A light emitting device

Abstract

The application discloses a light-emitting device, comprising: a light-emitting panel comprising a light-emitting area and a non-light-emitting area, a flexible circuit board being bonded to the non-light-emitting area; a second circuit structure layer comprising a fixed area and a suspended area, the flexible circuit board comprising a first circuit structure layer; the fixed area of the second circuit structure layer is fixedly arranged on the non-light-emitting area of the light-emitting panel through an adhesive layer, the suspended area is not in contact with the light-emitting panel, and an electrostatic protection unit is arranged on a surface of the suspended area away from the light-emitting panel; or, the fixed area of the second circuit structure layer is fixedly arranged on the first circuit structure layer through an adhesive layer, the suspended area is oppositely arranged with the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, and an electrostatic protection unit is arranged on a surface of the suspended area away from the first circuit structure layer. The application can ensure better electrostatic protection for the display panel while not affecting the bending performance of the light-emitting device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of organic light emitting, in particular to a light emitting device. BACKGROUND

[0002] Organic light emitting diode (OLED) as a new type of display and lighting technology, is gradually widely used. OLED has the risk of failure under the action of static electricity, so a stable anti-static method is needed. SUMMARY

[0003] The present application provides a light emitting device, by setting an electrostatic protection unit in the non-light emitting area of the flexible circuit board or the light emitting panel, the better electrostatic protection of the display panel is ensured, and the bending performance of the flexible circuit board and the light emitting panel is not affected, and the bending performance of the light emitting device is not affected.

[0004] According to one aspect of the present application, a light emitting device is provided, comprising:

[0005] The light emitting panel, the flexible circuit board, the second circuit structure layer and the electrostatic protection unit;

[0006] The light emitting panel comprises a light emitting area and a non-light emitting area, the light emitting area comprises a plurality of light emitting units; the flexible circuit board is bonded in the non-light emitting area; the second circuit structure layer comprises a fixed area and a suspended area, the flexible circuit board comprises a first circuit structure layer; the electrostatic protection unit is used for electrostatic protection of the light emitting unit;

[0007] The fixed area of the second circuit structure layer is fixedly arranged in the non-light emitting area of the light emitting panel through the adhesive layer, the suspended area is not in contact with the light emitting panel, the electrostatic protection unit is arranged on the surface of the suspended area away from the light emitting panel, and the electrostatic protection unit is electrically connected with the light emitting unit through the second circuit structure layer; or, the fixed area of the second circuit structure layer is fixedly arranged on the first circuit structure layer through the adhesive layer, the suspended area is arranged opposite to the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, the electrostatic protection unit is arranged on the surface of the suspended area away from the first circuit structure layer, and the electrostatic protection unit is electrically connected with the light emitting unit through the first circuit structure layer and the second circuit structure layer.

[0008] Optionally, the second circuit structure layer and the electrostatic protection unit are arranged on one side of the first circuit structure layer away from the light emitting panel, or the second circuit structure layer and the electrostatic protection unit are arranged on one side of the first circuit structure layer adjacent to the light emitting panel.

[0009] Optionally, the first circuit structure layer comprises a first trace layer, a first flexible region and a second flexible region, and the second circuit structure layer comprises a second trace layer; a surface of the first flexible region is provided with a first bonding pin, the first bonding pin is electrically connected with the first trace layer, and the first bonding pin is used for bonding connection with a light-emitting panel;

[0010] When the second circuit structure layer is fixedly arranged on the first flexible region through the adhesive layer, the electrostatic protection unit is electrically connected with the light-emitting unit in the light-emitting panel through the second trace layer and the first bonding pin.

[0011] When the second circuit structure layer is arranged on the non-light-emitting region, the electrostatic protection unit is electrically connected with the light-emitting unit in the light-emitting panel through the through hole in the second trace layer and the adhesive layer.

[0012] Optionally, the first circuit structure layer comprises at least one sub-circuit layer, and each sub-circuit layer comprises a first support layer and a first trace layer arranged on both sides of the first support layer.

