Test processor and control method thereof

Abstract

The invention provides a test processor and a control method thereof. The test processor comprises a main body part; the bag-shaped frame is detachably combined with the main body part, and a bag-shaped space capable of placing an electronic component is formed in the bag-shaped frame; and a support member sandwiched between the pouch-shaped frame and the main body portion, the electronic component being seated in the support member, a first opening hole and a plurality of second opening holes being formed in the support member, the first opening hole and the plurality of second opening holes being formed in the support member when the electronic component is seated on the support member. One part of the terminals of the electronic component can penetrate through the first open hole, the other part of the terminals of the electronic component can penetrate through the plurality of second open holes, and the plurality of second open holes can be formed along the periphery of the first open hole.

Description

[0001] This application is a divisional application with application number CN2021105648557, application date May 24, 2021, and invention name “Test processor and its control method”. Technical Field

[0002] The invention relates to a test processor and a control method thereof. Background Art

[0003] With the recent development of the technical field related to electronic components such as semiconductor elements, the demand for electronic components is increasing. In particular, electronic components that are small in size and have improved functions are required. Accordingly, the size of the electronic component is reduced, but the number of terminals of one electronic component is increased, so that the number of terminals per unit area of ​​the electronic component is increased. In the case of such an electronic component, even under the same impact, the impact applied to one terminal is greater than that of an electronic component with a small number of terminals per unit area. Therefore, in the process of testing the electronic component, it becomes more vulnerable to the impact applied to the electronic component.

[0004] On the other hand, when the electronic components are manufactured by a predetermined manufacturing process, they are tested by a test handler and a tester, and are classified by grade according to the test results. In this test process, the electronic components move a predetermined path and are tested while being loaded on a test tray. However, the electronic components manufactured by the predetermined manufacturing process are supplied by being loaded in a customer tray, and in order to test them, they are transferred from the customer tray to the test tray by various workbenches including a buffer table. In addition, the electronic components will pass through an open unit so as to be placed on the test tray. In this way, in order to test the electronic components, they will be loaded from the customer tray, passed through the workbench, the open unit, and held by the loading / unloading device for many times until they are unloaded on the test tray, and then undergo a process of releasing the holding.

[0005] At this time, when the loading / unloading device holds the electronic component or releases the hold on the electronic component, a predetermined impact will be applied to the electronic component. In particular, in the process of vacuum adsorption of the electronic component to hold the electronic component, the electronic component may be damaged due to the predetermined pressure applied to the electronic component. For example, when the electronic component is pressurized for vacuum adsorption, the terminal portion of the electronic component may be deformed, and the electronic component itself may bend. As another example, electronic components for special purposes can be manufactured in a form that is bent from the beginning to suit the purpose, and the terminals of these electronic components that are arranged on the outermost side can withstand stronger impacts than the terminals arranged on the inner side. In this way, in the electronic component in a bent form, the edge portion is more vulnerable to impact than the inner side, and greater damage may be applied.

[0006] In addition, when the rigidity of the test tray is greater than the rigidity of the electronic component, the electronic component may be damaged when it is placed on the test tray, etc. In this way, when the electronic component is transferred for testing or is being tested, the predetermined damage continues to accumulate, and when the number of terminals per unit area of ​​the electronic component increases, the impact accumulated on one terminal becomes larger. This accumulation of impact becomes a factor in the degradation of the performance of the electronic component.

[0007] Therefore, there is a need to minimize the impact applied to electronic components during the period when the electronic components are transferred for testing or are being tested, and to prevent damage to the terminals of the electronic components. Summary of the invention

[0008] In view of the above background, embodiments of the present invention have been invented to provide a test handler to minimize shocks applied to electronic components during transfer for testing and during testing, and to prevent damage to terminals of the electronic components.

[0009] According to one embodiment of the present invention, there may be provided a test handler, comprising: a pocket frame having a plurality of pocket spaces for accommodating electronic components; and

[0010] A plurality of impact-absorbing components are arranged in the plurality of bag-shaped spaces and are used to house the electronic components. The impact-absorbing components are formed of elastic material to absorb the impact exerted on the electronic components when the electronic components fall toward the impact-absorbing components, so that the electronic components are placed on the impact-absorbing components. In the bag-shaped frame, a plurality of wall portions are formed to protrude upward in a manner of surrounding the impact-absorbing components.

[0011] Further, a test processor may be provided, wherein the shock absorbing component comprises: a first shock absorbing component; and a second shock absorbing component, which is arranged on the upper side of the first shock absorbing component, wherein the surface friction coefficient of the second shock absorbing component is smaller than the surface friction coefficient of the first shock absorbing component.

[0012] The elastic force of the first impact absorbing member is higher than the elastic force of the second impact absorbing member.

[0013] Further, a test processor can be provided, wherein the plurality of wall portions are spaced apart from the impact absorbing component by a predetermined distance in the horizontal direction, so that a spacing space is provided between the wall portion and the impact absorbing component, and when the electronic component is placed on the impact absorbing component, a portion of the electronic component is arranged in the spacing space, a pocket-shaped open hole penetrating the pocket-shaped frame is formed in the pocket-shaped frame, a buffer open hole is formed in the impact absorbing component, and the buffer open hole penetrates the impact absorbing component to correspond to the pocket-shaped open hole.

[0014] Further, a test processor can be provided, wherein the impact absorbing component includes: a first impact absorbing component; and a second impact absorbing component, which is arranged on the upper side of the first impact absorbing component, and the buffer opening hole includes: a first buffer opening hole, which is formed in the first impact absorbing component to correspond to the bag-shaped opening hole; and a second buffer opening hole, which is formed in the second impact absorbing component to correspond to the first buffer opening hole.

[0015] Further, a test processor may be provided, comprising: a main body; a bag-shaped frame detachably coupled to the main body, wherein a bag-shaped space capable of placing the electronic component is formed in the bag-shaped frame; and

[0016] A shock absorbing component is sandwiched between the bag-shaped frame and the main body, and the electronic component can be placed in the shock absorbing component. The shock absorbing component is formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the shock absorbing component, so that the electronic component is placed on the shock absorbing component.

[0017] Furthermore, a test processor can be provided, wherein a bag-shaped groove portion is formed in the bag-shaped frame, and any part of the impact absorbing component can be accommodated in the bag-shaped groove portion, and a main body groove portion is formed in the main body portion, and another part of the impact absorbing component can be accommodated in the main body groove portion, and the impact absorbing component is fixedly supported on the bag-shaped frame and the main body portion by being accommodated in the bag-shaped groove portion on one side and in the main body groove portion on the other side.

[0018] Further, a test processor may be provided, comprising: a main body; a bag-shaped frame detachably coupled to the main body, wherein a bag-shaped space capable of placing electronic components is formed in the bag-shaped frame; and

[0019] A supporting component is sandwiched between the bag-shaped frame and the main body, the electronic component can be placed in the supporting component, a first open hole and a plurality of second open holes are formed in the supporting component, when the electronic component is placed on the supporting component, a part of the electronic component terminal can pass through the first open hole, another part of the electronic component terminal can pass through the plurality of second open holes, and the plurality of second open holes can be formed along the periphery of the first open hole.

[0020] Furthermore, a test processor can be provided, in which, in the main body, a protrusion for supporting the supporting component is formed to protrude from one side of the main body, and a bag-shaped groove portion into which the supporting component can be inserted is formed in the bag-shaped frame. When the bag-shaped frame is combined with the main body, the supporting component is fixedly supported on the bag-shaped frame by inserting the supporting component and at least a part of the protrusion into the bag-shaped groove portion.

[0021] Further, a test processor may be provided, wherein a first fixing element is provided in the bag-shaped frame, a second fixing element for engaging with the first fixing element is formed in the main body, a support fixing hole is formed in the support component, the support fixing hole is provided at a position corresponding to the second fixing element and is used to engage with any one of the first fixing element and the second fixing element,

[0022] Any one of the first fixing element and the second fixing element is engaged with the other of the first fixing element and the second fixing element in the support fixing hole to fix the support member to the main body.

