Display panel, manufacturing method thereof and display device

Abstract

The application discloses a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate, a pixel definition layer, a light emitting unit, a first partition structure and a second partition structure. The light emitting unit comprises an anode, a light emitting functional layer and a cathode. The second partition structure is arranged on the first partition structure. The first partition structure is used for partitioning the cathodes of two adjacent light emitting units. The second partition structure is used for partitioning the light emitting functional layers of two adjacent light emitting units. On the orthographic projection of the substrate, the radial width of the cathode is smaller than the width of the light emitting functional layer. The first partition structure is also used for separating the cathode from the second partition structure. The application sets two stacked first partition structures and second partition structures. The first partition structure is used for partitioning the cathode. The second partition structure is used for partitioning the light emitting functional layer. The film layer interface between the cathode and the light emitting functional layer is improved. The light emitting efficiency and the life of the light emitting unit are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] OLED (Organic Light Emitting Diode) display devices are widely used in various fields due to their lightness, wide viewing angle, fast response, low temperature resistance, high luminous efficiency, and the ability to produce flexible display screens. As the mass production technology matures, OLED display panels have gradually become mainstream real panels.

[0003] Existing organic light emitting display panels mainly include two types. One is a normal organic light emitting display panel, wherein the light emitting unit in the normal organic light emitting display panel includes an anode, a light emitting functional layer and a cathode which are sequentially stacked from a substrate. The other is an inverted organic light emitting display panel, which includes a cathode, a light emitting functional layer and an anode which are sequentially stacked from a substrate. In the normal organic light emitting display panel, the active metal in the cathode is easily eroded by water and oxygen, resulting in a decrease in the service life of the display panel. For the inverted organic light emitting display panel, the active metal in the cathode is also easily oxidized or has process residues during the process, resulting in low luminous efficiency of the inverted organic light emitting display panel. Therefore, there is an urgent need in the art for a solution to the above problems. SUMMARY

[0004] The purpose of the present application is to provide a display panel, a manufacturing method thereof and a display device. By setting two stacked first and second partition structures, the first partition structure is used to partition the cathode, and the second partition structure is used to partition the light emitting functional layer, so as to improve the film layer interface between the cathode and the light emitting functional layer, and improve the luminous efficiency and service life of the light emitting unit.

[0005] The application discloses a display panel, which comprises a substrate, a pixel definition layer, a light-emitting unit, a first partition structure and a second partition structure. The pixel definition layer is arranged on the substrate and is provided with a plurality of opening areas. The light-emitting unit is arranged on the substrate and is located in the opening area. The light-emitting unit comprises an anode, a light-emitting functional layer and a cathode. The cathode is arranged on the substrate. The light-emitting functional layer is arranged on the cathode. The anode is arranged on the light-emitting functional layer. The second partition structure is arranged on the first partition structure. The first partition structure is used for partitioning the cathodes of two adjacent light-emitting units. The second partition structure is used for partitioning the light-emitting functional layers of two adjacent light-emitting units. In the orthographic projection of the substrate, the radial width of the cathode is smaller than the width of the light-emitting functional layer. The first partition structure is also used for partitioning the cathode and the second partition structure.

[0006] Optionally, the first partition structure comprises a partition layer. The partition layer is arranged below the pixel definition layer and directly contacts the pixel definition layer. In the orthographic projection of the substrate, the boundary of the partition layer is in the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer. The pixel definition layer and the partition layer form the first partition structure.

[0007] Optionally, the second partition structure comprises a conductive part and a partition part. The conductive part is arranged on the pixel definition layer. The partition part is arranged on the conductive part. The radial width of the partition part is greater than the radial width of the conductive part. The conductive part is used for connecting the anodes of two adjacent light-emitting units. In the projection of the substrate, the boundary of the partition part of the second partition structure is arranged on the side of the first partition structure away from the light-emitting unit. The light-emitting functional layer covers the first partition structure and extends to the pixel definition layer and has a gap from the conductive part.

[0008] Optionally, the light-emitting functional layer comprises an electron transport layer, a light-emitting layer and a hole transport layer. The electron transport layer is arranged on the side of the light-emitting layer close to the cathode. The hole transport layer is arranged on the side of the light-emitting layer close to the anode. The electron transport layer is partitioned by the first partition structure. The radial width of the electron transport layer is equal to the radial width of the cathode. The light-emitting layer and the hole transport layer cover the first partition structure and are partitioned by the second partition structure. The radial widths of the light-emitting layer and the hole transport layer are respectively greater than the radial width of the electron transport layer. The electron transport layer, the light-emitting layer and the hole transport layer are also used for partitioning the cathode and the conductive part.

[0009] Optionally, the light-emitting unit further includes a cathode auxiliary electrode. The cathode auxiliary electrodes in two adjacent light-emitting units are separated and insulated by the pixel definition layer. The cathode auxiliary electrode is disposed under the cathode and is in direct contact with the cathode. The partition layer is disposed between the cathode auxiliary electrode and the pixel definition layer. The partition layer is formed of a conductive material and is in direct contact with the cathode auxiliary electrode. In two adjacent light-emitting units, the two adjacent partition layers are separated by the pixel definition layer.

