Electrical connector device and method

Abstract

An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have a density of at least 213 differential pairs per square inch, including 256 differential pairs per square inch. The electrical connector may include at least one internal locking mechanism and / or an external locking mechanism.

Description

Cross-reference to prior applications

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 403,561 filed on September 2, 2022, U.S. Provisional Patent Application No. 63 / 481,702 filed on January 26, 2023, and U.S. Provisional Patent Application No. 63 / 511,451 filed on June 30, 2023, the entire contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present embodiments generally relate to electrical connector devices / assemblies, with specific embodiments for use with electrical connectors being shown. Background Art

[0003] Typical connectors designed to operate at 112G / 224G may require a larger width chip package substrate to accommodate. However, this practice of increasing the size of the chip package substrate may increase insertion loss, and / or make the chip package substrate more susceptible to curling, warping, and / or loss of coplanarity during reflow. Therefore, there is a need to improve the chip package substrate size, reduce the width of the connector, minimize coplanarity issues, and / or minimize insertion loss.

[0004] The present invention aims to overcome or at least improve upon the disadvantages of the prior art. A brief description of other technical features

[0005] The following documents are incorporated herein by reference in their entirety: U.S. Patents 7,927,144; 3,587,028; 11,539,169; 4,571,014; 4,720,770; 6,435,913; 6,506,076; 6,981,898; and 4,632,476; and U.S. Publications US20200212631; US20200280145; US20220368084; US20090203259; US20050215120; and US20210265785. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In the drawings, like reference numerals generally refer to like parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention.

[0007] Figure 1 is a perspective view of one embodiment of an electrical connector assembly, illustrating one embodiment of an electrical connector.

[0008] Figure 2 yes Figure 1 Exploded view of an electrical connector assembly.

[0009] Figure 3A yes Figure 1 A perspective view of multiple electrical connectors.

[0010] Figure 3B yes Figure 3A Side view of the vertical cables.

[0011] Figure 3C yes Figure 3A Side view of a right-angle cable.

[0012] Figure 4A yes Figure 3A A perspective view of a right-angle cable and electrical connector.

[0013] Figure 4B yes Figure 4A Perspective view of a right-angle cable.

[0014] Figure 5 yes Figure 1 A perspective view of an embodiment of a mating interface of an electrical connector.

[0015] Figure 6 yes Figure 5 Exploded view of the mating interface.

[0016] Figure 7 is a perspective view showing a 1024-pair electrical connector assembly.

[0017] Figure 8 is a perspective view of an electrical connector assembly showing pairs 1192 and / or 1280 .

[0018] Fig. 9 is a perspective view of an electrical connector showing a mating interface or plate surrounding a cable connector and / or spaced a distance from a substrate.

[0019] Fig.10 is a perspective view of an electrical connector with the mating surface cut away.

[0020] Fig.11 is a graph illustrating the cable-to-package impedance distribution of one embodiment.

[0021] Fig.12 is a graph illustrating the effects of shield return path transitions for one embodiment.

[0022] Fig.13 is a graph showing the differential FD NEXT power summation for one embodiment.

[0023] Fig.14 is a graph showing the differential FD FEXT power summation for one embodiment.

[0024] Fig.15A PKG and PCB embodiment of 64 pairs of blocks is shown.

[0025] Fig.16A and Fig. 16B An embodiment of a retaining bracket is shown.

[0026] Fig.17 It is part of the PKG substrate wiring.

[0027] Fig.18 It is an embodiment of a PKG relative to a PCB, the design is rotated for vertical routing.

[0028] FIG. 19A to FIG. 19C is a view of an embodiment of a mezzanine, showing a height of less than 8 mm.

[0029] Fig. 20 is another embodiment of an electrical connector with portions of a cable connector removed to illustrate the locking mechanism.

[0030] Fig. 20A yes Fig. 20 An enlarged cross-sectional view showing the latch locking mechanism engaging between portions of the mating interface.

[0031] Fig.21 yes Fig. 20 Exploded diagram of .

[0032] Fig. 22 is a perspective view of the mating interface showing the assembled receptacle base and grounding member.

[0033] Fig.22A yes Fig. 22 An enlarged perspective view of .

[0034] Fig.23 yes Fig. 22 Exploded diagram of .

[0035] Fig.24 is a perspective view of a row of cavities of a mating interface for receiving a row or more connectors.

[0036] Fig.25 yes Fig.24 Exploded diagram of .

[0037] Fig.25A and Fig.25B yes Fig.25 An enlarged perspective view of .

[0038] Fig.26 is another embodiment of an electrical connector in which portions of a cable connector are removed to illustrate a mating interface and portions of a plug connector are cut away.

[0039] Fig. 27 yes Fig.26 A perspective view of an electrical connector with portions of a housing of a mating interface cut away and portions of a housing of a plug connector removed to illustrate embodiments of reinforcement and retaining members.

[0040] Fig.28 yes Fig.26 A perspective view of an electrical connector with the mating interface and cable connector exploded from the plug connector with portions of the housing of the mating interface removed.

[0041] Fig.29 yes Fig.26 An exploded view of a row of cavities of a mating interface for receiving a partial row or multiple connectors.

[0042] Fig.30 It is shown Fig.26 A graph of the differential FD NEXT power summation for one embodiment is shown.

[0043] Fig.31 It is shown Fig.26 A graph of the differential FD FEXT power summation for one embodiment is shown. DETAILED DESCRIPTION

[0044] The embodiments can be further understood with reference to the various drawings. With reference to the drawings, the embodiments provide one or more electrical connector assemblies 20. The assembly 20 may include at least one or more electrical connectors 30. In some embodiments, the electrical connector may include a width of about 12.5 mm, operate at about 224 Gbps, and / or a package size of about 75 mm. The number of pairs may be 64 pairs in less than half an inch or a density of more than 256 pairs per square inch. In some embodiments, the size and shape of the electrical connector may be designed so that a plurality of electrical connectors may be assembled on a single side of a chip package substrate no greater than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors may carry at least 1024 differential signal pairs in total, and the plurality of electrical connectors may transmit about 224 Gbps Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a FEXT (far end crosstalk) of no more than about -40 dB. In various embodiments, the size and shape of the electrical connector can be designed so that a plurality of electrical connectors can be assembled on a single side of a chip package substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors carry at least 1024 differential signal pairs in total, and the plurality of electrical connectors transmit about 224 Gbps PAM4 signals at a bandwidth of about 56 GHz to about 70 GHz with a NEXT (near-end crosstalk) of no more than about -50 dB. In some embodiments, the chip package substrate has sides no larger than about 75-110 mm, including about 80 mm±5 mm, 91 mm±5 mm, 95 mm±5 mm, 100 mm±5 mm, and 105 mm±5 mm, the plurality of electrical connectors carry at least 1024 differential signal pairs in total, and the plurality of electrical connectors transmit about 224 Gbits / sec PAM-4 signals at a bandwidth of about 56 GHz to about 70 GHz with a FEXT of no more than about -40 dB.

[0045] Now referring to the accompanying drawings, Figures 1 to 4B An exemplary embodiment of an electrical connector assembly 20 according to one aspect of the present invention is shown. The electrical connector assembly 20 includes an electrical connector 30 and / or a plurality of cable connectors 40 configured to mate with the electrical connector 30. The electrical connector 30 may include or be connected to a circuit substrate 50, such as a chip package substrate 50a, a printed circuit board 50b. As shown in one embodiment, the connector 30 may be positioned / assembled on a single side of the circuit substrate 50 (e.g., 50a, 50b). However, in some embodiments, the connector 30 may be positioned on both sides. Reference Figure 5 and Figure 6, the electrical connector 30 may include a mating interface or cable head organizer 60 (e.g., an egg crate mating interface or shield). The mating interface 60 may include a plurality of interlocking plates 62 defining a plurality of cavities 63. The connector 30 may include or be configured to mate with one or more cable connectors 40. The size of each cavity 63 is designed to receive or mate with the cable connector 40. The electrical connector 30 may include one or more plug connectors 70. The electrical connector 30 or the plug connector 70 also includes one or more electrical contacts 71 and / or one or more ground contact elements 72. Each electrical contact 71 is positioned within the cavity 63, electrically isolated from the interlocking plate 62, and configured to mate with a contact 42 (e.g., a slot) of the cable connector 40. The contact 42 may be a non-compression type contact, such as a beam to beam or a beam to a blade or a beam to a pad. A plastic or dielectric web and an optional button may be positioned between two adjacent contacts 42, as described in U.S. Pat. No. 10,439,330, the entire contents of which are incorporated herein by reference in their entirety. The contacts 42 may be conductive. The contacts of each differential signal pair may be spaced about 0.3 mm to about 0.4 mm, including about 0.3 mm, about 0.35 mm, about 0.4 mm, and all lengths therebetween. The differential pair to pair spacing may be about 1.4 mm, about 1.5 mm, about 1.6 mm, about 1.7 mm, or about 1.8 mm, and all lengths therebetween. The row to row spacing of the differential signal pair may be about 1.3 mm, about 1.4 mm, about 1.5 mm, about 1.6 mm, about 1.7 mm, or about 1.8 mm. Some rows may be spaced unevenly in the array of differential signal pairs, such as about 1.3 mm for some rows, and about 1.7 mm for the centerline to centerline spacing between other adjacent rows. Each ground contact element 72 may be electrically grounded and configured to mate with at least one plate 62 (e.g., directly, indirectly, a first plate, a second plate). The plug connector 70 (eg, ground contact elements, electrical contacts) may be soldered to the circuit substrate 50 (eg, 50a, 50b). Figure 7 In some embodiments shown, a 1024-pair solution may be used. Figure 8 In other embodiments shown, an 1192 or 1280 pair solution may be used.

