Manufacturing method of LED module, LED module and display equipment

Abstract

The invention relates to a manufacturing method of an LED module, the LED module and display equipment. The manufacturing method of the LED module comprises the following steps that a substrate is provided, the substrate is provided with a first face, the first face is divided into a first area and a second area, and an LED chip is installed in the first area; a semi-cured film is adopted to be pressed to the first face of the substrate, the LED chips penetrate through the semi-cured film to enable the LED chips to be exposed out of the semi-cured film, and the semi-cured film covers the second area; manufacturing a protective film on the LED chip, wherein the protective film completely covers the light-emitting surface of the LED chip; the semi-cured film is removed, so that the second area is exposed; a black layer is manufactured, the black layer comprises a first part and a second part, the first part covers the second area, and the second part covers the protective film; and removing the protective film and the second part of the black layer, so that the light-emitting surface of the LED chip is exposed out of the first part of the black layer.

Description

Technical Field

[0001] The present application relates to the technical field of LEDs, and in particular to a method for manufacturing an LED module, an LED module, and a display device. Background Art

[0002] ‌LED direct display‌ is a technology that uses light-emitting diodes (LEDs) as light-emitting elements and drives LEDs to emit light directly through current to achieve image display. LED direct display technology has the advantages of high brightness, low power consumption, long life, and environmental protection. It is widely used in various display scenarios, such as outdoor advertising, stage lighting, traffic signs, etc. ‌LED direct display screens are composed of many closely arranged LED pixels. Each LED pixel includes a positive electrode, a negative electrode, and a light emitter (semiconductor material). When current passes through the LED, the semiconductor material generates photons to form visible light. ‌As the pixel pitch continues to decrease, Mini&MicroLEDs are increasingly being used in display devices, but ink color consistency and high power consumption have always been pain points in the market.

[0003] In traditional technology, black substances are generally added to the packaging glue to control the ink color, and then the packaging glue is poured onto the LED substrate. However, the black substances in the packaging glue will block the light of the LED chip to a certain extent, causing a decrease in light transmittance, causing light loss and thus affecting the luminous effect. At the same time, the ink color difference cannot be completely eliminated. If the same luminous brightness is required, the current must be increased, which will lead to increased power consumption. Summary of the invention

[0004] Based on this, it is necessary to provide a method for manufacturing an LED module, an LED module, and a display device to address the problems of poor ink color consistency, light loss affecting the luminous effect, and high power consumption.

[0005] In a first aspect of the present application, a method for manufacturing an LED module is provided, which comprises the following steps:

[0006] Provide a substrate, the substrate having a first surface, the first surface being divided into a first area and a second area, and an LED chip is mounted in the first area;

[0007] A semi-cured film is pressed onto the first surface of the substrate, the LED chip penetrates the semi-cured film, so that the LED chip is exposed from the semi-cured film, and the semi-cured film covers the second area;

[0008] Making a protective film on the LED chip, wherein the protective film completely covers the light-emitting surface of the LED chip;

[0009] removing the semi-cured film to expose the second area;

[0010] Making a black layer, the black layer comprising a first part and a second part, the first part covers the second area, and the second part covers the protective film;

[0011] The protective film and the second portion of the black layer are removed to expose the light-emitting surface of the LED chip to the black layer.

[0012] When the LED module manufacturing method of the present scheme is used to process the LED module, the LED chip is first installed in the first area of ​​the first surface of the substrate, and then the semi-cured film is used to press and install it on the first surface of the substrate. During the pressing process, the LED chip penetrates the semi-cured film and is exposed on the semi-cured film, so that the semi-cured film only covers the second area; then a protective film is made for the LED chip, so that the protective film completely covers the light-emitting surface of the LED chip, and then the semi-cured film is removed to expose the second area, and then a black layer is made on this basis, so that the first part of the black layer covers the second area and the second part of the black layer The protective film is covered with a second portion of the black layer on the surface of the protective film; finally, the protective film and the second portion of the black layer covering the surface of the protective film are removed together, so that the light-emitting surface of the LED chip is exposed to the first portion of the black layer; since the light-emitting surface of the LED chip is not blocked in any way, extremely high light transmittance can be guaranteed to avoid light loss that affects the visual display effect, and high light transmittance and high contrast can be achieved. The black layer completely covers the second area of ​​the first surface of the substrate, and the ink color consistency of different substrates after assembly is good, and the brightness is not lost while ensuring the consistency of the ink color. On the basis of achieving the same brightness, there is no need to increase the input current, and the power consumption will not increase.

[0013] The technical solution of this application is further described below:

[0014] In one embodiment, in the step of laminating the semi-cured film to the first surface of the substrate, the LED chip penetrates the semi-cured film so that the LED chip is exposed from the semi-cured film, and the semi-cured film covers the second area, specifically:

[0015] The semi-cured film is pressed onto the first surface of the substrate by using a hot laminator, wherein the thickness of the semi-cured film is 5um-10um, the pressing temperature is set to 40°C-60°C, and the pressing pressure is set to 0.3Mpa-0.4Mpa.

