Infrared module, electronic equipment and bottom noise value determination method

Abstract

The invention discloses an infrared module, electronic equipment and a method for determining a bottom noise value, and belongs to the technical field of electronics. The infrared module comprises an infrared sensor and an infrared light isolation part, the infrared sensor is electrically connected with the infrared light isolation component; wherein the infrared light isolation part is a deformable conductive part, the resistance value of the infrared light isolation part changes along with the change of the deformation quantity of the infrared light isolation part, and the bottom noise value of the infrared sensor changes along with the change of the deformation quantity of the infrared light isolation part; the bottom noise value of the infrared sensor is associated with the resistance value of the infrared light isolation component.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to an infrared module, an electronic device, and a method for determining a background noise value. Background Art

[0002] As an important sensing device, infrared sensors can detect and measure objects by detecting infrared radiation. They are widely used in daily life, such as smart home systems and the anti-mistouch function in mobile phones. In the process of detecting and measuring objects, infrared light isolation components are usually used to reduce infrared light crosstalk.

[0003] However, infrared light isolation components usually cannot completely avoid infrared light crosstalk, which means that infrared sensors still have a certain noise floor value. The noise floor value of infrared sensors is not fixed and will change with temperature.

[0004] In order to obtain the noise floor value of the infrared sensor, the relevant technology usually establishes a functional relationship between the ambient temperature of the motherboard and the noise floor value, detects the ambient temperature of the motherboard through a temperature sensor, and uses the ambient temperature of the motherboard to replace the temperature of the infrared sensor to determine the noise floor value of the infrared sensor. However, there are usually multiple heat sources on the motherboard, and the conduction of temperature takes time. The ambient temperature of the motherboard cannot fully reflect the temperature of the infrared sensor. The temperature of the infrared sensor obtained in this way is inaccurate, resulting in poor accuracy of the noise floor value of the infrared sensor. Summary of the invention

[0005] The embodiments of the present application provide an infrared module, an electronic device, and a method for determining a background noise value, which can solve the problem of poor accuracy of the background noise value of the infrared sensor obtained in the related art.

[0006] In a first aspect, an embodiment of the present application provides an infrared module, which includes an infrared sensor and an infrared light isolation component; the infrared sensor is electrically connected to the infrared light isolation component; Among them, the infrared light isolation component is a deformable conductive component, and the resistance value of the infrared light isolation component changes with the change of the deformation amount of the infrared light isolation component, and the background noise value of the infrared sensor changes with the change of the deformation amount of the infrared light isolation component; the background noise value of the infrared sensor is associated with the resistance value of the infrared light isolation component.

[0007] In a second aspect, an embodiment of the present application provides an electronic device, which includes a screen and the infrared module described in the first aspect, and the infrared light isolation component is arranged between the screen and the infrared sensor.

[0008] In a third aspect, an embodiment of the present application provides a method for determining a background noise value, which is applied to the infrared module described in the first aspect, and the method includes: Acquiring a current value of a target parameter of the infrared light isolation component; Based on a pre-established correspondence between the target parameter and the noise floor value of the infrared sensor, obtaining the noise floor value of the current infrared sensor corresponding to the current value; Wherein, the target parameter includes any one of voltage, current and resistance.

[0009] In a fourth aspect, an embodiment of the present application provides a method for determining a background noise value, which is applied to the infrared module described in the first aspect, and the method includes: Providing a constant voltage to the infrared light isolation component and the infrared light emitting element connected in series, so that the noise floor value of the infrared sensor remains stable; Under the action of the constant voltage, the infrared light emitting element is driven to emit infrared light, and the infrared light is not reflected by the target shielding object during the transmission process; receiving target infrared light through the infrared light receiving element in the infrared sensor, wherein the target infrared light comes from the infrared light emitted by the infrared light emitting element; A noise floor value is determined based on the target infrared light.

[0010] At least one of the above technical solutions provided in the embodiments of the present application can achieve the following technical effects: The embodiment of the present application provides an infrared module, including an infrared sensor and an infrared light isolation component; the infrared sensor is electrically connected to the infrared light isolation component; wherein the infrared light isolation component is a deformable conductive component, and the resistance value of the infrared light isolation component changes with the change of the deformation amount of the infrared light isolation component, and the noise floor value of the infrared sensor changes with the change of the deformation amount of the infrared light isolation component; the noise floor value of the infrared sensor is associated with the resistance value of the infrared light isolation component. In this way, by using a conductive infrared light isolation component, the infrared light isolation component is electrically connected to the infrared sensor, and the noise floor value of the infrared sensor can be associated with the resistance value of the infrared light isolation component. In this way, the noise floor value of the infrared sensor can be obtained based on the change of the resistance value of the infrared light isolation component. Compared with the method of observing the ambient temperature of the mainboard in the related art, this method of obtaining the noise floor value of the infrared sensor does not need to consider the factors such as the inaccurate temperature obtained and the time required for the conduction of the temperature, and the obtained noise floor value of the infrared sensor is more accurate, which solves the problem of poor accuracy of the noise floor value of the infrared sensor obtained in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 is a schematic diagram of a working principle of realizing obstruction detection by using an infrared sensor provided in an embodiment of the present application; Figure 2-1 It is a schematic diagram of the correlation between the background noise value of an infrared sensor and the ambient temperature of the infrared sensor provided in an embodiment of the present application; Figure 2-2 It is a schematic diagram of a temperature drift phenomenon of infrared background noise provided by an embodiment of the present application; Figure 3 It is a schematic diagram of a mainboard layout of an electronic device provided in an embodiment of the present application; Figure 4 This is a flow chart of an infrared module provided in an embodiment of the present application; Figure 5 It is a schematic diagram of the change in resistance value of a conductive foam provided in an embodiment of the present application; Figure 6 is a schematic diagram of another infrared module provided in an embodiment of the present application; Figure 7 is a schematic diagram of another infrared module provided in an embodiment of the present application; Figure 8-1 is a schematic diagram of a welding point provided in an embodiment of the present application; Figure 8-2 is a schematic diagram of a stacked structure of an infrared light isolation component and an infrared sensor provided in an embodiment of the present application; Fig. 9 is a schematic diagram of another infrared module provided in an embodiment of the present application; Fig.10 is a schematic diagram of a specific example of an infrared module provided in an embodiment of the present application; Fig.11 is a schematic diagram of another specific example of an infrared module provided in an embodiment of the present application; Fig.12 is a schematic diagram of another infrared module provided in an embodiment of the present application; Fig.13 is a schematic diagram of another specific example of an infrared module provided in an embodiment of the present application; Fig.14 is a flow chart of a method for determining a background noise value provided in an embodiment of the present application; Fig.15 It is a schematic diagram of a linear relationship between a voltage value of an infrared light isolation component and a background noise value of an infrared sensor provided in an embodiment of the present application; Fig.16 is a flow chart of another method for determining a background noise value provided in an embodiment of the present application; Fig.17 It is a conceptual schematic diagram of a method for maintaining a stable background noise value of an infrared sensor provided in an embodiment of the present application; Fig.18 It is a structural block diagram of an electronic device provided in an embodiment of the present application.