[0010] Optionally, the cathode is formed using one or both of magnesium and silver materials; the anode is formed by full-surface deposition of a reflective metal material, and multiple light-emitting units share the anode; the light emitted by the light-emitting unit is emitted from one side of the substrate; the thickness of the cathode is greater than or equal to 100 angstroms and less than or equal to 300 angstroms; the preset distance is greater than or equal to 5000 angstroms and less than or equal to 50000 angstroms; the thickness of the partition layer is greater than or equal to 100 angstroms and less than or equal to 1000 angstroms.

[0011] This application also discloses a method for manufacturing a display panel, including the following steps:

[0012] Provide a substrate;

[0013] A pixel definition layer and a first partition structure are formed in a non-opening area on the substrate.

[0014] A second partition structure is formed on the first partition structure;

[0015] A cathode is formed in the opening area using the first partition structure;

[0016] The second partition structure is used to form a light-emitting functional layer in the opening area;

[0017] An anode is formed to create a light-emitting unit;

[0018] Wherein, on the orthographic projection of the substrate, the radial width of the cathode is smaller than the width of the light-emitting functional layer; the first partition structure is also used to separate the cathode from the second partition structure.

[0019] Optionally, the step of forming the pixel definition layer and the first isolation structure in the non-opening area on the substrate includes:

[0020] A full-surface partition layer material layer is formed in the non-opening area of ​​the substrate.

[0021] A pixel definition layer material layer is deposited on the entire surface of the partition layer material layer. After removing the pixel definition layer material in the opening area, the pixel definition layer in the non-opening area is retained.

[0022] The pixel definition layer is used as a protective layer to etch the partition layer so that the pixel definition layer and the partition layer form a first partition structure.

[0023] Wherein, under the orthographic projection of the substrate, the boundary of the partition layer is within the projection range of the pixel definition layer, and has a preset distance from the projection boundary of the pixel definition layer;

[0024] The step of forming the second partition structure on the first partition structure includes:

[0025] A conductive material layer and a barrier material layer are sequentially formed on the pixel definition layer;

[0026] A partition portion is patterned to form a second partition structure by etching the conductive material layer using the partition portion as a protective layer. The radial width of the partition portion is greater than the radial width of the conductive portion.

[0027] The step of forming an anode to form a light-emitting unit includes:

[0028] The second partition structure forms a light-emitting functional layer in the opening area, and the anodes of two adjacent light-emitting units are connected through the conductive part.

[0029] Optionally, the step of layering the substrate spacer material on the substrate includes:

[0030] A cathode auxiliary electrode material layer and a barrier layer material layer are sequentially deposited on the substrate.

[0031] The partition layer material layer and the cathode auxiliary electrode are sequentially etched in the non-opening area to form a partition hole;

[0032] The step of depositing a full-surface pixel definition layer material layer on a full-surface partition layer material layer, removing the pixel definition layer material in the opening area, and retaining the pixel definition layer in the non-opening area includes:

[0033] A pixel definition layer material layer is deposited across the entire surface; at the location of the partition hole, the pixel definition layer fills the partition hole;

[0034] After removing the pixel definition layer material in the opening area, the pixel definition layer in the non-opening area is retained; wherein the pixel definition layer fills the partition hole, and the radial width of the pixel definition layer is greater than the width of the partition hole.

[0035] This application also discloses a display device, including a driving circuit and the aforementioned display panel, wherein the driving circuit is used to drive the display panel to display. Attached Figure Description

[0036] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0037] Figure 1 This is a schematic diagram of the display panel according to the first embodiment of this application;

[0038] Figure 2 This is a schematic diagram of the film layer of the light-emitting unit in this application;

[0039] Figure 3 This is a schematic diagram of the first partition structure and the second partition structure of this application;

[0040] Figure 4 This is a schematic diagram of the display panel according to the second embodiment of this application;

[0041] Figure 5 This is a schematic diagram illustrating the steps of the method for manufacturing the display panel of this application;

[0042] Figure 6 This is a schematic diagram illustrating the manufacturing process of the display panel of this application;

[0043] Figure 7 This is a schematic diagram of the display device of this application.

[0044] Among them, 100 is a display panel; 101 is an opening area; 102 is a non-opening area; 110 is a substrate; 120 is a pixel definition layer; 130 is a light-emitting unit; 131 is a cathode; 132 is a light-emitting functional layer; 1321 is a hole injection layer; 1322 is a hole transport layer; 1323 is an electron blocking layer; 1324 is a light-emitting layer; 1325 is a hole blocking layer; 1326 is an electron transport layer; 1327 is an electron injection layer; 133 is an anode; 134 is a cathode auxiliary electrode; 140 is a first partition structure; 141 is a partition layer; 150 is a second partition structure; 151 is a conductive part; 152 is a partition part; 160 is a pixel driving layer; 200 is a display device; and 210 is a driving circuit. Detailed Implementation

[0045] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0046] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature specified as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. Furthermore, terms indicating orientation or positional relationships, such as "upper," "lower," "left," "right," "vertical," and "horizontal," are described based on the orientation or relative positional relationships shown in the accompanying drawings and are only for the purpose of simplifying the description of this application, not indicating that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.

