Internal heat dissipation structure of computer host

Abstract

The invention discloses a computer host internal heat dissipation structure which comprises a case, a mainboard part in the case and a CPU part and a display card part on the mainboard part, a heat insulation plate is installed at the top of the case, a semiconductor chilling plate is arranged at the end of the case, the cold end of the case faces inwards, the hot end of the case faces upwards, and the cold end of the chilling plate is provided with a double-circulation shunt heat dissipation structure to guide air exchange between the interior and the exterior of the case; the heat dissipation structure is simple in design, internal heat is efficiently absorbed and discharged in a double-circulation mode, the temperature of a case is reduced, stable operation of a system is ensured, centralized cooling is achieved through optimized pipeline design, heat loss is effectively isolated through a heat preservation interlayer, the overall heat dissipation efficiency is improved, in addition, a humidity isolation structure and a waterproof breathable film provide additional waterproof guarantee, and the service life is prolonged. According to the computer cooling system, condensed water drops are prevented from flowing out in the cooling process, safe operation of the system in the environment is ensured, electronic components are prevented from being damaged, the efficiency, safety and reliability of the cooling system are jointly improved, and stable and efficient operation of the computer host in various working environments is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of computer heat dissipation, in particular to an internal heat dissipation structure of a computer host. Background Art

[0002] With the rapid development of information technology, the penetration rate of computers in various application scenarios has increased significantly. From individual users to enterprise data centers, computer hosts have become indispensable core devices. In the process of high-performance computing and complex task processing, the operating frequency and load of key components such as central processing units (CPUs) and graphics processing units (GPUs) continue to increase, resulting in a large amount of heat generation. When these components perform complex calculations and process large amounts of data, electrical energy is converted into heat energy, causing their operating temperatures to rise significantly. Excessive temperatures will not only cause the CPU and GPU to automatically reduce their frequency (i.e., performance degradation), affecting the computer's computing speed and responsiveness, but may also cause aging and failure of electronic components, shortening the service life of the equipment.

[0003] Existing computer cooling methods mainly include fan cooling and water cooling. Fan cooling is the most common cooling method. It uses a high-speed rotating fan to discharge the hot air inside the chassis and relies on air flow to remove the heat. However, fan cooling is often inefficient under high heat loads. Multiple fan installation points need to be set inside the chassis, and the installation position needs to match the type and position of the graphics card and fan, which increases the complexity and cost of installation. In addition, the fan exhausts air directly to the outside, and the large space inside the chassis makes the hot air discharge slower, resulting in limited cooling effect. At the same time, the noise generated by the fan when running will also affect the user experience.

[0004] In contrast, water-cooled heat dissipation systems use the high specific heat capacity of liquids to efficiently transfer heat to the radiator and discharge it. However, the traditional water cooling system has a complex structure and requires professional skills during the installation process. In particular, the installation of water cooling for high-end graphics cards requires the graphics card to be disassembled, which increases the difficulty and time of installation. In addition, there is a risk of leakage in the water cooling system. Once a leak occurs, it may cause serious damage to high-end graphics cards and other electronic components, which is not worth the loss. Therefore, the existing heat dissipation methods still have many shortcomings in terms of efficiency, reliability and safety. A new heat dissipation structure is urgently needed to solve the above problems and improve the heat dissipation performance and system stability of the computer host. Summary of the invention

[0005] The object of the present invention is to provide an internal heat dissipation structure of a computer host to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an internal heat dissipation structure of a computer host, comprising a chassis; a motherboard part inside the chassis; and a CPU part and a graphics card part on the motherboard part, wherein a heat insulation board is arranged on the top of the chassis, a semiconductor cooling sheet is arranged on the end of the heat insulation board, the semiconductor cooling sheet has a cold end and a hot end, the cold end of the semiconductor cooling sheet faces the inside of the chassis, the hot end of the semiconductor cooling sheet faces the top of the chassis, and a double-circulation shunt heat dissipation structure for guiding the exchange of air inside the chassis with the outside is arranged on the outer side of the cold end of the semiconductor cooling sheet; The dual-circulation shunt heat dissipation structure includes: A cooling frame, wherein an inlet and two outlets are provided on the cooling frame, wherein the inlet of the cooling frame faces the main board portion, wherein the cooling frame is arranged at the lower end of the insulation board and is located outside the cold end of the semiconductor refrigeration sheet, wherein a first heat conductor is attached to the bottom of the cold end of the semiconductor refrigeration sheet, and wherein the first heat conductor has a plurality of fins; A heat-insulating arc plate, which is arranged at the inlet end of the cooling frame and is used to reduce the effective area of ​​the inlet of the cooling frame; A first heat conduction plate, which is arranged at the end of the heat insulation arc plate; A second heat conduction plate, the second heat conduction plate being arranged on the inner side surface of the heat insulating arc plate; A third thermal conduction plate, the third thermal conduction plate is arranged between the first thermal conduction plate and the second thermal conduction plate, and the distance between the third thermal conduction plate and the first thermal conduction plate is equal, the lower end surface of the third thermal conduction plate is provided with a guide portion, the guide portion is used to guide the air flow to the two outlets of the cooling frame, the first thermal conduction plate, the second thermal conduction plate and the third thermal conduction plate all have an inclination angle of 1-5 degrees, and the first thermal conduction plate, the second thermal conduction plate and the third thermal conduction plate and the fins of the first thermal conductor are arranged in a staggered manner; The outer row pipe group is arranged at two outlet ends of the cooling frame.