[0013] The second circuit structure layer further comprises a second support layer, and the second trace layer is arranged on a surface of the second support layer.

[0014] Optionally, when the second circuit structure layer is arranged on the first circuit structure layer, a vertical projection of the overhanging region on the first circuit structure layer is located in the second flexible region, and a distance between an edge of the overhanging region away from the fixed region and an edge of the second flexible region away from the first flexible region is greater than zero.

[0015] Optionally, when the second circuit structure layer is arranged on the first circuit structure layer, the first bonding pin is arranged in an edge region of the first flexible region away from the second flexible region.

[0016] An included angle between a length direction of the electrostatic protection unit and the edge of the second flexible region away from the first flexible region is less than a preset angle, and the preset angle is less than 90 degrees.

[0017] Optionally, the electrostatic protection unit comprises at least one of a pressure-sensitive resistor, a capacitor, an ESD diode, a TVS diode and a fuse.

[0018] Optionally, a surface of the second circuit structure layer in the overhanging region is provided with a reinforcing structure, and the reinforcing structure and the electrostatic protection unit are arranged on two surfaces opposite to the second circuit structure layer.

[0019] A surface of the first circuit structure layer is provided with a first protective film.

[0020] The second circuit structure layer surface is provided with a second protective film

[0021] Optionally, each light emitting unit is provided with at least one electrostatic protection unit, and the first electrode and the second electrode of the light emitting unit are electrically connected with the first end and the second end of the corresponding electrostatic protection unit respectively.

[0022] Optionally, when the electrostatic protection unit comprises a capacitor, the capacitance of the capacitor is greater than the equivalent capacitance of the light emitting unit corresponding to the electrostatic protection unit.

[0023] The breakdown voltage of the capacitor is greater than a preset voltage.

[0024] The preset voltage V = a * 100pf / (100pf + b), wherein a is a preset electrostatic voltage, and b is the equivalent capacitance of the light emitting unit.

[0025] In the embodiment of the present application, the electrostatic protection unit is arranged in the overhanging area of the second circuit structure layer, and the second circuit structure layer is arranged in the non-light emitting area of the light emitting panel. The overhanging area is not in contact with the light emitting panel, so that the overhanging area and the electrostatic protection unit do not affect the bending of the light emitting panel and the bending of the light emitting device. Alternatively, the second circuit structure layer is arranged in the first circuit structure layer, and the overhanging area is not in contact with the first circuit structure layer, so that the overhanging area does not affect the bending of the first circuit structure layer, and the electrostatic protection unit does not affect the bending performance of the flexible circuit board. Therefore, the electrostatic protection unit in the embodiment of the present application can ensure better electrostatic protection of the light emitting panel, and does not affect the bending performance of the flexible circuit board and the bending performance of the light emitting panel, and does not affect the bending performance of the light emitting device.

[0026] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present application, nor is it used to limit the scope of the present application. Other features of the present application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creating laborious work.

[0028] Figure 1 is a schematic diagram of a light emitting device provided by the embodiment of the present application.

[0029] Figure 2 is Figure 1 a schematic diagram of a flexible circuit board in the embodiment of the present application.

[0030] Figure 3 is a schematic view of still another light emitting device provided by an embodiment of the present application.

[0031] Figure 4 is Figure 3 is a side view of the light emitting device in

[0032] Figure 5 is a side view of still another light emitting device provided by an embodiment of the present application.

[0033] Figure 6 is a top view of a flexible circuit board provided by an embodiment of the present application.

[0034] Figure 7 is a schematic view of still another flexible circuit board provided by an embodiment of the present application.

[0035] Figure 8 is a side view of still another light emitting device provided by an embodiment of the present application.

[0036] Figure 9 is a connection schematic view of a static protection unit and a light emitting unit provided by an embodiment of the present application.

[0037] Figure 10 is a connection schematic view of still another static protection unit and a light emitting unit provided by an embodiment of the present application. DETAILED DESCRIPTION

[0038] In order to make the personnel in the art better understand the present application scheme, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person of ordinary skill in the art without making creative labor should belong to the protection scope of the present application.

