Cooling system of airborne computer and control method

Abstract

The invention provides a cooling system of an airborne computer and a control method. The cooling system comprises a fan, an environment control interface, a bracket, a mother board, a case, a plurality of electronic modules arranged in parallel and a fan control module, the electronic module and the fan control module are arranged in the case, the case is fixed through the bracket, and the electronic module is fixed to the mother board; the fan and the environmental control interface are arranged at the rear part of the bracket; the fan control module is electrically connected with the fan; an upper cold plate and a lower cold plate are arranged on the upper portion and the lower portion of the machine box, and through holes are formed in the upper cold plate and the lower cold plate. The fan and an air outlet of the environment control interface are communicated with the bottom of the case, and the fan, the air outlet of the environment control interface, the bottom of the case and gaps between the through holes and the electronic modules form a heat dissipation air channel. Through the cooling system and control over the cooling system, the requirement for heat dissipation of the airborne computer is met.

Description

Technical Field

[0001] The present invention relates to the technical field of computer cooling, and in particular to a cooling system and a control method for an onboard computer. Background Art

[0002] As computer speeds continue to increase, the overall power consumption of airborne computers is also increasing. In order to ensure long-term stable operation of the computer, the heat generated by the components must be exchanged to avoid excessive component temperatures affecting normal operation and to ensure the reliability of the components. Currently, the commonly used cooling methods for airborne computers include liquid cooling, air cooling, and natural heat dissipation. For air cooling, the general aircraft environmental control system will provide cooling air with a certain air volume and air temperature.

[0003] However, when the aircraft's engine is not running at full speed, the air supply flow and temperature of the aircraft's environmental control system may not meet the specified conditions. At the same time, when the aircraft is at low altitude and high speed, the cabin may be heated by air friction, causing the cabin temperature to rise sharply. Therefore, there is a problem that the cooling air provided by the environmental control system cannot meet the heat dissipation requirements of the onboard computer. Summary of the invention

[0004] In view of this, the embodiments of the present specification provide a cooling system and control method for an onboard computer to achieve the purpose of meeting the heat dissipation requirements of the onboard computer.

[0005] The embodiments of this specification provide the following technical solutions:

[0006] A cooling system for an onboard computer, comprising:

[0007] Fan, environmental control interface, bracket, motherboard, chassis, multiple electronic modules arranged in parallel and fan control module;

[0008] The electronic module and the fan control module are both arranged in a chassis, the chassis is fixed by a bracket, and the electronic modules are both fixed to the motherboard;

[0009] The fan and environmental control interface are arranged at the rear of the bracket, and the fan control module is electrically connected to the fan;

[0010] An upper cold plate and a lower cold plate are arranged above and below the chassis, and through holes are arranged on both the upper cold plate and the lower cold plate;

[0011] The air outlets of the fan and the environmental control interface are both connected to the bottom of the chassis, and the air outlets of the fan and the environmental control interface, the bottom of the chassis, the through holes and the gap between the electronic module constitute a heat dissipation duct.

[0012] Further, the fan includes a control circuit and a fan drive system;

[0013] The fan control module includes a processor circuit, an FPGA chip, an auxiliary test circuit and a driver;

[0014] The fan control module is connected to the fan drive system through a driver, the driver is connected to the FPGA chip, and the FPGA chip is also interconnected with the auxiliary test circuit and the processor circuit;

[0015] The driver is used to amplify the status data of the fan provided by the control circuit to generate amplified status data, wherein the status data of the fan includes the switch status and speed data of the fan;

[0016] The FPGA chip is used to obtain the amplified state data and transmit the temperature data collected by the temperature sensor to the auxiliary test circuit. The FPGA chip is also used to convert the processed signals generated by the processor circuit and the auxiliary test circuit into PMW control signals and transmit the PMW control signals to the driver.

[0017] The auxiliary test circuit is used for processing the temperature data and generating a processed signal;

[0018] The processor circuit is used to collect the temperature of key components in the auxiliary test circuit, and control the on, off and speed of the fan drive system through the driver according to the temperature of the key components.

[0019] Further, the electronic module comprises:

[0020] Upper cover, electronic components, plug and pull device, locking strip, lower cover and thermal interface material;

[0021] A plurality of electronic components are arranged between the upper cover plate and the lower cover plate, and the electronic components are fixed to the lower cover plate by locking strips;

[0022] The plug-in connector is arranged at the bottom of the lower cover plate, and the electronic module is fixed to the chassis through the plug-in connector.

