Driving substrate, manufacturing method thereof, display panel and display device

Abstract

The invention relates to a driving substrate and a manufacturing method thereof, a display panel and a display device. The driving substrate comprises a substrate body and a driving circuit arranged on the substrate body. The driving circuit comprises a driving end and a plurality of driving units electrically connected with the driving end, each driving unit comprises a common line, a positive electrode bonding pad, a negative electrode bonding pad and at least one driving chip welding area, the positive electrode bonding pads are connected to different positions of the common line through first lines, and the negative electrode bonding pads are connected to different positions of the common line through second lines. The common line is electrically connected with the driving end, and each negative electrode bonding pad is electrically connected with the corresponding driving chip welding area through a second line; and among the driving units, the line resistance of the first line is gradually reduced along the current direction of the common line. Therefore, the uniformity of the luminance of the light-emitting chips is higher, the problem of uneven display of the display panel is solved, and the display effect of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of LED display, and in particular to a driving substrate and a manufacturing method thereof, a display panel, and a display device. Background Art

[0002] At present, the application of LED (Light Emitting Diode) display panels has become more and more widespread. The array in the display panel is provided with a number of LED light-emitting chips, which are driven by the driving end of the driving substrate to emit light. In the process of the driving end supplying power to the light-emitting chip, there is a voltage drop phenomenon due to the influence of the line resistance of the metal wire between the driving end and the light-emitting chip. The farther the light-emitting chip is from the driving end, the greater the voltage drop, that is, the farther the light-emitting chip is from the driving end, the smaller the voltage will be. As a result, the display brightness of the light-emitting chip farther away from the driving end will be, which will cause the problem of uneven display of the display panel, affecting the display effect of the display panel.

[0003] Therefore, how to make the display of the display panel more uniform is an issue that needs to be solved urgently. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a driving substrate and a manufacturing method thereof, a display panel, and a display device, aiming to solve the problem of uneven display of the display panel.

[0005] The present application provides a driving substrate, comprising:

[0006] substrate body;

[0007] A driving circuit disposed on the substrate body;

[0008] The driving circuit includes a driving end and a plurality of driving units electrically connected to the driving end, wherein the driving unit includes a common line, a positive electrode pad, a negative electrode pad, and at least one driving chip welding area, wherein each of the positive electrode pads is respectively connected to a different position of the common line through a first line, the common line is electrically connected to the driving end, and each of the negative electrode pads is respectively electrically connected to a corresponding driving chip welding area through a second line; wherein, between each of the driving units, along the current direction of the common line, the line resistance of the first line gradually decreases.

[0009] In the above-mentioned driving substrate, the line resistance of the first line between the positive electrode pad and the common line is adjusted, and the line resistance of the first line between each driving unit gradually decreases along the current direction of the common line. The positive electrode pad and the negative electrode pad are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display panel.

[0010] Based on the same inventive concept, the present application also provides a display panel, including:

[0011] driving the substrate as described above; and

[0012] A plurality of light-emitting chips are arranged on the driving substrate, wherein the positive electrode of each light-emitting chip is electrically connected to the corresponding positive electrode pad, and the negative electrode of each light-emitting chip is electrically connected to the corresponding negative electrode pad.

[0013] The display panel includes a driving substrate, in which the line resistance of the first line between the positive electrode pad and the common line is adjusted, and the line resistance of the first line between each driving unit gradually decreases along the current direction of the common line. The positive electrode pad and the negative electrode pad are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, and making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display panel.

[0014] Based on the same inventive concept, the present application also provides a display device, comprising the display panel as described above.

[0015] The display panel in the above-mentioned display device includes a driving substrate, in which the line resistance of the first line between the positive electrode pad and the common line is adjusted, and along the current direction of the common line, the line resistance of the first line between each driving unit gradually decreases. The positive electrode pad and the negative electrode pad are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display device.

[0016] Based on the same inventive concept, the present application also provides a method for manufacturing the driving substrate as described above, comprising:

[0017] Providing a substrate body;

[0018] A driving circuit including a plurality of driving units is arranged on the substrate body, so that each positive electrode pad in the driving unit is respectively connected to a different position of a common circuit through a first circuit, the common circuit is electrically connected to a driving end of the driving unit, and each negative electrode pad is respectively electrically connected to a corresponding welding area of ​​the driving chip through a second circuit; between each of the driving units, along the current direction of the common circuit, the line resistance of the first circuit gradually decreases.