[0023] Furthermore, a test processor can be provided, comprising: a test tray, the test tray comprising a tray frame and a holding unit, the tray frame being formed with a receiving portion capable of accommodating electronic components, the holding unit being capable of supporting the electronic components in the receiving portion so that the electronic components will not be separated from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic components can be separated from the receiving portion, the opening unit comprising: an opening unit body capable of pressurizing the holding unit by approaching the test tray; and a buffer support component supported by the opening unit body, when the opening unit body presses the holding unit When the holding unit is pressurized, at least a portion of it can be arranged inside the receiving portion, and the buffer support component arranged inside the receiving portion is formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the buffer support component, so that the electronic component is placed on the buffer support component. When the open unit is separated from the holding unit, a tray support portion capable of supporting the electronic component arranged in the receiving portion is provided in the tray frame, and when the buffer support component is arranged inside the receiving portion, the upper surface of the buffer support component is located on the upper side of the upper end of the tray support portion.

[0024] Further, a test handler may be provided, comprising: a test tray, the test tray comprising a tray frame and a holding unit, the tray frame being provided with a receiving portion capable of accommodating an electronic component, the holding unit being capable of supporting the electronic component in the receiving portion so that the electronic component does not fall out of the receiving portion; and

[0025] an opening unit capable of applying pressure to the holding unit so that the electronic component can be released from the housing portion,

[0026] The open unit comprises:

[0027] opening the unit body so as to pressurize the holding unit by approaching the test tray; and

[0028] a buffer support member supported by the open unit body, at least a portion of which can be disposed inside the receiving portion when the open unit body pressurizes the holding unit;

[0029] The buffer support member disposed inside the housing portion is formed of an elastic material to absorb impact applied to the electronic component when a predetermined pressure is applied to the electronic component placed on the buffer support member.

[0030] When the opening unit is spaced apart from the holding unit, a tray support portion capable of supporting the electronic components arranged in the storage portion is provided in the tray frame.

[0031] When the buffer support member is disposed inside the storage portion, an upper surface of the buffer support member is located above an upper end of the tray support portion.

[0032] Further, a test processor may be provided, comprising:

[0033] A test tray, the test tray comprising a tray frame, a tray support component and a holding unit, the tray frame being formed with a receiving portion capable of arranging electronic components, the tray support component being used to support a plurality of terminals of the electronic components arranged in the receiving portion, the holding unit being capable of supporting the electronic components on the tray support component so that the electronic components will not fall out of the receiving portion; and

[0034] an opening unit capable of applying pressure to the holding unit so that the electronic component can be released from the housing portion,

[0035] The open unit comprises:

[0036] opening the unit body so as to pressurize the holding unit by approaching the test tray; and

[0037] a buffer support member, supported by the open cell body and formed of an elastic material,

[0038] The tray support member has an open hole formed therein, and when the electronic component is placed in the tray support member, at least a portion of the terminals of the electronic component can pass through the open hole.

[0039] Furthermore, a test processor can be provided, wherein when the electronic component falls toward the tray support component or a predetermined pressure is applied to the electronic component placed on the tray support component, the buffer support component is tightly attached to the bottom surface of the tray support component to absorb the impact applied to the tray support component and the electronic component and to support the electronic component exposed through the open hole.

[0040] Furthermore, a test processor control method may be provided, comprising:

[0041] a moving step, wherein the loading device moves to above the receiving portion of the tray frame while holding the electronic component;

[0042] A raising step of raising the open unit body so that the buffer support member supported by the open unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame;

[0043] a gripping and releasing step, wherein the loading device releases the grip on the electronic component so that the electronic component falls toward the receiving portion;

[0044] a shock absorbing step of supporting the electronic component exposed through the open hole formed in the tray supporting member by the buffer supporting member so as to absorb shock applied to the electronic component when the electronic component falls toward the tray supporting member; and

[0045] a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member,

[0046] In the descending step,

[0047] When the open cell body descends, at least a portion of the plurality of terminals of the electronic component are inserted into the open hole.

[0048] Furthermore, a test processor control method may be provided, comprising:

[0049] A moving step, in which the unloading device moves to above the receiving portion of the tray frame in order to hold the electronic components in the receiving portion; a raising step, in which the open unit body is raised so that the buffer support component supported by the open unit body is in close contact with the bottom surface of the tray support component supported on the lower side of the tray frame;

[0050] a holding step, wherein the unloading device holds the electronic components supported by the tray supporting member;

[0051] a shock absorbing step of supporting the electronic component exposed through the open hole formed in the tray supporting member, thereby absorbing a shock applied to the electronic component when a predetermined pressure is applied to the electronic component in the holding step; and

[0052] a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member,

[0053] In the ascending step,

[0054] When the open cell body rises, at least a portion of the terminals of the electronic component rises while being inserted into the open hole.

[0055] Further, a test processor control method may be provided, further comprising an opening step of opening a holding unit to support the electronic component by the tray supporting member or to separate the electronic component from the tray supporting member,

[0056] In the ascending step, the open cell body is ascended to a predetermined position so that the open cell body pressurizes the holding unit.

[0057] According to the embodiments of the present invention, there is an effect of minimizing the impact applied to electronic components during the process of transferring to test the electronic components and the test process, and preventing the terminals of the electronic components from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 is a perspective view conceptually showing a test processor according to an embodiment of the present invention;

[0059] Figure 2 is a perspective view of a workbench according to a first embodiment of the present invention;

[0060] Figure 3 is along Figure 2 A cross-sectional view taken along the A-A' line;

[0061] Figure 4 is a cross-sectional view taken along line AA' of a workbench according to a second embodiment of the present invention;

[0062] Figure 5 is a perspective view of a workbench according to a third embodiment of the present invention;

[0063] Figure 6 is along Figure 5 A cross-sectional view taken at a section B-B';

[0064] Figure 7 is a cross-sectional view of a workbench according to a fourth embodiment of the present invention cut along BB′;

[0065] Figure 8 is a perspective view of a workbench according to a fifth embodiment of the present invention;

[0066] Fig. 9 yes Figure 8 An exploded perspective view of a workbench;

[0067] Fig.10 yes Fig. 9 A bottom perspective view of a bag-shaped frame;

[0068] Fig.11 is a perspective view of a workbench according to a sixth embodiment of the present invention;

[0069] Fig.12 yes Fig.11 An exploded perspective view of a workbench;

[0070] Fig.13 yes Fig.12 A bottom-up stereoscopic view and a partial enlarged view of the bag-shaped frame;

[0071] Fig.14 yes Fig.12 Enlarged view of C;

[0072] Fig.15 yes Fig.12 A three-dimensional diagram of a supporting component;

[0073] Fig.16 is a perspective view conceptually showing a test processor according to a seventh embodiment of the present invention;

[0074] Fig.17 yes Fig.16 A three-dimensional diagram of a test tray and an open unit;

[0075] Fig.18 yes Fig.16 An enlarged stereoscopic view of a test tray and a portion of an open unit;

[0076] Fig.19 is along Fig.18 A cross-sectional view taken at a section D-D';

[0077] Fig. 20 It is shown Fig.18 A cross-sectional view of a style in which the holding unit is in a released state;

[0078] Fig.21 is a longitudinal cross-sectional view of a test tray and an open unit according to an eighth embodiment of the present invention;

[0079] Fig. 22 It is shown Fig.21 A diagram showing the style of the opening unit rising and the holding unit being in a released state;

[0080] Fig.23 yes Fig. 22 An enlarged view of part E;

[0081] Fig.24 It is shown Fig. 22 A diagram showing a style in which the opening unit is lowered and the holding unit is in a state of preventing disengagement;

[0082] Fig.25 yes Fig.24 Enlarged view of middle F;

[0083] Fig.26 1 and 2 are flowcharts sequentially showing a test processor control method according to an eighth embodiment of the present invention. DETAILED DESCRIPTION

[0084] Hereinafter, specific embodiments for realizing the spirit of the present invention will be described in detail with reference to the accompanying drawings.

[0085] Furthermore, when describing the present invention, if it is determined that the detailed description of a related well-known configuration or function may make the gist of the present invention unclear, the detailed description will be omitted.

[0086] In addition, when it is mentioned that a certain component is “connected,” “supported,” or “coupled” to another component, it should be understood that it may be directly connected, supported, or coupled to the other component, but the other component may be present in between.

