LED 3D display device and manufacturing method thereof

Abstract

The invention relates to an LED 3D display device and a manufacturing method thereof. The LED 3D display device provided by the invention comprises an LED device layer; the LED device layer comprises a plurality of LED packaging structures arranged in an array, and each LED packaging structure at least comprises a group of RGB three-color LED chips; a polarizer layer; the polaroid layer comprises a plurality of polaroids arranged in an array, and the polaroids are in one-to-one correspondence with the LED packaging structures; wherein the polaroid comprises a left-hand polaroid and a right-hand polaroid; the left-hand polaroids and the right-hand polaroids are arranged alternately. According to the LED 3D display device, the effective visual angle range of a 3D display image can be expanded, and the definition and brightness of the 3D image are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED 3D display, and in particular to an LED 3D display device and a manufacturing method thereof. Background Art

[0002] With the development of display technology, naked-eye 3D display technology has become an important development branch. Conventional naked-eye 3D technology, especially naked-eye LED 3D display, usually achieves 3D effect through external optical elements outside the display module, such as parallax barriers or cylindrical lenses. However, this method cannot accurately separate the left and right eye images at the pixel level, has a narrow viewing angle range, high equipment cost, and the imaged 3D image has a significant loss in brightness compared to the image directly displayed by the display module.

[0003] Therefore, a solution is needed to improve the viewing angle range and image brightness of the 3D image of the LED 3D display device. Summary of the invention

[0004] Therefore, the present invention provides an LED 3D display device and a manufacturing method thereof to solve the problems of narrow viewing angle range of 3D images and loss of image brightness in the LED 3D display device.

[0005] The present invention provides an LED 3D display device, comprising: an LED device layer; the LED device layer comprises a plurality of LED packaging structures arranged in an array, the LED packaging structure comprises at least one group of RGB three-color LED chips or emits RGB three-color light; a polarizer layer; the polarizer layer comprises a plurality of polarizers arranged in an array, located on the surface of the LED packaging structure, the polarizers corresponding to the LED packaging structure one by one; wherein the polarizers comprise left-handed polarizers and right-handed polarizers; the left-handed polarizers and the right-handed polarizers are arranged alternately.

[0006] Optionally, the left-handed polarizer and the right-handed polarizer are alternately arranged as follows: in a coordinate system with any corner of the LED device layer as the origin and two orthogonal sides of the LED device layer as coordinate axes, at least in the direction of one coordinate axis, the left-handed polarizer and the right-handed polarizer are alternately arranged.

[0007] Optionally, the left-handed polarizer and the right-handed polarizer are alternately arranged as follows: in a coordinate system with any corner of the LED device layer as the origin and two orthogonal sides of the LED device layer as coordinate axes, in the directions of the two coordinate axes, the left-handed polarizer and the right-handed polarizer are alternately arranged.

[0008] Optionally, the group of RGB three-color LED chips includes a red LED chip, a green LED chip and a blue LED chip; the LED packaging structure includes: a backplane substrate; the backplane substrate is provided with a conductive circuit; one side surface of the backplane substrate is provided with four electrode plates; three of the four electrode plates are respectively connected to one electrode pin of the red LED chip, the green LED chip and one of the blue LED chips; another one of the four electrode plates is connected to another electrode pin of the red LED chip, the green LED chip and the blue LED chip.

[0009] Optionally, the LED packaging structure also includes: a packaging layer; the packaging layer covers the back and sides of the red LED chip, the back and sides of the green LED chip, and the back and sides of the blue LED chip, and covers the electrode plate, and covers the unobstructed surface of the back panel substrate; the polarizer layer is arranged on the surface of the packaging layer facing away from the back panel substrate.

[0010] Optionally, the LED packaging structure also includes: a black glue layer; the black glue layer covers the electrode plate and covers the unobstructed surface of the back panel substrate; the pins of the red LED chip, the green LED chip and the blue LED chip pass through the black glue layer and are connected to the electrode plate; the surfaces of the red LED chip, the green LED chip and the blue LED chip facing the back panel substrate are flush with the surface of the black glue layer facing away from the back panel substrate; the LED packaging structure also includes: a packaging layer; the packaging layer covers the back and sides of the red LED chip, the back and sides of the green LED chip and the back and sides of the blue LED chip, and covers the unobstructed surface of the black glue layer; the polarizer layer is arranged on the surface of the packaging layer facing away from the back panel substrate.

