Display module and display device

Abstract

The invention provides a display module and a display device.The display module comprises a display substrate, an electric control chip arranged on the display substrate, a frame and a guiding component, the frame surrounds the electric control chip, the guiding component is located below the frame, an embedding groove is formed in the bottom of the frame, and the guiding component is located in the embedding groove. The guide part is embedded into the embedding groove, the guide part is of a thin-layer structure, and the frame is made of a light-transmitting material. According to the display device and the alignment method, accurate alignment can still be carried out on the premise of not occupying available space, and the display device and the alignment method have good application prospects for design and manufacturing standards of highly-integrated, miniaturized and narrowed display devices.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display module and a display device. Background Art

[0002] In the manufacturing process of display devices, in order to achieve the purpose of partial electronic control of display devices, it is necessary to connect the electronic control chip with the electronic control area of ​​the display substrate to connect the control circuit. In some processes, the connection method called COB process refers to the alignment and bonding of IC chips on PCB, which is called chip on board in English. This method is also a common bonding method in current display technology. Its characteristics are high equipment precision and it is used to process PCB boards with more lines, finer gaps and smaller area requirements.

[0003] The existing alignment method usually uses visual acquisition, infrared, laser acquisition and other collectors to collect the overall contour of the installation area to complete the alignment. For the increasingly narrow or more complex PCB structures, there are gradually exposed certain reliability issues in the alignment accuracy. Since there are many functional structural designs on the PCB and it is narrow due to the miniaturization design requirements, it is necessary to study some more accurate and space-saving solutions to improve the alignment accuracy. Summary of the invention

[0004] Based on this, an object of the present invention is to provide a display module and a display device to solve the deficiencies in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides a display module, including a display substrate, an electronic control chip arranged on the display substrate, a frame and a guide component, the frame is arranged around the electronic control chip, the guide component is located below the frame, an embedding groove is opened at the bottom of the frame, the guide component is embedded in the embedding groove, the guide component is a thin layer structure, and the frame is made of light-transmitting material.

[0006] The beneficial effects of the present invention are as follows: by arranging a guide component on a display substrate, opening an embedding groove at the bottom of the frame, embedding the guide component into the embedding groove, and making the frame with a light-transmitting material so that the collector can collect the guide component through the frame, and using the guide component to position the bonding operation of the electronic control chip, precise alignment can be achieved without occupying the available space, and the present invention has a good application prospect for the design and manufacturing standards of highly integrated, miniaturized and narrow display devices.

[0007] Preferably, the cross section of the frame is an inverted trapezoidal structure, and the surface area of ​​the bottom of the frame facing the display substrate is smaller than the surface area of ​​the top thereof.

[0008] Preferably, the top of the frame bulges outward to form a curved surface.

[0009] Preferably, the margin between a projection edge formed by projecting the top of the frame onto the display substrate and an edge of the guide component is 2 μm-5 μm.

[0010] Preferably, the cross-section of the frame is a rectangular structure, and the surface area of ​​the bottom of the frame facing the display substrate is equal to the surface area of ​​the top thereof.

[0011] Preferably, the number of the guide components is 4, and the 4 guide components are divided into two groups of guide component groups. The two groups of guide component groups are centrally symmetrically arranged about the center point of the frame and symmetrically arranged about the symmetry axis of the display substrate.

[0012] Preferably, a bonding area is provided on the display substrate, and the electronic control chip and the guide component are both located in the bonding area.

[0013] To achieve the above object, the present invention further provides a display device, comprising the display module described above.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a display module provided by a first embodiment of the present invention;

[0016] Figure 2 A cross-sectional view of a display module provided by a first embodiment of the present invention;

[0017] Figure 3 A schematic structural diagram of a frame and a guide component provided for the second embodiment of the present invention.

[0018] Description of main component symbols:

[0019] 10. Display substrate; 11. Binding area; 20. Electronic control chip; 30. Frame; 31. Arc surface; 40. Guide component.