[0046] In some embodiments, at least one of the interlocking plates 62 (eg, the first interlocking plate) can be conductive and provide a ground connection between the cable connector 40 and the circuit substrate 50 or a portion thereof. In general, the interlocking plates 62 can be conductive or insulating. Fig. 9 and Fig.10As shown, at least one interlocking plate 62 includes a terminal end 64 spaced apart from the circuit substrate 50, and a mating end 65 for electrically contacting the conductive outer shield element 43 of the cable connector 40. To reduce / control round-trip impedance, the spacing or distance D from the circuit substrate 50 (e.g., package 50a, 50b) to the terminal end 64 of the plate 62 / shield 43 can be reduced by a length L of the plate 62 or cavity 63. The remaining portion of the length or distance D from the circuit substrate to the terminal end 64 can be at least one source of crosstalk. The plate 62 defining the cavity 63 covers or overlaps approximately 85 to 95% of the length of the cable connector 40 to the package or substrate 50 to minimize the distance D. As shown in FIG. Fig. 9 As shown in one embodiment of FIG. , the plate 62 defining the cavity 63 covers / overlaps the cable connector 40 to about 90% or length L of the package to reduce crosstalk, while the remaining portion or distance D may be about 10% to the substrate. Fig.11 One embodiment of the cable-to-package impedance profile is shown in , where a simulation shows a TDR signal of 92Ω + / - 5Ω at 6ps (20%-80% rise time).

[0047] In some embodiments, the terminal end 64 of the plate 62 or cavity 63 may be spaced apart from the package / substrate 50 (e.g., a predetermined distance D). The terminal end 64 or plate 62 may abut / position / mate with the ground contact element 72 of the plug connector at a distance D. The contact element 72 or a portion thereof may space the plate 62 or a portion thereof (e.g., the terminal end 64) apart from the substrate 50 by a distance D. In one embodiment shown, the ground contact element 72 extends / protrudes from the circuit substrate 50 (e.g., 50a, 50b). The ground contact element 72 may include one or more arms / blades. For example, the ground contact element may include at least one arm, at least two arms, at least three arms, at least four arms, or four or more arms. When mated to a mating interface (e.g., a plate), an increase in the number of arms may increase the contact area / width. As shown in one embodiment, the ground contact element 72 may include two arms 72a, 72b (e.g., at least two laterally offset cantilever beams) extending upward and away from each other to define a slot 73 to receive the terminal end 64 (e.g., a first terminal end) of the plate 62. The two arms may be offset from the rest of the ground contact element or body. The two arms 72a may be offset from each other by a distance along the length or plane of the slot 73 of the receiving plate 62. Although the arms may not overlap or cross along the length of the slot, it should be understood that in some embodiments, a portion of the arms may overlap. The slot or one or more portions (e.g., arms) of the ground contact element 72 may define a stopper or vertical stop mechanism for limiting further axial travel of the plate 62 in the slot or toward the circuit substrate. The stopper may position the mating interface, plate or cavity at a distance D. In addition, the first arm 72a and the second arm 72b may be mirror images of each other about the plane of the slot 73. The first arm 72a engages the interior of one cavity / plate, and the second arm 72b engages the interior of an adjacent cavity / plate. In one embodiment shown, two ground contact elements 72 may engage adjacent and parallel plates 62 (e.g., first plates), rather than adjacent second plates defining the cavity 63 of the receiving cable connector 40. However, in some embodiments, one or more ground contact elements 72 may engage one or more second plates and / or engage in combination with one or more first plates. In one embodiment shown, each arm 72a, 72b can be spring loaded or biased to push toward the slot 73 or the engaging plate 62. In addition, each arm or the distal free end of the arm can be opened / bent away from the slot or the engaging plate. As shown in one embodiment, the arm 72 can be surrounded by air or free space without contacting the plastic or insulating member. There can be no plastic between the mating end of the ground contact element 72 and the mating end of the signal contact 71. The mating ends of 71 and 72 can be unrestricted or not surrounded by plastic or insulating members. The arm 72 (e.g., the mating end) can be free-standing, protruding and / or extending above the plastic of the plug connector 70 at the base of the arm (e.g., not inside the plastic).Additionally, there may be no plastic or insulating material along the line extending between the mating end of arm 72b and the immediately adjacent mating end of arm 72b. Fig.12 An example of S-parameters for a shield return path or ground contact element is shown in FIG. Fig.12 The simulated embodiment shown in was performed at 92Ω+ / -5Ω at 6ps (20%-80% rise time). In some embodiments, the contact may include one or more solder balls / masses 74. In one embodiment shown, the ground contact element 72 includes at least one solder block 74. It should be understood that the ground contact element 72 may include one or more solder blocks. For example, at least one solder block, at least two solder blocks, or at least three solder blocks. In some embodiments, two or more solder blocks may be adjacent to each other (e.g., linearly aligned). In some embodiments, the brazing for the contact may be one or more elongated pads of various lengths. In some embodiments, the electrical / signal contact 71 may be perpendicular to the ground contact element 72.

[0048] In a preferred embodiment, the interlocking plates 62 are metal plates formed by any suitable method, such as metal stamping. In other embodiments, the interlocking plates 62 are formed by other means, including molding and / or machining of polymeric materials, molding and / or machining of metals, or constructing a metal frame overmolded with a polymeric material. In some embodiments, the plastic frame / base may be plated.

[0049] In some embodiments, the interlocking / interconnecting plates 62 include a plurality of first plates 62a and a plurality of second plates 62b, such as Figure 5 and Figure 6 As shown. The plate 62 may include one or more grooves 66 and / or one or more slots 67. The grooves (if used) may interlock with the slots (if used) to define the cavity 63. The first plate 62a may include a plurality of first slots 67a aligned with the plurality of first grooves 66a. The second plate 62b may include a plurality of second slots 67b aligned with the plurality of second grooves 66b. When assembled, the second plate 62b is laterally positioned and interconnected relative to the first plate 62a by interlocking the first slots 67a with the second grooves 66b and the second slots 67b with the first grooves 66a, so that the plurality of first plates and the plurality of second plates define a plurality of cavities 63. The slot / groove joints 66, 67 or mating interface 60 provide a fully enclosed or 360-degree shield / periphery around one or more cable connectors 40. The 360-degree shield or plate reduces crosstalk between the cable connectors within the cavity. This can prevent or reduce gaps / holes / paths in the cavity wall to reduce crosstalk. The walls of the slot / groove joint may abut or overlap the edges of the opposing slot / groove joint to reduce the gap. Fig.13As shown, multiple electrical connectors can transmit approximately 70Ghz signals without exceeding approximately -40dB FEXT (far end crosstalk). Fig.13 The simulated embodiment shown in was performed with 92Ω + / - 5Ω at 6ps (20%-80% rise time).

[0050] In some embodiments, the mating interface 60 may include a housing 68. The housing 68, if used, may include a plurality of grooves 69 positioned in the inner periphery. The grooves 69 may maintain the spacing of the cavities 63 / 62 and / or provide rigidity to one or more plates 62. The grooves 69 may receive the ends of the first plate 62a and the second plate 62b.

[0051] In some embodiments, the electrical connector 30 may include one or more gaps / spaces 32 between the cable connectors 40 to reduce crosstalk. In some embodiments, more space or distance between rows can reduce the NEXT of the PKG. In one embodiment shown, the gap 32 can be defined by one or more rows of cavities 63 defined by multiple plates 62 that do not contain cable connectors 40. One or more rows without cable connectors 40 or gaps 32 within the array of cable connectors 40 can reduce crosstalk between cable connectors 40. As shown in one embodiment, the one or more rows / gaps 32 without cable connectors 40 can be defined by multiple smaller cavities (e.g., smaller through openings) or closer spaced plates. Smaller rows or gaps 32 (if used) can be defined by at least two adjacent and parallel plates (e.g., first plate 62a and / or second plate 62b), which are separated by a smaller distance than the remaining parallel plates. Grooves 66 and slots 67 can be positioned on the corresponding plates 62 to define gaps 32 of various row-to-row spacings / distances D. Although not shown, the intersecting plates 62 of both the first plate and the second plate may be spaced apart at a smaller distance (eg, row to row) to define smaller rows. Fig.14 As shown, the plurality of electrical connectors can transmit signals of approximately 70 GHz without exceeding approximately -50 dB NEXT (near end crosstalk). Fig.14 The simulated embodiment shown in was performed with 92Ω + / - 5Ω at 6ps (20%-80% rise time).

