A laser processing system and method for display panels

Abstract

This invention proposes a laser processing system and method for display panels. The processing system includes: a first laser for emitting an ablation laser; a scanning head for receiving the ablation laser and ablating the display layer and optical adhesive in the display panel; a second laser for emitting an ablation laser, and after the ablation laser ablates the display layer and optical adhesive, the ablation laser ablates the display layer to peel off the display layer and thin film layer, with the optical adhesive located on the thin film layer; a camera for taking pictures of the peeled thin film layer under top light and / or backlight to acquire the photographed image; and a processing module for obtaining the transparency of the optical adhesive from the photographed image and generating laser processing information of the display panel based on the transparency of the optical adhesive. This invention, after ablation and ablation processing of the display panel, can obtain the transparency of the optical adhesive on the thin film layer, allowing for an assessment of the processing precision of the laser cutting.

Description

Technical Field

[0001] This invention relates to the field of laser precision machining, and in particular to a laser machining system and method for display panels. Background Technology

[0002] The manufacturing process of Organic Light-Emitting Diode (OLED) display panels involves multiple steps, including substrate selection, transparent conductive layer deposition, organic light-emitting layer deposition, encapsulation, laser cutting / drilling, inspection / testing, and assembly / packaging. During the inspection / testing of the display panel, electrical performance tests can be performed to check the light emission of each pixel to ensure product quality. In existing technologies, after the laser cutting step, no cutting information corresponding to the transparent conductive layer and organic light-emitting layer is obtained at the physical level, making it impossible to understand the control precision related to laser cutting. Therefore, there is room for improvement. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a laser processing system and method for display panels, which solves the problem that the control precision related to laser cutting cannot be known after the laser cutting step in the prior art.

[0004] To achieve the above and other related objectives, the present invention provides a laser processing system for display panels, comprising:

[0005] The first laser is used to emit an ablation laser;

[0006] A scanning head is used to receive the ablation laser and ablate the display layer and optical adhesive in the display panel using the ablation laser. The display panel includes a display layer, optical adhesive and a thin film layer, wherein the optical adhesive is located between the display layer and the thin film layer.

[0007] The second laser is used to emit an ablation laser, and after the ablation laser ablates the display layer and the optical adhesive, the ablation laser is used to ablate the display layer to peel off the display layer and the thin film layer, with the optical adhesive located on the thin film layer;

[0008] A camera is used to take pictures of the peeled film layer under top light and / or back light to obtain photographic images;

[0009] The processing module is used to obtain the transparency of the optical adhesive from the photographed image and generate laser processing information of the display panel based on the transparency of the optical adhesive.

[0010] In one embodiment of the present invention, the laser processing system further includes:

[0011] A beam splitter is disposed at the emitting end of the first laser. The beam splitter is used to split the ablation laser into a first beam splitter and a second beam splitter according to a preset beam splitting ratio.

[0012] A laser monitoring module is used to monitor and analyze the first laser beam.

[0013] The scanning head is positioned on the side of the beam splitter from which the ablation laser is split, and the processing module analyzes the second beam splitter based on the beam splitting ratio and the monitoring and analysis data of the first beam splitter.

[0014] In one embodiment of the present invention, the laser processing system further includes a reflector located on the side of the beam splitter away from the first laser, and the emitting end of the first laser, the beam splitter, and the reflector are arranged along a straight line;

[0015] The reflector receives the second laser beam transmitted by the beam splitter and reflects it onto the scanning head, while the first laser beam reflected by the beam splitter illuminates the laser monitoring module.

[0016] In one embodiment of the present invention, the laser processing system further includes a reflector located on the side of the beam splitter away from the first laser, and the emitting end of the first laser, the beam splitter, and the reflector are arranged along a straight line;

[0017] The reflector receives the first laser beam transmitted by the beam splitter and reflects it onto the laser monitoring module. The second laser beam reflected by the beam splitter illuminates the scanning head.

