Diamond wire cutting method

Abstract

The invention provides a diamond wire cutting method which comprises the following steps: a feeding step: clamping a bar material by a working platform, and conveying the bar material to a machining initial position; a cutting step, specifically, the diamond wire is controlled to cut the bar in a reciprocating routing mode, and in the cutting process, along with the increase of the cutting depth of the bar, the set value of the machine speed of bar movement and the set value of the cutter feeding line speed of diamond wire movement are set to be increased firstly and then decreased; and the working platform drives all the bars to be separated from the diamond wire. The problem that in the prior art, abnormal diamond wire cutting force is insufficient, and wire marks are likely to be generated is solved.

Description

Technical Field

[0001] The invention relates to the field of silicon wafer processing, and in particular to a diamond wire cutting method. Background Art

[0002] At present, in the photovoltaic market, large-size silicon wafers have brought significant economic benefits in the cutting of solar silicon wafers. Compared with the conventional silicon wafers of 156.75 mm, the area of ​​182.2 mm silicon wafers has increased by 25%, which increases the effective light-emitting area of ​​a single module, and the conversion efficiency and power are also improved. Large-size silicon wafers reduce the number of cells required for a unit module, reduce costs, and improve the return on investment of the module. Because of this, it also requires silicon wafers to have extremely high flatness accuracy and extremely small surface roughness. However, in silicon wafer cutting, there are some abnormal diamond wires, such as uneven sandblasting, diamond wires with short cutting force maintenance time, etc. The insufficient cutting ability will produce a large number of line-marked silicon wafers. The line marks on the surface of the silicon wafers are deep and shallow, accounting for 20-30% of the defective silicon wafers, which seriously affects the quality yield of the silicon wafers. Summary of the invention

[0003] The main purpose of the present invention is to provide a diamond wire cutting method to solve the problem in the prior art that the abnormal diamond wire cutting force is insufficient and wire marks are easily generated.

[0004] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, a diamond wire cutting method is provided, comprising: a loading step: a working platform clamps the bar material and conveys the bar material to the starting position of processing; a cutting step: controlling the diamond wire to cut the bar material in a reciprocating manner, and during the cutting process, as the cutting depth of the bar material increases, the table speed setting value for the movement of the bar material and the cutting line speed setting value for the movement of the diamond wire are both first increased and then decreased; a unloading step: the working platform drives the bar material to completely separate from the diamond wire.

[0005] Furthermore, the diamond wire cutting method also includes: during the cutting step, when the table speed setting value is set to increase, the cutting line speed is set to increase or remain unchanged; when the table speed setting value is set to decrease, the cutting line speed setting value is set to decrease or remain unchanged; when the cutting line speed is set to increase, the table speed setting value is set to increase or remain unchanged; when the cutting line speed setting value is set to decrease, the table speed setting value is set to decrease or remain unchanged.

[0006] Furthermore, the diamond wire cutting method also includes: during the cutting step, obtaining the actual cutting depth of the rod material, and comparing the actual cutting depth with the first preset depth. When the actual cutting depth is less than the first preset depth, setting at least one of the cutting line speed setting value and the table speed setting value to keep increasing.

[0007] Furthermore, the diamond wire cutting method further comprises: during the cutting step, the first preset depth is 30%-35% of the total cutting depth of the bar material.

[0008] Furthermore, the diamond wire cutting method also includes: during the cutting step, obtaining the actual cutting depth of the rod material, and comparing the actual cutting depth with a second preset depth, and when the actual cutting depth is greater than or equal to the second preset depth, setting at least one of the cutting line speed setting value and the table speed setting value to remain reduced.

[0009] Furthermore, the diamond wire cutting method further comprises: during the cutting step, the second preset depth is 80%-85% of the total cutting depth of the bar material.

[0010] Furthermore, the diamond wire cutting method also includes: during the cutting step, obtaining the actual cutting depth of the rod material, and comparing the actual cutting depth with the first preset depth and the second preset depth. When the actual cutting depth is greater than or equal to the first preset depth and less than the second preset depth, at least one of the cutting line speed setting value and the table speed setting value is set to remain unchanged.

