Housing and preparation method thereof and electronic device

Abstract

The present application proposes a housing, a method for preparing the same, and an electronic device. The present application first forms interconnected openings and slots on a metal composite material to obtain a composite connector, and then sets the composite connector on a frame to connect the openings and through holes on the frame, thereby forming a button hole of the housing. In the housing of the present application, the hole wall of the button hole is the first metal layer and the frame of the composite connector. The first metal layer and the frame are made of the same material and have good waterproof and anti-corrosion properties. The button hole of the present application is not formed by a hot drilling process, so it can avoid the problems of low yield, high cost, and appearance defects caused by the hot drilling process, and can also avoid the problem that the hot drilling process cannot be implemented (interference) due to the obstruction of the side wall.

Description

Technical Field

[0001] The present application relates to the technical field of electronic accessories, and in particular to a housing and a preparation method thereof, and an electronic device. Background Art

[0002] The housing of an electronic device (e.g., a mobile phone, etc.) can be formed by welding a frame (left frame, right frame) to a bottom plate. The frame can be made of titanium, and the bottom plate can be made of aluminum. The housing is provided with a key hole. When conducting a salt spray test or a waterproof test, if the hole wall of the key hole is made of aluminum, the aluminum is easily corroded and the test fails. Therefore, in order to ensure the waterproofness and corrosion resistance of the key hole, a hot drilling process is usually used to stretch the titanium material to cover the aluminum material so that the hole wall of the key hole is titanium.

[0003] However, the yield of key holes made by hot drilling is low, the tool cost is high, and hot drilling is prone to defects such as pores, gaps, burrs and tensile cracks. In addition, when the frame and the bottom plate are formed in one piece, the choice of titanium aluminum raw materials and the design of forming key holes by hot drilling will no longer be applicable (the hot drilling process cannot be implemented due to the obstruction and interference of the opposite side wall). Summary of the invention

[0004] In view of this, the present application proposes a method for preparing a shell to solve at least one of the above technical problems.

[0005] In addition, it is also necessary to provide a housing prepared by the above preparation method and an electronic device including the housing.

[0006] One embodiment of the present application provides a method for preparing a shell, comprising the following steps: forming a composite connector from a metal composite material; wherein the composite connector is provided with interconnected openings and grooves, the composite connector comprises a first metal layer and a second metal layer, the opening passes through the first metal layer, the groove passes through the second metal layer, and the opening is exposed from the groove; forming a frame from a metal substrate; wherein the frame is provided with a through hole, and the material of the frame is the same as that of the first metal layer; arranging the composite connector in the frame; wherein the first metal layer is located between the frame and the second metal layer, and the opening is exposed from the through hole; and filling a plastic layer between the composite connector and the frame to obtain the shell.

[0007] In one embodiment, the process of making the metal composite material into a composite connector further includes: forming an opening penetrating the first metal layer on the first metal layer by a CNC machine tool; forming a groove penetrating the second metal layer on the second metal layer by a CNC machine tool to obtain the composite connector; wherein the first metal layer includes titanium and the second metal layer includes aluminum.

[0008] In one embodiment, the metal composite material is in the shape of an elongated strip, and the metal composite material is processed by the CNC machine tool to form a plurality of the composite connecting parts.

[0009] In one embodiment, the process of making a metal substrate into a frame further includes: providing a metal substrate, wherein the metal substrate is a titanium substrate, and the thickness of the titanium substrate is less than or equal to 2 mm; punching the titanium substrate into the frame, wherein the frame includes a bottom wall and two side walls connected to the bottom wall and arranged opposite to each other; thinning a portion of the side wall so that the side wall includes a first portion and a second portion connected thereto, and forming a groove on the second portion; the first portion is connected to the bottom wall, and the thickness of the first portion is less than the thickness of the second portion; the thickness of the first portion is T1, T1≥0.5 mm; the thickness of the second portion is T2, 0.5<T2≤2 mm.

[0010] In one embodiment, arranging the composite connector on the frame further includes: welding the composite connector to the inner surface of the first part, the first metal layer is located between the second metal layer and the first part; the first metal layer is made of titanium, and the frame is made of titanium.

