Display panel and display device

Abstract

The invention provides a display panel and a display device.The display panel comprises a display part, a bending part and a binding part which are connected in sequence, and the binding part is located on the side away from the light emitting direction of the display part and connected with the display part through the bending part; a supporting part is arranged between the display part and the binding part, and the supporting part is respectively bonded with a first surface, close to the binding part, of the display part and a second surface, close to the display part, of the binding part; the supporting part comprises a double-sided adhesive layer structure and a supporting structure which are sequentially stacked on the second surface of the binding part, and the double-sided adhesive layer structure comprises a first adhesive layer, a heat dissipation supporting layer and a second adhesive layer which are sequentially stacked on the second surface of the binding part; the surface of the heat dissipation supporting layer is provided with a plurality of first groove bodies facing the first adhesive layer and a plurality of second groove bodies facing the second adhesive layer. According to the technical scheme provided by the invention, the pressure-sensitive adhesive layer and the special supporting structure are matched with each other, so that the pressure generated by external extrusion on the integrated circuit module in the display panel can be absorbed and dispersed, and meanwhile, the situation that the integrated circuit module is peeled off and falls off when the supporting part is reversely folded on the panel is avoided; and the overall compression resistance of the bending area of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In the process of preparing the display module, it is necessary to sequentially bond the supporting structure layer, the back plate layer, the display panel, the polarizing layer, the cover plate layer and other structures. For example, Figure 1 A schematic diagram of a cross-sectional structure of a display panel is shown. Figure 1 As shown, the display panel includes a folded binding portion 001, a support structure 002, and a connection structure 003 for connecting the binding portion 001 and the support structure 002. An integrated circuit module 004 is disposed on the surface of the folded binding portion 001. In order to ensure the integration stability of the integrated circuit module 004, the connection structure 003 is required to stably connect the binding portion 001 and the support structure 002, and also provide certain support for the integrated circuit module 004.

[0003] like Figure 1 As shown in the figure, the connection structure 003 is configured as a double-sided adhesive layer structure, specifically including a first pressure-sensitive adhesive layer 0031, a support layer 0032 and a second pressure-sensitive adhesive layer 0033, wherein the first adhesive layer 0031 and the second adhesive layer 0032 can be prepared by using a pressure-sensitive adhesive (PSA), and the support layer 0032 can be prepared by using a polyethylene terephthalate (PET) material layer. Considering that the integrated circuit module is arranged on the back of the display panel after being folded back, the following is used: Figure 1 The connection structure 003 shown supports and connects the binding part 001 and the integrated circuit module 004, and its adhesive performance is weak, which is prone to peeling and falling off. At the same time, the structure of the composite material of pressure-sensitive adhesive and polyethylene terephthalate material layer is soft in material itself and has poor structural rigidity, making it difficult to provide necessary support for the integrated circuit module 004, thereby weakening the anti-extrusion characteristics of the integrated circuit module 004.

[0004] In addition, considering that an integrated circuit module is provided at the folded binding portion of the display panel, and the integrated circuit module may generate heat and accumulate heat during use, the accumulation of heat will also affect the overall stability of the display panel. Summary of the invention

[0005] In response to the problems raised in the background technology, the purpose of the present disclosure is to provide a display panel and a display device, which can absorb and disperse the pressure generated by external extrusion on the integrated circuit module in the display panel through the mutual coordination of the adhesive layer and the special supporting structure provided by the present disclosure, thereby improving the overall compressive resistance of the bending area of ​​the display panel.

[0006] Specifically, a first aspect of the present disclosure provides a display panel, the display panel comprising a display portion, a bending portion and a binding portion connected in sequence, the binding portion being located on a side away from a light emitting direction of the display portion and connected to the display portion through the bending portion;

[0007] A supporting portion is provided between the display portion and the binding portion, and the supporting portion is respectively bonded to a first surface of the display portion close to the binding portion and a second surface of the binding portion close to the display portion;

[0008] The supporting part includes a double-sided adhesive layer structure and a supporting structure stacked in sequence on the second surface of the binding part. The double-sided adhesive layer structure includes a first adhesive layer, a heat dissipation support layer and a second adhesive layer stacked in sequence on the second surface of the binding part. The surface of the heat dissipation support layer has a plurality of first grooves facing the first adhesive layer and a plurality of second grooves facing the second adhesive layer.

[0009] In a possible implementation of the first aspect above, the heat dissipation support layer includes a copper sheet layer.

