Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel includes: a driving substrate; the pixel definition layer is arranged on the driving substrate in a protruding manner and is provided with a plurality of pixel openings; each sub-pixel comprises an anode electrode, at least two stacked light-emitting functional layers and a cathode electrode which are stacked in the corresponding pixel opening, a charge generation layer is arranged between every two adjacent light-emitting functional layers, each charge generation layer comprises a first charge generation layer, a metal connecting layer and a second charge generation layer which are stacked in sequence, the cathode electrode extends out of the corresponding pixel opening, and the first charge generation layer and the second charge generation layer are stacked in sequence. The cathode electrodes are electrically connected with adjacent cathode electrodes; the first isolation layer is arranged on the surface of the side, away from the driving substrate, of the pixel defining layer, extends in the extending direction of the pixel defining layer to form a net shape so as to surround the pixel opening, and the first isolation layer and the metal material repel each other so as to be used for isolating the adjacent metal connecting layers. According to the display panel, the risk of poor screen lighting caused by series connection and conduction of the metal connecting layer and the cathode electrode in the charge generation layer can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] As the demands of end users continue to increase, the requirements for display technology are also getting higher and higher. In order to meet the growing needs of customers, various new technologies have emerged, such as Color Filter on Encapsulation (COE) technology, Micro Lens Array (MLA) integration technology, eLEAP maskless technology, transparent display technology, lamination technology, etc. Among them, lamination technology is listed as a new technology to be developed by major panel manufacturers and terminal manufacturers due to its advantages such as high brightness and long life.

[0003] However, the disadvantages of this technology are also obvious. First, because the structure of the stacked device is more complex than that of the single-layer device, it is easy to cause a substantial increase in the investment cost of materials and equipment. Secondly, compared with the single-layer device structure, its yield is lower, especially the cathode (Cathode) and the charge generation layer (Charge Generation Layer, CGL) are very easy to be connected in series. In addition, in order to further reduce the voltage and stability of the stacked device, it is often necessary to add a metal layer with better conductivity to the structural layer of the charge generation layer (CGL). However, due to the extremely close distance between the metal layer in the charge generation layer and the cathode, and when evaporating the light-emitting functional layer stacked above, the high-precision metal mask (Fine Metal Mask, FMM) repeatedly rubs the pixel definition layer (Pixel Definition Layer, PDL) and the spacer PS, further exposing the metal layer in the CGL layer and conducting with the cathode. Summary of the invention

[0004] The present application provides a display panel and a method for manufacturing the same, and a display device, aiming to solve the problem in the prior art that stacked OLEDs easily lead to series conduction between the CGL and the cathode.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is to provide a display panel. The display panel includes: Driver substrate; A pixel definition layer is protrudingly disposed on the driving substrate and has a plurality of pixel openings; The sub-pixel comprises an anode electrode stacked in a pixel opening, at least two stacked light-emitting functional layers and a cathode electrode; wherein a charge generation layer is further arranged between adjacent light-emitting functional layers, and the charge generation layer comprises a first charge generation layer, a metal connection layer and a second charge generation layer stacked in sequence; and the cathode electrode extends out of the pixel opening and is electrically connected to an adjacent cathode electrode; A first isolation layer is provided on the surface of the pixel definition layer away from the driving substrate. The first isolation layer extends along the extension direction of the pixel definition layer to form a mesh to surround the pixel opening. The first isolation layer and the metal material repel each other to isolate adjacent metal connection layers.

[0006] In some embodiments, the display panel further includes a spacer structure, which is disposed on the pixel definition layer in a spaced and protruding manner to support the mask plate; the first isolation layer is also disposed on a surface of the spacer structure on one side away from the driving substrate.

[0007] In some embodiments, in a radial direction of the pixel opening, a width of the first isolation layer is greater than or equal to a width of the spacer structure so as to at least cover the spacer structure and a portion of the pixel definition layer.

[0008] In some embodiments, a surface of the first isolation layer on one side away from the driving substrate is further covered with a second isolation layer, and the material of the second isolation layer is an insulating material.

[0009] In some embodiments, the orthographic projection of the second isolation layer on the pixel definition layer covers the orthographic projection of the first isolation layer on the pixel definition layer; or, the orthographic projection of the second isolation layer on the pixel definition layer coincides with the orthographic projection of the first isolation layer on the pixel definition layer.

[0010] In some embodiments, the material of the first isolation layer is a cathode patterning material that is mutually exclusive with the metal material.

[0011] In order to solve the above technical problems, the second technical solution provided by the present application is to provide a method for preparing a display panel. The preparation method comprises: A prefabricated board is provided; the prefabricated board comprises a driving substrate, a pixel definition layer and an anode electrode; wherein the pixel definition layer is protrudingly arranged on the driving substrate and is formed with a plurality of pixel openings; an anode electrode is arranged in each pixel opening; Depositing a first light-emitting functional layer and a first charge generating layer in sequence in the pixel opening; A first isolation layer is deposited on the pixel definition layer; the first isolation layer extends along the extension direction of the pixel definition layer to form a mesh, surrounds each pixel opening, and the first isolation layer and the metal material repel each other; Depositing a metal connection layer in the pixel opening, wherein the metal connection layer is disconnected at the first isolation layer; A second charge generation layer, a second light-emitting functional layer and a cathode electrode are sequentially deposited in the pixel opening; wherein the cathode electrode extends out of the pixel opening and is electrically connected to an adjacent cathode electrode.

[0012] In some embodiments, the prefabricated plate further includes a spacer structure disposed at intervals and protruding on the pixel definition layer, for supporting the mask; The step of depositing a first isolation layer on the pixel definition layer comprises: A cathode patterning material is evaporated through a corresponding mask plate to deposit a first isolation layer on the surface of the pixel definition layer and the spacer structure; wherein, in the radial direction of the pixel opening, the width of the first isolation layer is greater than or equal to the width of the spacer structure to at least cover the spacer structure and part of the pixel definition layer.

[0013] In some embodiments, the step of depositing a metal connection layer in the pixel opening, wherein the metal connection layer is disconnected at the first isolation layer, comprises: depositing a metal material on the surface of the first charge generation layer through a common mask, wherein the metal connection layer is disconnected at the first isolation layer; Later also includes: The second isolation layer is deposited on the surface of the first isolation layer by evaporating an insulating material through a corresponding mask plate; wherein the orthographic projection of the second isolation layer on the pixel definition layer covers the orthographic projection of the first isolation layer on the pixel definition layer; or, the orthographic projection of the second isolation layer on the pixel definition layer coincides with the orthographic projection of the first isolation layer on the pixel definition layer.

[0014] In order to solve the above technical problems, the third technical solution provided by the present application is to provide a display device. The display device includes: The display panel is the display panel provided in the above embodiment; The control circuit board is electrically connected to the display panel and is used to control the display panel to display corresponding images.

