θ2. In this embodiment, the first reflective film 42 is configured such that the third side surface 42B is not in contact with the first side surface 41B, but in contact with the upper surface 41C of the first transparent film 41. In other words, the first reflective film 42 is configured such that the third side surface 42B is concave inward relative to the first side surface 41B of the first transparent film 41.

[0043] like Figure 8 As shown, the second transparent film 43 has a fourth bottom surface 43A connected to the upper surface 42C of the first reflective film 42, and a fourth side surface 43B forming a fourth angle θ4 with the fourth bottom surface 43A. The fourth bottom surface 43A is the surface of the second transparent film 43 on the opposite side of the upper surface 43C, located on the side opposite to the second reflective film 44, and parallel to the first bottom surface 41A. A pair of fourth side surfaces 43B are provided at both ends in the X-axis direction of the second transparent film 43. The fourth angle θ4 formed by the fourth side surface 43B and the fourth bottom surface 43A can be less than 90°, but can also be greater than 90°, and can also be 90°. That is, the fourth side surface 43B can be an inclined surface in the shape of a positive cone relative to the fourth bottom surface 43A, can also be an inclined surface in the shape of an inverted cone, or can also be a vertical surface. Specifically, the fourth angle θ4 is, for example, in the range of 73° to 105°, Figure 8 The figure shows a case where the angle is set to about 80°. In addition, the fourth angle θ4 is greater than the first angle θ1 and the second angle θ2. In this embodiment, the fourth side surface 43B of the second transparent film 43 is formed in a substantially flat plane with the third side surface 42B of the first reflective film 42, and is parallel to the third side surface 42B. In other words, the second transparent film 43 is configured such that the fourth side surface 43B is concave inwardly relative to the first side surface 41B of the first transparent film 41.

[0044] In addition, if Figure 8As shown, the second reflective film 44 has a fifth side surface 44D in addition to the second side surface 44B. The fifth side surface 44D forms an obtuse angle, namely, a fifth angle θ5, with the second bottom surface 44A, and is respectively connected to the second side surface 44B and the second bottom surface 44A. That is, the fifth side surface 44D is an inclined surface in an inverted cone shape relative to the second bottom surface 44A. Specifically, the fifth angle θ5 is, for example, in the range of 97° to 137°. Figure 8 The figure shows the situation of about 110°. The contact point between the fifth side surface 44D and the second side surface 44B is the outer end 44E of the second reflective film 44 in the X-axis direction. In other words, the second reflective film 44 is a structure in which the portion including the outer end 44E protrudes outward relative to the second transparent film 43 in the X-axis direction. In addition, the contact point between the fifth side surface 44D and the second side surface 44B is closer to the second bottom surface 44A than the upper surface 44C in the Z-axis direction. In other words, the area of ​​the fifth side surface 44D is smaller than the area of ​​the second side surface 44B.

[0045] In addition, if Figure 8 As shown in FIG. 1 , the light shielding portion 40 is configured such that a line segment LS connecting an outer end 41D of the first transmissive film 41 and an outer end 44E of the second reflective film 44 forms an acute angle with the first bottom surface 41A. Specifically, the light shielding portion 40 is configured such that the angle formed by the line segment LS and the first bottom surface 41A, that is, the sixth angle θ6, is within a range of 70° to 90°. Figure 8 In FIG. 8 , the line segment LS is indicated by a two-dot chain line. In addition, the sixth angle θ6 is larger than the first angle θ1 and the second angle θ2.

[0046] The liquid crystal display device 10 of this embodiment has the above structure, and its manufacturing method is described below. The liquid crystal display device 10 is manufactured by assembling a liquid crystal panel 11 and a backlight device 12 that are manufactured separately. The manufacturing method of the liquid crystal panel 11 includes: a color filter substrate manufacturing process (CF substrate manufacturing process) for manufacturing a color filter substrate 20; an array substrate manufacturing process for manufacturing an array substrate 21; and a bonding process for bonding the manufactured color filter substrate 20 to the array substrate 21. The color filter substrate manufacturing process is described below.

[0047] The color filter substrate manufacturing process includes at least a first step (second light shielding portion forming step) of forming the light shielding portion 40 on the inner surface of the glass substrate 20GS and a second step (color filter forming step) of forming the color filter 29 on the upper layer side of the light shielding portion 40. The first step will be described in detail below.

[0048] In the first step, the first transparent film 41, the first reflective film 42, the second transparent film 43, the second reflective film 44, and the resist film R are formed (film forming step), and the resist film R is exposed / developed (exposure / development step). In the film forming step, the first transparent film 41 is formed on the glass substrate (substrate) 20GS, the first reflective film 42 is formed on the upper layer side of the first transparent film 41, the second transparent film 43 is formed on the upper layer side of the first reflective film 42, the second reflective film 44 having a larger film thickness than the first reflective film 42 is formed on the upper layer side of the second transparent film 43, and the resist film R having photosensitivity is formed on the upper layer side of the second reflective film 44. The resist film R may be a positive type or a negative type. In the exposure / development step, light emitted from a light source of an exposure device is irradiated to the resist film R via a photomask to which a predetermined exposure pattern is given. The portion of the resist film R corresponding to the exposure pattern of the photomask is selectively exposed. When the exposed resist film R is developed, the exposed portion or the non-exposed portion of the resist film R is selectively removed (see Fig.11 ).

[0049] In the first step, after the exposure / development step is completed, etching is performed using the resist film R as a mask (etching step). Fig. 9 The etching device 50 shown in FIG. 5 is described below. The etching device 50 of this embodiment is a dry etching device using an inductively coupled plasma (ICP: Inductively Coupled Plasma) method. Fig. 9 As shown, the etching device 50 has at least a vacuum chamber (etching processing chamber) 51, a substrate support part 52, a dielectric 53 and a coil (antenna) 54. The vacuum chamber 51 can accommodate the glass substrate 20GS inside and maintain a vacuum state when etching is performed. The dielectric 53 is composed of, for example, quartz glass, etc., and is arranged at the upper part of the vacuum chamber 51. The coil 54 is arranged on the upper side of the dielectric 53 outside the vacuum chamber 51. The first high-frequency power supply (power supply for plasma generation) RF1 is connected to the coil 54, and a high-frequency current (RF (radio-frequency) current) is supplied by the first high-frequency power supply RF1. As the high-frequency current is supplied from the first high-frequency power supply RF1 to the coil 54, an induced electric field is generated in the plasma, thereby generating a high-density plasma by accelerating electrons. The substrate support part 52 is arranged at the lower part of the vacuum chamber 51 and supports the glass substrate 20GS. The substrate support part 52 constitutes a lower electrode and is connected to a second high-frequency power supply (power supply for bias) RF2. A high-frequency current is supplied to the substrate support portion 52 serving as the lower electrode by the second high-frequency power supply RF2.