[0013] Description of reference numerals: Infrared module-100; infrared sensor-200; analog-to-digital converter (ADC)-210; fixed resistor-220; processing element-230; infrared light receiving element-240; infrared light emitting element-250; infrared light isolation component-300; conductive connection component-400; welding point-410; detection module-500; power supply end 600. DETAILED DESCRIPTION

[0014] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0015] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0016] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0017] At present, infrared sensors in electronic devices such as mobile phones are usually used to detect obstructions, thereby realizing functions such as "on / off screen during call" and "anti-accidental touch mode". Figure 1 , Figure 1 FIG. 1 is a schematic diagram of a working principle of realizing obstruction detection by an infrared sensor provided in an embodiment of the present application. Figure 1 As shown, the infrared sensor may include an infrared light emitting element and an infrared light receiving element, and the infrared light receiving element is used to receive the infrared light emitted by the infrared light emitting element. The infrared sensor is connected to the screen of the electronic device through an infrared light isolation component, such as a partition foam, and the infrared light isolation component can be used to block the infrared light emitted by the infrared light emitting element from being reflected by the screen. In this case, theoretically speaking, the infrared light received by the infrared light receiving element is the infrared light emitted by the infrared light emitting element and reflected to the infrared light receiving element by an obstruction. The intensity of the infrared light received by the infrared receiving element can be used to determine whether there is an obstruction outside the screen.

[0018] However, since light leakage from structural gaps, reflection from the screen cover, and reflection from the copper foil of the raised board / mainboard cannot be completely avoided, infrared light crosstalk usually exists between the infrared sensor and the screen structure, so that when there is no obstruction outside the screen, the infrared light receiving element of the infrared sensor can still detect a certain infrared light intensity, which is not the infrared light emitted by the infrared light emitting element and reflected by the obstruction. This infrared light intensity can be used as the background noise value of the infrared sensor. In the process of detecting obstructions, the difference between the infrared light intensity received by the infrared light receiving element and the background noise value of the infrared sensor can be determined as the infrared light intensity of the infrared light emitted by the infrared light emitting element and reflected by the obstruction to the infrared light receiving element.

[0019] The noise floor value of the infrared sensor will change with the change of the deformation of the infrared light isolation component, and the deformation of the infrared light isolation component will change with the change of the ambient temperature of the infrared sensor. Therefore, the noise floor value of the infrared sensor will change with the change of the ambient temperature of the infrared sensor, which can be called the infrared noise floor temperature drift phenomenon. See Figure 2-1 and Figure 2-2 , Figure 2-1 is a schematic diagram of the correlation between the background noise value of an infrared sensor and the ambient temperature of the infrared sensor provided in an embodiment of the present application, Figure 2-2 It is a schematic diagram of an infrared background noise temperature drift phenomenon provided in an embodiment of the present application.

[0020] like Figure 2-1As shown in the figure, taking the partition foam as an example, there is a negative correlation between the noise floor value of the infrared sensor and the ambient temperature of the infrared sensor. When the ambient temperature of the infrared sensor increases, the noise floor value of the infrared sensor decreases. When the ambient temperature of the infrared sensor decreases, the noise floor value of the infrared sensor increases. Figure 2-2 As shown in the figure, the main reasons for this infrared noise temperature drift phenomenon are as follows: when the ambient temperature of the infrared sensor rises, the partition foam softens due to heat, and the compression deformation of the partition foam increases, resulting in a smaller gap between the screen and the infrared sensor, and the infrared light crosstalk will also decrease, thereby reducing the noise floor value of the infrared sensor. When the ambient temperature of the infrared sensor decreases, the above process is reversible, that is, the stretching of the partition foam increases, resulting in a larger gap between the screen and the infrared sensor, and the infrared light crosstalk will also increase, thereby increasing the noise floor value of the infrared sensor.

[0021] In order to deal with the above-mentioned infrared noise floor temperature drift phenomenon, the relevant technology usually establishes a functional relationship between the ambient temperature of the mainboard and the noise floor value of the infrared sensor, obtains the ambient temperature of the mainboard through a temperature sensor, and then determines the noise floor value of the infrared sensor through the functional relationship between the ambient temperature of the mainboard and the noise floor value of the infrared sensor.

[0022] However, the methods used in the related art still have the following problems: First, the positions of the temperature sensor and the infrared sensor on the mainboard are not necessarily together, and the ambient temperature of the mainboard cannot fully reflect the temperature at the infrared sensor position. Therefore, the ambient temperature of the mainboard cannot be equivalent to the real-time temperature of the infrared sensor. In addition, the source of the temperature change at the infrared sensor position is not completely consistent with the source of the temperature change on the mainboard. The noise floor value of the infrared sensor determined by using the mainboard temperature as a variable to establish a function with the noise floor value of the infrared sensor has a large error. Second, the positions of the infrared sensors and temperature sensors on different electronic devices are not fixed, which also leads to different electronic devices using this method to obtain different results. Third, see Figure 3 , Figure 3 Schematic diagram of the mainboard layout of an electronic device provided in an embodiment of the present application. Figure 3 As shown in the figure, there are many heat sources on the motherboard of electronic equipment that cause the motherboard temperature to change, such as chips and operational amplifiers on the motherboard, which will cause the motherboard temperature to change rapidly. However, the conduction of temperature takes time, and the infrared sensor is usually connected to the motherboard through a pad, which also causes a large hysteresis in the transmission of the motherboard temperature to the infrared sensor and the location of the partition foam. In this case, using the motherboard temperature to determine the background noise value of the infrared sensor has a large hysteresis, resulting in an inaccurate background noise value of the infrared sensor.

