Micro-led device preparation method, micro-led device and display device

Abstract

The present disclosure provides a micro-LED device preparation method, a micro-LED device and a display device. The method comprises: obtaining a transparent substrate and a micro-LED chip structure; disposing a first reflective layer on the transparent substrate, the first reflective layer being configured to partially reflect light emitted by a micro-LED unit; disposing a first partition layer on the first reflective layer, so that the first partition layer comprises a plurality of groups of first through holes, each group of first through holes comprising at least two first through holes; disposing a second partition layer on the first partition layer, so that the second partition layer comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes; filling a photo-luminescent material layer in each group of second through holes to obtain a first color conversion structure, the color of the light emitted by the micro-LED unit being different from the color corresponding to the photo-luminescent material layer; and bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro-LED chip to obtain a micro-LED device.

Description

Technical Field

[0001] This disclosure relates to the technical field of semiconductor Micro LED, and more specifically, to a method for fabricating a micro LED device, a micro LED device, and a display device. Background Technology

[0002] Micro-LED is a comprehensive technology that integrates novel display technology with light-emitting diode (LED) technology. It boasts advantages such as small size, high brightness, high resolution, and low power consumption, and is considered one of the most promising next-generation display and light-emitting devices. Currently, full-color Micro-LED displays can be achieved in various ways, one of which is color conversion. However, full-color Micro-LED devices achieved through color conversion still suffer from unsatisfactory display effects. Summary of the Invention

[0003] The present disclosure provides a method for fabricating a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of the present disclosure, a method for fabricating a micro-LED device is provided, wherein the method includes: obtaining a transparent substrate and a micro-LED chip structure, wherein the micro-LED chip structure includes a micro-LED chip, the micro-LED chip including a micro-LED unit array composed of a plurality of micro-LED units; disposing a first reflective layer on the transparent substrate, the first reflective layer being used to partially reflect light emitted by the micro-LED units; disposing a first partition layer on the first reflective layer, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set containing a first through-hole. A via includes at least two first vias; a second partition layer is disposed on a first partition layer, such that the second partition layer includes a second via array, the second via array corresponding to the first via array, wherein the second via array includes multiple sets of second vias corresponding to the multiple sets of first vias, and the second vias in each set of second vias correspond to the first vias in the corresponding set of first vias; a photoluminescent material layer is filled in each set of second vias to obtain a first color conversion structure, wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer; the side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro-LED chip to obtain a micro-LED device.

[0005] Furthermore, the first reflective layer is used to partially reflect the third color light emitted by the micro-LED unit. Each group of first through holes includes three first through holes. A first partition layer is disposed on the first reflective layer, such that the first partition layer includes a first through hole array. The arrangement of the first through hole array corresponds to the arrangement of the micro-LED unit array. The first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes. This includes: disposing of a first partition layer on the first reflective layer and opening a first through hole array on the first partition layer, such that the arrangement of the first through hole array corresponds to the arrangement of the micro-LED unit array. The first through hole array includes multiple groups of first through holes, and each group of first through holes includes a first first through hole, a second first through hole, and a third first through hole. A second partition layer is provided on a first partition layer, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole set includes: providing a second partition layer on the first partition layer and opening a second through-hole array on the second partition layer, such that the second through-hole array is aligned with the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes includes three second through-holes, the three second through-holes including a first second through-hole aligned with a first first through-hole, a second second through-hole aligned with a second first through-hole, and a third second through-hole aligned with a third first through-hole. The photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. A first color conversion structure is obtained by filling each group of second through-holes with the photoluminescent material layer. The color of the light emitted by the micro-LED unit differs from the color corresponding to the photoluminescent material layer by filling the first second through-hole in each group with the first-color photoluminescent material layer and filling the second second through-hole in each group with the second-color photoluminescent material layer. White light is obtained by combining the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color.

[0006] Further, before the second partition layer is disposed on the first partition layer, the method further includes: a first filling step, wherein a first intermediate structure is obtained upon completion of the first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first first through hole in each group of first through holes, the first filling portion including a first light filter layer that allows only light of a first color to pass through, a first light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a second filling portion in the second first through hole in each group of first through holes, the second filling portion including a second light filter layer that allows only light of a second color to pass through, a first light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a third filling portion in the third first through hole in each group of first through holes, the third filling portion including a third light filter layer that allows only light of a third color to pass through, a first light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0007] Further, each group of first through holes includes two first through holes. Before the second partition layer is disposed on the first partition layer, the method further includes: a second filling step, in which a second intermediate structure is obtained upon completion of the second filling step. The second filling step includes at least one of the following steps: filling one of the first through holes in each group of first through holes with a fourth filling portion, the fourth filling portion including a fourth light filter layer that allows only fourth color light to pass through, a first light-absorbing layer for partially absorbing third color light, or a transparent material; filling the other first through hole in each group of first through holes with a fifth filling portion, the fifth filling portion including a third light filter layer that allows only third color light to pass through, a first light-absorbing layer for partially absorbing third color light, or a transparent material.

[0008] Furthermore, the first reflective layer is used to partially reflect the third color light emitted by the micro-LED units. A first partition layer is disposed on the first reflective layer, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. This includes: disposing a first partition layer on the first reflective layer and opening a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes. A second partition layer is provided on a first partition layer, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole set includes: providing a second partition layer on the first partition layer and opening a second through-hole array on the second partition layer, such that the second through-hole array is aligned with the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes two second through-holes respectively aligned with two first through-holes in the corresponding first through-hole set. The photoluminescent material layer includes a fourth color photoluminescent material layer. The photoluminescent material layer is filled in each group of second through holes to obtain a first color conversion structure. The color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer. The fourth color photoluminescent material layer is filled in the second through hole in each group of second through holes that is aligned with the first through hole used to fill the fourth filling part. The light corresponding to the fourth color and the light corresponding to the third color are combined to obtain white light.

[0009] Furthermore, before setting the second barrier layer on the first barrier layer, the method further includes: setting a second light-absorbing layer on the first barrier layer, the second light-absorbing layer being used to partially absorb the light emitted by the micro LED unit. Setting the second barrier layer on the first barrier layer includes: setting the second barrier layer on the second light-absorbing layer.

[0010] Furthermore, when filling each group of second through holes with a photoluminescent material layer, the method further includes: filling the second through holes other than the second through holes filled with the photoluminescent material layer in each group of second through holes with a sixth filling portion, the sixth filling portion including a third light-absorbing layer, a photoluminescent material layer of a third color or a transparent material, the third light-absorbing layer being used to partially absorb the light emitted by the micro LED unit.

[0011] Furthermore, after filling each group of second through holes with a photoluminescent material layer, the method further includes: providing a second reflective layer on the second barrier layer and the photoluminescent material layer, wherein the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0012] Further, after filling the second through-holes other than the second through-holes filled with the photoluminescent material layer in each group of second through-holes with a sixth filling portion, the method further includes: providing an insulating layer on the second barrier layer, the photoluminescent material layer, and the sixth filling portion. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

[0013] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0014] According to another aspect of this disclosure, a micro LED device is also provided.

