High-precision mass metering system and equipment for wafer measurement

Abstract

The invention relates to the technical field of wafer production, in particular to a high-precision mass metering system and equipment for wafer measurement, which comprises a detection table, a wafer plate and an optical axis, one end of the optical axis penetrates through and is rotatably connected to one side of the detection table, and the bottom end of the optical axis is connected with a motor; the outer wall of the optical shaft is in transmission connection with a threaded cylinder through a conveying belt. Through cooperation of a clamping rod, a dorsal fin block, a fixed cylinder, an annular plate, a magnet rod and a spring, when a wafer plate needs to be detected, a motor is started to drive an optical axis to rotate, then an electrostatic chuck indirectly rotates and is in a power-on state to adsorb the wafer plate, and meanwhile, the wafer plate indirectly rotates to facilitate detection of different places of the wafer plate; and when blanking is needed, the magnet rod is far away from the semicircular magnet ring, so that the electrostatic chuck is in a power-off state and does not adsorb the wafer plate, the operation steps are simple, a tester does not need to be manually operated to detect different positions, and the probability of dead angles of the undetected wafer plate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and in particular to a high-precision mass measurement system and equipment for wafer measurement. Background Art

[0002] With the rapid advancement of semiconductor technology, the integration of chips is getting higher and higher, and the feature size is shrinking. From the early micron level to the current nanometer level, such as 7nm, 5nm and even smaller process nodes, the requirements for wafer quality are becoming increasingly stringent, which requires high-precision and high-resolution measurement technology to ensure that the wafer's dimensional accuracy, film thickness, material properties and electrical properties meet strict standards. For example, in the manufacturing of advanced process chips, the dimensional accuracy of the transistor gate directly affects the performance of the chip, and even a slight deviation may cause the chip to fail, which has promoted the continuous innovation of wafer measurement technology;

[0003] At present, the detection process plays an important role in the wafer production process. The chip size within the radius of each wafer is detected, and whether the thickness around the wafer is qualified. The existing wafer tester detects a part of the top area of ​​the wafer, but the staff also needs to manually move the wafer tester in a straight line to detect other positions of the wafer. This will result in the staff being unable to free their hands to do other recording or operate equipment. In addition, if the mobile detection instrument moves too long and is negligent, the staff may ignore the area of ​​the wafer that has not been detected, thereby reducing the wafer pass rate. For this reason, the present invention provides a high-precision quality measurement system and equipment for wafer measurement. Summary of the invention

[0004] The purpose of the present invention is to solve the problem of blind spots in wafer measurement.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a high-precision mass metrology system and equipment for wafer measurement, comprising: a detection table, a wafer plate and an optical axis, one end of the optical axis passes through and is rotatably connected to one side of the detection table, the bottom end of the optical axis is connected to a motor, the outer wall of the optical axis is connected to a threaded barrel through a conveyor belt transmission, a limit ring is fixedly installed on the outer wall of the threaded barrel, the limit ring is rotatably connected to the inner wall of the detection table, the inner wall of the threaded barrel is provided with a rotating feeding mechanism, the top end of the optical axis is provided with an indirect rotating mechanism, the optical axis rotates to drive the rotating feeding mechanism, the rotating feeding mechanism transports the wafer plate, and the indirect rotating mechanism transports the wafer plate for inspection.

[0006] As a preferred embodiment, a support frame is fixedly installed on the top of the detection table, a tester is fixedly installed on the other side of the support frame, the tester detects the wafer plate, and a lighting lamp is fixedly installed on the top of the detection table, and the lighting lamp is located directly below the tester.

[0007] As a preferred embodiment, the indirect rotation mechanism includes a circular plate fixedly installed on the top of the optical axis, a clamping rod fixedly installed on the top of the circular plate, a crescent plate fixedly installed on the top of the circular plate, the outer wall of the clamping rod can contact with a clamping part, the clamping part has four clamping grooves, and the crescent plate can be clamped on the inner wall of the clamping groove.