[0023] Based on this, an embodiment of the present application provides an infrared module, which includes an infrared sensor and an infrared light isolation component. By using a conductive and deformable infrared light isolation component, the infrared light isolation component is electrically connected to the infrared sensor, and the noise floor value of the infrared sensor can be associated with the resistance value of the infrared light isolation component. In this way, the noise floor value of the infrared sensor can be obtained based on the change in the resistance value of the infrared light isolation component. Compared with the solution of observing the temperature of the mainboard, there is no need to consider factors such as the inaccuracy of the obtained temperature and the time required for the conduction of the temperature, and the determined noise floor value of the infrared sensor is more accurate. In addition, since the position between the infrared sensor and the infrared light isolation component on different electronic devices is relatively fixed, the effect obtained by using the structure of this infrared module on different electronic devices is consistent.

[0024] The infrared module provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0025] See also Figure 4 , Figure 4 This is a flow chart of an infrared module provided in an embodiment of the present application. Figure 4 As shown, the infrared module 100 comprises an infrared sensor 200 and an infrared light isolation component 300, and the infrared sensor 200 is electrically connected to the infrared light isolation component 300. The infrared light isolation component 300 is a deformable conductive component, and the resistance value of the infrared light isolation component (300) changes with the change of the deformation amount of the infrared light isolation component (300), and the background noise value of the infrared sensor (200) changes with the change of the deformation amount of the infrared light isolation component (300); the background noise value of the infrared sensor (200) is associated with the resistance value of the infrared light isolation component (300).

[0026] In the embodiment of the present application, the infrared light isolation component may be a component with a certain deformation ability, capable of isolating infrared light and being conductive, such as conductive foam or conductive sponge, etc. The material of the infrared light isolation component may be a composite of a conductive material and a loose porous material, wherein the conductive material includes but is not limited to materials such as graphene and carbon, and the loose porous material includes but is not limited to materials such as sponge and silica gel.

[0027] The infrared light isolation component may have a certain initial resistance value, and when the infrared light isolation component generates a deformation amount, the resistance value of the infrared light isolation component will also change accordingly. Specifically, the deformation amount of the infrared light isolation component includes a compression deformation amount and a tensile deformation amount; the background noise value of the infrared sensor is negatively correlated with the compression deformation amount of the infrared light isolation component, and the background noise value of the infrared sensor is positively correlated with the tensile deformation amount of the infrared light isolation component; the resistance value of the infrared light isolation component is negatively correlated with the compression deformation amount of the infrared light isolation component, and the resistance value of the infrared light isolation component is positively correlated with the tensile deformation amount of the infrared light isolation component.

[0028] When the amount of compression deformation of the infrared light isolation component increases, the infrared light crosstalk will decrease, and the noise floor value of the infrared sensor will decrease accordingly; when the amount of stretching of the infrared light isolation component increases, the infrared light crosstalk will increase, and the noise floor value of the infrared sensor will increase accordingly. In addition, when the amount of compression deformation of the infrared light isolation component increases, the volume of the infrared light isolation component will decrease, and the resistance value of the infrared light isolation component will decrease; when the amount of stretching deformation of the infrared light isolation component increases, the volume of the infrared light isolation component will increase, and the resistance value of the infrared light isolation component will increase. In other words, the resistance value of the infrared light isolation component is positively correlated with the volume of the infrared light isolation component.

[0029] See also Figure 5 , Figure 5 Schematic diagram of the change in resistance value of a conductive foam provided in an embodiment of the present application. Taking the conductive foam as an example, Figure 5 As shown, there are many pores inside the conductive foam. After the conductive foam is compressed, the pores inside the conductive foam may become smaller or even closed, which increases the conductive path inside the conductive foam, thereby reducing the resistance value of the conductive foam. Correspondingly, after the conductive foam is stretched, the pores inside the conductive foam may become larger and increase in number, which reduces the conductive path inside the conductive foam, thereby increasing the resistance value of the conductive foam.

[0030] Among them, the factors that cause the infrared light isolation component to produce a deformation amount may include external force and temperature change. For example, when the infrared light isolation component is subjected to external force, the infrared light isolation component may produce a certain amount of compression deformation. When the ambient temperature of the infrared light isolation component increases, the infrared light isolation component may soften due to heat and produce a certain amount of compression deformation. On the contrary, when the ambient temperature of the infrared light isolation component decreases, the infrared light isolation component may produce a certain amount of stretching.

[0031] In the embodiment of the present application, there are many factors that cause the noise floor value of the infrared sensor to change, such as the deformation of the infrared light isolation component and the configuration of the infrared sensor. The configuration of the infrared sensor may include the driving current of the infrared light emitting diode (LED) set inside the infrared sensor, the pulse width and the number of pulses emitted by the infrared LED, etc. Among them, the configuration of the infrared sensor can be fixed, and the deformation of the infrared light isolation component will change due to environmental factors. Therefore, when other factors remain unchanged, it can be considered that the deformation of the infrared light isolation component is the direct cause of the change in the noise floor value of the infrared sensor. In addition, the deformation of the infrared light isolation component is also the direct cause of the change in the resistance value of the infrared light isolation component. Therefore, the resistance value of the infrared light isolation component can be associated with the noise floor value of the infrared sensor, and the noise floor value of the infrared sensor can be obtained based on the information related to the resistance value of the infrared light isolation component.

[0032] In order to observe the information related to the resistance value of the infrared light isolation component, the infrared light isolation component can be connected to the internal circuit of the infrared sensor. Figure 4 As shown, the infrared sensor 200 can be electrically connected to the infrared light isolation component 300. The infrared sensor and the infrared light isolation component can be connected via a cable, and the infrared light isolation component can also be welded to the infrared sensor.

