Ball planting equipment

Abstract

The invention provides ball planting equipment which comprises a glue brushing device used for brushing glue on ball planting point positions on the upper surface of a substrate and a ball laying device used for laying balls on the ball planting point positions on the upper surface of the substrate subjected to glue brushing. The glue brushing device and the ball laying device each comprise a supporting table, a supporting runner used for horizontally supporting the base plate, a vacuum suction table used for sucking the base plate on the supporting runner from the lower portion, and a net rack located on the left-right direction side of the supporting table. The first linear driving module and the executing mechanism are used for driving the supporting table to horizontally move to the position below the net rack in the left-right direction, and the transferring device is used for transferring the base plate between the runners. According to the invention, a jig in the prior art does not need to be used, only the specification of the net body on the net rack needs to be adjusted, implantation of solder balls with different sizes can be adapted, the application range is wide, and the cost is greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a bulb planting device. Background Art

[0002] In the field of precision machining and manufacturing (such as semiconductor manufacturing and processing), it is often necessary to perform ball implantation on a substrate.

[0003] In the prior art, the solder balls are first spread onto a jig having the same ball planting position as that of the substrate, and then the solder balls in the jig are transferred to the substrate for ball planting. This method is limited by the difficulty of jig processing and cannot implant solder balls with a diameter less than 150um. In addition, the cost of the jig is high, and each specification of the substrate requires a corresponding set of jigs, which greatly increases the cost. Summary of the invention

[0004] Based on this, in order to solve the above technical problems, a ball planting device is provided.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A bulb implanting device, characterized by comprising:

[0007] A glue-brushing device for brushing glue on the ball-planting points on the upper surface of the substrate and a ball-laying device for laying balls on the ball-planting points on the upper surface of the substrate after brushing glue, the glue-brushing device and the ball-laying device both include a support platform, a support channel for horizontally supporting the substrate, a vacuum suction table for sucking the substrate on the support channel at the bottom, a grid located on the left and right sides of the support platform, a first linear drive module for driving the support platform to move horizontally in the left and right directions to below the grid, and an actuator, the support platform is fixed on the first linear drive module, and the support channel and the vacuum suction table are fixed to the support platform via a first lifting module and a second lifting module, respectively. On the upper part, the supporting flow channel includes two side plates arranged at intervals on the left and right, the inner sides of the two side plates each have a supporting edge for lifting the substrate, the vacuum suction table is located between the two side plates, and its upper surface is initially lower than the supporting edge, the upper surface of the vacuum suction table has adsorption holes, the grid frame has a horizontal grid body, the actuator of the glue brushing device is a glue brushing mechanism, which includes a glue brushing head located above the grid body and a horizontal driving module for driving the glue brushing head to move horizontally, the actuator of the ball laying device is a ball laying mechanism, which includes a ball laying head located above the grid body and a horizontal driving module for driving the ball laying head to move horizontally;

[0008] A transfer device for transferring substrates between flow channels.

[0009] The present invention does not require the use of a jig as in the prior art, and only requires adjusting the specifications of the mesh body on the mesh frame to adapt to the implantation of solder balls of different sizes, has a wide range of applications, and greatly reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of the present invention;

[0011] Figure 2 It is a schematic diagram of the top view of the structure of the present invention;

[0012] Figure 3 It is a structural schematic diagram of the feed flow channel of the present invention;

[0013] Figure 4 It is a structural schematic diagram of the support flow channel and the horizontal adjustment mechanism of the ball laying device of the present invention;

[0014] Figure 5 It is a partial enlarged view of the side plate supporting the flow channel of the present invention;

[0015] Figure 6 It is a structural schematic diagram of a pressure plate of a ball laying device of the present invention;

[0016] Figure 7 It is a structural schematic diagram of the actuator of the glue brushing device of the present invention;

[0017] Figure 8 It is a structural schematic diagram of the actuator of the ball laying device of the present invention;

[0018] Fig. 9 It is a structural schematic diagram of the cleaning mechanism of the glue brushing device of the present invention;

[0019] Fig.10 It is a structural schematic diagram of the first collecting mechanism of the ball laying device of the present invention;

[0020] Fig.11 It is a structural schematic diagram of the second collecting mechanism of the ball laying device of the present invention;

[0021] Fig.12 is a schematic diagram of four transfer devices of the present invention;

[0022] Fig.13 It is a schematic structural diagram of the transfer device of the present invention;

[0023] Fig.14 This is a schematic diagram of the material jam detection principle of the transfer device of the present invention;

