Heat dissipation device, energy supply system and power utilization device

Abstract

The invention relates to the technical field of heat exchange, and relates to a heat dissipation device, an energy supply system and a power utilization device. The heat dissipation device comprises an evaporation assembly, a liquid storage assembly and a cooling assembly. The evaporation assembly comprises an evaporator and a wick; an inner cavity of the liquid absorption core is used for containing a liquid heat dissipation medium, and the liquid heat dissipation medium is subjected to phase change in the liquid absorption core so as to be converted into a gas heat dissipation medium; the liquid storage assembly is connected to an inner cavity of the liquid absorption core and used for storing a liquid heat dissipation medium and conveying the liquid heat dissipation medium to the liquid absorption core; the cooling assembly is connected to the evaporator and the liquid storage assembly through conveying pipelines and used for cooling the gaseous heat dissipation medium to form a liquid heat dissipation medium. According to the heat dissipation device, the conveying pipeline is arranged to connect the evaporator and the cooling assembly, the heat dissipation device can be prevented from generating condensate water in the heat exchange process to affect heat sources such as a battery, and meanwhile efficient heat dissipation can be achieved through cooperation of the phase-changeable heat dissipation medium and the evaporation assembly.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and in particular to a heat dissipation device, an energy supply system and an electrical device. Background Art

[0002] The temperature of the battery directly affects its capacity and service life. Excessively high temperature can also cause thermal runaway, leading to battery fire or explosion.

[0003] In the prior art, air cooling or liquid cooling is usually used to dissipate heat from the battery. The heat dissipation capacity of traditional air cooling is limited by the low thermal conductivity of air, and the heat dissipation performance is limited. In addition, the emerging direct air-conditioning solution in recent years will produce unavoidable dew point problems, which are easy to corrode the battery and increase the risk of short circuits. The liquid cooling solution has improved heat dissipation performance compared to the air cooling solution, but during the heat dissipation process, additional humidity control is required to avoid condensation water, which may cause corrosion and short circuit problems in the battery. The reliance on water pumps reduces the reliability of the system and cannot meet the needs of higher rate charging and discharging.

[0004] Therefore, it is necessary to make improvements to the above problems in order to change the current situation. Summary of the invention

[0005] The present application provides a heat dissipation device, an energy supply system and an electrical device, which are used to solve the problems of poor heat dissipation effect and low safety performance of batteries in the prior art.

[0006] A first aspect of the present application provides a heat dissipation device, comprising:

[0007] The evaporation component comprises an evaporator and a liquid wick, wherein the liquid wick is arranged in the evaporator; the inner cavity of the liquid wick is used to accommodate a liquid heat dissipation medium, and the liquid heat dissipation medium undergoes a phase change in the liquid wick to be converted into a gaseous heat dissipation medium;

[0008] A liquid storage component connected to the inner cavity of the liquid absorbent core, the liquid storage component is used to store the liquid heat dissipation medium and transport it to the liquid absorbent core; and

[0009] A cooling component is connected to the evaporator and the liquid storage component through a delivery pipeline, and the cooling component is used to cool the gaseous heat dissipation medium to form the liquid heat dissipation medium.

[0010] In one possible implementation, the pore size of the absorbent core close to the outer layer is smaller than the pore size close to the inner cavity of the absorbent core; and / or the thermal conductivity of the absorbent core close to the outer layer is greater than the thermal conductivity close to the inner cavity of the absorbent core.

[0011] In a possible implementation, the liquid absorbent core includes a first liquid absorbent core and a second liquid absorbent core, the first liquid absorbent core is located outside the second liquid absorbent core, and the inner cavity of the second liquid absorbent core is used to accommodate the liquid heat dissipation medium;

[0012] Wherein, the pore size of the first absorbent core is smaller than the pore size of the second absorbent core; and / or the thermal conductivity of the first absorbent core is greater than the thermal conductivity of the second absorbent core.

[0013] In one possible implementation, the evaporation component also includes a heat conductor, which is arranged between the liquid wick and the inner wall of the evaporator to form a heat conduction channel, the heat conduction channel is connected to the cooling component, and the heat conduction channel is used to transport the gaseous heat dissipation medium.

[0014] In a possible implementation, the inner cavity of the liquid absorbent core extends along a first direction, the heat conduction channel extends along a second direction, and the first direction and the second direction are arranged at an angle.

[0015] In a possible implementation, there are multiple heat-conducting grooves, and the multiple heat-conducting grooves are arranged in parallel or staggered.

[0016] In a possible implementation, there are multiple heat conducting members.

[0017] In a possible implementation, the heat conducting member and the evaporator are integrally formed; and / or the heat conducting member and the liquid wick are integrally formed.

[0018] In a possible implementation, the evaporation component further includes a first sensor, which is connected to the evaporator and is used to obtain a temperature signal inside the evaporator.

[0019] In one possible implementation, the liquid storage component includes a liquid storage part and a temperature control part, the liquid storage part is connected to the liquid pipeline between the inner cavity of the liquid wick and the cooling component, and the liquid storage part is used to store the liquid heat dissipation medium, and the temperature control part is connected to the liquid storage part and is used to adjust the temperature of the liquid heat dissipation medium.

[0020] In one possible implementation, the liquid storage component further includes a pressure relief valve, and the pressure relief valve is disposed on a liquid pipeline between the liquid storage component and the cooling component.

[0021] In a possible implementation, the liquid storage component further includes a second sensor, the second sensor is connected to the liquid storage component, and the second sensor is used to obtain a temperature signal and / or a pressure signal in the liquid storage component.

[0022] In one possible implementation, the cooling component includes a heat sink, which is respectively connected to the evaporator and the liquid storage component, and is used to cool the gaseous heat dissipation medium output by the evaporator to condense and form the liquid heat dissipation medium.

[0023] In one possible implementation, the cooling component further includes a subcooler, which is disposed in a liquid pipeline between the evaporator and the liquid storage component, and is used to cool the liquid heat dissipation medium in the liquid pipeline.