[0007] Preferably, the outer row pipe group includes: Two special-shaped transfer tubes, which are respectively arranged at two outlet ends of the cooling frame; A first outer tube, the first outer tube is connected to one of the special-shaped transfer tubes, and a first side opening for accommodating a CPU portion is provided on a side of the first outer tube; A second outer tube, the second outer tube is connected to another special-shaped adapter tube, and a second side opening for accommodating a graphics card portion is provided on a side surface of the second outer tube.

[0008] Preferably, the cooling frame is also provided with a humidity isolation structure; The humidity isolation structure comprises: A first waterproof and breathable membrane, which is arranged at the inlet end of the cooling frame and located outside the thermal insulation arc plate; A fixed ring plate, the fixed ring plate is arranged in the two outlets of the cooling frame, a circulation groove is provided on the upper end surface of the fixed ring plate, the bottom of the circulation groove has an opening, an annular fixing groove is provided on the inner side of the circulation groove, a raised mesh plate is provided on the inner side of the annular fixing groove, a second waterproof and breathable membrane is provided on the upper end surface of the raised mesh plate, and the edge of the second waterproof and breathable membrane is placed in the annular fixing groove; A fixing ring, the fixing ring being pressed on a portion of the second waterproof breathable membrane located in the annular fixing groove; A collecting bottle, which is arranged between the two outlet ends of the cooling frame and located at the lower end of the circulation trough. Two connecting pipes are arranged on the top of the collecting bottle, and the connecting pipes are used for communication between the circulation trough and the collecting bottle. The collecting bottle is open at the bottom, and a bottle cap is threadedly connected to the bottom of the collecting bottle. A flow increasing fan is arranged at the lower end of the fixed ring plate.

[0009] Preferably, the hot end of the semiconductor refrigeration plate is provided with a water cooling structure; The water cooling structure comprises: A second heat conductor, the second heat conductor is attached to the hot end of the semiconductor refrigeration plate, the second heat conductor has a plurality of arc-shaped fins, and a centrifugal impeller is rotatably arranged at the center of the arc-shaped fins of the second heat conductor; A water-cooling shell, the water-cooling shell is arranged outside the second heat conductor, the interior of the water-cooling shell is filled with coolant, and the interior of the water-cooling shell is divided into a discharge part and a discharge part by a partition; A drive motor, wherein the drive motor is fixedly mounted on the water-cooling housing, and an output end of the drive motor is connected to a centrifugal impeller; The cold-discharge mechanism is arranged inside the water-cooling housing and located at the opposite end of the second heat conductor, and is used for conducting heat of the coolant.

[0010] Preferably, the cooling mechanism comprises: A radiator body, the radiator body being arranged at the opposite end of the second heat conductor, a part of the radiator body being located inside the water-cooling housing, and another part of the radiator body being located outside the water-cooling housing; The heat dissipation fan is fixedly arranged on the upper end of the radiator body outside the water-cooling shell.

[0011] Preferably, a support assembly is provided on the outer side of the outer row of pipes; The support assembly comprises: A plurality of movable vertical rods, wherein the movable vertical rods are fixedly arranged at the lower end of the insulation board, the sides of the movable vertical rods are respectively fixedly connected to the first outer row of pipes and the second outer row of pipes through fixed rods, and the bottom of the movable vertical rods is provided with pulleys; A plurality of movable plates are provided at the bottom of the chassis, and the movable plates are movably connected with the pulleys by means of slide grooves.