[0015] The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, which comprises a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: a first reflective layer for partially reflecting the light emitted by the micro-LED units; a first barrier layer disposed below the first reflective layer and including a first via array, the arrangement of which corresponds to the arrangement of the micro-LED unit array, wherein the first via array includes multiple sets of first vias, each set including at least two first vias; a second barrier layer disposed below the first barrier layer and including a second via array, the second via array corresponding to the first via array, wherein the second via array includes multiple sets of second vias corresponding to the multiple sets of first vias, the second vias in each set corresponding to the first vias in the corresponding first via group; and a photoluminescent material layer filling each set of second vias, wherein the color of the light emitted by the micro-LED units is different from the color corresponding to the photoluminescent material layer. The second barrier layer and the photoluminescent material layer of the second color conversion structure are disposed on the light-emitting side of the micro LED chip.

[0016] Furthermore, the first reflective layer is used to partially reflect the third color light emitted by the micro LED unit. Each group of first through holes includes three first through holes, namely a first first through hole, a second first through hole, and a third first through hole. Each group of second through holes includes three second through holes, namely a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole. The photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. The first color photoluminescent material layer fills the first second through hole in each group of second through holes, and the second color photoluminescent material layer fills the second second through hole in each group of second through holes. White light is obtained by combining the light corresponding to the first color, the light corresponding to the second color, and the third color.

[0017] Furthermore, the second color conversion structure further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: the first filling portion is used to fill the first first through hole in each group of first through holes, and the first filling portion includes a first light filter layer that allows only light of the first color to pass through, a first light-absorbing layer for partially absorbing light of the third color, or a transparent material; the second filling portion is used to fill the second first through hole in each group of first through holes, and the second filling portion includes a second light filter layer that allows only light of the second color to pass through, a first light-absorbing layer for partially absorbing light of the third color, or a transparent material; the third filling portion is used to fill the third first through hole in each group of first through holes, and the third filling portion includes a third light filter layer that allows only light of the third color to pass through, a first light-absorbing layer for partially absorbing light of the third color, or a transparent material.

[0018] Furthermore, the first color is red, the second color is green, and the third color is blue.

[0019] Furthermore, each group of first through holes includes two first through holes, and the second color conversion structure further includes at least one of a fourth filling part and a fifth filling part, wherein: the fourth filling part is used to fill one of the first through holes in each group of first through holes, and the fourth filling part includes a fourth filter layer that allows only the fourth color of light to pass through, a first light-absorbing layer for partially absorbing the third color of light, or a transparent material; the fifth filling part is used to fill the other first through hole in each group of first through holes, and the fifth filling part includes a third filter layer that allows only the third color of light to pass through, a first light-absorbing layer for partially absorbing the third color of light, or a transparent material.

[0020] Furthermore, the first reflective layer is used to partially reflect the third color light emitted by the micro LED unit. Each group of second through holes includes two second through holes that are respectively aligned with the two first through holes in the corresponding first through hole group. The photoluminescent material layer includes a fourth color photoluminescent material layer. The fourth color photoluminescent material layer fills the second through holes in each group of second through holes that are aligned with the first through holes used to fill the fourth filling portion. The light corresponding to the fourth color and the third color light are combined to obtain white light.

[0021] Furthermore, the fourth color is yellow and the third color is blue.

[0022] Furthermore, the second color conversion structure also includes a second light-absorbing layer, which is disposed below the first barrier layer. The second light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the second barrier layer is disposed below the second light-absorbing layer.

[0023] Furthermore, the second color conversion structure also includes a sixth filling portion, which includes a third light-absorbing layer, a photoluminescent material layer of a third color, or a transparent material. The sixth filling portion fills the second through holes in each group of second through holes other than the second through holes filled with the photoluminescent material layer. The third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0024] Furthermore, the second color conversion structure also includes a second reflective layer, which is disposed below the second barrier layer and the photoluminescent material layer. The second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0025] Furthermore, the second color conversion structure also includes an isolation layer, which is disposed below the second barrier layer, the photoluminescent material layer and the sixth filling portion, and the isolation layer of the second color conversion structure is disposed on the light-emitting side of the micro LED chip.

[0026] Furthermore, the micro LED chip structure also includes a driver chip, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure also includes a driver chip and a flexible circuit board, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0027] Furthermore, the first reflective layer includes a distributed Bragg reflector for partially reflecting blue light; the materials of the first barrier layer and the second barrier layer include visible light shielding materials; the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the material of the first light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; and the materials of the first filter layer, the second filter layer, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides.

[0028] According to another aspect of the present disclosure, a display device is also provided. The display device includes a miniature LED device prepared by the above-described method.

[0029] By applying the technical solution of this disclosure, a transparent substrate and a micro LED chip are obtained. A first reflective layer is disposed on the transparent substrate, which is used to partially reflect the light emitted by the micro LED unit. Then, a first barrier layer is disposed on the first reflective layer. Each group of first through holes included in the first barrier layer includes at least two first through holes. Next, a second barrier layer is disposed on the first barrier layer. The second through holes in each group of second through holes included in the second barrier layer correspond to the first through holes in the corresponding first through hole group. Then, a photoluminescent material layer is filled in each group of second through holes to form a first color conversion structure. The first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0030] On the one hand, in this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since the first reflective layer can partially reflect the light emitted by the micro-LED unit, the light emitted by the micro-LED unit that does not correspond to the photoluminescent material layer is reduced, which causes light overflow caused by the light emitted directly from the micro-LED device without passing through the photoluminescent material layer. Therefore, the color deviation and poor color purity caused by light overflow are reduced, thereby improving the uniformity of different colors of light emitted from the micro-LED device, improving the color purity of the micro-LED, and thus improving the display effect of the micro-LED device.

[0031] On the other hand, since the first reflective layer covers the photoluminescent material layer, if a portion of the light emitted by the micro-LED unit does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the first reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and re-participate in exciting the photoluminescent material layer. This increases the amount of light participating in exciting the photoluminescent material layer, thereby increasing the amount of light emitted in the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. Furthermore, it reduces the mixing output of the leaked portion of light with the different colors of light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device. Attached Figure Description

[0032] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0033] Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure;

[0034] Figures 2 to 13 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure. Detailed Implementation

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0037] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0038] Exemplary embodiments according to this disclosure will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions has been enlarged, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0039] This disclosure provides a method for fabricating a micro LED device. (Refer to...) Figures 1 to 13 , Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure; Figures 2 to 13 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure.

[0040] like Figure 1 As shown, the method for fabricating this micro LED device includes the following steps S101-S106.