[0033] In one embodiment of the present application, the background noise value of the infrared sensor is positively correlated with the resistance value of the infrared light isolation component.

[0034] In the embodiment of the present application, when the resistance value of the infrared light isolation component decreases, it means that the compression deformation of the infrared light isolation component increases. When the compression deformation of the infrared light isolation component increases, the noise floor value of the infrared sensor also decreases. In other words, the noise floor value of the infrared sensor is positively correlated with the resistance value of the infrared light isolation component. That is, when the resistance value of the infrared light isolation component decreases, the noise floor value of the infrared sensor also decreases.

[0035] The embodiment of the present application provides an infrared module, including an infrared sensor and an infrared light isolation component; the infrared sensor is electrically connected to the infrared light isolation component; wherein the infrared light isolation component is a deformable conductive component, and the resistance value of the infrared light isolation component changes with the change of the deformation amount of the infrared light isolation component, and the noise floor value of the infrared sensor changes with the change of the deformation amount of the infrared light isolation component; the noise floor value of the infrared sensor is associated with the resistance value of the infrared light isolation component. In this way, by using a conductive infrared light isolation component, the infrared light isolation component is electrically connected to the infrared sensor, and the noise floor value of the infrared sensor can be associated with the resistance value of the infrared light isolation component. In this way, the noise floor value of the infrared sensor can be obtained based on the change of the resistance value of the infrared light isolation component. Compared with the method of observing the ambient temperature of the mainboard in the related art, this method of obtaining the noise floor value of the infrared sensor does not need to consider the factors such as the inaccurate temperature obtained and the time required for the conduction of the temperature, and the obtained noise floor value of the infrared sensor is more accurate, which solves the problem of poor accuracy of the noise floor value of the infrared sensor obtained in the related art.

[0036] exist Figure 1 On the basis of the infrared module shown, the infrared light isolation component may also be in contact with the infrared sensor, and the deformation amount of the infrared light isolation component changes with the temperature of the infrared sensor. Figure 6 , Figure 6 is a schematic diagram of another infrared module provided in an embodiment of the present application. Figure 6 As shown, the infrared light isolating component 300 is in contact with the infrared sensor 200. In addition, the deformation amount of the infrared light isolating component 300 changes with the temperature of the infrared sensor.

[0037] In the embodiments of the present application, Figure 6 As shown, the infrared light isolation component 300 may be in contact with the infrared sensor 200, that is, the infrared light isolation component 300 may be arranged on the contact surface of the infrared sensor 200. In this case, the infrared light isolation component 300 is easily affected by the temperature of the infrared sensor 200 to produce a deformation amount, and the deformation amount of the infrared light isolation component 300 will change with the change of the temperature of the infrared sensor 200.

[0038] exist Figure 1 Based on the infrared module shown in FIG. , the infrared module may further include a conductive connecting component. Figure 7 , Figure 7 is a schematic diagram of another infrared module provided in an embodiment of the present application. Figure 7As shown, the infrared light isolation component 300 is electrically connected to the infrared sensor 200 through the conductive connection component 400 .

[0039] In the embodiment of the present application, the conductive connection component may be a connection component for conductively connecting (e.g., welding) the infrared light isolation component to the infrared sensor, and the conductive connection component may be, for example, a soldering pad. In order to connect the infrared light isolation component to the internal circuit of the infrared sensor, a soldering point connected to the infrared light isolation component may be determined on the contact surface of the infrared sensor, and the infrared light isolation component may be soldered to the soldering point through the soldering pad.

[0040] Please refer to Figure 8-1 and Figure 8-2 , Figure 8-1 is a schematic diagram of a welding point provided in an embodiment of the present application, Figure 8-2 Schematic diagram of a stacked structure of an infrared light isolation component and an infrared sensor provided in an embodiment of the present application. Figure 8-1 As shown, the packaging surface of the infrared sensor may leave a space as shown in FIG. Figure 8-1 The two welding points indicated by 410 are used to connect the internal circuit of the infrared sensor and the infrared light isolation component outside the infrared sensor. In this way, since the resistance value of the infrared light isolation component can change with the change of the deformation amount of the infrared light isolation component, the infrared light isolation component can be connected to the internal circuit of the infrared sensor as a variable resistor. In other words, the infrared light isolation component can be regarded as a part of the infrared sensor. In the process of connecting the infrared sensor with the infrared light isolation component, the infrared light isolation component can contact the surface of the infrared sensor through the conductive connecting component, such as Figure 8-2 shown. But Figure 8-2 For example only, the infrared light isolation component may not be in contact with the surface of the infrared sensor.

[0041] Based on the infrared module provided in the above embodiment, the infrared sensor may include a detection module. The detection module includes at least one of a voltage detection module for the infrared light isolation component, a current detection module for the infrared light isolation component, and a resistance detection module for the infrared light isolation component. Fig. 9 , Fig. 9 is a schematic diagram of another infrared module provided in an embodiment of the present application. Fig. 9 As shown, the infrared sensor 200 includes a detection module 500, and the detection module 500 can also be connected to the infrared light isolation component 300, and the infrared light isolation component can also be connected to the power supply terminal 600. It should be noted that, Fig. 9The detection module 500 is actually inside the infrared sensor 200. Fig. 9 It is only for showing the connection relationship between the detection module 500 and the infrared light isolation component.

[0042] In an embodiment of the present application, in order to observe the resistance value of the infrared light isolation component, the infrared light isolation component can be connected to a detection module, and the detection module may include at least one of a voltage detection module for detecting the voltage across the infrared light isolation component, a current detection module for detecting the current passing through the infrared light isolation component, and a resistance detection module for detecting the resistance value of the infrared light isolation component.

[0043] Since the voltage across the infrared light isolation component and the current passing through the infrared light isolation component will change when the resistance value of the infrared light isolation component changes, the resistance value change of the infrared light isolation component can be observed not only through the resistance detection module, but also through the current module and the voltage detection module.