[0052] In some embodiments, the component / connector or a portion thereof (e.g., a mating interface, a plug connector, and / or a cable connector) may be a 224 Gbps Pam4 signal, where it is performed at 92Ω+ / -5Ω at 6ps (20%-80% rise time), as simulated in one embodiment. In some embodiments, the bandwidth may be about 70GHz to 50GHz. In some embodiments, the bandwidth may be about 56GHz. In various embodiments, the FEXT may be about -30dB to about -45dB. For example, less than or equal to -30dB, less than or equal to -35dB, less than or equal to -40dB, and / or less than or equal to -45dB. In some embodiments, the insertion loss may be between about 0dB and about -5dB. For example, between 0dB and -1dB, between -1dB and -2dB, between -2dB and -3dB, between -3dB and -4dB, and / or between -4dB and -5dB. The bandwidth may be about 50GHz to about 80GHz. For example, 50GHz, 55GHz, 60GHz, 65GHz, 70GHz, 75GHz and / or 80GHz. In various embodiments, NEXT can be about -40dB to about -60dB. For example, less than or equal to -40dB, less than or equal to -45dB, less than or equal to -50dB, less than or equal to -55dB and / or less than or equal to -60dB. In some embodiments, the insertion loss can be between about 0dB and about -5dB. For example, between 0dB and -1dB, between -1dB and -2dB, between -2dB and -3dB, between -3dB and -4dB and / or between -4dB and -5dB. The bandwidth can be about 50GHz to about 70GHz. For example, 50GHz, 55GHz, 60GHz, 65GHz and / or 70GHz.

[0053] In some embodiments, the assembly 20 or electrical connector 30 may include a bend / cable organizer 80 for one or more cables 90. In some embodiments, the bend / cable organizer 80 may include a strain relief 81. The strain relief 81, if used, may be a hot melt. Figure 3A and Fig.15 As shown, the bend organizer 80 can be used with a vertical cable 90a or a right angle cable 90b. The overall height of the electrical connector 30 or assembly 20 can be less than 15mm. The right angle cable 90b with the bend organizer 80 can define a height of about 15mm. The vertical cable 90a with the bend organizer 80 can define a height of about 10mm.

[0054] In some embodiments, one or more cables 90 can be connected to one or more cable connectors 40. Although the cables 90 are shown as dual cables in one embodiment shown, it should be understood that various cables can be used and still be within the scope of the present invention. For example, coaxial cables can be used in some embodiments. The cable 90 may include a shield, such as a wound shield or an extruded shield, or any type of grounding or reference or EMI shield. The shield may be stripped relative to the exposed surface of the central electrical insulator, and may be partially stripped, but is not limited to a length greater than zero mm to about 1 mm to 2 mm, or zero mm, or 2 mm or greater, or zero mm to 0.5 mm. Any connector may include a conductive or electrically lossy magnetically absorbing material.

[0055] In some embodiments, the assembly 20 or electrical connector may include one or more retaining brackets 95. Fig.16A and Fig. 16B As shown, one example of a retaining bracket 95 may be one or more spring fingers. A retaining device (if used) may ensure mating components and / or allow maintenance. Another example of a retaining bracket may be a latch.

[0056] In some embodiments, the circuit substrate 50 may have a wiring density. Fig.17 As shown, a PKG or chip substrate package can start with a 350μm pitch to minimize FEXT and squeeze the pitch down to 200μm for routing vias. A 0.35 BGA pitch can determine routing density (e.g., 224 Gbps). There can be a PCB embodiment with 64 pairs of blocks. The PCB version can be wider and about 5mm deeper than the chip substrate package, as shown in Figure 1. Fig.15 In addition, Fig.18 An embodiment of a PKG vs. PCB embodiment is shown in . The designs are shown rotated for vertical routing. The PKG can be 2 layers, while the PCB can be 4 / 8 layers.

[0057] In some embodiments, the electrical connector assembly may include a lower RA height option. For example, a compatible cable organizer may be less than 8 mm. FIG. 19A to FIG. 19C As shown, the construction can be a sandwich construction of stacked flexible parts 98. An example as shown can be four 3-layer flexible films stacked, and one of them is soldered to the connector. The flexible part 98 can be converted into one or more cables of longer length.

[0058] In some embodiments, the electrical connector assembly 20, the electrical connector 30, the mating interface 60, 160, the substrate 50, and / or the plug connector 70, 170 may include one or more locking mechanisms 82 or portions thereof that couple the mating interface 160 to the plug connector 170. Figure 20 to Figure 23 In one embodiment shown, the locking mechanism 82 can be an intermediate or internal locking mechanism that is spaced inwardly from or positioned inwardly or located inwardly of the outer periphery (e.g., outer shell, wall) of the electrical connector 30 / connector 170 / mating interface 160. The locking mechanism 82 can include one or more latches, clips, or friction locks 82a (e.g., intermediate, internal). The one or more clips 82a are shown as being within or within / inside the plug connector 170, the mating interface 160, and / or the electrical connector 30 (e.g., outer periphery). Although the clips 82a are shown as being within the electrical / plug connector 30, 170, and / or the mating interface 160, it should be understood that in some embodiments, external clips (e.g., external clips positioned on the outer periphery, wall) can be used in conjunction with internal clips / locking mechanisms. The one or more clips 82a protrude upwardly from the spaced interior of the bottom and / or outer periphery of the plug connector 170 and / or the substrate 50. The clips may protrude upward from an intermediate or inner wall 82ab extending between or within the peripheral wall (e.g., opposing wall) of the mating interface 160 (e.g., base, grounding member) or the plug connector 170. In one embodiment shown, two spaced apart clips 82a may be spring loaded in a lateral direction (e.g., opposite directions, inwardly toward the opposite side of the inner panel 82b) to the plane of the clips 82a and / or the inner wall 82ab. The clips 82a apply friction to the locking mechanism 82 of the mating interface 160 or a portion thereof (e.g., the inner panel 82b, the catch 82ba) to reduce or prevent axial separation between the mating interface 160 and the plug connector 170. The locking mechanism 82 of the mating interface 160 or a portion thereof may be one or more receiving portions / catch members 82ba and / or an inner panel 82b that releasably engages the one or more clips 82a. When assembled, the clips 82a engage the inner panel 82b of the mating interface 160 or a portion thereof (e.g., the upper notch / catch member / receiving portion 82ba). The clip 82a of the plug connector 170 interferes with the axial separation of the mating interface 160 or the inner / middle panel 82b. The inner panel 82b can be positioned in the gap 32 between the cable connector 40 and / or the cavity 32 (e.g., a multi-row cable connector). The inner panel 82b can include one or more notches / catches 82ba in its upper edge. If two notches 82ba are used, the notches can be spaced apart from each other along the length of the panel 82b. One or more portions of the locking mechanism 82 can be reversed between the mating interface 160 and the plug connector 170. For example, it should be understood that in some embodiments, the mating interface 160 can include a clip and the plug connector 170 can include an inner panel.