[0011] Furthermore, the diamond wire cutting method also includes: the speed of the diamond wire increases from 0 to a set value of the cutting line speed and then decreases to 0, and then moves in the opposite direction and increases from 0 to a set value of the cutting line speed and then decreases to 0 for one reciprocating stroke, the setting value of the cutting line speed is the maximum value of the cutting line speed of the diamond wire in each reciprocating stroke, and the cutting depth of the bar is set for each reciprocating stroke of the diamond wire.

[0012] Furthermore, the diamond wire cutting method also includes: the set depth of the bar cutting first increases and then decreases with the number of reciprocating wire movements.

[0013] Furthermore, the diamond wire cutting method also includes: obtaining the actual cutting depth of the rod material, and comparing the actual cutting depth with the predetermined depth. When the actual cutting depth is greater than or equal to the predetermined depth, the table speed of the rod material and the cutting line speed of the diamond wire change in the same manner.

[0014] Furthermore, the diamond wire cutting method also includes: obtaining the actual cutting depth of the rod material, and comparing the actual cutting depth with the predetermined depth. When the actual cutting depth is less than the predetermined depth, the diamond wire performs a reciprocating routing, and the table speed of the rod material remains unchanged.

[0015] Furthermore, the diamond wire cutting method also includes: when the table speed setting value is set to increase, the table speed setting value gradually increases from 500m / min to 2200m / min, and when the knife entry linear speed setting value is set to increase, the knife entry linear speed setting value gradually increases from 800um / min to 2400um / min; when the table speed setting value is set to decrease, the table speed setting value gradually decreases from 2400um / min to 100um / min, and when the knife entry linear speed setting value is set to decrease, the knife entry linear speed setting value gradually decreases from 2200m / min to 1600m / min.

[0016] Furthermore, the diamond wire cutting method also includes: setting the cutting line speed setting value to one of 500m / min, 1200m / min, 1800m / min, 2000m / min, 2100m / min, and 2200m / min; setting the table speed setting value to one of 100um / min, 200um / min, 600um / min, 800um / min, 1200um / min, 1400um / min, 1600um / min, 1800um / min, 1900um / min, 2100um / min, 2200um / min, 2300um / min, and 2400um / min.

[0017] According to another aspect of the present invention, a slicer is provided for executing the above-mentioned diamond wire cutting method, the slicer comprising: a working platform and a diamond wire, the working platform being used for clamping the bar material, and the working platform being movably arranged along a first direction; the diamond wire being used for cutting the bar material, and the diamond wire being movably arranged along a second direction, and the first direction and the second direction being arranged at an angle.

[0018] By applying the technical solution of the present invention, in the step of cutting the bar material with the diamond wire, the table speed setting value and the knife line speed setting value are set to increase first and then decrease, so that in the entire cutting process of the bar material, the table speed setting value and the knife line speed setting value are continuously adjusted, which is conducive to improving the quality of silicon wafer cutting, and then improving the yield rate of silicon wafers. Specifically, the table speed setting value and the knife line speed setting value at the beginning and end of cutting are relatively small, so as to ensure the flatness of the cutting surface and reduce line marks, thereby compensating for the problem of insufficient cutting force of abnormal diamond wires, so that abnormal diamond wires can also cut qualified silicon wafers, and the table speed setting value and the knife line speed setting value in the middle of cutting are relatively large, so as to ensure cutting efficiency. This cutting method allows abnormal diamond wires to be utilized to the greatest extent, thereby reducing the waste of diamond wires and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 A flow chart of the diamond wire cutting method of the present invention is shown. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0023] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0024] In order to solve the problem in the prior art that abnormal diamond wire cutting force is insufficient and wire marks are easily generated, the present invention provides a diamond wire cutting method.

[0025] like Figure 1 A diamond wire cutting method is shown, comprising: a loading step: the working platform clamps the bar material and conveys the bar material to the starting position of processing; a cutting step: the diamond wire is controlled to cut the bar material in a reciprocating manner. During the cutting process, as the cutting depth of the bar material increases, the table speed setting value for the movement of the bar material and the cutting line speed setting value for the movement of the diamond wire are first increased and then decreased; a unloading step: the working platform drives the bar material to completely separate from the diamond wire.