[0011] Optionally, the LED packaging structure also includes: a microlens layer, arranged on the surface of the polarizer layer facing away from the backplane substrate; the microlens layer includes a plurality of microlenses arranged in an array; the microlenses are arranged in a one-to-one correspondence with the polarizers; and the microlenses are suitable for changing the angle of light emitted by the LED packaging structure.

[0012] Optionally, the difference between the thermal expansion coefficient of the material of the microlens and the thermal expansion coefficient of the material of the polarizer is less than 10ppm / °C; the light transmittance of the material of the microlens is greater than or equal to 90% within the light wavelength range of 400nm to 700nm; the light transmittance of the material of the polarizer is greater than or equal to 90% within the light wavelength range of 400nm to 700nm; the material of the microlens includes glass, polycarbonate, epoxy resin, PMMA, silicone or polyimide; the material of the polarizer includes glass, polycarbonate, epoxy resin, PMMA, silicone or polyimide; the RGB three-color LED chip is a Micro LED chip.

[0013] The present invention also provides a method for manufacturing an LED 3D display device, comprising the following steps: providing RGB three-color LED chips; forming an LED packaging structure, wherein the LED packaging structure includes at least one group of the RGB three-color LED chips or emits RGB three-color light; mounting a polarizing plate on the light-emitting side of the LED packaging structure, wherein the polarizing plate is a left-handed polarizing plate or a right-handed polarizing plate; according to whether the polarizing plate is a left-handed polarizing plate or a right-handed polarizing plate, the LED packaging structure after mounting the polarizing plate forms a left-handed packaging body or a right-handed packaging body; alternately mounting the left-handed packaging body and the right-handed packaging body on an LED display driving backplane, wherein the left-handed packaging body and the right-handed packaging body are alternately arranged on the LED display driving backplane; the LED packaging structures in each of the left-handed packaging bodies and each of the right-handed packaging bodies jointly form an LED device layer; and the polarizing plates in each of the left-handed packaging bodies and each of the right-handed packaging bodies jointly form a polarizing plate layer.

[0014] Optionally, the steps of forming the LED packaging structure include: arranging the RGB three-color LED chips on a temporary carrier; providing a backplane substrate, wherein the backplane substrate is provided with a conductive circuit; bonding the temporary carrier to the backplane substrate to connect the RGB three-color LED chips to the conductive circuit of the backplane substrate; removing the temporary carrier, and the remaining structure forms the LED packaging structure.

[0015] The beneficial effects of the present invention are as follows:

[0016] The LED 3D display device provided by the present invention comprises: an LED device layer; the LED device layer comprises a plurality of array-arranged LED packaging structures, the LED packaging structure comprises at least one group of RGB three-color LED chips; a polarizer layer; the polarizer layer comprises a plurality of array-arranged polarizers, located on the surface of the LED packaging structure, and the polarizers correspond to the LED packaging structure one by one; wherein the polarizers comprise left-handed polarizers and right-handed polarizers; the left-handed polarizers and the right-handed polarizers are arranged alternately. Through such an arrangement, the left-right splitting of the display graphics is realized by the alternating arrangement of the left-handed polarizers and the right-handed polarizers, so that the eyes can receive different image information, thereby realizing the naked eye 3D display effect. Furthermore, the polarizer is mounted on the surface of the LED packaging structure, which saves the device space, and because the optical path of the light reaching the optical element (polarizer) after the light is emitted is extremely short (the polarizer is located on the surface of the LED packaging structure), the medium loss in the propagation process is reduced, so that the displayed 3D graphics have higher accuracy and brightness.