[0008] As a preferred embodiment, the top of the detection table is rotatably connected to a rotating shaft, one end of the rotating shaft passes through and is fixedly installed at the center of the clamping part, the outer wall of the rotating shaft near the top is fixedly installed with a fixing rod, the outer wall of the fixing rod is fixedly installed with a battery pack, the battery pack has a switch button, the other end of the fixing rod is fixedly installed with a fixing ring, the inner wall of the fixing ring is rotatably connected to a fixing cylinder, the fixing cylinder has a rectangular groove, the rectangular groove and the inner wall of the fixing cylinder are slidably connected with an annular plate, the bottom of the annular plate is fixedly installed with a spring and a magnet rod, the magnet rod is located on the inner wall of the spring, one end of the magnet rod passes through and is slidably connected to the bottom end of the fixing cylinder, the top of the fixing cylinder is fixedly installed with an electrostatic suction cup, the electrostatic suction cup is connected to one side of the battery pack through a line, and the top of the electrostatic suction cup can be adsorbed on the bottom of the wafer plate.

[0009] As a preferred embodiment, a semicircular magnetic ring is fixedly installed on the top of the detection table, and the semicircular magnetic ring can be magnetically connected to the bottom end of the magnet rod. A rotatable driving rod is provided on the top of the detection table, and a dorsal fin block is fixedly installed on the outer wall of the driving rod, and the dorsal fin block can contact the outer wall of the magnet rod. One end of the driving rod passes through and is rotatably connected to one side of the detection table.

[0010] As a preferred embodiment, the rotary feeding mechanism includes a threaded rod connected by a threaded barrel, a crescent-shaped telescopic rod is fixedly installed on the bottom end of the threaded rod, a fixing frame is fixedly installed on the bottom end of the crescent-shaped telescopic rod, and the fixing frame is fixedly installed on the bottom of the detection table. A square groove is provided on the top of the threaded rod, a square block can be clamped inside the square groove, a storage shell 1 is fixedly installed on the top of the square block, and a plurality of arc plates 2 are installed in a linear array on one side of the storage shell 1, and a wafer plate can be placed on the top of the arc plate 2.

[0011] As a preferred embodiment, a connecting rod is fixedly installed on the top of the storage shell one, a storage shell two is fixedly installed on the other side of the connecting rod, a plurality of arc plates one are installed in a linear array on one side of the storage shell two, a blocking rod is fixedly installed on one side of the plurality of arc plates one, and the horizontal height of the arc plate one is higher than that of the arc plate two.

[0012] As a preferred embodiment, a high-precision mass metrology system for wafer measurement is characterized by comprising the following steps:

[0013] S1, firstly place the storage shell 1 on the top of the threaded rod through the connecting rod, and place multiple wafer plates in the storage shell 1, then start the motor to drive the rotating feeding mechanism through the optical axis, so that the wafer plates are adsorbed by the electrostatic chuck;

[0014] S2. During the rotation of the optical axis, the indirect rotation mechanism is driven to allow the wafer to be adsorbed by the electrostatic chuck during the static time, and then the wafer is driven to reach between the tester and the light lamp for detection. At the same time, the dorsal fin is used to drive the wafer to rotate indirectly, so that the tester can detect different positions of the wafer.

[0015] S3. When the indirect rotating mechanism drives the wafer to rotate between 180 and 270 degrees, the storage shell 2 will descend to facilitate the storage of the wafer. The operation is carried out in sequence. The tested wafers are stored on one side of the storage shell 2, and the untested wafers are stored on one side of the storage shell 1.

[0016] Compared with the prior art, the advantages and positive effects of the present invention are:

[0017] 1. The present invention cooperates with a clamping rod, a crescent plate, a clamping part, a driving rod, a dorsal fin block, a fixing tube, an annular plate, a magnet rod and a spring. When it is necessary to detect the wafer plate, the optical axis is driven to rotate by starting the motor, and then the electrostatic suction cup is indirectly rotated and is in a powered-on state to adsorb the wafer plate. When the wafer plate enters between the tester and the light lamp for detection, the driving rod and the dorsal fin block can be used to drive the wafer plate to rotate indirectly, so as to facilitate the detection of different places of the wafer plate. When unloading is required, the magnet rod is away from the semicircular magnetic ring to make the electrostatic suction cup in a powered-off state and no longer adsorb the wafer plate. The operation steps are simple, and there is no need to manually operate the tester to detect different positions, thereby reducing the probability of undetected dead corners of the wafer plate.