[0024] A second aspect of the present application provides an energy supply system, comprising:

[0025] Batteries; and

[0026] In the heat dissipation device as described in any one of the above items, the evaporator of the heat dissipation device is attached to the battery, the cooling component is arranged at a distance from the battery, and the heat dissipation device is used to cool the battery.

[0027] A third aspect of the present application provides an electrical device, comprising an energy supply system as described in any one of the above, or a heat dissipation device as described in any one of the above, wherein the heat dissipation device is used to cool a heat source in the electrical device or the energy supply system.

[0028] Implementing the embodiments of the present application has the following beneficial effects:

[0029] When using the heat dissipation device of this embodiment, the evaporator is first brought into contact with the heat source. Since the cooling component is connected to the evaporator through a conveying pipeline, the cooling component and the heat source can be spaced apart. After the liquid heat dissipation medium in the liquid storage component is conveyed to the inner cavity of the liquid absorbent core, the liquid absorbent core can absorb the liquid heat dissipation medium. The evaporator absorbs external heat and conducts it to the liquid absorbent core. As a result, the liquid heat dissipation medium in the liquid absorbent core can undergo a phase change and form a gaseous heat dissipation medium to realize the heat absorption function of the heat absorption and heat dissipation device. After being output from the evaporator, the gaseous heat dissipation medium is cooled and condensed by the cooling component to re-form a liquid heat dissipation medium. The liquid heat dissipation medium is then re-transported back to the liquid storage component.

[0030] In the heat dissipation device of this embodiment, by setting a delivery pipeline to connect the evaporator and the cooling component, it is possible to prevent the heat dissipation device from generating condensed water during the heat exchange process and affecting heat sources such as batteries. At the same time, by using a phase-changeable heat dissipation medium in conjunction with the evaporation component, efficient heat dissipation can be achieved. In addition, compared with traditional heat dissipation solutions such as air cooling and liquid cooling, the heat dissipation device of this embodiment can achieve self-circulation heat dissipation without external power after forming a thermal cycle, and its reliability is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 A schematic diagram showing the principle of a heat dissipation device in an embodiment of the present invention is shown;

[0033] Figure 2 A schematic cross-sectional view of an evaporation assembly in an embodiment of the present invention is shown;

[0034] Figure 3 Shows Figure 2 Sectional view along line AA;

[0035] Figure 4 Shows Figure 2 Sectional view along line BB;

[0036] Figure 5 A schematic cross-sectional view of an evaporation assembly in another embodiment of the present invention is shown;

[0037] Reference numerals:

[0038] 10- heat dissipation device;

[0039] 100-evaporation assembly; 110-evaporator; 111-steam chamber; 112-liquid pipeline; 113-gas pipeline; 121-first liquid wick; 122-second liquid wick; 130-heat conducting member; 131-heat conducting channel; 140-first sensor;

[0040] 200 - liquid storage component; 210 - liquid storage part; 220 - temperature control part; 230 - pressure relief valve; 240 - second sensor; 300 - cooling component; 310 - heat sink; 320 - subcooler. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0042] With the development of electric vehicles and large-scale energy storage systems, the charging and discharging capabilities of power and energy storage batteries are increasing, especially the high-rate charging and discharging current reaches hundreds of amperes, which makes the thermal effect of the battery during operation significant. The temperature of the battery directly affects its capacity and service life. Excessive temperature can also cause thermal runaway, which can lead to battery fire or explosion.

[0043] In order to solve the problem of battery heat dissipation, air cooling and liquid cooling are usually used in the prior art to dissipate heat from the battery. Air cooling usually relies on the flow of air to remove heat, but due to the relatively low thermal conductivity of air, this passive heat dissipation method often shows its insufficient heat dissipation capacity when facing high-power batteries. In addition, although the air-conditioning direct cooling scheme that introduces phase change working fluid into the battery package can effectively improve the heat dissipation effect, it inevitably brings about the dew point problem. In a high humidity environment, moisture will condense inside the battery pack, thereby increasing the risk of battery corrosion, further increasing the risk of short circuits, and placing high demands on the sealing of the battery package, affecting the safety and reliability of the battery.

[0044] The liquid cooling solution has improved heat dissipation performance compared to the air cooling solution. In the liquid cooling solution, the fluid mainly exchanges heat with the air conditioner under the drive of a pump to obtain cold air and then enters the pipes arranged on the battery pack to take away the heat. The pipe arrangement of this solution is difficult to cover the entire battery pack, the heat transfer area is limited and it is very dependent on the performance of driving devices such as liquid pumps. In addition, bringing cold air into the battery pack will cause condensation, which will also cause corrosion and short circuit problems in the battery. Therefore, in order to strictly control the dew point, a series of related devices such as dehumidifiers need to be introduced, which not only reduces the overall reliability of the cooling system, but also increases manufacturing costs.

[0045] For this, see Figures 1 to 5 As shown, an embodiment of the present invention provides a heat dissipation device 10, which includes an evaporation component 100, a liquid storage component 200 and a cooling component 300; the evaporation component 100 includes an evaporator 110 and a liquid wick, and the liquid wick is arranged in the evaporator 110; the inner cavity of the liquid wick is used to accommodate a liquid heat dissipation medium, and the liquid heat dissipation medium undergoes a phase change in the liquid wick to be converted into a gaseous heat dissipation medium; the liquid storage component 200 is connected to the inner cavity of the liquid wick, and the liquid storage component 200 is used to store the liquid heat dissipation medium and transport it to the liquid wick; the cooling component 300 is respectively connected to the evaporator 110 and the liquid storage component 200 through a transport pipeline, and the cooling component 300 is used to cool the gaseous heat dissipation medium to form a liquid heat dissipation medium.

[0046] When using the heat dissipation device 10 of the present embodiment, the evaporator 110 is first brought into contact with the heat source. Since the cooling component 300 is connected to the evaporator 110 through a conveying pipe, the cooling component 300 and the heat source can be spaced apart. After the liquid heat dissipation medium in the liquid storage component 200 is transported to the inner cavity of the liquid absorbent core, the liquid absorbent core can absorb the liquid heat dissipation medium. The evaporator 110 absorbs external heat and conducts it to the liquid absorbent core. As a result, the liquid heat dissipation medium in the liquid absorbent core can undergo a phase change and form a gaseous heat dissipation medium to realize the heat absorption function of the heat absorption and heat dissipation device 10. After the gaseous heat dissipation medium is output from the evaporator 110, it is cooled and condensed by the cooling component 300 to re-form a liquid heat dissipation medium. The liquid heat dissipation medium is then transported back to the liquid storage component 200, thereby forming a stable thermodynamic cycle state.