[0050] like Fig.10As shown, the substrate support portion 52 has a plurality of protrusions (embossings) 52A on the main surface facing the glass substrate 20GS side. The plurality of protrusions 52A are arranged at intervals in the X-axis direction and the Y-axis direction in the main surface of the glass substrate 20GS, and support the glass substrate 20GS from the bottom. The arrangement interval of the plurality of protrusions 52A is about several mm. The protrusions 52A are roughly hemispherical and point-contact with the main surface of the glass substrate 20GS. In this way, since the substrate support portion 52 has a plurality of protrusions 52A, the contact area between the substrate support portion 52 and the glass substrate 20GS becomes smaller than when the substrate support portion is assumed to be in surface contact with the main surface of the glass substrate 20GS. Therefore, even if the materials of the first reflective film 42 and the second reflective film 44 are scattered and attached to the surface of the substrate support portion 52 as etching proceeds, it is difficult to cause etching defects due to the attached materials.

[0051] On the other hand, Fig.10 As shown, the glass substrate 20GS has a portion in contact with the protrusion 52A and a portion not in contact with the protrusion 52A, so there is a concern that these heat dissipation properties may differ. If the heat dissipation properties of the glass substrate 20GS differ in each portion, the amount of retreat of the resist film R may differ as the etching proceeds, and the degree of completion of the width dimension (dimension in the X-axis direction) of the light shielding portion 40 may also differ. If the width dimension of the light shielding portion 40 differs in each portion of the glass substrate 20GS, as a result, display unevenness reflecting the arrangement interval of the protrusion 52A may be observed.

[0052] In order to eliminate such a problem, in the present embodiment, the etching process includes a first etching process and a second etching process whose etching speed is slower than that of the first etching process. Specifically, in the first etching process, the resist film R is used as a mask, and at least the second reflective film 44 is etched, and the etching speed is faster than that of the second etching process. Specifically, in the first etching process, at least SF6 gas is used as the etching gas (reactive gas) introduced into the vacuum chamber 51, thereby making the etching speed faster than that of the second etching process. On the other hand, in the second etching, the second reflective film 44, the second transparent film 43, the first reflective film 42 and the first transparent film 41 are etched using the resist film R as a mask, and the etching speed is slower than that of the first etching process. Specifically, in the second etching process, at least CF4 gas and O2 gas are used as the etching gas introduced into the vacuum chamber 51, thereby making the etching speed slower than that of the first etching process.

[0053] like Fig.11 As shown in FIG. 1 , the first etching process is performed by etching at least the second reflective film 44 through the resist film R patterned by the exposure / development process. When the first etching process is performed, as shown in FIG. Fig.12As shown, at least the portion of the second reflective film 44 that is not covered by the resist film R is removed. Since the etching rate in the first etching step is faster than the etching rate in the second etching step, the second reflective film 44 at the stage of the first etching step is processed so that its side surface and bottom surface form a large angle of nearly 90 degrees.

[0054] Next, when the second etching process is performed through the resist film R, Fig.13 As shown in FIG. 4 , the light shielding portion 40 is formed by removing the second reflective film 44, the second transparent film 43, the first reflective film 42, and the portion of the first transparent film 41 not covered by the resist film R. Fig.13 In FIG. 1 , the films 41 to 44 and R in the state before the second etching process is performed are illustrated by two-dot chain lines. Since the etching speed in the second etching process is slower than the etching speed in the first etching process, the resist film R gradually retreats as the etching progresses, and the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are gradually etched. As a result, the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are processed so that the angles formed by the respective side surfaces 41B to 44B and the respective bottom surfaces 41A to 44A are smaller than the angles of the respective side surfaces processed when only the first etching process is performed without performing the second etching process in the etching process. When the second etching process is completed, ashing is performed to remove the resist film R (ashing process).

[0055] After the first step is completed, the second step is performed. In the second step, the materials of the color filters 29R, 29G, and 29B of each color are sequentially applied to the inner surface of the glass substrate 20GS using an inkjet device or the like. For example, if the material of the green color filter 29G is applied, its end is arranged on the upper side of the light shielding portion 40. Next, if the material of the blue color filter 29B is applied, its end is arranged in a form adjacent to the green color filter 29G on the upper side of the light shielding portion 40. Furthermore, if the material of the red color filter 29R is applied, its end is arranged in a form adjacent to the green color filter 29G and the blue color filter 29B on the upper side of the light shielding portion 40. In addition, the order of applying the materials of the color filters 29R, 29G, and 29B of each color can be appropriately changed in addition to the above.

[0056] As described above, in the first step of the present embodiment, by performing the first etching step and then the second etching step, at least the first angle θ1 formed between the first side surface 41B of the first transparent film 41 and the first bottom surface 41A, and the second angle θ2 formed between the second side surface 44B of the second reflective film 44 and the second bottom surface 44A are acute angles. In addition, the first reflective film 42 and the second transparent film 43 are configured such that each side surface 42B and 43B is recessed inward relative to the first side surface 41B of the first transparent film 41, and the third side surface 42B is not in contact with the first side surface 41B, but is in contact with the upper surface 41C of the first transparent film 41. In addition, the third angle θ3 formed between the third side surface 42B of the first reflective film 42 and the third bottom surface 42A, and the fourth angle θ4 formed between the fourth side surface 43B of the second transparent film 43 and the fourth bottom surface 43A are both larger than the first angle θ1.