[0044] In addition, the power supply terminal may be the power supply terminal that originally supplies power to the infrared sensor. The infrared light isolation component may be connected to the power supply terminal, and the power supply terminal may be reused to supply power to the infrared light isolation component, so that the power supply terminal supplies power to the infrared sensor and the infrared light isolation component. In this way, the infrared sensor and the infrared light isolation component may share the same power supply terminal.

[0045] exist Fig. 9 On the basis of the infrared module shown, the detection module includes a voltage detection module, the infrared sensor may include an analog-to-digital converter (ADC), a processing element, an infrared light receiving element and an infrared light emitting element, and the voltage detection module includes an ADC arranged in the infrared sensor, and the ADC arranged in the infrared sensor is connected in parallel with the infrared light isolation component.

[0046] In the embodiment of the present application, the internal circuit of the infrared sensor includes an ADC. Since the ADC has a voltage detection function, the ADC in the infrared sensor can be reused as a voltage detection module. The infrared light isolation component is connected in parallel with the ADC in the infrared sensor, and the ADC in the infrared sensor can be used to detect the voltage across the infrared light isolation component without adding an additional voltage detection module.

[0047] In order to more specifically show the internal structure of the infrared sensor, please refer to Fig.10 , Fig.10is a schematic diagram of a specific example of an infrared module provided in an embodiment of the present application. Fig.10 As shown, the infrared light isolation component 300 can be connected in series with a fixed resistor 220 with a fixed resistance value inside the infrared sensor, and the infrared light isolation component 300 and the infrared sensor 200 share a power supply terminal 600 (VDD) and a ground terminal (GND). The ADC 210 set in the infrared sensor 200 is connected in parallel with the infrared light isolation component 300, and the ADC 210 is connected to the processing element 230 set in the infrared sensor 200. The ADC 210 can also be connected to the infrared light receiving element 240 set in the infrared sensor 200. The infrared light receiving element 240 is grounded, and the processing element can also be coupled to the infrared light emitting element 250 set in the infrared sensor 200. Among them, the fixed resistor with a fixed resistance value is used for voltage division. At the same time, the ADC inside the infrared sensor is reused to detect the change of the voltage value at both ends of the infrared light isolation component, and finally the data is transmitted to the CPU outside the infrared sensor for recording and collection through the integrated circuit (Inter-Integrated Circuit, I2C) bus of the infrared sensor. Among them, the I2C bus consists of a data line (Serial Data, SDA) and a clock signal line (Serial Clock, SCL), which can be used to send and receive data.

[0048] like Fig.10 As shown, the infrared light emitting element 250 of the infrared sensor includes an infrared LED, and the infrared light receiving element 240 of the infrared sensor includes a photodiode (PD). The infrared sensor also includes an LED driver, an anode of the embedded IR Light-Emitting Diode (LEDA), and an oscillator (OSC). The LED driver is used to configure the driving current of the infrared LED, the LEDA is used to provide voltage to the infrared LED, and the OSC is a clock module in the infrared sensor.

[0049] exist Fig. 9 Based on the infrared module shown, the detection module may include a current detection module, which is connected in series with the infrared light isolation component. The current detection module includes an ADC in the infrared sensor and a fixed resistor in the infrared sensor, and the ADC and the fixed resistor are connected in parallel.

[0050] In an embodiment of the present application, in order to detect the current passing through the infrared light isolation component, the infrared light isolation component can be connected in series with a fixed resistor in an infrared sensor, and the current detected passing through the infrared light isolation component is converted into the current detected passing through the fixed resistor. The ADC in the infrared sensor is connected in parallel with the fixed resistor, and the ADC can be used to detect the voltage across the fixed resistor. Since the resistance value of the fixed resistor is fixed, the resistance value of the fixed resistor can be obtained, and the current passing through the fixed resistor can be determined based on the resistance value of the fixed resistor and the voltage across the fixed resistor. Specifically, the quotient of the voltage across the fixed resistor and the resistance value of the fixed resistor can be determined as the current passing through the fixed resistor.

[0051] In order to more specifically show the internal structure of the infrared sensor, please refer to Fig.11 , Fig.11 is a schematic diagram of another specific example of an infrared module provided in an embodiment of the present application. Fig.11 As shown, the current detection module includes an ADC 210 and a fixed resistor 220, and the fixed resistor 220 is connected in series with the infrared light isolation component 300. The infrared sensor may also include a processing element 230, an infrared light receiving element 240, and an infrared light emitting element 250, and the infrared light isolation component 300 and the infrared sensor may share a power supply terminal (VDD) 600. Fig.10 and Fig.11 The descriptions of the same components in the figure can be referenced to each other and will not be repeated here.

[0052] In one embodiment of the present application, the ADC may also be connected to a processing element and an infrared light receiving element respectively disposed in the infrared sensor, the infrared light receiving element may be grounded, and the processing element may be coupled to the infrared light emitting element.

[0053] The infrared light emitting element may include an infrared LED for emitting infrared light. The infrared light receiving element may include a PD for receiving the infrared light emitted by the infrared light emitting element. The processing element is used to obtain the intensity of the infrared light received by the infrared light receiving element, and may communicate with an element outside the infrared sensor (such as an external CPU). For a detailed schematic diagram of the infrared sensor, see Fig.10 and Fig.11 .

[0054] See also Fig.12 , Fig.12 is a schematic diagram of another infrared module provided in an embodiment of the present application. Fig.12As shown, the infrared light isolation component 300 can also be connected in series with the infrared light emitting element 250. The sum of the voltage across the infrared light isolation component 300 and the voltage across the infrared light emitting element 250 is a fixed value.

[0055] In the embodiment of the present application, the infrared light emitting element may include an infrared LED. When the resistance value of the infrared light isolation component changes, since the infrared light isolation component is connected in series with the infrared light emitting element, the current passing through the infrared light isolation component and the series path of the infrared light emitting element will also change. The noise floor value of the infrared sensor is associated with the current passing through the infrared light emitting element, and the noise floor value of the infrared sensor is positively correlated with the current passing through the infrared light emitting element. In other words, when the current passing through the infrared light emitting element increases, the noise floor value of the infrared sensor will also increase.