[0015] Beneficial effects of the present application: Different from the prior art, the present application provides a display panel, a method for preparing the same, and a display device. The display panel includes a driving substrate, a pixel definition layer, and a sub-pixel. Wherein, the sub-pixel is arranged in the pixel opening, including a stacked anode electrode, at least two stacked light-emitting functional layers, a cathode electrode, and a charge generation layer arranged between adjacent light-emitting functional layers to form a stacked light-emitting device, thereby improving the brightness and service life of the display panel. At the same time, by making the charge generation layer include a first charge generation layer, a metal connection layer, and a second charge generation layer stacked in sequence, that is, a metal connection layer is arranged between the first charge generation layer and the second charge generation layer, the voltage of the sub-pixel of the stacked structure is reduced, and the current stability of the sub-pixel is improved. Furthermore, by arranging a first isolation layer on the surface of the side of the pixel definition layer away from the driving substrate, the first isolation layer is extended along the extension direction of the pixel definition layer to form a mesh to surround the pixel opening, and the first isolation layer and the metal material are mutually repelled, so that the metal connection layer cannot be deposited on the first isolation layer, which can be used to isolate adjacent metal connection layers, and then the metal connection layer can be confined within the pixel opening, which can effectively reduce the problem of lateral conductive crosstalk of the metal connection layer, thereby reducing the lateral crosstalk between sub-pixels. At the same time, in the subsequent process of evaporating the light-emitting functional layer, when the FMM frequently rubs against the pixel definition layer and the spacer structure during the alignment process, it can effectively reduce the occurrence of the problem of exposure of the metal connection layer due to friction, avoid the distance between the metal connection layer and the cathode electrode from becoming smaller, thereby reducing the problem of direct conduction between the metal connection layer and the cathode electrode due to the close distance between the metal connection layer and the cathode electrode, which is easy to break through the light-emitting functional layer under high current, and reduce the problem of poor point screen and sub-pixel lateral crosstalk caused by the series conduction between the metal connection layer and the cathode electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 is a schematic cross-sectional structural diagram of a display panel provided in the first embodiment of the present application; Figure 2 is a schematic diagram of a planar structure of a display panel provided in the first embodiment of the present application; Figure 3 is another schematic cross-sectional view of the display panel provided in the first embodiment of the present application; Figure 4 is a schematic cross-sectional structural diagram of a display panel provided in the second embodiment of the present application; Figure 5 is a schematic diagram of a planar structure of a display panel provided in the second embodiment of the present application; Figure 6 is another schematic cross-sectional view of the display panel provided in the second embodiment of the present application; Figure 7 is a schematic diagram of a longitudinal cross-sectional structure of a display panel provided in the third embodiment of the present application; Figure 8 is another schematic diagram of a longitudinal cross-sectional structure of a display panel provided in the third embodiment of the present application; Fig. 9 is a schematic diagram of a process of a method for manufacturing a display panel provided in the first embodiment of the present application; Fig.10 It corresponds to Fig. 9 A schematic diagram of a process flow of an implementation method; Fig.11 is a schematic diagram of a process of a method for manufacturing a display panel provided in a second embodiment of the present application; Fig.12 It corresponds to Fig.11 A schematic diagram of a process flow of an implementation method; Fig.13 is a schematic diagram of a process of a method for manufacturing a display panel provided in a third embodiment of the present application; Fig.14 It corresponds to Fig.13 A schematic diagram of a process flow of an implementation method; Fig.15 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0018] Reference numerals: 100-display panel; 10-driving substrate; 20-pixel definition layer; 21-pixel opening; 22-spacer structure; 30-sub-pixel; 31-anode electrode; 32-light-emitting functional layer; 321-first light-emitting functional layer; 322-second light-emitting functional layer; 33-charge generating layer; 331-first charge generating layer; 332-second charge generating layer; 333-metal connection layer; 34-cathode electrode; 41-first isolation layer; 42-second isolation layer; 200-control circuit board. DETAILED DESCRIPTION

[0019] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0020] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] The terms "first", "second" and "third" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] With the continuous development of display technology, organic light emitting diode (OLED) display panels have become one of the mainstream display technologies in the future due to their advantages such as self-luminescence, wide viewing angle, fast response speed, thinness, and bendability. Among them, the underlying technology of sub-pixels has been listed as a new technology for key development by major panel manufacturers and terminal manufacturers due to its advantages such as high brightness and long life. In order to further reduce the voltage and stability of the stacked light-emitting device, it is often necessary to add a metal connection layer with good conductivity to the structural layer of the charge generation layer (CGL). However, in the evaporation process of the subsequent light-emitting functional layer after the metal connection layer, a high-precision metal mask (Fine Metal Mask, FMM) is required. The mask (FMM) will frequently rub against the pixel definition layer and / or the spacer structure during the alignment process, which can easily lead to the exposure of the metal connection layer, making the distance between the metal connection layer and the cathode electrode too close. When the light-emitting functional layer is further evaporated, the distance between the metal connection layer and the cathode electrode is too close. When the current flowing through the sub-pixel of the stacked structure is large, it is easy to break through the light-emitting functional layer, so that the cathode electrode and the metal connection layer in the charge generation layer are directly connected in series, resulting in poor display panel point screen. Moreover, after adding a metal connection layer in the charge generation layer, due to the existence of lateral conductive crosstalk, when the sub-pixel is lit, the upper light-emitting functional layer of the adjacent sub-pixel is also likely to be lit, resulting in the problem of lateral crosstalk lighting.

[0025] In order to solve the above technical problems, a groove is often dug or an undercut is used on the pixel definition layer so that the metal connection layer in the charge generation layer is disconnected at this location, thereby reducing the problem of series conduction between the metal connection layer and the cathode electrode and lateral conductive crosstalk. However, this design is not only complex in process, but also easily leads to poor continuity of the subsequently deposited cathode electrode film layer, thereby causing abnormal cathode conductivity.

