Temperature measuring method and temperature measuring device for electrical component, and electronic equipment

Abstract

The invention relates to the technical field of electrical component temperature measurement, and discloses a temperature measurement method and device for an electrical component, and electronic equipment. The temperature measurement method comprises the following steps: collecting a whole frame of infrared image of an electrical appliance element to be subjected to temperature measurement in an electrolytic aluminum power system; using a pre-constructed identification model to identify the pixel coordinates of the electrical appliance element to be subjected to temperature measurement in the whole frame of infrared image; analyzing the whole frame of infrared image to determine a temperature matrix; and mapping the pixel coordinates of the electrical appliance element to be subjected to temperature measurement and the temperature matrix, determining the highest temperature in the area where the electrical appliance element to be subjected to temperature measurement is located, and taking the highest temperature as the measurement temperature of the electrical appliance element to be subjected to temperature measurement. According to the method, the pre-constructed recognition model is used, the image processing and recognition technology is adopted, the electrical appliance element to be subjected to temperature measurement is positioned, and the method does not depend on accurate positioning of a holder and an inspection robot. Therefore, the temperature measurement accuracy of the electrical apparatus element in the rectification filtering system can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of temperature measurement of electrical components, for example, to a temperature measurement method and temperature measurement device and electronic equipment for electrical components. Background Art

[0002] At present, the normal operation of the rectifier and filter system is crucial to ensure the safe operation of the electrolytic aluminum power system. Therefore, when the electrolytic aluminum power system is running, it is necessary to conduct temperature measurement and inspection on the electrical components in the rectifier and filter system.

[0003] In the related art, for the temperature measurement of electrical components in the rectifier and filter system, a dual-spectrum temperature measurement pan-tilt platform is usually mounted on an inspection robot as a hardware basis, and the temperature measurement is performed using a preset point + rule frame temperature measurement method.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] The temperature measurement of electrical components in the rectifier and filter system using the preset point + rule frame method is affected by the positioning accuracy of the dual-spectrum temperature measurement pan-tilt and the positioning accuracy of the inspection robot. If the error sum of the pan-tilt positioning accuracy and the inspection robot positioning accuracy is large, the preset temperature measurement point will be outside the rule frame, resulting in the inability to detect the temperature of the electrical component, or the detected temperature accuracy is low. Therefore, how to improve the accuracy of temperature measurement of electrical components in the rectifier and filter system has become a technical problem that needs to be solved urgently. Summary of the invention

[0006] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0007] The embodiments of the present disclosure provide a temperature measurement method and a temperature measurement device and an electronic device for electrical components, which can improve the accuracy of temperature measurement of electrical components in a rectifier and filter system.

[0008] In some embodiments, a temperature measurement method for electrical components includes: collecting a full-frame infrared image of the electrical components to be measured in the electrolytic aluminum power system; using a pre-built recognition model to identify the pixel coordinates of the electrical components to be measured in the full-frame infrared image; parsing the full-frame infrared image to determine the temperature matrix; mapping the pixel coordinates of the electrical components to be measured with the temperature matrix to determine the highest temperature in the area where the electrical components to be measured are located, and using the highest temperature as the measurement temperature of the electrical components to be measured.

[0009] Optionally, a pre-built recognition model is used to identify the pixel coordinates of the electrical component to be measured in the whole frame of infrared image, including: identifying the whole frame of infrared image to determine the pixel image; using the recognition model to identify the electrical component to be measured in the pixel image, and determining the pixel coordinates of the electrical component to be measured.

[0010] Optionally, parsing the entire frame of infrared image to determine the temperature matrix includes: calling an extraction function to extract temperature data in the entire frame of infrared image, and constructing the temperature matrix.

[0011] Optionally, the pixel coordinates of the electrical component to be measured are mapped to the temperature matrix to determine the highest temperature in the area where the electrical component to be measured is located as the measurement temperature of the electrical component to be measured, including: format conversion of the pixel coordinates of the electrical component to be measured to determine the starting coordinates and the ending coordinates of the area where the electrical component to be measured is located; according to the starting coordinates and the ending coordinates, determining the row and column indexes of the area where the electrical component to be measured is located in the temperature matrix; according to the row and column indexes of the electrical component to be measured, extracting the highest temperature in the temperature matrix within the range divided by the row and column indexes as the measurement temperature of the electrical component to be measured.