[0011] In one embodiment, the preparation method further includes: forming a threaded hole on the composite connector, wherein the threaded hole penetrates the second metal layer.

[0012] One embodiment of the present application provides a housing, which includes a frame, a composite connector and a plastic layer. The frame is provided with a through hole. The composite connector is arranged on the frame, and the composite connector includes a first metal layer and a second metal layer, and the first metal layer is located between the frame and the second metal layer. The composite connector is provided with a connected opening and a groove, the opening passes through the first metal layer, the groove passes through the second metal layer, and the opening is exposed from the groove and the through hole. The material of the frame is the same as that of the first metal layer. The plastic layer is arranged between the composite connector and the frame.

[0013] In one embodiment, the frame includes a bottom wall and two side walls connected to the bottom wall and arranged opposite to each other. The through hole is formed in the side wall, and the composite connector is arranged on the inner surface of the side wall. The side wall includes a first part and a second part connected, the first part is connected to the bottom wall, and the thickness of the first part is less than the thickness of the second part. A baffle is provided on the first part, and the second part and the baffle are surrounded to form a groove, and part of the plastic layer is located in the groove.

[0014] In one embodiment, the thickness of the side wall near the through hole is H, H≥0.6 mm. The thickness of the plastic layer near the through hole is Z, Z≥0.3 mm.

[0015] An embodiment of the present application provides an electronic device, which includes the housing as described above.

[0016] The present application forms a composite connector by first forming interconnected openings and grooves on a metal composite material, thereby obtaining the composite connector, and then arranges the composite connector on a frame so that the openings and the through holes on the frame are connected, thereby forming a button hole of the housing. In the housing of the present application, the hole wall of the button hole is the first metal layer and the frame of the composite connector. The first metal layer and the frame are made of the same material and have good waterproof and anti-corrosion properties. The button hole of the present application is not formed by a hot drilling process, so it can avoid the problems of low yield, high cost, and appearance defects caused by the hot drilling process, and can also avoid the problem that the hot drilling process cannot be implemented (interference) due to the obstruction of the side wall. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a metal composite material according to an embodiment of the present application.

[0018] Figure 2 for Figure 1 Schematic diagram of a composite connector made of metal composite material.

[0019] Figure 3 It is a schematic diagram of a metal substrate according to one embodiment of the present application.

[0020] Figure 4 for Figure 3 Schematic diagram of a frame made of a metal substrate.

[0021] Figure 5 For the general Figure 2 The composite connector shown is installed on Figure 4 A schematic diagram of a housing formed after the frame is shown in one embodiment.

[0022] Figure 6 for Figure 5 Exploded view of the housing shown.

[0023] Figure 7 for Figure 5 The housing is shown in cross-sectional view along line VII-VII.

[0024] Figure 8 for Figure 5 The housing is shown in cross-sectional view along line VIII-VIII.

[0025] Fig. 9 for Figure 5A cross-sectional view of the housing along line IX-IX is shown.

[0026] Fig.10 A schematic diagram of an electronic device according to an embodiment of the present application.

[0027] Main component symbols 100: housing; 10a: metal composite material; 10: composite connector; 11: first metal layer; 110: opening; 12: second metal layer; 120: slot; 121: threaded hole; 20a: metal substrate; 20: frame; 21: bottom wall; 22: side wall; 220: through hole; 221: first part; 222: second part; 224: groove; 30: auxiliary component; 31: Soldering point; 40: Plastic layer; 200: Electronic equipment.

[0028] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0029] Unless otherwise defined, all technical and scientific terms used herein are identical with the meanings generally understood by those skilled in the art of the technical field belonging to the embodiments of the present application. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present application. In the embodiments, if specific conditions are not specified, they are carried out according to the conditions recommended by normal conditions or manufacturers. If the manufacturer is not specified for reagents or instruments, they are all conventional products that can be obtained by commercial purchase.