[0026] The embodiment of the present application provides a display panel, which includes a driving substrate, a pixel definition layer and a sub-pixel. Wherein, the sub-pixel is arranged in the pixel opening, including a stacked anode electrode, at least two stacked light-emitting functional layers, a cathode electrode and a charge generation layer arranged between adjacent light-emitting functional layers to form a stacked light-emitting device, thereby improving the brightness and service life of the display panel. At the same time, by making the charge generation layer include a first charge generation layer, a metal connection layer and a second charge generation layer stacked in sequence, that is, a metal connection layer is arranged between the first charge generation layer and the second charge generation layer, the voltage of the sub-pixel of the stacked structure is reduced, and the current stability of the sub-pixel is improved. Further, by arranging a first isolation layer on the surface of the side of the pixel definition layer away from the driving substrate, the first isolation layer is extended along the extension direction of the pixel definition layer to form a mesh to surround the pixel opening, and the first isolation layer and the metal material are mutually repelled, so that the metal connection layer cannot be deposited on the first isolation layer, which can be used to isolate adjacent metal connection layers, and then the metal connection layer can be limited to the pixel opening, which can effectively reduce the problem of lateral conductive crosstalk due to the metal connection layer, thereby reducing the lateral crosstalk between sub-pixels. At the same time, in the subsequent process of evaporating the light-emitting functional layer, when the FMM frequently rubs against the pixel definition layer and the spacer structure during the alignment process, it can effectively reduce the exposure problem of the metal connection layer due to friction, and avoid the distance between the metal connection layer and the cathode electrode from becoming smaller, thereby reducing the problem of direct conduction between the metal connection layer and the cathode electrode due to the close distance between the metal connection layer and the cathode electrode, which is easy to break through the light-emitting functional layer under large current, and reducing the problem of poor point screen and sub-pixel lateral crosstalk caused by the series conduction between the metal connection layer and the cathode electrode.

[0027] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0028] See also Figure 1 and Figure 2 , Figure 1 is a schematic cross-sectional view of a display panel provided in the first embodiment of the present application, Figure 2 1 is a schematic diagram of a planar structure of a display panel provided in the first embodiment of the present application. In this embodiment, a display panel 100 is provided, and the display panel 100 includes: A driving substrate 10; The pixel definition layer 20 is protrudingly disposed on the driving substrate 10 and has a plurality of pixel openings 21; The sub-pixel 30 includes an anode electrode 31 stacked in the pixel opening 21, at least two stacked light-emitting functional layers 32, and a cathode electrode 34; wherein a charge generation layer 33 is further provided between adjacent light-emitting functional layers 32, and the charge generation layer 33 includes a first charge generation layer 331, a metal connection layer 333, and a second charge generation layer 332 stacked in sequence; and the cathode electrode 34 extends out of the pixel opening 21 and is electrically connected to the adjacent cathode electrode 34; Among them, a first isolation layer 41 is also provided on the surface of the side of the pixel definition layer 20 away from the driving substrate 10. The first isolation layer 41 extends along the extension direction of the pixel definition layer 20 to form a mesh to surround the pixel opening 21; and the first isolation layer 41 and the metal material repel each other to isolate the adjacent metal connection layer 333.

[0029] The driving substrate 10 includes a driving circuit for driving the sub-pixel 30 to emit light. The driving substrate 10 may be a silicon-based driving substrate 10, such as a monocrystalline silicon driving substrate 10 or a polycrystalline silicon driving substrate 10; the driving substrate 10 may be a hard substrate or a flexible driving substrate 10, which may be selected and designed according to the usage scenario and usage requirements. The driving circuit includes a plurality of sub-pixel 30 driving circuits, and the sub-pixel 30 driving circuit is composed of at least one semiconductor driving device and at least one energy storage device, so as to provide a driving signal to the sub-pixel 30, thereby driving the sub-pixel 30 to emit light.

[0030] The pixel definition layer 20 is disposed on the driving substrate 10 and protrudes from the driving substrate 10 to form a plurality of pixel openings 21 for accommodating the sub-pixels 30. Specifically, the pixel openings 21 can be formed by etching using a patterning process, such as a photolithography process or other patterning processes, to form a plurality of pixel openings 21 by etching. The pixel openings 21 are arranged in an array, and can be arranged specifically according to the arrangement design of the sub-pixels 30.

[0031] The sub-pixel 30 is disposed in the pixel opening 21 and is electrically connected to the drive substrate 10, thereby receiving a drive signal to perform a corresponding picture display operation. Specifically, the sub-pixel 30 includes an anode electrode 31, at least two stacked light-emitting functional layers 32, and a cathode electrode 34 stacked in sequence in a direction away from the drive substrate 10, to form a series-type stacked light-emitting device, thereby improving display brightness and extending service life.

[0032] Specifically, the anode electrode 31 is disposed on the driving substrate 10 and is electrically connected to the corresponding sub-pixel 30 driving circuit to receive the driving signal as the anode of the sub-pixel 30. The anode electrode 31 is exposed in the pixel opening 21 to contact and connect with the light-emitting functional layer 32. The material of the anode electrode 31 may include one of metal and conductive metal oxide or a combination of the two; wherein the metal material may be a metal conductive material such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), etc., and the metal oxide may be a metal oxide conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. For example, the anode electrode 31 may be a multilayer structure of "ITO layer-metal layer-ITO layer", which can be specifically arranged according to actual needs. The anode electrode 31 can be specifically formed by patterning through a patterning process, such as a patterning process such as a photolithography process or an evaporation process.

[0033] Specifically, the light-emitting functional layer 32 includes at least a hole transport layer, a light-emitting layer and an electron transport layer stacked in sequence to form a light-emitting unit. Further, the functional layer may also include a hole injection layer, an electron blocking layer and a hole blocking layer; wherein the hole injection layer may be arranged between the anode electrode 31 and the hole transport layer, the electron blocking layer may be arranged between the hole transport layer and the light-emitting layer, and the hole blocking layer may be arranged between the light-emitting layer and the electron transport layer. Specifically, the selection and setting may be made according to the use environment and light-emitting requirements of the display panel 100, and no specific limitation is made to this.

[0034] It should be noted that, in a specific embodiment, the sub-pixel 30 includes at least two stacked light-emitting functional layers 32, which may specifically include a first light-emitting functional layer 321, a second light-emitting functional layer 322, a third light-emitting functional layer, or even more, and the above-mentioned charge generation layer 33 is provided between adjacent light-emitting functional layers 32. In the embodiment of the present application, only the sub-pixel 30 including two stacked light-emitting functional layers 32 is used as an example for explanation, which does not mean that the sub-pixel 30 has only two stacked light-emitting functional layers 32. In other embodiments, the sub-pixel 30 may include more stacked light-emitting functional layers 32. In the embodiment of the present application, the two stacked light-emitting functional layers 32 are respectively a first light-emitting functional layer 321 and a second light-emitting functional layer 322. The first light-emitting functional layer 321 is provided between the anode electrode 31 and the charge generation layer 33, and the second light-emitting functional layer 322 is provided between the charge generation layer 33 and the cathode electrode 34.