[0024] Fig.15 The figure is a schematic diagram of the principle of tautly laying balls in the net of the ball laying device of the present invention. DETAILED DESCRIPTION

[0025] The following will illustrate the implementation methods of the present invention in conjunction with the drawings in the specification. It should be noted that the implementation methods involved in this specification are not exhaustive and do not represent the only implementation methods of the present invention. The following corresponding embodiments are only for the purpose of clearly illustrating the invention content of the patent of the present invention, and are not intended to limit its implementation methods. For ordinary technicians in this field, different forms of changes and modifications can be made on the basis of the description of this embodiment. All obvious changes or modifications that belong to the technical concept and invention content of the present invention are also within the scope of protection of the present invention.

[0026] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a ball planting device, including a machine 1100, a feed channel 1200, a glue brushing device 1300, a transfer channel 1400, a ball laying device 1500, a discharge channel 1600 and four transfer devices 1700.

[0027] Among them, the feed channel 1200, the glue brushing device 1300, the transfer channel 1400, the ball laying device 1500, and the discharge channel 1600 are arranged on the machine 1100 from back to front (Y direction). There is a vertical mounting plate 1110 on the left side of the machine 1100, and four transfer devices 1700 are arranged on the right side of the mounting plate 1110.

[0028] like Figure 3 As shown, the feed channel 1200 has two support plates 1210 arranged at intervals on the left and right (X direction), and a transmission belt assembly 1220 is provided on the inner side of the support plate 1210 for substrate feeding. The transmission belt assemblies 1220 on the two support plates 1210 are synchronously driven by a first motor 1230. At the same time, the two support plates 1210 can adjust the spacing under the action of a second motor 1240 and a lead screw 1250, so as to adapt to substrates of different widths; in addition, the two support plates 1210 can also move forward and backward under the action of a cylinder 1260. It should be pointed out that the above structure is a conventional structure, so it is not described in detail.

[0029] The glue brushing device 1300 is used to brush glue on the ball planting points on the upper surface of the substrate, and the ball laying device 1500 is used to lay balls on the ball planting points on the upper surface of the substrate after brushing glue, wherein the glue refers to flux and solder paste, and the balls refer to solder balls.

[0030] The structures of the glue brushing device 1300 and the ball spreading device 1500 are basically the same. Taking the ball spreading device 1500 as an example, Figure 1 , Figure 2 and Figure 4As shown, it includes a support platform 1510, a support channel 1520, a vacuum suction table 1530, a pressing plate 1540, a detection mechanism 1550, a horizontal adjustment mechanism 1560, a frame 1570, a first linear drive module 1580 and an actuator 1590.

[0031] The support platform 1510 is disposed on the horizontal adjustment mechanism 1560 and is initially located on the left side.

[0032] The supporting channel 1520 is used to horizontally support the substrate. Initially, its rear end and front end are respectively docked with the front end of the transfer channel 1400 and the rear end of the discharge channel 1600, while the supporting channel 1320 of the glue brushing device 1300 is initially docked with the front end of the feed channel 1200 and the rear end of the transfer channel 1400.

[0033] The supporting channel 1520 is fixed on the supporting platform 1510 through a first lifting module, and the supporting channel 1520 can be lifted and lowered by the first lifting module.

[0034] like Figure 4 and Figure 5 As shown, the supporting channel 1520 includes two side plates 1521 arranged at intervals on the left and right. The inner sides of the two side plates 1521 have a supporting edge 1521a for supporting the substrate and a retaining edge 1521b located above the supporting edge 1521a. The function of the retaining edge 1521b is to restrain the warped substrate. In order to facilitate the warped substrate to enter the supporting channel 1520, the rear end of the supporting edge 1521a has a slope 1521c that gradually rises from back to front to the same height as the main body of the supporting edge 1521a. The slope 1521c and the rear end of the retaining edge 1521b form a flared opening.

[0035] It should be pointed out that the top of the side panel 1521 has a plurality of adsorption holes arranged horizontally at intervals in the front-to-back direction for adsorbing the mesh, while for the supporting flow channel 1320 of the glue brushing device 1300, adsorption holes are not required to be set on the top of the side panel.

[0036] Similar to the two support plates 1210 of the feed channel 1200, the two side plates 1521 of the support channel 1520 can also adjust the spacing through a motor and a screw to adapt to substrates of different widths. This is a conventional technical means and will not be described in detail.