[0012] Preferably, a positioning block is provided at the upper end of the main board portion, a convex portion is provided at the lower end surface of the positioning block, and a concave portion matching the convex portion is provided at the upper end surface of the thermal insulation board.

[0013] Preferably, a thermal insulation interlayer is provided in the first outer row of pipes, the second outer row of pipes and the inner side wall of the cooling frame.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The internal heat dissipation structure of a computer host can effectively absorb heat from the inside of the host and discharge it after cooling by being provided with a double-circulation shunt heat dissipation structure, thereby significantly reducing the temperature inside the chassis and ensuring efficient and stable operation of the computer host. The structure quickly absorbs and cools the heat generated by the mainboard part through air circulation inside the cooling frame, and then centrally guides the cooled air to the radiators of the CPU part and the graphics card part, thereby achieving efficient heat transfer and discharge and maintaining the system working within a suitable temperature range; The internal heat dissipation structure of a computer host realizes centralized cooling by optimizing the pipeline design, avoids the interaction of the temperature difference between the inside and outside of the pipeline, and improves the overall heat dissipation efficiency. The double-circulation shunt heat dissipation structure of the cooling frame ensures that the cooled air is accurately delivered to the target heat dissipation components through two external exhaust pipes. At the same time, the setting of the thermal insulation interlayer effectively isolates the heat loss of the cooling air during the transmission process, reduces the interaction of the temperature difference between the inside and outside air, and further improves the energy efficiency and stability of the heat dissipation system. The internal heat dissipation structure of a computer host provides additional waterproof design protection by being provided with a humidity isolation structure and a waterproof breathable membrane, thereby ensuring the safety of the system during the cooling process. The humidity isolation structure includes a waterproof breathable membrane, which is combined with a collection bottle and a flow-increasing fan to effectively prevent the outflow of condensed water droplets generated during the cooling process, thereby ensuring the safe operation of the system in a high-humidity environment and avoiding the risk of damage to electronic components due to water droplet leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the internal structure of the chassis of the present invention; Figure 2 It is a schematic diagram of the overall structure of the heat dissipation structure of the present invention; Figure 3 A schematic diagram of the air circulation flow direction of the heat dissipation mechanism of the present invention inside the chassis; Figure 4 It is a schematic structural diagram of the first outer row pipe of the present invention; Figure 5 is a schematic structural diagram of the second outer row pipe of the present invention; Figure 6 It is a schematic diagram of the internal structure of the cold and hot ends of the insulation board of the present invention; Figure 7 It is an enlarged view of point A of the present invention; Figure 8 A schematic diagram of the air flow direction inside the cooling frame of the present invention; Fig. 9 It is a cross-sectional view at AA of the present invention; Fig.10 A comparison diagram of the first heat conductor and the second heat conductor of the present invention; Fig.11 It is a structural schematic diagram of the fixed ring plate part of the present invention; Fig.12 A top view of the present invention; Fig.13 It is a partial structural schematic diagram of the centrifugal impeller of the present invention.

[0016] In the figure: 1, chassis; 2, motherboard part; 3, CPU part; 4, graphics card part; 5, insulation board; 6, semiconductor refrigeration plate; 7, double-circulation shunt heat dissipation structure; 701, cooling frame; 702, first thermal conductor; 703, insulation arc plate; 704, first thermal conduction plate; 705, second thermal conduction plate; 706, third thermal conduction plate; 7061, guide part; 707, outer pipe group; 7071, special-shaped transfer pipe; 7072, first outer pipe; 7073, first side port; 7074, second outer pipe; 7075, second side port; 8, humidity isolation structure; 801, first waterproof breathable membrane; 802, fixed ring plate; 80 3. Circulation groove; 804. Annular fixing groove; 805. Raised mesh plate; 806. Second waterproof breathable membrane; 807. Fixing ring; 808. Collecting bottle; 809. Connecting pipe; 810. Bottle cap; 811. Flow increasing fan; 9. Water cooling structure; 901. Second heat conductor; 902. Centrifugal impeller; 903. Water cooling shell; 904. Partition; 905. Driving motor; 906. Radiator mechanism; 9061. Radiator body; 9062. Cooling fan; 10. Support assembly; 1001. Movable vertical pole; 1002. Pulley; 1003. Movable plate; 11. Positioning block; 12. Protrusion; 13. Concave; 14. Insulation interlayer. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] In the description of the present invention, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0019] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined. Example