[0018] 2. The present invention cooperates between the threaded cylinder, the crescent-shaped telescopic rod, the square groove, the storage shell one, the storage shell two, the blocking rod and the square block. Whenever the optical axis rotates one circle, the storage shell one will move downward a certain distance, and then the lowest point of the storage shell two will move downward to the horizontal height before the lowest point of the storage shell one moves downward, so that the storage shell two can store the inspected wafer plates. Compared with the existing equipment, the equipment can simultaneously store the inspected wafer plates without manual collection, thereby improving the practicality of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention:

[0021] Figure 2 This is a schematic diagram of the bottom structure of the detection table of the present invention:

[0022] Figure 3 This is a schematic diagram of the internal three-dimensional structure of the fixing cylinder of the present invention:

[0023] Figure 4 This is a schematic diagram of the three-dimensional structure of the fixing rod of the present invention:

[0024] Figure 5 This is a schematic diagram of the internal three-dimensional structure of the threaded barrel of the present invention:

[0025] Figure 6 This is a schematic diagram of a three-dimensional structure of a storage shell of the present invention:

[0026] Figure 7 It is a top plan schematic diagram of the present invention:

[0027] Figure 8 It is a plan view of a storage shell of the present invention.

[0028] 1. Test table; 2. Support frame; 3. Tester; 4. Illumination lamp; 5. Optical axis; 6. Conveyor belt; 7. Threaded cylinder; 8. Fixing frame; 9. Circular plate; 10. Clamping rod; 11. Crescent plate; 12. Snap-fit ​​piece; 13. Rotating shaft; 14. Fixing rod; 15. Battery pack; 16. Switch button; 17. Fixing ring; 18. Fixing cylinder; 19. Spring; 2. Annular plate; 3. Electrostatic suction cup; 4. Magnetic rod; 4. Circuit; 5. Semicircular magnetic ring; 6. Driving rod; 7. Dorsal fin block; 8. Limiting ring; 9. Crescent telescopic rod; 10. Threaded rod; 11. Square groove; 12. Square block; 13. Storage shell one; 14. Storage shell two; 15. Connecting rod; 16. Wafer plate; 17. Arc plate one; 18. Arc plate two. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described in combination with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The present invention will be further described below in conjunction with the embodiments.

[0031] Example: Refer to Figure 1 and Figure 2 The present invention provides a technical solution: a high-precision mass metrology system and equipment for wafer measurement, including: a detection table 1, a wafer plate 48 and an optical axis 13, one end of the optical axis 13 passes through and is rotatably connected to one side of the detection table 1, the bottom end of the optical axis 13 is connected to a motor, the outer wall of the optical axis 13 is connected to a threaded barrel 15 through a conveyor belt 14, the outer wall of the threaded barrel 15 is fixedly installed with a limit ring 4, the limit ring 4 is rotatably connected to the inner wall of the detection table 1, the inner wall of the threaded barrel 15 is provided with a rotating feeding mechanism, the top end of the optical axis 13 is provided with an indirect rotating mechanism, the optical axis 13 rotates to drive the rotating feeding mechanism, the rotating feeding mechanism transports the wafer plate 48, and the indirect rotating mechanism transports the wafer plate 48 for detection.

[0032] like Figure 1 As shown, a support frame 10 is fixedly installed on the top of the inspection table 1, and a tester 11 is fixedly installed on the other side of the support frame 10. The tester 11 detects the wafer plate 48. A light lamp 12 is fixedly installed on the top of the inspection table 1, and the light lamp 12 is located directly below the tester 11.

[0033] When the staff needs to inspect the wafer plate 48, first place the storage shell 44 filled with wafer plates 48 on the top of the threaded rod 41, and then start the motor to drive the optical axis 13 to start rotating, and then the optical axis 13 drives the rotating feeding mechanism to facilitate the wafer plate 48 to be adsorbed by the electrostatic suction cup 32. At the same time, the optical axis 13 drives the indirect rotation mechanism. The indirect rotation mechanism fixes the wafer plate 48 through the electrostatic suction cup 32 and moves it to between the tester 11 and the light lamp 12 for detection. At the same time, the indirect rotation mechanism drives the wafer plate 48 to indirectly rotate a certain angle, which is convenient for the tester 11 to detect all areas of the wafer plate 48. After each rotation of a certain angle, the wafer plate 48 will be stationary for a period of time to provide time for detection. The operation steps are simple. The staff only needs to check, and there is no need to operate the tester 11 to move the XY axis linearly.