[0030] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] It will be understood that when a layer is referred to as being "on" another layer, it can be directly on the other layer or there can be intervening layers therebetween. Conversely, when a layer is referred to as being "directly on" another layer, there are no intervening layers. When a component is referred to as being "fixed to," "mounted to," "disposed to," or "connected to" another component, it can be directly on the other component or there can also be an intervening component. The term "and / or" as used herein includes all and any combinations of one or more of the associated listed items.

[0032] Embodiments of the present application are described herein with reference to cross-sectional views, which are schematic diagrams of idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes shown in the drawings differ due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions shown here, but should include deviations in shapes, for example, due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not intended to illustrate the actual shapes of the devices, and are not intended to limit the scope of the present application.

[0033] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0034] See also Figures 1 to 5 In a first aspect, the present application provides a method for preparing a housing 100, which can be used in an electronic device (e.g., a mobile phone, etc.) to carry internal components of the electronic device. The preparation method includes steps S10 to S50. It is understood that the numbering of the steps is intended to clearly describe the specific preparation method, and does not mean to limit the order of the steps.

[0035] See also Figure 1 and Figure 2 , S10, making the metal composite material 10a into a composite connecting part 10.

[0036] like Figure 1 As shown, in some embodiments, the metal composite material 10a may include a first metal layer 11 and a second metal layer 12 stacked, and the metal composite material 10a may be in a rectangular shape (long strip shape). The material of the first metal layer 11 may be but not limited to titanium (Ti), and the material of the second metal layer 12 may be but not limited to aluminum (Al).

[0037] In some embodiments, the opening 110 penetrating the first metal layer 11 can be formed on the first metal layer 11 by a CNC machine tool (CNC) processing method, and the slot 120 penetrating the second metal layer 12 can be formed on the second metal layer 12 by a CNC processing method, so as to obtain Figure 2 The composite connector 10 shown. A rectangular metal composite material 10a can be formed into multiple composite connectors 10 by CNC. Forming the opening 110 and the slot 120 by CNC and manufacturing multiple composite connectors 10 can reduce processing time and reduce production costs compared to hot drilling.

[0038] like Figure 2As shown, at least one of the plurality of composite connectors 10 includes a first metal layer 11 and a second metal layer 12, and is provided with a connected opening 110 and a slot 120. The opening 110 penetrates the first metal layer 11 along the thickness direction of the first metal layer 11, and the slot 120 penetrates the second metal layer 12 along the thickness direction of the second metal layer 12, and the opening 110 is exposed from the slot 120. The opening 110 may be a regular or irregular shape such as a circular hole or a square hole, and the number of the openings 110 may be multiple. The orthographic projection shape of the slot 120 on the first metal layer 11 may be a regular or irregular shape such as a triangle or a quadrilateral, which is not limited in the present application.

[0039] Other composite connectors 10 can be configured according to actual needs to form a desired connection structure.

[0040] like Figure 2 As shown, in some embodiments, a threaded hole 121 may be formed on the composite connector 10. The threaded hole 121 penetrates the second metal layer 12 along the thickness direction of the second metal layer 12, and the threaded hole 121 is adjacent to the slot 120. The threaded hole 121 can be used to rivet the stud to ensure the position of the composite connector 10. The second metal layer 12 is aluminum, and the tapping difficulty of aluminum is small, while the tapping difficulty of titanium is large and is not conducive to ensuring the position of the composite connector 10.

[0041] See also Figure 3 and Figure 4 , S20, manufacturing the metal substrate 20a to form the frame 20. The material of the frame 20 is the same as the material of the first metal layer 11.

[0042] like Figure 3 As shown, the metal substrate 20a is roughly a plate-like structure with a certain thickness, and its thickness can be less than or equal to 2 mm to ensure that the metal substrate 20a will not crack in the subsequent stamping steps. The thickness of the metal substrate 20a is relatively large, and a greater stamping force needs to be applied during stamping, which can easily cause the metal substrate 20a to break during stamping. The material of the metal substrate 20a is the same as that of the first metal layer 11, and the metal substrate 20a can be a titanium substrate. That is, the first metal layer 11 and the frame 20 are both made of titanium, and the second metal layer 12 is made of aluminum. In this way, it can ensure that the weight of the housing 100 is relatively light, the hardness of the appearance surface formed by the first metal layer 11 is relatively large, and the processability of the connection structure formed by the second metal layer 12 is relatively good.