[0018] In one embodiment of the present invention, the laser monitoring module acquires the first power corresponding to the first sub-laser, and the laser processing system further includes:

[0019] A power detection instrument, located on the emitting side of the scanning head, is used to detect the second power corresponding to the second laser beam emitted by the scanning head;

[0020] The processing module is also used to determine whether the ratio of the first power to the second power is the same as the beam splitter ratio;

[0021] When the ratio of the first power to the second power is the same as the beam splitter ratio, the power detection instrument and the laser monitoring module are deemed to be normal; when the ratio of the first power to the second power is different from the beam splitter ratio, the power detection instrument and / or the laser monitoring module are deemed to be abnormal.

[0022] In one embodiment of the present invention, the camera is used to take pictures according to the following steps:

[0023] When the peeled film layer is placed face up, take pictures under top light and / or back light to obtain the corresponding top light image and / or back light image when the film layer is face up.

[0024] When the peeled film layer is placed on its reverse side, take pictures under top light and / or back light to obtain the corresponding top light image and / or back light image when the film layer is on its reverse side.

[0025] In one embodiment of the present invention, the processing module is used to obtain the transparency of the optical adhesive according to the following steps:

[0026] Compare the transparency of the optical adhesive with a preset transparency threshold;

[0027] When the transparency of the optical adhesive is greater than or equal to a preset transparency threshold, laser processing information that meets the process requirements is generated.

[0028] When the transparency of the optical adhesive is less than a preset transparency threshold, laser processing information that does not meet the process requirements is generated.

[0029] In one embodiment of the present invention, after generating laser processing information that does not meet the process requirements,

[0030] The processing module is also used to perform control according to the following steps:

[0031] Increase the power of the ablation laser, keep other processing parameters of the ablation laser, and ablate the display layer in another display panel by using a second laser beam split from the ablation laser;

[0032] After the second laser ablates the display layer, the ablation laser ablates the display layer to peel off the display layer and the thin film layer in another display panel, with the optical adhesive located on the thin film layer.

[0033] The transparency of the optical adhesive is obtained, and based on the transparency of the optical adhesive, laser processing information for another display panel is generated.

[0034] In one embodiment of the present invention, the laser processing system further includes a beam expander disposed between the first laser and the beam splitter;

[0035] Alternatively, the laser processing system may further include an attenuator disposed between the first laser and the beam splitter.

[0036] This invention also proposes a laser processing method for a display panel, characterized by comprising:

[0037] An ablation laser is emitted by a first laser to ablate the display layer and optical adhesive in the display panel. The display panel includes a display layer, optical adhesive, and a thin film layer, with the optical adhesive located between the display layer and the thin film layer.

[0038] An ablation laser is emitted by a second laser. After the ablation laser ablates the display layer and the optical adhesive, the display layer is ablated by the ablation laser to peel off the display layer and the thin film layer. The optical adhesive is located on the thin film layer.

[0039] The peeled film layer is photographed under top light and / or back light to obtain photographic images;

[0040] The transparency of the optical adhesive is obtained from the photographed image, and the laser processing information of the display panel is generated based on the transparency of the optical adhesive.

[0041] As described above, the laser processing system and method for display panels of the present invention have the following beneficial effects: after the display panel is ablated and melted, the transparency of the optical adhesive on the thin film layer in the display panel can be obtained, thereby revealing the processing precision of the laser cutting. Attached Figure Description

[0042] Figure 1 This is a structural block diagram of a laser processing system for a display panel provided in an embodiment of the present invention.

[0043] Figure 2 For the present invention in Figure 1 The structural block diagram of adding an attenuator in the laser processing system of the display panel.

[0044] Figure 3 This is a schematic diagram of a structure for ablation treatment of a display panel according to an embodiment of the present invention.

[0045] Figure 4 This is a schematic diagram of a structure for ablating a display panel according to an embodiment of the present invention.

[0046] Figure 5 This is a schematic diagram of the structure of a display panel after ablation treatment according to an embodiment of the present invention.

[0047] Figure 6 This is a structural block diagram of a laser processing system for a display panel provided in another embodiment of the present invention.

[0048] Figure 7 In a display panel provided according to an embodiment of the present invention, the thin film layer is disposed on the front and is photographed under top light.

