Measuring device and method for metal pole plate forming part

Abstract

The invention provides a measuring device and method for a metal polar plate forming part, and relates to the technical field of fuel cell metal polar plate measurement, and the measuring device for the metal polar plate forming part comprises an inlaying assembly which is used for inlaying the polar plate forming part to form an inlaying sample; the polishing piece is used for polishing the inlaid sample to form a measurement sample; by applying the technical scheme of the invention, the problem of poor stability caused by light and thin texture of the metal polar plate in the measurement process is effectively solved, the measurement precision is remarkably improved, the accuracy of the measurement result is ensured, and the measurement accuracy is improved. The problem that in the prior art, the measurement precision of a metal pole plate formed part is low is solved.

Description

Technical Field

[0001] The present application relates to the technical field of fuel cell metal plate measurement, and in particular, to a measurement device and method for metal plate formed parts. Background Art

[0002] Fuel cells are devices that convert the chemical energy of fuel directly into electrical energy. They are characterized by high efficiency and low emissions and are considered one of the most promising power generation technologies. As a core component of fuel cells, bipolar plates have the functions of support, gas supply, current collection, and isolation of hydrogen and oxygen. Metal bipolar plates are high in strength and light in weight, which can significantly promote the improvement of the power density of the fuel cell stack. They also have good low-temperature starting performance and have better application prospects.

[0003] The manufacturing process of metal bipolar plates includes forming, welding, painting and other processes. Due to the complex shape of the flow channels on the metal plates, it is easy to have excessive local thinning during the forming process, and the thinning rate can reach 30-40%. When the thickness of the plate is too thin, it is easy to crack and fail when subjected to excessive gas pressure during use. At present, laboratories often use the method of embedding the plates into ordinary metallographic specimens and then measuring the thickness through microscope observation. However, due to the thin thickness, light texture and poor stability of metal plates, metal plates often appear skewed, moved or twisted during the embedding process, which will lead to inaccurate thickness values, thus affecting the measurement results.

[0004] Currently, no effective solution has been proposed for the above problems. Summary of the invention

[0005] The main purpose of the present application is to provide a measuring device and method for metal plate forming parts, so as to solve the problem of low measurement accuracy of metal plate forming parts in the prior art.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a measuring device for a metal plate forming part is provided, comprising: an inlay assembly, which is used to inlay the plate forming part to form an inlay sample; a polishing piece, which is used to polish the inlay sample to form a measurement sample; and a measuring piece, which is used to measure the measurement sample to obtain the thickness of the plate forming part.

[0007] Furthermore, the inlay assembly includes: a limiting subassembly, which is used to limit the position of the plate forming part; and an inlay mold, which has a accommodating cavity, which is used to accommodate the limiting subassembly, the plate forming part and the inlay liquid.

[0008] Furthermore, the limiting subassembly includes: a mounting base, the mounting base has a mounting groove, one side of the mounting groove has an opening, and the other side of the mounting groove has a guide groove; a limiting plate, the limiting plate is detachably connected to the groove opening of the mounting groove, the limiting plate and the groove wall of the mounting groove are surrounded by a limiting space, and the limiting space is used to limit the plate forming component.

[0009] Furthermore, the limiting subassembly includes: a pad, which is arranged in the limiting space, and there are at least two pads, which are relatively arranged on both sides of the pole plate forming part.

[0010] Furthermore, the installation base is made of metal, and the limiting plate is made of magnets, and / or the pad is made of rubber.

[0011] Further, the length of the backing plate is less than or equal to the length of the mounting groove, the width of the backing plate is less than or equal to the width of the mounting groove, and / or the width of the guide channel is greater than or equal to the length of the mounting groove.

[0012] Further, the polishing component includes sandpaper, and / or the measuring component includes a microscope.