[0047] In the heat dissipation device 10 of the present embodiment, by setting a delivery pipeline to connect the evaporator 110 and the cooling component 300, it is possible to prevent the heat dissipation device 10 from generating condensed water during the heat exchange process to affect heat sources such as batteries, and at the same time, by using a phase-changeable heat dissipation medium in conjunction with the evaporation component 100, efficient heat dissipation can be achieved. In addition, compared to traditional heat dissipation solutions such as air cooling and liquid cooling, the heat dissipation device 10 of the present embodiment can achieve self-circulation heat dissipation without external power after forming a thermal cycle, and its reliability is also improved.

[0048] By setting the evaporator 110 and the cooling component 300 separately and connecting them through the liquid pipeline 112 and the gas pipeline 113 respectively, the heat dissipation device 10 does not need to release cold energy at a heat source such as a battery pack, but transfers heat to a location far away from the heat source for heat dissipation. When the heat dissipation device 10 is connected to multiple heat sources, the cooling components 300 in multiple heat dissipation devices 10 can also be concentrated to dissipate heat, so as to improve the heat dissipation effect and reduce the application cost of the overall equipment. At the same time, since the cooling component 300 is far away from the heat source, there is no need to worry about the dew point problem in the solution of the heat dissipation device 10 of this embodiment, and the heat dissipation device 10 no longer relies on additional pumps or dehumidifiers. The reliability of the heat dissipation device 10 will not be affected by external devices, and the temperature of heat sources such as battery packs can be actively controlled to maintain a constant temperature. The gas-liquid dual-channel design is adopted in the evaporator 110, which can effectively improve the temperature uniformity and have higher reliability, heat transfer capacity and heat buffer capacity.

[0049] In addition, in the case of thermal runaway of a heat source, the heat dissipation device 10 of this embodiment uses a phase change medium for heat exchange, and thus has a higher latent heat capacity than conventional air cooling and liquid cooling solutions. Therefore, the heat dissipation device 10 can effectively buffer short-term, massive heat release, thereby reducing the risk of thermal runaway of the heat source.

[0050] Specifically, see Figure 1As shown, the operating principle of the heat dissipation device 10 in this embodiment is as follows: according to the temperature conditions required by the heat source such as the battery pack, the liquid storage component 200 is heated or cooled to set the corresponding temperature value and pressure value for the liquid storage component 200. At this time, the heat dissipation medium in the liquid storage component 200 is in a saturated state of gas-liquid two-phases. After the shell of the evaporator 110 attached to or in contact with the heat source absorbs the heat from the heat source, the heat is transferred to the heat conductive member 130. When the heat reaches the phase change temperature of the liquid evaporation of the liquid absorbent core, the liquid heat dissipation medium in the inner cavity of the liquid absorbent core can form a gaseous heat dissipation medium at the interface between the liquid absorbent core and the heat conductive channel 131. At this time, a meniscus is formed at the interface between the gaseous heat dissipation medium and the liquid heat dissipation medium, and under the suction action of the meniscus, the heat dissipation medium can be transported from the liquid heat dissipation medium to the gaseous heat dissipation medium, and the liquid heat dissipation medium in the inner cavity of the liquid absorbent core is sucked into the liquid absorbent core to ensure the continuous supply of the heat dissipation medium. As the amount of heat provided by the evaporator 110 to the wick increases, the liquid heat dissipation medium in the inner cavity of the wick begins to evaporate, so that the gaseous heat dissipation medium forms saturated steam. The saturated steam gradually becomes superheated steam when exchanging heat with the heat conducting member 130. This process increases the thermal energy of the heat dissipation medium. The superheated steam in the heat conducting channel 131 flows to the cooling component 300 through the gas pipeline 113. At the cooling component 300, the steam-type gaseous heat dissipation medium is cooled and condensed into a liquid heat dissipation medium by phase change, and obtains a certain degree of supercooling to adapt to the circulation of the heat dissipation medium. The condensed liquid heat dissipation medium re-enters the liquid storage component 200. In the liquid storage component 200, due to the temperature difference between the inside and the outside, the liquid storage component 200 can absorb a part of the heat leakage from the evaporator 110 to keep the heat dissipation medium in a saturated two-phase state. With this arrangement, the heat dissipation device 10 can form a thermodynamic cycle by itself and realize heat exchange during the circulation of the heat dissipation medium.

[0051] It should be noted that in the heat dissipation device 10 of the present embodiment, the meniscus (or capillary meniscus) is formed by the liquid-gas interface inside the capillary structure, and usually appears in the wick or capillary channel in the evaporator 110. In the evaporator 110, after the liquid heat dissipation medium absorbs the heat from the heat source, it begins to evaporate and converts into steam. The formation of steam causes a meniscus to form on the surface of the liquid. In the structural design of the wick, there are usually small capillary channels or pores inside it. These capillary channels provide a flow path for the liquid. When the liquid evaporates and forms steam, the capillary action of the liquid in the capillary structure prompts it to move upward, and a meniscus is formed while converting into steam. In addition, in the meniscus, the surface tension of the liquid causes the curved surface of the liquid to form a shape concave toward the steam. That is to say, if observed from the side, the meniscus is a concave curve, with the liquid located in the center (bottom) and the gas located outside (above). Due to the surface tension between the liquid and the gas, the interface between the steam (gas phase) and the liquid (liquid phase) forms a stable meniscus. This shape is formed spontaneously by the liquid in order to minimize the surface energy. In the evaporation component 100, the formation of the meniscus is crucial for the capillary action, which can effectively drive the reflux and circulation of the liquid, ensure that the heat is effectively transferred from the evaporation component 100 to the cooling component 300, and achieve efficient heat dissipation of the system.