[0012] Optionally, the recognition model is constructed according to the following steps: a preset number of infrared images including various electrical components to be measured are collected, and a labeling tool is used to label the electrical components to be measured in the infrared images to construct a training set and a test set; an initial model is trained based on the training set; the trained initial model is tested based on the test set, and it is used as a recognition model after passing the test.

[0013] Optionally, the trained initial model is tested based on the test set, including: inputting the test set into the trained initial model to obtain feedback results; calculating the average precision mean of the trained initial model according to the feedback results; and confirming that the trained initial model has passed the test of the test set when the average precision mean is greater than or equal to a set threshold.

[0014] Optionally, after determining the highest temperature in the area where the electrical component to be measured is located as the measured temperature of the electrical component to be measured, the temperature measurement method also includes: saving the entire frame of infrared image, the pixel coordinates of the electrical component to be measured and the measured temperature of the electrical component to be measured; and displaying the measured temperature of the electrical component to be measured in the area where the electrical component to be measured is located in the entire frame of infrared image.

[0015] In some embodiments, a temperature measuring device for electrical components includes: an acquisition module configured to acquire a whole frame of infrared images of electrical components to be measured in an electrolytic aluminum power system; a pixel coordinate recognition module configured to use a pre-built recognition model to recognize the pixel coordinates of the electrical components to be measured in the whole frame of infrared images; a temperature matrix recognition module configured to parse the whole frame of infrared images to determine the temperature matrix; a determination module configured to map the pixel coordinates of the electrical components to be measured with the temperature matrix, determine the highest temperature in the area where the electrical components to be measured are located, and use the highest temperature as the measurement temperature of the electrical components to be measured.

[0016] In some embodiments, a temperature measurement device for an electrical component includes a processor and a memory storing program instructions, and the processor is configured to execute the temperature measurement method for an electrical component as described above.

[0017] In some embodiments, an electronic device includes: a device body; and a temperature measuring device for electrical components as described above, which is arranged on the device body.

[0018] The temperature measurement method, temperature measurement device, and electronic device for electrical components provided by the embodiments of the present disclosure can achieve the following technical effects:

[0019] In the disclosed embodiment, when measuring the temperature of the electrical components to be measured in the electrolytic aluminum system, first, a full-frame infrared image of the electrical components to be measured in the electrolytic aluminum power system will be collected. Then, the pixel coordinates of the electrical components to be measured in the full-frame infrared image will be identified by a pre-constructed recognition model, and the temperature matrix will be determined by parsing the full-frame infrared image. Finally, the highest temperature in the area where the electrical components to be measured are located is determined by mapping the pixel coordinates of the electrical components to be measured with the temperature matrix, and the highest temperature is used as the measured temperature of the electrical components to be measured. It can be seen that the disclosed embodiment uses a pre-constructed recognition model to use image processing and recognition technology to locate the electrical components to be measured, and does not rely on the precise positioning of the pan-tilt head and the inspection robot. Therefore, the disclosed embodiment can improve the accuracy of temperature measurement of electrical components in the rectifier and filter system.

[0020] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0022] Figure 1 is a schematic diagram of an electronic device provided by an embodiment of the present disclosure;

[0023] Figure 2 is a schematic diagram of a temperature measurement method for an electrical component provided by an embodiment of the present disclosure;

[0024] Figure 3 is a schematic diagram of another temperature measurement method for an electrical component provided by an embodiment of the present disclosure;

[0025] Figure 4 It is a full-frame infrared image showing the measured temperature of the electrical component to be measured, provided by the embodiment of the present disclosure;

[0026] Figure 5 is a schematic diagram of a temperature measuring device for an electrical component provided in an embodiment of the present disclosure;

[0027] Figure 6 It is a schematic diagram of another temperature measuring device for electrical components provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0029] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0030] Unless otherwise stated, the term "plurality" of a feature means two or more.