[0013] According to another aspect of the present application, a measurement method for a metal plate molded part is provided. The measurement method is performed using the above-mentioned measuring device for the metal plate molded part, and the measurement method includes the following steps: using an inlay component to inlay the plate molded part to form an inlaid sample; using a grinding component to beat the inlaid sample to obtain a measurement sample; using a measuring component to measure the measurement sample to obtain measurement data; and determining the thickness of the plate molded part based on the measurement data.

[0014] Furthermore, the plate forming parts are inlaid with an inlay assembly, including: limiting the plate forming parts with a limiting subassembly; placing the limiting subassembly and the plate forming parts in a receiving cavity of an inlay mold; pouring the inlay liquid into the receiving cavity, and waiting for thirty minutes to form an inlaid sample.

[0015] Furthermore, a limiting subassembly is used to limit the plate forming part, including: placing a pad in the mounting groove of the mounting base; placing the plate forming part on the pad in the mounting groove; placing another pad on the plate forming part; connecting the limiting plate to the mounting base to limit the plate forming part.

[0016] By applying the technical solution of the present application, an inlay assembly is used to inlay the plate molded parts to form an inlay sample, a polishing assembly is used to beat the inlaid sample to obtain a measurement sample, a measuring assembly is used to measure the measurement sample to obtain measurement data, and the thickness of the plate molded parts is determined based on the measurement data, which effectively solves the problem of poor stability of metal plates due to their light and thin texture during the measurement process, significantly improves the measurement accuracy, ensures the accuracy of the measurement results, and solves the problem of low measurement accuracy of metal plate molded parts in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 A schematic structural diagram of a first embodiment of a measuring device for a metal plate forming part according to the present application is shown;

[0019] Figure 2 A schematic structural diagram of a second embodiment of a measuring device for a metal plate forming part according to the present application is shown;

[0020] Figure 3 A schematic structural diagram of a first embodiment of an installation base according to the present application is shown;

[0021] Figure 4 A schematic structural diagram of a second embodiment of the installation base according to the present application is shown;

[0022] Figure 5 A schematic structural diagram of a third embodiment of a measuring device for a metal plate forming part according to the present application is shown;

[0023] Figure 6 A schematic structural diagram of an embodiment of a polar plate forming member according to the present application is shown;

[0024] Figure 7 A schematic structural diagram of an embodiment of a polar plate forming part according to the present application is shown.

[0025] The above drawings include the following reference numerals:

[0026] 1. Plate forming parts;

[0027] 2. Inlay components;

[0028] 21. Limit subassembly;

[0029] 211, installation base; 2110, installation groove; 2111, diversion channel;

[0030] 212, limit plate;

[0031] 213, pad;

[0032] 22. Inlay mold;

[0033] 23. Mounting fluid. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of the layers and regions may be enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0038] Combination Figures 1 to 6 In a specific embodiment of the present application, a measuring device for a metal plate forming part is provided.

[0039] Specifically, the measuring device for the metal plate forming part includes an inlay component 2, a polishing component and a measuring component. The inlay component 2 is used to inlay the plate forming part 1 to form an inlay sample; the polishing component is used to polish the inlay sample to form a measurement sample; and the measuring component is used to measure the measurement sample to obtain the thickness of the plate forming part 1.

[0040] In this embodiment, the inlay assembly 2 is used to fix and embed the plate molded part 1 to be tested into a supporting material to form an inlaid sample. The supporting material can be an inlay liquid or other types of fixing agents, which is used to provide stable support for the plate to prevent the plate from deforming or moving during subsequent processing. The polishing piece is used to perform surface treatment on the inlaid sample to remove the rough layer and excess supporting material on the surface, so that the surface of the plate is flat, which is convenient for subsequent accurate measurement. Polishing is usually performed using sandpaper or corresponding mechanical polishing equipment, and sometimes polishing may be required to further improve the surface finish of the sample. The measuring piece is a device for finally measuring the thickness of the plate molded part after treatment, usually including a microscope or other high-precision measuring instrument. Through observation and measurement, the thickness data of the plate molded part at different positions can be obtained, which is crucial for evaluating its performance and quality. The measuring device overcomes the limitations of traditional thickness measurement methods, such as the instability of the plate during the measurement process and the inaccuracy of the measured value. By integrating the three steps of plate inlay, polishing and measurement into a dedicated device, the accuracy and reliability of the measurement can be significantly improved, especially when dealing with metal plates with complex flow channel structures.