[0059] exist Figure 20 to Figure 25In one embodiment shown, the mating interface 160 may include a plurality of interlocking plates 62 defining at least one row of R1 cavities 63 that receive at least one row or one or more cable connectors 40. The interlocking plates 62 may include at least two third / opposite / parallel plates 62c that are interconnected by one or more fourth / parallel plates 62d that are transverse to the third plate. The fourth plate 62d may define opposing end plates at opposing ends of a row of cavities or third plates 62c. Each row R1 may include a third plate and a fourth plate. The mating interface 160 may include a plurality of rows R1 defined by the third plate and the fourth plate. The cavity 63 may have a through opening (e.g., an open top and an open bottom) defined by the third plate 62c and the fourth plate 62d. In some embodiments, the third plate 62c may include one or more through openings 62ca that receive one or more protrusions 62da that extend from the outer periphery (e.g., opposite ends / edges) of the fourth plate 62d when assembled. As Fig.24 , Fig.25 and Fig.25B As shown in one embodiment of FIG. 6 , the third plate 62 c may include one or more through holes or elongated slots 62 ca (eg, in a direction between the mating end 65 toward the terminal end 64 ). Fig.24 , Fig.25 and Fig.25A As shown, each fourth plate 62d can include one or more protrusions or elongated protrusions 62da on the opposite side / edge to engage the corresponding elongated slots 62ca of the opposing third plate 62c. The mating end 65 of one or more of the third plate 62c and / or the fourth plate 62d can include a plurality of curved edges to mate or contour with one or more cables 90 or cable connectors 40. The other of the opposing / parallel third plates 62c can be longer than the curved edge (if used) and extend beyond the curved edge, as shown. Fig.24 and 25As shown. In some embodiments, solder paste can be used near the joint of the orifice / protrusion. The cavity defined by the third plate 62c and the fourth plate 62d can receive the cable connector 40. The end plate or the fourth plate 62d can be spaced inward from the opposite end of the third plate or row R1 to define a groove 200b. The groove 200b may include a bottom opening to receive or insert the tongue member 200a of the remaining part (e.g., base, grounding member) of the mating interface 160. The third / fourth plate 62c, 62d (e.g., grounding, metal plate) can be stamped and / or plated. In some embodiments, the plate 62 can be cream solder printed, solder plated and / or laser welded together. The cavity or the third plate and / or the fourth plate can be assembled with one or more heat blades with the one or more cable connectors 40 therein. When assembled, a row of R1 cavities defined by the third and fourth plates 62c, 62d is positioned adjacent to one or more rows of R1 cavities. Adjacent third plates 62c of adjacent chambers / rows R1 may be positioned parallel to each other and / or in contact with each other, such as Fig. 20 , Fig. 20A and Fig.21 As shown. Fig. 20 As shown in one embodiment of , the locking mechanism 82 or a portion thereof, the inner wall 82ab, the gap 32, the inner panel 82b, the notch 82ba and / or the clip 82a can separate two adjacent rows R1 from each other.

[0060] In some embodiments, the mating interface 160 may include a plate (e.g., a third plate, a fourth plate, etc.), a receiving portion base 160a, and / or a grounding member 160b. In some embodiments, the receiving portion base 160a may be, but is not limited to, molded plastic, and / or the grounding member 160b may be, but is not limited to, stamped metal (e.g., conductive metal). In some embodiments, the base 160a or the mating interface 160 may include one or more internal panels 82b and / or a locking mechanism 82 or a portion thereof. The base 160a may include a housing 68 having a peripheral wall 68a defining a through opening 68b. The internal panel 82b may be within or within the outer periphery and extend between opposing walls of the peripheral wall 68a and / or intersect the through opening 68b. The grounding member 160b may include a peripheral wall 68c defining a through opening 68d. The peripheral wall 68c of the grounding member 160b may include a channel 68e (e.g., a U-shaped, inverted channel). The grounding member peripheral wall 68c can cooperate with the base peripheral wall 68a. The channel 68e or the grounding member wall 68c can receive the upper edge of the base peripheral wall 68a. The mating interface 160 may include one or more tongue and groove joints 200. The opposite wall 68c of the grounding member 160b may include one or more tongue members or mating surfaces 200a adjacent to the opposite wall of the base 160a. The tongue member 200a is positioned along at least one wall of the base 160a / grounding member 160b and can be spaced apart from each adjacent tongue member 200a along the wall by a slot 68f (e.g., a vertical, longitudinal slot). Although not shown, the width of the slot 68f can increase from the distal free end of the tongue toward the proximal end or upper edge of the grounding member. For example, the slot can include an upper slot portion that is larger than the lower slot portion. The tongue member may be inside the peripheral wall 68a and mate / engage with one or more grooves 200b of one or more rows R1 / opposite ends of the third and / or fourth plates 62c, 62d of the mating interface. Although not shown, the tongue member or a portion thereof may be spaced inwardly from the inner surface of the base wall 68a. The plates 62c, 62b may contact one or more walls 68c (e.g., opposing walls, one wall, two walls, three walls, etc.) and / or adjacent plates / rows (e.g., 62c, 62b) of the grounding member 160b.

[0061] In some embodiments, the plates 62c, 62d defining the one or more rows of R1 cavities 63 may engage the grounding member 160b and / or the base 160a via one or more latches. Figure 20 to Figure 24In one embodiment shown, the latch can be one or more tongue and groove joints 200 between the plate 62 (e.g., the third and fourth plates) and the grounding member 160b and / or the base 160a. It should be understood that various joints or latches can be used between the plate 62 and the grounding member 160b. One or more relative tongues 200a of the base / grounding member engage the relative grooves 200b or ends of the one or more rows of R1 cavities 63 defined by the third and fourth plates, or are received by the relative grooves 200b or ends, and / or position the third plates 62d of adjacent rows R1 to contact each other when assembled. If used, the tongues 200a and / or grooves 200b of the adjacent opposite walls of the grounding member 160b can be adjacent to the opposite ends of the inner panel 82b. The end of the third plate 62c or groove 200b (e.g., a portion of row R1) can extend between the tongue 200a or a portion thereof (e.g., slot 68f) and / or the base wall 68a to slidably engage the tongue and groove joint therebetween. In some embodiments, a latch locking mechanism 300 can be used to axially lock the tongue and groove joint 200 or the mating interface portion therebetween. Figure 20 to Figure 25 In one embodiment shown, the latch locking mechanism 300 may be a releasable engagement between the grounding member 160b and the plate 62 (eg, 62c, 62d) and / or the row R1. Fig. 20A As more clearly shown in FIG. 1 , one or more third plates 62 c may include one or more protrusions 300 a adjacent to and protruding outwardly from opposite ends of the one or more rows R1, the one or more protrusions 300 a releasably mating with one or more protrusions 300 b extending away from or laterally from adjacent tongues 200 a into the slot 68 f therebetween. The protrusions 300 b (if used) may narrow a portion of the slot 68 f between adjacent tongues 200 a. If used, the latch locking mechanism 300 (e.g., protrusions 300 a, 300 b, openings, etc.) may engage when axially engaging / traveling (e.g., sliding) a distance when engaging the tongue and groove engagement portion 200. For example, relative sliding of the tongue and groove engagement portions therebetween causes the one or more protrusions 300a of a row of cavities / plates containing the mating interface of the cable connector 40 to engage (e.g., be axially adjacent) with the one or more protrusions 300b of the grounding member and / or the base of the mating interface. In addition, when the mating interface 160 is assembled to the plug connector 170, the clips 82a (if used) can extend upward between the inner panel 82b and the adjacent third plates 62c of one or more rows of R1 cavities / connectors on one or both sides of the inner panel. If two clips 82a are used as shown in one embodiment, the clips can extend or mate with opposite sides of the inner panel 82b of the base 160a.

[0062] In some embodiments, the electrical connector 30 and / or the cable connector 40 may include shielding members (eg, 60, 160) for the differential signal pairs, while the plug connectors 70, 170 do not provide shielding for the differential signal pairs. Figure 1 , Fig.21 and Fig.26 As shown, the plug connector 70, 170 does not have its own separate circumferential shield or egg crate shield (eg, to shield against crosstalk). Only the electrical connector 30 and / or the cable connector 40 include a circumferential egg crate shield (eg, to shield against crosstalk) for the differential signal pairs or the mating interface 60, 160.

[0063] In some embodiments, the electrical connector assembly 20, the electrical connector 30, the mating interface 60, 160, the substrate 50 and / or the plug connector 70, 170 may include one or more locking mechanisms 182 or portions thereof that couple the mating interface 160 to the plug connector 170 (e.g., housing, substrate). Figure 26 to Figure 29In one embodiment shown, the locking mechanism 182 can be an external locking mechanism positioned within the outer perimeter (e.g., outer housing, wall) of the electrical connector 30 / connector 170 / mating interface 160. The locking mechanism 182 can include one or more latches or clips 182a (e.g., external). The one or more clips 182a are shown as being external (e.g., outer perimeter) to the plug connector 170, the mating interface 160, and / or the electrical connector 30. Although the clips 182a are shown as being external to the electrical / plug connector 30, 170, and / or the mating interface 160, it should be understood that in some embodiments, internal clips (e.g., positioned on the outer perimeter, wall) can be used in conjunction with the external clip / locking mechanism. The one or more clips 182a protrude downward from the bottom of the mating interface 160 or are included in the housing 168 of the electrical connector 30. The clips 182a may protrude downwardly from one or more outer walls 168a (e.g., opposite) to releasably engage the plug connector 170 (e.g., housing 178, outer wall 178a, receiving portion 179). One or more receiving portions 170 within the housing 178 and / or outer wall 178a of the plug connector 170 may releasably receive the one or more clips 182a. The receiving portion 179 may protrude from or engage the chip package substrate 50 (e.g., 50a, 50b). In one embodiment shown, two spaced-apart clips 182a may be spring loaded in a lateral direction (e.g., opposite directions, inward toward the connector) transverse to the plane of the clips 182a. The clips 182a may include one or more protrusions 182b that releasably engage the receiving portion 179 or one or more apertures 179a of the housing 178. It should be understood that the clips 182a and receiving portion 179 may be reversed and still be within the scope of the present invention.