[0016] In one embodiment, in the step of making a protective film for the LED chip, wherein the protective film completely covers the light-emitting surface of the LED chip, specifically:

[0017] The light emitting surface of the LED chip includes a top light emitting surface away from the substrate, and a side light emitting surface connected to the top light emitting surface;

[0018] Paraffin oil is sprayed onto the LED chip, the paraffin oil completely wraps the top light emitting surface and the side light emitting surface, and the paraffin oil is cured to form the protective film.

[0019] In one embodiment, in the step of spraying paraffin oil onto the LED chip, wherein the paraffin oil completely covers the top light emitting surface and the side light emitting surface, and curing the paraffin oil to form the protective film, specifically:

[0020] After the paraffin oil is sprayed, the substrate is placed in a cold storage area, and the paraffin oil is completely solidified at a solidification temperature to form the protective film;

[0021] Wherein, the curing temperature t<20°C, and the thickness of the protective film is 3um~5um.

[0022] In one embodiment, in the step of removing the semi-cured film to expose the second area, specifically:

[0023] Under the environmental condition of maintaining the curing temperature, the semi-cured film is removed from the second area by tearing off the film.

[0024] In one embodiment, in the step of making the black layer, the black layer includes a first part and a second part, the first part covers the second area, and the second part covers the protective film, specifically:

[0025] Under the environmental condition of maintaining the curing temperature, black light-blocking particles are attached to the second region and the surface of the protective film by deposition to form the black layer.

[0026] In one embodiment, the thickness of the black layer is h<10um, and the OD value is>6.

[0027] In one embodiment, in the step of removing the protective film and the second portion of the black layer so that the light-emitting surface of the LED chip is exposed at the first portion of the black layer, specifically:

[0028] The substrate is restored to room temperature, and the substrate is cleaned under heating conditions to remove the protective layer and the second portion of the black layer attached to the surface of the protective layer.

[0029] In one embodiment, after the step of removing the protective film and the second portion of the black layer to expose the light-emitting surface of the LED chip to the first portion of the black layer, the step further includes:

[0030] The first surface of the substrate is packaged to form a packaging structure on the surface of the black layer and the LED chip.

[0031] In one embodiment, in the step of encapsulating the first surface of the substrate to form an encapsulation structure on the surface of the black layer and the LED chip, the encapsulation structure includes a transparent semi-cured layer, a diffusion layer and an anti-glare layer, specifically:

[0032] Using a thermal lamination process to encapsulate a transparent semi-cured sheet onto the black layer and the surface of the LED chip to form the transparent semi-cured layer;

[0033] The transparent prepreg is doped with diffusion particles, the diffusion particles form the diffusion layer, and the diffusion layer is arranged on the side of the transparent prepreg layer away from the substrate;

[0034] The anti-glare layer is formed on the diffusion layer by a deposition or release process, and the anti-glare layer is arranged on the side of the diffusion layer away from the transparent semi-cured layer.

[0035] In one embodiment, in the step of encapsulating the first surface of the substrate to form an encapsulation structure on the surface of the black layer and the LED chip, the encapsulation structure includes a transparent semi-cured layer, a diffusion layer, a polarizing layer and an anti-glare layer, specifically:

[0036] Using a thermal lamination process to encapsulate a transparent semi-cured sheet onto the black layer and the surface of the LED chip to form the transparent semi-cured layer;

[0037] The transparent prepreg is doped with diffusion particles, the diffusion particles form the diffusion layer, and the diffusion layer is arranged on the side of the transparent prepreg layer away from the substrate;

[0038] Disposing a polarizer on the side of the diffusion layer away from the transparent semi-cured layer to form a polarizing layer;

[0039] The anti-glare layer is formed on the polarizing layer by a deposition or release process, and the anti-glare layer is arranged on the side of the polarizer away from the diffusion layer.

[0040] In one embodiment, based on the first surface, the height of the transparent semi-cured layer away from the side of the substrate is set to h1, and the height of the LED chip away from the side of the substrate is set to h2, where h1=h2+(20um~30um).

[0041] In one embodiment, in the step of encapsulating the first surface of the substrate to form an encapsulation structure on the black layer and the surface of the LED chip, the encapsulation structure includes a blackening layer, a transparent semi-cured layer, a diffusion layer and an anti-glare layer, specifically:

[0042] The black dry film is encapsulated onto the black layer and the surface of the LED chip by spraying, brushing or dipping to form a blackening layer;

[0043] A transparent semi-cured sheet is laminated to the surface of the blackening layer by a heat lamination process to form the transparent semi-cured layer, wherein the transparent semi-cured sheet is doped with diffusion particles, and the diffusion particles form a diffusion layer, and the diffusion layer is arranged on the side of the transparent semi-cured layer away from the blackening layer;

[0044] The anti-glare layer is formed on the diffusion layer by a thermal transfer process, and the anti-glare layer is arranged on the side of the diffusion layer away from the transparent semi-cured layer.

[0045] In one of the embodiments, the thickness of the blackening layer is less than or equal to 20 um; the thickness of the blackening layer is not greater than 1 / 4 of the height of the LED chip.