[0049] Figure 8 For the present invention in Figure 7 The provided display panel has the thin film layer facing forward, and the image is taken under backlight.

[0050] Figure 9 For the present invention in Figure 7 The provided display panel has the thin film layer set on the reverse side, and the image is taken under top light.

[0051] Figure 10 For the present invention in Figure 7 The provided display panel has a thin film layer set on the reverse side, and the image is taken under backlight.

[0052] Figure 11 In another embodiment of the present invention, a thin film layer is disposed on the front of the display panel, and the image is taken under top light.

[0053] Figure 12 For the present invention in Figure 11 The provided display panel has the thin film layer facing forward, and the image is taken under backlight.

[0054] Figure 13 For the present invention in Figure 11 The provided display panel has the thin film layer set on the reverse side, and the image is taken under top light.

[0055] Figure 14 For the present invention in Figure 11 The provided display panel has a thin film layer set on the reverse side, and the image is taken under backlight.

[0056] Figure 15 This is a schematic diagram illustrating the steps of a laser processing method for a display panel according to an embodiment of the present invention.

[0057] Figure Labels

[0058] 100. Display panel; 101. Display layer; 102. Thin film layer; 103. Glass substrate; 104. Indium tin oxide layer; 105. Electroluminescent film layer; 106. Silver layer;

[0059] 10. First laser; 20. Beam splitter; 30. Laser monitoring module; 40. Scanning head; 410. Power detection instrument; 50. Camera; 60. Processing module; 610. Host computer; 620. Sub-computer; 710. Beam expander; 720. Attenuator; 80. Reflector. Detailed Implementation

[0060] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0061] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0062] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the invention. However, it will be apparent to those skilled in the art that embodiments of the invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the invention.

[0063] Please see Figures 1 to 15 This invention proposes a laser processing system and method for display panels, applicable to the field of laser precision processing, such as the processing of organic light-emitting diode (OLED) display panels. After ablation and melting of the display panel, this invention can obtain the transparency of the optical adhesive on the thin film layer of the display panel, thereby determining whether the laser processing meets the process requirements and facilitating the understanding of the processing precision of laser cutting. Detailed descriptions are provided below using specific embodiments.

[0064] Please see Figure 1 , Figure 2 In one embodiment of the present invention, a laser processing system for a display panel is proposed, which may include a first laser 10, a beam splitter 20, a laser monitoring module 30, a scanning head 40, a second laser, a camera 50, and a processing module 60.

[0065] Specifically, the first laser 10 can be used to emit an ablation laser to ablate the display panel 100. Laser ablation is a process that uses a high-energy-density laser beam to emit onto the surface of a material, causing the material to be rapidly heated locally to its vaporization temperature or undergo a phase change and thus removed.

[0066] Specifically, the second laser (not shown in the figure) can be used to emit an ablation laser to ablate the display panel 100. Laser ablation is a key process in laser processing. It uses a high-energy-density laser beam to emit onto the surface of the material, causing the material to be rapidly heated, melted, vaporized, or decomposed locally, thereby removing the material.

[0067] like Figure 3 , Figure 4 ,and Figure 5 As shown, the display panel 100 includes a display layer 101 and a thin film layer 102. The display layer 101 may include an electroluminescent (EL) film layer 105 and a silver layer 106, with the silver layer 106 disposed between the two EL film layers 105. The EL film layers 105 and the silver layer 106 have different absorption rates for different types of light; specifically, the EL film layers 105 and the silver layer 106 have the highest absorption rate under green light, therefore the ablation laser can be a green laser. The thin film layer 102 includes a glass substrate 103 and an indium tin oxide (ITO) layer 104. The ablation laser can be a red laser.

[0068] For example, an optical adhesive (not shown) is formed between the display layer 101 and the thin film layer 102, that is, an optical adhesive is formed between the indium tin oxide layer 104 and the electroluminescent film layer 105. The optical adhesive is not only used to bond different layers, but also has multiple functions to ensure the performance and reliability of the display.