[0023] Further, the fan also includes a one-way valve and a temperature sensor;

[0024] The one-way valve is arranged below the fan, and the temperature sensor is arranged inside the fan;

[0025] The one-way valve includes a gland, a shaft, a torsion spring, a hinge and a wiring harness;

[0026] The gland is arranged on the air outlet of the fan, and the hinge is fixed to the gland by a torsion spring and a shaft;

[0027] The temperature sensor is connected to the temperature sensor through a wiring harness, and the temperature sensor is used to collect temperature data.

[0028] Furthermore, a temperature flow sensor is provided in the environmental control air duct of the environmental control interface, and the temperature flow sensor is used to collect temperature data.

[0029] A control method for a cooling system of an onboard computer, the control method is used to control the cooling system of the onboard computer to cool the onboard computer, and is characterized by comprising:

[0030] Connect the fan control module to the fan;

[0031] Set the maximum operating temperature of the electronic module and the maximum fan speed of the fan, and collect the component temperature of the electronic module in real time;

[0032] When the temperature of the component is greater than the maximum operating temperature, the fan switch state of the fan is adjusted to on through the fan control module, and the fan speed is adjusted to 80% of the maximum fan speed;

[0033] When the temperature of the components is greater than the maximum operating temperature plus 10 degrees, the fan switch state of the fan is adjusted to on through the fan control module, and the fan speed is adjusted to the maximum fan speed;

[0034] When the temperature of the components is between the maximum operating temperature minus 20 degrees and the maximum operating temperature, the fan control module adjusts the fan switch state to on, and adjusts the fan speed to 50% of the maximum fan speed;

[0035] When the temperature of the components is lower than the maximum operating temperature minus 20 degrees, the fan control module adjusts the fan's switch state to shutdown.

[0036] Furthermore, it also includes:

[0037] Monitor the status of the fan through the fan control module;

[0038] If the fan fails, record the fan failure information.

[0039] Furthermore, the fault information includes:

[0040] The fan sends a signal to stop and / or,

[0041] The fan speed increases but the temperature of the electronic module does not decrease and / or,

[0042] The fan is at maximum speed and the electronic module is at high speed and / or,

[0043] The fan speed cannot be adjusted and / or,

[0044] Any group of electronic components in the electronic module has a sustained high temperature.

[0045] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0046] The heat dissipation requirements of the onboard computer are met through the cooling system and the control of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 is a schematic diagram of the overall structure of a cooling system of an onboard computer according to an embodiment of the present invention;

[0049] Figure 2 is a schematic structural diagram of an electronic component according to an embodiment of the present invention;

[0050] Figure 3 A schematic diagram of the flow path of the cooling system of the onboard computer of the present invention;

[0051] Figure 4 A schematic structural diagram of a fan according to an embodiment of the present invention;

[0052] Figure 5 A schematic diagram of the structure of an environmental control interface according to an embodiment of the present invention;

[0053] Figure 6 Schematic diagram of a fan control circuit according to an embodiment of the present invention.

[0054] 1. Fan; 101. Pressure cover; 102. Shaft; 103. Torsion spring; 104. Hinge; 105. Temperature sensor; 106. Wiring harness; 2. Environmental control interface; 201. Temperature flow sensor; 3. Bracket; 4. Motherboard; 5. Chassis; 6. Electronic module; 601. Cover; 602. Electronic component; 603. Plug and unplug; 604. Locking strip; 605. Cover; 7. Fan control module. DETAILED DESCRIPTION

[0055] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0056] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0057] like Figure 1 As shown, a cooling system for an onboard computer comprises:

[0058] Fan 1, environmental control interface 2, bracket 3, motherboard 4, chassis 5, multiple electronic modules 6 and fan control module 7 arranged in parallel.

[0059] The electronic module 6 and the fan control module 7 are arranged in the chassis 5, and the chassis 5 is fixed by a bracket, and the chassis 5 is fixed by the bracket 3 and the motherboard 4. The fan 1 and the environmental control interface 2 are both arranged at the rear of the bracket 3, and the fan control module 7 is electrically connected to the fan 1. The upper and lower cold plates are arranged on the upper and lower parts of the chassis 5, and the upper and lower cold plates are both provided with through holes. The air outlets of the fan 1 and the environmental control interface 2 are both connected to the bottom of the chassis 5, and the air outlets of the fan 1 and the environmental control interface 2, the bottom of the chassis 5, the through holes and the gap between the electronic module 6 constitute a heat dissipation duct.

[0060] The fan 1 includes a control circuit and a fan drive system. The fan control module 7 includes a processor circuit, an FPGA chip, an auxiliary test circuit, a driver, a one-way valve and a temperature sensor 105 .