[0046] In a second aspect of the present application, there is also provided an LED module obtained by using the method for manufacturing the LED module as described above, the LED module comprising:

[0047] A substrate, comprising:

[0048] A first surface, wherein the first surface is provided with a PCB pad and the first surface is divided into a first area and a second area;

[0049] a second surface, wherein the second surface and the first surface are respectively arranged on two opposite sides of the substrate along the first direction;

[0050] LED chip, the LED chip is arranged in the first area, and the LED chip includes:

[0051] A chip body, wherein the chip body is provided with a top light-emitting surface disposed away from the substrate, and a side light-emitting surface connected to the top light-emitting surface;

[0052] A chip pad, which is disposed on the bottom surface of the chip body and is welded to the PCB pad;

[0053] a black layer, the black layer being disposed in a gap between the second region and the chip pad, the top light emitting surface and the side light emitting surface both being exposed in the black layer; and

[0054] A packaging structure is provided to cover the black layer and the outside of the LED chip.

[0055] According to a third aspect of the present application, a display device is provided, which includes the LED module as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0058] Figure 1 This is a schematic diagram of the cross-sectional structure of the LED module described in this application.

[0059] Figure 2 The schematic diagram is a top view of the structure in which an LED chip is installed in the first area of ​​a substrate.

[0060] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure.

[0061] Figure 4 It is a schematic diagram of a top view of the structure of a semi-cured film formed by lamination in the second area of ​​the substrate.

[0062] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure.

[0063] Figure 6 A schematic diagram of the top view of the protective film formed on the LED chip.

[0064] Figure 7 for Figure 6 Schematic diagram of the cross-sectional structure.

[0065] Figure 8 For Figure 6 Schematic diagram of the top view structure after removing the semi-cured film.

[0066] Fig. 9 for Figure 8 Schematic diagram of the cross-sectional structure.

[0067] Fig.10 For Figure 8 A schematic diagram of a top-view structure of a black layer is produced on the basis of the above.

[0068] Fig.11 for Fig.10 Schematic diagram of the cross-sectional structure.

[0069] Fig.12 It is a schematic diagram of the top view structure after the protective layer and the second part of the black layer on the surface of the LED chip are removed.

[0070] Fig.13 for Fig.12 Schematic diagram of the cross-sectional structure.

[0071] Fig.14 The present invention is a flowchart of a method for manufacturing an LED module according to an embodiment of the present invention.

[0072] Fig.15 FIG. 4 is a schematic diagram of the packaging structure of the first embodiment.

[0073] Fig.16 FIG. 4 is a schematic diagram of the packaging structure of the second embodiment.

[0074] Fig.17 FIG. 4 is a schematic structural diagram of the packaging structure of the third embodiment.

[0075] Description of reference numerals:

[0076] 100. LED module; 10. Substrate; 11. First surface; 111. First region; 112. Second region; 12. Second surface; 13. PCB pad; 20. LED chip; 21. Top light-emitting surface; 22. Side light-emitting surface; 23. Chip body; 24. Chip pad; 30. Semi-cured film; 40. Protective film; 50. Black layer; 51. First part; 52. Second part; 60. Packaging structure; 61. Transparent semi-cured layer; 62. Diffusion layer; 63. Anti-glare layer; 64. Polarizing layer; 65. Blackening layer; 70. Gap. DETAILED DESCRIPTION

[0077] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0078] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0079] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0080] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0081] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0082] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0083] The present application provides a display device, which may specifically be but not limited to any one of a television, an all-in-one machine, a tablet, a conference screen, etc., and may be flexibly selected according to actual needs.

[0084] See also Figure 1 The display device at least includes a housing and an LED module 100, and the LED module 100 is installed in the housing. The LED module 100 is a product composed of a certain number of light-emitting diodes arranged together in a regular pattern, then packaged and waterproofed. The LED module 100 can be divided into an LED light-emitting module and an LED backlight module, and is mainly used in the production of display devices such as indoor or outdoor display screens.

[0085] In the present application, the LED module 100 includes a substrate 10 , an LED chip 20 , a black layer 50 and a packaging structure 60 .

[0086] The substrate 10 , also known as a PCB board, can be regarded as a circuit carrier for mounting the integrated LED chip 20 , the black layer 50 and the packaging structure 60 .

[0087] Optionally, the substrate 10 may be, but is not limited to, a FR4 substrate, a glass substrate, or the like.

[0088] The LED chip 20 can be regarded as a light source, which lights up and generates light after being powered on to meet the use requirements.

[0089] In actual use, in order to obtain a larger display area, a plurality of LED modules 100 are generally spliced ​​and combined for use, and the provided black layer 50 is mainly used to solve the problem of ink color consistency.

[0090] Color consistency refers to the color consistency and accuracy of the display screen in different areas or under different display states. It is one of the important indicators for measuring display quality and directly affects user experience and visual effects. In the application of LED display screens, color consistency is a key parameter for measuring display quality. With the development of science and technology and the increase in market demand, companies pay more and more attention to color accuracy and consistency in product quality control. Poor color consistency will cause color differences in different areas or under different display states, affecting the overall visual effect and user experience.

[0091] Please continue reading Figure 1 In the present application, the substrate 10 includes a first surface 11 and a second surface 12, and the first surface 11 and the second surface 12 are respectively arranged on opposite sides of the substrate 10 along a first direction. Specifically, the first direction is the thickness direction of the substrate 10.

[0092] The first surface 11 is provided with a PCB pad 13 , and the first surface 11 is divided into a first area 111 and a second area 112 .