[0019] In the manufacturing method of the above-mentioned driving substrate, when the driving circuit is set on the substrate body, the line resistance of the first line between the positive electrode pad and the common line is adjusted, and the line resistance of the first line between each driving unit gradually decreases along the current direction of the common line. The positive electrode pad and the negative electrode pad are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, and making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of a driving substrate provided in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of a structure of a driving circuit on a driving substrate provided in an embodiment of the present application;

[0022] Figure 3 A flow chart of a method for manufacturing a driving substrate provided in yet another optional embodiment of the present application;

[0023] Figure 4 A flow chart of a method for forming first lines of different thicknesses provided in yet another optional embodiment of the present application;

[0024] Figure 5 A schematic diagram of a structure for providing a metal layer according to another optional embodiment of the present application;

[0025] Figure 6 A schematic diagram of a structure after a photoresist unit is formed according to another optional embodiment of the present application;

[0026] Figure 7 A schematic diagram of a structure after a metal unit is formed according to another optional embodiment of the present application;

[0027] Figure 8 A schematic diagram of a structure after the first development provided by another optional embodiment of the present application;

[0028] Fig. 9A schematic diagram of a structure after the first etching of a metal unit is provided in another optional embodiment of the present application;

[0029] Fig.10 A schematic diagram of a structure after a second development provided in yet another optional embodiment of the present application;

[0030] Fig.11 A schematic diagram of the structure after the second etching of the metal unit provided in another optional embodiment of the present application;

[0031] Fig.12 A schematic diagram of a structure after a third development provided by another optional embodiment of the present application;

[0032] Fig.13 A flow chart of a method for forming photoresist units of different thicknesses provided in yet another optional embodiment of the present application;

[0033] Fig.14 A schematic diagram of structural changes in forming photoresist units of different thicknesses provided in yet another optional embodiment of the present application;

[0034] Description of reference numerals:

[0035] 1-driving end; 2-common line; 3-driving unit; 4-first line; 5-positive electrode pad; 6-negative electrode pad; 7-driving chip welding area; 8-substrate body; 9-metal layer; 901-metal unit; 10-photoresist layer; 101-photoresist unit; 11-second line; 12-light shielding layer. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0038] In the relevant display panel, the driving end of the driving substrate drives the light-emitting chip to emit light for display. In the process of the driving end supplying power to the light-emitting chip, there is a voltage drop due to the influence of the line resistance of the metal wire between the driving end and the light-emitting chip. The farther the light-emitting chip is from the driving end, the greater the voltage drop is, that is, the farther the light-emitting chip is from the driving end, the smaller the voltage is. As a result, the display brightness of the light-emitting chip farther away from the driving end will be, which in turn causes the problem of uneven display of the display panel, affecting the display effect of the display panel.

[0039] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0040] This embodiment provides a driving substrate such as Figure 1 As shown, it includes a substrate body 8 and a driving circuit arranged on the substrate body 8. It can be understood that the substrate body 8 in this embodiment can be made of a rigid material, such as but not limited to phenolic paper laminate, epoxy paper laminate, polyester glass felt laminate, epoxy glass cloth laminate, BT resin board, and glass board; the substrate body 8 can also be made of a flexible material, such as but not limited to polyester film, polyimide film, and fluorinated ethylene propylene film. The driving circuit in this embodiment can be arranged in and on the surface of the substrate body 8, and can be integrated according to application requirements, including but not limited to pads connected to the light-emitting chip and the driving circuit.

[0041] like Figure 1 , Figure 2 As shown, the driving circuit in this embodiment includes a driving end 1, and a plurality of driving units 3 electrically connected to the driving end 1, and the driving unit 3 includes a common line 2, a positive electrode pad 5, a negative electrode pad 6, and at least one driving chip welding area 7. It can be understood that the positive electrode pad 5 and the negative electrode pad 6 in this embodiment are exposed on the surface of the substrate body 8, the positive electrode pad 5 is used to connect the positive electrode of the light-emitting chip, and the negative electrode pad 6 is used to connect the negative electrode of the light-emitting chip. The number and arrangement of the positive electrode pad 5 and the negative electrode pad 6 in this embodiment can be flexibly set according to application requirements, for example, the positive electrode pad 5 and the negative electrode pad 6 can be arranged in an array on the substrate body 8. In some examples of this embodiment, the material of the pad can be but not limited to copper, silver, gold, etc. The driving chip welding area 7 in this embodiment is an area for connecting the driving chip, and has a welding portion for connecting the driving chip. One driving chip can drive and control one or more light-emitting chips, for example, it can be 2 or 4, and can be specifically set according to needs.