[0087] The terms used in this specification are only used to describe specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0088] In addition, the terms including the first, second, etc. ordinal numbers may be used to describe various constituent elements, but the corresponding constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another constituent element.

[0089] The meaning of “comprising” as used in the specification will specify specific features, regions, integers, steps, actions, elements and / or components, and will not exclude the existence or addition of other specific features, regions, integers, steps, actions, elements, components and / or groups.

[0090] In addition, in this specification, expressions such as an upper part and an upper surface are described based on the drawings and can be expressed in different ways as long as the directions of the corresponding objects are changed.

[0091] Hereinafter, the specific configuration of the test processor 1 according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0092] In the following, reference is made to Figure 1 According to an embodiment of the present invention, the test processor 1 can test the electronic components manufactured by the manufacturing process, classify them according to the test results, and load them into the customer trays T1 and T2. In addition, the test processor 1 can be detachably combined with the tester (not shown). Such a test processor 1 may include a loading device 10, a test tray 20, a cavity 30, an unloading device 40, a stacker module 50, and a control unit 60.

[0093] The loading device 10 can load the electronic components loaded in the first customer tray T1 into the test tray 20. Here, the electronic components placed on the first customer tray T1 are electronic components before being tested. The specific structure of the loading device 10 will be described below.

[0094] The test tray 20 has a space where electronic components to be tested can be placed, and can circulate along a predetermined path to test the electronic components. In addition, the test tray 20 can place electronic components that have been tested.

[0095] The cavity 30 may include a wetting cavity 31 , a testing cavity 32 , and a non-wetting cavity 33 .

[0096] The wetting chamber 31 may preheat or precool the electronic components loaded on the test tray 20 transferred from the loading position LP according to test conditions.

[0097] The test cavity 32 may provide a space in which electronic components preheated or precooled in the wetting cavity 31 and moved into the test cavity 32 are tested.

[0098] The non-wetting chamber 33 may be heated or cooled inside the test chamber 32 to assimilate the electronic components that have completed the test to a temperature required for unloading.

[0099] The unloading device 40 can classify the electronic components loaded in the test tray 20 transferred from the non-wetting chamber 33 according to the test level and unload them to the second customer tray T2. Here, the electronic components placed on the second customer tray T2 are the electronic components that have completed the test.

[0100] The stacker module 50 may store a first customer tray T1 and a second customer tray T2 loaded with electronic components.

[0101] The controller 60 can control the driving of the loading device 10 and the unloading device 40. Such a control unit 60 can be implemented by a computing device including a microprocessor, a measuring device such as a sensor, and a memory, and the implementation method is obvious to those skilled in the art, so further detailed description is omitted.

[0102] On the other hand, in this specification, the first customer pallet T1 and the second customer pallet T2 have been distinguished as electronic components before / after loading test, but this is only an example to help understand the specification. In actual engineering, the first customer pallet T1 and the second customer pallet T2 can be mixed during the loading and unloading process and can have the same shape and structure.

[0103] In the following, reference will be made to Figure 2 and Figure 3 The detailed structure of the loading device 10 according to the first embodiment of the present invention is described. The loading device 10 may include a workbench 100 and a hand 200 .

[0104] The workbench 100 can provide a space for temporarily placing a plurality of electronic components loaded on the first customer tray T1 before being loaded on the test tray 20, or a plurality of electronic components loaded on the test tray 20 before being loaded on the second customer tray T1. Such a workbench 100 can be arranged between the customer trays T1 and T2 and the test tray 20. In addition, the workbench 100 can include a bag-shaped frame 110 and a shock absorbing member 120.

[0105] The pouch-shaped frame 110 may provide a space for placing electronic components. The pouch-shaped frame 110 may include a placement portion 111 and a wall portion 112, and may include a pouch-shaped space P as a space for placing electronic components.

[0106] The shock absorbing member 120 may be disposed on the placement portion 111, and the electronic component may be placed in the shock absorbing member 120. The placement portion 111 may be formed on one surface of the pouch frame 110. In addition, a pouch-shaped opening hole 111a penetrating the pouch frame 110 may be formed in the placement portion 111.

[0107] The wall portion 112 may guide the movement of the electronic component so that the electronic component descending toward the shock absorbing member 120 may be placed on the shock absorbing member 120. A plurality of such wall portions 112 may be provided, and the plurality of wall portions 112 may be formed to protrude upward to surround the shock absorbing member 120. In addition, the plurality of wall portions 112 may have a predetermined inclination toward the shock absorbing member 120.

[0108] The pocket space P may be a space where electronic components are arranged inside the pocket frame 110, and may refer to a space surrounded by a plurality of walls 112 and a shock absorbing member 120. A plurality of such pocket spaces P may be formed, and a plurality of electronic components may be arranged in the plurality of pocket spaces P.

[0109] When the electronic components are arranged in the bag-shaped space P, the impact absorbing component 120 can provide a portion for accommodating the electronic components. In addition, the impact absorbing component 120 can absorb the impact applied to the electronic components. For example, when the electronic components fall toward the impact absorbing component 120, the impact absorbing component 120 can absorb the impact applied to the electronic components. Such impact absorbing component 120 may include a material having an elastic material that is conducive to impact absorption, for example, it may include silicon Si. A plurality of such impact absorbing components 120 may be provided, and the plurality of impact absorbing components 120 may be arranged in a plurality of bag-shaped spaces P.

[0110] In addition, the impact absorbing member 120 may include a material having excellent lubricity. For example, the upper surface of the impact absorbing member 120 may be made of a material having excellent lubricity (i.e., a material having low friction resistance) to minimize the friction between the impact absorbing member 120 and the electronic component. In this way, when the upper surface of the impact absorbing member 120 includes a material having low friction resistance, when the electronic component is placed on the impact absorbing member 120, it is possible to prevent the electronic component from sliding off the impact absorbing member 120 or from being poorly placed. As another example, the surface of the impact absorbing member 120 may be formed as a flat surface without concave-convex to prevent the occurrence of poor placement of the electronic component.

[0111] The shock absorbing member 120 is disposed on the seating portion 111 and may be fixedly supported on the seating portion 111. For example, the shock absorbing member 120 may be adhered to the upper surface of the seating portion 111 by an adhesive (not shown). In addition, the shock absorbing member 120 may have a predetermined thickness, and a plurality of thicknesses may be formed in the shock absorbing member 120 along the thickness direction (e.g., Figure 3 The buffering open hole 120a that penetrates the impact absorbing component 120 in the up-down direction in the impact absorbing component 120 is formed. Such a buffering open hole 120a may be formed in the impact absorbing component 120 to correspond to the bag-shaped open hole 111a. Therefore, the bag-shaped open hole 111a and the buffering open hole 120a may be connected to each other. In addition, when the electronic component is placed on the impact absorbing component 120, the buffering open hole 120a may prevent an air layer from being formed between the electronic component and the impact absorbing component 120, so that the electronic component is spaced apart from the impact absorbing component 120.

[0112] The hand 200 can hold a plurality of electronic components placed on the customer tray T1 and transfer them to the workbench 100, and can place them on the shock absorbing member 120. In addition, the hand 200 can hold a plurality of electronic components placed on the workbench 100 and transfer them to the test tray 20. In addition, the hand 200 can release the electronic components from the upper side of the shock absorbing member 120 to drop them.

[0113] For example, the hand 200 can hold the electronic component by a predetermined vacuum pressure. On the other hand, when the hand 200 holds the electronic component, an impact may be applied to the electronic component due to the pressure applied by the hand 200, but this impact can be minimized by the impact absorbing member 120. In other words, when the hand 200 holds the electronic component, the impact applied to the electronic component can be absorbed by the impact absorbing member 120 by the elastic force of the impact absorbing member 120. In this way, there is an effect that the impact applied to the electronic component by the impact absorbing member 120 is minimized.