[0048] Figure 1 This is a schematic diagram of the display panel 100 according to the first embodiment of this application, see below. Figure 1 As shown, this application discloses a display panel 100, which includes a substrate 110, a pixel definition layer 120, a light-emitting unit 130, a first partition structure 140, and a second partition structure 150. The pixel definition layer 120 is disposed on the substrate 110 and has a plurality of opening regions 101. The light-emitting unit 130 is disposed on the substrate 110 and located within the opening regions 101. The light-emitting unit 130 includes an anode 133, a light-emitting functional layer 132, and a cathode 131. The cathode 131 is disposed on the substrate 110, and the light-emitting functional layer 132 is disposed on the substrate 110. The cathode 131 is disposed on the cathode 133, and the anode 133 is disposed on the light-emitting functional layer 132. The second partition structure 150 is disposed on the first partition structure 140. The first partition structure 140 is used to partition the cathodes 131 of two adjacent light-emitting units 130, and the second partition structure 150 is used to partition the light-emitting functional layers 132 of two adjacent light-emitting units 130. In the orthographic projection of the substrate 110, the radial width of the cathode 131 is smaller than the width of the light-emitting functional layer 132. The first partition structure 140 is also used to separate the cathode 131 from the second partition structure 150.

[0049] This application employs a first partition structure 140 and a second partition structure 150 stacked together. The first partition structure 140 isolates the cathode 131, and the second partition structure 150 isolates the light-emitting functional layer 132. By using the first partition structure 140 and the second partition structure 150, the radial width of the cathode 131 is smaller than the radial width of the light-emitting functional layer 132. This avoids the potential short circuit problem between the cathode 131 and anode 133 during maskless evaporation when the cathode 131, light-emitting functional layer 132, and anode 133 of the light-emitting unit 130 are separated by partition structures. On the other hand, this application, through the first partition structure 140 and the second partition structure 150, enables the cathode 131, the light-emitting functional layer 132, and the anode 133 of the light-emitting unit 130 to be deposited using maskless vapor deposition. Its advantage lies in the fact that during the formation of the cathode 131 and the light-emitting functional layer 132, the cathode 131 and the light-emitting functional layer 132 can be formed in the same environment, avoiding the problem of cathode 131 oxidation caused by etching in the exemplary process. Simultaneously, it also improves the film interface between the cathode 131 and the light-emitting functional layer 132, thereby enhancing the luminous efficiency of the light-emitting unit 130.

[0050] In one embodiment of this application, the cathode 131, the light-emitting functional layer 132, and the anode 133 of the light-emitting unit 130 can be formed by using either the first partition structure 140 or the second partition structure 150 alone. The first partition structure 140 or the second partition structure 150 is a key structure used in maskless vapor deposition technology, often referred to as an eaves structure or a conductive partition structure. Primarily, through the partition structure's isolation capability, patterned cathodes 131, light-emitting functional layers 132, and anodes 133 can be formed in the corresponding opening areas 101 without the need for a metal mask when vapor-depositing the anode 133, cathode 131, and light-emitting functional layer 132. Current maskless vapor deposition technology primarily uses partition structures to form the light-emitting functional layer 132 and the anode 133 or cathode 131 located on the light-emitting functional layer 132, without using partition structures to process the anode 133 and cathode 131 separately. Therefore, in maskless vapor deposition, the problem of short circuit between anode 133 and cathode 131 generally does not exist. However, in this application, by forming the cathode 131, which is located below the light-emitting functional layer 132, using maskless vapor deposition, the problem of poor film interface between cathode 131 and light-emitting functional layer 132 due to the need for etching steps is improved. However, even when using the first isolation structure 140 or the second isolation structure 150 alone, and controlling the vapor deposition angle, a short circuit between anode 133 and cathode 131 may still occur. To address this, this application provides the first isolation structure 140 and the second isolation structure 150. Utilizing the isolation capabilities of the first isolation structure 140 and the second isolation structure 150, the radial widths of cathode 131 and light-emitting functional layer 132 are different, and the side of cathode 131 is completely covered by the light-emitting functional layer 132, thereby avoiding the short circuit problem between cathode 131 and anode 133.

[0051] Specifically, the second partition structure 150 of this application is a partition structure in conventional maskless vapor deposition technology. The second partition structure 150 includes a conductive portion 151 and a partition portion 152 disposed on the pixel definition layer 120. The conductive portion 151 is disposed on the pixel definition layer 120, and the partition portion 152 is disposed on the conductive portion 151. The radial width of the partition portion 152 is greater than the radial width of the conductive portion 151.

[0052] In this embodiment, the main function of the second partition structure 150 is to isolate the light-emitting functional layer 132 and the anode 133. Of course, the second partition structure 150 also acts as a barrier to the cathode 131 during the full-surface vapor deposition. Therefore, during the full-surface vapor deposition of the cathode 131, in addition to forming the cathode 131 in the opening region 101, a redundant electrode of the first cathode 131 is formed between the first partition structure 140 and the second partition structure 150, and a redundant electrode of the second cathode 131 is formed on the second partition structure 150. These three electrode segments are not connected to each other. The first partition structure 140 and the second partition structure 150 are positioned differently; the first partition structure 140 is positioned closer to the opening region 101 than the second partition structure 150, so that the radial width of the cathode 131 is smaller than the radial width of the light-emitting functional layer 132. If the first partition structure 140 is not provided, the cathode 131 and the light-emitting functional layer 132 are both separated by the second partition structure 150. The radial width of the cathode 131 should be equal to the radial width of the light-emitting functional layer 132, which may easily lead to a short circuit between the cathode 131 and the conductive part 151 or the anode 133.