[0017] The manufacturing method of the LED 3D display device provided by the present invention can manufacture the LED 3D display device provided by the present invention. The LED 3D display device manufactured by the manufacturing method of the LED 3D display device provided by the present invention realizes the left-right splitting of the display graphics through the alternating arrangement of left-handed polarizers and right-handed polarizers, so that the eyes can receive different image information, thereby realizing the naked eye 3D display effect. Furthermore, the polarizer is mounted on the surface of the LED packaging structure, which saves the device space, and because the optical path of the light reaching the optical element (polarizer) after the light is emitted is extremely short (the polarizer is located on the surface of the LED packaging structure), the dielectric loss in the propagation process is reduced, so that the displayed 3D graphics have higher accuracy and brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of an LED packaging structure and a polarizing layer in an LED 3D display device according to an embodiment of the present invention;

[0020] Figure 2a-2c Schematic diagrams of the arrangement of an LED packaging structure with a left-handed polarizer and an LED packaging structure with a right-handed polarizer in an LED 3D display device according to different embodiments of the present invention;

[0021] Figure 3 A schematic diagram of the arrangement of the LED packaging structure in the LED 3D display device on the display driver backplane according to an embodiment of the present invention;

[0022] Figure 4a This is a front structural schematic diagram of an LED packaging structure in an LED 3D display device according to an embodiment of the present invention;

[0023] Figure 4b A schematic diagram of the back structure of an LED packaging structure in an LED 3D display device according to an embodiment of the present invention;

[0024] Figure 5 is a schematic diagram of an LED packaging structure and a partial structure on its surface in an LED 3D display device according to another embodiment of the present invention;

[0025] Figure 6 FIG. 4 is a flow chart of a method for manufacturing an LED 3D display device according to an embodiment of the present invention.

[0026] Description of reference numerals:

[0027] 1-LED display driver backplane; 2-pixel; 21-first pixel; 22-second pixel; 100-backplane substrate; 210-electrode plate; 211-perforation; 220-electrode; 300-LED chip; 310-red LED chip; 320-green LED chip; 330-blue LED chip; 400-encapsulation layer; 500-polarizer layer; 600-black glue layer; 700-microlens layer. DETAILED DESCRIPTION

[0028] In order to solve the problems of narrow 3D image viewing angle range and image brightness loss of an LED 3D display device, the present invention provides an LED 3D display device and a manufacturing method thereof.

[0029] The present invention provides an LED 3D display device, comprising: an LED device layer; the LED device layer comprises a plurality of LED packaging structures arranged in an array, the LED packaging structure comprises at least one group of RGB three-color LED chips; a polarizer layer; the polarizer layer comprises a plurality of polarizers arranged in an array, the polarizers are located on the surface of the LED packaging structure, and the polarizers correspond to the LED packaging structure one by one; wherein the polarizers comprise left-handed polarizers and right-handed polarizers; the left-handed polarizers and the right-handed polarizers are arranged alternately.

[0030] The present invention also provides a method for manufacturing an LED 3D display device, comprising the following steps: providing RGB three-color LED chips; forming an LED packaging structure, wherein the LED packaging structure includes at least one group of the RGB three-color LED chips or emits RGB three-color light; mounting a polarizing plate on the light-emitting side of the LED packaging structure, wherein the polarizing plate is a left-handed polarizing plate or a right-handed polarizing plate; according to whether the polarizing plate is a left-handed polarizing plate or a right-handed polarizing plate, the LED packaging structure after mounting the polarizing plate forms a left-handed packaging body or a right-handed packaging body; alternately mounting the left-handed packaging body and the right-handed packaging body on an LED display driving backplane, wherein the left-handed packaging body and the right-handed packaging body are alternately arranged on the LED display driving backplane; the LED packaging structures in each of the left-handed packaging bodies and each of the right-handed packaging bodies jointly form an LED device layer; and the polarizing plates in each of the left-handed packaging bodies and each of the right-handed packaging bodies jointly form a polarizing plate layer.

[0031] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. In the description of the present invention, it should be noted that the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0032] Example 1

[0033] refer to Figure 1 ,as well as Figure 2a-2c This embodiment provides an LED 3D display device, including:

[0034] LED device layer; the LED device layer includes a plurality of LED packaging structures arranged in an array, and the LED packaging structure includes at least one group of RGB three-color LED chips 300; that is, one LED packaging structure can be used alone as a pixel 2 for emitting light.