[0031] In the embodiment of the present disclosure, the character " / " feature indicates that the preceding and following objects are in an "or" relationship. For example, the A / B feature indicates: A or B.

[0032] The term "and / or" is a description of the association relationship between objects, and the characteristic indicates that there can be three relationships. For example, A and / or B, the characteristic indicates: A or B, or, A and B.

[0033] The term "correspondence" may refer to an association relationship or a binding relationship. The correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0035] like Figure 1 As shown, the electronic device 100 provided by the embodiment of the present disclosure includes a device body 110 and a temperature measuring device 500 (600) for electrical components.

[0036] Specifically, the temperature measuring device 500 ( 600 ) for the electrical component is disposed on the device body 110 .

[0037] Optionally, the temperature measuring device 600 for electrical components includes a processor. When measuring the temperature of the electrical components in the rectifier and filter system, the processor can collect a whole frame of infrared images of the electrical components to be measured. A pre-built recognition model can be used to identify the pixel coordinates of the electrical components to be measured in the whole frame of infrared images, and the whole frame of infrared images can be parsed to determine the temperature matrix. The pixel coordinates of the electrical components to be measured can be mapped to the temperature matrix to determine the highest temperature in the area where the electrical components to be measured are located, and the highest temperature is used as the measured temperature of the electrical components to be measured.

[0038] In combination with the above electronic device, the present disclosure provides a temperature measurement method for an electrical component, such as Figure 2 As shown, the temperature measurement method includes:

[0039] S201, the processor collects a full frame of infrared images of the electrical components to be measured in the electrolytic aluminum power system.

[0040] Specifically, the electrical component to be measured in the electrolytic aluminum power system is an electrical component used for rectification and filtering in the electrolytic aluminum power system.

[0041] Optionally, the electrical components to be measured in temperature include but are not limited to diodes, fast fuses, pure water pumps and busbars.

[0042] Specifically, an infrared image acquisition device (eg, an infrared camera) is provided in the rectifying and filtering system of the electrolytic aluminum power system, and the electronic device is communicatively connected with the infrared image acquisition device. The processor can acquire a full frame infrared image of the electrical component to be measured through the infrared image acquisition device.

[0043] S202, the processor uses a pre-built recognition model to recognize pixel coordinates of the electrical component to be temperature-measured in the entire frame of infrared image.

[0044] Specifically, the recognition model is a model that is pre-trained based on a deep learning model (for example, yolov5 (you only look once)) based on infrared images that are labeled with a variety of electrical components to be measured, and can identify various electrical components to be measured and their locations in the entire frame of infrared images.

[0045] Specifically, the pixel coordinates of the electrical component to be measured are used to represent the center coordinates of the area where the electrical component to be measured is located in the whole frame of infrared image and the height and width of the prediction box corresponding to the area. By identifying the pixel coordinates of the electrical component to be measured in the whole frame of infrared image, it is possible to determine which electrical components to be measured are included in the whole frame of infrared image and the area where each electrical component to be measured is located. Therefore, after acquiring the whole frame of infrared image, it is necessary to use a pre-built recognition model to identify the pixel coordinates of the electrical component to be measured in the whole frame of infrared image.

[0046] Optionally, a pre-built recognition model is used to identify the pixel coordinates of the electrical component to be measured in the whole frame of infrared image, including: identifying the whole frame of infrared image to determine the pixel image; using the recognition model to identify the electrical component to be measured in the pixel image, and determining the pixel coordinates of the electrical component to be measured.

[0047] Specifically, the whole frame of infrared image includes pixel image (pixel image is a thermal map in JPG format) and temperature data (temperature data is a thermal map in CSV format). Among them, the pixel image is used to display each object in the whole frame of infrared image, and the temperature data includes the temperature value of each pixel point in the whole frame of infrared image. Therefore, when measuring the temperature of the electrical component to be measured, it is necessary to first identify the pixel image through the recognition model to determine the pixel coordinates of the electrical component to be measured, so as to correspond the electrical component to be measured with the temperature data later.

[0048] Optionally, before using the recognition model to identify the electrical component to be measured in the pixel image, the pixel image may be preprocessed (such as denoising, enhancing, etc.) to improve the accuracy of the pixel coordinates of the subsequently identified electrical component to be measured.