[0114] As another example, since the rigidity of the placement portion 111 is greater than the rigidity of the electronic component, when the hand 200 places the electronic component in the bag-shaped space P, if the electronic component falls and is immediately placed on the placement portion 111, the impact may be applied to the electronic component. However, when the hand 200 releases the grip of the electronic component, the electronic component is placed on the impact absorbing component 120 having an elastic force, thereby minimizing the impact applied to the electronic component. In addition, there is the following effect: by including a material having low friction resistance on the upper surface of the impact absorbing component 120, even if the electronic component is placed on the upper surface of the impact absorbing component 120, it will not be detached from the impact absorbing component 120 and can be placed at a predetermined position.

[0115] On the other hand, the hand 200 may be provided in the unloading device 40, and the hand 200 provided in the unloading device 40 may transfer the electronic components placed on the test tray 20 to the second customer tray T2. In addition, the hand 200 provided in the loading device 10 may be named as the first hand 200, and the hand 200 provided in the unloading device 40 may be named as the second hand 200.

[0116] On the other hand, in addition to these structures, according to the second embodiment of the present invention, the impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122. Figure 4 A second embodiment of the present invention will be described. When describing the second embodiment, the differences from the above embodiment will be mainly described, and the same descriptions and reference numerals are used for the above embodiment.

[0117] Reference Figure 4 The impact absorbing component 120 may include a first impact absorbing component 121 and a second impact absorbing component 122 , and the buffering open hole 120 a may include a first buffering open hole 121 a and a second buffering open hole 122 a .

[0118] The first impact absorbing member 121 may be disposed on the seating portion 111 and may be formed of an elastic material. The elastic force of such a first impact absorbing member 121 may be higher than the elastic force of the second impact absorbing member 122. In addition, the first impact absorbing member 121 may have a first buffering open hole 121a formed therein to correspond to the bag-shaped open hole 111a.

[0119] The second impact absorbing member 122 may be disposed on the first impact absorbing member 121 and may provide a portion where electronic components are placed. Figure 4 The second impact absorbing member 122 is provided with a second buffering opening 122a that penetrates the second impact absorbing member 122 in the vertical direction. Such a second impact absorbing member 122 may have a predetermined elastic force and have a friction resistance less than that of the first impact absorbing member 121. For example, the second impact absorbing member 122 may include an engineering plastic having high lubricity due to low friction resistance. In a more detailed example, the second impact absorbing member 122 may include at least one of nylon, polyphenylene oxide (mPPO), polycarbonate (PC), polyacetal (Aceta l), and polybutylene terephthalate (PBT).

[0120] In this way, since the second shock absorbing member 122 has low friction resistance, when the electronic component is placed on the second shock absorbing member 122 , the electronic component has the effect of being placed on the second shock absorbing member 122 without being separated from the second shock absorbing member 122 .

[0121] In addition, the second shock absorbing component 122 and the first shock absorbing component 121 have elastic force, so when the electronic component is placed on the second shock absorbing component 122, the impact between the second shock absorbing component 121 and the electronic component will be absorbed by the first shock absorbing component 121 due to the elasticity of the first shock absorbing component 121.

[0122] Therefore, when the electronic component is placed on the second impact absorbing member 122 , there is an effect that the impact applied to the electronic component is minimized.

[0123] On the other hand, in addition to this configuration, according to the third embodiment of the present invention, the wall portion 112 may be spaced apart from the impact absorbing member 120. Figure 5 and Figure 6 A third embodiment of the present invention will be described. When describing the third embodiment, the differences from the above embodiment will be mainly described, and the same descriptions and reference numerals are used for the above embodiment.

[0124] Reference Figure 5 and Figure 6 The workbench 100 may include a bag-shaped frame 110 and a shock absorbing component 120 .

[0125] A pocket-shaped open hole 111 a penetrating the pocket-shaped space P may be formed in the pocket-shaped frame 110 .

[0126] The wall portion 112 may be provided in plurality, and the plurality of wall portions 112 may be formed to protrude upward to surround the impact absorbing member 120 .

[0127] In addition, the plurality of wall portions 112 may be spaced apart from the impact absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart by a predetermined distance from one side of the impact absorbing member 120 facing the wall portion 112. In this manner, a spacing space S may be provided between the wall portion 112 and the impact absorbing member 120 by spacing the plurality of wall portions 112 from the impact absorbing member 120.

[0128] The terminal portion of the electronic component may be disposed in the spacing space S. For example, a plurality of terminals may be disposed at the edge of the electronic component. In addition, when the electronic component is placed on the impact absorbing member 120, the edge of the electronic component may be disposed in the spacing space S without being placed on the impact absorbing member 120. In this case, since the terminal of the electronic component does not contact the impact absorbing member 120, it can be protected from the impact caused by contact with the impact absorbing member 120.

[0129] In addition, the shock absorbing member 120 may be formed with a buffering open hole 120 a penetrating the shock absorbing member 120 in a manner corresponding to the bag-shaped open hole 111 a .

[0130] On the other hand, the terminals of the electronic component can be formed not only on the entire front surface of the electronic component, but also can be concentrated at the edge of the electronic component. When such an electronic component is bent to have a predetermined curvature, the load is reduced in the center, and the load is concentrated on the terminals at the edge. However, according to the third embodiment of the present invention, since a spacing space S is formed between the wall portion 112 and the impact absorbing component 120, the terminals formed at the edge portion of the electronic component can be placed in the spacing space S. Accordingly, there is an effect of protecting the terminals formed at the edge portion of the electronic component from the impact caused by contact with the impact absorbing component 120.

[0131] On the other hand, in addition to this configuration, according to the fourth embodiment of the present invention, the wall portion 112 may be spaced apart from the first impact absorbing member 121 and the second impact absorbing member 122. Figure 7 A fourth embodiment of the present invention will be described. When describing the fourth embodiment, the differences from the above-described embodiment will be mainly described, and the same descriptions and reference numerals are used in the above-described embodiment.

[0132] Reference Figure 7 The workbench 100 may include a bag-shaped frame 110 and a shock absorbing component 120 .

[0133] The shock absorbing member 120 may include a first shock absorbing member 121 and a second shock absorbing member 122 , and the buffering open hole 120 a may include a first buffering open hole 121 a and a second buffering open hole 122 a .

[0134] The first impact absorbing member 121 may be disposed on the seating portion 111 and may be formed of an elastic material. The elastic force of such a first impact absorbing member 121 may be higher than the elastic force of the second impact absorbing member 122. In addition, the first impact absorbing member 121 may have a first buffering open hole 121a formed therein to correspond to the bag-shaped open hole 111a.

[0135] The second impact absorbing member 122 may be disposed on the first impact absorbing member 121 and may be fixedly supported on the first impact absorbing member 121. For example, the second impact absorbing member 122 may be adhered to the upper surface of the first impact absorbing member 121 by an adhesive (not shown). Such a second impact absorbing member 122 may have a predetermined thickness, and a plurality of portions along the thickness direction (e.g., Figure 7 The second buffer opening hole 122a of the second impact absorbing member 122 is penetrated in the up-down direction.

[0136] The second buffer opening hole 122a may be formed in the second shock absorbing member 122 in a manner corresponding to the first buffer opening hole 121a. Therefore, the second buffer opening hole 122a and the first buffer opening hole 121a may be communicated with each other. In addition, the second buffer opening hole 122a may prevent an air layer from being formed between the electronic component and the second shock absorbing member 122 when the electronic component is placed on the second shock absorbing member 122, so that the electronic component is spaced apart from the second shock absorbing member 122.

[0137] The wall portion 112 may be provided in plurality, and the plurality of wall portions 112 may be formed to protrude upward to surround the first impact absorbing member 121 and the second impact absorbing member 122 .

[0138] In addition, the plurality of wall portions 112 may be spaced apart from the impact absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart from a predetermined distance from a side of the impact absorbing member 120 facing the wall portion 112. In this manner, a spacing space S may be formed between the wall portion 112 and the first impact absorbing member 121 and the second impact absorbing member 122 by spacing the plurality of wall portions 112 from the first impact absorbing member 121 and the second impact absorbing member 122.

[0139] The terminal portion of the electronic component may be disposed in the spacing space S. For example, a plurality of terminals may be disposed at the edge of the electronic component. In addition, when the electronic component is disposed on the second impact absorbing member 1220, the edge of the electronic component may be disposed in the spacing space S without being disposed on the second impact absorbing member 122. In this case, since the terminal of the electronic component does not contact the second impact absorbing member 122, it can be protected from the impact caused by contact with the second impact absorbing member 122.