[0020] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] See also Figure 1 to Figure 2 , is a display module in the first embodiment of the present invention, including a display substrate 10, an electronic control chip 20, a frame 30 and a guide component 40.

[0025] Wherein: the electronic control chip 20, the frame 30 and the guide component 40 are respectively connected to the surface of the display substrate 10, and a bonding area is provided on the display substrate 10. The electronic control chip 20, the frame 30 and the guide component 40 are all provided in the bonding area, and the electronic control chip 20 is located at the center of the binding area 11, and the frame 30 is provided around the single control chip. The guide component 40 is located below the frame 30, and the frame 30 is provided with an embedding groove at the center of the bottom of the display substrate 10. The guide component 40 is embedded in the embedding groove, and the top of the guide component 40 is connected to the inner wall of the embedding groove by transparent glue to strengthen the connection relationship between the guide component 40 and the guide component 40, and at the same time, it is also beneficial to improve the supporting strength of the frame 30, thereby improving the overall structural strength of the display module. The setting of the frame 30 also has the function of preventing the heat produced from escaping when the electronic control chip 20 is bonded by a hot pressing process, and reducing the impact on surrounding components. The frame 30 is made of a transparent material, such as a transparent polymer, so that the collector can capture the guide component 40 through the frame 30.

[0026] In this embodiment, the guide component 40 is a thin layer structure, and the height of the guide component 40 is much lower than the height of the frame 30. There are four guide components 40, and the four guide components 40 are divided into two groups of guide components 40. The two groups of guide components 40 are centrally symmetrically arranged with respect to the center point of the frame 30, and are symmetrically arranged with respect to the symmetry axis of the display substrate 10 or the symmetry axis of the binding area 11. It should be noted that in order to make the guide component 40 easier to be collected by the collector, the guide component 40 is designed to be one of a cross shape and a dot shape, so that it has a more prominent contour shape compared with other components.

[0027] In this embodiment, the guide member 40 may be disposed on the surface of the display substrate 10 before the frame 30 is formed on the display substrate 10.

[0028] In this embodiment, the cross section of the frame 30 is a rectangular structure, and the surface area of ​​the bottom of the frame 30 facing the display substrate 10 is equal to the surface area of ​​the top thereof.

[0029] It should be noted that the frame 30 is a frame-type component with a certain thickness and a certain height along the defense line perpendicular to the display substrate 10. The size and shape of the frame 30 are designed with reference to the size of the binding area 11. For different shapes of the binding area 11, the frame 30 is different. When designing the frame 30, there is little available space in the binding area 11 on the display substrate 10. Therefore, by setting the guide component 40 under the frame 30, not only does it not occupy excess available space, but it can also ensure the accuracy of positioning.

[0030] In the specific implementation, a guide component 40 is provided on the display substrate 10, an embedding groove is opened at the bottom of the frame 30, the guide component 40 is embedded in the embedding groove, and the frame 30 is made of a light-transmitting material so that the collector can collect the guide component 40 through the frame 30. The guide component 40 is used to position the bonding operation of the electronic control chip 20, so that precise alignment can be achieved without occupying the available space. This has a good application prospect for the design and manufacturing standards of highly integrated, miniaturized, and narrow display devices.

[0031] It should be noted that the above implementation process is only to illustrate the feasibility of the present application, but this does not mean that the display module of the present application has only the above-mentioned implementation process. On the contrary, as long as the display module of the present application can be implemented, it can be included in the feasible implementation plan of the present application.

[0032] Please refer to 3, which shows a display module in a second embodiment of the present invention. The display module in this embodiment is different from the display module in the first embodiment in that the cross-section of the frame 30 is an inverted trapezoidal structure, and the surface area of ​​the frame 30 toward the bottom of the display substrate 10 is smaller than the surface area of ​​the top thereof.