[0049] S203, the processor analyzes the entire frame of infrared image to determine a temperature matrix.

[0050] Specifically, it can be understood that the entire frame of infrared image includes the temperature data of each pixel in the image, and by converting the temperature data of each pixel in the entire frame of infrared image into a matrix form, the temperature matrix corresponding to the entire frame of infrared image can be obtained. Specifically, the temperature matrix is ​​a two-dimensional array, each element of which represents the temperature value of the corresponding position in the entire frame of infrared image.

[0051] Optionally, parsing the entire frame of infrared image to determine the temperature matrix includes: calling an extraction function to extract temperature data in the entire frame of infrared image, and constructing the temperature matrix.

[0052] Specifically, the whole frame of infrared image includes pixel image (pixel image is a thermal map in JPG format) and temperature data (temperature data is a thermal map in CSV format). The temperature data includes the temperature value of each pixel in the whole frame of infrared image. Therefore, by calling the extraction function to process the whole frame of infrared image, the temperature data can be extracted and the temperature matrix of the whole frame of infrared image can be constructed.

[0053] Optionally, the extraction function may be a data acquisition function GetGWTempEx.

[0054] S204, the processor maps the pixel coordinates of the electrical component to be measured with the temperature matrix, determines the highest temperature in the area where the electrical component to be measured is located, and uses the highest temperature as the measurement temperature of the electrical component to be measured.

[0055] Specifically, the pixel coordinates of the electrical component to be measured can represent its position in the image, and each element in the temperature matrix represents the temperature value of the corresponding position in the entire infrared image. Therefore, by mapping the pixel coordinates of the electrical component to be measured with the temperature matrix, the temperature value corresponding to each pixel coordinate can be extracted, thereby determining the specific temperature distribution of the area where the electrical component to be measured is located in the temperature matrix.

[0056] Specifically, it is understandable that the temperature distribution of electrical components during operation is not uniform, and the highest temperature in the area where the electrical components are located represents the worst thermal stress condition to which the electrical components are subjected during operation. Monitoring this highest temperature is of advance significance for evaluating the safety of the electrical components. Therefore, in the embodiment of the present disclosure, the highest temperature in the area where the electrical components to be measured are located is used as the measured temperature of the electrical components to be measured.

[0057] In the disclosed embodiment, when measuring the temperature of the electrical components to be measured in the electrolytic aluminum system, first, a full-frame infrared image of the electrical components to be measured in the electrolytic aluminum power system will be collected. Then, the pixel coordinates of the electrical components to be measured in the full-frame infrared image will be identified by a pre-constructed recognition model, and the temperature matrix will be determined by parsing the full-frame infrared image. Finally, the highest temperature in the area where the electrical components to be measured are located is determined by mapping the pixel coordinates of the electrical components to be measured with the temperature matrix, and the highest temperature is used as the measured temperature of the electrical components to be measured. It can be seen that the disclosed embodiment uses a pre-constructed recognition model to use image processing and recognition technology to locate the electrical components to be measured, and does not rely on the precise positioning of the pan-tilt head and the inspection robot. Therefore, the disclosed embodiment can improve the accuracy of temperature measurement of electrical components in the rectifier and filter system.

[0058] The present disclosure provides another temperature measurement method for electrical components. Figure 3 As shown, the temperature measurement method includes:

[0059] S301, the processor collects a full frame of infrared images of the electrical components to be measured in the electrolytic aluminum power system.

[0060] S302, the processor uses a pre-built recognition model to recognize pixel coordinates of the electrical component to be temperature-measured in the entire frame of infrared image.

[0061] S303, the processor parses the entire frame of infrared image to determine a temperature matrix.

[0062] S304, the processor converts the format of the pixel coordinates of the temperature-measured electrical appliance to determine the starting coordinates and the ending coordinates of the area where the temperature-measured electrical appliance components are located.