[0140] In this way, by forming the separation space S, there is an effect of protecting the terminal of the electronic component from the impact generated by contact with the second impact absorbing member 122 .

[0141] In addition, when the electronic component is placed on the second shock absorbing member 122 , due to the elasticity of the first shock absorbing member 121 , there is an effect that the shock between the second shock absorbing member 122 and the electronic component is absorbed by the first shock absorbing member 121 .

[0142] Therefore, when the electronic component is placed on the second impact absorbing member 122 , there is an effect that the impact applied to the electronic component can be minimized.

[0143] On the other hand, in addition to this configuration, according to the fifth embodiment of the present invention, the workbench 100 may further include a main body 140. Figures 8 to 10 A fifth embodiment of the present invention will be described. When describing the fifth embodiment, the differences from the above embodiments will be mainly described, and the same descriptions and reference numerals are used for the above embodiments.

[0144] Reference Figure 8 The workbench 100 may provide a space in which a plurality of electronic components loaded in the customer tray T1 are temporarily placed before being loaded into the test tray 20. Such a workbench 100 may include a pouch frame 110, a buffer member 120, and a main body 140.

[0145] Reference Fig. 9 , the bag-shaped frame 110 may provide a space for accommodating electronic components. In addition, the bag-shaped frame 110 may be detachably coupled to the main body 140. A plurality of such bag-shaped frames 110 may be provided, and the plurality of bag-shaped frames 110 may be supported by the main body 140. In addition, a plurality of bag-shaped spaces P may be formed in the plurality of bag-shaped frames 110. The wall portion 112, the bag-shaped groove portion 113, and the correction hole 114 may be formed in the bag-shaped frame 110.

[0146] The wall portion 112 may be provided in plurality, and the plurality of wall portions 112 may be formed to protrude upward to surround the buffer member 120. In addition, the plurality of wall portions 112 may form a pocket space P together with the buffer member 120, and the pocket space P is a space where electronic components are arranged inside the pocket space P. A plurality of such pocket spaces P may be formed.

[0147] Reference Fig.10 The pocket-shaped groove 113 may provide a portion for accommodating a portion of the buffer component 120. Such a pocket-shaped groove 113 may be a portion formed by introducing from the pocket-shaped frame 110, and may prevent the buffer component 120 accommodated in the pocket-shaped groove 113 from being separated.

[0148] When the bag-shaped frame 110 is combined with the main body 140, the correction hole 114 can be engaged with the correction pin 143 of the main body 140 to correct the position of each other. For example, the position of the bag-shaped frame 110 and the main body 140 relative to each other can be corrected by inserting the correction pin 143 into the correction hole 114. Such correction holes 114 can be formed in plurality.

[0149] When the electronic component is placed in the pocket space P, the buffer component 120 can provide a portion for placing the electronic component. In addition, the buffer component 120 can be provided to absorb the impact applied to the electronic component. For example, the buffer component 120 can be in the shape of a pad extending in one direction and can include silicon (Si). A plurality of such buffer components 120 can be provided, and the plurality of buffer components 120 can be supported by the main body 140.

[0150] In addition, when the bag-shaped frame 110 is combined with the main body 140, the buffer component 120 can be sandwiched between the bag-shaped frame 110 and the main body 140. For example, a part of the buffer component 120 can be accommodated in the main body groove 141 described later of the main body 140, and another part of the buffer component 120 can be accommodated in the bag-shaped groove 113 of the bag-shaped frame 110. In this way, the buffer component 120 is inserted into the bag-shaped groove 113 and the main body groove 141, so that it can be fixedly supported at a predetermined position without being separated from the bag-shaped frame 110 and the main body 140.

[0151] On the other hand, the buffer component 120 is arranged on the main body groove portion 141 and can be fixedly supported on the main body 140. For example, the buffer component 120 can be adhered to the upper surface of the main body groove portion 141 by an adhesive (not shown). In addition, the buffer component 120 can have a predetermined thickness, and a buffer opening hole 120a that passes through the buffer component 120 can be formed in the buffer component 120 along the thickness direction. Such a buffer opening hole 120a can be formed at a position corresponding to the main body opening hole 142 described later. Therefore, the buffer opening hole 120a and the main body opening hole 142 can be connected to each other. In addition, when the electronic component is placed on the buffer component 120 through the buffer opening hole 120a, an air layer is formed between the electronic component and the buffer component 120 to prevent the electronic component from being separated from the buffer component 120.

[0152] Refer again Fig. 9 The body portion 140 may support the plurality of bag-shaped frames 110 and may support the plurality of buffer members 120. A body groove portion 141, a body open hole 142, and a correction pin 143 may be formed in the body portion 140.

[0153] The body groove 141 may support the buffer member 120 and may provide a portion for receiving a portion of the buffer member 120. In other words, when a portion of the buffer member 120 is received in the body groove 141, the body groove 141 may fixedly support the buffer member 120.

[0154] The body opening hole 142 may be formed through the body portion 140 and may be formed in the body groove portion 141. Such a body opening hole 142 may communicate with the buffer opening hole 120a.

[0155] When the bag-shaped frame 110 is combined with the main body 140, the correction pin 143 can be engaged with the correction hole 114 to correct the position between each other. For example, the correction pin 143 can be formed to protrude from the main body 140 to be inserted into the correction hole 114. A plurality of such correction pins 143 can be provided, and can be engaged with a plurality of correction holes 114 formed in a plurality of bag-shaped frames 110.

[0156] In this way, there is an effect that, by engaging the correction pin 143 with the correction hole 114 , the relative positions of the bag-shaped frame 110 and the main body portion 140 can be corrected so that they can be combined with each other.

[0157] In addition, by inserting the buffer component 120 into the bag-shaped groove 113 and the main body groove 141, it will not be detached from the bag-shaped frame 110 or the main body 140 and can be fixedly supported. When placing electronic components, it has the effect of more stably absorbing the impact applied to the electronic components.

[0158] In addition, since the main body portion 140 and the pouch frame 110 are separately provided, when the buffer member 120 is disposed on the main body portion 140 , there is an effect that it can be disposed more easily and quickly.

[0159] On the other hand, in addition to this configuration, according to the sixth embodiment of the present invention, the workbench 100 may further include a supporting member 150. Figures 11 to 15 The sixth embodiment of the present invention will be described. When describing the sixth embodiment, the differences from the above-mentioned embodiment will be mainly described, and the same descriptions and reference numerals are used for the above-mentioned embodiment.

[0160] Reference Fig.11 and Fig.12 The workbench 100 may include a bag-shaped frame 110 , a main body 140 and a supporting member 150 .

[0161] The pocket frame 110 may include a wall portion 112 , a pocket groove portion 113 , a correction hole 114 , and a fixing pin 115 .

[0162] Reference Fig.13The pocket groove 113 may provide a portion into which the support member 150 and at least a portion of the protrusion 144 described later are inserted. Such a pocket groove 113 may be a portion introduced into the pocket frame 110 and may prevent the support member 150 inserted into the pocket groove 113 from being separated from the pocket frame 110.

[0163] The fixing pin 115 can fix the support member 150 on the protrusion 144 of the main body 140. Such a fixing pin 115 can be inserted through the support fixing hole 153 described later, and can be engaged with the main body fixing hole 145 described later. For example, when the bag-shaped frame 110, the support member 150 and the main body 140 are arranged in sequence, the fixing pin 115 will be inserted into the support fixing hole 153 and the main body fixing hole 145 in sequence to fix the support member 150 to the protrusion 144. A plurality of such fixing pins 115 can be provided, and the plurality of fixing pins 115 can be formed in a protruding manner.

[0164] Reference Fig.12 and Fig.14 , a main body opening hole 142 , a correction pin 143 , a protrusion 144 and a main body fixing hole 145 may be formed in the main body 140 .

[0165] The protrusion 144 may support the support member 150 and may provide a portion where the support member 150 is placed. Such a protrusion 144 may be a portion protruding from the body 140 to a predetermined height. In addition, the protrusion 144 may be inserted into the pocket groove 113 together with the support member 150.