[0021] See also Figure 1-13 As shown, the present invention provides a technical solution for a heat dissipation structure inside a computer host: an internal heat dissipation structure of a computer host, comprising a chassis 1; a mainboard part 2 inside the chassis 1; and a CPU part 3 and a graphics card part 4 on the mainboard part 2, a heat insulation board 5 is installed on the top of the chassis 1, a semiconductor cooling sheet 6 is installed on the end of the heat insulation board 5, the semiconductor cooling sheet 6 has a cold end face and a hot end face, the cold end face of the semiconductor cooling sheet 6 faces the inside of the chassis 1, and the hot end face of the semiconductor cooling sheet 6 faces the top of the chassis 1, and a double-circulation shunt heat dissipation structure 7 for guiding the exchange of air between the inside of the chassis 1 and the outside is installed on the outer side of the cold end of the semiconductor cooling sheet 6; The dual-circulation shunt heat dissipation structure 7 includes components such as a cooling frame 701, a thermal insulation arc plate 703, a first thermal conduction plate 704, a second thermal conduction plate 705, a third thermal conduction plate 706, and an outer pipe group 707. The cooling frame 701 is provided with an inlet and two outlets. The inlet of the cooling frame 701 faces the main board part 2. The cooling frame 701 is fixedly mounted at the lower end of the thermal insulation plate 5 and is located outside the cold end of the semiconductor refrigeration plate 6. The bottom of the cold end of the semiconductor refrigeration plate 6 is fitted with a first thermal conductor 702 after being coated with silicone grease. The first thermal conductor 702 has a plurality of fins. The thermal insulation arc plate 703 is installed at the inlet end of the cooling frame 701. The first thermal conduction plate 704 is connected to the end of the thermal insulation arc plate 703. The second thermal conduction plate 705 is connected to the inner side of the thermal insulation arc plate 703. The third heat conduction plate 706 is located between the first heat conduction plate 704 and the second heat conduction plate 705, and the spacing between the first heat conduction plate 704 and the second heat conduction plate 705 is equal. The lower end surface of the third heat conduction plate 706 is designed with a guide portion 7061. The first heat conduction plate 704, the second heat conduction plate 705 and the third heat conduction plate 706 all have a downward inclination angle of 1-5 degrees. The first heat conduction plate 704, the second heat conduction plate 705 and the third heat conduction plate 706 are arranged in a staggered manner with the fins of the first thermal conductor 702, and the outer row pipe group 707 is installed at the two outlet ends of the cooling frame 701.

[0022] In this embodiment, the heat insulating arc plate 703 is used to reduce the effective area of ​​the cooling frame 701 entrance, thereby increasing the air flow speed and reducing the condensation phenomenon when the cold and hot air interact. Figure 7 As shown, it has a downwardly inclined baffle located at the upper end of the middle position of the two outlets of the cooling frame 701, which is used to guide and divert air to the two outlets of the cooling frame 701. The heat-insulating arc plate 703 is a PVC plate, and the heat-conducting plate is made of copper.

[0023] During normal operation of the computer host, the heat of the mainboard part 2 will be sucked into the cooling frame 701 by the fan of the graphics card and the CPU radiator fan in the external exhaust pipe group 707 for cooling. Figure 8As shown, the air sucked from the mainboard part 2 will immediately pass through the heat insulating arc plate 703 after entering the cooling frame 701, and enter the interior of the cooling frame 701. Subsequently, the air will flow downward along the extension direction of the first heat conducting plate 704, then move upward along the direction of the third heat conducting plate 706, and then flow downward again along the direction of the second heat conducting plate 705. Finally, under the guidance of the guide part 7061 at the lower end of the third heat conducting plate 706, the air will be discharged from the two outlets of the cooling frame 701, enter the external exhaust pipe group 707, and cool the CPU part 3 and the graphics card part 4, and finally be discharged from the chassis 1. Due to the external exhaust of the internal air, the external air will also enter the interior of the chassis 1, further providing cooling, forming a cycle, and reducing the temperature inside the chassis 1.

[0024] The outer tube group 707 includes two special-shaped adapter tubes 7071, a first outer tube 7072, a second outer tube 7074, etc. The two special-shaped adapter tubes 7071 are respectively installed at the two outlet ends of the cooling frame 701, the first outer tube 7072 is connected to one of the special-shaped adapter tubes 7071, and the side of the first outer tube 7072 is provided with a first side opening 7073 for accommodating the CPU part 3, the second outer tube 7074 is connected to the other special-shaped adapter tube 7071, and the side of the second outer tube 7074 is provided with a second side opening 7075 for accommodating the graphics card part 4.