[0064] In some embodiments, the plug connector 170 (eg, housing) and / or the circuit substrate 50 may include one or more reinforcement members 180. The reinforcement members 180 may support one or more portions of the plug connectors 70, 170. Figure 26 to Figure 29As shown in one embodiment of the embodiment of the present invention, the one or more reinforcement members 180 can be attached to the circuit board side of the circuit substrate 50 and / or engage one or more parts of the housing 178 (e.g., the bottom 178b, the outer wall 178a). In some embodiments as shown, one reinforcement member can engage three outer walls 178a, or in some embodiments, one reinforcement member can engage a single outer wall or the entire periphery of the outer wall. The embodiment shown includes two opposing reinforcement members. The reinforcement member may include one or more upwardly protruding members / tabs 181 that engage the housing 178 (e.g., wall). The tab 181 may include one or more columns 181a received in the receiving portion 177 of the housing 178, and / or one or more columns 181b having an aperture 181ba for receiving the offset tab 178c of the housing 178. In some embodiments, the reinforcement member may support the outer periphery or edge of the bottom / substrate wall 178b or the housing 178. The reinforcement member or a portion thereof may be made of a conductive material, a non-conductive material, or both. In some embodiments, the reinforcement member may be stainless steel. It should be understood that the reinforcements may be of various shapes, sizes, numbers, locations and configurations and still be within the scope of the present invention.

[0065] In some embodiments, the assembly 20, cable connector 40, and / or mating interface 60, 160 can include one or more retaining members 190. The one or more retaining members 190 can align or retain a joint (e.g., a conductive, non-conductive joint) between one or more portions of the mating interface 160. In some embodiments, the retaining members 190 can retain and / or align (e.g., horizontally, vertically) the plate 62, cavity 63, egg crate shield, or mating interface or portions thereof therebetween. In some embodiments, the retaining members 190 can retain and / or align (e.g., horizontally, vertically) the egg crate shield, cavity 63, plate 62 with the housing 168. Figure 26 to Figure 29 In one embodiment shown, the retaining member 190 can be one or more elongated members or rods 191 (e.g., horizontal) that engage one or more elongated slots / apertures 192 of the housing 168 (e.g., wall) and / or one or more slots / apertures 193 of the plate 62 / cavity 63 / egg crate shield. The retaining member or portions thereof can be made of conductive material, non-conductive material, or both. It should be understood that the retaining members / mechanisms can be of various shapes, sizes, quantities, locations, and configurations and still be within the scope of the present invention.

[0066] In some embodiments, one or more ends 65 of one or more plates 62 can electrically contact the conductive outer shield element 43 of the cable connector 40. Fig.24 , Fig.25 and Fig.25AAs shown, the mating end 65 of one or more of the third plate 62c and / or the second plate 62d may include a plurality of curved edges to mate or contour with one or more cables 90 or cable connectors 40 (e.g., outer shield element 43). In some embodiments, the mating end 65 may be in direct contact with the outer shield element 43. Figure 26 to Figure 29 As shown, the mating end 65 of one or more third plates 62c may include a plurality of flat edges to mate or contour with one or more cables 90 or cable connectors 40 (e.g., outer shield element 43) or portions thereof. In addition, in some embodiments, the mating interface 160 and / or connector 30 may include epoxy 65a at one or more conductive joints. For example, as Figure 26 to Figure 29 As shown in one embodiment of FIG. 8 , epoxy 65 a (eg, conductive) may be used between the planar shaped mating end 65 or one or more portions (eg, the mating end) of the board 62 and the outer shield element 43 .

[0067] In some embodiments, Fig.30 and Fig.31 Shows Figure 26 to Figure 29 The differential FD NEXT power sum and differential FD FEXT power sum of one embodiment of the electrical connector shown. Fig.30 As shown, multiple electrical connectors can transmit approximately 70Ghz signals without exceeding approximately -50dB NEXT (near-end crosstalk). Fig.30 The simulation example shown in is the total power sum of all noise sources, the industry standard sum. Fig.31 As shown, the plurality of electrical connectors can transmit signals of approximately 70 GHz without exceeding a FEXT (far end crosstalk) of approximately -30 dB. Fig.31 The simulated embodiment shown in is the total power sum of all noise sources, the industry standard sum.

[0068] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit substrates, and / or cable connectors) can include at least 257 differential pairs per square inch, at least 256 to 264 differential pairs per square inch, at least 139 to 263 differential pairs per square inch, at least 138 to 145 differential pairs per square inch, and / or at least 88 to 137 differential pairs per square inch.

[0069] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit substrates and / or cable connectors) can include at least 257 single-ended pins per square inch, at least 256 to 264 single-ended pins per square inch, at least 139 to 263 single-ended pins per square inch, at least 138 to 145 single-ended pins per square inch and / or at least 88 to 137 single-ended pins per square inch.

[0070] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit substrates, and / or cable connectors) can include at least 127 differential pairs per linear inch, at least 128 differential pairs per linear inch, and / or at least 129 pairs per linear inch.

[0071] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include conductors of about 30 AWG, 31 AWG, 32 AWG, 33 AWG, 34 AWG, and / or 36 AWG. A range of conductors may be, but is not limited to, about 30 to about 36 AWG, about 30 to about 34 AWG, and about 32 to about 36 AWG. About 33 AWG and / or about 34 AWG are also contemplated.

[0072] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include approximately 92 ohms plus / minus 9 ohms, or plus / minus 5%, and / or plus / minus 10%.

[0073] In some embodiments, the components / connectors 20, 30 or portions thereof (eg, mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include an IL to XT spacing of greater than about 55 dB at about 25 GHz.

[0074] In some embodiments, the components / connectors 20, 30 or portions thereof (eg, mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include an IL to XT spacing of greater than about 40 dB at about 60 GHz.

[0075] In some embodiments, the components / connectors 20, 30, or portions thereof (eg, mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include a bandwidth of 60 GHz.

[0076] In some embodiments, the components / connectors 20, 30 or portions thereof (eg, mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include non-skewed edge-jointed connectors (perfectly symmetrical paths in the connector).

[0077] In some embodiments, the components / connectors 20 , 30 or portions thereof (eg, mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include cable, mezzanine, and / or card edge connectors.

[0078] In some embodiments, the components / connectors 20 , 30 or portions thereof (eg, mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include a single track routing in a chip package substrate.

[0079] In some embodiments, components / connectors 20, 30 or portions thereof (e.g., mating interfaces, plug connectors, circuit substrates, and / or cable connectors) may include SMT / BGA / surface mounts. In some embodiments, through-hole mounting may be used. The plug connector and the cable connector may be separable from each other, such as reproducibly separable and reconnectable. The plug connector may be a vertical connector carried by the main surface of the chip package substrate. The vertical connector may be configured to receive a cable connector in a direction perpendicular to the main surface of the chip package substrate.

[0080] In some implementations, the ASIC may be devoid of screw holes and / or through holes.

[0081] In some embodiments, one or more connectors may carry at least 64 differential signal pairs per connector. One example is eight rows of electrical conductors, each row having eight differential signal pairs. Other examples are four rows of electrical conductors or six rows of electrical conductors. Four-row embodiments may also have eight differential signal pairs per row. Six-row embodiments may also have eight differential signal pairs per row. Two-row embodiments may also have eight differential signal pairs per row. All embodiments may also have more than eight differential signal pairs per row or less than eight differential signal pairs per row, but each row has at least one signal pair. For a chip package substrate of approximately 90 mm × 90 mm, the differential signal pair density may be approximately 320 differential signal pairs, approximately 640 differential signal pairs, approximately 960 differential signal pairs, approximately 1280 differential signal pairs, or more than one differential signal pair and at least approximately 840 differential signal pairs, or more than one differential signal pair and at least approximately 769 differential signal pairs, or some other number of differential signal pairs. In other words, at least 28 rows of connectors with 8 differential signal pairs per row can be assembled around the perimeter of a chip package substrate of about 90 mm by about 90 mm. At least 13 rows, at least 14 rows, at least 15 rows, at least 16 rows, at least 17 rows, at least 18 rows and / or at least 19 rows per row with eight differential signal pairs per row can be assembled around the perimeter of a chip package substrate of about 90 mm by about 90 mm. The chip or keep-out area of ​​any chip package substrate can be about 40 mm by about 40 mm. In other words, at least four or at least five electrical connectors can be assembled along one side of a chip package substrate of about 90 mm by about 90 mm, wherein each of the at least four or at least five electrical connectors has at least eight rows and at least eight differential signal pairs per row. Each electrical connector having eight rows of eight differential signal pairs can have a mating footprint of about 13 mm by about 13 mm, about 13.7 mm by about 13.7 mm, about 14 mm by about 14 mm, about 15 mm by about 15 mm, etc.