[0056] Based on this, when the resistance value of the infrared light isolation component decreases, the noise floor value of the infrared sensor will decrease as the resistance value of the infrared light isolation component decreases. At the same time, the current passing through the infrared light emitting element will increase as the resistance value of the infrared light isolation component decreases. When the current passing through the infrared light emitting element increases, the noise floor value of the infrared sensor will increase as the current passing through the infrared light emitting element increases. In this way, the noise floor value of the infrared sensor can maintain a stable state, and the stable noise floor value of the infrared sensor can be used directly without further determining the noise floor value of the infrared sensor.

[0057] In order to more specifically show the internal structure of the infrared sensor, please refer to Fig.13 , Fig.13 is a schematic diagram of another specific example of an infrared module provided in an embodiment of the present application. Fig.13 As shown, the infrared light emitting element 250 of the infrared sensor includes an infrared LED, and the infrared sensor also includes LEDA. The infrared LED is connected in series with the infrared light isolation element 300, and LEDA is used to provide a fixed voltage to the infrared LED and the infrared light isolation element. In other words, LEDA keeps the sum of the voltage across the infrared LED and the voltage across the infrared light isolation element 300 unchanged. In addition, the infrared sensor also includes an ADC 210, a processing element 230, and an infrared light receiving element 240. The infrared light isolation component and the infrared sensor share a power supply terminal 600 and a ground terminal (GND). Fig.10 and Fig.13 The descriptions of the same components in the figure can be referenced to each other and will not be repeated here.

[0058] See also Fig.14 , Fig.14 is a flow chart of a method for determining a background noise value provided in an embodiment of the present application, and the method is applied to the infrared module in the above embodiment. Fig.14 As shown, the method comprises the following steps: Step 1410: Obtain a current value of a target parameter of the infrared light isolation component; wherein the target parameter includes any one of voltage, current and resistance.

[0059] In an embodiment of the present application, the infrared light isolation component is a component that has a certain deformation ability, is conductive and can isolate infrared light, and the infrared light isolation component has a certain resistance value. When the resistance value of the infrared light isolation component changes, the noise floor value of the infrared sensor will also change accordingly. In order to observe the change in the noise floor value of the infrared sensor, the resistance change of the infrared light isolation component can be observed. Since when the resistance value of the infrared light isolation component changes, the voltage across the infrared light isolation component and the current value passing through the infrared light isolation component will change. Therefore, the voltage, current or resistance of the infrared light isolation component can be obtained, and then the change in the noise floor value of the infrared sensor can be observed.

[0060] Step 1420: Based on the pre-established correspondence between the target parameter and the background noise value of the infrared sensor, the background noise value of the current infrared sensor corresponding to the current value is obtained.

[0061] In the embodiment of the present application, the corresponding relationship between the target parameter and the noise floor value of the infrared sensor can be predetermined. In this way, the noise floor value of the current infrared sensor can be obtained based on the current value of the target parameter of the infrared light isolation component.

[0062] In one embodiment of the present application, when the target parameter includes voltage, the corresponding relationship is obtained based on the voltage value of the infrared light isolation component at a first time point and the noise floor value of the infrared sensor of the infrared sensor at the first time point; when the target parameter includes resistance, the corresponding relationship is obtained based on the resistance value of the infrared light isolation component at a second time point and the noise floor value of the infrared sensor of the infrared sensor at the second time point; when the target parameter includes current, the corresponding relationship is obtained based on the current value of the infrared light isolation component at a third time point and the noise floor value of the infrared sensor of the infrared sensor at the third time point.

[0063] In the embodiment of the present application, the following will introduce the case where the target parameter includes voltage, and the case where the target parameter includes resistance or current can be referred to. Specifically, the voltage value of the infrared light isolation component at the first time point is obtained; the infrared noise floor value of the infrared sensor at the first time point is obtained; based on the voltage value of the infrared light isolation component at the first time point and the infrared noise floor value of the infrared sensor at the first time point, a corresponding relationship between the infrared light isolation component and the noise floor value of the infrared sensor is established.

[0064] Among them, the voltage value of the infrared light isolation component at the first time point can be obtained by voltage detection by the ADC in the infrared sensor, and the noise floor value of the infrared sensor at the first time point can be obtained based on the intensity of the infrared light signal received by the infrared sensor when the infrared sensor is at the first time point and is in an unobstructed situation. In fact, since the infrared sensor is in an unobstructed situation at this time, all infrared light signals received by the infrared sensor are the noise floor of the infrared sensor. After the infrared sensor obtains the voltage of the infrared light isolation component and the noise floor value of the infrared sensor, the voltage of the infrared light isolation component and the noise floor value of the infrared sensor can be transmitted to the CPU outside the infrared sensor through the processing element in the infrared sensor, and the CPU can store the voltage of the infrared light isolation component and the noise floor value of the infrared sensor in the memory.

[0065] Wherein, the first time point may include multiple time points, and the voltage values ​​of the infrared light isolation component at the multiple time points may be different. Since the voltage values ​​of the infrared light isolation component at different temperatures may be different, the time points when the infrared light isolation component is at different temperatures may be selected as the first time point to obtain the voltage values ​​of the infrared light isolation component at multiple time points and the background noise values ​​of the infrared sensor at the multiple time points, and establish the corresponding relationship between the voltage value of the infrared light isolation component and the background noise value of the infrared sensor. In the process of establishing the corresponding relationship between the voltage value of the infrared light isolation component and the background noise value of the infrared sensor, the fitting function of the corresponding relationship may be first obtained, such as a linear function, an exponential relationship, a logarithmic function or a multiple power function. Then, the voltage values ​​of the infrared light isolation component at multiple time points and the background noise values ​​of the infrared sensor at multiple time points may be substituted into the above fitting function to determine the unknown parameters in the fitting function, and obtain the corresponding relationship between the voltage value of the infrared light isolation component and the background noise value of the infrared sensor.

[0066] Corresponding to the above process, the second time point may include multiple time points, and the third time point may include multiple time points. For details, please refer to the above process, which will not be repeated here.

