Non-waviness femtosecond laser processing device and method based on galvanometer path optimization

Abstract

The invention provides a non-waviness femtosecond laser machining device and method based on galvanometer path optimization. The method comprises the steps that S1, a special clamp is connected with a rotating C shaft; s2, the machined workpiece is clamped on a special clamp; s3, a laser beam generated by a femtosecond laser is focused through a two-dimensional scanning galvanometer and a field lens and then irradiates the surface of the machined workpiece; s4, the two-dimensional scanning galvanometer controls the machining path of the laser focus in the plane of the machined workpiece so as to cooperatively rotate the C axis to machine the surface of the workpiece in the circumferential direction; and S5, optimizing laser pulse energy processing technological parameters so as to optimize the processing process. Precise path planning and optimization are implemented on the surface of the workpiece on the X-Y plane through the two-dimensional scanning galvanometer system, the problem of periodic fluctuation caused by change of the laser spot pulse overlap rate in the rotating machining process is effectively restrained, and waviness-free high-precision contour machining is achieved. And the quality level of the machined surface is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of femtosecond laser processing, and in particular to a waviness-free femtosecond laser processing device and method based on galvanometer path optimization. Background Art

[0002] Femtosecond laser has ultrashort pulses (10 -15 s) and extremely high peak power, it has shown significant advantages in the field of micro-nanoscale processing. Its unique "cold processing" characteristics will not form a recast layer or microcracks in the processing area of ​​the material surface, almost eliminating the thermal damage to the processing area caused by heat diffusion; and the nonlinear absorption effect of femtosecond laser can achieve high-precision material removal, so it is widely used in high-precision fields such as microelectronic device manufacturing, optical component microstructure processing, biomedicine, and microfluidic chip preparation.

[0003] Typical femtosecond laser processing devices usually use a scanning galvanometer and a rotating axis (C-axis) to achieve processing. The scanning galvanometer is responsible for controlling the motion trajectory of the laser focus in the plane, and the C-axis drives the workpiece to rotate to achieve circumferential processing coverage. However, this motion control mode has two key technical defects: first, there is a lack of dynamic coordination mechanism between the scanning path planning and the C-axis speed, which leads to periodic fluctuations in the overlap rate of the laser pulse in the rotation direction. This fluctuation will directly transform into a periodic corrugated profile of the processed surface; second, the existing path planning algorithms mostly use linear or spiral trajectory modes with fixed scanning spacing. When processing complex surfaces, it is difficult to dynamically adjust the scanning parameters according to local curvature changes, which further aggravates the generation of waviness and makes it difficult to ensure surface quality consistency, becoming a key bottleneck restricting the widespread application of laser technology in the field of precision manufacturing.

[0004] Especially when it comes to rotating workpieces (such as disc-shaped workpieces), the problem of matching the workpiece rotation speed with the laser scanning path is particularly prominent. If the rotation speed is inappropriate or the scanning path planning is unreasonable, it is very easy to form an "M" profile waviness on the processed surface, which is caused by the periodic interference between the scanning direction and the workpiece rotation.

[0005] In view of this, the present invention proposes an innovative femtosecond laser processing device and method, which aims to achieve high-precision, waviness-free processing of workpieces of various shapes by accurately controlling the workpiece rotation speed, optimizing the processing path of the scanning galvanometer, and combining the high degree of freedom of the five-dimensional precision motion platform. This method is not only suitable for micro-nano processing of conventional materials, but also particularly suitable for the manufacture of optical components and precision mechanical parts with extremely high surface quality requirements, and has broad application prospects and significant technical advantages. Summary of the invention

[0006] In view of the defects in the prior art, an object of the present invention is to provide a waviness-free femtosecond laser processing device and method based on galvanometer path optimization.

[0007] According to the present invention, a waviness-free femtosecond laser processing device based on galvanometer path optimization is provided, comprising:

[0008] Femtosecond laser, beam expander, attenuator, reflector, 2D scanning galvanometer and F-θ field mirror;

[0009] The femtosecond laser is used to generate an ultrashort pulse laser beam, which propagates along a preset path; the preset path includes the ultrashort pulse laser beam passing through a beam expander, an attenuator, a reflector, a two-dimensional scanning galvanometer and an F-θ field mirror in sequence;

[0010] The beam expander is used to expand the laser beam diameter, control the divergence angle, optimize the transmission efficiency, and maintain the focusing performance while maintaining the transmission at a preset distance;

[0011] The attenuator is used to reduce the energy intensity of the laser beam;

[0012] The reflector is used to change the propagation direction of the laser beam;

[0013] The two-dimensional scanning galvanometer is used to adjust the direction and focal length of the laser beam;

[0014] The F-θ field mirror is used to correct the nonlinear relationship of laser beam deflection.