[0166] The main body fixing hole 145 can be engaged with the fixing pin 115 to fix the support member 150. For example, the main body fixing hole 145 can be formed through the main body 140 to insert the fixing pin 115. In addition, the main body fixing hole 145 can be formed in plurality, and the plurality of main body fixing holes 145 can be formed on the protrusion 144. The above-mentioned fixing pin 115 and the main body fixing hole 145 can be respectively named as the first fixing element 115 and the second fixing element 145, and can be deformed and implemented as the first fixing element 115 having a hole shape and the second fixing element 145 having a pin shape. Therefore, any one of the first fixing element 115 and the second fixing element 145 is engaged with the other of the first fixing element 115 and the second fixing element 145 on the support fixing hole 153 to fix the support member 150 to the main body 140.

[0167] Reference Fig.15 , a support member 150 may be provided to support the electronic component. For example, such a support member 150 may be provided as a thin film for supporting the electronic component. In addition, the support member 150 may be supported on the protrusion 144 and may be placed on the upper surface of the protrusion 144.

[0168] When the pouch frame 110 is combined with the main body 140, such a support member 150 may be sandwiched between the pouch frame 110 and the main body 140. For example, the support member 150 may be inserted into the pouch groove 113 to be supported by the pouch frame 110. A first open hole 151, a second open hole 152, and a support fixing hole 153 may be formed in the support member 150.

[0169] When the electronic component is supported by the support member 150, a part of the terminal of the electronic component may pass through the first open hole 151. For example, the terminal formed in the center of the electronic component may pass through the first open hole 151. Such a first open hole 151 passes through the support member 150 in the thickness direction of the support member 150 and may be formed in the center of the support member 150.

[0170] When the electronic component is supported by the support member 150, some terminals of the electronic component may pass through the second open hole 152. For example, the terminal formed at the edge of the electronic component may pass through the second open hole 152. Such a second open hole 152 surrounds the first open hole 151 along the periphery of the first open hole 151, and passes through the support member 150 in the thickness direction of the support member 150. In addition, a plurality of second open holes 152 may be formed.

[0171] On the other hand, the depth of the first opening hole 151 and the second opening hole 152 in the thickness direction of the support member 150 may be the same as the thickness t of the support member 150. In addition, the first opening hole 151 and the second opening hole 152 may be formed in the support member 150 in a manner equal to or deeper than the terminal length of the electronic component.

[0172] A support fixing hole 153 may be formed through the support member 150 to insert the fixing pin 115. Such a support fixing hole 153 may be formed at a position corresponding to the main body fixing hole 145. Therefore, the fixing pin 115 inserted into the support fixing hole 153 may be inserted into the main body fixing hole 145, and the support member 150 may be fixedly supported on the protrusion 144.

[0173] In this manner, since the first opening hole 151 and the second opening hole 152 are formed on the support member 150 , there is an effect that various types of electronic components can be mounted on the support member 150 regardless of the number of terminals.

[0174] In addition, there is an effect that the support member 150 is inserted into the fixing pin 115 and inserted into the pocket-shaped groove portion 113 without coming off the protruding portion 144 .

[0175] On the other hand, in addition to this configuration, according to the seventh embodiment of the present invention, the loading device 10 may further include an opening unit 300. Figures 16 to 20 The seventh embodiment of the present invention will be described. When describing the seventh embodiment, the differences from the above-mentioned embodiment will be mainly described, and the same descriptions and reference numerals are used for the above-mentioned embodiment.

[0176] Reference Fig.16 and Fig.17 , the loading device 10 may further include an opening unit 300 .

[0177] The opening unit 300 can convert the holding unit 22 described later of the test tray 20 into a release state or a prevented separation state. Such an opening unit 300 can move in a direction away from or close to the test tray 20 to load electronic components. In addition, the opening unit 300 may include a driving device (not shown) such as a hydraulic piston for such movement. However, in this specification, it is shown that the opening unit 300 approaches or moves away from the test tray 20, but this is only an example, and the test tray 20 may also approach or move away from the opening unit 300. Such an opening unit 300 may include an opening unit body 310, a support member 320, and an elastic unit 330.

[0178] The opening unit body 310 may support the support member 320 and open the holding unit 22 of the test tray 20. A recess 311, an opening protrusion 312, a positioning protrusion 313, and an anti-sticking protrusion 314 may be formed in such an opening unit body 310.

[0179] The recess 311 may be formed at one side of the open unit body 310, which may be a surface of the test tray 20 side. The support 320 may be received in the recess 311, and a groove 311a may be provided for receiving the elastic unit 330.

[0180] The opening protrusion 312 may operate the holding unit 22. Such an opening unit 300 may be disposed adjacent to the recess 311 and may be formed to protrude toward the test tray 20. In addition, the opening protrusion 312 may be formed on the opening unit body 310 to correspond to the holding unit 22.

[0181] The positioning protrusion 313 may guide the relative movement between the test tray 20 and the opening unit 300 so that the opening protrusion 312 may act on the holding unit 22. In other words, the opening protrusion 312 may be guided to the holding unit 22 with higher accuracy by the positioning protrusion 313.

[0182] When the opening unit 300 approaches the test tray 20, the anti-sticking protrusion 314 can prevent the opening unit 300 from being too close to the test tray 20. Therefore, even when the opening protrusion 312 operates the holding unit 22, the opening unit 300 can maintain a predetermined interval from the test tray 20.

[0183] Reference Fig.18 The support member 320 may be supported by the open unit body 310 to advance and retreat in a direction away from the open unit body 310. For example, the support member 320 may move in a direction away from the open unit body 310 within the recess 311 of the open unit body 310, and may move in a direction close to the open unit body 310. Such a support member 320 may support the electronic components accommodated in the test tray 20 in a released state. Such a support member 320 may include a support body 321 and a buffer support member 322.

[0184] The support body 321 may support the elastic unit 330. To this end, an elastic member groove 321a may be formed in the support body 321.

[0185] The buffer support member 322 may provide a portion where electronic components in the accommodating portion 21a described later are placed. Such a buffer support member 322 may be inserted into the accommodating portion 21a in the unlocked state of the retainer 22a, and the electronic components may be supported by the buffer support member 322. The area in which such a buffer support member 322 contacts the electronic components may be wider than the area in which the tray support portion 21b described later contacts the electronic components, and the buffer support member 322 is located between the tray support portions 21b in the released state. In addition, when the buffer support member 322 is disposed on the inner side of the accommodating portion 21a, the upper surface of the buffer support member 322 may be located on the upper side of the upper end of the tray support portion 21b.

[0186] A buffer support member 322 may be provided to absorb impact applied to the electronic component. For example, if the hand 200 releases the grip of the electronic component on the housing portion 21a, the buffer support member 322 may absorb the impact applied to the electronic component when the electronic component is placed on the buffer support member 322. As another example, when the hand 200 holds the electronic component disposed in the housing portion 21a, if a predetermined pressure is applied to the electronic component, the buffer support member 322 may absorb the impact applied to the electronic component. Such a buffer support member 322 may include a material having an elastic material that is conducive to absorbing impact, such as silicone (Si).

[0187] The buffer support member 322 may be disposed on the upper surface of the support body 321 and may be fixedly supported on the support body 321. For example, the buffer support member 322 may be adhered to the upper surface of the support body 321 by an adhesive (not shown). Fig.19 The buffer support hole 322a extends through the buffer support member 322 in the vertical direction. The buffer support hole 322a may be connected to a hole formed in the support body 321. In addition, when the electronic component is placed on the buffer support member 322, an air layer is formed between the electronic component and the buffer support member 322, so that the buffer support hole 322a can prevent the electronic component from being separated from the buffer support member.

[0188] Reference Fig.19 The elastic unit 330 may press the support member 320 toward the test tray 20 . The elastic unit 330 may include an elastic component 331 and a separation preventing portion 332 .