[0043] In some embodiments, the metal substrate 20a can be deformed by stamping to form a Figure 4The frame 20 shown. The frame 20 may include a bottom wall 21 and two side walls 22 connected to the bottom wall 21 and arranged opposite to each other. A through hole 220 penetrating the side wall 22 may be formed on each side wall 22 by, but not limited to, CNC, and the number of through holes 220 on each side wall 22 may be multiple. The through hole 220 may be a regular or irregular shape such as a round hole, a square hole, a waist-shaped hole, etc., which is not limited in the present application.

[0044] In some embodiments, Figure 4 As shown, a part of each side wall 22 may be thinned so that each side wall 22 includes a first portion 221 and a second portion 222 connected. The first portion 221 and the second portion 222 are arranged along the height direction of the side wall 22, the first portion 221 is connected to the bottom wall 21, and the second portion 222 is connected to an end of the first portion 221 away from the bottom wall 21. The thickness of the first portion 221 is less than the thickness of the second portion 222, so that it is convenient to arrange the composite connector 10 on the first portion 221 later.

[0045] Furthermore, if Figure 4 As shown, the thickness of the first part 221 is T1, T1 ≥ 0.5 mm; the thickness of the second part 222 is T2, 0.5 < T2 ≤ 2 mm. In this way, it can ensure that the shell 100 has a certain strength, and can also ensure that the shell 100 has a lighter and thinner appearance, and can also save material costs. It can be understood that along the extension direction of the first part 221, the thickness of the first part 221 may not be uniform at various locations. T1 represents the thickness of the thinnest part of the first part 221 (for example, the thickness at the edge of the extension direction of the first part 221), and the thickness of the thinnest part must also be greater than or equal to 0.5 mm. The thickness of the first part 221 near its through hole 220 may be greater than the thickness of the thinnest part to ensure that it will not affect the welding when the composite connector 10 is welded later.

[0046] In some embodiments, Figure 4 As shown, a groove 224 may be formed on the second portion 222. The groove 224 may be formed by partially recessing the inner surface of the second portion 222 (i.e., the surface facing the other side wall 22) in a direction away from the other side wall 22. A plurality of grooves 224 may be arranged at intervals along the extension direction of the side wall 22 (i.e., a direction perpendicular to the height and thickness direction of the side wall 22). The groove 224 may increase the plastic layer 40 (see Figures 7 to 9 ) and the bonding force between the frame 20.

[0047] In some embodiments, Figure 4 As shown, a rounded corner is formed between the first portion 221 of the side wall 22 and the bottom wall 21 , and the radius of the rounded corner may be 2.5 mm.

[0048] See also Figure 5 and Figure 6S30, the composite connector 10 is arranged on the frame 20. The first metal layer 11 is located between the frame 20 and the second metal layer 12, and the opening 110 is exposed from the through hole 220. The through hole 220 and the opening 110 form a key hole of the housing 100, and various function keys can be arranged in the key hole.

[0049] In some embodiments, Figure 5 and Figure 6 As shown, the composite connector 10 can be welded to the inner surface of the side wall 22 (that is, the surface of the side wall 22 facing the other side wall 22), and multiple composite connectors 10 can be welded on each side wall 22. Further, the composite connector 10 can be welded to the first portion 221 to make the entire housing 100 as thin as possible. The welding method can be, but is not limited to, laser welding.

[0050] In some embodiments, Figure 5 and Figure 6 As shown, the inner surface of the first part 221 will also be welded with an auxiliary component 30. The number of auxiliary components 30 can be multiple, and the auxiliary component 30 can be but not limited to a buckle, an anti-scratch strip, etc. The buckle can be used to fix the screen or other components of the electronic device, and the anti-scratch strip can prevent scratches and collisions.

[0051] See also Figures 5 to 7 , S40, filling a plastic layer 40 between the composite connector 10 and the frame 20 to obtain a housing 100.

