Light-emitting unit and lamp
By setting the second insulating layer in the light emitting unit and adjusting the position of the kit, the problem of small luminous area of the light emitting module in the existing COB lamps is solved, and the expansion of the luminous area and the improvement of the light efficiency is achieved.
Patent Information
- Application Number
- CN202411947481.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-04-11
AI Technical Summary
In existing COB lamps, the luminous area of the luminous module is greatly affected by the lamp kit, resulting in a smaller luminous area.
By providing a second insulating layer in the light emitting unit and setting the kit on the side where the second insulating layer is facing away from the first insulating layer, the kit limits the radial size of the light emitting module by the kit, thereby expanding the radial size of the light emitting module and increasing the light emitting area of the light emitting unit.
It effectively expands the luminous area of the luminous emitting unit and improves the luminous efficiency and luminous flux.
Smart Images
Figure CN119816031A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of lamps, and in particular to a light-emitting unit and a lamp. Background Art
[0002] COB stands for Chip On Board, which means that the bare chip is adhered to the interconnect substrate with conductive or non-conductive glue, and then wire bonding is performed to achieve its electrical connection.
[0003] However, in the existing COB lamps, the light-emitting area of the light-emitting module is greatly affected by the lamp kit, resulting in a smaller light-emitting area of the light-emitting module. Summary of the invention
[0004] The present application provides a light-emitting unit and a lamp to increase the light-emitting area of the light-emitting unit.
[0005] The present application provides a light-emitting unit, comprising:
[0006] substrate;
[0007] A light emitting module is arranged on one side of the substrate, and a light emitting area is arranged on a side of the light emitting module away from the substrate;
[0008] A first insulating layer is disposed on a side of the substrate facing the light-emitting module and surrounds the light-emitting module;
[0009] A second insulating layer is provided on a side of the first insulating layer away from the substrate, and a surface of the second insulating layer away from the first insulating layer is flush with a surface of the light-emitting module away from the substrate;
[0010] The set is arranged on a side of the second insulating layer away from the first insulating layer and is arranged around the circumference of the light emitting area.
[0011] In some possible implementations, the inner diameter D1 of the first insulating layer and the inner diameter D2 of the sleeve satisfy:
[0012] In some possible implementations, a surface of the first insulating layer facing the light-emitting module is in contact with the light-emitting module;
[0013] A surface of the second insulating layer facing the light emitting module is spaced apart from the light emitting module to form a gap.
[0014] In some possible implementations, the inner diameter D3 of the second insulating layer and the inner diameter D1 of the first insulating layer satisfy 0≤(D3-D1)≤8mm.
[0015] In some possible implementations, the inner diameter D1 of the first insulating layer and the inner diameter D2 of the sleeve satisfy 0≤(D2-D1)≤10 mm.
[0016] In some possible implementations, dam glue is provided in the gap.
[0017] In some possible implementations, a distance between a surface of the dam glue facing away from the first insulating layer and the first insulating layer is less than or equal to a distance between a surface of the second insulating layer facing away from the first insulating layer and the first insulating layer.
[0018] In some possible implementations, the thickness H of the dam glue is set to 0≤H≤0.6 mm.
[0019] In some possible implementations, a circuit layer is disposed between the first insulating layer and the second insulating layer, and the circuit layer is connected to the light-emitting module through wire bonding.
[0020] In addition, the present application also provides a lamp, comprising the light-emitting unit provided in the above embodiments.
[0021] Beneficial effects of the present application: In the light-emitting unit provided by the present application, a second insulating layer is arranged on the side of the first insulating layer away from the substrate, and the sleeve is arranged on the side of the second insulating layer away from the first insulating layer. Accordingly, the sleeve is no longer arranged on the peripheral side of the light-emitting module, which can reduce the restriction on the radial size of the light-emitting module. Thus, the radial size of the light-emitting module can be expanded, the light-emitting area of the light-emitting unit can be increased, and the light efficiency and light flux of the light-emitting unit can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 shows a schematic structural diagram of a light emitting unit in some embodiments;
[0024] Figure 2 shows a partial structural schematic diagram of a light emitting unit in some embodiments;
[0025] Figure 3 Another schematic structural diagram of a light emitting unit in some embodiments is shown;
[0026] Figure 4A schematic diagram of dimension marking of light-emitting units in some embodiments is shown.