[0015] Preferably, it also includes:

[0016] Z axis, workpiece, special fixture, rotating C axis, support frame, rotating A axis, Y axis and X axis;

[0017] The two-dimensional scanning galvanometer is fixed on the Z axis to adjust the focusing of the laser spot diameter on the surface of the processed workpiece; after the laser spot is focused, the two-dimensional scanning galvanometer controls the planning of the scanning path of the laser focus in the XY plane of the surface of the processed workpiece;

[0018] The workpiece to be processed is fixed on a special fixture;

[0019] The special fixture is connected to the rotating C axis;

[0020] The rotating C axis is connected with the A axis, Y axis and X axis of the motion table through a supporting frame.

[0021] Preferably, the rotating C-axis is rotated to drive the special fixture and the workpiece to rotate, thereby completing the processing of the workpiece surface along the circumferential direction.

[0022] Preferably, the material used for the reflector includes silver-plated or aluminum-plated glass or quartz; the material used for the beam expander includes optical glass or quartz; the attenuator includes a neutral density filter or a variable attenuator; and the material used for the F-θ field mirror includes fused quartz.

[0023] Preferably, the special clamp is made of aluminum alloy.

[0024] Preferably, the femtosecond laser generates a wavelength of 1030 nm and a beam quality of M 2 <1.2, pulse width 290fs, single pulse maximum energy 400μJ, ultrashort pulse laser beam with adjustable repetition rate of 60Hz~1000kHz.

[0025] Preferably, the maximum speed of the rotating C-axis is 600 rpm, the maximum load is 10 kg, and the repeatability is 3".

[0026] Preferably, the focal length of the F-θ field lens is between 60 mm and 100 mm.

[0027] Preferably, the two-dimensional scanning galvanometer adopts a strip-type laser reciprocating scanning method in the XY plane, and the rotation speed of the adapted rotating C axis does not exceed 1.0 rpm.

[0028] According to the present invention, a waviness-free femtosecond laser processing method based on galvanometer path optimization is provided, comprising:

[0029] Step S1: Connect the special fixture to the rotating C axis;

[0030] Step S2: Clamp the workpiece on a special fixture;

[0031] Step S3: The laser beam generated by the femtosecond laser is focused by a two-dimensional scanning galvanometer and a field lens and then irradiated onto the surface of the workpiece;

[0032] Step S4: controlling the laser focus on the processing path within the plane of the workpiece through a two-dimensional scanning galvanometer, and coordinating with the rotating C axis to process the circumferential direction of the workpiece surface;

[0033] Step S5: Further optimize the processing process by optimizing the laser pulse energy processing process parameters.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] 1. The present invention implements precise path planning and optimization on the workpiece surface in the XY plane through a two-dimensional scanning galvanometer system. At the same time, this technology cooperates with the adaptive C-axis rotation speed to achieve uniform and efficient processing of the workpiece surface in the circumferential direction.

[0036] 2. The synergistic mechanism provided by the present invention can effectively suppress the periodic fluctuation problem caused by the change of the laser spot pulse overlap rate during the rotation processing, thereby successfully realizing high-precision contour processing without waviness and greatly improving the quality level of the processed surface.

[0037] 3. The present invention realizes high-precision and waviness-free processing of workpieces of various shapes by accurately controlling the rotation speed of the workpiece, optimizing the processing path of the scanning galvanometer, and combining the high degree of freedom of the five-dimensional precision motion platform.

[0038] 4. This method is not only suitable for micro-nano processing of conventional materials, but is also particularly suitable for the manufacturing of optical components and precision mechanical parts with extremely high surface quality requirements. It has broad application prospects and significant technical advantages.

[0039] Other beneficial effects of the present invention will be explained in the specific implementation manner through the introduction of specific technical features and technical solutions. Through the introduction of these technical features and technical solutions, those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0041] Figure 1 It is a schematic diagram of the waviness-free femtosecond laser processing device based on galvanometer path optimization of the present invention.