[0069] Specifically, the beam splitter 20 is used to split the ablation laser emitted by the first laser 10 according to a splitting ratio. The beam splitter 20 is located at the emitting end of the first laser 10. In the field of lasers, the beam splitter 20 (also called a beam splitter or beam splitter) is an optical element that can divide an incident laser beam into two or more parts. The beam splitter 20 distributes the light intensity according to a certain ratio; part of the light is reflected, and the other part passes through the beam splitter 20. This ratio can be 50%:50%, or it can be customized according to specific application requirements.

[0070] Specifically, the laser monitoring module 30 is used to monitor the first laser beam split by the beam splitter 20, and the processing module 60 analyzes the second laser beam based on the beam splitting ratio and the monitoring and analysis data of the first laser beam.

[0071] Specifically, the scanning head 40 is used to receive the second laser beam and to ablate the display layer 101 and optical adhesive in the display panel 100 using the second laser beam. After the second laser beam ablates the display layer 101 and optical adhesive, it will leave obvious grayish-brown marks and uniformly cover the light spot marks, such as... Figure 1 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the second laser beam will leave a light spot mark on the optical adhesive.

[0072] After the second laser ablates the display layer 101 and the optical adhesive, the second laser emits an ablation laser to ablate the display layer 101, thereby separating the display layer 101 from the thin film layer 102, with the optical adhesive remaining on the thin film layer 102. For example, the second laser can be positioned to one side of the first laser 10. The second laser can emit light from a beam splitter 20, and under the action of the beam splitter 20, laser monitoring module 30, scanning head 40, camera 50, and processing module 60, the display layer 101 is ablated.

[0073] Specifically, camera 50 is used to take pictures of the peeled thin film layer 102 under top light and / or back light to acquire photographic images. Processing module 60 is used to obtain the transparency of the optical adhesive from the photographic images and generate laser processing information of display panel 100 based on the transparency of the optical adhesive.

[0074] Please see Figure 6 , Figure 7 , Figure 8 and Figure 9 In one embodiment of the present invention, the transmittance of the optical adhesive is less than 70%. After the second laser scan, the scanned area shows obvious grayish-brown marks that uniformly cover the light spot marks. The light spot marks within the scanned area are clear as... Figure 7 and Figure 8 When observed from the reverse side with a backlight, the light emission is not obvious. Figure 9 .

[0075] Please see Figure 6 , Figure 7 , Figure 8 and Figure 9 In one embodiment of the present invention, the transmittance of the optical adhesive is less than 70%, corresponding to an ablation laser frequency of 100 kHz, a focal length of 255 mm, a scanning speed of 2000 mm / s, and a power of 8 W. After the second laser scan, as... Figure 6 , Figure 9 The scanned area shows obvious grayish-brown marks that are evenly covered by light spots. The light spots within the scanned area are clear, as shown... Figure 7 and Figure 8 When observed from the reverse side with a backlight, the light emission is not obvious, such as... Figure 9 This does not meet the process requirements.

[0076] Please see Figure 10 , Figure 11 , Figure 12 and Figure 13In one embodiment of the present invention, the transmittance of the optical adhesive is less than 70%, corresponding to an ablation laser frequency of 100 kHz, a focal length of 255 mm, a scanning speed of 2000 mm / s, and a power of 9 W. After the second laser scan, as... Figure 10 , Figure 13 The scanned area shows obvious grayish-brown marks that are evenly covered by light spots. The light spots within the scanned area are clear, as shown... Figure 11 and Figure 12 When viewed from the reverse side with a backlight, the light emission is more pronounced, such as... Figure 9 It meets the process requirements.

[0077] Therefore, it can be seen that, Figure 1 As shown, the ablation laser, at an appropriate power, ablates the display layer 101 and the optical adhesive to a greater depth and with a better ablation effect. This results in higher transparency of the optical adhesive on the thin film layer 102 after the ablation laser ablates the display layer 101, meeting the process requirements.

[0078] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the laser processing system further includes a beam expander 710 or an attenuator 720, which is disposed between the first laser 10 and the beam splitter 20.

[0079] Specifically, such as Figure 1 As shown, a beam expander 710 is disposed between the first laser 10 and the beam splitter 20. The beam expander 710 can be used to expand the diameter of the laser beam while reducing its divergence angle.