[0052] Specifically, the heat dissipation medium of the heat dissipation device 10 is selected based on the operating temperature of the heat source used. The heat dissipation medium includes but is not limited to water, a mixture of ethylene glycol and water, methanol and liquid ammonia. Due to the high heat capacity and high thermal conductivity of water, water can usually be used in the heat dissipation device 10 at 60°C and above; the range of ethylene glycol is between -30°C and 120°C, and it is widely used in automobile heat dissipation and industrial cooling systems in the prior art; methanol is suitable for low-temperature heat dissipation systems, especially for ambient temperatures between -10°C and 80°C. In addition, the use of methanol can effectively avoid corrosion problems caused by moisture; liquid ammonia is usually used in low-temperature refrigeration systems, and the applicable temperature is usually between -30°C and 30°C. Of course, in some embodiments, the heat dissipation medium can also be selected from other materials, which is determined according to the application environment of the heat dissipation device 10, and will not be repeated here. The heat dissipation medium and the pipe wall material should meet compatibility, and the operating temperature range of the heat dissipation medium should be selected in the range with a large slope of the saturation pressure and saturation temperature curve to ensure that the heat dissipation device has good startup. In addition, the pressure change of the heat dissipation medium needs to be within the limit of the material.

[0053] Further, see Figure 2 As shown, the aperture of the wick near the heat-conducting channel 131 is smaller than the aperture of the inner cavity near the wick; and / or the thermal conductivity of the wick near the heat-conducting channel 131 is greater than the thermal conductivity of the inner cavity near the wick.

[0054] In this embodiment, heat enters the evaporator 110 from its outer surface, and is transferred to the wick through the heat conducting member 130. The vapor-type gaseous heat dissipation medium generated after the phase change of the liquid heat dissipation medium in the inner cavity of the wick enters the heat conducting channel 131, and is finally output to the cooling component 300 through the gas pipeline 113. The overall structure of the wick has different effective pore sizes and / or thermal conductivities, wherein the effective pore size of the wick close to the heat source is smaller and / or the thermal conductivity is higher to ensure sufficient capillary pressure head and heating capacity; while the effective pore size of the part close to the inner cavity of the wick is larger and / or the thermal conductivity is lower, thereby reducing the penetration resistance of the liquid and reducing reverse heat leakage. In addition, while the inner layer adopts a larger pore size to reduce the liquid resistance, the inner layer liquid can effectively block the gas from entering the inner cavity of the wick, and the outer wick ensures the realization of capillary performance.

[0055] It should be noted that the lower the thermal conductivity of a material, the greater its ability to hinder heat conduction. This means that when heat passes through this material, the rate of conduction will slow down, thereby reducing the possibility of heat flowing in the opposite direction, avoiding heat loss and causing the liquid in the liquid supply layer to boil, resulting in circulation cessation. Larger pore sizes and high permeability can effectively improve the fluidity of the liquid in the material, which promotes the uniform distribution of the liquid and the rapid absorption and dissipation of external heat, effectively reducing the flow pressure drop loss of the liquid, and significantly improving the heat transfer limit of the entire heat dissipation device.

[0056] Specifically in the present embodiment, the meniscus is usually formed at the interface between the first wick 121 and the heat-conducting groove 131. For the first wick 121 close to the heat source, a small effective pore size and a high thermal conductivity are required, and copper can be selected as the material. Copper has excellent thermal conductivity (about 398W / m·K) and can achieve good capillary action at a smaller pore size. Another optional material is aluminum alloy, such as 6061 or 7075, which has good thermal conductivity (about 150W / m·K), is relatively light and low in cost, and is suitable for applications with medium thermal conduction requirements. Graphite, especially thermally conductive graphite, can also be used for wicks, which can realize small holes and specific pore structures according to design requirements to meet the needs of efficient heat dissipation.

[0057] For the second wick 122 near the inner cavity of the wick, this part should adopt a material with a larger effective pore size, higher permeability and lower thermal conductivity. Aluminum oxide (such as bauxite and aluminum nitride) is a good choice, and its effective pore size is larger, which helps to reduce the penetration resistance of the liquid and is suitable for the liquid supply layer. Although the thermal conductivity of aluminum oxide is relatively low, specific components can be selected according to demand to adjust its thermal conductivity. In addition, some polymer-based composite materials can also be used as applicable materials. Such materials can be designed to have an appropriate pore size and provide excellent permeability, and can enhance thermal conductivity by filling thermal conductive materials (such as thermal conductive silicates). Porous ceramic materials, such as aluminum oxide (Al2O3) or silicon nitride (Si3N4), have a larger porosity, can reduce the penetration resistance of the liquid, and have certain high temperature resistance and mechanical strength, which are suitable for use as liquid supply layer materials. The specific selection of the wick should be based on the consideration of the heat dissipation medium to meet compatibility and good wettability.

[0058] In one embodiment, the inner cavity of the wick extends along a first direction, the heat conducting channel 131 extends along a second direction, and the first direction and the second direction are arranged at an angle.

[0059] See also Figures 2 to 4 As shown, the first direction may be the X direction in the figure, and the second direction may be the Y direction in the figure. Figure 4 As shown, the Y direction indicates a direction perpendicular to the outward direction of the drawing; specifically, the first direction and the second direction can be perpendicular to each other. The vertically arranged heat-conducting groove 131 and the inner cavity of the liquid-wick can help improve the smoothness of the transportation of the liquid heat-dissipating medium and the gaseous heat-dissipating medium, and can effectively prevent the local drying of the liquid-wick, thereby ensuring that the heat-dissipating medium can be evenly distributed in the entire evaporator 110, thereby achieving a stable and efficient heat-dissipating function.

[0060] Specifically, the vertically arranged heat conducting channels 131 and the inner cavity of the liquid wick help to form good convection in different temperature ranges, which can reduce the local isolation of the liquid and avoid uneven evaporation or reflux of the liquid due to temperature differences. At the same time, the dual-channel design can significantly shorten the flow distance between the liquid heat dissipation medium and the gaseous heat dissipation medium, thereby improving the temperature uniformity inside the evaporator 110 and ultimately improving the heat dissipation efficiency.