[0034] like Figures 1 to 5As shown, the indirect rotation mechanism includes a circular plate 2 fixedly installed on the top of the optical axis 13, a clamping rod 20 fixedly installed on the top of the circular plate 2, a crescent plate 21 fixedly installed on the top of the circular plate 2, the outer wall of the clamping rod 20 can contact with a clamping member 22, the clamping member 22 has four clamping grooves, the crescent plate 21 can be clamped on the inner wall of the clamping groove, the top of the detection table 1 is rotatably connected with a rotating shaft 23, one end of the rotating shaft 23 passes through and is fixedly installed at the center of the clamping member 22, a fixing rod 24 is fixedly installed on the outer wall of the rotating shaft 23 near the top, a battery pack 25 is fixedly installed on the outer wall of the fixing rod 24, and the battery pack 25 has a switch button 26, and a fixing ring 27 is fixedly installed on the other end of the fixing rod 24, and the inner wall of the fixing ring 27 is rotatably connected with a fixing cylinder 28, and the fixing cylinder 28 has a rectangular groove, and the rectangular groove and the fixing The inner wall of the cylinder 28 is slidably connected with an annular plate 3, and a spring 29 and a magnet rod 33 are fixedly installed at the bottom of the annular plate 3. The magnet rod 33 is located on the inner wall of the spring 29, and one end of the magnet rod 33 passes through and is slidably connected to the bottom end of the fixed cylinder 28. An electrostatic suction cup 32 is fixedly installed on the top of the fixed cylinder 28, and the electrostatic suction cup 32 is connected to one side of the battery pack 25 through a line 34. The top of the electrostatic suction cup 32 can be adsorbed on the bottom of the wafer plate 48. A semicircular magnetic ring 35 is fixedly installed on the top of the detection table 1, and the semicircular magnetic ring 35 can be magnetically connected to the bottom end of the magnet rod 33. A rotatable driving rod 37 is provided on the top of the detection table 1, and a dorsal fin block 38 is fixedly installed on the outer wall of the driving rod 37. The dorsal fin block 38 can contact the outer wall of the magnet rod 33, and one end of the driving rod 37 passes through and is rotatably connected to one side of the detection table 1.

[0035] When the optical axis 13 starts to rotate, the clamping rod 20 slides between the two clamping grooves of the clamping piece 22, and then each time the crescent plate 21 reaches the inner wall of the clamping groove, the clamping piece 22 can be driven to rotate a certain angle, that is, each time the optical axis 13 rotates one circle, the shaft 23 will rotate forty-five degrees. Each time the shaft 23 rotates forty-five degrees, the wafer plate 48 is driven to rotate forty-five degrees through the fixing rod 24. The wafer plate 48 moves from the inner wall of the storage shell 44 to between the tester 11 and the illumination lamp 12 and then remains stationary for a period of time, which is convenient for the tester 11 to perform detection. At the same time, the servo motor connected to the bottom end of the dorsal fin block 38, when the optical axis 13 rotates one circle, the shaft 23 will rotate forty-five degrees. During the rotation process, when the wafer plate 48 reaches the position between the tester 11 and the light lamp 12 and stops, the servo motor will start along with the start of the tester 11, and drive the driving rod 37 to rotate. After the optical axis 13 stops for a period of time, the driving rod 37 will indirectly rotate to drive the wafer plate 48 to rotate indirectly. During the rotation of the driving rod 37, the wafer plate 48 will not be driven to rotate. When the driving rod 37 rotates, the dorsal fin block 38 contacts the bottom end of the magnet rod 33, and the friction force drives the fixed cylinder 28 to rotate, and the wafer plate 48 will also be driven to rotate indirectly.

[0036] It is explained that the gap between the plurality of arc-shaped plates a1 on one side of the storage case 45 is equal to the thickness of the wafer plate 48 .