[0057] According to the present embodiment, since the retreat of the first transparent film 41 and the second transparent film 43 is suppressed, compared with the case where the etching process is constituted by only the first etching process, it is difficult for the light shielding portion 40 to have a large hook. Furthermore, according to the present embodiment, compared with the case where the etching process is constituted by only the second etching process, the first angle θ1 formed by the first side surface 41B in the first transparent film 41 and the first bottom surface 41A, and the second angle θ2 formed by the second side surface 44B in the second reflective film 44 and the second bottom surface 44A can be increased. Therefore, the heat transfer from the second reflective film 44 side to the first transparent film 41 side is reduced, and the difference in heat dissipation generated between the portion in contact with the protrusion 52A and the portion not in contact with the protrusion 52A in the glass substrate 20GS can be alleviated. As a result, the width dimension of the light shielding portion 40 is made uniform, and therefore, the amount of transmitted light transmitted through each of the color filters 29R, 29G, and 29B is equalized. Furthermore, compared to the case where the first angle formed by the first side surface of the first transparent film 41 and the first bottom surface 41A and the second angle formed by the second side surface of the second reflective film 44 and the second bottom surface 44A are both obtuse angles, when the color filters 29G and 29B are formed in the second step, the wettability of the material of the color filters 29G and 29B near the light shielding portion 40 is good. Therefore, the material of the color filters 29G and 29B is unlikely to be ejected near the light shielding portion 40, and thus, the color filters 29G and 29B are unlikely to have undesired openings.

[0058] In addition, since the first reflective film 42 is configured such that the third side surface 42B is recessed inward relative to the first side surface 41B, the heat transfer from the first reflective film 42 to the first transparent film 41 is reduced compared to the configuration in which the third side surface is in contact with the first side surface 41B. Therefore, even if the substrate support portion 52 provided in the etching device 50 used in the etching process has a configuration in which a plurality of protrusions 52A are intermittently arranged, it is difficult for a difference in heat dissipation to occur between a portion in contact with the protrusion 52A and a portion not in contact with the protrusion 52A in the glass substrate 20GS. As a result, the degree of completion of the light shielding portion 40 is made uniform, and thus the amount of light transmitted through each of the color filters 29R, 29G, and 29B is made uniform. Furthermore, since the light shielding portion 40 is configured such that the third angle θ3 and the fourth angle θ4 are larger than the first angle θ1, the heat transfer from the first reflective film 42 to the first transparent film 41 is reduced compared to the case in which the third angle and the fourth angle are equal to or less than the first angle θ1. As a result, the degree of completion of the light shielding portion 40 is further uniform. In addition, the second reflective film 44 has a fifth side surface 44D that forms an obtuse angle, that is, a fifth angle θ5, with the second bottom surface 44A and is in contact with the second bottom surface 44A, and a portion of which protrudes outward relative to the second transparent film 43. Therefore, compared with the case where the second reflective film does not have the fifth side surface 44D, the heat transfer from the second reflective film 44 to the second transparent film 43 becomes lower. As a result, the degree of completion of the light shielding portion 40 is further uniform.

[0059] In addition, the light shielding portion 40 is configured such that the sixth angle θ6 formed by the line segment LS connecting the outer end 41D of the first transparent film 41 and the outer end 44E of the second reflective film 44 and the first bottom surface 41A is within a range of 70° or more and 90° or less. In this way, since the sixth angle θ6 is less than 90°, the wettability of the material of each color filter 29R, 29G, 29B near the light shielding portion 40 is good when each color filter 29R, 29G, 29B is formed in the second step, compared with the case where the sixth angle exceeds 90°. As a result, the material of each color filter 29R, 29G, 29B is not easily bounced near the light shielding portion 40, so that each color filter 29R, 29G, 29B is less likely to have an undesired opening. On the other hand, since the sixth angle θ6 is greater than 70°, the heat transfer from the second reflective film 44 side to the first transparent film 41 side is reduced compared with the case where the sixth angle is less than 70°. Therefore, even if the substrate support portion 52 provided in the etching device 50 used in the etching process has a configuration in which a plurality of protrusions 52A are intermittently arranged, it is difficult for a difference in heat dissipation to occur between a portion of the glass substrate 20GS that is in contact with the protrusions 52A and a portion that is not in contact with the protrusions 52A. As a result, the width dimension of the light shielding portion 40 is made uniform, and therefore, the amount of light transmitted through each of the color filters 29R, 29G, and 29B is made uniform.

[0060] Next, in order to verify the superiority of the color filter substrate 20 of the present embodiment, the following comparative experiment 1 was performed. In comparative experiment 1, the conditions of the first step included in the color filter substrate manufacturing process were changed as follows, and the light shielding portion 40 was provided on each of the color filter substrates 20 of comparative examples 1 to 4 and embodiments 1 to 7.

[0061] Comparative Example 1 is a case where the first process is constituted by only the first etching process, and SF6 gas and O2 gas are used. Comparative Examples 2 and 3 are both cases where the first process is constituted by only the second etching process, and CF4 gas and O2 gas are used. Comparative Examples 2 and 3 are the same conditions, but etching is performed in different vacuum chambers 51 among the multiple vacuum chambers 51 provided in the etching device 50. Comparative Example 4 and Examples 1 to 7 share the point that the first process is constituted by the first etching process and the second etching process, and the second etching process is performed after the first etching process. In addition, Comparative Example 4 and Examples 1 to 7 also share the point that SF6 gas and O2 gas are used in the first etching process, and CF4 gas, O2 gas and Cl2 gas are used in the second etching process.

[0062] On the other hand, any one of the time for performing the first etching process, the time for performing the second etching process, and the flow rate of Cl2 gas in the second etching process is different between Comparative Example 4 and Examples 1 to 7, and Example 1 serves as the benchmark for these parameters. Specifically, in Example 2, the time for performing the first etching process is 10 seconds longer than that in Example 1. In Example 3, the time for performing the first etching process is 10 seconds shorter than that in Example 1. In Example 4, the flow rate of Cl2 gas in the second etching process is 1.33 times that of Example 1. In Example 5, the flow rate of Cl2 gas in the second etching process is 0.66 times that of Example 1. In Example 6, the time for performing the second etching process is 15 seconds longer than that in Example 1. In Example 7, the time for performing the second etching process is 15 seconds shorter than that in Example 1. In Comparative Example 4, the time for performing the second etching process is 30 seconds longer than that in Example 1.