[0027] Description of main component symbols:
[0028] 100-light emitting unit;
[0029] 110-Substrate;
[0030] 120-light emitting module; 1201-light emitting area; 121-light emitting chip; 122-packaging glue;
[0031] 131 - a first insulating layer; 132 - a second insulating layer;
[0032] 140-Kit;
[0033] 151-gap; 152-dam glue;
[0034] 161-circuit layer; 162-lead;
[0035] L-Center axis. DETAILED DESCRIPTION
[0036] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0039] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0040] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal thickness than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a smaller horizontal thickness than the second feature.
[0041] like Figure 1 As shown, a light emitting unit 100 is provided in an embodiment, which may include a substrate 110 , a light emitting module 120 , a first insulating layer 131 , a second insulating layer 132 and a kit 140 .
[0042] In some embodiments, the substrate 110 may be a circular plate-shaped structure. The light-emitting module 120 may also be a cylindrical structure. The light-emitting module 120 may be disposed on one side of the substrate 110. The light-emitting module 120 may be coaxially disposed with the substrate 110, and both may be coaxial with the central axis L of the light-emitting unit 100. In addition, a light-emitting region 1201 may be configured on the side of the light-emitting module 120 away from the substrate 110.
[0043] During use, the light emitting module 120 can be used to emit light to provide brightness, and the light generated by the light emitting module 120 can be emitted from the side of the light emitting module 120 away from the substrate 110. In the embodiment, the axial direction of the light emitting unit 100 can refer to the extension direction of the central axis L.
[0044] In other embodiments, the cross-sectional shape of the substrate 110 perpendicular to the axial direction of the light-emitting unit 100 and the cross-sectional shape of the light-emitting module 120 perpendicular to the axial direction of the light-emitting unit 100 can also be set to square, rectangular or elliptical shapes as needed.
[0045] In some embodiments, the first insulating layer 131 may be disposed on a side of the substrate 110 facing the light emitting module 120, and the first insulating layer 131 may be disposed around the periphery of the light emitting module 120. The second insulating layer 132 may be disposed on a side of the first insulating layer 131 facing away from the substrate 110, and the second insulating layer 132 may also be disposed around the periphery of the light emitting module 120. In addition, a surface of the second insulating layer 132 facing away from the first insulating layer 131 may be flush with a surface of the light emitting module 120 facing away from the substrate 110.
[0046] In the embodiment, the sleeve 140 may be disposed on a side of the second insulating layer 132 away from the first insulating layer 131 , and the sleeve 140 may be disposed around the periphery of the light emitting region 1201 of the light emitting module 120 .
[0047] In the embodiment of the present application, a second insulating layer 132 is disposed on a side of the first insulating layer 131 away from the substrate 110, and a sleeve 140 is disposed on a side of the second insulating layer 132 away from the first insulating layer 131. Accordingly, the sleeve 140 is no longer sleeved on the peripheral side of the light-emitting module 120, which can reduce the restriction on the radial dimension of the light-emitting module 120. Thus, the radial dimension of the light-emitting module 120 can be expanded, the light-emitting area of the light-emitting unit 100 can be increased, and the light efficiency and light flux of the light-emitting unit 100 can be improved. Among them, the radial direction of the light-emitting module 120 can be perpendicular to the central axis L.
[0048] like Figure 1 As shown, in some embodiments, the substrate 110 can be made of materials such as mirror aluminum, ceramic, ordinary aluminum or copper, and can have a good reflective effect. During the operation of the light-emitting unit 100, the substrate 110 can reflect the light generated by the light-emitting module 120 in a direction away from the substrate 110 to increase the brightness of the light-emitting unit 100 and improve the light effect of the light-emitting unit 100.