[0039] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0040] The embodiment of the present application provides a light emitting device, comprising:

[0041] The light emitting panel, the flexible circuit board, the second circuit structure layer and the electrostatic protection unit;

[0042] The light emitting panel comprises a light emitting area and a non-light emitting area, the light emitting area comprises a plurality of light emitting units; the flexible circuit board is bonded to the non-light emitting area; the second circuit structure layer comprises a fixed area and a suspended area, the flexible circuit board comprises a first circuit structure layer; and the electrostatic protection unit is used for electrostatic protection of the light emitting units;

[0043] The fixed area of the second circuit structure layer is fixedly arranged on the non-light emitting area of the light emitting panel through an adhesive layer, the suspended area is not in contact with the light emitting panel, the electrostatic protection unit is arranged on the surface of the suspended area away from the light emitting panel, and the electrostatic protection unit is electrically connected with the light emitting units through the second circuit structure layer; or the fixed area of the second circuit structure layer is fixedly arranged on the first circuit structure layer through an adhesive layer, the suspended area is arranged opposite to the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, the electrostatic protection unit is arranged on the surface of the suspended area away from the first circuit structure layer, and the electrostatic protection unit is electrically connected with the light emitting units through the first circuit structure layer and the second circuit structure layer.

[0044] The embodiment of the present application arranges the electrostatic protection unit on the suspended area of the second circuit structure layer, arranges the second circuit structure layer on the non-light emitting area of the light emitting panel, and the suspended area is not in contact with the light emitting panel, so that the suspended area and the electrostatic protection unit do not affect the bending of the light emitting panel and the bending of the light emitting device. Or, the second circuit structure layer is arranged on the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, so that the suspended area does not affect the bending of the first circuit structure layer, and the electrostatic protection unit does not affect the bending performance of the flexible circuit board. Therefore, the electrostatic protection unit of the embodiment of the present application can ensure better electrostatic protection of the light emitting panel, and does not affect the bending performance of the flexible circuit board and the bending performance of the light emitting panel, and does not affect the bending performance of the light emitting device.

[0045] The present application will be described below with reference to specific drawings, Figure 1 is a schematic diagram of a light emitting device provided by the embodiment of the present application, Figure 2 is Figure 1 a schematic diagram of a flexible circuit board in the embodiment, Figure 3 is a schematic diagram of another light emitting device provided by the embodiment of the present application, Figure 4 is Figure 3 a side view of a light emitting device in the embodiment, referring to Figures 1-4 , the light emitting device comprises:

[0046] The light-emitting panel 200, the flexible circuit board 100, the second circuit structure layer 20 and the electrostatic protection unit 30;

[0047] The light-emitting panel 200 includes a light-emitting area 210 and a non-light-emitting area 220, the light-emitting area 210 includes a plurality of light-emitting units 110; the flexible circuit board 200 is bonded in the non-light-emitting area 220; the second circuit structure layer 20 includes a fixed area 201 and a suspended area 202, the flexible circuit board 200 includes the first circuit structure layer 10; the electrostatic protection unit 30 is used for electrostatic protection of the light-emitting unit 110;

[0048] Referring to Figure 3 and Figure 4 , the fixed area 201 of the second circuit structure layer 20 is fixedly arranged on the non-light-emitting area 220 of the light-emitting panel 200 through the adhesive layer 40, the suspended area 201 is not in contact with the light-emitting panel 200, the electrostatic protection unit 30 is arranged on the surface of the suspended area 201 away from the light-emitting panel 200, and the electrostatic protection unit 30 is electrically connected with the light-emitting unit 110 through the second circuit structure layer 20; or, referring to Figure 1 and Figure 2 , the first circuit structure layer 10 includes a first flexible area 101 and a second flexible area 102, the fixed area 201 of the second circuit structure layer 20 is fixedly arranged on the first flexible area 101 through the adhesive layer 40, the suspended area 202 is arranged opposite to the second flexible area 102, and the suspended area 202 is not in contact with the second flexible area 102, the electrostatic protection unit 30 is arranged on the surface of the suspended area 202 away from the first circuit structure layer 10, and the electrostatic protection unit 30 is electrically connected with the light-emitting unit 110 through the first circuit structure layer 10 and the second circuit structure layer 20.