[0093] Specifically, two PCB pads 13 are provided, namely a PCB positive pad and a PCB negative pad, and the PCB positive pad and the PCB negative pad are arranged at an interval.

[0094] Please continue reading Figure 2 , the LED chip 20 is arranged in the first area 111. In the present application, a plurality of LED chips 20 and the first area 111 are provided. For example, the figure shows that nine LED chips 20 and the first area 111 are provided and arranged one by one. The nine LED chips 20 are arranged in three rows, and each row includes three LED chips 20. This array arrangement structure is more conducive to efficient use of the space on the first surface 11 of the substrate 10, so as to arrange more LED chips 20 and enhance the luminous efficiency of the LED module 100.

[0095] Please continue reading Figure 1 The LED chip 20 includes a chip body 23 and a chip pad 24. The chip pad 24 is disposed on the bottom surface of the chip body 23, and the chip pad 24 is welded to the PCB pad 13.

[0096] Specifically, each LED chip 20 includes two chip pads 24, namely a chip positive pad and a chip negative pad. During installation, the chip positive pad is welded and fixed to the PCB positive pad, and the chip negative pad is welded and fixed to the PCB negative pad to achieve electrical connection between the LED chip 20 and the substrate 10.

[0097] Please continue reading Figure 1The chip body 23 is provided with a top light emitting surface 21 which is arranged away from the substrate 10, and a side light emitting surface 22 which is connected to the top light emitting surface 21. After the LED chip 20 is welded and fixed, the top light emitting surface 21 is arranged parallel to the first surface 11, and the side light emitting surface 22 is arranged perpendicular to the first surface 11. In this way, the LED chip 20 obtains a larger light emitting area, and realizes light emission in multiple directions at the same time, so that the LED module 100 obtains a better light emitting effect.

[0098] Please continue reading Figure 1 In the present application, the main part of the black layer 50 is arranged outside the second area 112, and a small part of the black layer 50 also exists in the gap 70 of the chip pad 24. The top light-emitting surface 21 and the side light-emitting surface 22 are both exposed in the black layer 50. With such a configuration, the first surface 11 of the substrate 10 can form a full black effect except for the LED chip 20, so that the LED module 100 obtains a high blackness and completely realizes the uniformity of the ink color of the substrate 10. In other words, when the LED module 100 is lit and working, except for the LED chip 20 emitting light, other areas on the first surface 11 of the substrate 10 form a consistent full black visual effect, avoiding visual color differences that affect the experience.

[0099] For example, when the LED chip 20 is rectangular, the side light emitting surfaces 22 are specifically four side surfaces of the LED chip 20. That is, the LED chip 20 includes five light emitting surfaces, namely, a top light emitting surface 21 and four side light emitting surfaces 22.

[0100] Please continue reading Figure 1 The packaging structure 60 is covered on the black layer 50 and the outside of the LED chip 20. The packaging structure 60 is used to protect the black layer 50 and the LED chip 20.

[0101] Please continue reading Fig.14 In addition to the above, the present application also provides a method for manufacturing an LED module 100, which is used to process and obtain the above-mentioned LED module 100.

[0102] The manufacturing method of the LED module 100 includes the following steps:

[0103] S10: Provide a substrate 10, the substrate 10 has a first surface 11, the first surface 11 is divided into a first area 111 and a second area 112, and the LED chip 20 is installed in the first area 111. Figure 2 and Figure 3 .

[0104] S20: The semi-cured film 30 is pressed onto the first surface 11 of the substrate 10, and the LED chip 20 penetrates the semi-cured film 30, so that the LED chip 20 is exposed on the semi-cured film 30, and the semi-cured film 30 covers the second area 112. Figure 4 and Figure 5 .

[0105] S30: Make a protective film 40 on the LED chip 20, and the protective film 40 completely covers the light-emitting surface of the LED chip 20. Figure 6 and Figure 7 .

[0106] S40: Remove the semi-cured film 30 to expose the second area 112. Figure 8 and Fig. 9 .

[0107] S50: Make a black layer 50, the black layer 50 includes a first portion 51 and a second portion 52, the first portion 51 covers the second area 112, and the second portion 52 covers the protective film 40. Fig.10 and Fig.11 .

[0108] S60: Remove the protective film 40 and the second portion 52 of the black layer 50, so that the light-emitting surface of the LED chip 20 is exposed to the black layer 50. Fig.12 and Fig.13 .

[0109] In summary, the implementation of the technical solution of this embodiment will obtain the following beneficial effects: when the LED module 100 is processed by the manufacturing method of the LED module 100 of the present solution, the LED chip 20 is first installed in the first area 111 of the first surface 11 of the substrate 10, and then the semi-cured film 30 is used to press and install it on the first surface 11 of the substrate 10. During the pressing process, the LED chip 20 breaks through the semi-cured film 30 and is exposed on the semi-cured film 30, so that the semi-cured film 30 only covers the second area 112; then, a protective film 40 is made for the LED chip 20, so that the protective film 40 completely covers the light-emitting surface of the LED chip 20, and then the semi-cured film 30 is removed to expose the second area 112, and on this basis, a black layer 50 is made, so that the first part of the black layer 50 The second portion 51 of the black layer 50 covers the second area 112, and the second portion 52 of the black layer 50 covers the protective film 40; finally, the protective film 40 and the second portion 52 of the black layer 50 covering the surface of the protective film 40 are removed together, so that the light-emitting surface of the LED chip 20 is exposed to the first portion 51 of the black layer 50; since the light-emitting surface of the LED chip 20 is not blocked in any way, it can ensure extremely high light transmittance, avoid light loss and affect the visual display effect, and achieve high light transmittance and high contrast. The black layer 50 completely covers the second area 112 of the first surface 11 of the substrate 10. The ink color consistency of different substrates 10 after assembly is good, and the brightness is not lost while ensuring the consistency of the ink color. On the basis of achieving the same brightness, there is no need to increase the input current, and the power consumption will not increase.