[0049] like Figure 1 and Figure 2 As shown, in some embodiments, the light emitting module 120 may include a packaging glue 122 and a plurality of light emitting chips 121. The plurality of light emitting chips 121 may be arranged in an array on the same side of the substrate 110. The packaging glue 122 may be filled in the groove gaps between the light emitting chips 121, and may cover the side of the light emitting chip 121 away from the substrate 110. Accordingly, the light emitting chip 121 may be wrapped by the packaging glue 122, and the packaging glue 122 may provide corresponding protection functions for the light emitting chip 121. In some embodiments, the surface of the side of the packaging glue 122 away from the substrate 110 may be flush with the surface of the side of the second insulating layer 132 away from the first insulating layer 131.
[0050] In some embodiments, a circuit layer 161 is further disposed between the first insulating layer 131 and the second insulating layer 132. The light emitting chip 121 may be bonded to the circuit layer 161 through the wires 162.
[0051] like Figures 1 to 4 As shown, in some embodiments, the first insulating layer 131 and the second insulating layer 132 can be made of bismaleimide triazine resin (BT) or FR4 flame retardant material.
[0052] In some embodiments, the first insulating layer 131 may be a ring-shaped structure surrounding the light-emitting module 120. The first insulating layer 131 may have an inner diameter D1. In an embodiment, a surface of the first insulating layer 131 facing the light-emitting module 120 may be in contact with the light-emitting module 120. Accordingly, the inner diameter D1 of the first insulating layer 131 may also be the outer diameter of the light-emitting module 120.
[0053] In some embodiments, the sleeve 140 may also be a ring-shaped structure surrounding the light-emitting area 1201, and the sleeve 140 may have an inner diameter D2. The inner diameter D1 of the first insulating layer 131 and the inner diameter D2 of the sleeve 140 may satisfy: That is, the inner diameter D1 of the first insulating layer 131 may be equal to or smaller than the inner diameter D2 of the sleeve 140. On the one hand, it can ensure that the light generated by the light-emitting module 120 can be projected outward through the sleeve 140, and on the other hand, it can also avoid forming a wider frame around the light-emitting module 120, reduce the dispersion of the light emitted by the light-emitting module 120, and thus improve the brightness of the light-emitting unit 100.
[0054] For example, in some embodiments, the inner diameter D2 of the sleeve 140 may be larger than the inner diameter D1 of the first insulating layer 131 by 0, 1% D2, 3% D2, 5% D2, 6% D2, 8% D2, 10% D2, or any other value between 0 and 10% D2.
[0055] In some embodiments, the second insulating layer 132 may also be a ring-shaped structure surrounding the light-emitting module 120. A surface of the second insulating layer 132 facing the light-emitting module 120 may be spaced apart from the light-emitting module 120, and a gap 151 is formed. In an embodiment, the second insulating layer 132 may have an inner diameter D3. The inner diameter D3 of the second insulating layer 132 may be greater than or equal to the inner diameter D1 of the first insulating layer 131.
[0056] In some embodiments, the inner diameter D3 of the second insulating layer 132 and the inner diameter D1 of the first insulating layer 131 satisfy 0≤(D3-D1)≤8mm. Thus, space can be reserved for the bonding connection between the light-emitting chip 121 and the circuit layer 161. For example, in some embodiments, the inner diameter D3 of the second insulating layer 132 can be 1mm, 1.5mm, 2mm, 2.2mm, 2.7mm, 3mm, 3.5mm, 3.8mm, 4mm or any other value between 0 and 4mm (excluding 0 in this case) larger than the inner diameter D1 of the first insulating layer 131.
[0057] Of course, in some embodiments, the inner diameter D3 of the second insulating layer 132 may also be equal to the inner diameter D1 of the first insulating layer 131. Accordingly, the surface of the second insulating layer 132 facing the light-emitting module 120 may be in contact with the light-emitting module 120. There is no need to set the dam glue 152 between the second insulating layer 132 and the light-emitting module 120. Therefore, the manufacturing process of the dam glue 152 can be reduced during the processing of the light-emitting unit 100, thereby improving the production efficiency of the light-emitting unit 100 and saving production costs. At the same time, the amount of glue used in the light-emitting unit 100 can be reduced.