[0061] The fan control module 7 is connected to the fan drive system through a driver, and the driver is connected to the FPGA chip. The FPGA chip is also interconnected with the auxiliary test circuit and the processor circuit. The driver is used to amplify the state data of the fan 1 provided by the control circuit and generate amplified state data, wherein the state data of the fan 1 includes the fan switch state and speed data. The FPGA chip is used to obtain the amplified state data and transmit the temperature data collected by the temperature sensor to the auxiliary test circuit. The FPGA chip is also used to convert the processed signals generated by the processor circuit and the auxiliary test circuit into PMW control signals, and transmit the PMW control signals to the driver.

[0062] The auxiliary test circuit is used to process temperature data and generate processed signals. The processor circuit is used to collect the temperature of key components in the auxiliary test circuit and control the on / off and speed of the fan drive system through the driver according to the temperature of the key components.

[0063] The processor circuit periodically collects the temperature of key components in the auxiliary test circuit through the I2t (I squared × t) circuit. When the temperature rises to the set value, the FPGA chip is controlled by the digital signal to adjust the duty cycle of the PMW signal. After being converted into a 5V level by the driver, the control circuit of fan 1 controls the on / off and speed of the fan drive system.

[0064] The control circuit of fan 1 processes the collected fan status signal through the driver and transmits it to the FPGA chip to form a control closed loop.

[0065] like Figure 2As shown, the electronic module 6 includes: an upper cover plate 601, an electronic component 602, a plug-in device 603, a locking strip 604, a lower cover plate 605 and a thermal interface material. There can be several electronic components 602. The components of the electronic component 602 transfer heat to the cover plate through thermal interface materials such as thermal pads or thermal grease. There are heat dissipation fins on the upper cover plate 601 and the lower cover plate 605 to increase the heat exchange efficiency. The power consumption of the lower cover plate 605 is not more than 200W. The lower cover plate 605 has high-speed computing functions, network communication functions, secondary power conversion functions, map functions, storage functions, etc.

[0066] The components of the electronic assembly 602 conduct heat to the cover plate through thermal interface materials such as thermal pads or thermal grease. The cover plate is provided with heat dissipation fins to increase the heat exchange efficiency. The key chip of the fan control module 7 has a temperature measurement function. The fan control module 7 has fan control, fan temperature calculation functions, and environmental control flow and temperature calculation functions. The power consumption of the fan control module 7 is not more than 200W.

[0067] like Figure 3 As shown, the cooling air provided by the aircraft environmental control enters the bottom of the chassis 5 through the air cavity of the bracket 3, passes through the air duct formed by the module and the chassis, and is discharged from the upper part of the chassis 5. During the air flow, the cooling air exchanges heat with the module, thereby cooling the electronic module 6. The environmental control flow and temperature are provided to the environmental control system through a computer for health monitoring of the cooling air of the environmental control system. The fan temperature signal is provided to the environmental control system through a computer for temperature monitoring of the cabin section.

[0068] like Figure 4 As shown, the one-way valve is arranged below the fan 1, and the temperature sensor 105 is arranged inside the fan 1. The one-way valve includes a gland 101, a shaft 102, a torsion spring 103, a hinge 104 and a harness 106. The gland 101 is arranged on the air outlet of the fan 1, and the hinge 104 is fixed to the gland 101 by the torsion spring 103 and the shaft 102.

[0069] The temperature sensor 105 is connected to the temperature sensor 105 through the wiring harness 106 , and the temperature sensor 105 is used to collect temperature data.

[0070] like Figure 5 As shown, a temperature flow sensor 201 is provided in the environmental control air duct of the environmental control interface 2, and the temperature flow sensor 201 is used to collect temperature data. The environmental control air duct of the environmental control interface 2 is always open, and whether the fan 1 works depends on the temperature of the components. When the fan 1 starts, the one-way valve opens due to the wind pressure of the fan 1. When the fan is shut down, the one-way valve closes to prevent the cooling air provided by the environmental control from leaking from the fan. The environmental control system itself has a valve, and there will be no problem of backflow of cooling air from the fan.

[0071] Multiple groups of electronic components 602 are arranged between the upper cover plate 601 and the upper cover plate 601, and the electronic components 602 are fixed to the lower cover plate 605 through the locking strip 604. The plug-in device 603 is arranged at the bottom of the lower cover plate 605, and the electronic module 6 is fixed to the chassis 5 through the plug-in device 603.

[0072] like Figure 6 As shown, the fan 1 includes a control circuit and a fan drive system. The fan control module 7 includes a processor circuit, an FPGA chip, an auxiliary test circuit and a driver.