[0042] In this embodiment, each positive electrode pad 5 is connected to different positions of the common line 2 through the first line 4, the common line 2 is electrically connected to the driving end 1, and each negative electrode pad 6 is electrically connected to the corresponding driving chip welding area 7 through the second line 11; wherein, between each driving unit 3, along the current direction of the common line 2, the line resistance of the first line 4 gradually decreases. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, and making the consistency of the luminous brightness of each light-emitting chip higher. It can be understood that the driving end 1 in this embodiment is used to provide a driving power supply, the driving end 1 is electrically connected to the common line 2, and the light-emitting chip is powered through the first line 4 and the positive electrode pad 5. In this embodiment, the second line 11 can be connected to the pin of the driving chip connected to the driving chip welding area 7, and then connected to the driving end 1 through the driving chip to form a current loop, but it is not limited to this, and the current loop can also be formed by other connection methods.

[0043] In some embodiments, Figure 1 , the driving unit 3 may include a common line 2, that is, all the first lines 4 are connected to the driving end 1 through a common line 2; or Figure 2 As shown, the driving unit 3 may also include two or more common lines 2, one common line 2 connects a group of first lines 4, and the number of first lines 4 connected to each common line 2 may be the same or different. For example, when two common lines 2 are provided, the two common lines 2 may be respectively connected to half the number of first lines 4 in the driving unit 3. In some embodiments, in order to facilitate the arrangement of the lines and improve the consistency of the luminous brightness of the light-emitting chip, when two common lines 2 are provided, the two common lines 2 and the corresponding first lines 4, positive electrode pads 5, and negative electrode pads 6 may be symmetrically arranged. In this case, the driving unit 3 includes two groups of symmetrically arranged lines, and each group of lines includes a common line 2, a first line 4, a positive electrode pad 5, and a negative electrode pad 6, respectively.

[0044] In this embodiment, the thickness of the wire of the first line 4 may gradually increase along the current direction of the common line 2 between each driving unit 3. The thicker the wire, the smaller the line resistance, which can achieve consistency of voltage drop and improve the consistency of brightness of the light-emitting chip.

[0045] In some embodiments, when the driving unit 3 includes at least two positive electrode pads 5, the wire thickness of the first circuit 4 in each driving unit 3 may be the same. At this time, along the current direction of the common circuit 2, the wire thickness of the first circuit 4 between each driving unit 3 gradually increases in a step-by-step manner. Making the wire thickness of the first circuit 4 in the driving unit 3 the same is more convenient for manufacturing, and wires of the same thickness can be formed together, reducing the processing steps, shortening the processing time, and reducing the processing cost. In order to shorten the processing time, reduce the cost, and increase the uniformity of the brightness, when the overall voltage drop is not large, the driving circuit may include a smaller number of driving units 3, and each driving unit 3 includes a larger number of first circuits 4, that is, the number of first circuits 4 with the same wire thickness is larger. At this time, because the overall voltage drop is not large, the brightness consistency between the light-emitting chips is also high; when the overall voltage drop is large, the driving circuit may include a larger number of driving units 3, and each driving unit 3 includes a smaller number of first circuits 4, that is, the number of first circuits 4 with the same wire thickness is smaller. At this time, the voltage drop consistency between the light-emitting chips is higher, and the brightness of the light-emitting chips can be more uniform. For example, when the overall voltage drop is small, the driving circuit may include three driving units 3, wherein the conductor thickness of the first circuit 4 in the second driving unit 3 is 75% to 85% of the conductor thickness of the first circuit 4 in the first driving unit 3; and the conductor thickness of the first circuit 4 in the third driving unit 3 is 55% to 65% of the conductor thickness of the first circuit 4 in the first driving unit 3. Specifically, among the three driving units 3, the conductor thickness of the first circuit 4 in the second driving unit 3 may be 80% of the conductor thickness of the first circuit 4 in the first driving unit 3, and the conductor thickness of the first circuit 4 in the third driving unit 3 may be 60% of the conductor thickness of the first circuit 4 in the first driving unit 3. However, this is not limited to this, and any implementation method that can satisfy the gradual increase in the conductor thickness of the first circuit 4 between each driving unit 3 along the current direction of the common circuit 2 is also possible.