[0037] When the electrostatic chuck 32 moves to the top of the semicircular magnetic ring 35, the magnet rod 33 enters the magnetic attraction range of the semicircular magnetic ring 35, so the magnet rod 33 moves linearly downward toward the semicircular magnetic ring 35. Figure 3 As shown, the magnet rod 33 moves downward, and the annular plate 3 also moves downward until the annular plate 3 presses the switch button 26 downward to make the battery pack 25, the circuit 34 and the electrostatic chuck 32 in a powered state. When the magnet rod 33 is away from the magnetic attraction range of the semicircular magnetic ring 35, the magnet rod 33 is driven by the spring 29 to move upward, and the switch button 26 is not squeezed, so that the battery pack 25, the circuit 34 and the electrostatic chuck 32 are in a powered state. The electrostatic chuck 32 in a powered state will attract the wafer plate 48, and on the contrary, the electrostatic chuck 32 will not attract the wafer plate 48 if it is not in a powered state.

[0038] It should be noted that the battery pack 25 is relatively large and is installed at the highest and lowest points of the fixing rod 24 . Since the voltage required by the electrostatic chuck 32 is relatively large, there must be dozens or hundreds of batteries in the battery pack 25 to provide a stable voltage to the electrostatic chuck 32 .

[0039] like Figure 4 and Figures 5 to 8 As shown, the rotary feeding mechanism includes a threaded rod 41 connected to the inner thread of the threaded barrel 15, a crescent-shaped telescopic rod 40 is fixedly installed on the bottom end of the threaded rod 41, a fixing frame 16 is fixedly installed on the bottom end of the crescent-shaped telescopic rod 40, and the fixing frame 16 is fixedly installed on the bottom of the detection table 1. A square groove 42 is opened on the top of the threaded rod 41, and a square block 43 can be clamped inside the square groove 42. A storage shell 44 is fixedly installed on the top of the square block 43. A plurality of arc plates a2 are linearly arrayed on one side of the storage shell 44, and a wafer plate 48 can be placed on the top of the arc plate a2. A connecting rod 46 is fixedly installed on the top of the storage shell 44, and a storage shell 45 is fixedly installed on the other side of the connecting rod 46. A plurality of arc plates a1 are linearly arrayed on one side of the storage shell 45, and a blocking rod 47 is fixedly installed on one side of the plurality of arc plates a1. The horizontal height of the arc plate a1 is higher than that of the arc plate a2.

[0040] During the rotation of the optical axis 13, the threaded barrel 15 is driven to rotate synchronously by the conveyor belt 14. When the optical axis 13 rotates one circle, the threaded barrel 15 also rotates one circle, and the square slot 42 rotates and moves downward. However, due to the limitation of the crescent-shaped telescopic rod 40, the square slot 42 can only move up and down in a straight line. Therefore, every time the wafer plate 48 is adsorbed and taken away by the electrostatic suction cup 32, the optical axis 13 rotates one circle and the threaded barrel 15 also rotates one circle. The distance that the square slot 42 moves downward in a straight line is the distance between the multiple arc plates a2 on one side of the storage shell 44, as shown in the attached figure. Figure 8 As shown, when the arc plate a2 at the lowest position on one side of the storage shell 44 moves downward, the arc plate a1 at the lowest position on one side of the storage shell 45 will be flush with the horizontal height of the arc plate a2 before it moves downward. When the electrostatic chuck 32 rotates between 180 and 270 degrees, it will be out of the magnetic attraction range of the semicircular magnetic ring 35, so the electrostatic chuck 32 will no longer adsorb the wafer plate 48, and the wafer plate 48 will stay above the right-angled inner wall of the storage shell 45, and the electrostatic chuck 32 will not contact the right-angled position of the storage shell 45. When the wafer plate 48 reaches the right-angled position on one side of the storage shell 45, the electrostatic chuck 32 will not touch the wafer plate 48. Above the lowest arc plate a1, similarly, when the second wafer plate 48 enters above the right-angled inner wall of the storage shell 45, it will also enter the right-angled inner wall of the storage shell 45 and will push the last inspected wafer plate 48 to contact the right-angled inner wall of the storage shell 45, and, therefore, the inspected wafer plates 48 will remain in the storage shell 45, and when the next batch of wafer plates 48 needs to be inspected, the staff only needs to reverse the optical axis 13 to move the threaded rod 41 upward, and then clamp the next batch of storage shells 44 in the square groove 42 at the top of the threaded rod 41 through the square block 43.