[0041] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0042] Step S102: A first reflective layer is disposed on a transparent substrate, the first reflective layer being used to partially reflect the light emitted by the micro LED unit.

[0043] Step S103: A first partition layer is provided on the first reflective layer, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes.

[0044] Step S104: A second partition layer is provided on the first partition layer, such that the second partition layer includes a second through-hole array, the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set.

[0045] Step S105: Fill each group of second through holes with a photoluminescent material layer to obtain a first color conversion structure, wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer.

[0046] Step S106: Bond the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0047] According to this technical solution, a transparent substrate and a micro LED chip can be obtained. A first reflective layer is formed on the transparent substrate, which is used to partially reflect the light emitted by the micro LED unit. Then, a first barrier layer is formed on the first reflective layer. Each group of first through holes in the first barrier layer includes at least two first through holes. Next, a second barrier layer is formed on the first barrier layer. The second through holes in each group of second through holes in the second barrier layer correspond to the first through holes in the corresponding first through hole group. Then, a photoluminescent material layer is filled in each group of second through holes to form a first color conversion structure. The first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0048] On the one hand, in this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since the first reflective layer can partially reflect the light emitted by the micro-LED unit, the light emitted by the micro-LED unit that does not correspond to the photoluminescent material layer is reduced, which causes light overflow caused by the light emitted directly from the micro-LED device without passing through the photoluminescent material layer. Therefore, the color deviation and poor color purity caused by light overflow are reduced, thereby improving the uniformity of different colors of light emitted from the micro-LED device, improving the color purity of the micro-LED, and thus improving the display effect of the micro-LED device.

[0049] On the other hand, since the first reflective layer covers the photoluminescent material layer, if a portion of the light emitted by the micro-LED unit does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the first reflective layer can reflect the leaked portion of light back to the photoluminescent material layer and re-participate in exciting the photoluminescent material layer. This increases the amount of light participating in exciting the photoluminescent material layer, thereby increasing the amount of light emitted in the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED. Furthermore, it reduces the mixing output of the leaked portion of light with the different colors of light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0050] In step S101, a transparent substrate and a micro LED chip structure can be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0051] According to embodiments of this disclosure, a transparent substrate and a micro-LED chip structure can be obtained first. The transparent substrate may include any suitable substrate such as a glass substrate, a polyimide substrate, or a sapphire substrate. The micro-LED chip structure includes a micro-LED chip, which comprises an array of micro-LED units for emitting light. The micro-LED chip can be any micro-LED chip suitable for fabricating a micro-LED device; for example, the structure of the micro-LED chip may include a right-mounted structure, a flip-chip structure, or a vertical structure, etc., without limitation. Each micro-LED unit in the micro-LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro-LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro-LED chip structure can also be obtained in any step prior to the subsequent step of using the micro-LED chip structure.

[0052] Reference Figures 2-13 ,in Figure 2 A side view of a transparent substrate 101 according to an embodiment of the present disclosure is shown. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0053] Reference Figures 2-13 ,in Figure 3 A side view of a microLED chip structure according to an embodiment of the present disclosure is shown. Figure 3As shown, the micro-LED chip structure includes a micro-LED chip 20, which comprises a micro-LED unit array 201 composed of micro-LED units 2011. Each micro-LED unit 2011 in the micro-LED unit array 201 includes, for example, a first semiconductor layer 20111 of N-GaN layer on the light-emitting side. Figure 3 As shown, the first semiconductor layer 20111 is shared by each micro-LED unit 2011 in the micro-LED unit array 201, that is, the first semiconductor layer 20111 is integrated into the micro-LED chip 20.

[0054] In step S102, a first reflective layer may be provided on the transparent substrate. The first reflective layer is used to partially reflect the light emitted by the micro LED unit.

[0055] According to embodiments of this disclosure, after obtaining a transparent substrate, a first reflective layer can be formed on the transparent substrate. The first reflective layer is used to partially reflect the light emitted by the micro-LED unit, such that a portion of the light emitted by the micro-LED unit is reflected when passing through a first light-absorbing layer. The first reflective layer may include a distributed Bragg reflector film for partially reflecting the light emitted by the micro-LED unit, and may also include any material layer for reflecting the light emitted by the micro-LED unit. For example, the first reflective layer may be a distributed Bragg reflector film formed by alternating stacks of silicon dioxide and titanium dioxide layers. The first reflective layer may be used to partially reflect a third color of light emitted by the micro-LED unit, such as blue light.

[0056] Reference Figures 2-13 ,in Figure 4 A side view schematic diagram of a first reflective layer 102 disposed on a transparent substrate 101 is shown. Figure 4 As shown, a first reflective layer 102, such as a distributed Bragg reflector, is disposed on a transparent substrate 101. The first reflective layer 102 is used to partially reflect, for example, blue light emitted by the micro-LED unit.

[0057] In step S103, a first partition layer can be provided on the first reflective layer, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes.

[0058] According to embodiments of this disclosure, after the first reflective layer is provided, a first barrier layer can be provided on the first reflective layer. The first barrier layer may include a visible light shielding material, such as a matting material like black photoresist or a reflective material like a metal layer.

[0059] According to one embodiment of the first partition layer of this disclosure, each group of first through holes includes three first through holes. The first partition layer is disposed on the first reflective layer, such that the first partition layer includes a first through hole array. The arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array. The first through hole array includes multiple groups of first through holes, and each group of first through holes includes at least two first through holes. The first partition layer is disposed on the first reflective layer and a first through hole array is formed on the first partition layer, such that the arrangement of the first through hole array corresponds to the arrangement of the micro LED unit array. The first through hole array includes multiple groups of first through holes, and each group of first through holes includes a first first through hole, a second first through hole, and a third first through hole.

[0060] According to another embodiment of the first partition layer of this disclosure, a first partition layer is disposed on a first reflective layer, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The first partition layer is disposed on the first reflective layer and a first through-hole array is formed on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes.

[0061] Reference Figures 2-13 ,in Figure 5 A side view schematic diagram of a first barrier layer 103 disposed on a first reflective layer 102 is shown. Figure 5 As shown, the first barrier layer 103 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be coated onto, for example, the first reflective layer 102 of a distributed Bragg reflector film using spin coating. Then, for example, a first via array 1030 can be formed on the black photoresist layer by photolithography, such that the arrangement of the first via array 1030 corresponds to the arrangement of the subsequent micro-LED unit array 201 and exposes the first reflective layer 102. The first via array 1030 includes multiple sets of first vias, each set including a first first via 1031, a second first via 1032, and a third first via 1033. For clarity and brevity, Figure 5 Only one set of first through holes is shown in the first through hole array 1030, which includes a first first through hole 1031, a second first through hole 1032, and a third first through hole 1033. Figure 5The number of groups of first vias and the number of first vias in each group shown are merely illustrative and are not intended to be limiting. A first barrier layer 103, such as a black photoresist layer, can make the screen appear black when the display device is powered off or turned off.