[0061] Furthermore, there are multiple heat-conducting grooves 131 , and the multiple heat-conducting grooves 131 are arranged in parallel or staggered.

[0062] In this embodiment, a steam chamber 111 may also be provided inside the evaporator 110. The steam chamber 111 provides a centralized convergence area for the heat-conducting grooves 131, so that one end of a plurality of heat-conducting grooves 131 can be simultaneously connected to the steam chamber 111, and connected to the cooling assembly 300 through the steam chamber 111 and the gas pipeline 113. This arrangement not only helps to improve the flow efficiency of the heat dissipation medium, but also ensures that the pressure inside the plurality of heat-conducting grooves 131 is uniform, thereby promoting rapid heat exchange. Specifically, the number of steam chambers 111 may be two, and the two steam chambers 111 are respectively connected to opposite ends of the heat-conducting grooves 131. In some embodiments, the plurality of heat-conducting grooves 131 can effectively increase the contact area between the liquid heat dissipation medium and the gaseous heat dissipation medium liquid by adopting a parallel or staggered arrangement, thereby improving the efficiency of the phase change.

[0063] Specifically, see Figure 1 As shown, the opposite ends of the inner cavity of the liquid wick can be connected to the liquid storage component 200 through at least two liquid pipes 112 to improve the uniformity and efficiency of the liquid heat dissipation medium entering the liquid wick; of course, the heat conduction channel 131 can also be connected to the cooling component 300 through at least two gas pipes 113 respectively to improve the uniformity of the gaseous heat dissipation medium in the evaporator 110 and improve the transportation efficiency of the gaseous heat dissipation medium.

[0064] Furthermore, the evaporation assembly 100 further includes a first sensor 140 , which is connected to the evaporator 110 and is used to obtain a temperature signal inside the evaporator 110 .

[0065] Specifically, the first sensor 140 can use a temperature detection device such as a thermocouple, a thermistor or an infrared sensor to ensure high-precision and real-time temperature monitoring. In the heat dissipation device 10, the temperature at the evaporator 110 is usually high, so it is particularly important to monitor the temperature signal of the evaporator 110. The sensing position of the first sensor 140 in the evaporator 110 is preferably set at the temperature of the meniscus, which is the interface between the liquid and the vapor formed between the first liquid wick 121 and the heat conduction channel 131. By detecting the temperature of the interface of the meniscus, the heat dissipation device 10 can be accurately controlled.

[0066] In this embodiment, the heat sink 10 further includes a control module, and the control module signal is connected to the first sensor 140, the liquid storage component 200 and the cooling component 300. The control module can obtain the temperature of the first sensor 140, and control the liquid storage component 200 and the cooling component 300 according to a preset program, thereby realizing the automatic feedback control function of the heat sink 10 to improve the heat dissipation performance of the heat sink 10. Specifically, the control module can be, but is not limited to, various programmable logic controllers (PLC), STM32 microcontrollers (32-bit microcontrollers with ARM Cortex-M cores), single-chip microcomputers, field programmable gate arrays (FPGA), ARM processors, etc.

[0067] Specifically, the liquid storage component 200 includes a liquid storage part 210 and a temperature control part 220. The liquid storage part 210 can be a closed container for storing liquid heat dissipation medium. The liquid storage part 210 is connected to the liquid pipeline 112 between the inner cavity of the liquid wick and the cooling component 300. The liquid storage part 210 will ensure the effective storage of the liquid heat dissipation medium in the system, avoid temperature fluctuations caused by the flow of the working fluid, and thus improve the stability and reliability of the heat dissipation process, and transport the heat dissipation medium to the inner cavity of the liquid wick through the pipeline. Inside the liquid storage part 210, an appropriate volume can be designed to accommodate enough liquid heat dissipation medium and meet the temperature regulation requirements of the system when working under high load. In this embodiment, the temperature control part 220 can adjust the temperature of the liquid heat dissipation medium in the liquid storage part 210 in real time by connecting with the liquid storage part 210, and adjust its temperature according to the preset temperature control strategy. The temperature control part 220 can use a semiconductor cooling sheet, a heating wire or other energy regulating elements. In some embodiments, in order to ensure the stable establishment of the thermal cycle in the heat dissipation device 10, thermal insulation components can be set on the liquid storage component 200 and the pipelines connecting the various components to achieve thermal insulation protection of the liquid storage component 200 and the pipelines between the various components.

[0068] See also Figure 1 As shown, in some embodiments, the cooling component 300 is first connected to the inner cavity of the liquid absorbent core through the liquid pipeline 112, and the liquid storage member 210 is connected to the liquid pipeline 112 through a branch pipeline. In this configuration, the liquid storage member 210 is arranged outside the loop of the liquid pipeline 112 and connected through a branch, and the heat dissipation device 10 can be accurately controlled in temperature based on controlling the liquid filling amount of the heat dissipation device 10, and at the same time, a larger buffer space and latent heat reserve can be provided, thereby improving the adaptability of the heat dissipation device 10 to various working conditions.

[0069] In another embodiment, the liquid storage member 210 may also be disposed in the loop of the liquid pipeline 112, that is, the liquid storage member 210 is respectively connected to the inner cavity of the liquid absorbent core and the cooling component 300 through the liquid pipeline 112. With this arrangement, the temperature of the heat dissipation device 10 can also be accurately controlled based on controlling the liquid filling amount of the heat dissipation device 10, and at the same time, a larger buffer space can be provided, thereby improving the adaptability of the heat dissipation device 10 to various working conditions, and at the same time, the load change adjustment is faster and the system robustness is better.

[0070] Furthermore, the liquid storage component 200 also includes a pressure relief valve 230, which is provided on the liquid pipeline 112 between the liquid storage component 210 and the cooling component 300, in order to ensure the safety and stability of the entire circulation system. When the system faces an abnormal situation, such as thermal runaway of the heat source, the liquid heat dissipation medium in the evaporator 110 will be violently vaporized, generating a large amount of steam, which will cause the internal pressure of the system to rise rapidly.