[0052] like Figure 7 As shown, during welding, the welding spot 31 is located between the edge of the first metal layer 11 in the extension direction and the side wall 22, and the first metal layer 11 and the side wall 22 at the welding spot 31 are tightly connected. However, there is still a gap in the area between the first metal layer 11 and the side wall 22 outside the welding spot 31, and the plastic layer 40 is filled in the gap to further improve the connection stability and sealing between the composite connector 10 and the frame 20. The plastic layer 40 can be formed of conventional or unconventional rubber materials in the art, and this application is not limited. The plastic layer 40 can be set between the first metal layer 11 of the composite connector 10 and the side wall 22 of the frame 20 by an injection molding process.

[0053] In some embodiments, Figure 8 As shown, the thickness of the side wall 22 (first portion 221 ) near the through hole 220 is H, where H≥0.6 mm. This is to avoid stress marks caused by too small thickness.

[0054] In some embodiments, Figure 8As shown, the thickness of the plastic layer 40 near the through hole 220 is Z, and Z ≥ 0.3 mm. It can be understood that Z is the thickness of the thinnest part of the plastic layer 40, and the thinnest part is the area of ​​the plastic layer 40 near the through hole 220. The thickness Z of the thinnest part should also be greater than or equal to 0.3 mm to avoid short shots during injection molding.

[0055] In some embodiments, Fig. 9 As shown, a portion of the plastic layer 40 can flow into the groove 224 , which helps to improve the bonding strength between the composite connector 10 and the frame 20 .

[0056] In some embodiments, the plastic layer 40 is further disposed between the auxiliary component 30 and the side wall 22 of the frame 20 to further enhance the bonding force between the auxiliary component 30 and the frame 20 .

[0057] See also Figure 5 and Figure 6 In a second aspect, the present application provides a housing 100 prepared by the above-mentioned preparation method, which includes a composite connector 10, a frame 20 and a plastic layer 40. The composite connector 10 is arranged in the frame 20, and a through hole 220 is provided on the frame 20. The composite connector 10 includes a first metal layer 11 and a second metal layer 12, and is provided with a connected opening 110 and a groove 120, and the first metal layer 11 is located between the frame 20 and the second metal layer 12. The opening 110 penetrates the first metal layer 11 along the thickness direction of the first metal layer 11, and the groove 120 penetrates the second metal layer 12 along the thickness direction of the second metal layer 12. The opening 110 is exposed from the groove 120 and is exposed from the through hole 220. The material of the frame 20 is the same as that of the first metal layer 11. The plastic layer 40 is arranged between the composite connector 10 and the frame 20.

[0058] In some embodiments, Figure 5 and Figure 6 As shown, the frame 20 may include a bottom wall 21 and two side walls 22 connected to and opposite to the bottom wall 21. Each side wall 22 may be provided with a through hole 220, and the inner surface of each side wall 22 (the inner surface facing the other side wall 22) may be provided with a plurality of composite connectors 10.

[0059] Further, the side wall 22 includes a first portion 221 and a second portion 222 connected. The first portion 221 is connected to the bottom wall 21, and the thickness of the first portion 221 is less than the thickness of the second portion 222. The second portion 222 is provided with a groove 224, and the groove 224 can be formed by the inner surface of the second portion 222 (that is, the surface facing the other side wall 22) being partially recessed in a direction away from the other side wall 22, and a plurality of grooves 224 can be arranged at intervals along the extension direction of the side wall 22 (that is, the direction perpendicular to the height and thickness direction of the side wall 22). Part of the plastic layer 40 is located in the groove 224 to enhance the bonding strength between the frame 20 and the composite connector 10.

[0060] See also Fig.10 According to a third aspect of the present application, there is provided an electronic device 200, which includes the housing 100 as described above. The electronic device 200 may be, but is not limited to, a mobile phone.