[0053] The conductive portion 151 in the second partition structure 150 is also used to connect the anodes 133 of multiple light-emitting units 130 to form a full-surface anode 133 wiring. In this embodiment, the display panel 100 of this application is an inverted bottom-emitting display panel 100, wherein the cathode 131 of the light-emitting unit 130 is a light-transmitting electrode, and the anode 133 is a reflective electrode. The emitted light from the light-emitting unit 130 is emitted from the cathode 131 side, and thus emitted from the substrate 110 side to form a bottom-emitting display panel 100. Therefore, the cathode 131 disposed under the light-emitting functional layer 132 needs to be independently disposed, the two cathodes 131 are not connected to each other, and are respectively connected to the corresponding pixel driving circuit, while the anode 133 only needs to be supplied with a fixed voltage, so the anodes 133 of multiple light-emitting units 130 are connected together. By setting the anode 133 as a reflective electrode and connecting them together, the resistance drop problem of the anode 133 can be greatly reduced.

[0054] Figure 2 This is a schematic diagram of the film layer of the light-emitting unit 130 of this application, see [link / reference]. Figure 2As shown, "inverted" refers to the sequence of the light-emitting functional layers 132 in the light-emitting unit 130. In this embodiment, the light-emitting functional layer 132 generally includes an electron transport layer 1326, a light-emitting layer 1324, and a hole transport layer 1322. In the inverted light-emitting layer 1324, the electron transport layer 1326 is generally disposed on the side of the light-emitting layer 1324 closer to the cathode 131, and the hole transport layer 1322 is generally disposed on the side of the light-emitting layer 1324 closer to the anode 133. Generally, the light-emitting functional layers 132 in the bottom-emitting display panel 100 are all inverted to achieve higher luminous efficiency. However, the inverted design requires a high work function between the anode 133 and the cathode 131, and the work function of the cathode 131 should be as low as possible. In this case, the anode 133 is a reflective electrode, which can be made of silver. The cathode 131 is a transparent electrode. When a transparent conductive layer, which is an electrode with a high work function, is used, the problem of low luminous efficiency is likely to occur.

[0055] Therefore, it is necessary to add a transparent active metal to the cathode 131 to reduce its work function, and to add an ITO or IZO material with a higher work function to the anode 133 to increase its work function. When adding an active metal to the cathode 131, two aspects need to be considered. First, the transmittance of the active metal needs to be considered. The transmittance of a metal is related to its crystal structure, which refers to the arrangement of metal atoms according to a specific pattern. When the metal's crystal structure is sufficiently compact, leaving insufficient space for photons to pass through, the metal will exhibit opaque properties. However, if the metal thickness is reduced to a certain extent, photons may be able to pass through the metal's crystal structure, making the metal transparent. The other approach requires considering the work function. While setting the thickness based on transmittance, the work function also needs to be taken into account, as the thickness affects the work function. Generally, taking the cathode 131 as an example, with magnesium or silver as the active metal material, the thickness of the cathode 131 needs to be smaller than the thickness of the reflective metal layer in the anode 133 to achieve higher luminous efficiency.

[0056] However, when the active metal material used in the cathode 131 is relatively thin, for example, between 100 and 300 angstroms, oxidation is easily encountered during the deposition and etching steps in the manufacturing process. Specifically, in the etching process, there are also issues such as photoresist residue and etching problems, all of which affect the work function of the cathode 131, resulting in lower luminous efficiency of the inverted bottom-emitting display panel 100. However, through the first partition structure 140 of this application, a patterned cathode 131 is formed during the deposition of the cathode 131. Even when forming a relatively thin active metal as the cathode 131, oxidation and other problems do not occur in a vacuum environment. It is worth mentioning that when the active metal deposition of the cathode 131 is relatively thin, it is easily oxidized during the deposition process. For a top-emitting display panel 100 with a normal orientation, the cathode 131 is generally made of indium tin oxide (ITO), and the anode 133 is generally formed by sandwiching a layer of silver between two layers of ITO. The silver layer is relatively thick to form a reflective electrode, and with the protection of two layers of ITO, oxidation is relatively less likely to occur. However, for an inverted bottom-emitting display panel 100, there is no ITO protection above the cathode 131, making it highly susceptible to oxidation in subsequent processes. In this embodiment, the cathode 131 is protected by a first partition structure 140. Furthermore, combined with the above, the cathode 131 is separated from the redundant electrodes of the first and second cathodes 131, achieving a better light-emitting effect.

[0057] Figure 3 This is a schematic diagram of the first partition structure 140 and the second partition structure 150 of this application, see below. Figure 3 As shown, specifically, the first partition structure 140 includes a partition layer 141, which is disposed below the pixel definition layer 120 and in direct contact with the pixel definition layer 120; under the orthographic projection of the substrate 110, the boundary of the partition layer 141 is within the projection range of the pixel definition layer 120 and has a preset distance from the projection boundary of the pixel definition layer 120, and the pixel definition layer 120 and the partition layer 141 form the first partition structure 140.