[0049] The electrostatic protection unit 30 is used for electrostatic protection of the light-emitting unit 110 on the light-emitting panel 200, so as to avoid damage of the light-emitting unit 110 caused by static electricity. The electrostatic protection unit 30 can be arranged on the surface of the second circuit structure layer 20 in the form of a patch. The electrostatic protection unit 30 can include at least one of a pressure sensitive resistor, a capacitor, an ESD diode, a TVS diode and a fuse.

[0050] The adhesive layer 40 can be a prepreg or a film layer capable of bonding the first circuit structure layer 10 and the second circuit structure layer 20 together or bonding the second circuit structure layer 20 on the surface of the light-emitting panel 200. The size of the second circuit structure layer 20 is the same as the size of the first circuit structure layer 10, or the size of the second circuit structure layer 20 is smaller than the size of the first circuit structure layer 10. For example, in the direction from the first flexible area 101 to the second flexible area 102, the length of the second circuit structure layer 20 is smaller than the length of the first circuit structure layer 10.

[0051] Since the electrostatic protection unit 30 with stable protection performance has certain hardness, by arranging the electrostatic protection unit 30 in the overhanging area 202, the overhanging area 202 is not in contact with the second flexible area 102, so that the overhanging area 202 does not affect the bending of the second flexible area 102, and the electrostatic protection unit 30 does not affect the bending performance of the flexible circuit board. Alternatively, by arranging the overhanging area 202 not to be in contact with the light-emitting panel 200, the overhanging area 202 does not affect the bending of the light-emitting panel 200.

[0052] In the embodiment of the present application, the electrostatic protection unit 30 is arranged in the overhanging area 202 of the second circuit structure layer 20, and the second circuit structure layer 20 is arranged in the non-light-emitting area 220 of the light-emitting panel 200. The overhanging area 202 is not in contact with the light-emitting panel 200, so that the overhanging area 202 and the electrostatic protection unit 30 do not affect the bending of the light-emitting panel 200 and the bending of the light-emitting device. Alternatively, the second circuit structure layer 20 is arranged in the first flexible area 102 of the first circuit structure layer 10, and the overhanging area 202 is not in contact with the second flexible area 102, so that the overhanging area 202 does not affect the bending of the second flexible area 102, and the electrostatic protection unit 30 does not affect the bending performance of the flexible circuit board. Therefore, the electrostatic protection unit 30 in the embodiment of the present application can ensure better electrostatic protection of the light-emitting panel 200, and does not affect the bending performance of the flexible circuit board and the bending performance of the light-emitting panel 200, and does not affect the bending performance of the light-emitting device.

[0053] Figure 5 is another side view of a light-emitting device provided by the embodiment of the present application, which is based on the above-mentioned embodiments. Optionally, Figure 1 The second circuit structure layer 20 and the electrostatic protection unit 30 are arranged on the side of the first circuit structure layer 10 away from the light-emitting panel 200, or Figure 5 The second circuit structure layer 20 and the electrostatic protection unit 30 are arranged on the side of the first circuit structure layer 10 adjacent to the light-emitting panel 200.

[0054] Specifically, the specific positions of the second circuit structure layer 20 and the electrostatic protection unit 30 can be arranged according to the bending needs of the flexible circuit board 100.

[0055] The above-mentioned embodiments can be optionally combined with Figure 2 and Figure 4 The first circuit structure layer 10 comprises a first wiring layer 11, and the second circuit structure layer 20 comprises a second wiring layer 21; the surface of the first flexible area 101 has a first bonding pin 50, the first bonding pin 50 is electrically connected with the first wiring layer 11, and the first bonding pin 50 is used for bonding connection with the light-emitting panel;

[0056] Referring to Figure 1 andFigure 2 When the second circuit structure layer 20 is arranged on the first flexible area 101, the electrostatic protection unit 30 is electrically connected to the first trace layer 11 through the second trace layer 21; and the electrostatic protection unit 30 is electrically connected to the light emitting unit 110 in the light emitting panel 200 through the first bonding pin 50.