[0062] In step S104, a second partition layer can be provided on the first partition layer, such that the second partition layer includes a second through-hole array, the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set.

[0063] According to embodiments of this disclosure, after preparing the first barrier layer, a second barrier layer can be disposed on the first barrier layer. The second barrier layer can function as a grid, and the interior of the grid can be filled with a corresponding material. In some embodiments, the second barrier layer may include a visible light shielding material, such as a matting material like black photoresist or a reflective material like a metal layer.

[0064] Referring to an embodiment of the first partition layer in step S103, according to an embodiment of the second partition layer of this disclosure, a second partition layer is provided on the first partition layer, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole set includes: providing the second partition layer on the first partition layer and opening the second through-hole array on the second partition layer, such that the second through-hole array is aligned with the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, each set of second through-holes includes three second through-holes, the three second through-holes including a first second through-hole aligned with a first first through-hole, a second second through-hole aligned with a second first through-hole, and a third second through-hole aligned with a third first through-hole.

[0065] Further, before the second partition layer is disposed on the first partition layer, the method further includes: a first filling step, wherein a first intermediate structure is obtained upon completion of the first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first first through hole in each group of first through holes, the first filling portion including a first light filter layer that allows only light of a first color to pass through, a first light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a second filling portion in the second first through hole in each group of first through holes, the second filling portion including a second light filter layer that allows only light of a second color to pass through, a first light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a third filling portion in the third first through hole in each group of first through holes, the third filling portion including a third light filter layer that allows only light of a third color to pass through, a first light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0066] In this embodiment, the first color of light refers to the light within the wavelength range corresponding to the first color, the second color of light refers to the light within the wavelength range corresponding to the second color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The first color can be red, the second color can be green, and the third color can be blue. The material of the first light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist. The materials of the first filter layer, the second filter layer, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides.

[0067] Referring to another embodiment of the first partition layer in step S103, according to another embodiment of the second partition layer of this disclosure, a second partition layer is provided on the first partition layer, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole group includes: providing the second partition layer on the first partition layer and opening the second through-hole array on the second partition layer, such that the second through-hole array is aligned with the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes two second through-holes respectively aligned with two first through-holes in the corresponding first through-hole group.

[0068] Further, each group of first through holes includes two first through holes. Before the second partition layer is disposed on the first partition layer, the method further includes: a second filling step, in which a second intermediate structure is obtained upon completion of the second filling step. The second filling step includes at least one of the following steps: filling one of the first through holes in each group of first through holes with a fourth filling portion, the fourth filling portion including a fourth light filter layer that allows only fourth color light to pass through, a first light-absorbing layer for partially absorbing third color light, or a transparent material; filling the other first through hole in each group of first through holes with a fifth filling portion, the fifth filling portion including a third light filter layer that allows only third color light to pass through, a first light-absorbing layer for partially absorbing third color light, or a transparent material.

[0069] In this embodiment, the fourth color of light refers to the light within the wavelength range corresponding to the fourth color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The fourth color can be yellow, and the third color can be blue. The material of the first light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for partially absorbing the third color of light, such as blue light; for example, it can be zinc oxide nanoparticle photoresist. The materials of the third and fourth light-filtering layers include organic dyes, nano-absorbing particles, or inorganic oxides.

[0070] According to embodiments of this disclosure, before depositing the second barrier layer on the first barrier layer, the method further includes: depositing a second light-absorbing layer on the first barrier layer, the second light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Depositing the second barrier layer on the first barrier layer includes: depositing the second barrier layer on the second light-absorbing layer. The material of the second light-absorbing layer may include organic dyes, nano-absorbing particles, or inorganic oxides for partially absorbing a third color of light, such as blue light, for example, zinc oxide nanoparticle photoresist.

[0071] Reference Figures 2-13 ,in Figure 6 A side view schematic diagram of the filling portion in each group of first through holes is shown. (Combined with...) Figure 5 ,like Figure 6 As shown, a first filling portion is filled in the first first through-hole 1031 of each group of first through-holes. This first filling portion may include a first filter layer 1041 that only allows light of a first color, such as red, to pass through. A second filling portion is filled in the second first through-hole 1032 of each group of first through-holes. This second filling portion may include a second filter layer 1042 that only allows light of a second color, such as green, to pass through. A first light-absorbing layer 1043 is filled in the third first through-hole 1033 of each group of first through-holes. This first light-absorbing layer 1043 is used to partially absorb light of a third color, such as blue, to obtain... Figure 5The first intermediate structure 30 is shown. It is worth noting that in other embodiments, when there are unfilled first through holes in each group of first through holes, transparent material can be filled into the unfilled first through holes to support the portion above the corresponding first through holes in subsequent fabrication processes that require support. The transparent material can be, for example, any suitable material such as transparent resin.

[0072] Reference Figures 2-13 ,in Figure 7 A side view schematic diagram of a second light-absorbing layer 105 disposed on the first intermediate structure 30 is shown. Figure 7 As shown, a second light-absorbing layer 105 is disposed on the first intermediate structure 30. This second light-absorbing layer 105 is used to partially absorb, for example, blue light emitted by the micro LED unit. The material of the second light-absorbing layer 105 can be the same as the material of the first light-absorbing layer 1043.

[0073] Reference Figures 2-13 ,in Figure 8 A side view schematic diagram of a second barrier layer 106 disposed on a second light-absorbing layer 105 is shown. Figure 8 As shown, the second barrier layer 106 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be coated onto the second light-absorbing layer 105 using a spin-coating method. Then, for example, a second via array 1060 can be formed on the black photoresist layer by photolithography, such that the second via array 1060 is aligned with the first via array 1030, and the second via array 1060 exposes a portion of the second light-absorbing layer 105. The second via array 1060 includes multiple sets of second vias corresponding to multiple sets of first vias. Each set of second vias includes a first second via 1061 aligned with the first first via 1031, a second second via 1062 aligned with the second first via 1032, and a third second via 1063 aligned with the third first via 1033, resulting in the following... Figure 8 The structure shown.

[0074] In step S105, a photoluminescent material layer can be filled into each group of second through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0075] According to embodiments of this disclosure, after obtaining the second through-hole array described above, a photoluminescent material layer can be filled into the second through-hole array.