[0046] In other embodiments, when the driving unit 3 includes at least two positive electrode pads 5, the line resistance of each first line 4 in the driving unit 3 gradually decreases along the current direction of the common line 2. At this time, the line resistance of each first line 4 decreases linearly, the consistency of the voltage drop between each light-emitting chip is higher, and the brightness of the light-emitting chip can be more uniform. Specifically, the thickness of the wire of each first line 4 in the driving unit 3 can be gradually increased along the current direction of the common line 2.

[0047] In this embodiment, the wire width of the first line 4 may be gradually increased along the current direction of the common line 2 between the driving units 3; or the wire length of the first line 4 may be gradually decreased along the current direction of the common line 2 between the driving units 3. Changing the wire width and the wire length may also adjust the wire resistance of the first line 4.

[0048] In the above-mentioned driving substrate, the line resistance of the first line 4 between the positive electrode pad 5 and the common line 2 is adjusted, and the line resistance of the first line 4 between each driving unit 3 gradually decreases along the current direction of the common line 2. The positive electrode pad 5 and the negative electrode pad 6 are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display panel.

[0049] Another optional embodiment of the present application:

[0050] This embodiment provides a display panel, including the driving substrate as described above, and a plurality of light-emitting chips disposed on the driving substrate, wherein the positive electrode of each light-emitting chip is electrically connected to the corresponding positive electrode pad 5, and the negative electrode of each light-emitting chip is electrically connected to the corresponding negative electrode pad 6. This embodiment does not specifically limit the specific connection method between the light-emitting chip and the pad, and it is sufficient that the light-emitting chip can emit light for display.

[0051] The light-emitting chip in this embodiment may be, but is not limited to, an LED light-emitting chip. When it is an LED light-emitting chip, it may include, but is not limited to, an LED of ordinary size, and may also include a micro LED, such as, but not limited to, Mini LED (Mini Light Emitting Diode) and Micro LED (Micro Light Emitting Diode). In terms of the distribution of the electrodes of the light-emitting chip, the light-emitting chip may be a front-mounted LED chip or a flip-chip LED chip. The electrode material of the light-emitting chip in this embodiment may include, but is not limited to, at least one of Cr, Ni, Al, Ti, Au, Pt, W, Pb, Rh, Sn, Cu, Ag, etc.

[0052] The display panel provided in this embodiment can be applied to display devices such as televisions, mobile phones, car displays, AR and VR.

[0053] The display panel includes a driving substrate, in which the line resistance of the first line 4 between the positive electrode pad 5 and the common line 2 is adjusted, and the line resistance of the first line 4 between each driving unit 3 gradually decreases along the current direction of the common line 2. The positive electrode pad 5 and the negative electrode pad 6 are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, and making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display panel.

[0054] Another optional embodiment of the present application:

[0055] This embodiment provides a display device, including the display panel as described above.

[0056] In this embodiment, a control unit is further included, and the display panel is connected to the control unit. The control unit is used to control the display image and sound of the display panel.

[0057] In this embodiment, a frame is also included, and the display panel is arranged in the frame. It is understandable that the material of the frame in this embodiment can be plastic or metal, or part of it can be plastic and part of it can be metal. This embodiment does not specifically limit the connection method between the display panel and the frame, and it only needs to achieve a connection and fixation between the two.

[0058] The display device provided in this embodiment can be a display device such as a television, an advertising screen, a mobile phone, a car display, AR, and VR.

[0059] The display panel in the above-mentioned display device includes a driving substrate, in which the line resistance of the first line 4 between the positive electrode pad 5 and the common line 2 is adjusted, and the line resistance of the first line 4 between each driving unit 3 gradually decreases along the current direction of the common line 2. The positive electrode pad 5 and the negative electrode pad 6 are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display device.

[0060] Another optional embodiment of the present application:

[0061] This embodiment provides a method for manufacturing the driving substrate as described above. Figure 3 As shown, the following steps are included:

[0062] S1: Provide the substrate body.

[0063] The substrate body 8 in this embodiment is the same as the aforementioned substrate body 8 and will not be described in detail herein.

[0064] S2: A driving circuit including a plurality of driving units is arranged on the substrate body.