[0057] Referring to Figure 3 and Figure 4 When the second circuit structure layer 20 is arranged on the non-light emitting area 220, the electrostatic protection unit 30 is electrically connected to the light emitting unit 110 in the light emitting panel 200 through the second trace layer 21 and the through hole 41 in the adhesive layer 40.

[0058] The first circuit structure layer 10 can include one, two or more layers of the first trace layer 11. The second circuit structure layer 20 can include one, two or more layers of the second trace layer 21, and the second circuit structure layer 20 is used to arrange the electrostatic protection unit 30, which is electrically connected to the trace in the second trace layer 21.

[0059] Referring to Figure 1 and Figure 2 When the second circuit structure layer 20 is arranged on the first flexible area 101, the second trace layer 21 is electrically connected to the trace in the first trace layer 11, the electrostatic protection unit 30 is electrically connected to the first bonding pin 50 through the second trace layer 21 and the first trace layer 11, the first bonding pin 50 is electrically connected to the second bonding pin 120 on the surface of the light emitting panel 200, and the second bonding pin 120 is electrically connected to the light emitting unit 110. The first trace layer 11 is also used to connect the driving circuit, receive the driving signal sent by the driving circuit, and transmit the driving signal to the light emitting panel 200 to drive the light emitting unit 110 in the light emitting panel 200 to emit light.

[0060] Referring to Figure 3 and Figure 4 When the second circuit structure layer 20 is arranged on the non-light emitting area 220, the through hole 41 in the adhesive layer 40 can be filled with conductive material, the second trace layer 21 and the pin on the surface of the light emitting panel 200 are electrically connected through the conductive material in the through hole 41, and the electrostatic protection unit 30 is electrically connected to the light emitting unit 110.

[0061] In addition, the traces in different layers can be electrically connected through vias. The first bonding pin 50 can be arranged on the surface of the first flexible area 101 away from the second circuit structure layer 20, or on the surface of the first flexible area 101 adjacent to the second circuit structure layer 20.

[0062] On the basis of the above embodiments, optionally, the first circuit structure layer 10 includes at least one sub-circuit layer 60, each sub-circuit layer 60 includes a first support layer 61, and the first trace layer 11 arranged on both sides of the first support layer 61;

[0063] The second circuit structure layer 20 further comprises a second support layer 22, and the second trace layer 21 is arranged on the surface of the second support layer 22.

[0064] Specifically, the first support layer 61 and the second support layer 22 are flexible layers. The first circuit structure layer 10 can comprise one, two or more sub-circuit layers 60, each of the sub-circuit layers 60 comprises a first support layer 61 and one or two first trace layers 11 arranged on the surface of the first support layer 61, and when the sub-circuit layer 60 comprises two first trace layers 11, the two first trace layers 11 are arranged on the opposite surfaces of the first support layer 60.

[0065] The second trace layer 21 is used to connect the electrostatic protection unit 30 and the first trace layer 11, or connect the electrostatic protection unit 30 and the light-emitting panel 200. The second circuit structure layer 20 can comprise one, two or more second trace layers 21, and when the second circuit structure layer 20 comprises two second trace layers 21, the two second trace layers 21 are arranged on the opposite surfaces of the second support layer 22.

[0066] On the basis of the above-mentioned embodiments, optionally, with reference to Figure 2 When the second circuit structure layer 20 is arranged on the first flexible area 101, the vertical projection of the overhanging area 202 on the first circuit structure layer 10 is located in the second flexible area 102, and the distance between the edge of the overhanging area 202 away from the fixed area 201 and the edge of the second flexible area 102 away from the first flexible area 101 is greater than zero. That is, in the direction from the first flexible area 101 to the second flexible area 102, the size of the overhanging area 202 is smaller than the size of the second flexible area 102.