[0058] In some embodiments, the inner diameter D1 of the first insulating layer 131 and the inner diameter D2 of the sleeve 140 may also satisfy 0≤(D2-D1)≤10mm. That is, the inner diameter D2 of the sleeve 140 is greater than or equal to the inner diameter D1 of the first insulating layer 131. For example, in some embodiments, the inner diameter D2 of the sleeve 140 is greater than the inner diameter D1 of the first insulating layer 131 by 0, 1mm, 1.5mm, 2mm, 2.8mm, 3.2mm, 3.7mm, 4.5mm, 5mm, 6.2mm, 6.8mm, 7mm, 7.5mm, 8.5mm, 9mm, 9.4mm, 10 or any other value between 0 and 10mm.
[0059] In some embodiments, a side surface of the second insulating layer 132 facing the light-emitting module 120, a side surface of the sleeve 140 facing the light-emitting area 1201, and a side surface of the first insulating layer 131 facing the light-emitting module 120 may be on the same cylindrical surface and on the same cylindrical surface as the outer surface of the peripheral side of the light-emitting module 120.
[0060] In some embodiments, when a gap 151 is disposed between the second insulating layer 132 and the light-emitting module 120 , a dam glue 152 may be disposed in the gap 151 .
[0061] In some embodiments, the thickness H of the dam glue 152 may be equal to or less than the thickness H2 of the second insulating layer 132. Thus, during the installation of the kit 140, the kit 140 may be prevented from contacting the dam glue 152 and causing the lead 162 to break, thereby reducing the probability of causing a dead light during the assembly process and improving the processing yield of the light-emitting unit 100.
[0062] In some embodiments, the thickness H of the dam glue 152 can be set to 0≤H≤0.6 mm. For example, in some embodiments, the thickness H of the dam glue 152 can be set to 0, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.35 mm, 0.4 mm, 0.48 mm, 0.55 mm, 0.6 mm, or any other thickness between 0 and 0.6 mm.
[0063] The embodiment also provides a lamp, which may include the light-emitting unit 100 provided in the embodiment. In addition, the lamp may also include a lampshade and the like, which may be disposed on a side of the kit 140 away from the substrate 110 to provide dust and water protection for the light-emitting module 120 .
[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0065] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. A light emitting unit, characterized in that: include: substrate; A light emitting module is arranged on one side of the substrate, and a light emitting area is arranged on a side of the light emitting module away from the substrate; A first insulating layer is disposed on a side of the substrate facing the light-emitting module and surrounds the light-emitting module; A second insulating layer is provided on a side of the first insulating layer away from the substrate, and a surface of the second insulating layer away from the first insulating layer is flush with a surface of the light-emitting module away from the substrate; The set is arranged on a side of the second insulating layer away from the first insulating layer and is arranged around the circumference of the light emitting area.
2. The light emitting unit according to claim 1, characterized in that: The inner diameter D1 of the first insulating layer and the inner diameter D2 of the sleeve satisfy, 3. The light emitting unit according to claim 1 or 2, characterized in that: A surface of the first insulating layer facing the light-emitting module is in contact with the light-emitting module; A surface of the second insulating layer facing the light emitting module is spaced apart from the light emitting module to form a gap.
4. The light emitting unit according to claim 3, characterized in that: The inner diameter D3 of the second insulating layer and the inner diameter D1 of the first insulating layer satisfy 0≤(D3-D1)≤8mm.
5. The light emitting unit according to claim 3, characterized in that: The inner diameter D1 of the first insulating layer and the inner diameter D2 of the sleeve satisfy 0≤(D2-D1)≤10mm.
6. The light emitting unit according to claim 3, characterized in that: The gap is provided with dam glue.
7. The light emitting unit according to claim 6, characterized in that: A distance between a surface of the dam glue facing away from the first insulating layer and the first insulating layer is less than or equal to a distance between a surface of the second insulating layer facing away from the first insulating layer and the first insulating layer.
8. The light emitting unit according to claim 7, characterized in that: The thickness H of the dam glue is set to 0≤H≤0.6mm.
9. The light emitting unit according to claim 1, characterized in that: A circuit layer is disposed between the first insulating layer and the second insulating layer, and the circuit layer is connected to the light-emitting module through wire bonding.
10. A lamp, characterized in that: The light emitting unit comprises the light emitting unit as claimed in any one of claims 1 to 9.