[0042] Figure 2 Schematic diagram of scanning path I processing in an embodiment of the present invention, where the long strip is along the Y direction.

[0043] Figure 3 FIG. 1 is a schematic diagram of scanning path II processing in an embodiment of the present invention, wherein the long strip is along the X direction.

[0044] Figure 4 This is a diagram of the processing results of the scanning galvanometer path I in an embodiment of the present invention.

[0045] Figure 5 This is a diagram of the processing results of the scanning galvanometer path II in an embodiment of the present invention.

[0046] Figure 6 The figure is a flow chart of the method of the present invention.

[0047] Description of reference numerals:

[0048] Femtosecond laser 1 Processing workpiece 8

[0049] Beam expander 2 Special fixture 9

[0050] Attenuator 3 Rotating C axis 10

[0051] Reflector 4 Support frame 11

[0052] 2D scanning galvanometer 5 Rotating A axis 12

[0053] Z axis 6 Y axis 13

[0054] F-θ field lens 7 X axis 14 DETAILED DESCRIPTION

[0055] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0056] Reference Figure 1 As shown, a waviness-free femtosecond laser processing device based on galvanometer path optimization comprises:

[0057] Femtosecond laser 1, beam expander 2, attenuator 3, reflector 4, two-dimensional scanning galvanometer 5, Z axis 6, F-θ field mirror 7, processing workpiece 8, special fixture 9, rotating C axis 10, support frame 11, rotating A axis 12, Y axis 13, X axis 14;

[0058] Femtosecond laser 1 is used to generate ultrashort pulse laser beam, which propagates along a preset path; the laser beam wavelength is 1030nm, and the beam quality is M 2 <1.2, pulse width 290fs, maximum single pulse energy 400μJ, adjustable repetition rate of 60Hz~1000kHz.

[0059] First, it passes through the beam expander 2 to expand the beam diameter, control the divergence angle, optimize the transmission efficiency, and maintain the focusing performance during long-distance transmission; then it enters the attenuator 3 to reduce the energy intensity of the laser beam; then it enters the reflector 4 to change the propagation direction of the laser beam; then it enters the two-dimensional scanning galvanometer 5 to quickly and accurately adjust the direction and focal length of the laser beam; finally, it enters the F-θ field mirror 7 to achieve linear scanning and precise focusing of the laser beam by correcting the nonlinear relationship of the beam deflection.

[0060] The two-dimensional scanning galvanometer 5 is fixed on the Z axis 6 to adjust the focusing of the laser spot diameter on the surface of the workpiece 8; the two-dimensional scanning galvanometer 5 adopts a strip laser reciprocating scanning method in the XY plane, and the adapted C axis rotation speed does not exceed 1.0rpm.

[0061] After the laser spot is focused, the two-dimensional scanning galvanometer 5 is responsible for controlling the planning of the scanning path of the laser focus in the XY plane of the surface of the workpiece 8 to be processed.

[0062] The workpiece 8 is fixed on a special fixture 9, which is connected to a rotating C-axis 10. The rotating C-axis 10 rotates to drive the special fixture 9 and the workpiece 8 to rotate, so as to achieve processing of the surface of the workpiece 8 along the circumferential direction; the rotating C-axis 10 is connected to the A-axis 12, the Y-axis 13, and the X-axis 14 of the motion table through a support frame 11; the special fixture 9 is made of aluminum alloy; the maximum speed of the rotating C-axis 10 is 600rpm, the maximum load is 10kg, and the repeatability is 3".

[0063] The reflector is made of silver-plated or aluminum-plated glass or quartz; the beam expander 2 is made of optical glass or quartz; the attenuator 3 is made of a neutral density filter or a variable attenuator; it includes reflectors 4 in the X-axis and Y-axis directions, a galvanometer motor and a drive controller; the F-θ field mirror 7 is made of fused quartz, and the focal length is between 60mm and 100mm.

[0064] The present invention implements precise path planning and optimization of the workpiece surface in the XY plane through a two-dimensional scanning galvanometer system. At the same time, this technology cooperates with the adaptive C-axis rotation speed to achieve uniform and efficient processing of the workpiece surface in the circumferential direction. This collaborative mechanism can effectively suppress the periodic fluctuation problem caused by the change of the laser spot pulse overlap rate during the rotation processing, thereby successfully realizing high-precision contour processing without waviness, greatly improving the quality level of the processed surface.