[0067] Specifically, the size of the overhanging area 202 can be adjusted according to the space required for arranging the electrostatic protection unit 30. The vertical projection of the overhanging area 202 on the first circuit structure layer 10 is located in the second flexible area 102, and the distance between the edge of the overhanging area 202 away from the fixed area 201 and the edge of the second flexible area 102 away from the first flexible area 101 is greater than zero, so that when the second flexible area 101 is bent towards the side adjacent to the overhanging area 202 and the side away from the overhanging area 202, the overhanging area 202 does not affect the bending performance of the second flexible area 101, and the overhanging area 202 has a small size and is not prone to large deformation, so that large deformation can be avoided, and the electrostatic protection unit 30 is prevented from falling off.

[0068] Figure 6 is a top view of a flexible circuit board provided by an embodiment of the present application, and on the basis of the above-mentioned embodiments, with reference to Figure 2 , Figure 5 and Figure 6Optionally, when the second circuit structure layer 20 is arranged on the first flexible area 101, the first bonding pin 50 is arranged on the edge area of the first flexible area 101 away from the second flexible area 102; and the angle between the length direction of the electrostatic protection unit 30 and the edge 203 of the second flexible area 102 away from the first flexible area 101 is less than a preset angle, wherein the preset angle is less than 90 degrees.

[0069] Specifically, the first bonding pin 50 is arranged on the edge area of the first flexible area 101 away from the second flexible area 102. After the first bonding pin 50 is bonded on the light-emitting panel, the end of the second flexible area 102 away from the first flexible area 101 is a free bending end. When the second flexible area 102 is bent, the second flexible area 102 bends around an axis parallel to the edge 203 of the second flexible area 102 away from the first flexible area 101, and the edge 203 of the second flexible area 102 away from the first flexible area 101 moves as a whole without deformation. The electrostatic protection unit 30 has a large size in the length direction. When the second flexible area 102 is bent, the overhanging area 202 will also be bent to a certain extent under the action of the second flexible area 102. If the overhanging area 202 is bent, the long side of the electrostatic protection unit 30 will be subjected to a large bending stress, and the electrostatic protection unit 30 is easy to separate from the second circuit structure layer 20, thereby affecting the electrostatic protection performance of the electrostatic protection unit 30.

[0070] By arranging the angle between the length direction of the electrostatic protection unit 30 and the edge 203 of the second flexible area 102 away from the first flexible area 101 to be less than a preset angle, when the flexible circuit board is bent, the long side of the electrostatic protection unit 30 is subjected to a smaller bending force, thereby improving the connection stability between the electrostatic protection unit 30 and the second circuit structure layer 20. For example, as shown in FIG. 2, the angle between the length direction of the electrostatic protection unit 30 and the edge 203 of the second flexible area 102 away from the first flexible area 101 is 0, so that when the flexible circuit board is bent, the short side of the electrostatic protection unit 30 is subjected to a bending force, and the long side is not subjected to a bending force. Figure 2

[0071] In the above embodiment, the electrostatic protection unit 30 can include at least one of a pressure-sensitive resistor, a capacitor, an ESD diode, a TVS diode, and a fuse.

[0072] Specifically, the pressure-sensitive resistor, the capacitor, the ESD diode, the TVS diode, and the fuse can all withstand a large static voltage. By arranging the electrostatic protection unit 30 to include at least one of the pressure-sensitive resistor, the capacitor, the ESD diode, the TVS diode, and the fuse, the electrostatic protection unit 30 can consume and release static electricity when the light-emitting panel is subjected to a large static electricity, thereby avoiding damage to the light-emitting unit caused by static electricity.

[0073] Figure 7 ​is a schematic view of another flexible circuit board provided by an embodiment of the present application, Figure 8 is a side view of another light emitting device provided by an embodiment of the present application. Based on the above embodiment, optionally, referring to Figure 7 and Figure 8 The surface of the second circuit structure layer 202 in the overhanging area 202 is provided with a reinforcing structure 70, and the reinforcing structure 70 is arranged on the two surfaces opposite to the second circuit structure layer 20 together with the electrostatic protection unit 30.