[0010] In a possible implementation of the first aspect above, materials of the first adhesive layer and the second adhesive layer include pressure-sensitive adhesive.

[0011] In a possible implementation of the first aspect, the heat dissipation support layer is a plate-shaped structure, and a plurality of first grooves uniformly distributed along a first direction are provided on a third surface of the plate-shaped structure close to the first adhesive layer, and a plurality of second grooves uniformly distributed along the first direction are provided on a fourth surface close to the second adhesive layer, and the first direction is perpendicular to a thickness direction of the display panel;

[0012] In the first direction, the projection of the first slot body on the plane where the plate-shaped structure is located is alternately spaced with the projection of the second slot body on the plane where the plate-shaped structure is located.

[0013] In a possible implementation of the first aspect, the heat dissipation support layer is a stacked buffer structure, and a cross section of the stacked buffer structure in a thickness direction of the display panel is a plurality of V-shaped structures connected in sequence;

[0014] The V-shaped structure forms a plurality of first grooves with openings facing the first adhesive layer and a plurality of second grooves with openings facing the second adhesive layer. The first grooves and the second grooves are alternately spaced in a first direction perpendicular to the thickness direction of the display panel.

[0015] In a possible implementation of the first aspect, the heat dissipation support layer is a cylindrical stacked buffer structure, and a plurality of first grooves uniformly distributed along a first direction are provided on a side of the cylindrical stacked buffer structure facing the first adhesive layer, and a plurality of second grooves uniformly distributed along the first direction are provided on a side of the cylindrical stacked buffer structure facing the second adhesive layer, and the first direction is perpendicular to a thickness direction of the display panel;

[0016] In the first direction, the projection of the first slot body on the plane where the binding portion is located is alternately spaced from the projection of the second slot body on the plane where the binding portion is located.

[0017] In a possible implementation of the first aspect above, the first slot body and the second slot body have the same shape.

[0018] In a possible implementation of the first aspect, the groove depth of the first groove body and / or the second groove body is in the interval [30um, 50um];

[0019] The spacing distance between the first slots is in the interval [0.1mm, 1mm];

[0020] The spacing distance between the second slots is in the interval [0.1 mm, 1 mm].

[0021] In a possible implementation of the first aspect, the support structure is bonded to the first surface of the display portion close to the binding portion through a pressure-sensitive adhesive layer or an adhesive structure having the same structure as the double-sided adhesive layer structure.

[0022] A second aspect of the present disclosure provides a display device, which includes the display panel provided by the first aspect.

[0023] Compared with the background technology, the present invention has the following beneficial effects:

[0024] In the technical solution provided by the present disclosure, a composite structure including a glue layer and a special support structure is provided. By arranging a plurality of grooves on the surface of the special support structure, the contact area between the surface of the support structure and the glue layer can be increased, and the pressure generated by the external extrusion of the integrated circuit module in the display panel can be absorbed and dispersed. At the same time, the material selection of the support structure can also help the heat dissipation of the integrated circuit module. The solution provided by the present disclosure can absorb and disperse the pressure generated by the external extrusion of the integrated circuit module in the display panel through the mutual coordination of the glue layer and the support structure, and at the same time avoid the peeling and falling of the integrated circuit module in the support part during the panel folding process, thereby improving the overall compressive performance of the bending area of ​​the display panel, and has a popularizable value. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Other features, objects and advantages of the present disclosure will become more apparent from a reading of the detailed description of non-limiting embodiments made with reference to the following accompanying drawings.

[0026] Figure 1 According to the prior art, a schematic cross-sectional structure diagram of a display module is shown.

[0027] Figure 2 According to an embodiment of the present disclosure, a schematic cross-sectional structure diagram of a display module is shown.

[0028] Figure 3 According to an embodiment of the present disclosure, a partial cross-sectional schematic diagram of an integrated circuit module arrangement region in a display panel is shown.

[0029] Figure 4 According to an embodiment of the present disclosure, a partial cross-sectional schematic diagram of an integrated circuit module arrangement region in another display panel is shown.

[0030] Figure 5 According to an embodiment of the present disclosure, a partial cross-sectional schematic diagram of an integrated circuit module arrangement region in another display panel is shown. DETAILED DESCRIPTION

[0031] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in the present disclosure. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in the present disclosure can also be modified or changed in various ways according to different viewpoints and application systems without departing from the spirit of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0032] The following is a detailed description of the embodiments of the present disclosure with reference to the accompanying drawings so that those skilled in the art can easily implement the present disclosure. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.