[0071] By setting a pressure relief valve 230 on the liquid pipeline 112, when the pressure reaches a preset threshold, the pressure relief valve 230 will automatically open to release excess steam to achieve effective pressure regulation. This process can not only reduce the pressure inside the heat dissipation device 10, effectively alleviate the risk caused by thermal runaway, but also prevent equipment damage or equipment structure failure caused by excessive pressure, thereby improving the safety of the entire heat dissipation device 10.

[0072] Specifically, the pressure relief valve 230 can adopt a spring type or a diaphragm type structure, combining the structural and material properties to ensure long-term stable operation. When the valve is opened, it should have the ability to quickly release steam to avoid delaying the discharge time and affecting the safety of surrounding equipment. Under normal working conditions, the pressure relief valve 230 will remain closed to avoid unnecessary loss of working fluid, and respond quickly in extreme situations to ensure the good operation of the system.

[0073] In addition, the control system of the pressure relief valve 230 can be connected to the control module to provide real-time pressure monitoring and feedback. The pressure state in the liquid storage component 210 is continuously monitored by the sensor, and timely alarms or response measures are provided for different working conditions. When abnormal pressure is detected, the control module can link other parts of the liquid storage component 200 (such as the temperature control unit 220) to enhance the protection measures of the heat dissipation device 10.

[0074] Furthermore, the liquid storage component 200 further includes a second sensor 240, which is connected to the liquid storage component 210 and is used to monitor in real time the temperature signal and / or the pressure signal in the liquid storage component 210. The design of this embodiment effectively cooperates the second sensor 240 with the liquid storage component 210, so as to obtain relevant data of the heat dissipation medium in a timely manner, and provide effective data support for the automatic control of the heat dissipation device 10.

[0075] Specifically, the second sensor 240 can be a thermocouple, thermistor or other type of sensor to achieve efficient and accurate monitoring of the temperature in the liquid storage member 210. In terms of monitoring pressure, the second sensor 240 can also be configured as a pressure sensor to collect pressure data in the liquid storage member 210.

[0076] Based on the temperature and pressure signals provided by the second sensor 240, the control module can perform precise adjustment measures. In the specific implementation process, the temperature control unit 220 can adopt a PID (proportional-integral-differential) control algorithm, combined with a feedback mechanism, to adjust the temperature control strategy in real time, thereby ensuring that the working medium temperature in the liquid storage unit 210 is stable within a preset range.

[0077] Specifically, the control module compares the monitored temperature signal with the set temperature threshold. When it is found that the phase change temperature in the evaporator 110 is higher than the set value, the temperature control unit 220 immediately cools the liquid storage unit 210 and uses the cooling component 300 to reduce the temperature in the liquid storage unit 210. Since the liquid storage unit 210 is in a saturated two-phase state, its internal pressure is reduced accordingly, so that the liquid in the heat sink 310 flows back into the liquid storage unit 210, increasing the heat dissipation area inside the heat sink 310, thereby strengthening the heat transfer and reducing the pressure of the entire system, thereby reducing the phase change temperature in the evaporator 110. On the contrary, when the temperature is lower than the set value, the temperature control unit 220 adopts heating measures, such as activating an electric heater, the pressure in the liquid storage unit 210 rises, the liquid enters the heat sink 310 and blocks part of the heat dissipation area and the system pressure rises, and the phase change temperature in the evaporator 110 rises accordingly. Through such means, the temperature of the evaporator 110 can be accurately controlled, and then the temperature of the heat dissipation body can be controlled.

[0078] Specifically, the cooling component 300 includes a heat sink 310, which is respectively connected to the heat conduction channel 131 and the liquid storage component 200, and the heat sink 310 is used to cool the gaseous heat dissipation medium output by the evaporator 110 to condense and form a liquid heat dissipation medium.

[0079] In this embodiment, by providing the heat sink 310 connected to the gas pipeline 113, the heat sink 310 can effectively exchange heat with the gaseous heat sink medium in the gas pipeline 113, and can promote the rapid condensation of the steam-type gaseous heat sink medium into liquid heat sink medium.

[0080] Specifically, the heat sink 310 can adopt heat sink fins. The arrangement of the fins not only increases the heat dissipation area, but also promotes air flow, thereby improving the heat dissipation effect under natural convection or forced convection conditions. The heat sink 310 can also be connected to an external air conditioner to achieve the cooling and heat dissipation effect of the heat sink 310. The heat generated in this process is mainly dissipated quickly by conduction and convection, and the supercooling treatment scheme of the heat sink 310 makes the condensed liquid working medium in a good reflux state to prevent the working medium from being retained or vaporized. Good thermal coupling between the heat sink 310 and the evaporator 110 is an important part of ensuring a smooth thermal cycle. The efficient cooling capacity of the heat sink 310 realizes the continuous circulation of the working medium and provides a stable thermal management solution for the entire system, thereby ensuring the reliability and safety of the equipment under different working environments. It should be noted that in order to ensure the normal circulation of the heat sink 10, in a preferred embodiment, the design load of the heat sink 310 is preferably that under the preset working load, all the steam generated by the evaporator 110 can be completely condensed, and the preset supercooling degree is reached at the outlet of the heat sink 310.

[0081] In one embodiment, the cooling component 300 further includes a subcooler 320 , which is disposed in the liquid pipeline 112 between the evaporator 110 and the liquid storage component 200 , and is used to cool the liquid heat dissipation medium in the liquid pipeline 112 .

[0082] In this embodiment, the condensed liquid heat dissipation medium transfers its internal heat to the surrounding environment in an active or passive manner during the process of passing through the supercooler 320, so that the liquid heat dissipation medium further obtains a degree of supercooling, and the heat dissipation medium can effectively offset the reverse heat leakage from the evaporator 110, and prevent the system from shutting down due to the boiling of the liquid in the liquid supply layer. The subcooled liquid heat dissipation medium then enters the inner cavity of the liquid wick along the liquid pipe 112, where it is converted into a saturated liquid, and is again supplied to the meniscus through the liquid wick to complete the cycle.