[0041] By applying the technical solution of the present application, an inlay assembly is used to inlay the plate molded parts to form an inlay sample, a polishing assembly is used to beat the inlaid sample to obtain a measurement sample, a measuring assembly is used to measure the measurement sample to obtain measurement data, and the thickness of the plate molded parts is determined based on the measurement data, which effectively solves the problem of poor stability of metal plates due to their light and thin texture during the measurement process, significantly improves the measurement accuracy, ensures the accuracy of the measurement results, and solves the problem of low measurement accuracy of metal plate molded parts in the prior art.

[0042] Furthermore, the inlay component 2 includes a limiting sub-component 21 and an inlay mold 22 . The limiting sub-component 21 is used to limit the plate forming part 1 . The inlay mold 22 has a accommodating cavity, which is used to accommodate the limiting sub-component 21 , the plate forming part 1 and the inlay liquid 23 .

[0043] Combination Figure 2As shown, in this embodiment, the main function of the limiting subassembly 21 is to ensure that the plate forming part 1 maintains a stable position during the embedding process and prevent it from moving or deforming in the embedding liquid 23, thereby ensuring the accuracy of the thickness measurement. The embedding mold 22 is designed to accommodate the limiting subassembly 21, the plate forming part 1 and the embedding liquid 23. The embedding liquid 23 is a material used to fill and fix the plate forming part 1. After being poured into the mold, it can flow to every corner of the plate forming part 1 and then solidify to form a stable embedded sample. The embedding liquid 23 should try to use a material with a shorter curing time, higher stability, and no corrosion to the material of the plate forming part 1 to improve the efficiency and accuracy of the overall measurement process.

[0044] It should be noted that the limiting subassembly 21 includes but is not limited to components such as fine-tuning screws, elastic clamping devices, and magnetic connection devices. As long as it can limit the pole plate forming part 1, the pole plate forming part 1 can be accurately positioned during measurement or processing to prevent it from being displaced during operation and affecting the measurement accuracy or processing effect.

[0045] Furthermore, the limiting subassembly 21 includes a mounting base 211 and a limiting plate 212, the mounting base 211 has a mounting groove 2110, one side of the mounting groove 2110 has an opening, and the other side of the mounting groove 2110 has a guide channel 2111; the limiting plate 212 is detachably connected to the groove opening of the mounting groove 2110, and the limiting plate 212 and the groove wall of the mounting groove 2110 are arranged to form a limiting space, and the limiting space is used to limit the plate forming component 1.

[0046] Combination Figure 2 and Figure 3 As shown, in this embodiment, the limiting subassembly 21 can effectively fix the position of the plate forming part 1 by using the matching use of the mounting groove 2110 of the mounting base 211 and the limiting plate 212, and prevent any unnecessary movement thereof during the measurement or processing, thereby ensuring the accuracy of the thickness measurement or the consistency of the processing. The limiting plate 212 is connected to the notch of the mounting groove 2110, and can adopt a thread, a buckle, a magnet or other detachable connection method. The function of the limiting plate 212 is to enclose a limiting space together with the groove wall of the mounting groove 2110, so as to ensure the position stability of the plate forming part 1 during measurement or processing and improve the operation accuracy.

[0047] Combination Figure 3As shown, the mounting base 211 is used as the basic support part of the limiting subassembly 21, which is usually made of metal or hard plastic and has certain strength and stability. A mounting groove 2110 is provided on the mounting base 211. The size and shape of the mounting groove 2110 are designed according to the shape of the plate forming part 1, or the plate forming part 1 is cut into a size and shape that can be placed in the mounting groove 2110 by wire cutting or other methods before inlaying, so as to ensure that the plate forming part 1 can be tightly embedded in the mounting groove 2110. An opening is designed on one side of the mounting groove 2110 to facilitate the placement and removal of the plate forming part 1.