[0063] Then, in Comparative Experiment 1, for each color filter substrate 20 of Comparative Examples 1 to 4 and Examples 1 to 7 manufactured, an image (SEM image) of the shading portion 40 is obtained using a scanning electron microscope (SEM). Based on the obtained image of the shading portion 40, the angle formed by the line segment LS connecting the outer end 41D of the first transparent film 41 and the outer end 44E of the second reflective film 44 and the first bottom surface 41A, that is, the sixth angle θ6 is measured. Furthermore, each color filter substrate 20 of Comparative Examples 1 to 4 and Examples 1 to 7 is bonded to the array substrate 21 to manufacture the liquid crystal panel 11, and the lighting inspection of the manufactured liquid crystal panel 11 is performed to determine whether display unevenness (poor display) is visible. The experimental results of Comparative Experiment 1 are as follows. Figure 14 to Figure 24 shown. Figure 14 to Figure 24 , an image, a sixth angle θ6, and a judgment result are shown in FIG. The unit of the sixth angle θ6 is “°”. The judgment result is marked with “0” when the display unevenness is almost invisible, “×” when the display unevenness is visible in the entire area, and “△” when the display unevenness is partially visible. Fig.14 This is the experimental result of Comparative Example 1. Fig.15 This is the experimental result of Comparative Example 2. Fig.16 This is the experimental result of Comparative Example 3. Fig.17 This is the experimental result of Comparative Example 4. Fig.18 This is the experimental result of Example 1. Fig.19 This is the experimental result of Example 2. Fig. 20 This is the experimental result of Example 3. Fig.21 This is the experimental result of Example 4. Fig. 22 This is the experimental result of Example 5. Fig.23 This is the experimental result of Example 6. Fig.24 This is the experimental result of Example 7.

[0064] The experimental results of comparative experiment 1 are used to illustrate this. Figures 14 to 17As shown, the judgment results of Comparative Examples 1 to 4 are all "×" or "△", and the sixth angle θ6 is less than 70° or greater than 90°. In detail, the judgment result of Comparative Example 1 is "×", and the sixth angle θ6 is 99°. The judgment result of Comparative Example 2 is "△", and the sixth angle θ6 is 50°. The judgment result of Comparative Example 3 is "×", and the sixth angle θ6 is 47°. The judgment result of Comparative Example 4 is "△", and the sixth angle θ6 is 64°. Among them, Comparative Example 1 produces a large barb in the shading portion 40, and the sixth angle θ6 exceeds 90°. Therefore, when forming each color filter 29R, 29G, and 29B, the wettability of the material of each color filter 29R, 29G, and 29B deteriorates near the shading portion 40, resulting in "pop-up" of the material. As a result, an opening (non-formed portion) that is not desired by each color filter 29R, 29G, and 29B is produced, so it is inferred that the judgment result is "×". Since the sixth angle θ6 of any of Comparative Examples 2 to 4 is less than 70°, the heat transfer from the second reflective film 44 side to the first transparent film 41 side is improved. Therefore, in Comparative Examples 2 to 4, there is a large difference in heat dissipation between the portion where the glass substrate 20GS is in contact with the plurality of protrusions 52A provided on the substrate support portion 52 of the etching device 50 used in the first step and the portion where the protrusions 52A are not in contact, and due to this difference, there is also a large difference in the degree of perfection of the width dimension of the light shielding portion 40. As a result, there is also a large difference in the amount of transmitted light of each color filter 29R, 29G, and 29B, and it is estimated that the judgment result is "×" or "△". Among them, since the sixth angle θ6 of Comparative Example 3 is 47° and a value less than 50°, there is a large difference in the degree of perfection of the width dimension of the light shielding portion 40, and it is estimated that the judgment result is "×". On the other hand, since the sixth angle θ6 of Comparative Examples 2 and 4 is 50° or more, the difference in the degree of perfection of the width dimension of the light shielding portion 40 is smaller than that of Comparative Example 3, and it is estimated that the judgment result is "△".

[0065] In contrast, Figures 18 to 24As shown, the judgment results of Examples 1 to 7 are all "0", and the sixth angle θ6 is in the range of 70° or more and 90° or less. In detail, the judgment result of Example 1 is "0", and the sixth angle θ6 is 74°. The judgment result of Example 2 is "0", and the sixth angle θ6 is 78°. The judgment result of Example 3 is "0", and the sixth angle θ6 is 70°. The judgment result of Example 4 is "0", and the sixth angle θ6 is 70°. The judgment result of Example 5 is "0", and the sixth angle θ6 is 74°. The judgment result of Example 6 is "0", and the sixth angle θ6 is 71°. The judgment result of Example 7 is "0", and the sixth angle θ6 is 81°. Since the sixth angle θ6 of Examples 1 to 7 is 90° or less, compared with Comparative Example 1 in which the sixth angle θ6 exceeds 90°, when forming each color filter 29R, 29G, 29B, the wettability of the material of each color filter 29R, 29G, 29B near the light shielding portion 40 is good, and the material "pop-up" is unlikely to occur. As a result, each color filter 29R, 29G, 29B is unlikely to have an undesired opening, so it is estimated that the judgment result is "0". Since the sixth angle θ6 of Examples 1 to 7 is 70° or more, the heat transfer from the second reflective film 44 side to the first transparent film 41 side is reduced compared with Comparative Examples 2 to 4 in which the sixth angle θ6 is less than 70°. Therefore, in Examples 1 to 7, the difference in heat dissipation is unlikely to occur between the portion where the glass substrate 20GS is in contact with the plurality of protrusions 52A provided on the substrate support portion 52 of the etching device 50 used in the first step and the portion where the protrusions 52A are not in contact, so the degree of completion of the width dimension of the light shielding portion 40 is unlikely to occur. As a result, the amount of light transmitted through each color filter 29R, 29G, and 29B is unlikely to differ, and the estimated judgment result is "0". As described above, in Examples 1 to 7, it is difficult to generate undesired openings in each color filter 29R, 29G, and 29B, and it is difficult to generate differences in the degree of completion of the width dimension of the light shielding portion 40, so that it is difficult to visually confirm display unevenness. In addition, although the light shielding portion 40 of any of Examples 1, 2, 5, and 7 has a barb, its size is smaller than the barb generated by the light shielding portion 40 of Comparative Example 1, so that the "pop-out" of the material of each color filter 29R, 29G, and 29B can be fully suppressed, and the effect of reducing the heat transfer from the second reflective film 44 side to the first transparent film 41 side can be fully obtained, so it is preferred. On the other hand, in Examples 3, 4, and 6, the second reflective film 44 has a configuration without the fifth side surface 44D (a configuration without generating a barb), and even with such a configuration, the occurrence of display unevenness is fully suppressed.