[0033] In the representations of the present disclosure, the reference terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" and the like mean that the specific features, structures, materials, or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials, or characteristics represented may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples represented in the present disclosure and the features of different embodiments or examples, unless they are mutually contradictory.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In order to clearly describe the present disclosure, components not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.

[0036] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.

[0037] When a device is said to be "on" another device, it may be directly on the other device, but there may also be other devices between it. In contrast, when a device is said to be "directly" on another device, there are no other devices between it.

[0038] Although the terms first, second, etc. are used to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0039] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present disclosure. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0040] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which the present disclosure belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with the content of relevant technical literature and current disclosures, and unless defined, shall not be overly interpreted as ideal or very formal meanings.

[0041] Based on the description in the background technology, it can be understood that in order to overcome the problems raised in the background technology, the present disclosure provides a display panel and a display device, which can absorb and disperse the pressure generated by external extrusion of the integrated circuit module in the display panel through the mutual coordination between the glue layer and the special supporting structure provided by the present disclosure, thereby effectively improving the overall compressive resistance of the bending area of ​​the display panel.

[0042] Specifically, in some embodiments of the present disclosure, Figure 2 A schematic diagram of a cross-sectional structure of a display panel is shown. Figure 2 As shown, the display panel includes a display portion 100, a bending portion 200 and a binding portion 300 connected in sequence, wherein the binding portion 300 is located on a side away from the light emitting direction of the display portion 100 and is connected to the display portion 100 through the bending portion 200. Figure 2 As shown in the figure, a support portion 400 is provided between the display portion 100 and the binding portion 300. The support portion 400 is respectively bonded to the first surface of the display portion 100 close to the binding portion 300 and the second surface of the binding portion 300 close to the display portion 100, so as to provide effective support to the binding portion 300 when the display panel is folded back. It can be understood that in order to achieve a narrow frame design, a portion of the display panel provided with the integrated circuit module 500 can be folded back to the back of the light-emitting side, that is, to form a Figure 2 The binding portion 300 is shown; in order to improve the overall stability of the display panel, the support portion 400 can be used to achieve a fixed connection between the binding portion 300 and the display portion 100, so that the binding portion 300 can still maintain a stable connection with the display portion 100 when it is folded back to a light emitting direction away from the display portion 100, thereby avoiding malfunctions of the display panel when it is squeezed by external force.

[0043] like Figure 2As shown, the support part 400 includes a double-sided adhesive layer structure 401 and a support structure 402 which are sequentially stacked on the second surface of the binding part 300. Specifically, the double-sided adhesive layer structure 401 includes a first adhesive layer 401a, a heat dissipation support layer 401b and a second adhesive layer 401c which are sequentially stacked on the second surface of the binding part. The surface of the heat dissipation support layer 401b has a plurality of first grooves 401b1 facing the first adhesive layer 401a and a plurality of second grooves 401b2 facing the second adhesive layer 401c. Figure 1 and Figure 2 It can be seen from the display panel shown that, compared with the composite structure of the pressure-sensitive adhesive layer and the polyethylene terephthalate material layer mentioned in the background technology, a plurality of first grooves 401b1 and a plurality of second grooves 401b2 are arranged on the upper and lower surfaces of the heat dissipation support layer 401b, thereby increasing the bonding area between the heat dissipation support layer 401b and the first adhesive layer 401a and the second adhesive layer 401c. At the same time, a material with stronger structural strength can be selected to prepare the heat dissipation support layer 401b, so that the double-sided adhesive layer structure 401 provided in the present disclosure has stronger bonding stability and pressure resistance.

[0044] In some embodiments of the present disclosure, it can be understood that since functional devices such as integrated circuits are on the side of the binding portion 300 away from the display portion 100, in order to avoid heat accumulation in these functional devices during use, a corresponding heat dissipation support layer 401b can be provided at the corresponding position where the integrated circuits and other functional devices are provided, so as to share part of the heat dissipation function while providing effective support.

[0045] In the above embodiment, the support structure 402 can be prepared using conventional support materials, such as stainless steel plates and other materials with strong structural rigidity and better pressure resistance, which is not limited here; the connection between the support structure 402 and the display unit 100 can be achieved by bonding with colloids such as pressure-sensitive adhesive or heat-sensitive adhesive, which is also not limited here.