[0048] Furthermore, the limiting subassembly 21 includes a pad 213 , which is disposed in the limiting space. There are at least two pads 213 , and at least two pads 213 are relatively disposed on two sides of the pole plate forming component 1 .

[0049] Combination Figure 2 and Figure 5 As shown, in this embodiment, two pads 213 are relatively arranged on both sides of the plate forming part 1 along the horizontal direction (i.e. Figure 5 Specifically, one pad 213 is disposed between the bottom of the mounting groove 2110 and the plate forming member 1, and another pad 213 is disposed between the limiting plate 212 and the plate forming member 1 (such as Figure 2 As shown), this arrangement can provide support and positioning to prevent the plate forming part 1 from moving or deforming due to any external interference during the measurement process, thereby ensuring the accuracy of the thickness measurement.

[0050] In a preferred embodiment of the present application, the mounting base 211 is made of metal, and the limiting plate 212 is made of magnets. In this embodiment, the mounting base 211 is made of metal, which can provide sufficient strength and stability to support the entire device. At the same time, the limiting plate 212 is made of magnets, and the adsorption force of the magnets can be used to fix the pole plate forming part 1 to ensure that it will not be displaced during the measurement or processing process, thereby improving the accuracy and efficiency of the operation.

[0051] In a preferred embodiment of the present application, the pad 213 is made of rubber. In this embodiment, the rubber material generally has good elasticity and anti-skid properties, which can effectively buffer the vibration of the plate forming part 1 during the placement or measurement process and avoid damage caused by hard contact. In addition, the anti-skid properties of the rubber pad can further help fix the plate forming part 1, making it more stable during operation.

[0052] Furthermore, the length of the pad 213 is less than or equal to the length of the mounting groove 2110, and the width of the pad 213 is less than or equal to the width of the mounting groove 2110. Such a design can prevent the pad from shifting or tilting during operation, ensure that the position of the plate forming part 1 is fixed during measurement, and improve the reliability of the measurement result.

[0053] In a preferred embodiment of the present application, the grinding piece includes sandpaper. It is used to remove excess material and rough layers on the surface of the mounted sample to make the surface of the plate smoother and facilitate subsequent thickness measurement. The choice of sandpaper depends on the hardness and surface state of the plate material, usually starting from coarse sandpaper and gradually transitioning to fine sandpaper to ensure the flatness and smoothness of the surface.

[0054] Furthermore, the width of the flow guide channel 2111 is greater than or equal to the length of the mounting groove 2110. In this embodiment, such an arrangement ensures that each flow channel of the electrode forming part 1 can be embedded.

[0055] In one embodiment of the present application, the grinding member includes an electric grinder. The grinding efficiency can be improved by using the electric grinder to grind the mounted sample.

[0056] In a preferred embodiment of the present application, the measuring device includes a microscope. The microscope can be an optical microscope or an electron microscope (such as a scanning electron microscope SEM or a transmission electron microscope TEM), and the specific selection depends on the required measurement accuracy and observation details. When using a microscope to measure thickness, it is usually necessary to cooperate with image analysis software to automatically or semi-automatically identify and measure the thickness of the electrode plate.

[0057] In addition to sandpaper and a microscope, the device may also include other auxiliary equipment, such as a clamp for fixing the sample, a temperature and humidity control system for controlling the measurement environment, and a computer for data recording and analysis, which can further improve the accuracy and efficiency of the measurement.

[0058] In another embodiment of the present application, a method for measuring a metal plate formed part is provided. The measuring method is performed using the measuring device for the metal plate formed part in the above embodiment. The measuring method comprises the following steps:

[0059] Step S100, using an inlay assembly to inlay the plate molded part to form an inlay sample.