[0026] In this embodiment, in the step of cutting the bar material with the diamond wire, the table speed setting value and the knife line speed setting value are set to increase first and then decrease, so that during the entire cutting process of the bar material, the table speed setting value and the knife line speed setting value are continuously adjusted, which is conducive to improving the quality of silicon wafer cutting and further improving the yield rate of silicon wafers. Specifically, the table speed setting value and the knife line speed setting value at the beginning and end of cutting are relatively small, so as to ensure the flatness of the cutting surface and reduce line marks, thereby compensating for the problem of insufficient cutting force of abnormal diamond wires, so that abnormal diamond wires can also cut qualified silicon wafers, and the table speed setting value and the knife line speed setting value at the middle of cutting are relatively large, so as to ensure cutting efficiency. This cutting method allows the abnormal diamond wire to be utilized to the greatest extent, thereby reducing the waste of diamond wires and thus reducing production costs.

[0027] In this embodiment, the diamond wire cutting method further includes: in the cutting step, when the table speed setting value is set to increase, the knife line speed is set to increase or remain unchanged; when the table speed setting value is set to decrease, the knife line speed setting value is set to decrease or remain unchanged; when the knife line speed is set to increase, the table speed setting value is set to increase or remain unchanged; when the knife line speed setting value is set to decrease, the table speed setting value is set to decrease or remain unchanged. This synchronous or semi-synchronous adjustment strategy can reduce the material vibration caused by speed mismatch, thereby compensating for the problem that abnormal diamond wire cutting is prone to produce line marks, thereby ensuring the stability of the cutting process and the uniformity of the material, thereby ensuring the flatness of the cutting surface, and then improving the yield rate of silicon wafers.

[0028] In this embodiment, the diamond wire cutting method further includes: in the cutting step, obtaining the actual cutting depth of the bar material, and comparing the actual cutting depth with the first preset depth, and in the process where the actual cutting depth is less than the first preset depth, setting at least one of the cutter line speed setting value and the table speed setting value to keep increasing, thereby ensuring the stability of the initial cutting and the efficiency of the mid-term cutting, thereby ensuring the yield rate of the silicon wafer. Specifically, the process where the actual cutting depth is less than the first preset depth is the process from starting to cut the bar material to cutting the bar material to the first preset depth. In this embodiment, it refers to the cutting process of sequence number 1 to sequence number 6 in Table 1, that is, the first preset depth refers to 140mm in this embodiment. In the cutting process of sequence number 1 to sequence number 6, the cutter line speed setting value increases from 500m / min to 2200m / min, and the table speed setting value increases from 800μm / min to 2400μm / min. Of course, according to the actual total cutting depth of the bar material, the first preset depth can be adjusted proportionally according to the actual situation.

[0029] Preferably, the first preset depth may be set to 30%-35% of the total bar cutting depth.

[0030] In this embodiment, the diamond wire cutting method further includes: in the cutting step, obtaining the actual cutting depth of the bar material, and comparing the actual cutting depth with the second preset depth, and in the process where the actual cutting depth is greater than or equal to the second preset depth, setting at least one of the cutter line speed setting value and the table speed setting value to keep decreasing, thereby ensuring the cutting efficiency in the middle of the cutting and the stability in the end of the cutting,

[0031] Thereby ensuring the yield rate of silicon wafers. Specifically, the process in which the actual cutting depth is greater than or equal to the second preset depth is the process from the second preset depth to the end of cutting. In this embodiment, it refers to the cutting process from sequence number 10 to sequence number 19 in Table 1, that is, the second preset depth in this embodiment refers to 170mm. In the cutting process from sequence number 10 to sequence number 19, the cutting line speed setting value is reduced from 2200m / min to 1600m / min, and the table speed setting value is reduced from 2200μm / min to 100μm / min, thereby ensuring fine adjustment at the end of cutting, reducing micro cracks in the material, and ensuring the flatness of the cutting surface. Of course, depending on the actual total cutting depth of the bar material, the second preset depth can be adjusted proportionally according to the actual situation.

[0032] Preferably, the second preset depth is 80%-85% of the total cutting depth of the bar material, thereby ensuring that when the cutting is nearly completed, the cutting speed is reduced, the thermal damage to the material is reduced, the flatness of the cutting surface is improved, and the quality of the product is improved.