[0046] It is understandable that in Figure 2 In the display panel structure shown, the problem raised in the background technology can be overcome by setting the double-sided adhesive layer structure 401. The specific setting of the double-sided adhesive layer structure 401 in the display panel will be further explained and illustrated below in combination with the specific implementation of the above embodiment:

[0047] In the above embodiment, further, the heat dissipation support layer 401b can be configured as a copper sheet layer. Compared with the composite structure of the pressure-sensitive adhesive layer and the polyethylene terephthalate material layer (PET) mentioned in the background technology, the use of copper material as the preparation material of the heat dissipation support layer 401b can provide structural rigidity while providing certain heat dissipation support for the integrated circuit module arranged on the surface of the binding part 300, thereby increasing the heat dissipation effect of the integrated circuit module. Those skilled in the art can also select other suitable metal materials or non-metal materials to configure the heat dissipation support layer 401b according to actual needs, which is not limited here.

[0048] In the above embodiment, correspondingly, the first adhesive layer 401a and the second adhesive layer 401c can be configured as pressure-sensitive adhesive layers (PSA), which can achieve a fastening connection between the film layers inside the double-sided adhesive layer structure 401 and a fastening connection between the support structure 402 and the binding part 300 during the film layer stacking process. Those skilled in the art can also select other suitable adhesive layer materials for configuration according to actual needs, which is not limited here.

[0049] It can be understood that, by setting the first groove body 401b1 and the second groove body 401b2 on the surface of the heat dissipation support layer 401b, the bonding area between the heat dissipation support layer 401b and the first adhesive layer 401a and the second adhesive layer 401c can be increased, so that the bonding between the heat dissipation support layer 401b and the first adhesive layer 401a and the second adhesive layer 401c is more firmly secured, thereby preventing the setting area of ​​the integrated circuit module from being separated and peeled off during the folding process of the binding part 300. The specific setting structure of the heat dissipation support layer 401b will be further described below in conjunction with the specific embodiments of the present disclosure:

[0050] In the first specific embodiment of the present disclosure, Figure 3 A partial cross-sectional schematic diagram of an integrated circuit module arrangement area in a display panel is shown. Figure 3 As shown in the figure, in the setting area corresponding to the integrated circuit module 500, the binding part 300, the first adhesive layer 401a, the heat dissipation support layer 401b and the second adhesive layer 401c are stacked in sequence, wherein the heat dissipation support layer 401b is a plate-shaped structure, and the plate-shaped structure is provided with a plurality of first grooves 401b1 uniformly distributed along the first direction on the third surface close to the first adhesive layer 401a, and a plurality of second grooves 401b2 uniformly distributed along the first direction on the fourth surface close to the second adhesive layer, wherein the first direction is perpendicular to the thickness direction of the display panel. Figure 3It can be seen from the first specific embodiment shown that the first groove body 401b1 and the second groove body 401b2 are configured to have the same shape, and their cross-sectional shapes in the film thickness direction are both semi-elliptical, which can be formed by laser etching the surface of the plate-shaped structure and other processing methods. Those skilled in the art can set the groove cross-sectional shape of the first groove body 401b1 and the second groove body 401b2 in the film thickness direction to other suitable shapes such as rectangle, V-shape, etc. according to actual needs, and can also select a suitable groove preparation method according to actual needs, which is not limited here.

[0051] In the first specific embodiment above, if Figure 3 As shown, the projection of the first groove body 401b1 on the plane where the binding part 300 is located is alternately spaced with the projection of the second groove body 401b2 on the plane where the binding part 300 is located, that is, in the first direction, the first groove body 401b1 and the second groove body 401b2 are alternately spaced. The above arrangement can increase the bonding contact area between the heat dissipation support layer 401b and the first adhesive layer 401a and the second adhesive layer 401b, while ensuring the structural rigidity of the heat dissipation support layer 401b itself, and can absorb and disperse the pressure generated by the external extrusion of the integrated circuit module 500, and provide necessary structural support for the integrated circuit module 500. In the above-mentioned first specific embodiment, the spacing distance between two adjacent first grooves 401b1 is configured to be in the interval [0.1mm, 1mm], and the spacing distance between two adjacent second grooves 401b2 is also configured to be in the interval [0.1mm, 1mm]. Since the first groove 401b1 and the second groove 401b2 are configured to be the same shape, the groove depth is configured to be in the interval [30um, 50um]. The above-mentioned parameter settings are designed according to the actual product needs of the display panel. Those skilled in the art can also choose other groove setting parameters according to actual needs, which are not limited here. In the specific preparation process, during the preparation of the first adhesive layer 401a, the second adhesive layer 401c and the heat dissipation support layer 401b, the pressure-sensitive adhesive can be injected into the first groove 401b1 and the second groove 401b2 by dispensing. The thickened colloid part of the first adhesive layer 401a and the second adhesive layer 401c can also disperse and absorb the pressure generated by the external extrusion of the integrated circuit module 500.