[0060] In step S100, Figure 6As shown, firstly, the plate forming part is cut into plate forming part samples of specific sizes by wire cutting. Then, the plate sample is fixed by using a limiting subassembly, specifically, the plate sample is clamped between at least two pads, and these pads are pre-placed in the mounting groove of the mounting base. The mounting base is magnetically connected to the limiting plate, so that the plate sample remains stable in the limiting subassembly without movement or deformation. Finally, the entire limiting subassembly is placed in the inlay mold, and the inlay liquid is poured in. After the inlay liquid is solidified, a stable inlay sample is formed, in which the plate sample is completely fixed and wrapped.

[0061] Step S200: using a grinding assembly to grind and mount a sample to obtain a measurement sample.

[0062] In step S200, a grinding piece is used to perform surface treatment on the embedded sample, with the purpose of removing excess material and rough layers on the sample surface, so that the surface of the plate sample becomes smooth and flat.

[0063] Step S300: using a measuring component to measure a measurement sample to obtain measurement data.

[0064] In step S300, the polished measurement sample is placed under the measuring piece, and the thickness of the plate sample is usually measured using a microscope or similar high-precision measuring equipment. When measuring, the measurement points need to be carefully selected, usually at the flow channel of the plate, because these locations are prone to thickness changes during the forming process. The microscope can magnify and observe the microstructure of the plate surface, and with the image analysis software, the thickness of the plate can be automatically or semi-automatically identified and measured, thereby obtaining accurate measurement data.

[0065] Step S400, determining the thickness of the electrode plate molded part according to the measurement data.

[0066] In step S400, after obtaining the data of multiple measurement points, it is necessary to analyze and process these data to determine the thickness of the plate molded parts at different positions. This process may include calculating the average thickness, maximum thickness and minimum thickness, as well as the uniformity of thickness. By comparing the measured data with the original thickness of the plate, it is possible to evaluate the impact of the forming process on the thickness of the plate and whether the molded parts meet the design requirements. Ultimately, based on the analysis of the measured data, the effective thickness of the plate molded parts can be determined, providing key information for the performance evaluation and quality control of the fuel cell.

[0067] Combination Figure 7 As shown, based on the measurement data, a thickness distribution diagram is generated to determine the thickness of the plate forming parts at different positions, which provides intuitive data support for the quality control of the plate forming parts, helps to optimize the production process and improve product quality.

[0068] Through the above steps, common problems in traditional measurement methods, such as sample deformation, improper selection of measurement points or interference from external factors, can be effectively avoided, thereby providing a more scientific and reliable thickness measurement method for the production of fuel cell metal plates.

[0069] Furthermore, the polar plate forming part is inlaid with an inlay assembly, including:

[0070] Step S110, using a limiting subassembly to limit the position of the plate forming part.

[0071] In step S110, the limiting subassembly is used to accurately fix and position the pole plate forming part. Specifically, the pole plate forming part is placed in the mounting groove of the mounting base. The mounting base is magnetically connected to the limiting plate, and supported by pads on both sides. The pad is a rubber pad, which not only prevents the pole plate forming part from moving inside the limiting subassembly, but its dark color and elastic properties also help to clearly distinguish the boundary between the pole plate and the pad during the subsequent mounting and measurement process. The use of magnets further enhances the limiting effect, ensuring that the pole plate forming part is stable and motionless during the mounting process, thereby improving the accuracy of thickness measurement.

[0072] Step S120, placing the limiting subassembly and the electrode forming part in the accommodating cavity of the embedding mold.

[0073] In step S120, after the positioning is completed, the entire positioning subassembly (including the plate forming part and the rubber pad) is carefully placed in the accommodating cavity of the inlay mold. The design of the accommodating cavity needs to take into account the size of the positioning subassembly to ensure that the positioning subassembly can be fully placed and there is enough space to pour the inlay liquid. The purpose of this step is to provide a closed and stable environment for the subsequent inlay process, ensuring that the inlay liquid can evenly surround the plate forming part, so that the plate sample can be fully fixed during the inlay process.