[0058] On the orthographic projection of the substrate 110, the first partition structure 140 is closer to the opening region 101 than the second partition structure 150, such that the radial width of the cathode 131 formed by the first partition structure 140 is smaller than the radial width of the light-emitting functional layer 132 formed by the second partition structure 150. Thus, the light-emitting functional layer 132 can separate the anode 133, the cathode 131, the redundant electrode of the first cathode 131, and the redundant electrode of the second cathode 131, thereby avoiding the short-circuit problem when the anode 133 and the cathode 131 are formed using maskless vapor deposition technology.

[0059] Figure 4 This is a schematic diagram of the display panel 100 according to the second embodiment of this application, see below. Figure 4 As shown, the light-emitting unit 130 further includes a cathode auxiliary electrode 134. The cathode auxiliary electrodes 134 in two adjacent light-emitting units 130 are separated and insulated by the pixel definition layer 120. The cathode auxiliary electrode 134 is disposed under the cathode 131 and is in direct contact with the cathode 131. The partition layer 141 is disposed between the cathode auxiliary electrode 134 and the pixel definition layer. The partition layer 141 is formed of a conductive material and is in direct contact with the cathode auxiliary electrode 134. In two adjacent light-emitting units 130, the two adjacent partition layers 141 are separated by the pixel definition layer 120.

[0060] In this design, a cathode auxiliary electrode 134 is disposed below the cathode 131. The cathode auxiliary electrode 134 can be formed of a transparent conductive material, such as indium tin oxide or indium zinc oxide. This cathode auxiliary electrode 134 is connected to the pixel active switch in the pixel driving layer 160 via a via. It is understood that a pixel driving layer 160 is also disposed on the substrate 110. The pixel driving layer 160 generally includes the pixel driving circuit of the light-emitting unit 130, such as a pixel active switch, data driving lines, scan control lines, etc. The cathode 131 of each light-emitting unit 130 is connected to the pixel active switch via the cathode auxiliary electrode 134, and the voltage and shutdown of the cathode 131 are controlled by the pixel active switch. Specifically, the cathode auxiliary electrodes 134 of two adjacent light-emitting units 130 are separated by the pixel definition layer 120. Considering that the cathode auxiliary electrode 134 needs to be directly connected to the cathode 131 of each light-emitting unit 130, the cathode auxiliary electrodes 134 of adjacent light-emitting units 130 also need to be spaced apart to avoid electrical crosstalk problems.

[0061] In this design, the cathode auxiliary electrode 134 is typically formed through etching. After the cathode auxiliary electrode 134 material is laid across the entire surface, the material in the non-opening region 102 is removed by etching, thus retaining the cathode auxiliary electrode 134 in the opening region 101. During the etching process, a barrier layer 141 can be used to protect the cathode auxiliary electrode 134. Specifically, the barrier layer 141 is disposed between the pixel definition layer 120 and the cathode auxiliary electrode 134. Between two adjacent opening regions 101, the pixel definition layer 120 insulates and separates the adjacent barrier layer 141 and the cathode auxiliary electrode 134. When etching the cathode auxiliary electrode 134, the barrier layer 141 protects the cathode auxiliary electrode 134. During the formation of the first partition structure 140, the partition layer 141 of the opening region 101 is removed, thereby stripping the partition layer 141 on the cathode auxiliary electrode 134. The first partition structure 140 is formed at the edge of the pixel definition layer 120 to isolate the cathode 131 during its formation. It is worth noting that the isolation capability of the first partition structure 140 and the second partition structure 150 in this application is mainly determined by the width of the upper part exceeding the lower part. For example, in one partition structure, the distance w by which the boundary of the pixel definition layer 120 exceeds the boundary of the partition layer 141, and the thickness of the partition layer 141, together determine the isolation capability of the first partition structure 140.

[0062] The isolation layer 141 can also be formed using a metallic material. Specifically, after the pixel driving layer 160 on the substrate 110 is fabricated, and after the cathode auxiliary electrode 134 is formed, the isolation layer 141 is formed using a metallic material different from that of the cathode auxiliary electrode 134. A pixel definition layer 120 is then formed on the isolation layer 141. The pixel definition layer 120 is patterned by forming multiple openings as opening regions 101. The isolation layer 141 is then etched using the pixel definition layer 120, so that at the boundary between each non-opening region 102 and the opening region 101, the pixel definition layer 120 extends beyond the isolation layer 141 by a certain distance, forming a first isolation structure 140. Although this process adds the structure of the isolation layer 141, it does not complicate the fabrication process and can be achieved entirely using current technology without the need for additional masks.

[0063] When the partition layer 141 is formed of a metal material, since the partition layer 141 is in direct contact with the cathode auxiliary electrode 134, the partition layers 141 of adjacent light-emitting units 130 also need to be spaced apart and insulated by the pixel definition layer 120 respectively.

[0064] In one specific embodiment, the second partition structure 150 has a stronger partitioning capability than the first partition structure 140. This is because in maskless vapor deposition technology, the use of the second partition structure 150 necessitates the selection of an inorganic insulating material for the pixel definition layer 120, resulting in a limited height for the pixel definition layer 120 and a limited partitioning capability for the first partition structure 140. Replacing the pixel definition layer 120 with an organic insulating material would easily lead to a thicker film layer. Therefore, in this embodiment, the first partition structure 140 typically only partitions a portion of the film layer of the light-emitting unit 130, and cannot completely partition the light-emitting functional layer 132.