[0074] Specifically, the reinforcing structure 70 is used to enhance the strength of the structure of the overhanging area 202, so as to avoid large deformation of the overhanging area 202, which leads to warping or falling off of the electrostatic protection unit 30.

[0075] Based on the above embodiment, optionally, the surface of the first circuit structure layer 10 is provided with a first protective film 81; and the surface of the second circuit structure layer 20 is provided with a second protective film 82.

[0076] The first protective film 81 is used to protect the first circuit structure layer 10, and the second protective film 82 is used to protect the second circuit structure layer 20. The first protective film 81 and the second protective film 82 can both be flexible films, and the first protective film 81 and the second protective film 82 can be made of organic materials, such as PI and the like.

[0077] Figure 9 is a connection schematic view of an electrostatic protection unit and a light emitting unit provided by an embodiment of the present application, Figure 10 is another connection schematic view of an electrostatic protection unit and a light emitting unit provided by an embodiment of the present application. Optionally, referring to Figure 9 and Figure 10 Each light emitting unit 110 is correspondingly provided with at least one electrostatic protection unit 30, and the first electrode and the second electrode of the light emitting unit 110 are electrically connected with the first end and the second end of the corresponding electrostatic protection unit, respectively.

[0078] Specifically, the light emitting unit 110 is connected in parallel with the electrostatic protection unit 30. When static electricity acts on the light emitting panel, the static electricity is absorbed by the electrostatic protection unit 30, and the light emitting unit 110 is not damaged. When the electrostatic protection unit 30 is a TVS diode 31, when there is large static electricity, the static electricity is preferentially absorbed by the TVS diode 31, and the light emitting unit 110 is not affected. When the electrostatic protection unit 30 is a capacitor 32, when there is large static electricity, the static electricity is preferentially absorbed by the capacitor 32, and the light emitting unit 110 is not affected.

[0079] Optionally, when the electrostatic protection unit 30 includes the capacitor 32, the capacitance of the capacitor 32 is greater than the equivalent capacitance of the light emitting unit 110 corresponding to the electrostatic protection unit 30.

[0080] The breakdown voltage of the capacitor 32 is greater than the preset voltage.

[0081] The preset voltage V=a*100pf / (100pf+b), wherein a is a preset electrostatic voltage, and b is an equivalent capacitance value of the light emitting unit 110.

[0082] The preset voltage V is a minimum breakdown voltage that the equivalent capacitance of the light emitting unit 110 needs to satisfy when the preset electrostatic voltage a acts on the light emitting unit 110. The capacitance value of the capacitor 32 is greater than the equivalent capacitance value of the light emitting unit 110 corresponding to the electrostatic protection unit 30. The breakdown voltage of the capacitor 32 is greater than the preset voltage, which ensures that the capacitor 32 can withstand the preset electrostatic voltage without being broken down, so that the capacitor 32 can better protect the light emitting unit 110. The preset electrostatic voltage can be the voltage required by JESD22-A114. For example, a is 10kv, and b is 4.7nF, so the breakdown voltage of the capacitor 32 is greater than 208.33V.

[0083] It should be understood that the various forms of flow shown above can be used to reorder, add or delete steps. For example, the steps described in the present application can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions of the present application can be achieved, which are not limited herein.