[0074] Step S130, pour the mounting liquid into the receiving cavity and wait for thirty minutes to form a mounted sample.

[0075] In step S130, the embedding liquid is poured into the accommodating cavity of the embedding mold until it completely covers the plate forming part and the limiting subassembly. The selection of the embedding liquid needs to take into account its fluidity and curing time, as well as its compatibility with the material of the plate forming part. After pouring the embedding liquid, it is necessary to wait for a period of time, usually thirty minutes, to allow the embedding liquid to fully penetrate into every gap of the plate sample and solidify into shape in the mold. The solidified embedding liquid fixes the plate sample and the limiting subassembly together to form an embedded sample, providing a stable foundation for the subsequent polishing and thickness measurement steps.

[0076] Through the above steps, the stability and fixity of the plate molded parts during the inlay process are ensured, thereby improving the accuracy and reliability of subsequent thickness measurement. By using the limit subassembly and the inlay mold, common problems of the plate samples in the traditional inlay process, such as deformation, movement or distortion, can be effectively avoided, providing a more scientific thickness measurement method for the formed parts of the fuel cell metal plate.

[0077] Furthermore, a limiting subassembly is used to limit the position of the plate forming part, including:

[0078] Step S121, placing the pad in the installation groove of the installation base.

[0079] In step S121, a pad is placed in the mounting groove of the mounting base to provide an initial support platform for the plate forming part. The pad is usually made of a material with certain elasticity and anti-slip properties, such as rubber, which can play a buffering role to prevent the plate from being damaged due to hard contact during measurement or processing. At the same time, the use of a dark pad helps to clearly distinguish the boundary between the plate and the pad after the mounting is completed, which is convenient for subsequent measurement.

[0080] Step S122, placing the electrode plate forming part on the backing plate in the mounting groove.

[0081] In step S122, after the backing plate is placed, the plate forming part to be tested is gently placed on the backing plate to ensure that it is completely located in the installation groove. The size of the plate forming part should match the installation groove, so as to ensure that the position of the plate is stable during measurement or processing and will not move easily.

[0082] Step S123, placing another pad on the pole plate forming part.

[0083] In step S123, the purpose of placing the second pad is to further fix the plate forming part to make it more stable in subsequent operations. The second pad also has a buffering and anti-skid function, which can prevent the plate from warping or deformation during the curing process of the embedding liquid. The combined thickness of the two pads and the plate forming part is designed to be slightly greater than the depth of the mounting groove, which ensures that the plate is firmly clamped while remaining relatively flat.

[0084] Step S124, connecting the limiting plate to the installation base to limit the plate forming part.

[0085] In step S124, the connection of the limit plate is the last step of the entire fixing process. The limit plate can be connected to the installation base by magnetic adsorption, threaded connection or other means. The function of the limit plate is to enclose a limit space together with the groove wall of the installation groove, so as to ensure that the plate forming part will not be displaced during the operations of inlaying, grinding, etc., and maintain its stable position in the installation groove, providing the necessary conditions for high-precision measurement.

[0086] The use of the entire stopper subassembly in the above steps significantly improves the accuracy of measurement and the convenience of operation, avoiding common problems in traditional measurement methods, such as the skew or movement of the plate forming parts during the measurement process, which leads to deviations in the measurement results. Through this series of delicate operations, the position of the plate forming parts during the inlay and measurement process can be ensured to be stable, thereby obtaining more reliable and accurate thickness measurement results.

[0087] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0088] 1) The connection and fixation between the limit plate and the installation base and the support of the rubber pad ensure the stability and accuracy of the plate forming parts during the measurement process, avoiding the deformation or damage of the sample that may be caused by traditional fixtures.

[0089] 2) The dark rubber pad and adjustable magnetic strength design improve the contrast and flexibility of the measurement, making the measurement results more reliable.