[0067] Here we take the linear function as an example. For other fitting functions, refer to the following process. Fig.15 , Fig.15 It is a schematic diagram of the linear relationship between the voltage value of an infrared light isolation component and the background noise value of an infrared sensor provided in an embodiment of the present application. By substituting the voltage value of the infrared light isolation component at multiple time points and the background noise value of the infrared sensor at multiple time points into a linear function, the unknown parameter in the linear function (the slope of the linear function) can be determined. At the same time, the voltage value of the infrared light isolation component and the background noise value of the infrared sensor at a certain time point (for example, a time point when the infrared light isolation component is in a static environment at normal temperature) can be selected from the voltage values ​​of the infrared light isolation component at multiple time points and the background noise values ​​of the infrared sensor at multiple time points as the initial voltage value of the infrared light isolation component and the initial background noise value of the infrared sensor.

[0068] In the process of obtaining the current noise floor value of the infrared sensor based on the current value of the target parameter of the infrared light isolation component, the current noise floor value of the infrared sensor can be obtained based on the current voltage value of the infrared light isolation component and the following formula: ; ; in, is the initial voltage value of the infrared light isolation element, y is the initial background noise value of the infrared sensor, k is the slope of the linear function, is the current background noise value of the infrared sensor, is the current voltage value of the infrared light isolation component. According to the above process, a corresponding relationship curve between the voltage value of the infrared light isolation component and the background noise value of the infrared sensor can be obtained, such as Fig.15 shown.

[0069] In one embodiment of the present application, the pre-established correspondence between the target parameter and the background noise value of the infrared sensor is in the form of a logarithmic function.

[0070] In the embodiment of the present application, the above linear relationship is only an example. In fact, the voltage value of the infrared light isolation component and the noise floor value of the infrared sensor should be a logarithmic function relationship. By fitting the corresponding relationship between the target parameter and the noise floor value of the infrared sensor through a logarithmic function, the corresponding relationship obtained is more accurate, so that the noise floor value of the infrared sensor obtained is more accurate.

[0071] In an embodiment of the present application, a method for obtaining the noise floor value of an infrared sensor based on the resistance information of an infrared light isolation component is provided. Compared with the method of detecting the ambient temperature of the mainboard, the accuracy of detecting information related to the resistance of the infrared light isolation component in this method is higher, and there is no need to consider the time required for temperature conduction, so the noise floor value of the infrared sensor obtained is more accurate. Since the position between the infrared light isolation component and the infrared sensor in different electronic devices is relatively fixed, the effect of this method applied to different electronic devices is consistent.

[0072] In addition, there is no hysteresis in the process of determining the noise floor value of the infrared sensor by detecting the resistance information of the infrared light isolation component, and the noise floor value of the infrared sensor can be determined in real time. And because the direct cause of the change in the noise floor value of the infrared sensor is the deformation of the infrared light isolation component, and the deformation of the infrared light isolation component will also directly affect the resistance value of the infrared light isolation component, compared with detecting the ambient temperature of the motherboard, this method of determining the noise floor value of the infrared sensor based on the resistance-related information of the infrared light isolation component is more direct, and the noise floor value of the infrared sensor obtained is more accurate.

[0073] See also Fig.16 , Fig.16 FIG. 1 is a flow chart of another method for determining a background noise value provided in an embodiment of the present application. Fig.16 As shown, the method comprises the following steps: Step 1610: Provide a constant voltage to the infrared light isolation component and the infrared light emitting element connected in series, so that the background noise value of the infrared sensor remains stable.

[0074] In the embodiments of the present application, Fig.12 As shown, the infrared light isolation component and the infrared light emitting element are connected in series, and a constant voltage can be provided to the infrared light isolation component and the infrared light emitting element connected in series. Fig.13 As shown, LED A can provide a constant voltage to the infrared light isolation component and the infrared light emitting element connected in series. That is, the sum of the voltage across the infrared light isolation component and the voltage across the infrared light emitting element is the constant voltage.

[0075] By providing a constant voltage to the infrared light isolation component and the infrared light emitting element connected in series, the noise floor value of the infrared sensor can be kept stable. Fig.17 , Fig.17 FIG. 1 is a conceptual diagram of a method for maintaining a stable background noise value of an infrared sensor provided by an embodiment of the present application. Fig.17As shown, in the case where the infrared light isolation component is compressed, the compression amount of the infrared light isolation component reduces the background noise value of the infrared sensor, and at the same time, the compression amount of the infrared light isolation component reduces the resistance value of the infrared light isolation component. The reduction in the resistance value of the infrared light isolation component increases the driving current passing through the infrared light emitting element. The increase in the driving current passing through the infrared light emitting element increases the background noise value of the infrared sensor, thereby keeping the background noise value of the infrared sensor stable.

[0076] like Fig.17 As shown, correspondingly, in the case where the infrared light isolation component is stretched, the stretching amount of the infrared light isolation component increases the background noise value of the infrared sensor, and at the same time, the stretching amount of the infrared light isolation component increases the resistance value of the infrared light isolation component. The increase in the resistance value of the infrared light isolation component reduces the driving current passing through the infrared light emitting element. The reduction in the driving current passing through the infrared light emitting element reduces the background noise value of the infrared sensor, thereby keeping the background noise value of the infrared sensor stable.

[0077] It should be noted that the above process may not make the noise floor value of the infrared sensor absolutely stable. Fig.17 As shown, the initial driving current of the infrared LED can be configured, and then the parameters of the infrared light isolation component can be adjusted to keep the background noise value of the infrared sensor stable.

[0078] Step 1620: driving the infrared light emitting element to emit infrared light under the action of the constant voltage, wherein the infrared light is not reflected by the target obstruction during the transmission process.

[0079] In the embodiment of the present application, after the background noise value of the infrared sensor remains stable, the infrared light emitting element can be driven to emit infrared light signals, and the whole process needs to be carried out without any obstruction. That is to say, the infrared light emitted by the infrared light emitting element is not reflected by the target obstruction during the whole infrared light signal transmission process. The target obstruction can be an obstruction other than the screen of the electronic device, that is, Figure 1 The occluder shown in .