[0052] In the second specific embodiment of the present disclosure, Figure 4 FIG. 4 is a partial cross-sectional schematic diagram of another display panel in which an integrated circuit module is disposed. Different from the heat dissipation support layer 401b in a plate-shaped structure provided in the first specific embodiment, the heat dissipation support layer 401b in the second specific embodiment is in a Figure 4The stacked buffer structure shown, and the cross-section of the stacked buffer structure in the thickness direction of the display panel is a plurality of V-shaped structures connected in sequence, these V-shaped structures form a plurality of first slots 401b1 with openings facing the first adhesive layer 401a and a plurality of second slots 401b2 with openings facing the second adhesive layer 401c, the first slots 401b1 and the second slots 401b2 are alternately spaced in the first direction, wherein the first direction is perpendicular to the thickness direction of the display panel. It can be understood that the heat dissipation support layer 401b with the stacked buffer structure can better absorb and disperse the pressure generated by the external extrusion of the integrated circuit module 500, and provide the necessary structural support for the integrated circuit module 500. In the specific preparation process, during the preparation of the first adhesive layer 401a, the second adhesive layer 401c and the heat dissipation support layer 401b, the pressure-sensitive adhesive can be injected into the stacked buffer structure by dispensing, and the colloid thickening part of the first adhesive layer 401a and the second adhesive layer 401c can also disperse and absorb the pressure generated by the external extrusion of the integrated circuit module 500.

[0053] In the above second specific embodiment, the spacing distance between two adjacent first slots 401b1 can be configured to be in the interval [0.1mm, 1mm], and the spacing distance between two adjacent second slots 401b2 can also be configured to be in the interval [0.1mm, 1mm]. Figure 4 As shown, the first groove body 401b1 and the second groove body 401b2 can be configured to have the same shape, and the groove body depth is configured to be in the interval [30um, 50um]. Those skilled in the art can also configure the setting parameters of the first groove body 401b1 and the second groove body 401b2 according to actual needs, which will not be repeated here.

[0054] In the third specific embodiment of the present disclosure, Figure 5 FIG. 4 is a partial cross-sectional schematic diagram of another display panel in which an integrated circuit module is arranged. Different from the structural arrangement of the heat dissipation support layer 401b provided in the first and second specific embodiments, the heat dissipation support layer 401b provided in the third specific embodiment is Figure 5The cylindrical stacking buffer structure shown in the figure is provided with a plurality of first grooves 401b1 uniformly distributed along the first direction on the side of the cylindrical stacking buffer structure facing the first adhesive layer 401a, and a plurality of second grooves 401b2 uniformly distributed along the first direction on the side facing the second adhesive layer 401b, wherein the first direction is perpendicular to the thickness direction of the display panel. It can be understood that the heat dissipation support layer 401b using the cylindrical stacking buffer structure can also better absorb and disperse the pressure generated by the external extrusion of the integrated circuit module 500, and provide the necessary structural support for the integrated circuit module 500. In the specific preparation process, during the preparation of the first adhesive layer 401a, the second adhesive layer 401c and the heat dissipation support layer 401b, the pressure-sensitive adhesive can be injected into the grooves formed by the cylindrical stacking buffer structure by dispensing, and the colloid thickening part of the first adhesive layer 401a and the second adhesive layer 401c can also disperse and absorb the pressure generated by the external extrusion of the integrated circuit module 500.

[0055] In the above second specific embodiment, the spacing distance between two adjacent first slots 401b1 can be configured to be in the interval [0.1mm, 1mm], and the spacing distance between two adjacent second slots 401b2 can also be configured to be in the interval [0.1mm, 1mm]. Figure 5 As shown, the first groove body 401b1 and the second groove body 401b2 can be configured to have the same shape, and the groove body depth is configured to be in the interval [30um, 50um]. Those skilled in the art can also configure the setting parameters of the first groove body 401b1 and the second groove body 401b2 according to actual needs, which will not be repeated here.