[0076] Referring to an embodiment of the first partition layer in step S103 and an embodiment of the second partition layer and the filling of the first through-hole in step S104, according to an embodiment of the photoluminescent material layer filled in this disclosure, the photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. A first color conversion structure is obtained by filling the photoluminescent material layer in each group of second through-holes. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, which includes filling the first color photoluminescent material layer in the first second through-hole in each group of second through-holes and filling the second color photoluminescent material layer in the second second through-hole in each group of second through-holes. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0077] In this embodiment, the first color, the second color, and the third color can be three primary colors, for example, the first color is red, the second color is green, and the third color is blue. The materials of the photoluminescent material layer of the first color and the photoluminescent material layer of the second color include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0078] Referring to another embodiment of the first partition layer in step S103 and another embodiment of the second partition layer and the filling of the first through-hole in step S104, according to another embodiment of the photoluminescent material layer of the present disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color. The photoluminescent material layer is filled in each group of second through-holes to obtain a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, which includes filling the second through-hole of each group of second through-holes that is aligned with the first through-hole for filling the fourth filling portion with a photoluminescent material layer of the fourth color. The light corresponding to the fourth color and the light corresponding to the third color are combined to obtain white light.

[0079] In this embodiment, the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0080] According to embodiments of this disclosure, when filling each group of second vias with a photoluminescent material layer, the method further includes: filling a sixth filling portion in the second vias other than those filled with the photoluminescent material layer, wherein the sixth filling portion includes a third light-absorbing layer, a third-color photoluminescent material layer, or a transparent material, the third light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. The material of the third light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, and the material of the third light-absorbing layer can be the same as the material of the first and second light-absorbing layers, for example, zinc oxide nanoparticle photoresist. Additionally, the sixth filling portion may also include, for example, a third-color photoluminescent material layer of blue, the material of which includes at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0081] According to embodiments of this disclosure, after filling each group of second vias with a photoluminescent material layer, the method further includes: disposing a second reflective layer on the second barrier layer and the photoluminescent material layer, the second reflective layer being used to reflect light of the color corresponding to the photoluminescent material layer. The second reflective layer may include a distributed Bragg reflector film for reflecting light of the color corresponding to the photoluminescent material layer, and may also include any material layer for reflecting light of the color corresponding to the photoluminescent material layer. For example, the second reflective layer may be a distributed Bragg reflector film formed by alternating stacks of silicon dioxide layers and titanium dioxide layers. It is worth noting that although the second reflective layer, like the first reflective layer, is a distributed Bragg reflector film formed by alternating stacks of silicon dioxide layers and titanium dioxide layers, the number of silicon dioxide and titanium dioxide layers in the second reflective layer, as well as the thickness of each silicon dioxide layer and each titanium dioxide layer, are different from those in the first reflective layer.

[0082] According to an embodiment of this disclosure, after filling a sixth filling portion in a second through hole other than the second through hole filled with a photoluminescent material layer in each group of second through holes, the method further includes: providing an insulating layer on the second partition layer, the photoluminescent material layer and the sixth filling portion.

[0083] Reference Figures 2-13 ,in Figure 9 A side view schematic diagram of the photoluminescent material layer filling each group of second through-holes is shown. (Combined with...) Figure 8 ,like Figure 9 As shown, the first second through hole 1061 in each group of second through holes is filled with a photoluminescent material layer 1071 of a first color, such as red, and the second second through hole 1062 in each group of second through holes is filled with a photoluminescent material layer 1072 of a second color, such as green.

[0084] Reference Figures 2-13 ,in Figure 10 This diagram shows a side view of a sixth filling portion, located in a second through-hole other than the second through-hole filled with a photoluminescent material layer in each group of second through-holes. (Combined with...) Figure 8 and Figure 9 ,like Figure 10 As shown, the sixth filling portion is, for example, the third light-absorbing layer 1073, which is filled in the third second through-hole 1063 aligned with the third first through-hole 1033 for partially absorbing, for example, blue light. The material of the third light-absorbing layer 1073 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, and the material of the third light-absorbing layer 1073 can be the same as the material of the first light-absorbing layer 1043 and the second light-absorbing layer 105. It is worth noting that the filling order of the first color photoluminescent material layer 1071, the second color photoluminescent material layer 1072, and the third light-absorbing layer 1073 is only exemplary and is not limited here. The filling order of the first color photoluminescent material layer 1071, the second color photoluminescent material layer 1072, and the third light-absorbing layer 1073 can be arbitrarily adjusted according to the specific process, equipment, and other actual preparation conditions. The sixth filling section may also include a third color photoluminescent material layer, such as blue, so that the third color light emitted by the micro LED unit, such as blue light, excites the third color photoluminescent material layer to emit third color light, such as blue light.

[0085] Reference Figures 2-13 ,in Figure 11 A side view schematic diagram is shown, illustrating the insulating layer disposed on the second barrier layer, the photoluminescent material layer, and the sixth filling portion. (See diagram below.) Figure 11 As shown, a barrier layer 108, such as a silicon dioxide layer, can be deposited on the second barrier layer 106, the first photoluminescent material layer 1071, the second photoluminescent material layer 1072, and the third light-absorbing layer 1073 using plasma-enhanced chemical vapor deposition (PECVD) to obtain the barrier layer 108. Figure 11 The first color conversion structure 10 is shown. Of course, the insulating layer can also include any other suitable materials, such as any suitable organic polymers and inorganic oxides, and any suitable fabrication process can be used to prepare the insulating layer for different materials. The insulating layer is used to protect the other parts of the first color conversion structure and can also serve as a surface layer of the first color conversion structure, making the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure to the micro-LED chip.

[0086] In step S106, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0087] According to embodiments of this disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0088] Furthermore, when an isolation layer is provided on the second barrier layer, the photoluminescent material layer, and the sixth filling portion, bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro-LED chip includes: bonding the isolation layer of the first color conversion structure to the light-emitting side of the micro-LED chip.

[0089] Furthermore, each micro-LED unit in the micro-LED unit array includes a first semiconductor layer on the light-emitting side, and bonding the isolation layer of the first color conversion structure to the light-emitting side of the micro-LED chip includes: bonding the isolation layer of the first color conversion structure to the first semiconductor layer.

[0090] According to an embodiment of this disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0091] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0092] Reference Figures 2-13 ,in Figure 12 A side view showing the bonding of a first color conversion structure 10 to a microLED chip 20 according to an embodiment of the present disclosure is shown. Figure 12 As shown, the insulating layer 108 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the micro-LED chip 20, resulting in the following... Figure 12 The structure shown.

[0093] Reference Figures 2-13 ,in Figure 13 A side view of a micro LED device 1 according to an embodiment of the present disclosure is shown. Figure 13 As shown, remove Figure 12The transparent substrate 101 of the first color conversion structure 10 in the structure shown obtains the second color conversion structure 11 through the first color conversion structure 10, resulting in the following... Figure 13 The micro LED device 1 shown.