[0035] A polarizer layer 500; the polarizer layer 500 includes a plurality of polarizers arranged in an array and located on the surface of the LED packaging structure, wherein the polarizers correspond to the LED packaging structure one by one; wherein the polarizers include left-handed polarizers and right-handed polarizers; the left-handed polarizers and the right-handed polarizers are arranged alternately.

[0036] The LED 3D display device provided in this embodiment, through the above-mentioned settings, realizes the left-right split of the display graphics by alternating the arrangement of left-handed polarizers and right-handed polarizers, so that the eyes can receive different image information, thereby realizing the naked eye 3D display effect. Furthermore, the polarizer is mounted on the surface of the LED packaging structure, which saves the device space, and because the optical path of the light reaching the optical element (polarizer) after the light is emitted is extremely short (the polarizer is located on the surface of the LED packaging structure), the dielectric loss in the propagation process is reduced, so that the displayed 3D graphics have higher accuracy and brightness.

[0037] In some embodiments, the left-handed polarizer and the right-handed polarizer are circular polarizers. Circular polarizers can provide the largest viewing angle. In some other embodiments, they can also be linear polarizers, elliptical polarizers, birefringent polarizers, reflective polarizers, composite polarizers, etc.

[0038] For further reference, Figure 2a or Figure 2b In some embodiments, the left-handed polarizer and the right-handed polarizer are arranged alternately as follows: in a coordinate system with any corner of the LED device layer as the origin and two orthogonal sides of the LED device layer as the coordinate axes, in at least one direction of the coordinate axis, the left-handed polarizer and the right-handed polarizer are arranged alternately. For example, with any corner of the LED device layer as the origin, the two sides intersecting at this point are the coordinate axes. Based on this, Figure 2a In the figure, left-handed polarizers and right-handed polarizers are arranged alternately along the horizontal axis; Figure 2b In the figure, the left-handed polarizer and the preferred polarizer are arranged along the vertical axis. Figure 2a As shown, the pixel 2 includes a first pixel 21 and a second pixel 22. From the left, the first column is a left-handed polarizer, and the second column is a right-handed polarizer. The first pixels 21 are all left-handed polarizers, and the second pixels 22 are all right-handed polarizers, and they are arranged alternately in this order. In some other embodiments, the first column may be a right-handed polarizer, and the second column may be a left-handed polarizer. Figure 2b As shown, the pixel 2 includes a first pixel 21 and a second pixel 22. From the top, the first column is a left-handed polarizer, and the second column is a right-handed polarizer. The first pixels 21 are all left-handed polarizers, and the second pixels 22 are all right-handed polarizers, and they are arranged alternately in this order. In some other embodiments, other alternating arrangements may also be used. For example, in some other embodiments, the first column may be a right-handed polarizer, and the second column may be a left-handed polarizer.

[0039] For further reference, Figure 2cIn some embodiments, the left-handed polarizer and the right-handed polarizer are alternately arranged as follows: in a coordinate system with any corner of the LED device layer as the origin and two orthogonal sides of the LED device layer as the coordinate axes, in the directions of the two coordinate axes, the left-handed polarizer and the right-handed polarizer are alternately arranged. Figure 2c As shown in the figure, in the direction of the two coordinate axes, the left-handed polarizers and the right-handed polarizers are arranged alternately. For any left-handed polarizer, the adjacent one is a right-handed polarizer; for any right-handed polarizer, the adjacent one is a left-handed polarizer. The final arrangement is like a chessboard.

[0040] For further reference, Figure 3 and Figure 4a , Figure 4b . Figure 4a , Figure 4b show Figure 3 The group of RGB tri-color LED chips 300 includes a red LED chip 310, a green LED chip 320 and a blue LED chip 330 ( Figure 4a The LED packaging structure includes: a backplane substrate 100 (refer to Figure 1 ); the backplane substrate 100 is provided with a conductive circuit; one side surface of the backplane substrate 100 is provided with four electrode plates 210; three of the four electrode plates 210 are respectively connected to one electrode pin of one of the red LED chip 310, the green LED chip 320 and the blue LED chip 330; another of the four electrode plates 210 is connected to another electrode pin of the red LED chip 310, the green LED chip 320 and the blue LED chip 330. The electrode plates 210 are connected, and then connected to the conductive circuit in the backplane substrate 100, and the electrode 220 is connected by the through hole 211 penetrating the electrode plate 210, and then connected to the driving circuit of the LED display driving backplane. In this way, each LED package structure includes a group of three-color LED chips 300, and can be connected to an external driving circuit through the conductive circuit of the backplane substrate 100, so that the light emission of a pixel 2 can be realized.