[0065] Example 1

[0066] like Figure 1 As shown, the waviness-free femtosecond laser processing device based on galvanometer path optimization involved in this embodiment includes: a femtosecond laser 1 for providing a laser beam, a laser optical path transmission system, a two-dimensional scanning galvanometer system for laser path planning, a workpiece-specific fixture 9, and an XYZAC five-dimensional precision motion platform. Among them, the laser generated by the femtosecond laser 1 is transmitted, expanded, combined / coupled, attenuated, and monitored through the laser optical path transmission and focusing module. After the scanning beam passes through the two-dimensional scanning galvanometer 5, it is focused on the workpiece surface through the F-θ field lens 7 to achieve linear scanning of the laser beam.

[0067] The femtosecond processing system includes: a femtosecond laser 1, a beam expander 2, an attenuator 3, a reflector 4, a two-dimensional scanning galvanometer 5, a Z axis 6, an F-θ field mirror 7, a processing workpiece 8, a special fixture 9, a rotating C axis 10, a support frame 11, an A axis 12, a Y axis 13, and an X axis 14.

[0068] Here’s how it works:

[0069] The femtosecond laser 1 is used as a core component to generate an ultrashort pulse laser beam that propagates along a preset path. First, the laser beam passes through the beam expander 2, which can effectively control the divergence angle of the beam, expand the beam diameter, optimize the laser transmission efficiency, and ensure the focusing performance of the long-distance transmission laser; then it enters the attenuator 3 to reduce the energy intensity of the laser to adapt to the processing requirements of the workpiece material for the laser power; then it enters the reflector 4 to change the propagation direction of the laser beam; then it enters the two-dimensional scanning galvanometer 5, which is fixed on the Z axis 6, and the focusing position of the laser spot on the surface of the workpiece 8 is accurately controlled by adjusting the position of the Z axis 6; after the laser spot is focused on the surface of the workpiece 8 through the F-θ field mirror 7, the scanning path is planned and optimized in the XY plane through the two-dimensional scanning galvanometer.

[0070] The workpiece 8 is fixed on a special fixture 9, which is connected to the turntable of the rotating C-axis 10. The rotation of the rotating C-axis 10 can drive the special fixture 9 and the workpiece 8 to rotate together, thereby realizing the processing of the surface of the workpiece 8 along the circumferential direction.

[0071] The rotating C axis 10 is connected to the moving table A axis 12, Y axis 13 and X axis 14 through the support frame 11. The multi-axis motion control design enables the workpiece 8 to be accurately moved and positioned in a multi-dimensional space, further improving the processing flexibility of the present invention.

[0072] The material properties of each component:

[0073] The reflectors, attenuators 3, beam expanders 2, two-dimensional scanning galvanometers 5, F-θ field mirrors 7, etc. in the femtosecond laser processing system are usually customized according to system requirements. Among them, the reflectors are usually made of silver-plated or aluminum-plated glass or quartz, which need to have high-precision optical surfaces, good thermal stability, and resistance to vibration and impact to ensure the collimation of beam transmission; the attenuator 3 generally uses a neutral density filter or a variable attenuator, which needs to have good spectral transmittance, the ability to prevent thermal deformation, and a highly wear-resistant optical surface; the two-dimensional scanning galvanometer 5 includes reflectors 4 in the X and Y directions, a galvanometer motor, and a drive controller; at the same time, the F-θ field mirror 7 is often made of optical glass or special materials, which has high light transmittance, excellent wear resistance and thermal stability, and maintains high-precision focusing performance.

[0074] The workpiece-specific fixture 9 is made of aluminum alloy. Due to its lightweight characteristics, it can significantly reduce the overall weight of the fixture, help reduce its moment of inertia rotating with the C-axis, and effectively improve the dynamic performance of the system.

[0075] High-precision laser beam wavelength 1030nm, beam quality M 2<1.2, pulse width 290fs, maximum single pulse energy 400μJ, adjustable repetition rate of 60Hz~1000kHz.

[0076] The maximum rotation speed of the rotating C axis 10 is 600rpm, the maximum load is 10kg, and the repeatability is 3".