[0035] Specifically, the color of the emitted light of the first light-emitting functional layer 321 is the same as the color of the emitted light of the second light-emitting functional layer 322, so that the color of the sub-pixel 30 is unified with the color of the emitted light of the two light-emitting functional layers 32. Specifically, the sub-pixel 30 may include a red sub-pixel 30, a green sub-pixel 30, and a blue sub-pixel 30, and the red sub-pixel 30, the green sub-pixel 30, and the blue sub-pixel 30 may be distributed and arranged according to a preset sub-pixel 30 color arrangement rule, wherein adjacent red sub-pixels 30, green sub-pixels 30, and blue sub-pixels 30 may form a pixel unit. In some embodiments, the sub-pixel 30 may also include a white sub-pixel 30, and the pixel unit may also include a white sub-pixel 30. In some embodiments, in the sub-pixel 30, the color of the emitted light of the first light-emitting functional layer 321 and the color of the emitted light of the second light-emitting functional layer 322 may also be different, thereby forming a sub-pixel 30 of a special color to meet some special display requirements.

[0036] The charge generation layer 33 is arranged between adjacent light-emitting functional layers 32, and is used to generate carriers and transfer the carriers to the corresponding film layer. The charge generation layer 33 includes a first charge generation layer 331, a metal connection layer 333, and a second charge generation layer 332, which are stacked in sequence. Specifically, the first charge generation layer 331 and the second charge generation layer 332 are respectively an N-type charge generation layer and a P-type charge generation layer, the N-type charge generation layer is used to generate electrons and transfer electrons to the corresponding film layer, and the P-type charge generation layer is used to generate holes and transfer holes to the corresponding film layer; wherein the first charge generation layer 331 is an N-type charge generation layer, and the second charge generation layer 332 is a P-type charge generation layer, or the first charge generation layer 331 is a P-type charge generation layer, and the second charge generation layer 332 is an N-type charge generation layer, which can be specifically arranged according to actual needs. The metal connection layer 333 can be used to reduce the voltage of the stacked light-emitting device to improve the current stability of the stacked light-emitting device. The metal connection layer 333 is made of metal material, specifically, metal conductive materials such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), or alloy materials thereof.

[0037] Among them, the cathode electrode 34 is arranged on the light-emitting functional layer 32 farthest from the driving substrate 10, and covers the light-emitting functional layer 32. The cathode electrodes 34 of adjacent sub-pixels 30 are electrically connected to each other, so that the cathode electrodes 34 form a continuous whole-surface electrode, thereby improving the uniformity of the cathode signal. The material of the cathode electrode 34 can be a metal material, such as aluminum (Al), silver (Ag), lithium (Li), magnesium (Mg), calcium (Ca), indium (In) and other metal conductive materials with low work function, so as to facilitate the injection of electrons; or it can also be an alloy of active low work function metals and chemically stable high work function metals such as magnesium silver alloy (Mg:Ag), lithium aluminum alloy (Li:Al).

[0038] In this embodiment, a first isolation layer 41 is further provided on the surface of the pixel definition layer 20 on the side away from the driving substrate 10, and the first isolation layer 41 extends along the extension direction of the pixel definition layer 20 to form a mesh to surround the pixel opening 21. That is, in the direction parallel to the driving substrate 10, the shape of the first isolation layer 41 is the same as or similar to the shape of the pixel definition layer 20, so that the first isolation layer 41 forms a mesh and can surround the pixel opening 21; this arrangement allows the use of a mask for patterning the pixel definition layer 20 when manufacturing the first isolation layer 41, that is, the first isolation layer 41 and the pixel definition layer 20 can share the same mask, without the need to increase the number of masks.

[0039] Furthermore, the first isolation layer 41 and the metal material repel each other to isolate the adjacent metal connection layer 333, that is, the metal connection layer 333 can be disconnected at the first isolation layer 41, which can effectively reduce the problem of lateral conductive crosstalk caused by the metal connection layer 333, thereby reducing the problem of the upper light-emitting functional layer 32 of the adjacent sub-pixel 30 being lit when the sub-pixel 30 is lit, and reducing the lateral crosstalk between the sub-pixels 30. Specifically, the material of the first isolation layer 41 may include a cathode patterning material (CPM), which is incompatible with the metal material and repel each other; the CPM material is a fluorine-containing organic material, such as a substituted fluorinated cyclotriphosphazene compound. The CPM material can be deposited on the pixel definition layer 20 by low-temperature vacuum evaporation to form the above-mentioned first isolation layer 41. The CPM material is incompatible with the metal material, so the metal material cannot be deposited on the first isolation layer 41. Therefore, when the metal connection layer 333 is subsequently produced by evaporating the metal material, the metal material cannot be deposited on the first isolation layer 41, so that the metal connection layer 333 is disconnected at the first isolation layer 41, that is, the metal connection layer 333 of the adjacent sub-pixel 30 is disconnected at the pixel definition layer 20.

[0040] At the same time, in the subsequent process of evaporating the light-emitting functional layer 32, when the FMM frequently rubs against the pixel definition layer 20 and the spacer structure 22 during the alignment process, since the metal connection layer 333 can be disconnected at the first isolation layer 41 on the pixel definition layer 20, the exposure problem of the metal connection layer 333 caused by friction can be effectively reduced, and the possibility of the distance between the metal connection layer 333 and the cathode electrode 34 becoming smaller is reduced, thereby reducing the problem of direct conduction between the metal connection layer 333 and the cathode electrode 34 due to the metal connection layer 333 and the cathode electrode 34 being easily broken through under large current due to the close distance between the metal connection layer 333 and the cathode electrode 34, and reducing the problem of poor point screen caused by series conduction between the metal connection layer 333 and the cathode electrode 34.

[0041] Please refer to Figure 1~Figure 3 , Figure 3is another cross-sectional structural schematic diagram of the display panel 100 provided in the first embodiment of the present application. Specifically, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is less than or equal to the width of the side surface of the pixel definition layer 20 away from the driving substrate 10. It can be understood that the orthographic projection of the first isolation layer 41 on the pixel definition layer 20 is located within the upper surface of the pixel definition layer 20, or coincides with the upper surface of the pixel definition layer 20; wherein, the side surface of the pixel definition layer 20 away from the driving substrate 10 is the upper surface of the pixel definition layer 20.

[0042] like Figure 1 and Figure 2 As shown, in this embodiment, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is smaller than the width of the surface of the pixel definition layer 20 on the side away from the driving substrate 10, that is, the orthographic projection of the first isolation layer 41 on the pixel definition layer 20 is located within the upper surface of the pixel definition layer 20 and does not completely cover the pixel definition layer 20. By means of this arrangement, the metal connection layer 333 in the charge generation layer 33 can be disconnected at the first isolation layer 41 on the pixel definition layer 20, thereby reducing the problem of lateral conductive crosstalk; at the same time, in the subsequent process of evaporating the second charge generation layer 332 and the light-emitting functional layer 32, when the FMM frequently rubs against the pixel definition layer 20 during the alignment process, it can also reduce the exposure of the metal connection layer 333 due to friction, and reduce the possibility of the distance between the metal connection layer 333 and the cathode electrode 34 becoming smaller, thereby reducing the problem of series connection between the metal connection layer 333 and the cathode electrode 34 caused by the breakdown of the light-emitting functional layer 32 by a large current, and reducing the problem of poor point screen caused by the series connection between the metal connection layer 333 and the cathode electrode 34. Moreover, by means of the above arrangement, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is smaller than the width of the pixel definition layer 20, which can reduce the material usage of the first isolation layer 41 and reduce the cost. At the same time, since the shape of the first isolation layer 41 is basically the same as that of the pixel definition layer 20, it can still be prepared by sharing the mask plate with the pixel definition layer 20, and only the process parameters need to be adjusted, such as the evaporation angle and evaporation rate related to the evaporation parameters, or the etching process parameters, etc., which depends on the preparation process and structural size.