[0025] In this embodiment, the first outer exhaust pipe 7072 and the second outer exhaust pipe 7074 provide a cooling path for the flow of refrigerated air, and the graphics card and the CPU radiator are both built into the two outer exhaust pipes. On the one hand, this prevents the outflow of cold air and provides a more efficient and centralized cooling effect. On the other hand, it prevents the heat discharged from the graphics card (with its own heat dissipation part) and the CPU radiator from accumulating inside the chassis 1.

[0026] A humidity isolation structure 8 is installed on the cooling frame 701, and the humidity isolation structure 8 includes a first waterproof breathable membrane 801, a fixed ring plate 802, a fixed ring 807, a collecting bottle 808, a flow-increasing fan 811, etc. The first waterproof breathable membrane 801 is installed at the inlet end of the cooling frame 701 and is located on the outside of the temperature-insulating arc plate 703. The fixed ring plate 802 is arranged in the two outlets of the cooling frame 701. A circulation groove 803 is provided on the upper end surface of the fixed ring plate 802, and the bottom of the circulation groove 803 has an opening. An annular fixed groove 804 is provided on the inner side of the circulation groove 803, and a raised mesh plate 805 is provided on the inner side of the annular fixed groove 804. The upper end surface of the raised mesh plate 805 is paved with a second waterproof breathable membrane 806, and the second waterproof breathable membrane 806 is provided on the upper end surface of the second waterproof breathable membrane 806. The edge portion of the water-permeable membrane 806 is placed in the annular fixing groove 804, and the fixing ring 807 is pressed on the portion of the second waterproof and breathable membrane 806 located in the annular fixing groove 804. The collecting bottle 808 is located between the two outlet ends of the cooling frame 701 and at the lower end of the circulation groove 803. Two connecting pipes 809 are installed on the top of the collecting bottle 808. The collecting bottle 808 is open at the bottom, and the bottom of the collecting bottle 808 is threadedly connected to a bottle cap 810. The flow-increasing fan 811 is installed at the lower end of the fixing ring plate 802.

[0027] In this embodiment, the waterproof and breathable membrane is a polytetrafluoroethylene microporous membrane (ie, ePTFE membrane) to ensure that under the condition of normal gas circulation, the outflow of internal condensed water droplets is further restricted.

[0028] During normal air flow, the narrow opening design of the inlet of the cooling frame 701 can prevent water droplets from condensing there. The first waterproof and breathable membrane 801 is used to provide further waterproof protection to improve more reliable safety. After the air passes through the thermal insulation arc plate 703, as the space becomes larger, the gas flow rate slows down, and water droplets may condense on the inner wall of the cooling frame 701. Due to the inclined design of the thermal conduction plate, the condensed water droplets will flow to the lower part along the thermal conduction plate. If the condensed water is located at the bottom of the third thermal conduction plate 706, due to the third thermal conduction plate The arc of 706 is not large, and the operation of the flow-increasing fan 811 will generate a low-pressure area in the direction of air flow, thereby generating suction on the water, causing the water to flow toward the outlet of the cooling frame 701 to ensure air circulation. After that, the condensed water will reach the second heat conduction plate 705, and under its guidance, it will flow into the circulation groove 803, and finally, through the connecting pipe 809, it will flow into the collection bottle 808. On the other hand, the cooled air will pass through the second waterproof and breathable membrane 806 for further centralized heat dissipation of the graphics card and CPU radiator.

[0029] A water cooling structure 9 is installed on the hot end surface of the semiconductor refrigeration plate 6. The water cooling structure 9 includes a second heat conductor 901, a water cooling shell 903, a drive motor 905, a cold discharge mechanism 906, etc. The second heat conductor 901 is installed on the hot end surface of the semiconductor refrigeration plate 6 after being coated with silicone grease on the bottom surface. The second heat conductor 901 has a plurality of arc-shaped fins. A centrifugal impeller 902 is rotatably provided at the central part of the arc-shaped fins of the second heat conductor 901. The water cooling shell 903 is installed on the outside of the second heat conductor 901 by bolts. The interior of the water cooling shell 903 is filled with coolant. The interior of the water cooling shell 903 is divided into a discharge part and a discharge part by setting a partition 904. The drive motor 905 is fixedly installed on the water cooling shell 903. The output end of the drive motor 905 is connected to the centrifugal impeller 902. The cold discharge mechanism 906 is installed in the water cooling shell 903 and is located at the opposite end of the second heat conductor 901. The cold discharge mechanism 906 is used to extract the heat of the coolant.