[0065] In this embodiment, if Figure 1 , Figure 2As shown, each positive electrode pad 5 in the driving unit 3 is respectively connected to different positions of the common line 2 through the first line 4, the common line 2 is electrically connected to the driving end 1 of the driving unit 3, and each negative electrode pad 6 is electrically connected to the corresponding driving chip welding area 7 through the second line 11; between each driving unit 3, along the current direction of the common line 2, the line resistance of the first line 4 gradually decreases. The specific setting method of the driving circuit in this embodiment is also the same as the above, and will not be repeated here. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, and making the consistency of the light-emitting brightness of each light-emitting chip higher.

[0066] In some embodiments, Figure 4 As shown, a driving circuit including a plurality of driving units 3 is arranged on the substrate body 8 and includes:

[0067] S21: Disposing a metal layer on the substrate body.

[0068] In this embodiment, the structure after the metal layer is provided is as follows Figure 5 shown.

[0069] S22: Disposing photoresist units with different thicknesses on the metal layer.

[0070] In this embodiment, the structure after setting the photoresist units with different thicknesses is as follows: Figure 6 The photoresist unit 101 in this embodiment serves as a mask for subsequent etching, which can prevent the portion covered by the photoresist unit 101 from being etched.

[0071] S23: Etching the metal layer to form a plurality of metal units.

[0072] In this embodiment, if Figure 7 As shown, one photoresist unit 101 corresponds to one metal unit 901 ; between each metal unit 901 , the thickness of the photoresist unit 101 thereon gradually increases along the current direction of the common line 2 .

[0073] It is understandable that etching the metal layer 9 to form the plurality of metal units 901 means etching away the metal layer 9 between the photoresist units 101 and the portions not covered by the photoresist units 101 , and the remaining portions after etching are the metal units 901 .

[0074] S24: forming first circuits with different thicknesses.

[0075] In this step, the photoresist units 101 on each metal unit 901 are removed in order from small to large thickness of the photoresist unit 101; and after each photoresist unit 101 on a metal unit 901 is removed, all metal units 901 from which the photoresist units 101 have been removed are etched once, until the photoresist unit 101 with the largest thickness is removed and the etching of the metal units 901 is stopped. In this embodiment, the photoresist unit 101 can be removed by development. For example, three metal units 901 are formed in step S23, and the thickness of the photoresist units 101 on each metal unit 901 is different. Figure 8 As shown, the first development removes the photoresist unit 101 with the smallest thickness, and then an etching is performed after the removal, as shown in FIG. Fig. 9 As shown, the metal unit 901 corresponding to the photoresist unit 101 with the smallest thickness is thinned. Fig.10 As shown, the second smallest photoresist unit 101 can be removed by a second development. At this time, the photoresist unit 101 with the largest thickness also becomes thinner. After removing the second smallest photoresist unit 101, etching is performed again. Fig.11 As shown, the metal unit 901 corresponding to the photoresist unit 101 with the second smallest thickness is thinned, and the metal unit 901 that was thinned by etching last time is thinned again in this etching. Fig.12 As shown, the third development can remove the thickest photoresist unit 101, and the thickness of the metal unit 901 corresponding to the thickest photoresist unit 101 remains unchanged, thereby forming three first circuits 4 of different thicknesses. The production of circuits of different thicknesses is simple.

[0076] In this embodiment, if Fig.13 , Fig.14 , the photoresist units 101 with different thicknesses are arranged on the metal layer 9 by the following steps:

[0077] S221: Disposing a photoresist layer on the metal layer.

[0078] S222: a light shielding layer is provided on the photoresist layer, wherein the light shielding layer includes a plurality of light-transmitting units, each light-transmitting unit has a different light transmittance, and one light-transmitting unit corresponds to one photoresist unit.

[0079] This embodiment does not impose any specific restrictions on the material of the light-transmitting unit, as long as the corresponding light transmittance can be achieved. In this embodiment, a material with a light transmittance of 100% can be set between each light-transmitting unit, or it can be set without setting, and this embodiment does not impose any restrictions on this.

[0080] S223: exposing the photoresist layer from the side where the light shielding layer is provided to form photoresist units with different thicknesses.

[0081] It is understandable that different light transmittances correspond to different thicknesses of the removed photoresist layer 10. In this embodiment, by setting photoresist layers 10 of different thicknesses, the metal unit 901 is thinned in batches, which is simple to manufacture.