[0033] In this embodiment, the diamond wire cutting method further includes: in the cutting step, obtaining the actual cutting depth of the bar material, and comparing the actual cutting depth with the first preset depth and the second preset depth, and in the process where the actual cutting depth is greater than or equal to the first preset depth and less than the second preset depth, setting at least one of the cutter line speed setting value and the table speed setting value to remain unchanged, thereby ensuring the cutting efficiency and cutting stability in the middle of the cutting, reducing the material vibration caused by the speed change, and improving the cutting accuracy. Specifically, this process refers to the cutting process of sequence number 7 to sequence number 9 in Table 1, in which the cutter line speed setting value and the table speed setting value are both maintained at the maximum value, the cutter line speed setting value is maintained at 2200m / min, and the table speed setting value is maintained at 2400μm / min, so as to ensure the cutting speed of the bar material.

[0034] In this embodiment, the diamond wire cutting method further includes: the speed of the diamond wire increases from 0 to the set value of the entry line speed and then decreases to 0, and then moves in the opposite direction and increases from 0 to the set value of the entry line speed and then decreases to 0 for one reciprocating movement, the setting value of the entry line speed is the maximum value of the entry line speed of the diamond wire in each reciprocating movement, and the bar cutting depth is set for each reciprocating movement of the diamond wire. Specifically, the entire cutting process of the bar consists of multiple reciprocating movements of the diamond wire, and the setting value of the entry line speed of each reciprocating movement can be the same or different. The depth of the bar cut by each reciprocating movement, that is, the set depth, can be set to be the same or different. As shown in Table 1, there are 19 reciprocating movements of the diamond wire in the table. In each reciprocating movement, the diamond wire has a forward acceleration and deceleration process and a reverse acceleration and deceleration process.

[0035] In this embodiment, taking serial number 1 as an example, the depth is set to 5mm, the cutting line speed setting value is 500m / min, and during the cutting process, the speed of the diamond wire increases uniformly from 0m / min to the cutting line speed setting value of 500m / min, and then decreases uniformly to 0m / min before moving in the reverse direction. During the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the cutting line speed setting value of 500m / min, and then decreases uniformly to 0m / min. At this point, the first reciprocating routing is completed. Taking sequence number 2 as an example, the initial cutting depth of the bar material is 5mm, and the cutting continues to 10mm. The reciprocating routing process of the diamond wire is that the speed of the diamond wire increases uniformly from 0m / min to the set value of the cutting line speed of 1200m / min, and then decreases uniformly to 0m / min before moving in the reverse direction. In the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the set value of the cutting line speed of 1200m / min, and then decreases uniformly to 0m / min. At this point, the second reciprocating routing is completed. Taking sequence number 3 as an example, the initial cutting depth of the bar material is 10mm, and the cutting continues to 20mm. The reciprocating routing process of the diamond wire is that the speed of the diamond wire increases uniformly from 0m / min to the set value of the cutting line speed of 1800m / min, and then decreases uniformly to 0m / min before moving in the reverse direction. In the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the set value of the cutting line speed of 1800m / min, and then decreases uniformly to 0m / min. At this point, the third reciprocating routing is completed. Taking sequence number 4 as an example, the initial cutting depth of the bar material is 20mm, and the cutting continues to 40mm. The reciprocating routing process of the diamond wire is that the speed of the diamond wire increases uniformly from 0m / min to the set value of the cutting line speed of 2000m / min, and then decreases uniformly to 0m / min before moving in the reverse direction. In the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the set value of the cutting line speed of 2000m / min, and then decreases uniformly to 0m / min. At this point, the fourth reciprocating routing is completed. Taking sequence numbers 5 to 9 as an example, the initial cutting depth of the bar material is 40mm, and the cutting continues to 160mm. The setting value of the diamond wire's cutting line speed is increased to 2100m / min in the 5th reciprocating line, and increased to 2200m / min in the 6th reciprocating line, and maintained at 2200m / min in the following reciprocating lines. During this process, all new diamond wires are used for cutting, so the table speed and the cutting line speed reach the highest value. In the subsequent cutting process from sequence numbers 10 to 19, that is, in the process of cutting depth from 160mm to 191.5mm, the diamond wire is still routed in a reciprocating manner, which will not be repeated. Among them, in the process from sequence numbers 10 to 14, new diamond wires are still continuously cut, thereby reducing cutting line marks and improving cutting quality.In the process from sequence 15 to sequence 19, the silicon wafer has been cut, and the plastic plate with lower hardness is being cut. Therefore, it is not necessary to feed in new diamond wire to cut through the plastic plate to the set position. It is only necessary to wind out the old diamond wire and then cut the plastic plate. This reciprocating wire routing method can effectively reduce the wear of the diamond wire, so that the abnormal diamond wire can be used to the maximum extent, reduce the waste of diamond wire, and thus reduce production costs.