[0110] In an optional embodiment, in the step of laminating the semi-cured film 30 to the first surface 11 of the substrate 10, the LED chip 20 penetrates the semi-cured film 30 so that the LED chip 20 is exposed in the semi-cured film 30, and the semi-cured film 30 covers the second area 112, specifically:

[0111] The semi-cured film 30 is pressed onto the first surface 11 of the substrate 10 by a heat laminator, wherein the thickness of the semi-cured film 30 is 5 um to 10 um, the pressing temperature is set to 40° C. to 60° C., and the pressing pressure is set to 0.3 MPa to 0.4 MPa.

[0112] For example, when the heat laminator is an airbag heat laminator, when the semi-cured film 30 is pressed onto the first surface 11 of the substrate 10, the portion of the semi-cured film 30 opposite to the LED chip 20 can be broken through by the LED chip 20, so that the semi-cured film 30 is attached to the second area 112 to avoid blocking the LED chip 20. In other words, when there are multiple LED chips 20, the multiple LED chips 20 will break through the semi-cured film 30 at the same time.

[0113] The semi-cured film 30 is made of a modified silicone resin material, and the semi-cured film 30 can be formed in advance by the viscosity of glue.

[0114] The thickness of the semi-cured film 30 is 5 um to 10 um to ensure that the modified silicone resin material has good moldability.

[0115] The temperature of the pressing process is set at 40°C~60°C to ensure that the modified silicone resin material has good moldability and forms a semi-cured film 30 without falling apart, while reducing the toughness of the semi-cured film 30 so that the LED chip 20 can penetrate the semi-cured film 30 more easily.

[0116] The pressure of the lamination process is set to 0.3Mpa-0.4Mpa. Under this pressure, the semi-cured film 30 can be penetrated by the LED chip 20 without damaging the LED chip 20.

[0117] Furthermore, in another optional embodiment, in the step of making the protective film 40 for the LED chip 20 so that the protective film 40 completely covers the light-emitting surface of the LED chip 20, specifically:

[0118] The light emitting surface of the LED chip 20 includes a top light emitting surface 21 away from the substrate 10 and a side light emitting surface 22 connected to the top light emitting surface 21;

[0119] Paraffin oil is sprayed onto the LED chip 20 , the paraffin oil completely covers the top light emitting surface 21 and the side light emitting surface 22 , and the paraffin oil is solidified to form a protective film 40 .

[0120] By spraying the LED chip 20 with paraffin oil, an oil film protective film 40 can be quickly and effectively formed on the top light-emitting surface 21 and the side light-emitting surface 22. The processing method is simple and low-cost, and it is highly feasible. The formed protective film 40 has uniform texture, strong isolation performance, and is easy to remove later.

[0121] It should be noted that the protective film 40 is sprayed to completely wrap the top light-emitting surface 21 and the side light-emitting surface 22 of the LED chip 20. The purpose is to form an isolation layer with the protective film 40 to prevent the black layer 50 from being contaminated onto the surface of the LED chip 20 during subsequent deposition to block the light, causing light loss and reducing the transmittance.

[0122] Further, based on the above embodiment, in the step of spraying paraffin oil onto the LED chip 20, completely covering the top light emitting surface 21 and the side light emitting surface 22, and curing the paraffin oil to form the protective film 40, the steps are as follows:

[0123] After the paraffin oil is sprayed, the substrate 10 is placed in a cold storage area, and the paraffin oil is completely solidified at the curing temperature to form a protective film 40;

[0124] The curing temperature t is less than 20° C., and the thickness of the protective film 40 is 3 um to 5 um.

[0125] The substrate 10 is placed in a cold storage area below 20°C. Under the action of the solidification temperature, the paraffin oil is cooled and quickly and completely solidified, thereby forming a complete protective film 40 with a stable structure. The thickness of the protective film 40 is set to 3um~5um. On the one hand, the thickness of the protective film 40 is sufficient to have a reliable isolation effect to prevent the black layer 50 from penetrating the protective film 40 and contaminating the LED chip 20; on the other hand, the thickness of the protective film 40 is not too large, which is convenient for subsequent removal.

[0126] In addition, based on any of the above embodiments, in the step of removing the semi-cured film 30 to expose the second area 112, specifically:

[0127] Under the environmental condition of maintaining the curing temperature, the semi-cured film 30 is removed from the second area 112 by tearing off the film.