[0066] As described above, the color filter substrate 20 of the present embodiment includes a green color filter (first color filter) 29G, a blue color filter (second color filter) 29B having a color different from that of the green color filter 29G, and a light shielding portion 40 disposed at a boundary between the green color filter 29G and the blue color filter 29B on the lower layer side of the green color filter 29G and the blue color filter 29B. The light shielding portion 40 includes a first transparent film 41, a first reflective film 42 disposed on the upper layer side of the first transparent film 41, and a second transparent film 42 disposed on the upper layer side of the first reflective film 42. The second reflective film 43 is provided on the upper side of the second transparent film 43 and has a thickness greater than that of the first reflective film 42. The first transparent film 41 has: a first bottom surface 41A located on the opposite side of the first reflective film 42, and a first side surface 41B forming an acute angle θ1 with the first bottom surface 41A. The second reflective film 44 has: a second bottom surface 44A connected to an upper surface 43C of the second transparent film 43 and parallel to the first bottom surface 41A; and a second side surface 44B forming an acute angle θ2 with the second bottom surface 44A.

[0067] The light that alternates between the green filter 29G and the blue filter 29B is blocked by the light blocking portion 40 located at the boundary between the green filter 29G and the blue filter 29B. This makes it difficult for color mixture to occur.

[0068] The external light incident on the light shielding portion 40 from the lower layer side passes through the first transmission film 41 and reaches the first reflection film 42. Since the film thickness of the first reflection film 42 is smaller than that of the second reflection film 44, it does not reflect all the light, but can reflect a predetermined amount of light and transmit a predetermined amount of light. The light that has passed through the first reflection film 42 passes through the second transmission film 43 and reaches the second reflection film 44. Since the film thickness of the second reflection film 44 is larger than that of the first reflection film 42, it can reflect almost all the light. The reflected light of the first reflection film 42 and the reflected light of the second reflection film 44 are offset to a certain extent based on the interference conditions corresponding to the refractive indexes and film thicknesses of the first transmission film 41 and the second transmission film 43. Thus, the reflection of the external light by the light shielding portion 40 can be suppressed. In addition, the reflected light of the second reflection film 44 is re-reflected in a manner that a predetermined amount is returned to the second reflection film 44 side by the first reflection film 42, thereby suppressing the light from being emitted to the lower layer side from the first transmission film 41.

[0069] Thus, the light shielding portion 40 is formed into a stacked structure of the first transmission film 41, the first reflection film 42, the second transmission film 43, and the second reflection film 44. Therefore, compared with the case where the light shielding portion 40 is formed of a resin material as in the past, the exposure accuracy of the exposure device used when the light shielding portion 40 is patterned in the manufacturing process can be sufficiently improved. Therefore, it is suitable to make the light shielding portion 40 finer. In addition, since the first side surface 41B of the first transmission film 41 forms an acute first angle θ1 with the first bottom surface 41A, and the second side surface 44B of the second reflection film 44 forms an acute second angle θ2 with the second bottom surface 44A, when the color filters 29G and 29B are formed in the manufacturing process, the wettability of the material of the color filters 29G and 29B near the light shielding portion 40 is good, compared with the case where the first side surface forms an obtuse angle with the first bottom surface 41A and the second side surface forms an obtuse angle with the second bottom surface 44A. Therefore, the material of each color filter 29G, 29B is unlikely to be bounced off near the light shielding portion 40, and thus, each color filter 29G, 29B is unlikely to have an unintended opening.

[0070] Furthermore, the first reflective film 42 includes a third bottom surface 42A in contact with the upper surface 41C of the first transparent film 41 and parallel to the first bottom surface 41A, and a third side surface 42B forming a third angle θ3 with the third bottom surface 42A, and the second transparent film 43 includes a fourth bottom surface 43A in contact with the upper surface 42C of the first reflective film 42 and parallel to the first bottom surface 41A, and a fourth side surface 43B forming a fourth angle θ4 with the fourth bottom surface 43A, and the first reflective film 42 is configured such that the third side surface 42B is not in contact with the first side surface 41B but is in contact with the upper surface 41C of the first transparent film 41. In this way, since the third side surface 42B is inwardly recessed relative to the first side surface 41B, heat transfer from the first reflective film 42 to the first transparent film 41 is reduced compared with a configuration in which the third side surface is in contact with the first side surface 41B. Therefore, in the manufacturing process, the etching device 50 is used to pattern the light shielding portion 40, and when the color filter substrate 20 is supported by the substrate support portion 52 including the intermittent protrusions 52A, it is difficult for the heat dissipation to differ between the portion in contact with the protrusions 52A and the portion not in contact with the protrusions 52A in the color filter substrate 20. As a result, the degree of completion of the light shielding portion 40 is homogenized, and therefore the amount of light transmitted through each color filter 29G, 29B is equalized.

[0071] In addition, the light shielding portion 40 is configured such that the third angle θ3 and the fourth angle θ4 are larger than the first angle θ1. Thus, compared with the case where the third angle and the fourth angle are equal to or smaller than the first angle θ1, the heat transfer from the first reflective film 42 to the first transparent film 41 is reduced. As a result, the degree of completion of the light shielding portion 40 is more uniform.

[0072] In addition, the second reflective film 44 has a fifth side surface 44D, which forms an obtuse angle, that is, a fifth angle θ5, with the second bottom surface 44A and is in contact with the second bottom surface 44A. The second reflective film 44 having the fifth side surface 44D is configured such that a portion of the second reflective film 44 protrudes outward relative to the second transparent film 43. Therefore, compared with the case where the second reflective film does not have the fifth side surface 44D, the heat transfer from the second reflective film 44 to the second transparent film 43 is reduced. As a result, the degree of completion of the light shielding portion 40 is more uniform.