[0041] In some other embodiments, it can also be a single-color LED that cooperates with the color conversion layer to emit three-color light. For example, the blue LED chip 330 cooperates with the quantum dot layer to achieve three-color light emission.

[0042] For further reference, Figure 1, the LED packaging structure also includes: a packaging layer 400; the packaging layer 400 covers the back and side of the red LED chip 310, the back and side of the green LED chip 320, and the back and side of the blue LED chip 330, and covers the electrode plate 210, and covers the unblocked surface of the backplane substrate 100; the polarizer layer 500 is arranged on the surface of the packaging layer 400 facing away from the backplane substrate 100. In this way, the LED chip is encapsulated and sealed to achieve water vapor isolation and physical collision protection for the LED chip. The polarizer is directly arranged on the surface of the packaging layer 400, so that the distance between the polarizer and the LED chip is very close, and the whole can be used as a package. Compared with adding additional optical elements outside the actual module, the optical path is shorter. And each pixel 2 (that is, an LED packaging structure) corresponds to a polarizer, which can realize the pixel-level splitting of the display image, and the final 3D display image effect of the left and right eye images is clearer. And because the polarizer is very close to the LED chip, the optical path is shortened, which reduces the consumption of light in the propagation medium, and the final brightness displayed is also higher.

[0043] For further reference, Figure 5 In some other embodiments, the LED packaging structure further includes: a black glue layer 600; the black glue layer 600 covers the electrode plate 210 and covers the unblocked surface of the backplane substrate 100; the pins of the red LED chip 310, the green LED chip 320 and the blue LED chip 330 pass through the black glue layer 600 and are connected to the electrode plate 210; the red LED chip 310, the green LED chip 320 and the blue LED chip 330 face the backplane The surface of one side of the substrate 100 is flush with the surface of the black glue layer 600 facing away from the backplane substrate 100; the LED packaging structure further includes: a packaging layer 400; the packaging layer 400 covers the back and side of the red LED chip 310, the back and side of the green LED chip 320, and the back and side of the blue LED chip 330, and covers the unblocked surface of the black glue layer 600; the polarizer layer 500 is arranged on the surface of the packaging layer 400 facing away from the backplane substrate 100. By setting the black glue layer 600, the area around the LED chip can be filled with black, thereby improving the contrast of the displayed image.

[0044] For further reference, Figure 5 In some other embodiments, the LED packaging structure further includes: a microlens layer 700, which is arranged on the surface of the polarizer layer 500 facing away from the backplane substrate 100; the microlens layer 700 includes a plurality of microlenses arranged in an array; the microlenses are arranged in a one-to-one correspondence with the polarizers; and the microlenses are suitable for changing the angle of light emitted by the LED packaging structure.

[0045] By setting the lenses in a one-to-one correspondence, the angle of the outgoing light modulated by the left-handed polarizer and the right-handed polarizer can be further adjusted. Specifically, by adjusting the radius of curvature and size of the microlens, it is ensured that it can guide the light into the expected angle range, thereby expanding the viewing angle or enhancing the light gathering in a certain direction. For example, the outgoing light is deflected outward so that the viewing angle range can reach ±30° to ±40° from the midline to the outside. In addition, the light can also be concentrated in certain directions to make the displayed image clearer and the local area brighter, achieving a better display effect.

[0046] Furthermore, in some embodiments, the thermal expansion coefficient of the material of the microlens matches the thermal expansion coefficient of the material of the polarizer. Matching the thermal expansion coefficients of the material of the microlens and the material of the polarizer can ensure that the two laminated materials will not be deformed or damaged due to mismatched thermal expansion coefficients. The difference between the thermal expansion coefficients of the material of the microlens and the material of the polarizer is less than 10ppm / °C.