[0189] The elastic member 331 can press the support member 320 toward the test tray 20. For example, the elastic member 331 can be sandwiched between the support body 321 and the open unit body 310. One end of the elastic member 331 can be accommodated in the elastic member groove 321a provided at the lower part of the support body 321, and the other end can be accommodated in the recess 311 of the open unit body 310. When the pressure is released, the elastic unit 330 moves the support member 320, which is pressed by the test tray 20 and moves in the direction close to the open unit body 310, to the direction away from the open unit body 310 by the restoring force. In addition, during the period when the test tray 20 moves a predetermined distance in the direction away from the open unit 300, the support member 320 is pressed toward the test tray 20 by the elastic member 331, so that it can be closely attached to the test tray 20, and the support member 320 can support the electronic components in the receiving portion 21a.

[0190] The detachment preventing portion 332 can prevent the support member 320 from being completely detached from the open unit body 310. One end of the detachment preventing portion 332 can be fixed to the open unit body 310, and can guide the support member 320 to move in a direction away from the open unit body 310. In addition, when the support member 320 is pressed by the elastic member 331 and moves in a direction away from the open unit body 310, the other end of the detachment preventing portion 332 can limit the movement of the support member 320.

[0191] However, in this specification, it has been described that the elastic unit 330 is provided to press the support member 320 toward the test tray 20 and prevent the support member 320 from being separated from the open unit body 310, but this is only an example, and the elastic unit 330 may be omitted. Therefore, the support member 320 may also be fixedly supported on the open unit body 310.

[0192] Hereinafter, the test tray 20 will be described in detail. The test tray 20 can accommodate electronic components, and the object accommodated in the test tray 20 can be prevented from escaping by a holding unit 22 described later. The electronic components can be loaded or unloaded in such a test tray 20. Such a test tray 20 may include a tray frame 21 and a holding unit 22.

[0193] A receiving portion 21a in which electronic components can be placed may be formed in the tray frame 21. Such receiving portion 21a may be configured in the form of a through hole, and such through hole may be formed to be narrowed toward one side. For example, the receiving portion 21a may be formed to be narrowed toward the open unit 300. One side of such receiving portion 21a may be used as an entrance for moving electronic components. On the other hand, a tray support portion 21b may be formed on the tray frame 21. Such tray support portion 21b may be a protrusion protruding from the receiving portion 21a. In addition, the tray support portion 21b may contact and support the electronic components placed in the receiving portion 21a.

[0194] Reference Fig.19 and Fig. 20 The holding unit 22 can selectively hold the electronic components arranged in the receiving portion 21a. Therefore, even if the test tray 20 moves or rotates, the electronic components can be constrained and will not be separated from the test tray 20. Such a holding unit 22 can be converted into any one of a release state and a separation prevention state by the opening unit 300. Here, the release state refers to a state in which the electronic components are allowed to be placed and separated from the receiving portion 21a by the opening unit 300, and the separation prevention state refers to a state in which the electronic components are prevented from being separated from the receiving portion 21a. The holding unit 22 may include a retainer 22a and a retainer spring 22b.

[0195] The retainer 22a can selectively retain the electronic components contained in the housing portion 21a. Such a retainer 22a can be pivoted, for example, by a hinge connection. In other words, without applying any force to the retainer 22a, the retainer 22a can be rotated toward the tray support portion 21b with the pivot as the center by the force of the retainer spring 22b, so that the electronic components can be retained by the retainer 22a. In addition, if the electronic components are placed in the housing portion 21a, one side of the electronic components can be supported by the retainer 22a, and the other side of the electronic components can be supported by the tray support portion 21b.

[0196] The retainer spring 22b can provide a restoring force to the retainer 22a. On the other hand, in this specification, the retainer spring 22b is shown as a torsion spring, but this is only an example, and other well-known springs can also be used.

[0197] Hereinafter, the operation and effects of the test processor 1 according to the seventh embodiment of the present invention will be described.

[0198] The hand 200 can load a plurality of electronic components loaded on the customer trays T1 and T2 onto the workbench 100. The workbench 100 can transfer a plurality of electronic components to the test tray 20. In addition, the hand 200 can move a plurality of electronic components loaded on the workbench 100 to the upper side of the test tray 20, and can release the grip on the upper side of the test tray 20.

[0199] The opening unit 300 may rise toward the test tray 20, so that the receiving portion 21a of the test tray 20 is in a released state. At this time, the opening protrusion 312 of the opening unit 300 rotates the holder 22a, so that the receiving portion 21a may be in a released state. In addition, when the opening unit 300 is in close contact with the test tray 20, the buffer support member 322 may be disposed inside the receiving portion 21a.

[0200] When the hand 200 releases the grip of the electronic component from the upper side of the receiving portion 21a, the electronic component can be lowered and placed on the buffer support member 322. In addition, when the opening unit 300 is lowered, the electronic component placed on the buffer support member 322 can be supported by the tray support portion 21b. At this time, the retainer 22a can be in a state of preventing separation by rotating to the original position by the retainer spring 22b.

[0201] In this way, when the hand 200 releases the grip of the electronic component from the upper side of the housing portion 21a, the buffer support member 322 has elastic force, so that the impact between the buffer support member 322 and the electronic component is absorbed by the buffer support member 322. Therefore, there is an effect of minimizing the impact applied to the electronic component.

[0202] In addition, since one end of the buffer support member 322 is disposed on the upper side of the tray support portion 21b, when the electronic component is lowered, it can be placed on the buffer support member 322, and the impact applied to the electronic component can be minimized. Thereafter, when the buffer support member 322 is lowered, the electronic component placed on the buffer support member 322 will be supported by the tray support portion 21b, and at this time, the electronic component can be supported by the tray support portion 21b without being impacted. Therefore, there is an effect of preventing the impact applied to the electronic component.

[0203] On the other hand, in addition to this configuration, according to the eighth embodiment of the present invention, the test tray 20 may omit the test support portion 21b and include the tray support member 23. Figure 21 to Figure 23 The eighth embodiment of the present invention will be described. When describing the eighth embodiment, the differences from the above-mentioned embodiments will be mainly described, and the same descriptions and reference numerals are used for the above-mentioned embodiments.

[0204] The tray support member 23 can support the electronic component 2 placed inside the receiving portion 21a. For example, the tray support member 23 can support between the multiple terminals 2a of the electronic component. Such a tray support member 23 can be supported by the tray frame 21 at the lower side of the tray frame 21. In addition, a plurality of open holes 23a through which the terminals of the electronic component can pass can be formed in the tray support member 23. For example, when the electronic component is supported by the tray support member 23, the multiple terminals of the electronic component can be exposed downward through the multiple open holes 23a.

[0205] The holding unit 22 can prevent the electronic components supported by the tray supporting member 23 from being detached from the tray supporting member 23 .

[0206] The buffer support member 322 can absorb the impact applied to the tray support member 23 and the electronic components supported by the tray support member 23. For example, when the electronic components fall toward the tray support member 23 or when a predetermined pressure is applied to the electronic components, the buffer support member 322 can absorb the impact applied to the tray support member 23. That is, the buffer support member 322 is in close contact with the bottom surface of the tray support member 23 to absorb the impact applied to the tray support member 23. Moreover, the buffer support member 322 can support the electronic components exposed through the open hole 23a, thereby absorbing the impact applied to the electronic components when the electronic components are placed on the tray support member 23.

[0207] In the following, reference will be made to Figure 21 to Figure 26 A test processor control method S10 according to an eighth embodiment of the present invention is described.

[0208] The test processor control method S10 may support the test of electronic components by loading or unloading the electronic components in the test tray 20. The test processor control method S10 may include a moving step S100, an ascending step S200, an opening step S300, a gripping release step S400, a gripping step S500, a shock absorbing step S600, and a descending step S700.

[0209] In the moving step S100, the loading device 10 holding the electronic components may be moved to the receiving portion 21a of the test tray 20 where no electronic components are placed. In this case, the electronic components may be located on the upper side of the receiving portion 21a. In addition, in the moving step S110, the unloading device 40 may be moved to the receiving portion 21a to hold the electronic components placed on the tray supporting portion 23 of the test tray 20 where the test has been completed.

[0210] Reference Fig. 22In the ascending step S200, the open unit 300 may be ascended to approach the test tray 20. In addition, in the ascending step S200, the open unit body 310 may be elevated so that the buffer support part 322 is in close contact with the bottom surface of the tray support part 23. On the other hand, when the ascending step S200 is performed while the electronic component is supported by the tray support part 23, the electronic component is not supported by the tray support part 23, but is ascended while being supported by the buffer support part 322.