[0065] Specifically, the light-emitting functional layer 132 includes an electron transport layer 1326, a light-emitting layer 1324, and a hole transport layer 1322. The electron transport layer 1326 is disposed on the side of the light-emitting layer 1324 near the cathode 131, and the hole transport layer 1322 is disposed on the side of the light-emitting layer 1324 near the anode 133. The electron transport layer 1326 is separated by the first partition structure 140, and the radial width of the electron transport layer 1326 is equal to the radial width of the cathode 131. The light-emitting layer 1324 and the hole transport layer 1322 cover the first partition structure 140 and are separated by the second partition structure 150. The radial widths of the light-emitting layer 1324 and the hole transport layer 1322 are respectively greater than the radial width of the electron transport layer 1326. The electron transport layer 1326, the light-emitting layer 1324, and the hole transport layer 1322 are also used to isolate the cathode 131 from the conductive part 151.

[0066] In this embodiment, the electron transport layer 1326 located near the cathode 131 can be isolated by the first isolation structure 140. To completely isolate the cathode 131 through the first isolation structure 140, the isolation capability of the first isolation structure 140 needs to extend directly to the light-emitting functional layer 132 to ensure that the first isolation structure 140 can completely isolate the cathode 131. Therefore, for the light-emitting functional layer 132, it is necessary to insulate the cathode 131 from the redundant electrode of the first cathode 131 isolated by the first isolation structure 140. This further avoids the short circuit problem between the cathode 131 and the redundant electrode of the first cathode 131, and the anode 133. It is worth mentioning that even if the radial width of the cathode 131 and the electron transport layer 1326 is reduced, it does not actually affect the effective light-emitting area of ​​the light-emitting unit 130.

[0067] Of course, in one specific embodiment, the electron transport layer 1326 also has an electron injection layer 1327 disposed on the side near the cathode 131, a hole blocking layer 1325 disposed on the side near the light-emitting layer 1324, a hole injection layer 1321 disposed on the side of the hole transport layer 1322 near the anode, and an electron blocking layer 1323 disposed on the side near the light-emitting layer 1324. The film layer of the electron transport layer 1326 near the cathode 131 is also blocked by the first partition structure 140, thereby forming unconnected electron injection layers in the opening region 101.

[0068] The cathode 131 has a thickness greater than or equal to 100 angstroms and less than or equal to 300 angstroms. In the first partition structure 140, the preset distance is greater than or equal to 5000 angstroms and less than or equal to 50000 angstroms, preferably 10000 angstroms to 30000 angstroms. When the first partition structure 140 only partitions the cathode 131, the thickness of the partition layer 141 is greater than or equal to 100 angstroms and less than or equal to 600 angstroms, preferably 200 angstroms to 500 angstroms. When the first partition structure 140 further partitions to the electron transport layer 1326, the thickness of the partition layer 141 is greater than or equal to 200 angstroms and less than or equal to 1500 angstroms, preferably 400 angstroms to 1000 angstroms.

[0069] Figure 5 This is a schematic diagram illustrating the steps of the method for manufacturing the display panel of this application. Figure 6 This is a schematic diagram of the manufacturing process of the display panel of this application. See [link / reference]. Figures 5 to 6 As shown, this application also discloses a method for manufacturing a display panel corresponding to any of the above embodiments, including the following steps:

[0070] S10: Provides a substrate;

[0071] S20: A pixel definition layer and a first partition structure are formed in a non-opening area on the substrate.

[0072] S30: A second partition structure is formed on the first partition structure;

[0073] S40: A cathode is formed in the opening area using the first partition structure;

[0074] S50: A light-emitting functional layer is formed in the opening area using the second partition structure;

[0075] S60: Forming an anode to form a light-emitting unit;

[0076] S70: Forms a display panel.

[0077] Wherein, on the orthographic projection of the substrate, the radial width of the cathode is smaller than the width of the light-emitting functional layer; the first partition structure is also used to separate the cathode from the second partition structure.

[0078] This application utilizes a first and a second partition structure. The first partition structure is used for maskless vapor deposition when forming the cathode, and the second partition structure is used for maskless vapor deposition when forming the light-emitting functional layer. The different positions of the first and second partition structures result in a cathode with a smaller radial width than the light-emitting functional layer. This effectively insulates the cathode and anode from the light-emitting functional layer, preventing short circuits between them. Furthermore, the first and second partition structures allow for maskless vapor deposition of the cathode, light-emitting functional layer, and anode of the light-emitting unit. This offers the advantage of forming the cathode and light-emitting functional layer in the same environment, avoiding the cathode oxidation problem caused by etching in existing processes. It also improves the film interface between the cathode and the light-emitting functional layer, enhancing the luminous efficiency of the light-emitting unit.

[0079] Step S20 includes:

[0080] S201: A full-surface partition layer material layer is formed in the non-opening area of ​​the substrate.