[0043] like Figure 3As shown, in this embodiment, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is equal to the width of the side surface of the pixel definition layer 20 away from the driving substrate 10, that is, the positive projection of the first isolation layer 41 on the pixel definition layer 20 coincides with the upper surface of the pixel definition layer 20, or it can be understood that the first isolation layer 41 just covers the upper surface of the pixel definition layer 20. By making the first isolation layer 41 cover the upper surface of the pixel definition layer 20, the metal connection layer 333 can be better confined within the pixel opening 21, which can not only further reduce the lateral conductive crosstalk problem, but also in the subsequent process of evaporating the second charge generation layer 332 and the light-emitting functional layer 32, the possibility of the metal connection layer 333 being exposed due to the friction between the FMM and the pixel definition layer 20 during alignment can be further reduced, thereby further reducing the problem of the metal connection layer 333 being connected in series with the cathode electrode 34. Similarly, through this arrangement, in the radial direction of the pixel opening 21 , the width of the first isolation layer 41 is the same as the width of the pixel definition layer 20 , and the first isolation layer 41 and the pixel definition layer 20 can be prepared using a common mask.

[0044] See also Figure 4 and Figure 5 , Figure 4 is a schematic cross-sectional view of a display panel provided in the second embodiment of the present application, Figure 5 1 is a schematic diagram of a planar structure of a display panel 100 provided in the second embodiment of the present application. In this embodiment, the display panel 100 further includes a spacer structure 22, which is disposed protrudingly on the pixel definition layer 20 at intervals for supporting the mask; the first isolation layer 41 is also disposed on a side surface of the spacer structure 22 away from the drive substrate 10.

[0045] The spacer structure 22 is disposed on the pixel definition layer 20 at intervals to support the mask plate to protect the film structure on the display panel 100. The spacer structure 22 can be prepared by a patterning process, such as photolithography, deposition, inkjet printing and other patterning processes. The spacer structure 22 can be made of a transparent insulating material, such as polystyrene (PS).

[0046] Specifically, the first isolation layer 41 is also disposed on the side surface of the spacer structure 22 away from the driving substrate 10, that is, the first isolation layer 41 covers the surface of the spacer structure 22 protruding from the pixel definition layer 20. It can be understood that the first isolation layer 41 is deposited on the side surface of the pixel definition layer 20 and the spacer structure 22 away from the driving substrate 10 to form a continuous mesh film structure, so as to limit the metal connection layer 333 between adjacent sub-pixels 30 to the pixel opening 21, thereby reducing the risk of lateral conductive crosstalk caused by the metal connection layer 333, and reducing the risk of series connection between the metal connection layer 333 and the cathode connection layer, thereby reducing the risk of poor dot screen.

[0047] Please refer to Figure 5 and Figure 6 , Figure 6 2 is another cross-sectional view of the display panel provided in the second embodiment of the present application. Specifically, in the radial direction of the pixel opening 21 , the width of the first isolation layer 41 is greater than or equal to the width of the spacer structure 22 , so as to at least cover the spacer structure 22 and a portion of the pixel definition layer 20 .

[0048] Similar to the first embodiment, along the radial direction of the pixel opening 21, the width of the first isolation layer 41 is greater than or equal to the width of the spacer structure 22, so that the surface of the spacer structure 22 exposed relative to the pixel definition layer 20 is completely covered by the first isolation layer 41. It should be noted that in the deposition process such as evaporation, the spacer structure 22 is mainly used to support the mask. Therefore, in the process of aligning the mask with the drive substrate 10, the mask will frequently rub against the spacer structure 22, which can easily lead to the metal connection layer 333 being exposed at this location, so that the distance between the metal connection layer 333 and the cathode electrode 34 at this location is too close, which can easily lead to the metal connection layer 333 and the cathode electrode 34 at this location being connected in series, thereby causing the problem of poor dot screen. In this embodiment, the first isolation layer 41 covers the exposed surface of the spacer structure 22 so that the first isolation layer 41 cannot be deposited on the spacer structure 22 during the subsequent vapor deposition of the first isolation layer 41, thereby reducing the risk of the first isolation layer 41 being exposed due to friction, reducing the problem of series conduction between the metal connection layer 333 and the cathode electrode 34, and reducing the problem of poor screen dot caused by this.

[0049] At the same time, the first isolation layer 41 extends along the extension direction of the pixel definition layer 20 to form a continuous mesh film layer to cover at least a portion of the pixel definition layer 20 in the radial direction of the pixel opening 21. Since the metal connection layer 333 cannot be deposited on the first isolation layer 41, it can be disconnected at the pixel definition layer 20 to separate the metal connection layers 333 in adjacent sub-pixels 30, so that the metal connection layers 333 in each sub-pixel 30 are independent of each other, thereby reducing the lateral conductive crosstalk of the metal connection layer 333 causing pixel lighting crosstalk and reducing the yield risk.

[0050] like Figure 5 As shown, in this embodiment, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is equal to the width of the spacer structure 22, and the first isolation layer 41 covers the spacer structure 22 and at least a portion of the pixel definition layer 20, thereby reducing the risk of the metal connection layer 333 being exposed due to the friction between the mask and the spacer structure 22, reducing the problem of the metal connection layer 333 and the cathode clicking in series conduction, and at the same time, the metal connection layers 333 of each sub-pixel 30 can be made independent of each other, reducing the lateral conductive crosstalk of the metal connection layer 333 causing pixel lighting crosstalk, thereby reducing the problem of poor screen dotting and lateral conductive crosstalk when the pixel is lit, and improving the product yield; it can also reduce the material usage of the first isolation layer 41 and reduce production costs.

[0051] like Figure 6 As shown, in this embodiment, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is greater than the width of the spacer structure 22, and is the same as the width of the pixel definition layer 20, so that the first isolation layer 41 covers the spacer structure 22 and the pixel definition layer 20, which can better confine the metal connection layer 333 within the pixel opening 21, further reducing the risk of the metal connection layer 333 being exposed due to friction between the mask and the spacer structure 22, thereby further reducing the problem of the metal connection layer 333 and the cathode click series conduction, and can also better separate the metal connection layers 333 of each sub-pixel 30, further reducing the pixel lighting crosstalk caused by the lateral conductive crosstalk of the metal connection layer 333.