[0082] In some embodiments of the present invention, for example, the size and shape of the electrical connector can be designed so that multiple electrical connectors are assembled on a single side of a chip package substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the multiple electrical connectors carry at least 1024 differential signal pairs in total, and / or the multiple electrical connectors transmit approximately 224 Gbps Pam4 signals with a bandwidth of approximately 56 GHz to approximately 70 GHz with a FEXT (far-end crosstalk) of no more than about -40 dB.

[0083] In some embodiments, the size and shape of the electrical connector can be designed so that multiple electrical connectors are assembled on a single side of a chip package substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the multiple electrical connectors carry at least 1024 differential signal pairs in total, and / or the multiple electrical connectors transmit approximately 224 Gbs Pam4 signals with a bandwidth of approximately 56 GHz to approximately 70 GHz with a NEXT (near-end crosstalk) of no more than about -50 dB.

[0084] In addition, in some embodiments, the plurality of electrical connectors can transmit signals at about 60 GHz with a FEXT of no more than about -45 dB. In various embodiments, the plurality of electrical connectors can transmit signals at about 50 GHz with a NEXT of no more than about -45 dB. In some embodiments, each of the plurality of electrical connectors can include an egg crate mating interface. In various embodiments, the electrical connector can be configured to mate with a cable connector.

[0085] In some embodiments, an electrical connector may include a mating interface having a plurality of interconnect plates defining a plurality of cavities therein.

[0086] In addition, in some embodiments, the connector may include a plurality of cable connectors that fit within a plurality of cavities. In various embodiments, each of the plurality of plates may include a plurality of slots aligned with a plurality of grooves. In some embodiments, the plurality of plates may define a periphery of a first cavity in the plurality of cavities without any gaps therein. In various embodiments, the plurality of plates may define a row of cavities without any cable connector in the plurality of cable connectors. In some embodiments, the plurality of plates may extend about 90% of the length of the cable connector to the substrate. In various embodiments, the electrical connector may include a substrate and a ground contact element that positions the plurality of plates at a distance from the substrate. In some embodiments, the electrical connector may include a chip package substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors may carry at least 1024 differential signal pairs in total, and / or the plurality of electrical connectors may transmit about 224 Gbps Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a FEXT (far end crosstalk) of no more than about -40 dB or a NEXT (near end crosstalk) of no more than about -50 dB. In various embodiments, the plurality of electrical connectors can transmit signals at about 60 GHz without exceeding a FEXT of about -45 dB. In some embodiments, the plurality of electrical connectors can transmit signals at about 50 GHz without exceeding a NEXT of about -45 dB.

[0087] Furthermore, in some embodiments, an electrical connector configured to be attached to a chip package may include a density of at least 256 differential pairs per square inch.

[0088] In various embodiments, the electrical connector can transmit about 224 Gbps Pam4 signals without exceeding about -40 dB crosstalk. In some embodiments, the connector can transmit at a bandwidth of about 56 GHz to about 70 GHz.

[0089] Furthermore, in some embodiments, the electrical connector may include a mating interface.In various embodiments, the connector may include a plug connector having at least one ground contact element configured to mate with the mating interface.

[0090] In some embodiments, the ground contact element may include at least one arm that cooperates with the mating interface. In various embodiments, the ground contact element may include at least two arms that cooperate with the mating interface. In some embodiments, the ground contact element may include at least three arms that cooperate with the mating interface. In various embodiments, the ground contact element may include at least four arms that cooperate with the mating interface. In some embodiments, the ground contact element includes four or more arms that cooperate with the mating interface. In various embodiments, the ground contact element may include at least one solder block. In some embodiments, the ground contact element may include at least two solder blocks that are adjacent to each other. In various embodiments, the ground contact element includes at least three solder blocks that are adjacent to each other.

[0091] In some embodiments, the electrical connector may include at least one of a mating interface, a plug connector, and / or a cable connector. In various embodiments, the connector may include a 224Gbps Pam4 signal at 6ps with a 20%-80% rise time.

[0092] In some embodiments, the connector may include at least one of FEXT and / or insertion loss. In various embodiments, the FEXT may be less than or equal to -30 dB. In some embodiments, the FEXT may be less than or equal to -35 dB. In various embodiments, the FEXT may be less than or equal to -40 dB. In some embodiments, the FEXT may be less than or equal to -45 dB. In various embodiments, the insertion loss may be between 0 dB and -1 dB. In some embodiments, the insertion loss may be between -1 dB and -2 dB. In various embodiments, the insertion loss may be between -2 dB and -3 dB. In some embodiments, the insertion loss may be between -3 dB and -4 dB. In various embodiments, the insertion loss may be between -4 dB and -5 dB. In some embodiments, the connector may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz.

[0093] In various embodiments, the electrical connector may include at least one of NEXT and / or insertion loss. In some embodiments, NEXT may be less than or equal to -40dB. In various embodiments, NEXT may be less than or equal to -45dB. In various embodiments, NEXT may be less than or equal to -50dB. In some embodiments, NEXT may be less than or equal to -55dB. In various embodiments, NEXT may be less than or equal to -60dB. In some embodiments, the insertion loss may be between 0dB and -1dB. In various embodiments, the insertion loss may be between -1dB and -2dB. In some embodiments, the insertion loss may be between -2dB and -3dB. In some embodiments, the insertion loss may be between -3dB and -4dB. In various embodiments, the insertion loss may be between -4dB and -5dB. In some embodiments, the connector may be at 50GHz, 55GHz, 60GHz, 65GHz, and / or 70GHz.

[0094] Additionally, in some embodiments, the electrical connector can include an outer perimeter.In various embodiments, the connector can include a locking mechanism positioned within the outer perimeter of the electrical connector.

[0095] In some embodiments, the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned within the outer periphery of at least one of the mating interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one notch. In some embodiments, the locking mechanism may include at least two notches. In various embodiments, the locking mechanism may be positioned within at least one gap between cavities of adjacent rows. In some embodiments, the electrical connector may include a plurality of cable connectors, wherein the locking mechanism may be positioned between adjacent cable connectors of the plurality of cable connectors. In various embodiments, the electrical connector may include a plurality of cavities, wherein the locking mechanism may be positioned between adjacent cavities in the plurality of cavities. In some embodiments, the locking mechanism may be spaced inwardly from one or more walls of the outer periphery of the electrical connector. In various embodiments, the connector may be configured to be attached to a chip package having a density of at least 256 differential pairs per square inch.

[0096] In some embodiments, the electrical connector may include a plurality of differential signal pairs. In various embodiments, the electrical connector may include a plurality of ground contact elements, each ground contact element being configured to receive a corresponding portion of an egg crate shield of a mating connector, wherein the electrical connector does not have an egg crate crosstalk shield, and its size and shape are designed so that the plurality of electrical connectors are each mounted on a single side of a chip package substrate, each side of which is no larger than about 75 mm-96 mm (including about 80 mm ± 5 mm and 91 mm ± 5 mm), the plurality of electrical connectors carry at least 1024 differential signal pairs in total, and the plurality of electrical connectors transmit about 224 Gbits / sec PAM-4 signals at a bandwidth of about 56 GHz to about 70 GHz without exceeding about -40 dB FEXT.

[0097] In addition, in some embodiments, the electrical connector also includes a first housing that carries a differential signal pair, and at least two or more of the plurality of ground contacts each define at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has a corresponding free end. In various embodiments, the differential signal pairs are surface mounted to the chip packaging substrate. In some embodiments, the differential signal pairs may each include a first stamped-formed electrical conductor and a second stamped-formed electrical conductor. In some embodiments, the electrical connector may also include a conductive or non-conductive magnetic absorption material or an electrically lossy material. In various embodiments, the plurality of differential signal pairs are connected to corresponding pads on the chip packaging substrate with electrical connection, physical connection, or both electrical connection and physical connection.

[0098] In some embodiments, the electrical connector may include a mating interface having a housing and a plurality of plates defining a plurality of cavities in the housing. In various embodiments, the electrical connector may include at least one retaining member that retains at least one of the plurality of plates therebetween and / or retains the plurality of plates with the housing.

[0099] In addition, in some embodiments, at least one holding member can hold the plurality of plates therebetween. In various embodiments, at least one holding member can hold the plurality of plates together with the housing. In some embodiments, at least one holding member can hold the plurality of plates therebetween and hold the plurality of plates together with the housing. In various embodiments, at least one holding member can be an elongated member engaging one or more slots. In some embodiments, at least one holding member can be conductive or non-conductive.

[0100] In some embodiments, the electrical connector may include an outer perimeter.In various embodiments, the electrical connector may include a locking mechanism positioned in the outer perimeter of the electrical connector.

[0101] In addition, in some embodiments, the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned in the outer periphery of at least one of the mating interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one receiving portion that releasably engages at least one clip. In some embodiments, the electrical connector may include another locking mechanism positioned within the outer periphery.