[0063] Specifically, the pixel coordinates identified by the recognition model are generally in the xywh format, where xy is the center point coordinate of the prediction box of the area where the temperature-measured electrical component is located, and wh is the width and height of the prediction box. Pixel coordinates in this format are not convenient for subsequent mapping of pixel coordinates to the temperature matrix. Therefore, it is necessary to first convert the pixel coordinates of the temperature-measured electrical appliance into a format, specifically, the pixel coordinates can be converted into an xyxy format, where the first xy is the starting coordinate (the upper left corner coordinate of the prediction box of the area where the temperature-measured electrical component is located), and the second xy is the ending coordinate (the lower right corner coordinate of the prediction box of the area where the temperature-measured electrical component is located).

[0064] S305: The processor determines the row and column indexes of the area where the temperature-tested electrical appliance is located in the temperature matrix according to the starting coordinates and the ending coordinates.

[0065] Specifically, the row and column indexes of the area where the temperature-tested electrical appliance is located in the temperature matrix are used to specify the submatrix corresponding to the area where the temperature-tested electrical appliance is located in the temperature matrix. The row and column indexes include start_row (index of the starting row of the submatrix), start_col (index of the starting column of the submatrix), end_row (index of the ending row of the submatrix), and end_col (index of the ending column of the submatrix).

[0066] It should be noted that the size of the whole frame infrared image may be inconsistent with the size of the temperature matrix. In this case, it is necessary to unify the size of the whole frame infrared image and the temperature matrix, and then determine the row and column index of the area where the temperature-tested electrical appliance is located in the temperature matrix according to the starting coordinates and the ending coordinates. For example, the size of the whole frame infrared image is 1280*1024, the size of the temperature matrix is ​​640*512, and the image size is twice the size of the matrix. In this case, the pixel coordinates need to be divided by 2 first.

[0067] S306, the processor extracts the highest temperature in the range divided by the row and column indexes in the temperature matrix according to the row and column indexes of the electrical component to be measured, and uses the highest temperature as the measured temperature of the electrical component to be measured.

[0068] Specifically, the range divided based on the row and column indexes in the temperature matrix is ​​the area where the electrical component to be measured is located. Therefore, the highest temperature in the range can be used as the measurement temperature of the electrical component to be measured.

[0069] In the disclosed embodiment, when the pixel coordinates of the temperature-measured electrical component are mapped to the temperature matrix to determine the highest temperature in the area where the temperature-measured electrical component is located, first, the pixel coordinates of the temperature-measured electrical component are converted to a format to determine the starting coordinates and the ending coordinates of the area where the temperature-measured electrical component is located. Then, based on the starting coordinates and the ending coordinates, the row and column indexes of the area where the temperature-measured electrical component is located in the temperature matrix are determined. Finally, based on the row and column indexes of the temperature-measured electrical component, the highest temperature in the temperature matrix that is within the range divided by the row and column indexes is extracted. This helps to improve the accuracy of identifying the highest temperature in the area where the temperature-measured electrical component is located.

[0070] In some embodiments, a recognition model is constructed according to the following steps: a preset number of infrared images including multiple electrical components to be measured are collected, and a labeling tool is used to label the electrical components to be measured in the infrared images to construct a training set and a test set; an initial model is trained based on the training set; the trained initial model is tested based on the test set, and it is used as a recognition model after passing the test.

[0071] Specifically, the ratio of the training set to the test set is 8:2.

[0072] Optionally, the trained initial model is tested based on the test set, including: inputting the test set into the trained initial model to obtain feedback results; calculating the average precision mean of the trained initial model according to the feedback results; and confirming that the trained initial model has passed the test of the test set when the average precision mean is greater than or equal to a set threshold.

[0073] Specifically, the mean average precision refers to the map value.

[0074] Specifically, if the average precision mean of the trained initial model is greater than or equal to the set threshold, it indicates that the accuracy of the trained initial model in identifying the electrical components in the infrared image meets the use requirements. Therefore, in this case, it can be confirmed that the trained initial model passes the test of the test set.

[0075] In this embodiment, the trained initial model is used as the recognition model only after it passes the test of the test set, thus ensuring the accuracy of the pixel coordinates of the electrical component to be measured in the whole frame of infrared image extracted based on the recognition model.