[0080] Specifically, such as Figure 2 As shown, an attenuator 720 is provided between the first laser 10 and the beam splitter 20. The attenuator 720 is used to control the light intensity, such as a device to reduce the intensity of the beam, and the attenuator 720 does not significantly change other characteristics of the beam, such as wavelength, polarization state or propagation direction.

[0081] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of the present invention, the laser processing system further includes a reflector 80, which is located on the side of the beam splitter 20 away from the first laser 10, and the emitting end of the first laser 10, the beam splitter 20 and the reflector 80 are arranged in a straight line.

[0082] Specifically, such as Figure 1 and Figure 2As shown, the reflector 80 receives the second laser beam split from the beam splitter 20 and reflects it onto the scanning head 40. The first laser beam split from the beam splitter 20 is directly emitted to the laser monitoring module 30, which is used to detect the power of the first laser beam.

[0083] Furthermore, due to the beam splitting effect of the beam splitter 20, the ratio of the energy of the first split laser to the energy of the second split laser is known. Therefore, even if the laser monitoring module 30 only detects the power of the first split laser, it can still determine the power of the second split laser. For example, the processing module 60 analyzes the second split laser based on the beam splitting ratio and the monitoring and analysis data of the first split laser.

[0084] Specifically, such as Figure 14 As shown, the reflector 80 receives the first laser beam split by the beam splitter 20 and reflects it onto the laser monitoring module 30. The second laser beam split by the beam splitter 20 is directly emitted onto the scanning head 40.

[0085] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the laser monitoring module 30 acquires the first power corresponding to the first sub-laser, and the laser processing system further includes a power detection instrument 410, which is located on the emitting side of the scanning head 40 and is used to detect the second power corresponding to the second sub-laser emitted by the scanning head 40.

[0086] Specifically, the processing module 60 is electrically connected to the power detection instrument 410 and the laser monitoring module 30 to acquire a first power and a second power, which are used to determine whether the ratio of the first power to the second power is the same as the beam splitter ratio of the beam splitter 20. When the ratio of the first power to the second power is the same as the beam splitter ratio, the power detection instrument and the laser monitoring module are functioning normally. When the ratio of the first power to the second power is different from the beam splitter ratio, the power detection instrument and / or the laser monitoring module are malfunctioning.

[0087] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the processing module 60 is electrically connected to the attenuator 720, and the processing module 60 adjusts the beam intensity of the ablation laser output by the attenuator 720 based on the magnitude of the first power and the second power.

[0088] Please see Figure 1 , Figure 2 and Figure 14In one embodiment of the present invention, the camera 50 takes pictures according to the following steps: When the peeled-off film layer 102 is placed face up, a picture is taken under top light and / or back light to obtain a top-lit image and / or back-lit image corresponding to the face of the film layer 102. When the peeled-off film layer 102 is placed face down, a picture is taken under top light and / or back light to obtain a top-lit image and / or back-lit image corresponding to the face of the film layer 102.

[0089] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of the present invention, the processing module 60 is used to obtain the transparency of the optical adhesive according to the following steps: The processing module 60 compares the transparency of the optical adhesive with a preset transparency threshold. When the transparency of the optical adhesive is greater than or equal to the preset transparency threshold, laser processing information that meets the process requirements is generated. When the transparency of the optical adhesive is less than the preset transparency threshold, laser processing information that does not meet the process requirements is generated.

[0090] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of the present invention, after generating laser processing information that does not meet the process requirements, the processing module 60 is further configured to perform processing according to the following steps: The power of the ablation laser is increased, while maintaining other processing parameters of the ablation laser, and the display layer 101 in another display panel 100 is ablated using a second beam split from the ablation laser. After the second beam splits the display layer 101, the display layer 101 is ablated using an ablation laser to peel off the display layer 101 and the thin film layer 102 in the other display panel 100, with the optical adhesive located on the thin film layer 102. The processing module 60 obtains the transparency of the optical adhesive and generates laser processing information for the other display panel 100 based on the transparency of the optical adhesive.

[0091] Please see Figure 15 In one embodiment of the present invention, a laser processing method for a display panel may also be provided, which may include the following steps.