[0084] The above detailed description does not constitute a limitation on the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A light emitting device, characterized by, The light emitting device comprises a light emitting panel, a flexible circuit board, a second circuit structure layer and an electrostatic protection unit. The light emitting panel comprises a light emitting area and a non-light emitting area, the light emitting area comprises a plurality of light emitting units; the flexible circuit board is bonded to the non-light emitting area; the second circuit structure layer comprises a fixed area and a suspended area, the flexible circuit board comprises a first circuit structure layer; the electrostatic protection unit is used for electrostatic protection of the light emitting units; The fixed area of the second circuit structure layer is fixedly arranged on the non-light emitting area of the light emitting panel through an adhesive layer, the suspended area is not in contact with the light emitting panel, the electrostatic protection unit is arranged on the surface of the suspended area away from the light emitting panel, and the electrostatic protection unit is electrically connected with the light emitting units through the second circuit structure layer; or the fixed area of the second circuit structure layer is fixedly arranged on the first circuit structure layer through an adhesive layer, the suspended area is arranged opposite to the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, the electrostatic protection unit is arranged on the surface of the suspended area away from the first circuit structure layer, and the electrostatic protection unit is electrically connected with the light emitting units through the first circuit structure layer and the second circuit structure layer.

2. The light emitting device according to claim 1, wherein: The second circuit structure layer and the electrostatic protection unit are arranged on one side of the first circuit structure layer away from the light emitting panel, or the second circuit structure layer and the electrostatic protection unit are arranged on one side of the first circuit structure layer adjacent to the light emitting panel.

3. The light emitting device according to claim 1, wherein: The first circuit structure layer comprises a first trace layer, a first flexible area and a second flexible area, and the second circuit structure layer comprises a second trace layer; a surface of the first flexible area has a first bonding pin, the first bonding pin is electrically connected with the first trace layer, and the first bonding pin is used for bonding connection with the light emitting panel; When the fixed area of the second circuit structure layer is fixedly arranged on the first flexible area through an adhesive layer, the electrostatic protection unit is electrically connected with the first trace layer through the second trace layer, and the electrostatic protection unit is electrically connected with the light emitting units in the light emitting panel through the first bonding pin; When the second circuit structure layer is arranged on the non-light emitting area, the electrostatic protection unit is electrically connected with the light emitting units in the light emitting panel through the through hole in the second trace layer and the adhesive layer.

4. The light emitting device according to claim 3, wherein: The first circuit structure layer comprises at least one sub-circuit layer, each sub-circuit layer comprises a first support layer and a first trace layer arranged on both sides of the first support layer; The second circuit structure layer further comprises a second support layer, and the second trace layer is arranged on a surface of the second support layer.

5. The light emitting device according to claim 3, wherein: ​ When the second circuit structure layer is arranged on the first circuit structure layer, a vertical projection of the overhanging area on the first circuit structure layer is located in the second flexible area, and a distance between an edge of the overhanging area away from the fixed area and an edge of the second flexible area away from the first flexible area is greater than zero.

6. The light emitting device of claim 3, wherein: When the second circuit structure layer is arranged on the first circuit structure layer, the first bonding pin is arranged in a first flexible area away from a second flexible area; An angle between a length direction of the electrostatic protection unit and the edge of the second flexible area away from the first flexible area is less than a preset angle, and the preset angle is less than 90 degrees.

7. The light emitting device of claim 1, wherein: The electrostatic protection unit includes at least one of a pressure sensitive resistor, a capacitor, an ESD diode, a TVS diode and a fuse.

8. The light emitting device of claim 1, wherein: In the overhanging area, a surface of the second circuit structure layer is provided with a reinforcing structure, and the reinforcing structure and the electrostatic protection unit are arranged on two surfaces opposite to the second circuit structure layer; A surface of the first circuit structure layer is provided with a first protective film; A surface of the second circuit structure layer is provided with a second protective film.

9. The light emitting device of claim 1, wherein: Each light emitting unit is provided with at least one electrostatic protection unit, and a first electrode and a second electrode of the light emitting unit are electrically connected to a first end and a second end of the corresponding electrostatic protection unit, respectively.

10. The light emitting device of claim 1, wherein: When the electrostatic protection unit includes a capacitor, a capacitance of the capacitor is greater than an equivalent capacitance of a light emitting unit corresponding to the electrostatic protection unit; A breakdown voltage of the capacitor is greater than a preset voltage; The preset voltage V=a*100pf / (100pf+b), wherein a is a preset electrostatic voltage, and b is an equivalent capacitance of the light emitting unit.

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