[0056] In some embodiments of the present disclosure, a display device is further provided. The display device includes the display panel provided by the aforementioned embodiment, which will not be described in detail here.

[0057] In summary, in the technical solution provided by the present disclosure, a composite structure including an adhesive layer and a special support structure is provided. By arranging a plurality of grooves on the surface of the special support structure, the contact area between the surface of the support structure and the adhesive layer can be increased, and the pressure generated by the external extrusion of the integrated circuit module in the display panel can be absorbed and dispersed. At the same time, the material selection of the support structure can also help the heat dissipation of the integrated circuit module. The solution provided by the present disclosure can absorb and disperse the pressure generated by the external extrusion of the integrated circuit module in the display panel through the mutual coordination of the adhesive layer and the support structure, and at the same time avoid the peeling and falling of the integrated circuit module in the support part during the panel folding process, thereby improving the overall compressive performance of the bending area of ​​the display panel, and has a popularizable value.

[0058] The above contents are further detailed descriptions of the present disclosure in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present disclosure is limited to these descriptions. For ordinary technicians in the technical field to which the present disclosure belongs, several simple deductions or substitutions can be made without departing from the concept of the present disclosure, which should be regarded as falling within the scope of protection of the present disclosure.

Claims

1. A display panel, characterized in that: The display panel comprises a display portion, a bending portion and a binding portion which are connected in sequence, wherein the binding portion is located at a side away from the light emitting direction of the display portion and is connected to the display portion through the bending portion; A supporting portion is provided between the display portion and the binding portion, and the supporting portion is respectively bonded to a first surface of the display portion close to the binding portion and a second surface of the binding portion close to the display portion; The supporting part includes a double-sided adhesive layer structure and a supporting structure stacked in sequence on the second surface of the binding part. The double-sided adhesive layer structure includes a first adhesive layer, a heat dissipation support layer and a second adhesive layer stacked in sequence on the second surface of the binding part. The surface of the heat dissipation support layer has a plurality of first grooves facing the first adhesive layer and a plurality of second grooves facing the second adhesive layer.

2. The display panel according to claim 1, wherein: The heat dissipation support layer includes a copper sheet layer.

3. The display panel according to claim 1, wherein: The materials of the first adhesive layer and the second adhesive layer include pressure-sensitive adhesive.

4. The display panel according to claim 1, wherein: The heat dissipation support layer is a plate-shaped structure, and the plate-shaped structure is provided with a plurality of the first grooves evenly distributed along a first direction on a third surface close to the first adhesive layer, and a plurality of the second grooves evenly distributed along the first direction on a fourth surface close to the second adhesive layer, and the first direction is perpendicular to the thickness direction of the display panel; In the first direction, the projection of the first slot body on the plane where the plate-shaped structure is located is alternately spaced from the projection of the second slot body on the plane where the plate-shaped structure is located.

5. The display panel according to claim 1, wherein: The heat dissipation support layer is a stacked buffer structure, and the cross-section of the stacked buffer structure in the thickness direction of the display panel is a plurality of V-shaped structures connected in sequence; The V-shaped structure forms a plurality of first grooves with openings facing the first adhesive layer and a plurality of second grooves with openings facing the second adhesive layer. The first grooves and the second grooves are alternately spaced in a first direction perpendicular to the thickness direction of the display panel.

6. The display panel according to claim 1, wherein: The heat dissipation support layer is a cylindrical stacked buffer structure, and a plurality of first grooves evenly distributed along a first direction are provided on a side of the cylindrical stacked buffer structure facing the first adhesive layer, and a plurality of second grooves evenly distributed along the first direction are provided on a side facing the second adhesive layer, and the first direction is perpendicular to the thickness direction of the display panel; In the first direction, the projection of the first groove body on the plane where the binding portion is located is alternately spaced from the projection of the second groove body on the plane where the binding portion is located.

7. The display panel according to any one of claims 4 to 6, characterized in that: The first slot body and the second slot body have the same shape.

8. The display panel according to any one of claims 4 to 6, characterized in that: The groove depth of the first groove body and / or the second groove body is in the interval [30um, 50um]; The spacing distance between the first slots is in the interval [0.1 mm, 1 mm]; The spacing distance between the second slots is in the interval [0.1 mm, 1 mm].

9. The display panel according to claim 1, wherein: The support structure is bonded to the first surface of the display part close to the binding part through a pressure-sensitive adhesive layer or an adhesive structure having the same structure as the double-sided adhesive layer.

10. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 9.

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