A large-capacity parallel-connected IGBT device power module

By independently crimping the IGBT and diodes in a large-capacity parallel IGBT module, and adopting water-cooled heat dissipation and modular design, the problems of uneven heat dissipation, large footprint and difficult maintenance in the existing modules are solved, and a power module with high efficiency heat dissipation, low footprint and high reliability are achieved.

CN119787774APending Publication Date: 2025-04-08RONGXIN HUIKO ELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202411919780.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-04-08

AI Technical Summary

Technical Problem

The existing large-capacity parallel IGBT modules have problems such as uneven heat dissipation, large footprint and high maintenance in high power applications, which are difficult to meet the needs of high performance and high reliability.

Method used

The power module of large-capacity parallel crimped IGBT device is adopted. By independently crimping the crimped IGBT with the crimped diode, and adopting a water-cooled heat dissipation system and a modular design, the heat dissipation efficiency and maintenance convenience are improved.

Benefits of technology

It significantly improves the thermal management performance and service life of IGBT, reduces module height, reduces floor area, simplifies maintenance process, and improves equipment reliability and energy efficiency.

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Abstract

The present invention relates to the technical field of flexible direct current transmission converter valves, and in particular to a large-capacity parallel crimped IGBT device power module, wherein a power device crimping assembly and a crimped diode assembly are placed side by side, the power device crimping assembly and the crimped diode assembly are both arranged at the front end of a direct current capacitor unit, a circuit control unit is arranged at the upper end of the power device crimping assembly and the diode, a bypass switch unit is arranged at the front end of the power device crimping assembly and the diode, the power device crimping assembly and the direct current capacitor unit are connected through a laminated busbar assembly, and the power device crimping assembly and the diode parallel crimping assembly are connected through a laminated busbar assembly. The advantages of the present invention are: the power device parallel crimping structure can double the rated current of the power module, improve the output power of the power module, and meet the use of large-capacity working condition flexible direct current projects; the separation crimping strategy is adopted, which not only significantly reduces the overall height of the module, but also solves the problem of uneven heat dissipation.
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