[0081] S202: Deposit a pixel definition layer material layer on the entire surface of the partition layer material layer, remove the pixel definition layer material in the opening area, and retain the pixel definition layer in the non-opening area.

[0082] S203: The partition layer is etched using the pixel definition layer as a protective layer so that the pixel definition layer and the partition layer form a first partition structure.

[0083] In this embodiment, under the orthographic projection of the substrate, the boundary of the isolation layer is within the projection range of the pixel definition layer and has a predetermined distance from the projection boundary of the pixel definition layer. For the isolation layer material and other film layers, the general material layer designation involves forming an entire isolation layer material layer on the substrate. After removing a portion of the area (i.e., patterning), the corresponding isolation layer is formed. The difference between isolation layers is distinguished by adding material layers; there is no other difference between the isolation layer material layer and the isolation layer itself. The first isolation structure in this embodiment mainly employs adding an isolation layer between the pixel definition layer and the substrate. The first isolation structure is formed using the isolation layer and the pixel definition layer. Etching this isolation layer does not require additional masks, thus not increasing process costs.

[0084] The steps in S30 include:

[0085] S301: A conductive material layer and a barrier material layer are sequentially formed on the pixel definition layer;

[0086] S302: Patterning a partition portion, using the partition portion as a protective layer to etch the conductive material layer to form a second partition structure; wherein the radial width of the partition portion is greater than the radial width of the conductive portion.

[0087] The steps in S60 include:

[0088] S601: A light-emitting functional layer is formed in the opening area using the second partition structure, and the anodes of two adjacent light-emitting units are connected through the conductive part.

[0089] In this embodiment, a second partition structure is formed on the pixel definition layer to isolate the light-emitting functional layer and the anode. It is understood that the second partition structure also acts as a barrier to the cathode during the full-area evaporation deposition. Therefore, during the full-area evaporation deposition of the cathode, in addition to forming the cathode in the opening area, a first redundant cathode electrode is formed between the first and second partition structures, and a second redundant cathode electrode is formed on the second partition structure. These three electrode segments are not connected to each other, and the second redundant cathode electrode on the second partition structure can be removed in subsequent processes.

[0090] Of course, in the case of the display panel where the cathode auxiliary electrode is located in the partition layer, step S20 includes:

[0091] S211: A cathode auxiliary electrode material layer and a barrier layer material layer are sequentially deposited on the substrate.

[0092] S212: The partition layer material layer and the cathode auxiliary electrode are sequentially etched in the non-opening area to form a partition hole;

[0093] S213: Deposit a pixel definition layer material layer across the entire surface; at the location of the partition hole, the pixel definition layer fills the partition hole;

[0094] S214: After removing the pixel definition layer material in the opening area, the pixel definition layer in the non-opening area is retained; wherein the pixel definition layer fills the partition hole, and the radial width of the pixel definition layer is greater than the width of the partition hole;

[0095] S215: Etch the partition layer using the pixel definition layer as a protective layer, so that the pixel definition layer and the partition layer form a first partition structure.

[0096] In this embodiment, a partition layer is used to protect the cathode auxiliary electrode. After the first partition structure is completed, the cathode auxiliary electrode is exposed from the opening area. When the cathode is formed, the cathode and the cathode auxiliary electrode are in direct contact.

[0097] In this embodiment, the first and second partition structures can be respectively arranged around each opening area, allowing the cathode, light-emitting functional layer, and anode to be formed using maskless vapor deposition technology. Furthermore, the arrangement of the cathode, cathode auxiliary electrode, and anode in this application results in high luminous efficiency for the inverted bottom-emitting display panel. Since the anode does not require light transmission, it can be made thick and formed across the entire surface. This results in a smaller resistance drop at different locations compared to the solid cathode formed with indium tin oxide in a top-emitting display panel, leading to more uniform resistance drops and avoiding voltage variations at different locations. Another advantage of the inverted bottom-emitting display panel is that after the light-emitting unit completes its process, the emitted light does not exit from the encapsulation layer above the light-emitting unit. Therefore, there is greater selectivity in the materials and processes used for the encapsulation layer, allowing for better encapsulation of the light-emitting unit.

[0098] Figure 7 This is a schematic diagram of the display device of this application, see below. Figure 7 As shown, this application also discloses a display device, the display device 200 including a driving circuit 210 and a display panel 100 in any of the above embodiments, wherein the driving circuit 210 is used to drive the display panel 100 to perform display.