[0092] Step S10: An ablation laser is emitted by a first laser to ablate the display layer and optical adhesive in the display panel. The display panel includes a display layer, optical adhesive and a thin film layer, with the optical adhesive located between the display layer and the thin film layer.

[0093] Step S20: An ablation laser is emitted by the second laser. After the ablation laser ablates the display layer and the optical adhesive, the display layer is ablated by the ablation laser to peel off the display layer and the thin film layer. The optical adhesive is located on the thin film layer.

[0094] Step S30: Take a picture of the peeled film layer under top light and / or back light to obtain the picture.

[0095] Step S40: Obtain the transparency of the optical adhesive from the photographed image, and generate laser processing information for the display panel based on the transparency of the optical adhesive.

[0096] For details, please refer to Figure 6 , Figure 7 , Figure 8 and Figure 9 The optical adhesive has a light transmittance of less than 70%, corresponding to an ablation laser frequency of 100kHz, a focal length of 255mm, a scanning speed of 2000mm / s, and a power of 8W. After the second laser scan, as... Figure 6 , Figure 9 The scanned area shows obvious grayish-brown marks that are evenly covered by light spots. The light spots within the scanned area are clear, as shown... Figure 7 and Figure 8 When observed from the reverse side with a backlight, the light emission is not obvious, such as... Figure 9 This does not meet the process requirements.

[0097] Please see Figure 10 , Figure 11 , Figure 12 and Figure 13 The optical adhesive has a light transmittance of less than 70%, corresponding to an ablation laser frequency of 100kHz, a focal length of 255mm, a scanning speed of 2000mm / s, and a power of 9W. After the second laser scan, as... Figure 10 , Figure 13 The scanned area shows obvious grayish-brown marks that are evenly covered by light spots. The light spots within the scanned area are clear, as shown... Figure 11 and Figure 12 When viewed from the reverse side with a backlight, the light emission is more pronounced, such as... Figure 9 It meets the process requirements.

[0098] Therefore, it can be seen that, Figure 1 As shown, the ablation laser, at an appropriate power, ablates the display layer 101 and the optical adhesive to a greater depth and with a better ablation effect. This results in higher transparency of the optical adhesive on the thin film layer 102 after the ablation laser ablates the display layer 101, meeting the process requirements.

[0099] In summary, the laser processing system and method for display panels disclosed in this invention allow for the determination of the transparency of the optical adhesive on the thin film layer of the display panel after ablation and melting treatment, thereby revealing the processing precision of the laser cutting. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and possesses high industrial applicability.

[0100] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A laser processing system for a display panel, characterized in that, include: The first laser is used to emit an ablation laser; A scanning head is used to receive the ablation laser and ablate the display layer and optical adhesive in the display panel using the ablation laser. The display panel includes a display layer, optical adhesive and a thin film layer, wherein the optical adhesive is located between the display layer and the thin film layer. The second laser is used to emit an ablation laser, and after the ablation laser ablates the display layer and the optical adhesive, the ablation laser is used to ablate the display layer to peel off the display layer and the thin film layer, with the optical adhesive located on the thin film layer; A camera is used to take pictures of the peeled film layer under top light and / or back light to obtain photographic images; The processing module is used to obtain the transparency of the optical adhesive from the photographed image, and generate laser processing information of the display panel based on the transparency of the optical adhesive. Specifically, when the transparency of the optical adhesive is greater than or equal to a preset transparency threshold, laser processing information that meets the process requirements is generated; when the transparency of the optical adhesive is less than the preset transparency threshold, laser processing information that does not meet the process requirements is generated.

2. The laser processing system for a display panel according to claim 1, characterized in that, The laser processing system also includes: A beam splitter is disposed at the emitting end of the first laser. The beam splitter is used to split the ablation laser into a first beam splitter and a second beam splitter according to a preset beam splitting ratio. A laser monitoring module is used to monitor and analyze the first laser beam. The scanning head is positioned on the side of the beam splitter from which the ablation laser is split, and the processing module analyzes the second beam splitter based on the beam splitting ratio and the monitoring and analysis data of the first beam splitter.