[0094] Reference Figures 2 to 13 It should be understood that the third color light emitted by the micro-LED unit 2011, such as blue light, excites the first color photoluminescent material layer 1071, such as red light, to emit red light. The third color light emitted by the micro-LED unit 2011, such as blue light, excites the second color photoluminescent material layer 1072, such as green light, to emit green light. The third color light emitted by the micro-LED unit corresponding to the third second through-hole 1063, such as blue light, is partially reflected when it passes through the first reflective layer 102, but some blue light still passes through the first reflective layer 102. The first color light, such as red light, the second color light, such as green light, and the third color light, such as blue light, emitted after passing through the photoluminescent material layer and the first reflective layer 102 can be combined to obtain white light. Therefore, by providing a first reflective layer that partially reflects, for example, blue light emitted by the micro-LED unit, the blue light overflow caused by the direct emission of blue light from the micro-LED device from the micro-LED unit corresponding to the third second through-hole can be reduced. This reduces color shift and poor color purity caused by blue light overflow, thereby improving the uniformity of different colors of light emitted from the micro-LED device, enhancing the color purity of the micro-LED, and thus improving the display effect of the micro-LED device. Furthermore, since the first reflective layer 102 covers a photoluminescent material layer 1071 of a first color, such as red, and a photoluminescent material layer 1072 of a second color, such as green, when a portion of the blue light emitted by the micro-LED unit corresponding to the photoluminescent material layer does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the first reflective layer 102 can reflect the leaked blue light towards the photoluminescent material layer. This reduces the mixing and output of the leaked blue light with the red and green light emitted by exciting the photoluminescent material layer, thereby enhancing the color purity of the micro-LED and improving the display effect of the micro-LED device.

[0095] Furthermore, since the third first through hole 1033 is aligned with the third second through hole 1063, when the third first through hole 1033 is filled with the first light-absorbing layer 1043, the first light-absorbing layer 1043 can partially absorb, for example, blue light emitted by the micro LED unit 2011 corresponding to the third first through hole, thereby further reducing the blue light overflow caused by the blue light emitted directly from the micro LED device, thus further improving the display effect of the micro LED device.

[0096] Furthermore, regarding the second light-absorbing layer 105, it can partially absorb, for example, blue light emitted by the micro-LED unit 2011 corresponding to the third first through-hole, thereby further reducing blue light overflow caused by the direct emission of blue light from the micro-LED device, thus further improving the display effect of the micro-LED device. Also, since the second light-absorbing layer 105 covers the photoluminescent material layer, when a portion of the blue light emitted by the micro-LED unit corresponding to the photoluminescent material layer leaks through the photoluminescent material layer without participating in the excitation of the photoluminescent material layer, the second light-absorbing layer 105 can absorb this leaked portion of blue light. This reduces the mixing and output of the leaked blue light with the red and green light emitted from the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus enhancing the display effect of the micro-LED device.

[0097] Furthermore, when the third light-absorbing layer 1073 is filled in the third third through hole 1063, the third light-absorbing layer 1073 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1063, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly from the micro LED device, thus further improving the display effect of the micro LED device.

[0098] Furthermore, regarding the second reflective layer, this second reflective layer is disposed on the second barrier layer, the photoluminescent material layer, and the sixth filling portion. The barrier layer can be disposed on the second reflective layer and located between the second reflective layer and the microLED chip. Therefore, the second reflective layer can cover, for example, the first color photoluminescent material layer, the second color photoluminescent material layer, and, for example, the sixth filling portion of the third light-absorbing layer. Since the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, light emitted from the microLED unit, for example, blue light, can pass through the second reflective layer. When the blue light emitted by the microLED unit excites, for example, the first color photoluminescent material layer (red) to emit red light, a portion of the emitted red light will be emitted towards the microLED unit. The second reflective layer can reflect this portion of red light towards the first color photoluminescent material layer (red), thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the microLED and preventing light from emitting towards the microLED chip. The red light emitted from the D unit direction partially interferes with the blue light emitted by the micro-LED unit. Similarly, when the blue light emitted by the micro-LED unit excites a second-color photoluminescent material layer (e.g., green) to emit green light, a portion of this excited green light is emitted towards the micro-LED unit. The second reflective layer can reflect this portion of green light towards the second-color photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro-LED and preventing the portion of green light emitted towards the micro-LED unit from interfering with the blue light emitted by the micro-LED unit. It is worth noting that when the first through-hole 1031 is filled with the first filter layer 1041 and the second through-hole 1032 is filled with the second filter layer 1042, the first filter layer 1041 only allows light of the first color (e.g., red) to pass through, and the first filter layer 1041 reflects light of the third color (e.g., blue) towards the first-color photoluminescent material layer 1071 (e.g., red). The second filter layer 1042 only allows light of a second color, such as green, to pass through, while reflecting light of a third color, such as blue, towards the photoluminescent material layer 1072 of the second color, such as green. Therefore, the function of the first filter layer 1041 and the second filter layer 1042 is to reflect light other than the corresponding color, which is different from the light absorption function of the first, second, and third light-absorbing layers.

[0099] It is worth noting that when the material of the second barrier layer is transparent, the number of second through holes in each group of second through holes can be different from the number of first through holes in the corresponding group of first through holes. For example, if each group of first through holes includes a first first through hole, a second first through hole, and a third first through hole, the corresponding group of second through holes can include a first second through hole aligned with the first first through hole and a second second through hole aligned with the second first through hole. A photoluminescent material layer can be filled in the first and second second through holes. Since the second barrier layer is transparent, light emitted by the micro-LED unit that does not correspond to the photoluminescent material layer can pass through the transparent second barrier layer and be emitted from the micro-LED device.

[0100] This disclosure also provides a miniature LED device.

[0101] like Figures 2-13 As shown, the micro-LED device 1 includes a second color conversion structure 11 and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip 20, which includes a micro-LED unit array 201 composed of multiple micro-LED units 2011. The second color conversion structure 11 includes: a first reflective layer 102, which partially reflects the light emitted by the micro-LED units 2011; and a first barrier layer 103, which is disposed below the first reflective layer 102 and includes a first through-hole array 1030, the arrangement of which corresponds to the arrangement of the micro-LED unit array 201. The first via array 1030 includes multiple sets of first vias, each set including at least two first vias; a second partition layer 106 is disposed below the first partition layer 103 and includes a second via array 1060, which corresponds to the first via array 1030, wherein the second via array 1060 includes multiple sets of second vias corresponding to the multiple sets of first vias, and the second vias in each set of second vias correspond to the first vias in the corresponding set of first vias; a photoluminescent material layer is filled in each set of second vias, wherein the color of the light emitted by the micro-LED unit 2011 is different from the color corresponding to the photoluminescent material layer. The second partition layer 106 and the photoluminescent material layer of the second color conversion structure 11 are disposed on the light-emitting side of the micro-LED chip 20.