[0030] During the operation of the semiconductor refrigeration sheet 6, the heat is conducted to the coolant through the second heat conductor 901. In this embodiment, the arc-shaped fins can not only provide a larger surface area and improve the heat dissipation efficiency, but also guide the coolant to flow more evenly, reduce turbulence and dead angles, and enhance the heat exchange effect. In addition, a water barrier frame can be further provided outside the water-cooled housing 903 to further improve waterproof safety. At the same time, the fixed parts of the first heat conductor 702 and the second heat conductor 901 can be staggered to avoid contact to ensure working efficiency.

[0031] When the heat is dissipated on the hot end face, the second heat conductor 901 conducts the heat to the coolant, and the driving motor 905 will drive the centrifugal impeller 902 to rotate, promote the flow of the coolant, and take away the coolant containing heat. Next, the coolant will be cooled down under the heat dissipation of the cold discharge mechanism 906, and the new coolant will enter the centrifugal impeller 902 at the top, and pass through the fin part of the second heat conductor 901 again, taking away the heat for circulation. During the whole process, the partition 904 will separate the coolant with different flow directions to reduce heat loss and ensure that the cooling water entering the centrifugal impeller 902 can absorb and take away heat more effectively.

[0032] The radiator mechanism 906 includes a radiator body 9061 and a cooling fan 9062. The radiator body 9061 is installed at the opposite end of the second heat conductor 901. A part of the radiator body 9061 is located inside the water-cooled shell 903, and the other part is located outside the water-cooled shell 903. The cooling fan 9062 is fixedly installed at the upper end of the radiator body 9061 located outside the water-cooled shell 903.

[0033] During the cooling process of the cooling water, the radiator body 9061 is responsible for conducting the heat away. At the same time, the cooling fan 9062 located at the upper end thereof continuously cools the radiator body 9061, thereby achieving an effective cooling effect.

[0034] A support assembly 10 is installed on the outside of the outer row of pipes 707, and the support assembly 10 includes a plurality of movable vertical rods 1001, a plurality of movable plates 1003, etc. The movable vertical rods 1001 are fixedly installed at the lower end of the insulation board 5, and the sides of the movable vertical rods 1001 are fixedly connected to the first outer row of pipes 7072 and the second outer row of pipes 7074 respectively through fixed rods. A pulley 1002 is installed at the bottom of the movable vertical rods 1001, and the movable plate 1003 is arranged at the bottom of the chassis 1. The movable plate 1003 is movably connected to the pulley 1002 by providing a slide groove.

[0035] In this embodiment, the movable vertical rod 1001 not only provides support for the insulation board 5 and the components thereon, but also provides an additional fixing effect for the first outer tube 7072 and the second outer tube 7074, reducing the shaking during the air circulation process. The pulley 1002 and the movable plate 1003 located at the bottom of the movable vertical rod 1001 can provide a path guide for the movement of the structure to avoid collision with other computer components during disassembly. In addition, during the installation process, gaskets can be attached to both sides of the insulation board 5 to achieve a more stable fixing effect.

[0036] A positioning block 11 is fixedly installed on the upper end of the main board part 2, and a convex portion 12 is designed on the lower end surface of the positioning block 11. A concave portion 13 matching the convex portion 12 is provided on the upper end surface of the insulation board 5. This design allows for quick alignment of the upper end portion during installation, shortens installation time, and improves installation efficiency.

[0037] The first outer pipe 7072, the second outer pipe 7074 and the inner wall of the cooling frame 701 are filled with a thermal insulation interlayer 14, which can isolate the heat of the cooling air from being lost to the external environment during the transmission process, ensuring that the cold air can be efficiently transmitted to the target graphics card and CPU radiator, thereby improving the overall heat dissipation performance. In addition, the thermal insulation interlayer 14 can also effectively reduce the noise generated during the operation of the cooling system, thereby improving the user experience.