[0082] In the manufacturing method of the above-mentioned driving substrate, when the driving circuit is set on the substrate body 8, the line resistance of the first line 4 between the positive electrode pad 5 and the common line 2 is adjusted, and the line resistance of the first line 4 between each driving unit 3 is gradually reduced along the current direction of the common line 2. The positive electrode pad 5 and the negative electrode pad 6 are used to connect the light-emitting chip. The smaller the line resistance, the more current flows to the light-emitting chip, and the corresponding voltage will be greater, thereby compensating for the voltage drop at the corresponding light-emitting chip, increasing the consistency of the current of each light-emitting chip, and making the consistency of the light-emitting brightness of each light-emitting chip higher, solving the problem of uneven display of the display panel, and improving the display effect of the display panel.

[0083] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A driving substrate, characterized in that: include: substrate body; A driving circuit disposed on the substrate body; The driving circuit includes a driving end and a plurality of driving units electrically connected to the driving end, wherein the driving unit includes a common line, a positive electrode pad, a negative electrode pad, and at least one driving chip welding area, wherein each of the positive electrode pads is respectively connected to a different position of the common line through a first line, the common line is electrically connected to the driving end, and each of the negative electrode pads is respectively electrically connected to a corresponding driving chip welding area through a second line; wherein, between each of the driving units, along the current direction of the common line, the line resistance of the first line gradually decreases.

2. The driving substrate according to claim 1, wherein: Between the driving units, along the current direction of the common circuit, the thickness of the conductor of the first circuit gradually increases.

3. The driving substrate according to claim 2, wherein: The driving unit includes at least two positive electrode pads, and the conductive wires of the first circuits in each of the driving units have the same thickness.

4. The driving substrate according to claim 3, characterized in that: The driving circuit includes three driving units, wherein the conductor thickness of the first circuit in the second driving unit is 75% to 85% of the conductor thickness of the first circuit in the first driving unit; and the conductor thickness of the first circuit in the third driving unit is 55% to 65% of the conductor thickness of the first circuit in the first driving unit.

5. The driving substrate according to claim 1 or 2, characterized in that: The driving unit includes at least two positive electrode pads, and the line resistance of each of the first lines in the driving unit gradually decreases along the current direction of the common line.

6. The driving substrate according to claim 5, characterized in that: The thickness of the conductors of each of the first circuits in the driving unit gradually increases along the current direction of the common circuit.

7. A display panel, characterized in that: include: The driving substrate according to any one of claims 1 to 6; as well as A plurality of light-emitting chips are arranged on the driving substrate, wherein the positive electrode of each light-emitting chip is electrically connected to the corresponding positive electrode pad, and the negative electrode of each light-emitting chip is electrically connected to the corresponding negative electrode pad.

8. A display device, characterized in that: Comprising the display panel as claimed in claim 7.

9. A method for manufacturing a driving substrate according to any one of claims 1 to 6, characterized in that: include: Providing a substrate body; A driving circuit including a plurality of driving units is arranged on the substrate body, so that each positive electrode pad in the driving unit is respectively connected to a different position of a common circuit through a first circuit, the common circuit is electrically connected to a driving end of the driving unit, and each negative electrode pad is respectively electrically connected to a corresponding welding area of ​​the driving chip through a second circuit; between each of the driving units, along the current direction of the common circuit, the line resistance of the first circuit gradually decreases.

10. The method for manufacturing a driving substrate according to claim 9, wherein: The driving circuit including a plurality of driving units arranged on the substrate body includes: Disposing a metal layer on the substrate body; Disposing photoresist units of different thicknesses on the metal layer; Etching the metal layer to form a plurality of metal units, wherein one photoresist unit corresponds to one metal unit; between each metal unit, the thickness of the photoresist unit thereon gradually increases along the current direction of the common line; The photoresist units on each of the metal units are removed in order from small to large thickness of the photoresist units; and after each photoresist unit on the metal unit is removed, all the metal units from which the photoresist units have been removed are etched once, until the photoresist unit with the largest thickness is removed, and then the etching of the metal units is stopped, so as to form the first circuits with different thicknesses.

11. The method for manufacturing a driving substrate according to claim 10, wherein: The photoresist unit with different thicknesses arranged on the metal layer comprises: Disposing a photoresist layer on the metal layer; A light shielding layer is arranged on the photoresist layer, wherein the light shielding layer includes a plurality of light-transmitting units, each light-transmitting unit has a different light transmittance, and one light-transmitting unit corresponds to one photoresist unit; The photoresist layer is exposed from the side where the light shielding layer is provided to form the photoresist units with different thicknesses.

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