[0090] 3) By using a thermosetting resin and filler embedding liquid, as well as subsequent grinding and polishing, the surface of the sample is ensured to be smooth, which is conducive to accurate measurement of the microscope.

[0091] 4) The introduction of image analysis software enables automatic identification and recording of measurement points, greatly improving measurement efficiency and data processing accuracy. The thickness distribution map finally generated provides intuitive data support for the quality control of plate forming parts, helping to optimize the production process and improve product quality.

[0092] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0093] In addition to the above, it should be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0094] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0095] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A measuring device for metal plate forming parts, characterized in that: include: An inlay component (2), the inlay component (2) being used to inlay the polar plate forming part (1) to form an inlay sample; A polishing piece, the polishing piece is used to polish the mounted sample to form a measurement sample; A measuring piece, wherein the measuring piece is used to measure the measurement sample to obtain the thickness of the polar plate molded part (1).

2. The measuring device for metal plate forming parts according to claim 1, characterized in that: The inlay component (2) comprises: A limiting subassembly (21), the limiting subassembly (21) being used to limit the position of the pole plate forming component (1); An inlay mold (22), wherein the inlay mold (22) has a receiving cavity, wherein the receiving cavity is used to receive the limiting subassembly (21), the polar plate forming part (1) and the inlay liquid (23).

3. The measuring device for metal plate forming parts according to claim 2, characterized in that: The limiting subassembly (21) comprises: A mounting base (211), the mounting base (211) having a mounting groove (2110), one side of the mounting groove (2110) having an opening, the other side of the mounting groove (2110) having a flow guide channel (2111), the flow guide channel (2111) being arranged in communication with the mounting groove (2110); A limiting plate (212), the limiting plate (212) being detachably connected to the slot opening of the installation slot (2110), the limiting plate (212) and the slot wall of the installation slot (2110) forming a limiting space, the limiting space being used to limit the pole plate forming part (1).

4. The measuring device for metal plate forming parts according to claim 3, characterized in that: The limiting subassembly (21) comprises: A pad (213), the pad (213) being arranged in the limiting space, there being at least two pads (213), and at least two pads (213) being arranged oppositely on two sides of the pole plate forming part (1).

5. The measuring device for metal plate forming parts according to claim 4, characterized in that: The installation base (211) is made of metal, and the limiting plate (212) is made of magnet, and / or, The pad (213) is made of rubber.

6. The measuring device for metal plate forming parts according to claim 5, characterized in that: The length of the backing plate (213) is less than or equal to the length of the mounting groove (2110), the width of the backing plate (213) is less than or equal to the width of the mounting groove (2110), and / or, The width of the guide channel (2111) is greater than or equal to the length of the mounting groove (2110).

7. The measuring device for metal plate forming parts according to claim 5, characterized in that: The polishing piece includes sandpaper, and / or The measuring member includes a microscope.

8. A method for measuring a metal plate formed part, the method being carried out using the measuring device for a metal plate formed part according to any one of claims 1 to 7, characterized in that: The measuring method comprises the following steps: Using an inlay assembly to inlay the plate molded part to form an inlay sample; Using a grinding component to grind the mounted sample to obtain a measurement sample; Measuring the measurement sample using a measurement component to obtain measurement data; The thickness of the polar plate forming part is determined based on the measurement data.

9. The method according to claim 8, characterized in that The polar plate forming part is inlaid using the inlay assembly, comprising: The limiting subassembly is used to limit the position of the plate forming part; Placing the stopper subassembly and the plate forming part in the accommodating cavity of the insert mold; Pour the mounting solution into the holding chamber and wait for thirty minutes to form a mounted sample.

10. The method according to claim 9, characterized in that The limiting subassembly is used to limit the polar plate forming part, including: Place the pad in the mounting groove of the mounting base; Placing the plate forming part on the backing plate in the mounting groove; placing another backing plate on the plate forming part; The limiting plate is connected to the mounting base to limit the polar plate forming part.

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