[0076] In some embodiments, after taking the highest temperature as the measured temperature of the electrical component to be measured, the temperature measurement method also includes: saving the entire frame of infrared image, the pixel coordinates of the electrical component to be measured, and the measured temperature of the electrical component to be measured; and displaying the measured temperature of the electrical component to be measured in the area where the electrical component to be measured is located in the entire frame of infrared image.

[0077] Specifically, by saving the entire infrared image, the pixel coordinates of the electrical component to be measured, and the measured temperature of the electrical component to be measured, it is convenient for subsequent users to view the historical temperature changes of the electrical component to be measured and analyze the working conditions of the electrical component to be measured.

[0078] Specifically, the measured temperature of the electrical component to be measured is displayed in the area where the electrical component to be measured is located in the whole frame of infrared image, so that the user can intuitively view the measured temperature of the electrical component to be measured and realize real-time monitoring of the temperature of the electrical component to be measured.

[0079] For example, the situation where the measured temperature of the electrical component to be measured is displayed in the area where the electrical component to be measured is located in the whole frame of infrared image is as follows: Figure 4 shown. Figure 4 In the figure, each box represents the area where different electrical components to be measured are located, and the data on the upper part of the box represents the measured temperature value of the electrical components to be measured.

[0080] Combination Figure 5 As shown, the embodiment of the present disclosure provides a temperature measurement device 500 for electrical components, including: an acquisition module 501, a pixel coordinate recognition module 502, a temperature matrix recognition module 503 and a determination module 504. The acquisition module 501 is configured to acquire a whole frame of infrared images of the electrical components to be measured in the electrolytic aluminum power system. The pixel coordinate recognition module 502 is configured to use a pre-built recognition model to identify the pixel coordinates of the electrical components to be measured in the whole frame of infrared images. The temperature matrix recognition module 503 is configured to parse the whole frame of infrared images to determine the temperature matrix. The determination module 504 is configured to map the pixel coordinates of the electrical components to be measured with the temperature matrix, determine the highest temperature in the area where the electrical components to be measured are located, and use the highest temperature as the measurement temperature of the electrical components to be measured.

[0081] Combination Figure 6As shown, the embodiment of the present disclosure provides a temperature measurement device 600 for electrical components, including: a processor (processor) 601 and a memory (memory) 602. Optionally, the device may also include a communication interface (Communication Interface) 603 and a bus 604. Among them, the processor 601, the communication interface 603, and the memory 602 can communicate with each other through the bus 604. The communication interface 603 can be used for information transmission. The processor 601 can call the logic instructions in the memory 602 to execute the temperature measurement method for electrical components of the above embodiment.

[0082] In addition, the logic instructions in the memory 602 described above may be implemented in the form of software functional units and when sold or used as independent products, may be stored in a computer-readable storage medium.

[0083] The memory 602 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present disclosure. The processor 601 executes the function application and data processing by running the program instructions / modules stored in the memory 602, that is, the temperature measurement method for electrical components in the above embodiment is implemented.

[0084] The memory 602 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 602 may include a high-speed random access memory and may also include a non-volatile memory.

[0085] An embodiment of the present disclosure provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured to execute the above-mentioned temperature measurement method for an electrical component.

[0086] The technical solution of the embodiment of the present disclosure can be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the embodiment of the present disclosure. The aforementioned storage medium may be a non-transient storage medium, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, and other media that can store program codes.

[0087] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible changes. Unless explicitly required, separate components and functions are optional, and the order of operation may vary. The parts and features of some embodiments may be included in or replace the parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and the claims, unless the context clearly indicates, the singular forms of "a", "an" and "the" are intended to include plural forms as well. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of listings containing one or more associated ones. In addition, when used in the present application, the term "comprise" and its variants "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the presence of other identical elements in the process, method or device comprising the elements. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments may refer to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can refer to the description of the method part.

[0088] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. The technicians may use different methods for each specific application to implement the described functions, but such implementations should not be considered to exceed the scope of the embodiments of the present disclosure. The technicians may clearly understand that, for the convenience and simplicity of description, the specific working processes of the systems, devices and units described above may refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here.

[0089] In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units can be only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between each other shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiment of the present disclosure may be integrated in a processing unit, or each unit may exist physically alone, or two or more units may be integrated in one unit.