[0047] In addition, the material of the microlens has a light transmittance greater than or equal to 90% within the light wavelength range of 400nm to 700nm; the material of the polarizer has a light transmittance greater than or equal to 90% within the light wavelength range of 400nm to 700nm; in this way, effective transmission of light is ensured to prevent a decrease in display brightness.

[0048] Specifically, in some embodiments, the material of the microlens includes glass, polycarbonate, epoxy resin, PMMA, silica gel or polyimide. The material of the polarizer includes glass, polycarbonate, epoxy resin, PMMA, silica gel or polyimide.

[0049] In some embodiments, the RGB tri-color LED chip 300 is a Micro LED chip.

[0050] Example 2

[0051] refer to Figure 6 This embodiment provides a method for manufacturing an LED 3D display device, which is used to manufacture the LED 3D display device of the above embodiment 1. The method comprises the following steps:

[0052] Provide RGB three-color LED chips;

[0053] Forming an LED packaging structure, wherein the LED packaging structure includes at least one group of RGB three-color LED chips or emits RGB three-color light;

[0054] A polarizing plate is mounted on the light-emitting side of the LED packaging structure, wherein the polarizing plate is a left-handed polarizing plate or a right-handed polarizing plate; and according to whether the polarizing plate is a left-handed polarizing plate or a right-handed polarizing plate, the LED packaging structure after mounting the polarizing plate forms a left-handed packaging body or a right-handed packaging body;

[0055] The left-handed package and the right-handed package are alternately mounted on the LED display driver backplane, and the left-handed package and the right-handed package are alternately arranged on the LED display driver backplane; the LED packaging structures in each of the left-handed package and each of the right-handed package jointly form an LED device layer; the polarizers in each of the left-handed package and each of the right-handed package jointly form a polarizer layer 500.

[0056] The manufacturing method of the LED 3D display device provided in this embodiment can manufacture the LED 3D display device provided by the present invention. The LED 3D display device manufactured by the manufacturing method of the LED 3D display device provided by the present invention realizes the left-right splitting of the display graphics through the alternating arrangement of left-handed polarizers and right-handed polarizers, so that the eyes can receive different image information, thereby realizing the naked eye 3D display effect. Furthermore, the polarizer is mounted on the surface of the LED packaging structure, which saves the device space, and because the optical path of the light reaching the optical element (polarizer) after the light is emitted is extremely short (the polarizer is located on the surface of the LED packaging structure), the dielectric loss in the propagation process is reduced, so that the displayed 3D graphics have higher accuracy and brightness.

[0057] Furthermore, the steps of forming the LED packaging structure include:

[0058] Arrange the RGB tri-color LED chips on a temporary carrier; provide a backplane substrate 100, wherein the backplane substrate 100 is provided with a conductive circuit;

[0059] Bonding the temporary carrier to the backplane substrate 100 to connect the RGB LED chips to the conductive circuits of the backplane substrate 100;

[0060] The temporary carrier is removed, and the remaining structure is formed into the LED packaging structure.

[0061] The above-mentioned manufacturing method is described below by taking a specific implementation process as an example.

[0062] This embodiment is based on a Micro-LED chip with a size of 34μm×58μm and adopts the Micro LED in Package (MIP) technology route.

[0063] The Micro-LED chip is temporarily bonded to the temporary carrier board 1, the sapphire substrate is peeled off, and then the array is transferred to the temporary carrier board 2 according to the requirements of the package backplane through the mass transfer technology. The temporary carrier board 2 is welded or bonded to the package backplane to make the LED chip and the backplane electrically connected. After that, the temporary carrier board 2 is removed, and the LED chip is packaged by film lamination, film lamination, or glue uniformity to form a packaging layer 400. The 34μm×58μm Micro-LED chip is packaged using MIP technology. Through this technology, the Micro-LED chip is packaged into an independent packaging unit, and the luminous efficiency and optical stability of the chip are ensured.