[0073] In addition, the light shielding portion 40 is configured such that the angle formed by the line segment LS connecting the outer end 41D of the first transparent film 41 and the outer end 44E of the second reflective film 44 and the first bottom surface 41A, that is, the sixth angle θ6, is within the range of 70° or more and 90° or less. In this way, the angle formed by the above-mentioned line segment LS and the first bottom surface 41A, that is, the sixth angle θ6, is less than 90°, so when each color filter 29G, 29B is formed during the manufacturing process, the wettability of the material of each color filter 29G, 29B near the light shielding portion 40 is good compared to the case where the sixth angle exceeds 90°. As a result, it is less likely that the material of each color filter 29G, 29B is bounced off near the light shielding portion 40, and it is more difficult for an undesired opening to be generated in each color filter 29G, 29B. On the other hand, since the sixth angle θ6 formed by the line segment LS and the first bottom surface 41A is 70° or more, the heat transfer from the second reflective film 44 side to the first transparent film 41 side is reduced compared to the case where the sixth angle is an angle less than 70°. Therefore, in the manufacturing process, when the etching device 50 is used to pattern the light shielding portion 40, and when the color filter substrate 20 is supported by the substrate support portion 52 including the intermittent protrusions 52A, it is difficult to generate a difference in heat dissipation between the portion in contact with the protrusions 52A and the portion not in contact with the protrusions 52A in the color filter substrate 20. As a result, the degree of completion of the light shielding portion 40 is homogenized, and therefore, the amount of transmitted light transmitted through each color filter 29G, 29B is equalized.

[0074] In addition, the liquid crystal display device (display device) 10 of this embodiment includes: the color filter substrate 20 described above; and an array substrate 21 arranged in a manner opposite to the color filter substrate 20. According to such a liquid crystal display device 10, the light shielding portion 40 provided in the color filter substrate 20 is miniaturized, which is preferable in terms of achieving high-definition display images.

[0075] Furthermore, in the manufacturing method of the color filter substrate 20 of the present embodiment, a first transmission film 41 is formed on a glass substrate (substrate) 20GS, a first reflection film 42 is formed on the upper layer side of the first transmission film 41, a second transmission film 43 is formed on the upper layer side of the first reflection film 42, a second reflection film 44 is formed on the upper layer side of the second transmission film 43, the film thickness of the second reflection film 44 is greater than the film thickness of the first reflection film 42, a photosensitive resist film R is formed on the upper layer side of the second reflection film 44, the resist film R is exposed and developed, and at least the second reflection film 44 is photolithographically exposed using the resist film R as a mask. The first etching is performed, and the second etching is performed on the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 at a slower etching speed than the first etching, thereby forming the light shielding portion 40 composed of the first transparent film 41, the first reflective film 42, the second transparent film 43, and the second reflective film 44, forming the green color filter 29G whose end is arranged on the upper layer side of the light shielding portion 40, and forming the blue color filter 29B which is different in color from the green color filter 29G, whose end is located on the upper layer side of the light shielding portion 40, and adjacent to the green color filter 29G.

[0076] After the first transmission film 41, the first reflection film 42, the second transmission film 43, the second reflection film 44, and the resist film R are sequentially formed, the resist film R is exposed and developed. When the first etching is performed through the patterned resist film R, at least the portion of the second reflection film 44 that is not covered by the resist film R is removed. Next, when the second etching is performed through the resist film R, the portion of the second reflection film 44, the second transmission film 43, the first reflection film 42, and the first transmission film 41 that is not covered by the resist film R is removed, thereby forming the light shielding portion 40. Then, when the green color filter 29G and the blue color filter 29B are formed, the light shielding portion 40 is arranged to be located at the boundary between the green color filter 29G and the blue color filter 29B.

[0077] The first etching and the second etching are described in detail. If the first etching, which is faster than the second etching, is performed first, the side surface of the second reflective film 44 is processed to form a large angle close to 90° with the bottom surface. Then, after the second etching, which is slower than the first etching, is performed, since the resist film R gradually retreats, the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are etched at the same time, so that the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are processed so that the angles formed by the side surfaces 41B to 44B and the bottom surfaces 41A to 44A are smaller than the angles of the side surfaces processed when only the first etching is performed without the second etching. By the above, the angle formed by the side surface, i.e., the first side surface 41B, and the bottom surface, i.e., the first bottom surface 41A, i.e., the first angle θ1, and the angle formed by the side surface, i.e., the second side surface 44B, and the bottom surface, i.e., the second bottom surface 44A, i.e., the second angle θ2, can be made acute angles. Furthermore, compared with the case where only the first etching is performed, the retreat of the first transparent film 41 and the second transparent film 43 can be suppressed, so that a large undercut is less likely to be generated in the light shielding portion 40 .

[0078] The light shielding portion 40 formed in this way is formed into a stacked structure of the first transmission film 41, the first reflection film 42, the second transmission film 43, and the second reflection film 44. Therefore, compared with the case where the light shielding portion 40 is formed of a resin material as in the past, the exposure accuracy of the exposure device used when patterning the light shielding portion 40 in the manufacturing process can be sufficiently improved. Therefore, it is suitable to make the light shielding portion 40 finer. Furthermore, since at least the first angle θ1 formed by the side surface, i.e., the first side surface 41B, and the bottom surface, i.e., the first bottom surface 41A, in the first transmission film 41, and the second angle θ2 formed by the side surface, i.e., the second side surface 44B, and the bottom surface, i.e., the second bottom surface 44A, in the second reflection film 44, are both acute angles, the wettability of the material of each color filter 29G, 29B near the light shielding portion 40 is good when forming each color filter 29G, 29B during the manufacturing process, compared with the case where the first angle formed by the first side surface, i.e., the first bottom surface 41A, and the second angle formed by the second side surface, i.e., the second bottom surface 44A, in the second reflection film 44, are both obtuse angles, the material of each color filter 29G, 29B near the light shielding portion 40 is less likely to be bounced off, and thus each color filter 29G, 29B is less likely to have an undesired opening.

[0079] In addition, at least SF6 gas is used in the first etching, and at least CF4 gas and O2 gas are used in the second etching. In this way, at least SF6 gas is used in the first etching, and at least CF4 gas and O2 gas are used in the second etching, thereby accelerating the etching speed in the first etching and slowing down the etching speed in the second etching.