[0128] Under low temperature conditions, the semi-cured film 30 has good moldability and greater toughness, and the semi-cured film 30 will shrink when it is cooled, which makes the size of the holes formed by the semi-cured film 30 being pierced by the LED chip 20 during the lamination process larger. Therefore, the semi-cured film 30 can be torn off the second area 112 of the first surface 11 of the substrate 10 as a whole by directly tearing the film. The removal method is simple and the removal effect is good.

[0129] Further, in the step of manufacturing the black layer 50, the black layer 50 includes a first portion 51 and a second portion 52, the first portion 51 covers the second area 112, and the second portion 52 covers the protective film 40, specifically:

[0130] Under the environmental condition of maintaining the curing temperature, the black light-blocking particles are deposited onto the second region 112 and the surface of the protective film 40 to form a black layer 50 .

[0131] It should be noted that the first part 51 and the second part 52 are integrally connected, and the two constitute the overall structure of the black layer 50. Under the environmental conditions of maintaining the curing temperature, the paraffin oil can be ensured to be in a completely cured state to maintain a good isolation effect on the black layer 50. The black layer 50 can be quickly and effectively formed by using a deposition process of nano-scale, uniform and dense black light-blocking particles, and the black layer 50 has good bonding with the substrate 10 and the protective film 40.

[0132] For example, the thickness of the black layer 50 is h<10 um, and the OD value is> 6. Thus, the black layer 50 has the ability to completely blacken and block light, completely eliminates ink color differences, and achieves ink color consistency.

[0133] It should be noted that OD value is the abbreviation of optical density, which indicates the light density absorbed by the object being tested. It is a special term in the test method, which is used to characterize the value of the material's light-shielding ability. An OD value of 6 or more indicates that the black layer 50 has a strong light-shielding ability and can achieve a completely black visual effect.

[0134] It should also be noted that, in other optional embodiments, the black layer 50 may also be formed by surface printing, plating, etc.

[0135] Furthermore, in the step of removing the protective film 40 and the second portion 52 of the black layer 50 so that the light-emitting surface of the LED chip 20 is exposed to the first portion 51 of the black layer 50, specifically:

[0136] The substrate 10 is restored to room temperature, and then cleaned under heating conditions to remove the protective layer and the second portion 52 of the black layer 50 attached to the surface of the protective layer.

[0137] The substrate 10 is restored to room temperature and heated, so that the paraffin oil constituting the protective film 40 covering the top light-emitting surface 21 and the side light-emitting surface 22 is quickly and completely melted, and the second part 52 of the black layer 50 deposited and covering the surface of the protective film 40 is washed and removed together with the paraffin oil to completely expose the five light-emitting surfaces of the LED. The light-emitting surfaces are not blocked and can achieve no light loss, high light transmittance and high contrast.

[0138] In addition, based on any of the above embodiments, after removing the protective film 40 and the second portion 52 of the black layer 50 to expose the light-emitting surface of the LED chip 20 to the first portion 51 of the black layer 50, the method further includes the following steps:

[0139] Please continue reading Figure 1 The first surface 11 of the substrate 10 is packaged to form a packaging structure 60 on the surface of the black layer 50 and the LED chip 20. The packaging structure 60 is used to form a packaging protection for the black layer 50 and the LED chip 20.

[0140] Please continue reading Fig.15 In the present application, there may be many specific implementations for forming the encapsulation structure 60. For example, in the first embodiment, in the step of encapsulating the first surface 11 of the substrate 10 to form the encapsulation structure 60 on the surface of the black layer 50 and the LED chip 20, the encapsulation structure 60 includes a transparent semi-cured layer 61, a diffusion layer 62 and an anti-glare layer 63, specifically:

[0141] A transparent prepreg is encapsulated onto the black layer 50 and the surface of the LED chip 20 by a thermal lamination process to form a transparent prepreg layer 61;

[0142] The transparent semi-cured sheet is doped with diffusion particles, and the diffusion particles form a diffusion layer 62. The diffusion layer 62 is arranged on the side of the transparent semi-cured layer 61 away from the substrate 10;

[0143] The anti-glare layer 63 is formed on the diffusion layer 62 by a deposition or release process. The anti-glare layer 63 is disposed on the side of the diffusion layer 62 away from the transparent semi-cured layer 61 .

[0144] The transparent prepreg is used for packaging by heat lamination, which is simple in processing and has good packaging effect. The diffusion layer 62 is formed by mixing diffusion particles in the transparent prepreg. The formed anti-glare layer 63 can play a good anti-glare role and improve the reflectivity.

[0145] Please continue reading Fig.16 In the second embodiment, in the step of encapsulating the first surface 11 of the substrate 10 to form an encapsulation structure 60 on the surface of the black layer 50 and the LED chip 20, the encapsulation structure 60 includes a transparent semi-cured layer 61, a diffusion layer 62, a polarizing layer 64 and an anti-glare layer 63, specifically:

[0146] A transparent prepreg is encapsulated onto the black layer 50 and the surface of the LED chip 20 by a thermal lamination process to form a transparent prepreg layer 61;

[0147] The transparent semi-cured sheet is doped with diffusion particles, and the diffusion particles form a diffusion layer 62. The diffusion layer 62 is arranged on the side of the transparent semi-cured layer 61 away from the substrate 10;

[0148] A polarizing film is disposed on the side of the diffusion layer 62 away from the transparent semi-cured layer 61 to form a polarizing layer 64;

[0149] The anti-glare layer 63 is formed on the polarizing layer 64 by a deposition or release process. The anti-glare layer 63 is disposed on the side of the polarizer away from the diffusion layer 62 .