[0033] It should be noted that, in the case of a small size, the image contour of the guide component 40 is easily disturbed by the contour edge of the frame 30, resulting in a certain degree of recognition error. In order to improve this problem, in the width dimension, the frame 30 is designed to be a special structure that is gradually braided in a direction perpendicular to the display substrate 10 and from bottom to top. If observed from the direction of looking down at the surface of the display substrate 10, the surface area of ​​the top of the frame 30 is larger than the surface area of ​​the bottom of the frame 30. Specifically, the cross-section of the frame 30 is designed to be an inverted trapezoidal structure, that is, the small area of ​​the bottom of the frame 30 facing the display substrate 10 is smaller than the surface area of ​​its top.

[0034] Furthermore, the top of the frame 30 is raised outward to form an arc surface 31, so that the frame 30 itself has a certain convex lens effect, which can magnify the image of the guide component 40 inside the frame 30. Designing this frame 30, on the one hand, through its special shape design, a convex lens effect is formed on the frame 30, so that the guide component 40 set at the bottom of the frame 30 can be magnified within the top viewing angle of the frame 30, which is more conducive to the capture of the collector. At the same time, due to the convex lens imaging principle, the vertical coordinate of the center point of the guide component 40 will not change, so it does not affect the positioning accuracy. On the other hand, designing a frame 30 with this structure is conducive to optimizing the overall structural distribution, that is, a narrower frame 30 part can be designed at the bottom that contacts the display substrate 10, so as to ensure the miniaturization size requirements of the display module and reduce the space occupation of other components, and the top can be designed with a gradually widened frame 30 part, so as to make full use of the air-avoiding space to form a convex transparent effect, and on the other hand, it can also more effectively block heat dissipation.

[0035] It should be noted that the margin between the projection edge formed by projecting the top of the frame 30 onto the display substrate 10 and the edge of the guide component 40 is 2μm-5μm. Considering the space utilization and the success rate of collector recognition, the margin between the projection edge formed by projecting the top of the frame 30 onto the display substrate 10 and the edge of the guide component 40 is preferably 3.5μm-5μm.

[0036] It should be pointed out that the display module provided in the second embodiment of the present invention has the same implementation principle and some technical effects as those of the first embodiment. For the sake of brief description, for matters not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.

[0037] The display device in the third embodiment of the present invention includes the display module mentioned above.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0039] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A display module, characterized in that: The invention comprises a display substrate, an electric control chip arranged on the display substrate, a frame and a guide component. The frame is arranged around the electric control chip. The guide component is located below the frame. An embedding groove is provided at the bottom of the frame. The guide component is embedded in the embedding groove. The guide component is a thin layer structure. The frame is made of a light-transmitting material.

2. The display module according to claim 1, characterized in that: The cross section of the frame is an inverted trapezoidal structure, and the surface area of ​​the bottom of the frame facing the display substrate is smaller than the surface area of ​​the top thereof.

3. The display module according to claim 2, characterized in that: The top of the frame bulges outward to form a curved surface.

4. The display module according to claim 2, characterized in that: The margin between the projection edge formed by projecting the top of the frame onto the display substrate and the edge of the guide component is 2 μm-5 μm.

5. The display module according to claim 1, characterized in that: The cross section of the frame is a rectangular structure, and the surface area of ​​the bottom of the frame facing the display substrate is equal to the surface area of ​​the top thereof.

6. The display module according to claim 1, characterized in that: The guide component is arranged in a cross shape or a dot shape.

7. The display module according to claim 1, characterized in that: The number of the guide components is 4, and the 4 guide components are divided into two groups of guide component groups. The two groups of guide component groups are centrally symmetrically arranged around the center point of the frame and symmetrically arranged around the symmetry axis of the display substrate.

8. The display module according to claim 1, characterized in that: A bonding area is provided on the display substrate, and the electronic control chip and the guide component are both located in the bonding area.

9. A display device, characterized in that: A display module comprising any one of claims 1-8.

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