[0083] It should be noted that the shortening of the penetration distance may lead to a potential increase in the risk of heat leakage. Therefore, this embodiment sets a subcooler 320 to cooperate with the liquid pipeline 112 to deal with the process instability problem that may occur in the saturated liquid from the liquid storage part 210. Specifically, the subcooler 320 can use high-efficiency heat dissipation materials and technologies such as heat dissipation fins and semiconductor refrigeration sheets to ensure that the liquid heat dissipation medium coming out of the heat dissipation part 310 has sufficient subcooling. This subcooling is to prevent the liquid heat dissipation medium in the inner cavity of the liquid absorbent core from generating bubbles due to reverse heat leakage, thereby causing the liquid absorbent core to deliquate, thereby affecting the normal operation and cooling effect of the system.

[0084] In actual operation, once the system reaches a predetermined working state, the entire circulation system will maintain a self-running state, and there will be no backflow of liquid in the system. The main heat loss will be manifested as the reverse conduction of heat from the evaporator. By setting the subcooler 320, the normal operation of the heat sink 10 can be ensured. Of course, when starting the heat sink 10, the subcooler 320 can be used as a starter for the heat sink 10 to ensure the normal operation of the heat sink 10. When the thermal balance in the heat sink 10 is maintained, the heat sink 10 can operate on its own. At this time, the subcooler 320 can reduce the power only to offset the reverse heat leakage of the evaporator 110.

[0085] Specifically, the number of the heat conducting member 130 is at least one; Figure 2 As shown, the heat conducting member 130 and the evaporator 110 are integrally formed.

[0086] In this embodiment, by disposing a heat conductive member 130 on the inner wall of the evaporator 110, the inner wall of the evaporator 110 can be spaced apart from the liquid wick, and a plurality of spaced heat conductive grooves 131 can be formed between the inner wall of the evaporator 110 and the liquid wick through the heat conductive member 130. The strength of the evaporator 110 can also be improved by disposing the heat conductive member 130. Specifically, the heat conductive member 130 can be formed by processing the heat conductive grooves 131 on the inner wall of the evaporator 110 by, for example, cutting.

[0087] See also Figure 5 As shown, in another embodiment, the heat conductive member 130 is integrally formed with the liquid wick.

[0088] In this embodiment, a heat conductive groove 131 can be formed on the first liquid absorbent core 121, and a heat conductive member 130 is formed by the heat conductive groove 131 arranged on the first liquid absorbent core 121. This arrangement can further increase the heat exchange surface area of ​​the liquid absorbent core, improve the phase change rate, and significantly improve the startup and working performance of the evaporation component 100.

[0089] In some embodiments, the liquid pipeline 112 can be formed by a main liquid pipeline and a plurality of liquid pipeline branches, the main liquid pipeline is connected to the liquid storage assembly 200, and the plurality of liquid pipeline branches are respectively connected to the evaporator 110, and the plurality of liquid pipeline branches can be arranged at intervals along the extension direction of the liquid wick (e.g., Figure 3 Y direction as shown), thereby improving the uniformity of the liquid heat dissipation medium entering the liquid wick, thereby improving the heat exchange performance of the heat dissipation device 10.

[0090] Of course, in some embodiments, the gas pipeline 113 can also be formed by a combination of a main gas pipeline and multiple gas pipeline branches. The main gas pipeline is connected to the cooling component 300, and the multiple gas pipeline branches are respectively connected to the steam chamber 111 or the heat conduction channel 131. Similar to the previous embodiment, this can also improve the uniformity and output efficiency of the gaseous heat dissipation medium output to the evaporator 110, thereby effectively improving the heat exchange performance of the heat dissipation device 10.

[0091] The heat dissipation device 10 of this embodiment has a more efficient heat transfer performance compared with liquid cooling and air conditioning direct cooling in the prior art through the above-mentioned settings. Based on the concept of heat transfer rather than cold transfer, the dew point problem can be effectively avoided. At the same time, since the heat dissipation device 10 adopts a passive heat transfer method and does not require a pump body structure, the reliability is also improved. In addition, since the heat dissipation device 10 has latent heat capacity, it can buffer short-term heat release and reduce the risk of thermal runaway. Based on the principle of phase change heat transfer, the temperature is stable and uniform. Compared with the general heat pipe solution, the heat dissipation device 10 of this embodiment has the advantages of gas-liquid separation pipeline, low liquid flow loss, long transmission distance and reverse gravity operation. Compared with the general separation loop heat pipe solution, the heat dissipation device 10 of this embodiment can adopt a flat evaporator 110, which can be applied to large-area flat heat dissipation, especially to flat batteries. Compared with the general plate loop heat pipe solution, the heat dissipation device 10 of this embodiment has a two-way heat transfer structure, which can realize heat transfer between double-layer heat sources and is suitable for heat transfer between multi-layer battery packages. Compared with the plate-type loop heat pipe solution with two-way heat transfer, the heat dissipation device 10 of this embodiment has an independently temperature-controlled liquid storage component 200, which can actively control the operating temperature of the liquid pipeline 112, and by providing a liquid absorption core, it can significantly reduce the liquid penetration distance, improve the heat transfer limit and transmission distance. At the same time, since the heat dissipation device 10 adopts dual liquid pipelines 112 and dual gas pipelines 113 for output, the temperature of the plate evaporator 110 can be made more uniform.

[0092] The present invention also provides an energy supply system, which includes a battery and the heat dissipation device 10 in any of the above embodiments, the evaporator 110 of the heat dissipation device 10 is attached to the battery, the cooling component 300 is spaced apart from the battery, and the heat dissipation device 10 is used to cool the battery.

[0093] It can be understood that in the energy supply system of this embodiment, by setting the heat dissipation device 10 to cooperate with the battery, the heat dissipation device 10 is provided with a delivery pipeline to connect the evaporator 110 and the cooling component 300, so that the heat dissipation device 10 can avoid the condensation water generated during the heat exchange process to affect the battery, and at the same time, by using a phase-changeable heat dissipation medium to cooperate with the evaporation component 100, efficient heat dissipation can be achieved. Specifically, the battery can be a flat battery or a cylindrical battery, which is not limited here.