[0102] According to embodiments of this disclosure, the first reflective layer 102 is used to partially reflect the third color light emitted by the micro LED unit 2011. Each group of first through holes includes three first through holes, namely a first first through hole 1031, a second first through hole 1032, and a third first through hole 1033. Each group of second through holes includes three second through holes, namely a first second through hole 1061 aligned with the first first through hole 1031, a second second through hole 1062 aligned with the second first through hole 1032, and a third first through hole 1033 aligned with the third first through hole 1033. The third second through-hole 1063 is aligned with the through-hole 1033. The photoluminescent material layer includes a first color photoluminescent material layer 1071 and a second color photoluminescent material layer 1072. The first color photoluminescent material layer 1071 fills the first second through-hole 1061 in each group of second through-holes, and the second color photoluminescent material layer 1072 fills the second second through-hole 1062 in each group of second through-holes. White light is obtained by combining the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color.

[0103] According to embodiments of this disclosure, the second color conversion structure 11 further includes at least one of a first filling portion, a second filling portion, and a third filling portion, wherein: the first filling portion is used to fill the first first through-hole 1031 in each group of first through-holes, and the first filling portion includes a first light filter layer 1041 that allows only light of the first color to pass through, a first light-absorbing layer for partially absorbing light of the third color, or a transparent material; the second filling portion is used to fill the second first through-hole 1032 in each group of first through-holes, and the second filling portion includes a second light filter layer 1042 that allows only light of the second color to pass through, a first light-absorbing layer for partially absorbing light of the third color, or a transparent material; the third filling portion is used to fill the third first through-hole 1033 in each group of first through-holes, and the third filling portion includes a third light filter layer that allows only light of the third color to pass through, a first light-absorbing layer 1043 for partially absorbing light of the third color, or a transparent material.

[0104] According to embodiments of this disclosure, the first color is red, the second color is green, and the third color is blue.

[0105] According to embodiments of this disclosure, each group of first through holes includes two first through holes, and the second color conversion structure further includes at least one of a fourth filling portion and a fifth filling portion, wherein: the fourth filling portion is used to fill one of the first through holes in each group of first through holes, and the fourth filling portion includes a fourth light filter layer that allows only fourth color light to pass through, a first light-absorbing layer for partially absorbing third color light, or a transparent material; the fifth filling portion is used to fill the other first through hole in each group of first through holes, and the fifth filling portion includes a third light filter layer that allows only third color light to pass through, a first light-absorbing layer for partially absorbing third color light, or a transparent material.

[0106] According to an embodiment of this disclosure, the first reflective layer is used to partially reflect the third color light emitted by the micro LED unit, each group of second through holes includes two second through holes respectively aligned with two first through holes in the corresponding first through hole group, the photoluminescent material layer includes a fourth color photoluminescent material layer, the fourth color photoluminescent material layer fills the second through holes in each group of second through holes aligned with the first through holes for filling the fourth filling portion, and white light is obtained by combining the fourth color light and the third color light.

[0107] According to an embodiment of this disclosure, the fourth color is yellow and the third color is blue.

[0108] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a second light-absorbing layer 105, which is disposed below the first barrier layer 103. The second light-absorbing layer 105 is used to partially absorb the light emitted by the micro LED unit 2011, and the second barrier layer 106 is disposed below the second light-absorbing layer 105.

[0109] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a sixth filling portion, which includes a third light-absorbing layer 1073, a photoluminescent material layer of a third color, or a transparent material. The sixth filling portion fills the second through holes in each group of second through holes other than the second through holes filled with the photoluminescent material layer. The third light-absorbing layer 1073 is used to partially absorb the light emitted by the micro LED unit 2011.

[0110] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a second reflective layer disposed below the second barrier layer 106 and the photoluminescent material layer, and the second reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0111] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes an insulating layer 108, which is disposed below the second barrier layer 106, the photoluminescent material layer and the sixth filling portion, and the insulating layer 108 of the second color conversion structure 11 is disposed on the light-emitting side of the micro LED chip 20.

[0112] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip 20 opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip 20 opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0113] According to embodiments of this disclosure, the material of the first reflective layer 102 includes a distributed Bragg reflector for partially reflecting blue light; the materials of the first barrier layer 103 and the second barrier layer 106 include visible light shielding materials; the materials of the first color photoluminescent material layer 1071 and the second color photoluminescent material layer 1072 include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the material of the first light-absorbing layer 1043 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; and the materials of the first filter layer 1041, the second filter layer 1042, and the third filter layer include organic dyes, nano-absorbing particles, or inorganic oxides.

[0114] It is worth noting that any relevant descriptions of the micro-LED device in the above-mentioned micro-LED device fabrication method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro-LED device disclosed herein.

[0115] According to embodiments of this disclosure, the pixel size in a micro-LED device is typically less than 50 micrometers.

[0116] This disclosure also provides a display device including the aforementioned LED device. This display device can be applied to flexible electronic devices to realize technologies such as Augmented Reality (AR), Virtual Reality (VR), Extended Reality (XR), and Mixed Reality (MR). For example, the micro-LED device can be a projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the micro-LED device can be a display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen.