[0077] The focal length of the F-θ field lens 7 is between 60 mm and 100 mm.

[0078] The two-dimensional scanning galvanometer 5 adopts a strip-type laser reciprocating scanning method in the XY plane, and the adapted C-axis rotation speed does not exceed 1.0 rpm.

[0079] The present invention realizes high-precision, waviness-free processing of workpieces of various shapes by precisely controlling the rotation speed of the workpiece, optimizing the processing path of the scanning galvanometer, and combining the high degree of freedom of the five-dimensional precision motion platform. It is not only suitable for micro-nano processing of conventional materials, but also particularly suitable for the manufacture of optical elements and precision mechanical parts with extremely high requirements on surface quality. It has broad application prospects and significant technical advantages.

[0080] Example 2

[0081] Reference Figure 6 As shown, this embodiment discloses a waviness-free femtosecond laser processing method based on galvanometer path optimization, comprising the following steps:

[0082] Step 1: Connect the special fixture 9 to the rotating C-axis 10;

[0083] Step 2: Clamp the workpiece 8 on the special fixture 9;

[0084] Step 3: The laser beam generated by the femtosecond laser 1 is focused by the two-dimensional scanning galvanometer 5 and the field lens and then irradiated onto the workpiece processing surface;

[0085] Step 4: Control the processing path of the laser focus in the plane of the workpiece through the two-dimensional scanning galvanometer 5, coordinate the C-axis speed to realize the processing in the circumferential direction of the workpiece surface, and realize high surface quality laser processing by optimizing the laser pulse energy processing process parameters.

[0086] like Figure 2As shown, it is a schematic diagram of scanning path I processing implemented by the processing device and processing method described in the above embodiment of the present invention. The laser spot starts processing from point A, first scanning along the -X direction (spacing of 5μm), then scanning along the -Y direction in strips, then scanning along the -X direction (spacing of 10μm), then scanning along the Y direction in strips, and periodically (scanning direction -X→-Y→-X→Y→-X) scanning to point B; then from point B, first scanning along the X direction (spacing of 5μm), then scanning along the Y direction in strips, then scanning along the X direction (spacing of 10μm), then scanning along the -Y direction in strips, and periodically (scanning direction X→Y→X→-Y→X) scanning back to point A. While the galvanometer is scanning back and forth, the C axis rotates clockwise at a constant speed of no more than 1.0rpm.

[0087] like Figure 3 As shown, the processing schematic diagram of scanning path I implemented by the processing device and processing method described in the above embodiment of the present invention, the laser spot starts processing from point A, first scans along the -Y direction (spacing of 5μm), then scans along the -X direction in strips, then scans along the -Y direction (spacing of 10μm), then scans along the X direction in strips, and periodically (scanning direction -Y→-X→-Y→X→-Y) scans to point B; then from point B, first scans along the X direction (spacing of 5μm), then scans along the Y direction in strips, then scans along the X direction (spacing of 10μm), then scans along the -Y direction in strips, and periodically (scanning direction Y→-X→Y→-X→Y) scans back to point A. While the galvanometer scans back and forth, the C axis rotates clockwise at a constant speed of no more than 1.0rpm.

[0088] like Figure 4 As shown, it is the processing result of scanning path I implemented by the processing device and processing method described in the above embodiment of the present invention, and there is an "M" waviness profile on the surface of the workpiece.

[0089] like Figure 5 As shown, it is the scanning path II processing result implemented by the processing device and processing method described in the above embodiment of the present invention, and the surface contour of the workpiece is flat and smooth.

[0090] Compared with the prior art, the embodiment of the present invention implements a strip-type laser reciprocating scanning process path through a two-dimensional scanning galvanometer. At the same time, this technology cooperates with the C-axis clockwise uniform rotation speed not exceeding 1.0rpm to ensure that the workpiece surface is evenly and efficiently processed in the circumferential direction, and can achieve high-precision laser processing without corrugation on the workpiece surface.

[0091] Those skilled in the art know that, in addition to realizing the system and its various devices, modules, and units provided by the present invention in a purely computer-readable program code, it is entirely possible to realize the same functions in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, the system and its various devices, modules, and units provided by the present invention can be considered as a hardware component, and the devices, modules, and units included therein for realizing various functions can also be regarded as structures within the hardware component; the devices, modules, and units for realizing various functions can also be regarded as both software modules for realizing the method and structures within the hardware component.