[0150] The difference between the second embodiment and the first embodiment is that a polarizing layer 64 is first formed on the diffusion layer 62, and then an anti-glare layer 63 is formed on the polarizing layer 64. The main function of the polarizing layer 64 is to provide a polarization effect and absorb light perpendicular to the light transmission axis, thereby reducing glare and reflection and improving visual clarity.

[0151] The polarizing layer 64 is usually made of polyvinyl alcohol (PVA) and has polarizing properties through stretching and orientation technology.

[0152] In the above two embodiments, taking the first surface 11 of the substrate 10 as a reference, the height of the transparent semi-cured layer 61 away from the side of the substrate 10 is set to h1, and the height of the LED chip 20 away from the side of the substrate 10 is set to h2, where h1=h2+(20um~30um). This helps to ensure the uniformity of light mixing.

[0153] Please continue reading Fig.17 , further, a third embodiment is provided. In the third embodiment, in the step of encapsulating the first surface 11 of the substrate 10 to form an encapsulation structure 60 on the surface of the black layer 50 and the LED chip 20, the encapsulation structure 60 includes a blackening layer 65, a transparent semi-cured layer 61, a diffusion layer 62 and an anti-glare layer 63, specifically:

[0154] The black dry film is encapsulated on the surface of the black layer 50 and the LED chip 20 by spraying, brushing or dipping to form a blackening layer 65;

[0155] A transparent semi-cured sheet is laminated to the surface of the blackening layer 65 by a heat lamination process to form a transparent semi-cured layer 61. The transparent semi-cured sheet is doped with diffusion particles, and the diffusion particles form a diffusion layer 62. The diffusion layer 62 is arranged on the side of the transparent semi-cured layer 61 away from the blackening layer 65.

[0156] The anti-glare layer 63 is formed on the diffusion layer 62 by a thermal transfer process. The anti-glare layer 63 is disposed on the side of the diffusion layer 62 away from the transparent semi-cured layer 61 .

[0157] Furthermore, the thickness of the blackening layer 65 is less than or equal to 20 um; the thickness of the blackening layer 65 is not greater than 1 / 4 of the height of the LED chip 20 .

[0158] The difference from the above two embodiments is that a blackening layer 65 is used to replace the transparent semi-cured layer 61. The provision of the blackening layer 65 can further enhance the blackening effect and reduce the light loss, which can be controlled within 10%. On this basis, good light mixing uniformity, anti-glare and high reflectivity effects can also be obtained.

[0159] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0160] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for manufacturing an LED module, characterized in that: The steps include: Provide a substrate, the substrate having a first surface, the first surface being divided into a first area and a second area, and an LED chip is mounted in the first area; A semi-cured film is pressed onto the first surface of the substrate, the LED chip penetrates the semi-cured film, so that the LED chip is exposed from the semi-cured film, and the semi-cured film covers the second area; Making a protective film on the LED chip, wherein the protective film completely covers the light-emitting surface of the LED chip; removing the semi-cured film to expose the second area; Making a black layer, the black layer comprising a first part and a second part, the first part covers the second area, and the second part covers the protective film; The protective film and the second portion of the black layer are removed to expose the light-emitting surface of the LED chip to the black layer.

2. The method for manufacturing an LED module according to claim 1, characterized in that: In the step of laminating the semi-cured film to the first surface of the substrate, the LED chip penetrates the semi-cured film so that the LED chip is exposed from the semi-cured film, and the semi-cured film covers the second area, specifically: The semi-cured film is pressed onto the first surface of the substrate by using a hot laminator, wherein the thickness of the semi-cured film is 5um-10um, the pressing temperature is set to 40°C-60°C, and the pressing pressure is set to 0.3Mpa-0.4Mpa.

3. The method for manufacturing an LED module according to claim 1, characterized in that: In the step of making a protective film for the LED chip, wherein the protective film completely covers the light-emitting surface of the LED chip, the steps are as follows: The light emitting surface of the LED chip includes a top light emitting surface away from the substrate, and a side light emitting surface connected to the top light emitting surface; Spray paraffin oil onto the LED chip, wherein the paraffin oil completely covers the top light-emitting surface and the side light-emitting surface; and solidify the paraffin oil to form the protective film.

4. The method for manufacturing an LED module according to claim 3, characterized in that: In the step of spraying paraffin oil onto the LED chip, wherein the paraffin oil completely covers the top light-emitting surface and the side light-emitting surface; and curing the paraffin oil to form the protective film, the steps are specifically as follows: After the paraffin oil is sprayed, the substrate is placed in a cold storage area, and the paraffin oil is completely solidified at a solidification temperature to form the protective film; Wherein, the curing temperature t<20°C, and the thickness of the protective film is 3um~5um.

5. The method for manufacturing an LED module according to claim 4, characterized in that: In the step of removing the semi-cured film to expose the second area, specifically: Under the environmental condition of maintaining the curing temperature, the semi-cured film is removed from the second area by tearing off the film.