[0036] In this embodiment, the diamond wire cutting method also includes: the set depth of the bar cutting increases first and then decreases with the number of reciprocating lines, that is, the change of the set depth matches the size change law of the set value of the cutting line speed and the set value of the table speed, so as to ensure the fine adjustment at the beginning and end of the cutting and the cutting efficiency in the middle of the cutting. As shown in Table 1, the set depth gradually increases from sequence number 1 to sequence number 8. Of course, the specific value of the set depth can be adjusted according to the actual situation.

[0037] In this embodiment, the diamond wire cutting method further includes: obtaining the actual cutting depth of the bar material, and comparing the actual cutting depth with the predetermined depth. When the actual cutting depth is greater than or equal to the predetermined depth, the table speed of the bar material and the entry line speed of the diamond wire change in the same manner, so that the entry line speed setting value and the table speed setting value can simultaneously respond to the change of the cutting depth to ensure the continuity and stability of the cutting process, to ensure the cutting quality of the diamond wire, and to avoid the occurrence of line marks. Specifically, the predetermined depth of this embodiment is 5mm in Table 1. In the cutting process of sequence number 2 to sequence number 19, the change law of the table speed matches the speed change law of the reciprocating routing process of the diamond wire. Taking the table speed in sequence number 2 as an example, when the entry line speed of the diamond wire increases from 0m / min to 1200m / min, the table speed increases uniformly to 1800μm / min. When the entry line speed of the diamond wire decreases to 0m / min, the table speed decreases uniformly to 0μm / min. Taking the table speed in sequence 3 as an example, when the cutting speed of the diamond wire increases from 0m / min to 1800m / min, the table speed increases uniformly to 2100μm / min, and when the cutting speed of the diamond wire decreases to 0m / min, the table speed decreases uniformly to 0μm / min. The subsequent table speed change rules are the same as those in the cutting process of sequence 2 and sequence 3, and will not be repeated here.

[0038] In this embodiment, the diamond wire cutting method further includes: obtaining the actual cutting depth of the bar material, and comparing the actual cutting depth with the predetermined depth. When the actual cutting depth is less than the predetermined depth, the diamond wire performs a reciprocating routing, and the table speed of the bar material remains unchanged, thereby ensuring the stability of the bar material when the cutting depth does not reach the predetermined depth, and reducing the cutting line marks caused by speed changes. Specifically, the process in which the actual cutting depth of this embodiment is less than the predetermined depth is the cutting process of sequence number 1 in Table 1. In this process, the cutting line speed of the diamond wire changes according to the law of reciprocating routing, and the table speed of the bar material remains unchanged at 800μm / min, thereby ensuring the stability of the bar material in the initial cutting stage.

[0039] In this embodiment, the diamond wire cutting method also includes: when the table speed setting value is set to increase, the table speed setting value gradually increases from 500m / min to 2200m / min, and when the knife entry line speed setting value is set to increase, the knife entry line speed setting value gradually increases from 800um / min to 2400um / min; when the table speed setting value is set to decrease, the table speed setting value gradually decreases from 2400um / min to 100um / min, and when the knife entry line speed setting value is set to decrease, the knife entry line speed setting value gradually decreases from 2200m / min to 1600m / min, thereby ensuring high efficiency and stability during the cutting process, and being able to flexibly adjust to adapt to different cutting requirements.