[0211] In the opening step S300, the holding unit 22 may be opened so that the electronic component may be placed on the tray supporting member 23. That is, the holding unit 22 may be in a released state. For example, in the opening step S300, the opening protrusion 312 may pressurize the holder 22a so that the holder 22a rotates.

[0212] In the gripping release step S400 , the loading device 10 may release the grip of the electronic component so that the electronic component falls toward the storage portion 21 a. When the electronic component is not supported by the tray supporting member 23 , the gripping release step S400 may be performed.

[0213] In the holding step S500, the unloading device 40 may hold the electronic components supported by the tray supporting member 23. When the electronic components are supported by the tray supporting member 23, such a holding step S500 may be performed.

[0214] Reference Fig.23 , in the shock absorbing step S500, when the electronic component falls toward the tray supporting member 23, the shock applied to the electronic component can be absorbed. In addition, in the shock absorbing step S500, when a predetermined pressure is applied to the electronic component supported by the tray supporting member 23, the shock applied to the electronic component can be absorbed. For example, in the shock absorbing step S500, the buffer supporting member 322 supports the terminal of the electronic component exposed through the open hole 23a formed in the tray supporting member 23, so that the shock applied to the electronic component can be absorbed. .

[0215] Reference Fig.24 and Fig.25 In the lowering step S600, the open unit body 310 may be lowered so that the buffer support member 322 is spaced apart from the bottom surface of the tray support member 23. In addition, if the lowering step S600 is performed after the grip release step S400, when the open unit body 310 is lowered, at least a portion of the plurality of terminals of the electronic component may be inserted into the open hole 23a.

[0216] As described above, the embodiments of the present invention have been described as specific embodiments, but these are only examples, the present invention is not limited thereto, and should be interpreted as having the widest scope based on the basic ideas disclosed in this specification. Those skilled in the art can combine / replace the disclosed embodiments to implement patterns of shapes not shown, but this does not depart from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on this specification, and it is clear that such changes or modifications also belong to the scope of the present invention.

Claims

1. A test processor, characterized in that: include: Main body; a bag-shaped frame, detachably coupled to the main body, wherein a bag-shaped space capable of placing electronic components is formed in the bag-shaped frame; and a supporting component sandwiched between the bag-shaped frame and the main body, wherein the electronic component can be placed in the supporting component, A first open hole and a plurality of second open holes are formed in the support component. When the electronic component is placed on the support component, a portion of the terminals of the electronic component can pass through the first open hole, another portion of the terminals of the electronic component can pass through the plurality of second open holes, and the plurality of second open holes can be formed along the periphery of the first open hole.

2. The test processor according to claim 1, wherein: In the main body, a protrusion for supporting the supporting member is formed protruding from one side of the main body. A pocket-shaped groove portion into which the supporting member can be inserted is formed in the pocket-shaped frame. When the bag-shaped frame is combined with the main body, the support member and at least a portion of the protruding portion are inserted into the bag-shaped groove portion, so that the support member is fixedly supported on the bag-shaped frame.

3. The test processor according to claim 1, wherein: A first fixing element is provided in the bag-like frame, In the main body, a second fixing element is formed for engaging with the first fixing element. A support fixing hole is formed in the support component, and the support fixing hole is arranged at a position corresponding to the second fixing element and is used to engage with any one of the first fixing element and the second fixing element. Any one of the first fixing element and the second fixing element is engaged with the other one of the first fixing element and the second fixing element in the support fixing hole to fix the support component to the main body.

4. A test processor, characterized in that: include: A test tray, the test tray comprising a tray frame and a holding unit, the tray frame being formed with a receiving portion capable of accommodating electronic components, the holding unit being capable of supporting the electronic components in the receiving portion so that the electronic components will not fall out of the receiving portion; and an opening unit capable of applying pressure to the holding unit so that the electronic component can be released from the housing portion, The open unit comprises: opening the unit body so as to pressurize the holding unit by approaching the test tray; and a buffer support member supported by the open unit body, at least a portion of which can be disposed inside the receiving portion when the open unit body pressurizes the holding unit; The buffer support member disposed inside the housing portion is formed of an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the buffer support member, so that the electronic component is placed on the buffer support member. A tray support portion is provided in the tray frame, and when the open unit is spaced apart from the holding unit, the tray support portion can support the electronic component arranged in the storage portion, When the buffer support member is disposed inside the storage portion, an upper surface of the buffer support member is located above an upper end of the tray support portion.

5. A test processor, characterized in that: include: A test tray, the test tray comprising a tray frame and a holding unit, the tray frame being formed with a receiving portion capable of accommodating electronic components, the holding unit being capable of supporting the electronic components in the receiving portion so that the electronic components will not fall out of the receiving portion; and an opening unit capable of applying pressure to the holding unit so that the electronic component can be released from the housing portion, The open unit comprises: opening the unit body so as to pressurize the holding unit by approaching the test tray; and a buffer support member supported by the open unit body, at least a portion of which can be disposed inside the receiving portion when the open unit body pressurizes the holding unit; The buffer support member disposed inside the housing portion is formed of an elastic material to absorb impact applied to the electronic component when a predetermined pressure is applied to the electronic component placed on the buffer support member. A tray support portion is provided in the tray frame, and when the open unit is spaced apart from the holding unit, the tray support portion can support the electronic component arranged in the storage portion, When the buffer support member is disposed inside the storage portion, an upper surface of the buffer support member is located above an upper end of the tray support portion.

6. A test processor, characterized in that include: A test tray, the test tray comprising a tray frame, a tray support component and a holding unit, the tray frame being formed with a receiving portion capable of arranging electronic components, the tray support component being used to support between a plurality of terminals of the electronic components arranged in the receiving portion, the holding unit being capable of supporting the electronic components on the tray support component so that the electronic components will not fall out of the receiving portion; and an opening unit capable of applying pressure to the holding unit so that the electronic component can be released from the housing portion, The open unit comprises: opening the unit body so as to pressurize the holding unit by approaching the test tray; and a buffer support member, supported by the open cell body and formed of an elastic material, The tray support member has an open hole formed therein, and when the electronic component is placed in the tray support member, at least a portion of the terminals of the electronic component can pass through the open hole.

7. The test processor of claim 6, wherein: When the electronic component falls toward the tray supporting component or a predetermined pressure is applied to the electronic component placed on the tray supporting component, the buffer supporting component is in close contact with the bottom surface of the tray supporting component to absorb the impact applied to the tray supporting component and the electronic component and support the electronic component exposed through the open hole.

8. A test processor control method, characterized in that: include: a moving step, wherein the loading device moves to above the receiving portion of the tray frame while holding the electronic component; A raising step of raising the open unit body so that the buffer support member supported by the open unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; a gripping and releasing step, wherein the loading device releases the grip on the electronic component so that the electronic component falls toward the receiving portion; a shock absorbing step of supporting the electronic component exposed through the open hole formed in the tray supporting member by the buffer supporting member so as to absorb shock applied to the electronic component when the electronic component falls toward the tray supporting member; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, In the descending step, When the open cell body descends, at least a portion of the plurality of terminals of the electronic component are inserted into the open hole.

9. A test processor control method, characterized in that: include: A moving step, in which the unloading device moves to above the receiving portion in order to hold the electronic components in the receiving portion of the tray frame; A raising step of raising the open unit body so that the buffer support member supported by the open unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; a holding step, wherein the unloading device holds the electronic component supported by the tray supporting member; a shock absorbing step of supporting the electronic component exposed through the open hole formed in the tray supporting member, thereby absorbing a shock applied to the electronic component when a predetermined pressure is applied to the electronic component in the holding step; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, In the ascending step, When the open cell body rises, at least a portion of the terminals of the electronic component rises while being inserted into the open hole.

10. The test processor control method according to claim 9, characterized in that: The electronic component is further included in the step of opening the holding unit so that the electronic component is supported by the tray supporting member or the electronic component is separated from the tray supporting member. In the ascending step, The opening cell body is raised to a predetermined position so that the opening cell body pressurizes the holding unit.

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