[0041] Furthermore, the high-precision mass measurement system for wafer measurement is characterized by comprising the following steps: S1, firstly placing the storage shell 44 on the top of the threaded rod 41 through the connecting rod 46, and placing a plurality of wafer plates 48 in the storage shell 44, and then starting the motor to drive the rotating feeding mechanism through the optical axis 13, so that the wafer plates 48 are adsorbed by the electrostatic chuck 32;

[0042] S2. During the rotation of the optical axis 13, the indirect rotation mechanism is driven to allow the wafer plate 48 to be adsorbed by the electrostatic chuck 32 during the static time, and then the wafer plate 48 is driven to reach between the tester 11 and the light lamp 12 for detection. At the same time, the dorsal fin block 38 is used to drive the wafer plate 48 to rotate indirectly so that the tester 11 can detect different positions of the wafer plate 48.

[0043] S3. When the indirect rotating mechanism drives the wafer plate 48 to rotate between one hundred and eighty degrees and two hundred and seventy degrees, the storage shell 2 45 will descend to facilitate the storage of the wafer plate 48. The operation is carried out in sequence. The inspected wafer plate 48 is stored on one side of the storage shell 2 45, and the uninspected wafer plate 48 is stored on one side of the storage shell 1 44.

[0044] Working principle: When the staff needs to inspect the wafer plates 48, firstly, the storage shell 44 filled with the wafer plates 48 is clamped into the square groove 42 at the top of the threaded rod 41 through the square block 43, and then the staff only needs to reverse the rotation of the optical axis 13 to move the threaded rod 41 upward, and then start the motor to drive the optical axis 13 to rotate. When the next batch of wafer plates 48 needs to be inspected, the above operation can be repeated;

[0045] The starting motor drives the optical axis 13 to start rotating, and then the optical axis 13 drives the rotating feeding mechanism to facilitate the wafer plate 48 to be adsorbed by the electrostatic suction cup 32. At the same time, the optical axis 13 drives the indirect rotating mechanism. The indirect rotating mechanism fixes the wafer plate 48 through the electrostatic suction cup 32 and moves it to between the tester 11 and the light lamp 12 for detection. At the same time, the indirect rotating mechanism drives the wafer plate 48 to indirectly rotate a certain angle, which is convenient for the tester 11 to detect all areas of the wafer plate 48. Each time the wafer plate 48 rotates a certain angle, it will be still for a period of time to provide time for detection. The operation steps are simple. The staff only needs to check it, and there is no need to operate the tester 11 to move the XY axis linearly.

[0046] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-precision mass measurement device for wafer measurement, characterized in that: include: An inspection table (1), a wafer plate (48) and an optical axis (13), one end of the optical axis (13) passes through and is rotatably connected to one side of the inspection table (1), the bottom end of the optical axis (13) is connected to a motor, the outer wall of the optical axis (13) is connected to a threaded barrel (15) through a conveyor belt (14), a limit ring (4) is fixedly installed on the outer wall of the threaded barrel (15), the limit ring (4) is rotatably connected to the inner wall of the inspection table (1), the inner wall of the threaded barrel (15) is provided with a rotating feeding mechanism, the top end of the optical axis (13) is provided with an indirect rotating mechanism, the optical axis (13) rotates to drive the rotating feeding mechanism, the rotating feeding mechanism transports the wafer plate (48), and the indirect rotating mechanism transports the wafer plate (48) for inspection.

2. The high-precision mass metrology equipment for wafer measurement according to claim 1, characterized in that: A support frame (10) is fixedly mounted on the top of the inspection table (1), a tester (11) is fixedly mounted on the other side of the support frame (10), the tester (11) detects the wafer plate (48), and a lighting lamp (12) is fixedly mounted on the top of the inspection table (1), the lighting lamp (12) is located directly below the tester (11).

3. The high-precision mass metrology equipment for wafer measurement according to claim 1, characterized in that: The indirect rotation mechanism comprises a circular plate (2) fixedly mounted on the top of the optical axis (13), a clamping rod (20) fixedly mounted on the top of the circular plate (2), a crescent plate (21) fixedly mounted on the top of the circular plate (2), an outer wall of the clamping rod (20) being contactable with a clamping member (22), the clamping member (22) having four clamping grooves, and the crescent plate (21) being clampable on the inner wall of the clamping groove.