[0040] In this embodiment, the diamond wire cutting method also includes: setting the cutting line speed setting value to one of 500m / min, 1200m / min, 1800m / min, 2000m / min, 2100m / min, and 2200m / min; setting the table speed setting value to one of 100um / min, 200um / min, 600um / min, 800um / min, 1200um / min, 1400um / min, 1600um / min, 1800um / min, 1900um / min, 2100um / min, 2200um / min, 2300um / min, and 2400um / min to ensure cutting quality and cutting efficiency.

[0041] It should be noted that this embodiment is described by taking the cutting depth of the bar as 191.5mm as an example. In actual use, the cutting parameters, such as the predetermined depth and preset depth, can be adjusted accordingly according to the size of the bar. The wire feeding amount and wire return amount of the slicer during the cutting process are matched with the size of the cutting line speed and the table speed. The starting position of this embodiment refers to the position where the bar is 0.5mm away from the diamond wire, which can be adjusted according to the actual situation.

[0042] Table 1

[0043]

[0044] This embodiment adjusts the cutting depth position, table speed, line speed, and reasonable settings of the supply and return line according to the abnormal diamond wire cutting force, so that the table speed and the cutting line speed are in the best combination in each step, ensuring that new diamond wire is continuously supplied to the bar during the entire cutting stage, and this process continues until the bar cutting is completed; through the reasonable connection of parameters in each stage, the wear of the diamond wire on the bar during reversing is reduced, the depth of the grain is effectively reduced, thereby changing the parameter defects of the silicon wafer, reducing the generation of line marks and the roughness of the silicon wafer, thereby improving the cutting quality of the silicon wafer, and making full use of the abnormal diamond wire to maximize its value, save costs, and increase benefits.

[0045] The present invention also provides a slicer for executing the above-mentioned diamond wire cutting method, the slicer comprises: a working platform and a diamond wire, the working platform is used to clamp the bar material, the working platform is movably arranged along a first direction; the diamond wire is used to cut the bar material, the diamond wire is movably arranged along a second direction, and the first direction and the second direction are arranged at an angle. In this way, the slicer realizes the above-mentioned cutting method by accurately controlling the movement of the bar material and the diamond wire, thereby ensuring the cutting quality of the abnormal diamond wire, improving the cutting efficiency and precision, and reducing the production cost.

[0046] It should be noted that, the multiple in the above embodiments refers to at least two.

[0047] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0048] 1. It solves the problem of abnormal diamond wire cutting force being insufficient and easily causing wire marks in the prior art;

[0049] 2. In the step of cutting the bar with diamond wire, the table speed setting value and the knife line speed setting value are set to increase first and then decrease, so that during the entire cutting process of the bar, the table speed setting value and the knife line speed setting value are continuously adjusted, which is beneficial to improve the quality of silicon wafer cutting and further improve the yield rate of silicon wafers. Specifically, the table speed setting value and the knife line speed setting value at the beginning and end of cutting are relatively small, so as to ensure the flatness of the cutting surface and reduce line marks, thereby compensating for the problem of insufficient cutting force of abnormal diamond wire, so that abnormal diamond wire can also cut qualified silicon wafers, and the table speed setting value and the knife line speed setting value in the middle of cutting are relatively large, so as to ensure cutting efficiency;

[0050] 3. Make the best use of abnormal diamond wires, thereby reducing the waste of diamond wires and reducing production costs.

[0051] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0052] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0053] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A diamond wire cutting method, characterized in that: include: Loading step: the working platform clamps the bar material and transports the bar material to the starting position of processing; Cutting step: controlling the diamond wire to cut the bar material in a reciprocating manner, and during the cutting process, as the cutting depth of the bar material increases, setting the table speed setting value of the bar material movement and the cutting line speed setting value of the diamond wire movement are both increased first and then decreased; Unloading step: the working platform drives all the bar materials to be separated from the diamond wire.

2. The diamond wire cutting method according to claim 1, characterized in that: The diamond wire cutting method further comprises: during the cutting step, When the table speed setting value is set to increase, the knife entry linear speed is set to increase or remain unchanged; when the table speed setting value is set to decrease, the knife entry linear speed setting value is set to decrease or remain unchanged; When the knife entry linear speed is set to increase, the table speed setting value is set to increase or remain unchanged; when the knife entry linear speed setting value is set to decrease, the table speed setting value is set to decrease or remain unchanged.