[0102] In some embodiments, the electrical connector may include a plug connector having a housing. In various embodiments, the electrical connector may include at least one reinforcement member coupled to the housing.

[0103] Additionally, in some embodiments, at least one stiffener may be attached to the circuit board side of the chip package substrate. In various embodiments, the electrical connector may include at least two stiffeners spaced apart from each other in a horizontal plane. In some embodiments, at least one stiffener may be conductive or non-conductive. In various embodiments, at least one stiffener may include at least one protruding tab.

[0104] Furthermore, in some embodiments, the electrical connector may include means for getting off at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and / or at least 1024 differential signal pairs from a side of a chip package substrate of approximately 75 mm to approximately 95 mm, the chip package substrate having a keep-out area of ​​at least approximately 40 mm square.

[0105] Furthermore, in some embodiments, the electrical connector may include means for obtaining at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and / or at least 1024 differential signal pairs from one side of a 75 mm to 95 mm chip package substrate.

[0106] In addition, in some embodiments, the electrical connector may include a device for obtaining at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and / or at least 1024 differential signal pairs from one side of a chip package substrate of any size disclosed herein having a keep-out area of ​​at least about 40 mm square.

[0107] Additionally, in some embodiments, the electrical connector may include means for obtaining at least 513, at least 600, at least 700, at least 800, at least 900, at least 1000 and / or at least 1024 differential signal pairs from one side of a chip package substrate of any size disclosed herein.

[0108] Although several embodiments have been described and shown herein, a person of ordinary skill in the art will readily conceive of various other means and / or structures for performing functions and / or obtaining results and / or one or more advantages described herein, and each of these variations and / or modifications is considered to fall within the scope of the embodiments described herein. More generally, it will be readily understood by those skilled in the art that all parameters, dimensions, materials, and configurations described herein are intended to be exemplary, and that actual parameters, dimensions, materials, and / or configurations will depend on one or more specific applications for which this teaching is used. Using no more than routine experiments, those skilled in the art will recognize or be able to find many equivalents of the specific embodiments described herein. Therefore, it should be understood that the foregoing embodiments are presented only by way of example, and within the scope of the appended claims and their equivalents, embodiments may be practiced in a manner different from that specifically described and claimed. The embodiments of the present disclosure relate to each individual feature, system, article, material, and / or method described herein. In addition, if such features, systems, articles, materials, and / or methods are not mutually inconsistent, any combination of two or more such features, systems, articles, materials, and / or methods is included within the scope of the present disclosure.

[0109] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0110] Unless clearly indicated to the contrary, the indefinite articles "a" and "an" as used herein in the specification and claims should be understood to mean "at least one".

[0111] The phrase "and / or" used herein in the specification and claims should be understood to mean "either one or both" of the elements so combined, i.e., elements that exist in combination in some cases and separately in other cases. Multiple elements listed with "and / or" should be interpreted in the same manner, i.e., "one or more" of the elements so combined. In addition to the elements specifically identified by the "and / or" clause, other elements may optionally exist, whether related or unrelated to those specifically identified elements. Therefore, as a non-limiting example, when used in conjunction with an open language such as "including", a reference to "A and / or B" may refer to only A (optionally including elements other than B) in one embodiment; only B (optionally including elements other than A) in another embodiment; in yet another embodiment, both A and B (optionally including other elements); and so on.

[0112] As used herein in the specification and claims, "or" shall be understood to have the same meaning as "and / or" as defined above. For example, when separating items in a list, "or" or "and / or" shall be interpreted as inclusive, i.e., including at least one element in a plurality of elements or a list of elements, but also including more than one element in a plurality of elements or a list of elements, and optionally, including additional unlisted items. Only terms that clearly indicate the opposite, such as "only one" or "exactly one", or when used in the claims, "consisting of..." will refer to including exactly one element in a plurality of elements or a list of elements. Typically, when preceded by an exclusive term, such as "either", "one", "only one" or "exactly one", the term "or" as used herein will only be interpreted as indicating an exclusive alternative element (i.e., "one or the other, but not two"). When used in the claims, "consisting essentially of..." should have its ordinary meaning used in the field of patent law.

[0113] As used herein in the specification and claims, the phrase "at least one" with respect to a list of one or more elements should be understood to mean at least one element selected from any one or more elements in the list of elements, but not necessarily including at least one of each element specifically listed within the list of elements, and not excluding any combination of elements in the list of elements. This definition also allows that elements may optionally be present other than those specifically identified within the list of elements to which the phrase "at least one" refers, whether related or unrelated to those specifically identified elements. Thus, as a non-limiting example, “at least one of A and B” (or equivalently, “at least one of A or B”, or equivalently, “at least one of A and / or B”) may refer in one embodiment to at least one A, optionally including more than one A, wherein B is not present (and optionally including elements other than B); in another embodiment, may refer to at least one B, optionally including more than one B, wherein A is not present (and optionally including elements other than A); in yet another embodiment, may refer to at least one A, optionally including more than one A, and at least one B, optionally including more than one B (and optionally including other elements); and so on.

[0114] It should also be understood that in any method claimed herein that includes more than one step or action, the order of the method steps or actions is not necessarily limited to the order in which the method steps or actions are recited unless clearly indicated to the contrary.

[0115] In the claims, as well as in the foregoing description, all transitional phrases such as "comprising," "including," "carrying," "having," "containing," "involving," "maintaining," "consisting of," etc. shall be understood as open-ended, i.e., meaning including, but not limited to. Only transitional phrases such as "consisting of" and "consisting essentially of" shall be closed or semi-closed transitional phrases, respectively, as described in Section 2111.03 of the U.S. Patent Office Manual of Patent Examining Procedures.

[0116] It should be understood that the embodiments are not limited in their application to the details of the construction and arrangement of the components set forth in the specification or shown in the drawings. The present invention can have other embodiments and can be practiced or implemented in various ways. Unless otherwise limited, the terms "connect", "couple", "communicate with..." and "install" and their variations are used broadly herein and cover direct and indirect connections, couplings and installations. In addition, the terms "connect" and "couple" and their variations are not limited to physical or mechanical connections or couplings.

[0117] The foregoing description of several embodiments of the invention has been presented for purposes of illustration. It is not intended to be exhaustive or to limit the invention to the precise steps and / or forms disclosed, and obviously many modifications and variations are possible in light of the above teachings.

Claims

1. An electrical connector, the size and shape of which are designed so that a plurality of the electrical connectors are mounted on a single side of a chip package substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors carry at least 1024 differential signal pairs in total, and the plurality of electrical connectors transmit about 224 Gbps Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a FEXT (far end crosstalk) of no more than about -40 dB.

2. An electrical connector, the size and shape of which are designed so that a plurality of the electrical connectors are mounted on a single side of a chip package substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors carry at least 1024 differential signal pairs in total, and the plurality of electrical connectors transmit about 224 Gbs Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a NEXT (near-end crosstalk) of no more than about -50 dB.

3. The electrical connector according to any one of claims 1 and 2, wherein: The plurality of electrical connectors transmit signals at approximately 60 GHz without exceeding a FEXT of approximately -45 dB.

4. The electrical connector according to any one of claims 1 to 3, wherein: The plurality of electrical connectors transmit signals at approximately 50 GHz without exceeding a NEXT of approximately -45 dB.

5. The electrical connector according to any one of claims 1 to 4, wherein: Each electrical connector of the plurality of electrical connectors includes an egg-crate mating interface.

6. The electrical connector according to any one of claims 1 to 5, wherein: The electrical connector is configured to mate with a cable connector.

7. An electrical connector, comprising: A mating interface has a plurality of interconnecting plates defining a plurality of cavities therein.

8. The electrical connector of claim 7, further comprising a plurality of cable connectors fitted within the plurality of cavities.

9. The electrical connector according to any one of claims 7 to 8, wherein: Each plate of the plurality of plates includes a plurality of slots aligned with the plurality of grooves.

10. The electrical connector according to any one of claims 7 to 9, wherein: The plurality of plates define a periphery of a first cavity of the plurality of cavities without any gaps therein.

11. The electrical connector according to any one of claims 8 to 10, wherein: The plurality of plates define a row of cavities that are devoid of any cable connectors of the plurality of cable connectors.

12. The electrical connector according to any one of claims 8 to 11, wherein: The plurality of plates extend approximately 90% of the length of the cable connector to the substrate.

13. The electrical connector according to any one of claims 7 to 12, further comprising a substrate and a ground contact element, the ground contact element positioning the plurality of plates at a distance from the substrate.

14. The electrical connector according to any one of claims 7-13, further comprising a chip packaging substrate no larger than about 75 mm×75 mm to about 85 mm×85 mm, the plurality of electrical connectors carrying a total of at least 1024 differential signal pairs, and the plurality of electrical connectors transmitting about 224 Gbps Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a FEXT (far-end crosstalk) of no more than about -40 dB or a NEXT (near-end crosstalk) of no more than about -50 dB.