[0038] The working principle of the present invention is as follows: When the internal heat dissipation structure of a computer host of this embodiment is in use, the heat generated by the mainboard part 2 will be sucked into the cooling frame 701 for cooling. The cooling frame 701 effectively removes heat from the air through the double-circulation shunt heat dissipation structure 7, and the cooled air is then directed to the radiator of the CPU part 3 and the graphics card part 4 to ensure that these key components are fully cooled. The air that absorbs heat through the radiator is discharged from the chassis 1 through the external exhaust pipe group 707, forming a continuous air circulation, thereby continuously reducing the temperature inside the chassis and maintaining the efficient and stable operation of the computer host. At the same time, the design of the thermal insulation interlayer 14 and the humidity isolation structure 8 effectively isolates the loss of heat and the outflow of water droplets, further improving the efficiency and safety of the heat dissipation system. The support assembly 10 ensures that the external exhaust pipe group 707 runs stably during the air circulation process, reduces jitter, and ensures the overall stability of the system. The design of the positioning block 11, the convex portion 12 and the concave portion 13 simplifies the installation process of the insulation board 5, improves the installation efficiency and the overall reliability of the structure. Through the synergistic effect of the water cooling structure 9 and the cold discharge mechanism 906, the heat of the semiconductor refrigeration plate 6 is efficiently conducted and discharged, ensuring that key components such as the CPU and graphics card still maintain a suitable temperature under high-load operation, extending the life of the equipment, improving the overall performance, and ultimately achieving an effective reduction in the internal temperature of the chassis 1, ensuring efficient and stable operation of the computer host.

[0039] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation structure inside a computer host, comprising a chassis (1); a motherboard portion (2) inside the chassis (1); and a CPU portion (3) and a graphics card portion (4) on the motherboard portion (2), characterized in that: The top of the chassis (1) is provided with a thermal insulation plate (5), the end of the thermal insulation plate (5) is provided with a semiconductor cooling plate (6), the semiconductor cooling plate (6) has a cold end and a hot end, the cold end of the semiconductor cooling plate (6) faces the inside of the chassis (1), the hot end of the semiconductor cooling plate (6) faces the top of the chassis (1), and a double-circulation shunt heat dissipation structure (7) for guiding the exchange of air inside the chassis (1) and outside is provided on the outside of the cold end of the semiconductor cooling plate (6); The dual-circulation shunt heat dissipation structure (7) comprises: A cooling frame (701), wherein the cooling frame (701) is provided with an inlet and two outlets, the inlet of the cooling frame (701) faces the main board portion (2), the cooling frame (701) is arranged at the lower end of the thermal insulation plate (5) and is located outside the cold end of the semiconductor cooling plate (6), a first thermal conductor (702) is provided at the bottom of the cold end of the semiconductor cooling plate (6), and the first thermal conductor (702) has a plurality of fins; A thermal insulation arc plate (703), wherein the thermal insulation arc plate (703) is arranged at the inlet end of the cooling frame (701), and the thermal insulation arc plate (703) is used to reduce the effective area of ​​the inlet of the cooling frame (701); A first heat conduction plate (704), the first heat conduction plate (704) being arranged at an end of the heat-insulating arc-shaped plate (703); A second heat conduction plate (705), the second heat conduction plate (705) being arranged on the inner side surface of the heat insulating arc plate (703); a third heat conducting plate (706), the third heat conducting plate (706) being arranged between the first heat conducting plate (704) and the second heat conducting plate (705), and being at an equal distance from the first heat conducting plate (704) and the second heat conducting plate (705); a guide portion (7061) being arranged on a lower end surface of the third heat conducting plate (706), the guide portion (7061) being used to guide air flow to two outlets of the cooling frame (701); the first heat conducting plate (704), the second heat conducting plate (705) and the third heat conducting plate (706) all having an inclination angle of 1-5 degrees; the first heat conducting plate (704), the second heat conducting plate (705) and the third heat conducting plate (706) and the fins of the first heat conductor (702) are arranged in a staggered manner; An outer row pipe group (707), wherein the outer row pipe group (707) is arranged at two outlet ends of the cooling frame (701).

2. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: The outer pipe group (707) includes: Two special-shaped transfer tubes (7071), the special-shaped transfer tubes (7071) being respectively arranged at two outlet ends of the cooling frame (701); A first outer tube (7072), the first outer tube (7072) being connected to one of the special-shaped transfer tubes (7071), and a first side opening (7073) for accommodating a CPU portion (3) being provided on a side surface of the first outer tube (7072); A second outer tube (7074), the second outer tube (7074) is connected to another special-shaped adapter tube (7071), and a second side opening (7075) for accommodating a graphics card portion (4) is provided on a side surface of the second outer tube (7074).

3. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: The cooling frame (701) is also provided with a humidity isolation structure (8); The humidity isolation structure (8) comprises: A first waterproof and breathable membrane (801), the first waterproof and breathable membrane (801) being arranged at the inlet end of the cooling frame (701) and located outside the thermal insulation arc plate (703); A fixed ring plate (802), the fixed ring plate (802) being arranged in two outlets of the cooling frame (701), a circulation groove (803) being provided on the upper end surface of the fixed ring plate (802), the bottom of the circulation groove (803) being provided with an opening, an annular fixing groove (804) being provided on the inner side of the circulation groove (803), a raised mesh plate (805) being provided on the inner side of the annular fixing groove (804), a second waterproof and breathable membrane (806) being provided on the upper end surface of the raised mesh plate (805), and an edge of the second waterproof and breathable membrane (806) being placed in the annular fixing groove (804); A fixing ring (807), the fixing ring (807) being pressed onto the portion of the second waterproof breathable membrane (806) located in the annular fixing groove (804); a collecting bottle (808), the collecting bottle (808) being arranged between two outlet ends of the cooling frame (701) and located at the lower end of the circulation groove (803); two connecting pipes (809) being arranged on the top of the collecting bottle (808); the connecting pipes (809) being used for communication between the circulation groove (803) and the collecting bottle (808); the collecting bottle (808) being open at the bottom; and a bottle cap (810) being threadedly connected to the bottom of the collecting bottle (808); A flow increasing fan (811), wherein the flow increasing fan (811) is arranged at the lower end of the fixed ring plate (802).

4. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: The hot end of the semiconductor refrigeration sheet (6) is provided with a water cooling structure (9); The water cooling structure (9) comprises: A second heat conductor (901), the second heat conductor (901) being arranged in close contact with the hot end of the semiconductor cooling plate (6), the second heat conductor (901) having a plurality of arc-shaped fins, and a centrifugal impeller (902) being rotatably arranged at the central portion of the arc-shaped fins of the second heat conductor (901); A water-cooling shell (903), the water-cooling shell (903) being arranged outside the second heat conductor (901), the interior of the water-cooling shell (903) being filled with cooling liquid, and the interior of the water-cooling shell (903) being divided into a discharge part and a discharge part by a partition (904); A driving motor (905), wherein the driving motor (905) is fixedly disposed on the water-cooling housing (903), and an output end of the driving motor (905) is connected to the centrifugal impeller (902); A cold discharge mechanism (906) is arranged inside the water-cooling housing (903) and is located at an opposite end of the second heat conductor (901); the cold discharge mechanism (906) is used to conduct heat of the cooling liquid.

5. The internal heat dissipation structure of a computer host according to claim 4, characterized in that: The cooling mechanism (906) comprises: A cold row body (9061), the cold row body (9061) being arranged at the opposite end of the second heat conductor (901), a portion of the cold row body (9061) being located inside the water-cooling housing (903), and another portion of the cold row body (9061) being located outside the water-cooling housing (903); A heat dissipation fan (9062), wherein the heat dissipation fan (9062) is fixedly arranged at the upper end of the radiator body (9061) located outside the water-cooling shell (903).

6. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: A support assembly (10) is provided on the outer side of the outer row tube group (707); The support assembly (10) comprises: A plurality of movable vertical rods (1001), wherein the movable vertical rods (1001) are fixedly arranged at the lower end of the thermal insulation board (5), the side surfaces of the movable vertical rods (1001) are respectively fixedly connected to the first outer row of pipes (7072) and the second outer row of pipes (7074) via fixed rods, and a pulley (1002) is arranged at the bottom of the movable vertical rods (1001); A plurality of movable plates (1003) are arranged at the bottom of the chassis (1), and the movable plates (1003) are movably connected to the pulley (1002) by providing a sliding groove on the movable plates (1003).

7. The internal heat dissipation structure of a computer host according to claim 1, characterized in that: A positioning block (11) is provided at the upper end of the main board portion (2), a convex portion (12) is provided at the lower end surface of the positioning block (11), and a concave portion (13) matching the convex portion (12) is provided at the upper end surface of the thermal insulation board (5).

8. The internal heat dissipation structure of a computer host according to claim 2, characterized in that: A thermal insulation interlayer (14) is provided in the inner side walls of the first outer row pipes (7072), the second outer row pipes (7074) and the cooling frame (701).

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