[0117] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0118] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above steps / processes do not imply a sequential order of execution; the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. Moreover, the above embodiment numbers are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0119] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0120] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A method of fabricating a micro-LED device, wherein, The method comprises: acquiring a transparent substrate and a micro-LED chip structure, wherein the micro-LED chip structure comprises a micro-LED chip, and the micro-LED chip comprises a micro-LED unit array composed of a plurality of micro-LED units; disposing a first reflection layer on the transparent substrate, the first reflection layer being used for partially reflecting light emitted by the micro-LED units; disposing a first partition layer on the first reflection layer, so that the first partition layer comprises a first through hole array, and an arrangement of the first through hole array corresponds to an arrangement of the micro-LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes; disposing a second partition layer on the first partition layer, so that the second partition layer comprises a second through hole array, and the second through hole array corresponds to the first through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and a second through hole in each group of second through holes corresponds to a first through hole in a corresponding group of first through holes; filling a photo-luminescent material layer in each group of second through holes to obtain a first color conversion structure, wherein a color of light emitted by the micro-LED units is different from a color corresponding to the photo-luminescent material layer; bonding a side, opposite to the transparent substrate, of the first color conversion structure to a light-emitting side of the micro-LED chip to obtain a micro-LED device. 2.The micro-LED device fabrication method of claim 1, wherein, The first reflection layer is used for partially reflecting light of a third color emitted by the micro-LED units, each group of first through holes comprises three first through holes, and disposing the first partition layer on the first reflection layer so that the first partition layer comprises the first through hole array, and an arrangement of the first through hole array corresponds to an arrangement of the micro-LED unit array comprises: disposing the first partition layer on the first reflection layer and opening the first through hole array on the first partition layer, so that an arrangement of the first through hole array corresponds to an arrangement of the micro-LED unit array, wherein the first through hole array comprises a plurality of groups of first through holes, and each group of first through holes comprises a first first through hole, a second first through hole and a third first through hole, disposing the second partition layer on the first partition layer so that the second partition layer comprises the second through hole array, and the second through hole array corresponds to the first through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and a second through hole in each group of second through holes corresponds to a first through hole in a corresponding group of first through holes comprises: disposing the second partition layer on the first partition layer and opening the second through hole array on the second partition layer, so that the second through hole array is aligned with the first through hole array, wherein the second through hole array comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises three second through holes, the three second through holes comprising a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole, The photoluminescence material layer includes a first color photoluminescence material layer and a second color photoluminescence material layer, and the photoluminescence material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescence material layer includes: filling the first color photoluminescence material layer in the first second through hole in each group of second through holes, and filling the second color photoluminescence material layer in the second second through hole in each group of second through holes, the first color light, the second color light and the third color light are synthesized to obtain white light. 3.The micro-LED device fabrication method of claim 2, wherein, Before the second partition layer is arranged on the first partition layer, the method further comprises: The first filling step, when the first filling step is completed, a first intermediate structure is obtained, and the first filling step comprises at least one of the following steps: filling a first filling part in the first first through hole in each group of first through holes, the first filling part comprising a first filter layer allowing only the first color light to pass through, a first light absorbing layer for partially absorbing the third color light, or a transparent material; filling a second filling part in the second first through hole in each group of first through holes, the second filling part comprising a second filter layer allowing only the second color light to pass through, a first light absorbing layer for partially absorbing the third color light, or a transparent material; filling a third filling part in the third first through hole in each group of first through holes, the third filling part comprising a third filter layer allowing only the third color light to pass through, a first light absorbing layer for partially absorbing the third color light, or a transparent material. 4.The micro-LED device fabrication method of claim 1, wherein, Each group of first through holes includes two first through holes, and before the second partition layer is arranged on the first partition layer, the method further comprises: The second filling step, when the second filling step is completed, a second intermediate structure is obtained, and the second filling step comprises at least one of the following steps: filling a fourth filling part in one of the first through holes in each group of first through holes, the fourth filling part comprising a fourth filter layer allowing only the fourth color light to pass through, a first light absorbing layer for partially absorbing the third color light, or a transparent material; filling a fifth filling part in the other first through hole in each group of first through holes, the fifth filling part comprising a third filter layer allowing only the third color light to pass through, a first light absorbing layer for partially absorbing the third color light, or a transparent material. 5.The micro-LED device fabrication method of claim 4, wherein, The first reflective layer is configured to partially reflect the third color light emitted by the micro-LED units, and a first barrier layer is arranged on the first reflective layer, so that the first barrier layer comprises a first array of through holes, and the arrangement of the first array of through holes corresponds to the arrangement of the array of micro-LED units, wherein the first array of through holes comprises a plurality of groups of first through holes, and each group of first through holes comprises at least two first through holes, and the method comprises: arranging the first barrier layer on the first reflective layer and opening the first array of through holes on the first barrier layer, so that the arrangement of the first array of through holes corresponds to the arrangement of the array of micro-LED units, and wherein the first array of through holes comprises a plurality of groups of first through holes, and each group of first through holes comprises two first through holes, The second barrier layer is arranged on the first barrier layer, so that the second barrier layer comprises a second array of through holes, and the second array of through holes corresponds to the first array of through holes, wherein the second array of through holes comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and the second through hole in each group of second through holes corresponds to the first through hole in the corresponding group of first through holes, and the method comprises: arranging the second barrier layer on the first barrier layer and opening the second array of through holes on the second barrier layer, so that the second array of through holes is aligned with the first array of through holes, and wherein the second array of through holes comprises a plurality of groups of second through holes corresponding to the plurality of groups of first through holes, and each group of second through holes comprises two second through holes respectively aligned with the two first through holes in the corresponding group of first through holes, The photoluminescence material layer comprises a fourth color photoluminescence material layer, and the photoluminescence material layer is filled in each group of second through holes to obtain a first color conversion structure, wherein the color of the light emitted by the micro-LED units is different from the color corresponding to the photoluminescence material layer, and the method comprises: filling the fourth color photoluminescence material layer in the second through hole in each group of second through holes that is aligned with the first through hole used to fill the fourth filling part, and synthesizing white light corresponding to the fourth color light and the third color light. 6.The micro-LED device fabrication method of claim 1, wherein, Before arranging the second barrier layer on the first barrier layer, the method further comprises: arranging a second light-absorbing layer on the first barrier layer, and the second light-absorbing layer is configured to partially absorb the light emitted by the micro-LED units. Arranging the second barrier layer on the first barrier layer comprises: arranging the second barrier layer on the second light-absorbing layer. 7.The micro-LED device fabrication method of claim 1, wherein, When filling the photoluminescence material layer in each group of second through holes, the method further comprises: Filling a sixth filling part in the second through hole in each group of second through holes except the second through hole filled with the photoluminescence material layer, and the sixth filling part comprises a third light-absorbing layer, a third color photoluminescence material layer, or a transparent material, and the third light-absorbing layer is configured to partially absorb the light emitted by the micro-LED units. 8.The micro-LED device fabrication method of claim 7, wherein, After filling the sixth filling part in the second through hole in each group of second through holes except the second through hole filled with the photoluminescence material layer, the method further comprises: arranging an insulating layer on the second barrier layer, the photoluminescence material layer, and the sixth filling part, Bonding the side of the first color conversion structure opposite to the transparent substrate with the light-emitting side of the micro-LED chip includes bonding the isolation layer of the first color conversion structure with the light-emitting side of the micro-LED chip. 9.The micro-LED device fabrication method of claim 1, wherein, After bonding the side of the first color conversion structure opposite to the transparent substrate with the light-emitting side of the micro-LED chip, the method includes: Removing the transparent substrate of the first color conversion structure, and obtaining a second color conversion structure from the first color conversion structure.

10. A micro-LED device, wherein, The micro-LED device includes a second color conversion structure and a micro-LED chip structure, the micro-LED chip structure includes a micro-LED chip, the micro-LED chip includes a micro-LED unit array composed of a plurality of micro-LED units, wherein the second color conversion structure includes: a first reflection layer for partially reflecting light emitted by the micro-LED units; a first isolation layer disposed below the first reflection layer and including a first via array, the arrangement of the first via array corresponding to the arrangement of the micro-LED unit array, wherein the first via array includes a plurality of groups of first vias, each group of first vias including at least two first vias; a second isolation layer disposed below the first isolation layer and including a second via array, the second via array corresponding to the first via array, wherein the second via array includes a plurality of groups of second vias corresponding to the plurality of groups of first vias, and each second via in each group of second vias corresponding to a first via in the corresponding group of first vias; a photoluminescence material layer filled in each group of second vias, wherein the color of the light emitted by the micro-LED units is different from the color corresponding to the photoluminescence material layer, the second isolation layer and the photoluminescence material layer of the second color conversion structure are disposed on the light-emitting side of the micro-LED chip.

11. A display device, wherein, The display device includes the micro-LED device of claim 10.

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