4. The high-precision mass metrology equipment for wafer measurement according to claim 2, characterized in that: The top of the detection table (1) is rotatably connected to a rotating shaft (23), one end of the rotating shaft (23) passes through and is fixedly installed at the center of the clamping member (22), a fixing rod (24) is fixedly installed on the outer wall of the rotating shaft (23) near the top, a battery pack (25) is fixedly installed on the outer wall of the fixing rod (24), and the battery pack (25) has a switch button (26), the other end of the fixing rod (24) is fixedly installed with a fixing ring (27), the inner wall of the fixing ring (27) is rotatably connected to a fixing cylinder (28), and the fixing cylinder (28) has a rectangular groove, An annular plate (3) is slidably connected to the inner wall of the rectangular groove and the fixed cylinder (28); a spring (29) and a magnet rod (33) are fixedly installed at the bottom of the annular plate (3); the magnet rod (33) is located on the inner wall of the spring (29); one end of the magnet rod (33) passes through and is slidably connected to the bottom end of the fixed cylinder (28); an electrostatic suction cup (32) is fixedly installed at the top end of the fixed cylinder (28); the electrostatic suction cup (32) is connected to one side of the battery pack (25) through a line (34); and the top of the electrostatic suction cup (32) can be adsorbed on the bottom of the wafer plate (48).

5. The high-precision mass metrology equipment for wafer measurement according to claim 4, characterized in that: A semicircular magnetic ring (35) is fixedly installed on the top of the detection table (1), and the semicircular magnetic ring (35) can be magnetically connected to the bottom end of the magnet rod (33). A rotatable driving rod (37) is provided on the top of the detection table (1), and a dorsal fin block (38) is fixedly installed on the outer wall of the driving rod (37), and the dorsal fin block (38) can contact the outer wall of the magnet rod (33). One end of the driving rod (37) passes through and is rotatably connected to one side of the detection table (1).

6. The high-precision mass metrology equipment for wafer measurement according to claim 1, characterized in that: The rotary feeding mechanism comprises a threaded rod (41) connected to the threaded barrel (15) by an internal thread, a crescent-shaped telescopic rod (40) is fixedly installed at the bottom end of the threaded rod (41), a fixing frame (16) is fixedly installed at the bottom end of the crescent-shaped telescopic rod (40), and the fixing frame (16) is fixedly installed at the bottom of the detection table (1), a square groove (42) is opened at the top end of the threaded rod (41), a square block (43) can be snapped into the inside of the square groove (42), a storage shell (44) is fixedly installed on the top of the square block (43), and a plurality of arc plates (a2) are linearly arranged on one side of the storage shell (44), and a wafer plate (48) can be placed on the top of the arc plate (a2).

7. The high-precision mass metrology equipment for wafer measurement according to claim 6, characterized in that: A connecting rod (46) is fixedly installed on the top of the storage shell one (44), and a storage shell two (45) is fixedly installed on the other side of the connecting rod (46). A plurality of arc plates one (a1) are linearly arranged on one side of the storage shell two (45), and a blocking rod (47) is fixedly installed on one side of the plurality of arc plates one (a1), and the horizontal height of the arc plate one (a1) is higher than that of the arc plate two (a2).

8. A high-precision mass metrology system for wafer measurement according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, firstly, placing the storage shell (44) on the top of the threaded rod (41) through the connecting rod (46), and placing a plurality of wafer plates (48) in the storage shell (44), and then starting the motor to drive the rotating feeding mechanism through the optical axis (13), so that the wafer plates (48) are adsorbed by the electrostatic chuck (32); S2. During the rotation of the optical axis (13), the indirect rotation mechanism is driven to allow the wafer plate (48) to be adsorbed by the electrostatic chuck (32) during the static time, and then the wafer plate (48) is driven to arrive between the tester (11) and the light lamp (12) for detection. At the same time, the dorsal fin block (38) is used to drive the wafer plate (48) to rotate indirectly, so that the tester (11) can detect different positions of the wafer plate (48); S3. When the indirect rotating mechanism drives the wafer plate (48) to rotate between one hundred and eighty degrees and two hundred and seventy degrees, the storage shell (45) will descend to facilitate the storage of the wafer plate (48). The operation is carried out in sequence. The wafer plate (48) that has been tested is stored on one side of the storage shell (45), and the wafer plate (48) that has not been tested is stored on one side of the storage shell (44).

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