[0099] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0100] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A display panel, comprising a substrate substrate, a pixel definition layer and a light emitting unit, the pixel definition layer is arranged on the substrate substrate and is provided with a plurality of opening regions, the light emitting unit is arranged on the substrate substrate and is located in the opening region; characterized in that, the light emitting unit comprises an anode, a light emitting functional layer and a cathode, the cathode is arranged on the substrate substrate, the light emitting functional layer is arranged on the cathode, and the anode is arranged on the light emitting functional layer; the display panel further comprises a first partition structure and a second partition structure, the second partition structure is arranged on the first partition structure, the first partition structure is used for partitioning the cathodes of two adjacent light emitting units, and the second partition structure is used for partitioning the light emitting functional layers of two adjacent light emitting units; wherein, in the orthographic projection of the substrate substrate, the radial width of the cathode is smaller than the width of the light emitting functional layer; the first partition structure is further used for separating the cathode and the second partition structure; the first partition structure comprises a partition layer, the partition layer is arranged below the pixel definition layer and directly contacts the pixel definition layer; in the orthographic projection of the substrate substrate, the boundary of the partition layer is within the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer, the pixel definition layer and the partition layer form a first partition structure; the second partition structure comprises a conductive part and a partition part, the conductive part is arranged on the pixel definition layer, the partition part is arranged on the conductive part, and the radial width of the partition part is greater than the radial width of the conductive part; the conductive part is used for connecting the anodes of two adjacent light emitting units; in the projection of the substrate substrate, the boundary of the partition part of the second partition structure is arranged on the side of the first partition structure away from the light emitting unit; the light emitting functional layer covers the first partition structure and extends on the pixel definition layer and has a gap from the conductive part. The light emitting functional layer comprises an electron transport layer, a light emitting layer and a hole transport layer, the electron transport layer is arranged on the side of the light emitting layer close to the cathode, and the hole transport layer is arranged on the side of the light emitting layer close to the anode; the electron transport layer is partitioned by the first partition structure, and the radial width of the electron transport layer is equal to the radial width of the cathode; the light emitting layer and the hole transport layer cover the first partition structure and are partitioned by the second partition structure, and the radial widths of the light emitting layer and the hole transport layer are respectively greater than the radial width of the electron transport layer; the electron transport layer, the light emitting layer and the hole transport layer are further used for partitioning the cathode and the conductive part. The light emitting unit further comprises a cathode auxiliary electrode, the cathode auxiliary electrodes in two adjacent light emitting units are insulated by the pixel definition layer, the cathode auxiliary electrode is arranged below the cathode and directly contacts the cathode; ​ ​ ​ ​ 2. The display panel of claim 1, wherein, ​ ​ ​ ​ 3. The display panel of claim 2, wherein, ​ The partition layer is arranged between the cathode auxiliary electrode and the pixel definition, is formed of a conductive material, and is in direct contact with the cathode auxiliary electrode. In two adjacent light emitting units, two adjacent partition layers are separated by the pixel definition layer.

4. The display panel of claim 2, wherein, The cathode is formed of one or both of magnesium and silver, and the anode is formed of a reflective metal material. The anode is shared by a plurality of light emitting units. Light emitted by the light emitting units is emitted from one side of the substrate. The thickness of the cathode is greater than or equal to 100 angstroms and less than or equal to 300 angstroms. The preset distance is greater than or equal to 5000 angstroms and less than or equal to 50000 angstroms. The thickness of the partition layer is greater than or equal to 100 angstroms and less than or equal to 1000 angstroms.

5. A manufacturing method of a display panel, comprising: The method comprises the steps of: providing a substrate; forming a pixel definition layer and a first partition structure on a non-opening area of the substrate; forming a second partition structure on the first partition structure; forming a cathode on the opening area using the first partition structure; forming a light emitting functional layer on the opening area using the second partition structure; forming an anode to form a light emitting unit; In the orthographic projection of the substrate, the radial width of the cathode is less than the width of the light emitting functional layer. The first partition structure is also used to separate the cathode from the second partition structure. The step of forming a pixel definition layer and a first partition structure on a non-opening area of the substrate comprises: forming a full-area partition layer material layer on the non-opening area of the substrate; depositing a full-area pixel definition layer material layer on the full-area partition layer material layer. After removing the pixel definition layer material in the opening area, the pixel definition layer in the non-opening area is retained. etching the partition layer using the pixel definition layer as a protective layer to form a first partition structure between the pixel definition layer and the partition layer; In the orthographic projection of the substrate, the boundary of the partition layer is within the projection range of the pixel definition layer, and has a preset distance from the projection boundary of the pixel definition layer. The step of forming a second partition structure on the first partition structure comprises: forming a conductive part material layer and a partition part material layer on the pixel definition layer in sequence; patterning the partition part to form a second partition structure by etching the conductive part material layer using the partition part as a protective layer. The radial width of the partition part is greater than the radial width of the conductive part. The step of forming an anode to form a light emitting unit comprises: forming a light emitting functional layer on the opening area using the second partition structure. The anodes of two adjacent light emitting units are connected by the conductive part.

6. The manufacturing method of a display panel according to claim 5, wherein, The step of forming a full-area partition layer material layer on the non-opening area of the substrate comprises: depositing a cathode auxiliary electrode material layer and a partition layer material layer on the substrate in sequence; etching the partition layer material layer and the cathode auxiliary electrode in sequence at the non-opening area to form a partition hole; The step of depositing a full-area pixel definition layer material layer on the full-area partition layer material layer, and after removing the pixel definition layer material in the opening area, retaining the pixel definition layer in the non-opening area comprises: Depositing a pixel definition layer material layer on the whole surface; at the position of the partition hole, the pixel definition layer fills the partition hole; After removing the pixel definition layer material in the opening area, the pixel definition layer in the non-opening area is reserved; wherein the pixel definition layer fills the partition hole, and the radial width of the pixel definition layer is greater than the width of the partition hole.

7. A display device, characterized by comprising: The display panel comprises a driving circuit and the display panel according to any one of claims 1-4, wherein the driving circuit is used for driving the display panel to display.

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