[0052] See also Figure 7 , Figure 7 1 is a schematic diagram of a longitudinal cross-sectional structure of a display panel 100 provided in the third embodiment of the present application. In this embodiment, the surface of the first isolation layer 41 away from the driving substrate 10 is also covered with a second isolation layer 42, and the material of the second isolation layer 42 is an insulating material.

[0053] Specifically, when the first isolation layer 41 is difficult to completely inhibit the adhesion of the metal material, in order to further isolate the metal connection layer 333 from the cathode electrode 34 and reduce the lateral conductive crosstalk, after the metal connection layer 333 is prepared, a second insulating layer formed by an insulating material can be covered on the first isolation layer 41, and the pixel definition layer 20 and the metal connection layer 333 at the spacer are further separated from the cathode electrode 34 by the second insulating layer, thereby improving the insulation stability between the metal connection layer 333 and the cathode electrode 34, and further reducing the problem of series connection between the metal connection layer 333 and the cathode electrode 34. The material of the second insulating layer can be an inorganic or organic insulating material with good insulation, such as lithium fluoride (LiF), an oxide insulating material or a CPL material, etc., which can be selected according to actual needs.

[0054] Please refer to Figure 7 and Figure 8 , Figure 8 is another longitudinal cross-sectional structural schematic diagram of the display panel 100 provided in the third embodiment of the present application. Specifically, the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 covers the orthographic projection of the first isolation layer 41 on the pixel definition layer 20; or, the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 coincides with the orthographic projection of the first isolation layer 41 on the pixel definition layer 20. That is, along the radial direction of the pixel opening 21, the edge of the second isolation layer 42 at least coincides with the edge of the first isolation layer 41, so that the second isolation layer 42 can completely cover the first isolation layer 41, thereby improving the insulation performance of the second isolation layer 42 between the metal connection layer 333 and the cathode electrode 34, and further reducing the risk of the metal connection layer 333 and the cathode electrode 34 being connected in series.

[0055] like Figure 7 As shown, in this embodiment, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is smaller than the width of the pixel definition layer 20, and the orthographic projection of the first isolation layer 41 on the pixel definition layer 20 is located within the upper surface of the first pixel isolation layer, and the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 covers the orthographic projection of the first isolation layer 41 on the pixel definition layer 20. That is, along the radial direction of the pixel opening 21, the edges of both sides of the second isolation layer 42 extend beyond the first isolation layer 41 to completely cover the first isolation layer 41, thereby further isolating the metal connection layer 333 and the cathode electrode 34, avoiding the metal connection layer 333 and the cathode electrode 34 from being connected in series, and reducing the lateral conductive crosstalk of the metal connection layer 333.

[0056] like Figure 8As shown, in this embodiment, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is the same as the width of the second isolation layer 42, and the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 coincides with the orthographic projection of the first isolation layer 41 on the pixel definition layer 20, so that the second isolation layer 42 has the same shape and size as the first isolation layer 41, and the second isolation layer 42 just completely covers the first isolation layer 41, thereby further isolating the metal connection layer 333 and the cathode electrode 34, avoiding series conduction between the metal connection layer 333 and the cathode electrode 34, and reducing the lateral conductive crosstalk of the metal connection layer 333.

[0057] Specifically, the method for preparing the display panel 100 provided in the above embodiment is described as follows. For details, please refer to the detailed introduction and description of the implementation method below.

[0058] See also Fig. 9 and Fig.10 , Fig. 9 is a schematic diagram of a process of manufacturing a display panel 100 provided in the first embodiment of the present application. Fig.10 It corresponds to Fig. 9 A process flow diagram of an embodiment. In this embodiment, a method for preparing a display panel 100 is provided. The method is used to prepare the display panel 100 provided in the above embodiment. The method comprises: S10: providing a prefabricated board; the prefabricated board comprises a driving substrate 10, a pixel definition layer 20 and an anode electrode 31; wherein the pixel definition layer 20 is protrudingly disposed on the driving substrate 10 and is formed with a plurality of pixel openings 21; and an anode electrode 31 is disposed in each pixel opening 21; S20: forming a first light-emitting functional layer 321 and a first charge generating layer 331 by sequentially depositing in the pixel opening 21; S30: depositing a first isolation layer 41 on the pixel definition layer 20; the first isolation layer 41 extends along the extension direction of the pixel definition layer 20 to form a mesh, surrounding each pixel opening 21, and the first isolation layer 41 and the metal material repel each other; S40: depositing a metal connection layer 333 in the pixel opening 21 , and the metal connection layer 333 is disconnected at the first isolation layer 41 ; S50 : depositing a second charge generation layer 332 , a second light-emitting functional layer 322 and a cathode electrode 34 in sequence in the pixel opening 21 ; wherein the cathode electrode 34 extends out of the pixel opening 21 and is electrically connected to adjacent cathode electrodes 34 .

[0059] The prefabricated board includes a driving substrate 10, a pixel definition layer 20 and an anode electrode 31. It can be understood that the prefabricated board is a substrate on which the anode electrode 31 and the pixel definition layer 20 are manufactured on the driving substrate 10. Specifically, the step of providing the prefabricated board may include: S11: providing a driving substrate 10; S12: manufacturing an anode electrode 31 on the driving substrate 10; S13 : forming a pixel definition layer 20 on the driving substrate 10 .

[0060] Among them, the anode electrode 31 can be patterned by an evaporation process or a photolithography process. The anode electrode 31 is electrically connected to the corresponding sub-pixel 30 driving circuit on the driving substrate 10 to receive the driving signal as the anode of the sub-pixel 30. The anode electrode 31 is arranged in an array, and can be patterned according to the arrangement design of the sub-pixel 30. The structure, material and function of the anode electrode 31 are the same as the structure, material and function of the anode electrode 31 involved in the above embodiment, and the details can be referred to the above introduction.

[0061] Among them, the pixel definition layer 20 can be manufactured by photolithography or other patterning processes to form a plurality of pixel openings 21 corresponding to the anode electrodes 31. The pixel openings 21 correspond to the anode electrodes 31 one by one, so that the anode electrodes 31 are exposed in the pixel openings 21 to contact and connect with the subsequent light-emitting functional layer 32.

[0062] Specifically, step S20 may include: S21: depositing a first hole transport layer, a first light emitting layer and a first electron transport layer in sequence in the pixel opening 21 to form a first light emitting functional layer 321 on the anode electrode 31; S22 : depositing a first charge generation layer 331 on the first light emitting functional layer 321 .