[0061] The method for preparing the housing 100 provided in the embodiment of the present application is to first form a connected opening 110 and a slot 120 on the metal composite material 10a to obtain a composite connector 10, and then set the composite connector 10 on the frame 20 so that the opening 110 is connected to the through hole 220 on the frame 20, so as to form a button hole of the housing 100. In the housing 100 of the embodiment of the present application, the hole wall of the button hole is the first metal layer 11 of the composite connector 10 and the frame 20. The first metal layer 11 and the frame 20 are made of the same material (titanium), and have good waterproof and anti-corrosion properties. The button hole of the present application is not formed by a hot drilling process, so it can avoid the problems of low yield, high cost, and easy appearance defects caused by the hot drilling process, and can also avoid the problem that the hot drilling process cannot be implemented (interference) due to the obstruction of the side wall.

[0062] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for preparing a shell, characterized in that: The following steps are involved: The metal composite material is made into a composite connector; wherein the composite connector has interconnected openings and slots, the composite connector comprises a first metal layer and a second metal layer, the openings penetrate the first metal layer, the slots penetrate the second metal layer, and the openings are exposed from the slots; The metal substrate is manufactured into a frame; wherein the frame is provided with a through hole, and the material of the frame is the same as that of the first metal layer; The composite connector is arranged on the frame; wherein the first metal layer is located between the frame and the second metal layer, and the opening is exposed from the through hole; A plastic layer is filled between the composite connector and the frame to obtain the shell.

2. The method for preparing a shell according to claim 1, characterized in that: The method of manufacturing the metal composite material into a composite connector further comprises: Forming an opening penetrating through the first metal layer on the first metal layer by a numerically controlled machine tool; Forming a groove penetrating the second metal layer on the second metal layer by a numerically controlled machine tool to obtain the composite connector; Wherein, the first metal layer includes titanium, and the second metal layer includes aluminum.

3. The method for preparing the shell according to claim 2, characterized in that: The metal composite material is in the shape of a long strip, and the metal composite material is processed by the CNC machine tool to form a plurality of the composite connecting parts.

4. The method for preparing a shell according to claim 1, characterized in that: The step of manufacturing the metal substrate into a frame further comprises: Providing a metal substrate, wherein the metal substrate is a titanium substrate, and the thickness of the titanium substrate is less than or equal to 2 mm; Punching the titanium substrate to form the frame, wherein the frame comprises a bottom wall and two side walls connected to the bottom wall and arranged opposite to each other; Part of the side wall is thinned so that the side wall includes a first part and a second part that are connected, and a groove is formed on the second part; the first part is connected to the bottom wall, and the thickness of the first part is less than the thickness of the second part; the thickness of the first part is T1, T1≥0.5mm; the thickness of the second part is T2, 0.5<T2≤2mm.

5. The method for preparing the shell according to claim 4, characterized in that: The step of arranging the composite connector on the frame further comprises: The composite connector is welded to the inner surface of the first part, and the first metal layer is located between the second metal layer and the first part; the first metal layer is made of titanium, and the frame is made of titanium.

6. The method for preparing a shell according to claim 1, characterized in that: Also includes: A threaded hole is formed on the composite connector, and the threaded hole penetrates the second metal layer.

7. A housing, characterized in that: include: A frame, wherein the frame is provided with a through hole; A composite connector is arranged on the frame, the composite connector comprises a first metal layer and a second metal layer, the first metal layer is located between the frame and the second metal layer; the composite connector is provided with a connected opening and a groove, the opening passes through the first metal layer, the groove passes through the second metal layer, and the opening is exposed from the groove and the through hole; the material of the frame is the same as that of the first metal layer; and The plastic layer is arranged between the composite connecting member and the frame.

8. The housing according to claim 7, characterized in that The frame body comprises a bottom wall and two side walls connected to the bottom wall and arranged opposite to each other, the through hole is formed in the side walls, and the composite connector is arranged on the inner surface of the side walls; The side wall includes a first part and a second part connected to each other. The first part is connected to the bottom wall. The thickness of the first part is smaller than that of the second part. The second part is provided with a groove. Part of the plastic layer is located in the groove.

9. The housing according to claim 8, characterized in that The thickness of the side wall near the through hole is H, H≥0.6mm; the thickness of the plastic layer near the through hole is Z, Z≥0.3mm.

10. An electronic device, characterized in that: Comprising a housing as claimed in any one of claims 7 to 9.

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