[0092] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A waviness-free femtosecond laser processing device based on galvanometer path optimization, characterized in that: include: A femtosecond laser (1), a beam expander (2), an attenuator (3), a reflector (4), a two-dimensional scanning galvanometer (5), and an F-θ field mirror (7); The femtosecond laser (1) is used to generate an ultrashort pulse laser beam, which propagates along a preset path; the preset path includes the ultrashort pulse laser beam passing through a beam expander (2), an attenuator (3), a reflector (4), a two-dimensional scanning galvanometer (5), and an F-θ field mirror (7) in sequence; The beam expander (2) is used to expand the diameter of the laser beam, control the divergence angle, optimize the transmission efficiency, and maintain the transmission at a preset distance to maintain the focusing performance; The attenuator (3) is used to reduce the energy intensity of the laser beam; The reflector (4) is used to change the propagation direction of the laser beam; The two-dimensional scanning galvanometer (5) is used to adjust the direction and focal length of the laser beam; The F-θ field mirror (7) is used to correct the nonlinear relationship of laser beam deflection.

2. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 1, characterized in that: Also includes: Z axis (6), processing workpiece (8), special fixture (9), rotating C axis (10), support frame (11), rotating A axis (12), Y axis (13) and X axis (14); The two-dimensional scanning galvanometer (5) is fixed on the Z axis (6) to adjust the focusing of the laser spot diameter on the surface of the workpiece (8) to be processed; after the laser spot is focused, the two-dimensional scanning galvanometer (5) controls the planning of the scanning path of the laser focus in the XY plane on the surface of the workpiece (8); The workpiece (8) to be processed is fixed on a special fixture (9); The special fixture (9) is connected to the rotating C-axis (10); The rotating C axis (10) is connected to the A axis (12), the Y axis (13) and the X axis (14) of the moving table through a support frame (11).

3. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 2, characterized in that: The rotating C axis (10) is rotated to drive the special fixture (9) and the workpiece (8) to rotate, thereby completing the processing of the surface of the workpiece (8) along the circumferential direction.

4. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 1, characterized in that: The material used by the reflector (4) includes silver-plated or aluminum-plated glass or quartz; the material used by the beam expander (2) includes optical glass or quartz; the attenuator (3) includes a neutral density filter or a variable attenuator; and the material used by the F-θ field mirror (7) includes fused quartz.

5. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 2, characterized in that: The special clamp (9) is made of aluminum alloy.

6. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 1, characterized in that: The femtosecond laser (1) generates a light beam with a wavelength of 1030 nm and a beam quality of M 2 <1.2, pulse width 290fs, single pulse maximum energy 400μJ, ultrashort pulse laser beam with adjustable repetition rate of 60Hz~1000kHz.

7. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 2, characterized in that: The maximum rotation speed of the rotating C axis (10) is 600 rpm, the maximum load is 10 kg, and the repeatability is 3".

8. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 1, characterized in that: The focal length of the F-θ field lens (7) is between 60 mm and 100 mm.

9. The waviness-free femtosecond laser processing device based on galvanometer path optimization according to claim 2, characterized in that: The two-dimensional scanning galvanometer (5) adopts a strip-type laser reciprocating scanning method in the XY plane, and the rotation speed of the adapted rotating C axis (10) does not exceed 1.0 rpm.

10. A waviness-free femtosecond laser processing method based on galvanometer path optimization, using the waviness-free femtosecond laser processing device based on galvanometer path optimization according to any one of claims 1 to 9, characterized in that: include: Step S1: Connect the special fixture (9) to the rotating C-axis (10); Step S2: clamping the workpiece (8) on a special fixture (9); Step S3: allowing the laser beam generated by the femtosecond laser (1) to pass through a two-dimensional scanning galvanometer (5) and a field lens for focusing and then irradiating the surface of the workpiece (8); Step S4: controlling the laser focus on a processing path within the plane of the workpiece (8) through a two-dimensional scanning galvanometer (5), and coordinating with the rotating C axis (10) to process the workpiece surface in a circumferential direction; Step S5: Further optimize the processing process by optimizing the laser pulse energy processing process parameters.

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