[0064] After the initial packaging is completed, a left-handed or right-handed circular polarizer is bonded to the surface of each package. The left-handed polarizer is used to produce the left-eye image, and the right-handed polarizer is used for the right-eye image, forming a left-handed package and a right-handed package respectively, thereby achieving image separation through polarized light. The bonding process needs to ensure that the polarizer is tightly bonded to the surface of the package and maintains a good optical effect. In order to ensure that the polarizer is tightly bonded to the surface of the package and maintains a good optical effect, the bonding process needs to be carried out under a pressure of 50kPa to 100kPa and a temperature of 60℃ to 80℃, and the bonding time is controlled within 5 to 10 seconds. At the same time, the thickness of the polarizer and the package should be controlled at 100μm to 200μm respectively, and the refractive index difference should be less than 0.05 to reduce light reflection loss, and the transmittance should be maintained above 90% in the visible light range of 400nm to 700nm. In addition, the bonding process should ensure that the surface roughness is less than 10nm, the transparency of the optical adhesive is not less than 98%, and it should be carried out in a dust-free environment with a cleanliness level of Class 1000 to avoid impurities affecting the optical performance. The adhesion strength should reach 5N / cm 2 The above ensures that the polarizer and the package will not be delaminated or fall off during subsequent operation and use, and the optical transmittance should not drop by more than 5% after bonding. In some embodiments, a lens is further mounted on the left-handed package and the right-handed package. By setting the parameters of the microlens and adjusting the angle of the emitted light, the image viewing angle can be expanded or the display effect can be concentrated.

[0065] Afterwards, a cutting process is used to cut the package back plate and the structure thereon (including the LED package structure, the package layer 400, the polarizer and the microlens) into several independent left-handed packages and right-handed packages of 200 μm×200 μm.

[0066] The left-handed package and the right-handed package are alternately mounted on the LED display driver backplane 1 by using surface mounting technology (SMT). The LED package structures in each of the left-handed package and each of the right-handed package jointly form an LED device layer; the polarizers in each of the left-handed package and each of the right-handed package jointly form a polarizer layer; and the microlenses in each of the left-handed package and each of the right-handed package form a microlens layer.

[0067] The LED 3D display device prepared by the above process ensures that the left and right eyes receive different polarized light respectively by alternately arranging left-handed polarizers and right-handed polarizer packages. For example, left-handed polarized light packages are used for even rows, and right-handed polarized light packages are used for odd rows. Through this alternating arrangement, the left and right eyes receive different image information respectively, thereby achieving a stereoscopic 3D display effect. The experimental results show that the microlens layer can not only improve the brightness of the display, but also optimize the direction of light propagation to ensure the stability and clarity of the 3D image within a larger viewing angle range. The 3D image displayed by the LED 3D display device of this embodiment has an effective viewing angle range of ±30° to ±40° from the midline outward. The brightness can be increased by 15%-20% compared with the external optical device of the prior art. Through the optimized polarizer and microlens layer, the package of this embodiment has good optical contrast, which can provide clearer images and excellent display effects.

[0068] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. An LED 3D display device, characterized in that: include: LED device layer; The LED device layer includes a plurality of LED packaging structures arranged in an array, and the LED packaging structure includes at least one group of RGB three-color LED chips or emits RGB three-color light; A polarizer layer; the polarizer layer includes a plurality of polarizers arranged in an array, and is located on the surface of the LED packaging structure, and the polarizers correspond to the LED packaging structure one by one; The polarizers include a left-handed polarizer and a right-handed polarizer; the left-handed polarizer and the right-handed polarizer are arranged alternately.

2. The LED 3D display device according to claim 1, characterized in that: The left-handed polarizer and the right-handed polarizer are alternately arranged as follows: in a coordinate system with any corner of the LED device layer as the origin and two orthogonal sides of the LED device layer as coordinate axes, the left-handed polarizer and the right-handed polarizer are alternately arranged in at least one direction of the coordinate axis.

3. The LED 3D display device according to claim 2, characterized in that: The left-handed polarizer and the right-handed polarizer are arranged alternately as follows: in a coordinate system with any corner of the LED device layer as the origin and two orthogonal sides of the LED device layer as coordinate axes, the left-handed polarizer and the right-handed polarizer are arranged alternately in the directions of the two coordinate axes.