[0090] The flowchart and block diagram in the accompanying drawings show the possible architecture, function and operation of the system, method and computer program product according to the embodiment of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. In the description corresponding to the flowchart and the block diagram in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in a different order from the order disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A temperature measurement method for electrical components, characterized in that: include: Collect full-frame infrared images of electrical components to be measured in the electrolytic aluminum power system; Use the pre-built recognition model to identify the pixel coordinates of the electrical components to be measured in the entire infrared image; Analyze the entire infrared image to determine the temperature matrix; The pixel coordinates of the electrical component to be measured are mapped to the temperature matrix to determine the highest temperature in the area where the electrical component to be measured is located, and the highest temperature is used as the measurement temperature of the electrical component to be measured.

2. The temperature measurement method according to claim 1, characterized in that: The pre-built recognition model is used to identify the pixel coordinates of the electrical components to be measured in the entire infrared image, including: Identify the entire frame of infrared image to determine the pixel image; The recognition model is used to recognize the electrical component to be measured in the pixel image, and the pixel coordinates of the electrical component to be measured are determined.

3. The temperature measurement method according to claim 1, characterized in that: Analyze the entire infrared image to determine the temperature matrix, including: Call the extraction function to extract the temperature data in the entire frame of infrared image and construct a temperature matrix.

4. The temperature measurement method according to any one of claims 1 to 3, characterized in that: Mapping the pixel coordinates of the electrical component to be measured with the temperature matrix, and determining the highest temperature in the area where the electrical component to be measured is located as the measurement temperature of the electrical component to be measured, including: Performing format conversion on the pixel coordinates of the temperature-measured electrical appliance to determine the starting coordinates and the ending coordinates of the area where the temperature-measured electrical appliance element is located; According to the starting coordinates and the ending coordinates, the row and column indexes of the area where the temperature-tested electrical appliance is located in the temperature matrix are determined; According to the row and column indexes of the electrical component to be measured, the highest temperature in the temperature matrix within the range divided by the row and column indexes is extracted as the measurement temperature of the electrical component to be measured.

5. The temperature measurement method according to any one of claims 1 to 3, characterized in that: Follow the steps below to build a recognition model: Collect a preset number of infrared images including various electrical components to be measured, and use annotation tools to annotate the electrical components to be measured in the infrared images to construct a training set and a test set; Train the initial model based on the training set; The trained initial model is tested on the test set and used as the recognition model after passing the test.

6. The temperature measurement method according to claim 5, characterized in that: Test the trained initial model based on the test set, including: Input the test set into the trained initial model to obtain feedback results; Calculate the average precision of the initial model after training based on the feedback results; When the average precision is greater than or equal to the set threshold, it is confirmed that the trained initial model passes the test of the test set.

7. The temperature measurement method according to any one of claims 1 to 3, characterized in that: After the highest temperature is used as the measured temperature of the electrical component to be measured, the temperature measurement method further includes: Save the whole frame of infrared image, the pixel coordinates of the electrical component to be measured and the measured temperature of the electrical component to be measured; The measured temperature of the electrical component to be measured is displayed in the area where the electrical component to be measured is located in the entire frame of infrared image.

8. A temperature measuring device for electrical components, characterized in that: include: An acquisition module is configured to acquire a full-frame infrared image of an electrical component to be temperature-measured in an electrolytic aluminum power system; A pixel coordinate recognition module is configured to use a pre-built recognition model to recognize the pixel coordinates of the electrical component to be temperature-measured in the entire frame of infrared image; A temperature matrix recognition module is configured to parse the entire infrared image frame to determine a temperature matrix; The determination module is configured to map the pixel coordinates of the electrical component to be measured with the temperature matrix, determine the highest temperature in the area where the electrical component to be measured is located, and use the highest temperature as the measurement temperature of the electrical component to be measured.

9. A temperature measuring device for an electrical component, comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to execute the temperature measurement method for an electrical component according to any one of claims 1 to 7.

10. An electronic device, characterized in that: include: Equipment body; The temperature measuring device for electrical components as described in claim 8 or 9 is arranged on the device body.

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