[0073] The fan control module 7 is connected to the fan drive system through a driver, and the driver is connected to the FPGA chip. The FPGA chip is also interconnected with the auxiliary test circuit and the processor circuit. The driver is used to amplify the state data of the fan 1 provided by the control circuit and generate the amplified state data, wherein the state data of the fan 1 includes the fan switch state and speed data. The FPGA chip is used to obtain the amplified state data and transmit the temperature data collected by the temperature sensor to the auxiliary test circuit. The FPGA chip is also used to convert the processed signal generated by the processor circuit and the auxiliary test circuit into a PMW control signal, and transmit the PMW control signal to the driver. The auxiliary test circuit is used to process the temperature data and generate the processed signal. The processor circuit is used to process the temperature data and generate the processed signal.

[0074] The fan 1 receives power input from the chassis 5, and the control module controls the fan, that is, by adjusting the duty cycle of the output PWM wave, the PWM control circuit adjusts the level and amplifies the current, and then controls the speed of the fan 1. At the same time, the fan control module 7 can collect the fan indication signal to obtain the working status of the fan.

[0075] When the temperature of the key components of the electronic module 6 is greater than T0 (T0 can be obtained through thermal simulation or actual testing, and is generally defined as the highest normal operating temperature), the speed of the fan 1 is turned on to 80% to provide auxiliary cooling air. When the temperature of the key components of the electronic module 6 is greater than (T0+10), the speed of the fan is turned on to 100%. When the temperature of the components drops to (T0-20), the fan 1 is turned off.

[0076] When the following situations are found, health monitoring will record the fault information:

[0077] a. The fan sends a signal to stop rotating;

[0078] b. The fan speed increases, but the temperature does not drop.

[0079] c. The fan is at the highest speed, and the components of the electronic module 6 are still working at high speed;

[0080] d. The fan speed cannot be adjusted;

[0081] e. According to the design, the temperature of all electronic modules should be relatively uniform. When an individual module has an abnormally high temperature, it will continue to be high.

[0082] When an abnormality occurs, the fan and air duct should be checked.

[0083] Embodiments of the present invention:

[0084] When the cooling system of the onboard computer is working: the cooling air provided by the aircraft environmental control enters the bottom of the chassis 5 through the wind cavity of the bracket 3, passes through the air duct formed by the electronic module 6 and the chassis 5, and is discharged from the upper part of the chassis 5. During the air flow, the cooling air exchanges heat with the electronic module 6, thereby cooling the electronic module 6. The cooling flow and temperature are provided to the environmental control system through the computer for health monitoring of the cooling air of the cooling system. The temperature signal of the fan 1 is provided to the environmental control system through the computer for temperature monitoring of the cabin section.

[0085] When there is a problem with the cooling system, or the ambient temperature exceeds the normal range, and the temperature of the key components of the electronic module 6 is greater than T0 (T0 can be obtained through thermal simulation or actual testing, and is generally defined as the highest normal operating temperature), the speed of the fan 1 is turned on to 80% to provide auxiliary cooling air. When the temperature of the key components of the electronic module 6 is greater than (T0+10), the fan speed is turned on to 100%. When the temperature of the components drops to (T0-20), the fan 1 is turned off.

[0086] Beneficial effects of the embodiments of the present invention:

[0087] The onboard computer cooling system of the embodiment of the present invention introduces the air around the cabin into the computer through the fan when the module temperature reaches a limit value. When the temperature drops to a reasonable temperature, the fan is shut down, thereby ensuring that the overall temperature of the onboard computer is within a controllable range; the temperature of the electronic components of the onboard computer is adjusted by controlling the fan, and the operation of the fan is monitored.

[0088] The above is only a specific embodiment of the present invention, and cannot be used to limit the scope of the invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the scope of protection of the patent of the present invention, should still fall within the scope of this patent. In addition, the technical features of the present invention can be freely combined with each other, with each other, and with each other.

Claims

1. A cooling system for an onboard computer, characterized in that: include: A fan (1), an environmental control interface (2), a bracket (3), a motherboard (4), a chassis (5), a plurality of electronic modules (6) arranged in parallel, and a fan control module (7); The electronic module (6) and the fan control module (7) are arranged in the chassis (5), the chassis (5) is fixed by the bracket (3), and the electronic modules (6) are fixed to the motherboard (4); The fan (1) and the environmental control interface (2) are both arranged at the rear of the bracket (3), and the fan control module (7) is electrically connected to the fan (1); An upper cold plate and a lower cold plate are arranged above and below the chassis (5), and through holes are arranged on the upper cold plate and the lower cold plate; The air outlets of the fan (1) and the environmental control interface (2) are both connected to the bottom of the chassis (5); the air outlets of the fan (1) and the environmental control interface (2), the bottom of the chassis (5), and the gap between the through hole and the electronic module (6) form a heat dissipation duct.