[0080] In addition, in the first etching and the second etching, an etching device 50 having a vacuum chamber 51 and a substrate support 52 is used. The vacuum chamber 51 accommodates the glass substrate 20GS, and the substrate support 52 is arranged in the vacuum chamber 51 and has a plurality of protrusions 52A. The plurality of protrusions 52A are arranged at intervals in the main surface of the glass substrate 20GS and support the glass substrate 20GS. When performing the first etching and the second etching, the glass substrate 20GS accommodated in the vacuum chamber 51 of the etching device 50 is supported by the plurality of protrusions 52A provided by the substrate support 52. Compared with the case where the substrate support is assumed to be in surface contact with the main surface of the glass substrate 20GS, the contact area between the substrate support 52 and the glass substrate 20GS becomes smaller. Therefore, even if the material of the first reflective film 42 or the second reflective film 44 is scattered and attached to the surface of the substrate support 52 as the first etching or the second etching is performed, it is difficult to cause etching defects due to the attached material. On the other hand, the glass substrate 20GS has a portion in contact with the protrusion 52A and a portion not in contact with the protrusion 52A, so there is a concern that these heat dissipation properties may differ. In this regard, since the second etching is performed after the first etching whose etching speed is faster than the second etching, the second etching is performed at a slower etching speed than the first etching, so that the angle between the side surface and the bottom surface of the first transparent film 41 and the angle between the side surface and the bottom surface of the second reflective film 44 can be increased compared to the case where only the second etching is performed. Therefore, the heat transfer from the second reflective film 44 side to the first transparent film 41 side is reduced, so that the difference in heat dissipation properties between the portion in contact with the protrusion 52A and the portion not in contact with the protrusion 52A in the glass substrate 20GS can be alleviated. As a result, the degree of completion of the light shielding portion 40 is homogenized, and therefore the amount of transmitted light transmitted through each color filter 29G, 29B is equalized.

[0081] <Other Implementation Methods> The technology disclosed in this specification is not limited to the embodiments illustrated in the above description and drawings, and for example, the following embodiments are also included in the technical scope.

[0082] (1) The specific numerical values ​​of the angles θ1 to θ6 in the light shielding portion 40 may be changed as appropriate in addition to the above. In this case, the sixth angle θ6 is preferably set to a range of 70° to 90°, but is not necessarily limited thereto.

[0083] (2) The light shielding portion 40 is Figure 7 and Figure 8 In addition to the above-mentioned structure, the second reflective film 44 may have no fifth side surface 44D (no barb) as in Examples 3, 4, and 6 of Comparative Experiment 1. That is, the first reflective film 42 may have a structure in which the third side surface 42B is in contact with the first side surface 41B.

[0084] (3) The light shielding portion 40 is Figure 7 and Figure 8 In addition to the configuration shown, the third angle θ3 and the fourth angle θ4 in the first reflective film 42 and the second transparent film 43 may be greater than 90°. In this case, the third side surface 42B and the fourth side surface 43B in the first reflective film 42 and the second transparent film 43 may be parallel to the fifth side surface 44D, or may be intersecting with the fifth side surface 44D.

[0085] (4) The material of the reflective films 42 and 44 constituting the light shielding portion 40 may be changed to, for example, Mo (molybdenum), an alloy of Mo and W, that is, MoW (molybdenum tungsten), Al (aluminum), Cu (copper), or the like.

[0086] (5) The light-transmitting resin material of each of the transparent films 41 and 43 constituting the light-shielding portion 40 may be changed to, for example, SiO 2 (silicon oxide) or the like.

[0087] (6) The material of each of the transparent films 41 and 43 constituting the light shielding portion 40 may be a material other than an insulating material, and may be a transparent electrode material such as ITO (Indium Tin Oxide).

[0088] (7) The specific numerical values ​​of the film thicknesses of the films 41 to 44 constituting the light shielding portion 40 can be changed as appropriate.

[0089] (8) The specific numerical value of the refractive index of the material of each of the transparent films 41 and 43 constituting the light shielding portion 40 can be changed as appropriate.

[0090] (9) The thickness of the first transparent film 41 constituting the light shielding portion 40 may be smaller than the thickness of the second transparent film 43. Alternatively, the first transparent film 41 and the second transparent film 43 may have different refractive indices and the same film thickness.

[0091] (10) Another film may be present between the glass substrate 20GS constituting the color filter substrate 20 and the first transparent film 41 constituting the light shielding portion 40. That is, the first bottom surface 41A of the first transparent film 41 may not be in direct contact with the inner surface of the glass substrate 20GS.

[0092] (11) The specific types of etching gases used in the first etching and the second etching can be changed as appropriate in addition to those described above.

[0093] (12) In the etching device 50, the substrate support portion 52 may not have the protrusion 52A, and the main surface opposite to the glass substrate 20GS may be flat. Even in this case, if dirt or the like is generated on the main surface of the substrate support portion 52, there will be a portion of the glass substrate 20GS that contacts the dirt or the like and a portion that does not contact the dirt or the like, and these heat dissipation properties will differ. Therefore, there may be a difference in the width dimension of the light shielding portion 40, and the display unevenness reflecting the dirt or the like may be visually recognized, but the occurrence of such an undesirable situation can be suppressed. In addition, a grid-shaped slit (groove) for filling a cooling gas (for example, He (helium) gas, etc.) may be formed on the main surface of the substrate support portion 52 that contacts the glass substrate 20GS. In this case, the glass substrate 20GS has portions in contact with the main surface of the substrate support portion 52 and portions not in contact with the main surface of the substrate support portion 52 (portions overlapping with the grid-shaped slits), which have differences in heat dissipation. Therefore, there is a possibility that a difference in the width dimension of the shading portion 40 may occur, resulting in visually recognizable display unevenness reflecting the slits. However, the occurrence of such an undesirable situation can be suppressed.

[0094] (13) The etching device 50 may be a dry etching device using a method other than the inductively coupled plasma method.

[0095] (14) The light shielding portions 40 may be arranged in a grid pattern in a plan view so as to overlap with both the gate wiring 25 and the source wiring 26 .

[0096] (15) An overcoat film may be provided on the color filter substrate 20 for planarization.