15. The electrical connector according to claim 14, wherein: The plurality of electrical connectors transmit signals at approximately 60 GHz without exceeding a FEXT of approximately -45 dB.

16. The electrical connector according to any one of claims 14 to 15, wherein: The plurality of electrical connectors transmit signals at approximately 50 GHz without exceeding a NEXT of approximately -45 dB.

17. An electrical connector configured for attachment to a chip package, comprising: A density of at least 256 differential pairs per square inch.

18. The electrical connector of claim 17, capable of transmitting approximately 224 Gbps Pam4 signals without exceeding approximately -40 dB of crosstalk.

19. The electrical connector of claims 17 and 18, transmitting at a bandwidth of about 56 GHz to about 70 GHz.

20. An electrical connector, comprising: Matching interface; as well as A plug connector has at least one ground contact element configured to mate with the mating interface.

21. The electrical connector according to claim 20, wherein: The ground contact element includes at least one arm that mates with the mating interface.

22. The electrical connector according to any one of claims 20 and 21, wherein: The ground contact element includes at least two arms that mate with the mating interface.

23. The electrical connector according to any one of claims 20 to 22, wherein: The ground contact element includes at least three arms that mate with the mating interface.

24. The electrical connector according to any one of claims 20 to 23, wherein: The ground contact element includes at least four arms that mate with the mating interface.

25. The electrical connector according to any one of claims 20 to 24, wherein: The ground contact element includes four or more arms that mate with the mating interface.

26. The electrical connector according to any one of claims 20 to 25, wherein: The ground contact element includes at least one solder bump.

27. The electrical connector according to any one of claims 20 to 26, wherein: The ground contact element includes at least two solder bumps immediately adjacent to each other.

28. The electrical connector according to any one of claims 20 to 27, wherein: The ground contact element includes at least three solder bumps immediately adjacent to each other.

29. An electrical connector, comprising: at least one of a mating interface, a plug connector, and / or a cable connector; as well as 224 Gbps Pam4 signal at 6ps with 20%-80% rise time.

30. The electrical connector of claim 29, further comprising at least one of FEXT and / or insertion loss.

31. The electrical connector according to claim 30, wherein: The FEXT is lower than or equal to -30 dB.

32. The electrical connector according to any one of claims 30-31, wherein: The FEXT is lower than or equal to -35dB.

33. The electrical connector according to any one of claims 30 to 32, wherein: The FEXT is lower than or equal to -40dB.

34. The electrical connector according to any one of claims 30 to 33, wherein: The FEXT is lower than or equal to -45dB.

35. The electrical connector according to any one of claims 30 to 34, wherein: The insertion loss is between 0 dB and -1 dB.

36. The electrical connector according to any one of claims 30 to 35, wherein: The insertion loss is between -1 dB and -2 dB.

37. The electrical connector according to any one of claims 30 to 36, wherein: The insertion loss is between -2dB and -3dB.

38. The electrical connector according to any one of claims 30 to 37, wherein: The insertion loss is between -3dB and -4dB.

39. The electrical connector according to any one of claims 30 to 38, wherein: The insertion loss is between -4dB and -5dB.

40. The electrical connector of any one of claims 30-39, at 50 GHz.

41. The electrical connector of any one of claims 30-40, at 55 GHz.

42. The electrical connector of any one of claims 30-41 at 60 GHz.

43. An electrical connector according to any one of claims 30-42, at 65 GHz.

44. An electrical connector according to any one of claims 30-43, at 70 GHz.

45. An electrical connector according to any one of claims 30-44, at 75 GHz.

46. ​​An electrical connector according to any one of claims 30-45, at 80 GHz.

47. The electrical connector of claim 29, further comprising at least one of NEXT and / or insertion loss.

48. The electrical connector according to claim 47, wherein: The NEXT is lower than or equal to -40dB.

49. The electrical connector according to any one of claims 47-48, wherein: The NEXT is lower than or equal to -45dB.

50. The electrical connector according to any one of claims 47 to 49, wherein: The NEXT is lower than or equal to -50dB.

51. The electrical connector according to any one of claims 47 to 50, wherein: The NEXT is lower than or equal to -55dB.

52. The electrical connector according to any one of claims 47 to 51, wherein: The NEXT is lower than or equal to -60dB.

53. The electrical connector according to any one of claims 47 to 52, wherein: The insertion loss is between 0 dB and -1 dB.

54. An electrical connector according to any one of claims 47 to 53, wherein: The insertion loss is between -1 dB and -2 dB.

55. The electrical connector according to any one of claims 47 to 54, wherein: The insertion loss is between -2dB and -3dB.

56. An electrical connector according to any one of claims 47 to 55, wherein: The insertion loss is between -3dB and -4dB.

57. The electrical connector according to any one of claims 47 to 56, wherein: The insertion loss is between -4dB and -5dB.

58. An electrical connector according to any one of claims 47-57, said electrical connector being at 50 GHz.

59. The electrical connector of any one of claims 47-58, being at 55 GHz.

60. The electrical connector of any one of claims 47-59, being at 60 GHz.

61. An electrical connector according to any one of claims 47-60, at 65 GHz.

62. The electrical connector of any one of claims 47-61 at 70 GHz.

63. An electrical connector, comprising: outer perimeter; as well as A locking mechanism is positioned within the outer perimeter of the electrical connector.

64. The electrical connector of claim 63, further comprising a mating interface and a plug connector, wherein: The locking mechanism is positioned within an outer perimeter of at least one of the mating interface and / or the plug connector.

65. An electrical connector according to any one of claims 63-64, wherein: The locking mechanism includes at least one clip.

66. An electrical connector according to any one of claims 63-65, wherein: The locking mechanism includes at least two clips.

67. An electrical connector according to any one of claims 63-66, wherein: The locking mechanism includes at least one notch.

68. An electrical connector according to any one of claims 63-67, wherein: The locking mechanism includes at least two notches.

69. An electrical connector according to any one of claims 63-68, wherein: The locking mechanism is positioned within at least one gap between adjacent rows of cavities.

70. The electrical connector according to any one of claims 63-69, further comprising a plurality of cable connectors, wherein: The locking mechanism is positioned between adjacent cable connectors of the plurality of cable connectors.

71. The electrical connector according to any one of claims 63-70, further comprising a plurality of cavities, wherein: The locking mechanism is positioned between adjacent cavities of the plurality of cavities.

72. An electrical connector according to any one of claims 63 to 71, wherein: The locking mechanism is spaced inwardly from one or more walls of the outer perimeter of the electrical connector.

73. The electrical connector of any one of claims 63-72, configured for attachment to a chip package having a density of at least 256 differential pairs per square inch.

74. An electrical connector, comprising: Multiple differential signal pairs; as well as a plurality of ground contact elements, each ground contact element being configured to receive a corresponding portion of an egg crate shield of a mating connector, The electrical connector has no egg-crate crosstalk shield, the size and shape of the electrical connector are designed so that multiple electrical connectors are each mounted on a single side of a chip packaging substrate, each side of the chip packaging substrate is no larger than about 75 mm to 96 mm, including about 80 mm ± 5 mm and 91 mm ± 5 mm, the multiple electrical connectors carry at least 1024 differential signal pairs in total, and the multiple electrical connectors transmit about 224 Gbits / sec PAM-4 signals with a bandwidth of about 56 GHz to about 70 GHz without exceeding about -40 dB FEXT.

75. The electrical connector of claim 74, wherein: The electrical connector also includes a first housing carrying the differential signal pair, and at least two or more of the plurality of ground contacts each define at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has a corresponding free end.

76. An electrical connector according to any one of claims 74 and 75, wherein: The differential signal pair is surface mounted to the chip package substrate.

77. An electrical connector according to any one of claims 74 to 76, wherein: The differential signal pairs each include a first stamped and formed electrical conductor and a second stamped and formed electrical conductor.

78. The electrical connector according to any one of claims 74-77 further comprises a conductive or non-conductive magnetic absorption material or an electrically lossy material.

79. The electrical connector according to any one of claims 74 to 78, wherein: The plurality of differential signal pairs are connected to corresponding respective pads on the chip package substrate with electrical connection, physical connection, or both electrical connection and physical connection.

80. An electrical connector, comprising: An apparatus for acquiring at least 800 differential signal pairs from one side of a 75 mm to 95 mm chip package substrate having a keep-out area of ​​at least 40 mm square.

81. An electrical connector, comprising: An apparatus for obtaining at least 800 differential signal pairs from one side of a 75mm to 95mm chip package substrate.

82. An electrical connector, comprising: An apparatus for acquiring at least 800 differential signal pairs from a side of a chip package substrate of any size disclosed herein, the chip package substrate having a keep-out area of ​​at least 40 mm square.

83. An electrical connector, comprising: Means for obtaining at least 800 differential signal pairs from one side of a chip package substrate of any size disclosed herein.

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