4. The LED 3D display device according to claim 1, characterized in that: The group of RGB three-color LED chips includes a red LED chip, a green LED chip and a blue LED chip; The LED packaging structure comprises: A backplane substrate; the backplane substrate is provided with a conductive circuit; Four electrode plates are arranged on one side surface of the back panel substrate; three of the four electrode plates are respectively connected to one electrode pin of the red LED chip, the green LED chip and one of the blue LED chips; another of the four electrode plates is connected to another electrode pin of the red LED chip, the green LED chip and the blue LED chip.

5. The LED 3D display device according to claim 4, characterized in that: The LED packaging structure further includes: a packaging layer; the packaging layer covers the back and side of the red LED chip, the back and side of the green LED chip, and the back and side of the blue LED chip, and covers the electrode plate, and covers the unshielded surface of the backplane substrate; The polarizer layer is arranged on a surface of the packaging layer facing away from the backplane substrate.

6. The LED 3D display device according to claim 4, characterized in that: The LED packaging structure further includes: a black glue layer; the black glue layer covers the electrode plate and covers the unshielded surface of the backplane substrate; The pins of the red LED chip, the green LED chip and the blue LED chip penetrate the black glue layer and are connected to the electrode plate; the surfaces of the red LED chip, the green LED chip and the blue LED chip facing the backplane substrate are flush with the surface of the black glue layer facing away from the backplane substrate; The LED packaging structure also includes: a packaging layer; the packaging layer covers the back and sides of the red LED chip, the back and sides of the green LED chip, and the back and sides of the blue LED chip, and covers the unblocked surface of the black glue layer; the polarizer layer is arranged on the surface of the packaging layer facing away from the back panel substrate.

7. The LED 3D display device according to claim 5 or 6, characterized in that: The LED packaging structure also includes: a microlens layer, which is arranged on the surface of the polarizer layer facing away from the backplane substrate; the microlens layer includes a plurality of microlenses arranged in an array; the microlenses are arranged in a one-to-one correspondence with the polarizers; and the microlenses are suitable for changing the angle of light emitted by the LED packaging structure.

8. The LED 3D display device according to claim 7, characterized in that: The difference between the thermal expansion coefficient of the material of the microlens and the thermal expansion coefficient of the material of the polarizer is less than 10 ppm / °C; The difference in light transmittance between the material of the microlens and the material of the polarizer in the light wavelength range of 400nm to 700nm is less than 5%; The material of the microlens has a light transmittance greater than or equal to 90% within the light wavelength range of 400nm to 700nm; The material of the polarizer has a light transmittance greater than or equal to 90% within the light wavelength range of 400nm to 700nm; The material of the microlens includes glass, polycarbonate, epoxy resin, PMMA, silicone or polyimide; The material of the polarizer includes glass, polycarbonate, epoxy resin, PMMA, silica gel or polyimide; The RGB three-color LED chip is a Micro LED chip.

9. A method for manufacturing an LED 3D display device, characterized in that: The following steps are involved: Provide RGB three-color LED chips; Forming an LED packaging structure, wherein the LED packaging structure includes at least one group of RGB three-color LED chips or emits RGB three-color light; A polarizer is mounted on the light emitting side of the LED packaging structure, wherein the polarizer is a left-handed polarizer or a right-handed polarizer; According to whether the polarizer is a left-handed polarizer or a right-handed polarizer, the LED packaging structure after mounting the polarizer forms a left-handed packaging body or a right-handed packaging body; The left-handed package and the right-handed package are alternately mounted on the LED display driver backplane, and the left-handed package and the right-handed package are alternately arranged on the LED display driver backplane; the LED packaging structures in each of the left-handed package and each of the right-handed package jointly form an LED device layer; and the polarizers in each of the left-handed package and each of the right-handed package jointly form a polarizer layer.

10. The method for manufacturing an LED 3D display device according to claim 9, characterized in that: The steps of forming the LED packaging structure include: Arrange the RGB tri-color LED chips on a temporary carrier board; Providing a backplane substrate, wherein the backplane substrate is provided with a conductive circuit; Bonding the temporary carrier to the backplane substrate, so that the RGB tri-color LED chip is connected to the conductive circuit of the backplane substrate; The temporary carrier is removed, and the remaining structure is formed into the LED packaging structure.

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