[0097] (16) The number of colors of the color filter 29 may be 4 or more. The additional color filter 29 may be a yellow color filter that exhibits yellow, a transparent color filter that transmits light in the entire wavelength range, or the like.

[0098] (17) A source driver may be mounted on the array substrate 21 instead of the first circuit portion 14A.

[0099] (18) A source driver may be mounted on the flexible substrate 13 instead of the first circuit portion 14A.

[0100] (19) A gate driver may be mounted on the array substrate 21 instead of the second circuit portion 14B.

[0101] (20) The upper electrode of the pixel electrode 28 and the common electrode 30, that is, the "upper electrode", may be the pixel electrode 28, and the lower electrode, that is, the "lower electrode", may be the common electrode 30. In this case, the pixel electrode 28 as the "upper electrode" is provided with a slit.

[0102] (21) The display mode of the liquid crystal panel 11 may be a VA mode, an IPS mode, or the like in addition to the FFS mode.

[0103] (22) The liquid crystal panel 11 may be a reflective type or a semi-transmissive type in addition to a transmissive type. When the liquid crystal panel 11 is a reflective type, the backlight device 12 can be omitted.

[0104] (23) In addition to the head mounted display 10HMD, the present invention can also be applied to a head mounted display, a projector, etc. as a device that uses a lens or the like to magnify and display an image displayed on the liquid crystal panel 11. In addition, the present invention can also be applied to a display device that does not have a magnified display function (a television receiver, a tablet terminal, a smartphone, etc.). Description of Reference Numerals

[0105] 10…liquid crystal display device (display device), 20…color filter substrate, 20GS…glass substrate (substrate), 21…array substrate, 29B…blue color filter (second color filter), 29G…green color filter (first color filter), 40…light shielding portion, 41…first transmission film, 41A…first bottom surface, 41B…first side surface, 41C…upper surface, 41D…outer end, 42…first reflection film, 42A…third bottom surface, 42B…third side surface, 42C…upper surface, 43…third two transmitting films, 43A…the fourth bottom surface, 43B…the fourth side surface, 43C…the upper surface, 44…the second reflecting film, 44A…the second bottom surface, 44B…the second side surface, 44D…the fifth side surface, 44E…the outer end, 50…the etching device, 51…the vacuum chamber, 52…the substrate supporting portion, 52A…the protrusion, LS…the line segment, R…the anti-etching film, θ1…the first angle, θ2…the second angle, θ3…the third angle, θ4…the fourth angle, θ5…the fifth angle, θ6…the sixth angle (angle).

Claims

1. A color filter substrate, characterized in that: It includes: a first color filter; a second color filter having a different color than the first color filter; as well as a light shielding portion disposed at a boundary between the first color filter and the second color filter on a lower layer side of the first color filter and the second color filter, The light shielding portion has: a first transmission film; a first reflective film disposed on an upper layer side of the first transmissive film; a second transmissive film disposed on an upper layer side of the first reflective film; as well as a second reflective film disposed on an upper layer side of the second transmissive film and having a greater film thickness than the first reflective film; The first transmission film has: A first bottom surface located on a side opposite to the first reflective film side; and A first side surface forms an acute angle, namely a first angle, with the first bottom surface, The second reflective film has: a second bottom surface, which is in contact with the upper surface of the second transmissive film and is parallel to the first bottom surface; and The second side surface forms an acute angle, ie, a second angle, with the second bottom surface.

2. The color filter substrate according to claim 1, characterized in that The first reflective film has: a third bottom surface, which is in contact with the upper surface of the first transmissive film and is parallel to the first bottom surface; and a third side surface, which forms a third angle with the third bottom surface, The second transmission film has: a fourth bottom surface, which is connected to the upper surface of the first reflective film and is parallel to the first bottom surface; and a fourth side surface, which forms a fourth angle with the fourth bottom surface, The first reflective film is configured such that the third side surface is not in contact with the first side surface but is in contact with the upper surface of the first transparent film.

3. The color filter substrate according to claim 2, characterized in that: The light shielding portion is configured such that the third angle and the fourth angle are larger than the first angle.

4. The color filter substrate according to claim 2 or 3, characterized in that: The second reflective film has a fifth side surface, the fifth side surface forms an obtuse angle, ie, a fifth angle, with the second bottom surface, and is connected to the second bottom surface.

5. The color filter substrate according to any one of claims 1 to 3, characterized in that: The light shielding portion is configured such that an angle formed by a line segment connecting an outer end of the first transparent film and an outer end of the second reflective film and the first bottom surface is within a range of 70° to 90°.

6. A display device, characterized in that: It includes: The color filter substrate according to any one of claims 1 to 3; as well as The array substrate is arranged opposite to the color filter substrate.

7. A method for manufacturing a color filter substrate, characterized in that: The method for manufacturing the color filter substrate comprises: forming a first transmission film on a substrate; forming a first reflective film on the upper layer side of the first transmissive film; forming a second transmissive film on the upper layer side of the first reflective film; forming a second reflective film on the upper layer side of the second transmissive film, wherein the thickness of the second reflective film is greater than the thickness of the first reflective film; forming a photosensitive resist film on the upper layer side of the second reflective film; exposing and developing the resist film; using the resist film as a mask, performing a first etching process of etching at least the second reflective film; By using the resist film as a mask, performing a second etching process to etch the second reflective film, the second transmissive film, the first reflective film, and the first transmissive film at a slower etching rate than the first etching process, thereby forming a light shielding portion composed of the first transmissive film, the first reflective film, the second transmissive film, and the second reflective film; forming a first color filter whose end portion is arranged on the upper layer side of the light shielding portion; and A second color filter is formed which has a color different from that of the first color filter and has an end portion located on the upper layer side of the light shielding portion and adjacent to the first color filter.

8. The method for manufacturing a color filter substrate according to claim 7, wherein: In the first etching, at least SF6 gas is used, and in the second etching, at least CF4 gas and O2 gas are used.

9. The method for manufacturing a color filter substrate according to claim 7 or 8, characterized in that: An etching device is used in the first etching and the second etching, and the etching device has: a vacuum chamber accommodating the substrate; as well as The substrate support portion is disposed in the vacuum chamber and has a plurality of protrusions arranged at intervals in the main surface of the substrate to support the substrate.

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