[0080] Step 1630: Receive target infrared light through the infrared light receiving element in the infrared sensor, where the target infrared light comes from the infrared light emitted by the infrared light emitting element.

[0081] In the embodiment of the present application, since the entire process is carried out without any obstruction, the infrared light receiving element cannot receive the infrared light reflected by the target obstruction. In this case, all the infrared light received by the infrared light receiving element at this time is the signal noise of the infrared sensor, that is, the background noise of the infrared sensor.

[0082] Step 1640: Determine a background noise value based on the target infrared light.

[0083] In the embodiment of the present application, the signal strength of the target infrared light received by the infrared light receiving element can be determined as the noise floor value of the infrared sensor. Since the noise floor value of the infrared sensor remains stable, the noise floor value can be used in the subsequent process of the infrared sensor detecting the obstruction.

[0084] In the embodiment of the present application, since the infrared light isolation component is connected in series with the infrared light emitting element, the driving current of the infrared light emitting element can be adjusted by changing the resistance value of the infrared light isolation component, and a feedback mechanism can be formed, that is, the change of the infrared light emitting element's driving current on the infrared sensor's noise floor value is compensated by the change of the infrared light isolation component's deformation on the infrared sensor's noise floor value, so that the infrared sensor's noise floor value remains stable. Since the infrared sensor's noise floor value remains stable, there is no need to determine the infrared sensor's noise floor value through software, which can save software space and debugging costs.

[0085] See also Fig.18 , Fig.18 is a structural block diagram of an electronic device provided in an embodiment of the present application. Fig.18 As shown, the electronic device 1800 includes a screen 1810 and an infrared module, and the infrared module includes an infrared sensor 200 and an infrared light isolation component 300. The infrared light isolation component 300 is disposed between the screen 1810 and the infrared sensor 200.

[0086] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0087] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for enabling a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0088] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An infrared module, characterized in that: It includes an infrared sensor and an infrared light isolation component; the infrared sensor is electrically connected to the infrared light isolation component; Among them, the infrared light isolation component is a deformable conductive component, and the resistance value of the infrared light isolation component changes with the change of the deformation amount of the infrared light isolation component, and the background noise value of the infrared sensor changes with the change of the deformation amount of the infrared light isolation component; the background noise value of the infrared sensor is associated with the resistance value of the infrared light isolation component.

2. The infrared module according to claim 1, characterized in that: The background noise value of the infrared sensor is positively correlated with the resistance value of the infrared light isolation component.

3. The infrared module according to claim 1, characterized in that: The infrared light isolation component is in contact with the infrared sensor, and a deformation amount of the infrared light isolation component changes with a temperature change of the infrared sensor.

4. The infrared module according to claim 1, characterized in that: The infrared module also includes a conductive connecting component, and the infrared light isolation component is electrically connected to the infrared sensor through the conductive connecting component.

5. The infrared module according to any one of claims 1 to 4, characterized in that: The infrared sensor comprises a detection module, and the detection module is connected to the infrared light isolation component; Wherein, the detection module includes at least one of a voltage detection module for the infrared light isolation component, a current detection module for the infrared light isolation component, and a resistance detection module for the infrared light isolation component.

6. The infrared module according to claim 5, characterized in that: The detection module includes a voltage detection module, and the voltage detection module is connected in parallel with the infrared light isolation component; the voltage detection module includes an analog-to-digital converter in the infrared sensor.

7. The infrared module according to claim 5, characterized in that: The detection module includes a current detection module, which is connected in series with the infrared light isolation component; the current detection module includes an analog-to-digital converter in the infrared sensor and a fixed resistor in the infrared sensor, and the analog-to-digital converter and the fixed resistor are connected in parallel.

8. The infrared module according to claim 6 or 7, characterized in that: The analog-to-digital converter is respectively connected to a processing element and an infrared light receiving element arranged in the infrared sensor, the infrared light receiving element is grounded, and the processing element is coupled to the infrared light emitting element.

9. The infrared module according to any one of claims 1 to 4, characterized in that: The infrared sensor comprises an infrared light emitting element, the infrared light isolating component is connected in series with the infrared light emitting element, and the sum of the voltage across the infrared light isolating component and the voltage across the infrared light emitting element is a fixed value.

10. An electronic device, characterized in that: It comprises a screen and an infrared module according to any one of claims 1 to 9, wherein the infrared light isolation component is arranged between the screen and the infrared sensor.

11. A method for determining a background noise value, characterized in that: Applied to the infrared module according to any one of claims 1 to 8, the method comprises: Acquiring a current value of a target parameter of the infrared light isolation component; Based on a pre-established correspondence between the target parameter and the noise floor value of the infrared sensor, obtaining the noise floor value of the current infrared sensor corresponding to the current value; Wherein, the target parameter includes any one of voltage, current and resistance.

12. The method according to claim 11, characterized in that In the case where the target parameter includes voltage, the corresponding relationship is obtained based on a voltage value of the infrared light isolation component at a first time point and a background noise value of the infrared sensor at the first time point; In the case where the target parameter includes resistance, the corresponding relationship is obtained based on the resistance value of the infrared light isolation component at the second time point and the background noise value of the infrared sensor at the second time point; In the case where the target parameter includes current, the corresponding relationship is obtained based on a current value of the infrared light isolation component at a third time point and a background noise value of the infrared sensor at the third time point.

13. The method according to claim 11, characterized in that The correspondence between the pre-established target parameters and the background noise value of the infrared sensor is in the form of a logarithmic function.

14. A method for determining a background noise value, characterized in that: Applied to the infrared module according to claim 9, the method comprises: Providing a constant voltage to the infrared light isolation component and the infrared light emitting element connected in series, so that the noise floor value of the infrared sensor remains stable; Under the action of the constant voltage, the infrared light emitting element is driven to emit infrared light, and the infrared light is not reflected by the target shielding object during the transmission process; receiving target infrared light through the infrared light receiving element in the infrared sensor, wherein the target infrared light comes from the infrared light emitted by the infrared light emitting element; A noise floor value is determined based on the target infrared light.

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