[0063] The structure and function of the first light-emitting functional layer 321 are the same or similar to those of the light-emitting functional layer 32 involved in the above embodiment, and the above detailed description may be referred to, which will not be repeated here. The first charge generation layer 331 may be specifically an N-type charge generation layer 33, which may be deposited on the first light-emitting functional layer 321 by an evaporation process to generate electrons and transfer the electrons to the electron transport layer.

[0064] Among them, in step S30, the first isolation layer 41 can be deposited on the pixel definition layer 20 through a high-precision metal mask (FMM), so that the first isolation layer 41 forms a continuous mesh film layer on the pixel definition layer 20 to surround each pixel opening 21. Specifically, an insulating material incompatible with the metal material can be used for evaporation to form the first isolation layer 41, so that when the metal material is subsequently evaporated, the metal material cannot adhere to the first isolation layer 41. Specifically, the cathode patterned material (CPM) can be used for evaporation to form the first isolation layer 41. The CPM material can be a fluorine-containing organic material, such as a fluorinated cyclotriphosphazene compound, which is incompatible with the metal material. Specifically, it can be deposited on the pixel definition layer 20 by low-temperature vacuum evaporation to form the first isolation layer 41.

[0065] In step S40, a metal connection layer 333 may be deposited on the first light-emitting functional layer 321 through a common metal mask (CMM). Since a first isolation layer 41 is previously formed on the pixel definition layer 20, when the metal connection layer 333 is evaporated, the metal material cannot adhere to the first isolation layer 41, so that the metal connection layer 333 is disconnected at the first isolation layer 41, so that the metal connection layer 333 between adjacent sub-pixels 30 is spaced apart, which can effectively reduce the risk of pixel lighting crosstalk caused by lateral conductive crosstalk of the metal connection layer 333.

[0066] Specifically, step S50 may include: S51: depositing a second charge generation layer 332 on the metal connection layer 333; S52: sequentially depositing a second hole transport layer, a second light emitting layer and a second electron transport layer on the second charge generation layer 332 in the pixel opening 21 to form a second light emitting functional layer 322 on the charge generation layer 33; S53 : depositing a cathode electrode 34 on the second light emitting functional layer 322 .

[0067] Among them, in steps S51, S52 and S53, a mask plate is required. In the process of each step, the mask plate needs to be aligned and set on the prefabricated plate first, and then the evaporation deposition is performed. In the process of mask plate alignment, the mask plate will inevitably rub against the pixel definition layer 20, and frequent friction can easily lead to the exposure of the metal connection layer 333 there. In this embodiment, by first forming the above-mentioned first isolation layer 41 on the pixel definition layer 20, the metal connection layer 333 cannot be deposited on the first isolation layer 41, so that in the subsequent steps S51, S52 and S53, the risk of the metal connection layer 333 being exposed due to the friction caused by the mask plate alignment is effectively reduced, thereby reducing the risk of the metal connection layer 333 and the cathode electrode 34 being connected in series at the pixel definition layer 20, and improving the product yield.

[0068] Specifically, in the steps of manufacturing the first charge generation layer 331 , the metal connection layer 333 , the second charge generation layer 332 and the cathode electrode 34 , a common metal mask (CMM) can be used for evaporation deposition, that is, a common metal mask (CMM) is shared, thereby reducing the manufacturing cost.

[0069] Specifically, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is less than or equal to the width of the surface of the pixel definition layer 20 on the side away from the driving substrate 10, which is the same as the design of the width of the first isolation layer 41 involved in the above embodiment. For details, please refer to the detailed description above and will not be repeated here.

[0070] See also Fig.11 and Fig.12 , Fig.11 is a schematic diagram of a process of manufacturing a display panel 100 provided in the second embodiment of the present application. Fig.12 It corresponds to Fig.11 A schematic diagram of a process flow of an embodiment. In this embodiment, the prefabricated plate further includes a spacer structure 22 disposed protrudingly and spaced apart from the pixel definition layer 20 for supporting the mask; The step S30 of depositing a first isolation layer 41 on the pixel definition layer 20 includes: S31: A cathode patterning material is evaporated through a corresponding mask plate to deposit a first isolation layer 41 on the surface of the pixel definition layer 20 and the spacer structure 22; wherein, in the radial direction of the pixel opening 21, the width of the first isolation layer 41 is greater than or equal to the width of the spacer structure 22, so as to at least cover the spacer structure 22 and a portion of the pixel definition layer 20.

[0071] Specifically, the step S10 of providing the prefabricated panels further includes: S14 : manufacturing a spacer structure 22 on the pixel definition layer 20 .

[0072] Among them, the spacer structure 22 is formed on the pixel definition layer 20, and can be made by patterning processes such as photolithography. The spacer structure 22 is mainly used to support the mask to protect the film structure on the display panel 100. The material of the spacer structure 22 can be made of transparent insulating material, such as polystyrene (PS). Specifically, by supporting the mask with the spacer structure 22, the friction between the mask and the pixel definition layer 20 can be reduced, thereby reducing the exposure of the metal connection layer 333 on the pixel definition layer 20 due to friction, and further reducing the risk of the metal connection layer 333 and the cathode electrode 34 being connected in series at the pixel definition layer 20 and the spacer structure 22, thereby improving the product yield.

[0073] See also Fig.13 and Fig.14 , Fig.13 is a schematic diagram of a process of manufacturing a display panel 100 provided in the third embodiment of the present application. Fig.14 It corresponds to Fig.13 Schematic diagram of a process flow of an embodiment. In this embodiment, step S40 of depositing a metal connection layer 333 in the pixel opening 21 and disconnecting the metal connection layer 333 at the first isolation layer 41 includes: S41: using a common mask to evaporate a metal material to form a metal connection layer 333 on the surface of the first charge generation layer 331 , and the metal connection layer 333 is disconnected at the first isolation layer 41 ; Later also includes: S42: An insulating material is evaporated through a corresponding mask plate to form a second isolation layer 42 on the surface of the first isolation layer 41; wherein the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 covers the orthographic projection of the first isolation layer 41 on the pixel definition layer 20; or, the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 coincides with the orthographic projection of the first isolation layer 41 on the pixel definition layer 20.

[0074] Among them, step S41 is the same as the above embodiment, and a metal material can be evaporated through a common metal mask (Common Metal Mask, CMM) to deposit and form a metal connection layer 333 on the first light-emitting functional layer 321. The metal material can be a metal conductive material such as (Au), silver (Ag), copper (Cu), aluminum (Al), or an alloy material thereof. The structure and function of the metal connection layer 333 are the same or similar to the structure and function of the metal connection layer 333 involved in the above embodiment, and the details can be referred to the above detailed description.