3. The diamond wire cutting method according to claim 2, characterized in that: The diamond wire cutting method further comprises: during the cutting step, The actual cutting depth of the bar is obtained and compared with a first preset depth. When the actual cutting depth is less than the first preset depth, at least one of the cutting line speed setting value and the table speed setting value is set to keep increasing.

4. The diamond wire cutting method according to claim 3, characterized in that: The diamond wire cutting method further comprises: during the cutting step, The first preset depth is 30%-35% of the total cutting depth of the bar material.

5. The diamond wire cutting method according to claim 2, characterized in that: The diamond wire cutting method further comprises: during the cutting step, The actual cutting depth of the bar is obtained, and the actual cutting depth is compared with a second preset depth. When the actual cutting depth is greater than or equal to the second preset depth, at least one of the cutting line speed setting value and the table speed setting value is set to remain reduced.

6. The diamond wire cutting method according to claim 5, characterized in that: The diamond wire cutting method further comprises: during the cutting step, The second preset depth is 80%-85% of the total cutting depth of the bar material.

7. The diamond wire cutting method according to claim 5, characterized in that: The diamond wire cutting method further comprises: during the cutting step, The actual cutting depth of the bar is obtained, and the actual cutting depth is compared with the first preset depth and the second preset depth. When the actual cutting depth is greater than or equal to the first preset depth and less than the second preset depth, at least one of the cutting line speed setting value and the table speed setting value is set to remain unchanged.

8. The diamond wire cutting method according to claim 1, characterized in that: The diamond wire cutting method further comprises: The speed of the diamond wire increases from 0 to the set value of the cutting line speed and then decreases to 0, and then moves in the opposite direction and increases from 0 to the set value of the cutting line speed and then decreases to 0, which is one reciprocating movement. The setting value of the cutting line speed is the maximum value of the cutting line speed of the diamond wire in each reciprocating movement. The bar cutting setting depth is set each time the diamond wire performs the reciprocating movement.

9. The diamond wire cutting method according to claim 8, characterized in that: The diamond wire cutting method further comprises: The set depth of the bar cutting increases first and then decreases with the number of reciprocating lines.

10. The diamond wire cutting method according to claim 8, characterized in that: The diamond wire cutting method further comprises: The actual cutting depth of the bar is obtained, and the actual cutting depth is compared with the predetermined depth. When the actual cutting depth is greater than or equal to the predetermined depth, the table speed of the bar and the cutting line speed of the diamond wire change in the same manner.

11. The diamond wire cutting method according to claim 8, characterized in that: The diamond wire cutting method further comprises: The actual cutting depth of the bar is obtained, and the actual cutting depth is compared with the predetermined depth. When the actual cutting depth is less than the predetermined depth, the diamond wire performs the reciprocating routing once, and the table speed of the bar remains unchanged.

12. The diamond wire cutting method according to claim 1, characterized in that: The diamond wire cutting method further comprises: When the table speed setting value is set to increase, the table speed setting value gradually increases from 500m / min to 2200m / min, and when the knife entry linear speed setting value is set to increase, the knife entry linear speed setting value gradually increases from 800um / min to 2400um / min; When the table speed setting value is set to decrease, the table speed setting value gradually decreases from 2400um / min to 100um / min, and when the knife entry linear speed setting value is set to decrease, the knife entry linear speed setting value gradually decreases from 2200m / min to 1600m / min.

13. The diamond wire cutting method according to claim 1, characterized in that: The diamond wire cutting method further comprises: The cutting line speed setting value is set to one of 500 m / min, 1200 m / min, 1800 m / min, 2000 m / min, 2100 m / min, and 2200 m / min; Set the stage speed setting value to one of 100um / min, 200um / min, 600um / min, 800um / min, 1200um / min, 1400um / min, 1600um / min, 1800um / min, 1900um / min, 2100um / min, 2200um / min, 2300um / min, and 2400um / min.

14. A slicer, characterized in that: For performing the diamond wire cutting method according to any one of claims 1 to 13, the slicer comprises: A working platform, the working platform is used to clamp the bar material, and the working platform is movably arranged along a first direction; A diamond wire is used for cutting the bar material, the diamond wire is movably arranged along a second direction, and the first direction and the second direction are arranged at an angle.

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