3. The laser processing system for a display panel according to claim 2, characterized in that, The laser processing system also includes a reflector, which is located on the side of the beam splitter away from the first laser, and the emitting end of the first laser, the beam splitter, and the reflector are arranged in a straight line; The reflector receives the second laser beam transmitted by the beam splitter and reflects it onto the scanning head, while the first laser beam reflected by the beam splitter illuminates the laser monitoring module.

4. The laser processing system for a display panel according to claim 2, characterized in that, The laser processing system also includes a reflector, which is located on the side of the beam splitter away from the first laser, and the emitting end of the first laser, the beam splitter, and the reflector are arranged in a straight line; The reflector receives the first laser beam transmitted by the beam splitter and reflects it onto the laser monitoring module. The second laser beam reflected by the beam splitter illuminates the scanning head.

5. The laser processing system for a display panel according to claim 2, characterized in that, The laser monitoring module acquires the first power corresponding to the first sub-laser, and the laser processing system further includes: A power detection instrument, located on the emitting side of the scanning head, is used to detect the second power corresponding to the second laser beam emitted by the scanning head; The processing module is also used to determine whether the ratio of the first power to the second power is the same as the beam splitter ratio; When the ratio of the first power to the second power is the same as the beam splitter ratio, the power detection instrument and the laser monitoring module are deemed to be normal; when the ratio of the first power to the second power is different from the beam splitter ratio, the power detection instrument and / or the laser monitoring module are deemed to be abnormal.

6. The laser processing system for a display panel according to claim 2, characterized in that, The camera is used to take pictures according to the following steps: When the peeled film layer is placed face up, take pictures under top light and / or back light to obtain the corresponding top light image and / or back light image when the film layer is face up. When the peeled film layer is placed face down, take pictures under top light and / or back light to obtain the corresponding top light image and / or back light image when the film layer is face down.

7. The laser processing system for a display panel according to claim 6, characterized in that, The processing module is used to obtain the transparency of the optical adhesive according to the following steps: Compare the transparency of the optical adhesive with a preset transparency threshold; When the transparency of the optical adhesive is greater than or equal to a preset transparency threshold, laser processing information that meets the process requirements is generated. When the transparency of the optical adhesive is less than a preset transparency threshold, laser processing information that does not meet the process requirements is generated.

8. The laser processing system for a display panel according to claim 7, characterized in that, After generating laser processing information that does not meet the process requirements, The processing module is also used to perform control according to the following steps: Increase the power of the ablation laser, keep other processing parameters of the ablation laser, and ablate the display layer in another display panel by using a second laser beam split from the ablation laser; After the second laser ablates the display layer, the ablation laser ablates the display layer to peel off the display layer and the thin film layer in another display panel, with the optical adhesive located on the thin film layer. The transparency of the optical adhesive is obtained, and based on the transparency of the optical adhesive, laser processing information for another display panel is generated.

9. The laser processing system for a display panel according to claim 2, characterized in that, The laser processing system further includes a beam expander, which is disposed between the first laser and the beam splitter; Alternatively, the laser processing system may further include an attenuator disposed between the first laser and the beam splitter.

10. A laser processing method for a display panel, characterized in that, include: An ablation laser is emitted by a first laser to ablate the display layer and optical adhesive in the display panel. The display panel includes a display layer, optical adhesive, and a thin film layer, with the optical adhesive located between the display layer and the thin film layer. An ablation laser is emitted by a second laser. After the ablation laser ablates the display layer and the optical adhesive, the display layer is ablated by the ablation laser to peel off the display layer and the thin film layer. The optical adhesive is located on the thin film layer. The peeled film layer is photographed under top light and / or back light to obtain photographic images; The transparency of the optical adhesive is obtained from the photographed image, and laser processing information of the display panel is generated based on the transparency of the optical adhesive. Specifically, when the transparency of the optical adhesive is greater than or equal to a preset transparency threshold, laser processing information that meets the process requirements is generated; when the transparency of the optical adhesive is less than the preset transparency threshold, laser processing information that does not meet the process requirements is generated.

Images