[0075] Among them, in step S42, insulating material can be evaporated through the mask plate used to make the first isolation layer 41 to deposit and form the second isolation layer 42 on the surface of the first isolation layer 41. When the first isolation layer 41 is difficult to completely inhibit the adhesion of the metal material, in order to further isolate the metal connection layer 333 from the cathode electrode 34 and reduce the lateral conductive crosstalk, after the metal connection layer 333 is prepared, a second insulating layer formed by an insulating material can be covered on the first isolation layer 41. The pixel definition layer 20 and the metal connection layer 333 at the spacer are further separated from the cathode electrode 34 by the second insulating layer, thereby improving the insulation stability between the metal connection layer 333 and the cathode electrode 34, and further reducing the problem of series conduction between the metal connection layer 333 and the cathode electrode 34.

[0076] Specifically, the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 covers the orthographic projection of the first isolation layer 41 on the pixel definition layer 20; or, the orthographic projection of the second isolation layer 42 on the pixel definition layer 20 coincides with the orthographic projection of the first isolation layer 41 on the pixel definition layer 20. This arrangement is the same as the arrangement between the second isolation layer 42 and the first isolation layer 41 involved in the above embodiment, and can achieve the same technical effect. For details, please refer to the above detailed description, which will not be repeated here.

[0077] See also Fig.15 , Fig.15 1 is a schematic diagram of a display device according to an embodiment of the present application. In this embodiment, a display device is provided, which can be used in display fields such as tablets, mobile phones, vehicles, VR glasses, and lighting equipment.

[0078] The display device comprises: The display panel 100 is the display panel 100 provided in the above embodiment; The control circuit board 200 is electrically connected to the display panel 100 and is used to control the display panel 100 to display corresponding images.

[0079] The specific structure and function of the display panel 100 are the same or similar to those of the display panel 100 in the above embodiment, and can achieve the same technical effect. For details, please refer to the above related introduction. Specifically, the display panel 100 can be prepared by the preparation method provided in the above embodiment, and the preparation method can refer to the above related introduction.

[0080] The control circuit board 200 is electrically connected to the display panel, and is used to provide the display panel 100 with various driving signals, power signals and other driving signals required by the display panel 100, so as to control the display panel 100 to display the corresponding picture.

[0081] In this embodiment, the display device is a stacked series OLED display device with high display brightness and long service life. Moreover, by providing the display panel 100, the display device can reduce the risk of poor screen dots caused by the metal connection layer 333 of the charge generation layer 33 and the cathode electrode 34 being connected in series and the risk of pixel lighting crosstalk caused by the lateral conductive crosstalk of the metal connection layer 333, thereby improving the product yield.

[0082] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, comprising: Driver substrate; A pixel definition layer is protrudingly disposed on the driving substrate and has a plurality of pixel openings; The sub-pixel comprises an anode electrode stacked in the pixel opening, at least two stacked light-emitting functional layers and a cathode electrode; wherein a charge generation layer is further arranged between adjacent light-emitting functional layers, and the charge generation layer comprises a first charge generation layer, a metal connection layer and a second charge generation layer stacked in sequence; the cathode electrode extends out of the pixel opening and is electrically connected to the adjacent cathode electrode; It is characterized in that a first isolation layer is further provided on the surface of the pixel definition layer on the side away from the driving substrate, and the first isolation layer extends along the extension direction of the pixel definition layer to form a mesh to surround the pixel opening; and the first isolation layer and the metal material repel each other to isolate the adjacent metal connection layer.

2. The display panel according to claim 1, characterized in that: The display panel further comprises a spacer structure which is arranged at intervals and protrudingly on the pixel definition layer for supporting the mask plate; the first isolation layer is also arranged on a side surface of the spacer structure away from the driving substrate.

3. The display panel according to claim 2, characterized in that: In the radial direction of the pixel opening, the width of the first isolation layer is greater than or equal to the width of the spacer structure, so as to at least cover the spacer structure and a portion of the pixel definition layer.

4. The display panel according to claim 2, characterized in that: A surface of the first isolation layer on one side away from the driving substrate is also covered with a second isolation layer, and the material of the second isolation layer is an insulating material.

5. The display panel according to claim 4, characterized in that: The orthographic projection of the second isolation layer on the pixel definition layer covers the orthographic projection of the first isolation layer on the pixel definition layer; or, the orthographic projection of the second isolation layer on the pixel definition layer coincides with the orthographic projection of the first isolation layer on the pixel definition layer.

6. The display panel according to claim 1, characterized in that: The material of the first isolation layer is a cathode patterning material, which is mutually exclusive with the metal material.

7. A method for preparing a display panel, characterized in that: include: Provide prefabricated panels; The prefabricated board includes a driving substrate, a pixel definition layer and an anode electrode; wherein the pixel definition layer is protrudingly disposed on the driving substrate and is formed with a plurality of pixel openings; and an anode electrode is disposed in each pixel opening; Depositing a first light-emitting functional layer and a first charge generating layer in the pixel opening in sequence; Depositing a first isolation layer on the pixel definition layer; the first isolation layer extends along the extension direction of the pixel definition layer to form a mesh, surrounding each pixel opening, and the first isolation layer and the metal material repel each other; Depositing a metal connection layer in the pixel opening, wherein the metal connection layer is disconnected at the first isolation layer; A second charge generation layer, a second light-emitting functional layer and a cathode electrode are sequentially deposited in the pixel opening; wherein the cathode electrode extends out of the pixel opening and is electrically connected to an adjacent cathode electrode.

8. The preparation method according to claim 7, characterized in that: The prefabricated plate further comprises a spacer structure which is arranged at intervals and protrudes on the pixel definition layer, and is used to support the mask plate; The step of depositing a first isolation layer on the pixel definition layer comprises: The first isolation layer is deposited on the surface of the pixel definition layer and the spacer structure by evaporating the cathode patterning material through the corresponding mask plate; wherein, in the radial direction of the pixel opening, the width of the first isolation layer is greater than or equal to the width of the spacer structure, so as to at least cover the spacer structure and part of the pixel definition layer.

9. The preparation method according to claim 7, characterized in that: The step of depositing a metal connection layer in the pixel opening and disconnecting the metal connection layer at the first isolation layer comprises: depositing a metal material on the surface of the first charge generation layer through a common mask, and disconnecting the metal connection layer at the first isolation layer; Later also includes: A second isolation layer is deposited on the surface of the first isolation layer by evaporating an insulating material through a corresponding mask plate; wherein the orthographic projection of the second isolation layer on the pixel definition layer covers the orthographic projection of the first isolation layer on the pixel definition layer; or, the orthographic projection of the second isolation layer on the pixel definition layer coincides with the orthographic projection of the first isolation layer on the pixel definition layer.

10. A display device, characterized in that: include: The display panel is a display panel as claimed in any one of claims 1 to 6; The control circuit board is electrically connected to the display panel and is used to control the display panel to display a corresponding picture.

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