[0094] The present invention further provides an electrical device, which includes the energy supply system in any one of the above embodiments, or the heat dissipation device 10 in any one of the above embodiments, and the heat dissipation device 10 is used to cool the heat source or the energy supply system in the electrical device.

[0095] In the electric device of this embodiment, the cooling component 300 in the heat dissipation device 10 can be connected to the air conditioner of the electric device to make full use of the cooling performance of the air conditioner, so as to make the overall structure of the heat dissipation device 10 more compact. At the same time, by arranging the heat dissipation device 10 to cooperate with the heat source, the heat dissipation performance of the internal device of the electric device can be effectively improved. Specifically, the electric device can be a vehicle, and the cooling component 300 can be connected to the air conditioner of the vehicle to make full use of the cooling performance of the air conditioner of the vehicle, so as to make the structure of the heat dissipation device 10 more compact.

[0096] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0097] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0098] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0099] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device (10), characterized in that: include: An evaporation component (100) comprises an evaporator (110) and a liquid wick, wherein the liquid wick is arranged in the evaporator (110); an inner cavity of the liquid wick is used to accommodate a liquid heat dissipation medium, and the liquid heat dissipation medium undergoes a phase change in the liquid wick to be converted into a gaseous heat dissipation medium; A liquid storage component (200) connected to the inner cavity of the liquid absorbent core, the liquid storage component (200) being used to store the liquid heat dissipation medium and transport it to the liquid absorbent core; as well as A cooling component (300) is respectively connected to the evaporator (110) and the liquid storage component (200) through a delivery pipeline, and the cooling component (300) is used to cool the gaseous heat dissipation medium to form the liquid heat dissipation medium.

2. The heat dissipation device (10) according to claim 1, characterized in that: The pore size of the absorbent core close to the outer layer is smaller than the pore size close to the inner cavity of the absorbent core; and / or the thermal conductivity of the absorbent core close to the outer layer is greater than the thermal conductivity close to the inner cavity of the absorbent core.

3. The heat dissipation device (10) according to claim 2, characterized in that: The liquid absorbent core comprises a first liquid absorbent core (121) and a second liquid absorbent core (122), wherein the first liquid absorbent core (121) is located outside the second liquid absorbent core (122), and the inner cavity of the second liquid absorbent core (122) is used to accommodate the liquid heat dissipation medium; Wherein, the pore size of the first absorbent core (121) is smaller than the pore size of the second absorbent core (122); and / or the thermal conductivity of the first absorbent core (121) is greater than the thermal conductivity of the second absorbent core (122).

4. The heat dissipation device (10) according to claim 1, characterized in that: The evaporation component (100) further comprises a heat conducting member (130), wherein the heat conducting member (130) is arranged between the liquid wick and the inner wall of the evaporator (110) to form a heat conducting channel (131), wherein the heat conducting channel (131) is connected to the cooling component (300), and the heat conducting channel (131) is used to transport the gaseous heat dissipation medium.

5. The heat dissipation device (10) according to claim 4, characterized in that: The inner cavity of the liquid absorbent core extends along a first direction, the heat conduction channel (131) extends along a second direction, and the first direction and the second direction are arranged at an angle.

6. The heat dissipation device (10) according to claim 4, characterized in that: The number of the heat-conducting grooves (131) is multiple, and the multiple heat-conducting grooves (131) are arranged in parallel or staggered.

7. The heat dissipation device (10) according to any one of claims 4 to 6, characterized in that: The number of the heat conducting members (130) is plural.

8. The heat dissipation device (10) according to any one of claims 4 to 6, characterized in that: The heat conducting member (130) and the evaporator (110) are integrally formed; and / or the heat conducting member (130) and the liquid wick are integrally formed.

9. The heat dissipation device (10) according to claim 1, characterized in that: The evaporation component (100) further comprises a first sensor (140), wherein the first sensor (140) is connected to the evaporator (110) and is used to obtain a temperature signal inside the evaporator (110).

10. The heat dissipation device (10) according to claim 1, characterized in that: The liquid storage component (200) comprises a liquid storage part (210) and a temperature control part (220); the liquid storage part (210) is connected to the liquid pipeline (112) between the inner cavity of the liquid wick and the cooling component (300); the liquid storage part (210) is used to store the liquid heat dissipation medium; and the temperature control part (220) is connected to the liquid storage part (210) and is used to adjust the temperature of the liquid heat dissipation medium.

11. The heat dissipation device (10) according to claim 10, characterized in that: The liquid storage component (200) further comprises a pressure relief valve (230), wherein the pressure relief valve (230) is arranged on the liquid pipeline (112) between the liquid storage component (210) and the temperature reduction component (300).

12. The heat dissipation device (10) according to claim 10, characterized in that: The liquid storage component (200) further comprises a second sensor (240), wherein the second sensor (240) is connected to the liquid storage component (210), and the second sensor (240) is used to obtain a temperature signal and / or a pressure signal in the liquid storage component (210).

13. The heat dissipation device (10) according to claim 1, characterized in that: The cooling component (300) comprises a heat sink (310), the heat sink (310) being connected to the evaporator (110) and the liquid storage component (200) respectively, and the heat sink (310) being used to cool the gaseous heat sink medium output by the evaporator (110) so as to condense and form the liquid heat sink medium.

14. The heat dissipation device (10) according to claim 13, characterized in that: The cooling component (300) further comprises a subcooler (320), wherein the subcooler (320) is arranged in the liquid pipeline (112) between the evaporator (110) and the liquid storage component (200), and the subcooler (320) is used to cool the liquid heat dissipation medium in the liquid pipeline (112).

15. An energy supply system, characterized in that: include: Battery; as well as The heat dissipation device (10) according to any one of claims 1 to 14, wherein the evaporator (110) of the heat dissipation device (10) is attached to the battery, the cooling component (300) is spaced apart from the battery, and the heat dissipation device (10) is used to cool the battery.

16. An electrical device, characterized in that: It comprises the energy supply system according to claim 15, or the heat dissipation device (10) according to any one of claims 1 to 14, wherein the heat dissipation device (10) is used to cool the heat source in the electrical device or the energy supply system.

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