6. The method for manufacturing an LED module according to claim 4, characterized in that: In the step of manufacturing the black layer, the black layer includes a first part and a second part, the first part covers the second area, and the second part covers the protective film, specifically: Under the environmental condition of maintaining the curing temperature, black light-blocking particles are attached to the second region and the surface of the protective film by deposition to form the black layer.

7. The method for manufacturing an LED module according to claim 6, characterized in that: The thickness of the black layer is h<10um, and the OD value is>6.

8. The method for manufacturing an LED module according to claim 6, characterized in that: In the step of removing the protective film and the second part of the black layer so that the light-emitting surface of the LED chip is exposed at the first part of the black layer, specifically: The substrate is restored to room temperature, and the substrate is cleaned under heating conditions to remove the protective layer and the second portion of the black layer attached to the surface of the protective layer.

9. The method for manufacturing an LED module according to claim 1, characterized in that: After the step of removing the protective film and the second part of the black layer so that the light-emitting surface of the LED chip is exposed to the first part of the black layer, the step further includes: The first surface of the substrate is packaged to form a packaging structure on the surface of the black layer and the LED chip.

10. The method for manufacturing an LED module according to claim 9, characterized in that: In the step of encapsulating the first surface of the substrate to form an encapsulation structure on the surface of the black layer and the LED chip, the encapsulation structure includes a transparent semi-cured layer, a diffusion layer and an anti-glare layer, specifically: Using a thermal lamination process to encapsulate a transparent semi-cured sheet onto the black layer and the surface of the LED chip to form the transparent semi-cured layer; The transparent prepreg is doped with diffusion particles, the diffusion particles form the diffusion layer, and the diffusion layer is arranged on the side of the transparent prepreg layer away from the substrate; The anti-glare layer is formed on the diffusion layer by a deposition or release process, and the anti-glare layer is arranged on the side of the diffusion layer away from the transparent semi-cured layer.

11. The method for manufacturing an LED module according to claim 9, characterized in that: In the step of encapsulating the first surface of the substrate to form an encapsulation structure on the surface of the black layer and the LED chip, the encapsulation structure includes a transparent semi-cured layer, a diffusion layer, a polarizing layer and an anti-glare layer, specifically: Using a thermal lamination process to encapsulate a transparent semi-cured sheet onto the black layer and the surface of the LED chip to form the transparent semi-cured layer; The transparent prepreg is doped with diffusion particles, the diffusion particles form the diffusion layer, and the diffusion layer is arranged on the side of the transparent prepreg layer away from the substrate; Disposing a polarizer on the side of the diffusion layer away from the transparent semi-cured layer to form the polarizing layer; The anti-glare layer is formed on the polarizing layer by a deposition or release process, and the anti-glare layer is arranged on the side of the polarizer away from the diffusion layer.

12. The method for manufacturing an LED module according to claim 10 or 11, characterized in that: Taking the first surface as a reference, the height of the transparent semi-cured layer away from the side surface of the substrate is set to h1, and the height of the LED chip away from the side surface of the substrate is set to h2, where h1=h2+(20um-30um).

13. The method for manufacturing an LED module according to claim 9, characterized in that: In the step of encapsulating the first surface of the substrate to form an encapsulation structure on the black layer and the surface of the LED chip, the encapsulation structure includes a blackening layer, a transparent semi-cured layer, a diffusion layer and an anti-glare layer, specifically: The black dry film is encapsulated onto the black layer and the surface of the LED chip by spraying, brushing or dipping to form a blackening layer; A transparent semi-cured sheet is laminated to the surface of the blackening layer by a heat lamination process to form the transparent semi-cured layer, wherein the transparent semi-cured sheet is doped with diffusion particles, and the diffusion particles form a diffusion layer, and the diffusion layer is arranged on the side of the transparent semi-cured layer away from the blackening layer; The anti-glare layer is formed on the diffusion layer by a thermal transfer process, and the anti-glare layer is arranged on the side of the diffusion layer away from the transparent semi-cured layer.

14. The method for manufacturing an LED module according to claim 13, characterized in that: The thickness of the blackening layer is less than or equal to 20 um; the thickness of the blackening layer is not greater than 1 / 4 of the height of the LED chip.

15. An LED module obtained by the method for manufacturing an LED module according to any one of claims 1 to 14, characterized in that: The LED module comprises: A substrate, comprising: A first surface, wherein the first surface is provided with a PCB pad and the first surface is divided into a first area and a second area; a second surface, wherein the second surface and the first surface are respectively arranged on two opposite sides of the substrate along the first direction; LED chip, the LED chip is arranged in the first area, and the LED chip includes: A chip body, wherein the chip body is provided with a top light-emitting surface disposed away from the substrate, and a side light-emitting surface connected to the top light-emitting surface; A chip pad, the chip pad is arranged on the bottom surface of the chip body, and the chip pad is welded to the PCB pad; a black layer, the black layer being disposed in a gap between the second region and the chip pad, the top light emitting surface and the side light emitting surface both being exposed from the black layer; and A packaging structure is provided to cover the black layer and the outside of the LED chip.

16. A display device, characterized in that: Comprising the LED module according to any one of claims 1 to 15.

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