2. The cooling system for an onboard computer according to claim 1, characterized in that: The fan (1) comprises a control circuit and a fan drive system; The fan control module (7) comprises a processor circuit, an FPGA chip, an auxiliary test circuit and a driver; The fan control module (7) is connected to the fan drive system via the driver, the driver is connected to the FPGA chip, and the FPGA chip is also interconnected with the auxiliary test circuit and the processor circuit; The driver is used to amplify the status data of the fan (1) provided by the control circuit to generate amplified status data, wherein the status data of the fan (1) includes the fan switch status and speed data; The FPGA chip is used to obtain the amplified state data and transmit the temperature data collected by the temperature sensor to the auxiliary test circuit. The FPGA chip is also used to convert the processed signals generated by the processor circuit and the auxiliary test circuit into PMW control signals and transmit the PMW control signals to the driver. The auxiliary test circuit is used to process the temperature data and generate a processed signal; The processor circuit is used to collect the temperature of key components in the auxiliary test circuit, and control the on / off and speed of the fan drive system through the driver according to the temperature of the key components.

3. The cooling system for an onboard computer according to claim 1, characterized in that: The electronic module (6) comprises: An upper cover plate (601), an electronic component (602), a plug-in device (603), a locking strip (604), a lower cover plate (605) and a thermal interface material; A plurality of electronic components (602) are arranged between the upper cover plate (601) and the lower cover plate (601), and the electronic components (602) are fixed to the lower cover plate (605) via a locking strip (604); The plug-in / pull-out device (603) is arranged at the bottom of the lower cover plate (605), and the electronic module (6) is fixed to the chassis (5) via the plug-in / pull-out device (603).

4. The cooling system for an onboard computer according to claim 2, characterized in that: The fan (1) also includes a one-way valve and a temperature sensor (105); The one-way valve is arranged below the fan (1), and the temperature sensor (105) is arranged inside the fan (1); The one-way valve comprises a gland (101), a shaft (102), a torsion spring (103), a hinge (104) and a wiring harness (106); The pressure cover (101) is arranged on the air outlet of the fan (1), and the hinge (104) is fixed to the pressure cover (101) via a torsion spring (103) and a shaft (102); The temperature sensor (105) is connected to the temperature sensor (105) via a wiring harness (106), and the temperature sensor (105) is used to collect the temperature data.

5. The cooling system for an onboard computer according to claim 2, characterized in that: A temperature flow sensor (201) is provided in the environmental control air duct of the environmental control interface (2), and the temperature flow sensor (201) is used to collect the temperature data.

6. A method for controlling a cooling system of an onboard computer, the method being used to control the cooling system of an onboard computer according to any one of claims 1 to 5 to cool the onboard computer, characterized in that: include: Connecting the fan control module (7) to the fan (1); Setting the maximum operating temperature of the electronic module (6) and the maximum fan speed of the fan (1), and collecting the component temperatures of the electronic module (6) in real time; When the temperature of the component is greater than the maximum operating temperature, the fan switch state of the fan (1) is adjusted to on through the fan control module (7), and the rotation speed of the fan (1) is adjusted to 80% of the maximum rotation speed of the fan; When the temperature of the component is greater than the maximum operating temperature plus 10 degrees, the fan switch state of the fan (1) is adjusted to on through the fan control module (7), and the speed of the fan (1) is adjusted to the maximum speed of the fan; When the temperature of the component is between the maximum operating temperature minus 20 degrees and the maximum operating temperature, the fan (1) is switched on through the fan control module (7), and the speed of the fan (1) is adjusted to 50% of the maximum speed of the fan; When the temperature of the component is lower than the maximum operating temperature minus 20 degrees, the fan control module adjusts the switch state of the fan (1) to off.

7. The control method of the cooling system of the onboard computer according to claim 6, characterized in that: Also includes: Monitoring the status of the fan (1) through a fan control module (7); If the fan (1) fails, the failure information of the fan (1) is recorded.

8. The control method of the cooling system of the onboard computer according to claim 7, characterized in that: The fault information includes: The fan (1) sends a signal to stop rotating and / or The fan (1) increases its speed but the temperature of the electronic module (6) does not decrease and / or, The fan (1) is at the highest speed and the electronic module (6) is in high-speed operation and / or, The speed of the fan (1) cannot be adjusted and / or, Any group of electronic components (602) in the electronic module (6) has a continuous high temperature.

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