[0037] The vacuum suction table 1530 is used to suck the substrate on the supporting channel 1520 from below. It is located between the two side plates 1521 of the supporting channel 1520. The upper surface is initially lower than the supporting edge 1521a, and the upper surface has suction holes.

[0038] The vacuum suction table 1530 is fixed on the support table 1510 through a second lifting module, and the vacuum suction table 1530 can be lifted and lowered through the second lifting module.

[0039] The pressing plate 1540 is used to press down the substrate on the vacuum suction table 1530. It is located on the right side of the support table 1510. The pressing plate 1540 is driven by the third lifting module 1541 to achieve lifting. The third lifting module 1541 is fixed on the crossbeam 1120 above the machine table 1100. Figure 6 .

[0040] The detection mechanism 1550 is used to visually detect whether the horizontal position of the substrate on the vacuum suction table 1530 deviates from the mesh on the grid frame 1570 . It is fixed on the beam 1120 and is located on the right side of the pressure plate 1540 .

[0041] In this embodiment, the detection mechanism 1550 has two detection cameras, and the two cameras can be moved by linear drive modules respectively, so that the marking points on the substrate can be detected at the same time, or the marking points on the mesh can be detected at the same time to determine whether there is any deviation on the substrate.

[0042] The horizontal adjustment mechanism 1560 is used to adjust the horizontal position of the substrate on the vacuum suction table 1530 when there is a deviation in the horizontal position of the substrate. The horizontal adjustment mechanism 1560 is disposed on the first linear driving module 1580 .

[0043] Specifically, Figure 4 As shown, the horizontal adjustment mechanism 1560 includes a lower plate 1561, an upper plate 1562, a second linear drive module 1563 and a rotation drive module 1564. The lower plate 1561 is driven by the first linear drive module 1580 and slidingly cooperates with the first slide rail 1581a on the bottom plate 1581 of the first linear drive module 1580. The upper plate 1562 is driven by the second linear drive module 1563 to achieve horizontal movement forward and backward. The second linear drive module 1563 is fixed on the upper surface of the lower plate 1561, and the upper plate 1562 is slidingly cooperated with the second slide rail 1561a on the lower plate 1561. The rotation drive module 1564 can use a motor, which is fixed on the upper surface of the upper plate 1562, and the output shaft is fixed to the support platform 1510.

[0044] When the horizontal position of the substrate needs to be adjusted, the front and rear horizontal position of the support platform 1510 can be adjusted by the second linear drive module 1563 , and the horizontal angle of the support platform 1510 can be adjusted by the rotation drive module 1564 .

[0045] The grid frame 1570 is located on the right side of the detection mechanism 1550 , and can be fixed on the top of the machine platform 1100 through a support column. The grid frame 1570 has a horizontal grid body.

[0046] The first linear drive module 1580 is used to drive the support platform 1510 to move horizontally in the left and right directions, that is, to move from the initial left position to the right, and move to the bottom of the pressure plate 1540, the detection mechanism 1550 and the grid 1570 in sequence (adjusted to align with the grid body of the grid 1570).

[0047] For the glue brushing device 1300, its actuator 1390 is a glue brushing mechanism, such as Figure 7 As shown, the glue brushing mechanism includes a glue brush head 1391 located above the mesh body and a horizontal driving module 1392 for driving the glue brush head 1391 to move horizontally. The glue brush head 1391 is a commercially available product and its structure is not limited here. The glue brush head 1391 is connected to the horizontal driving module 1392. The horizontal driving module 1392 is a linear driving module in the front-to-back direction, which is fixed on the mesh frame 1570 and can realize the horizontal movement of the glue brush head 1391 in the front-to-back direction.

[0048] For the ball-laying device 1500, its actuator 1590 is a ball-laying mechanism, such as Figure 8 As shown, it includes a ball-laying head 1591 located above the mesh body and a horizontal driving module 1592 for driving the ball-laying head 1591 to move horizontally. The ball-laying head 1591 is a commercially available product and its structure is not limited here. The ball-laying head 1591 is connected to the horizontal driving module 1592. The horizontal driving module 1592 is composed of a linear driving module 1592a in the front-to-back direction and a linear driving module 1592b in the left-to-right direction. The linear driving module 1592a is fixed to the linear driving module 1592b through a transmission beam 1592c, and the linear driving module 1592b is fixed to the mesh frame 1570, thereby realizing the horizontal movement of the ball-laying head 1591 in the front-to-back direction and the left-to-right direction.

[0049] In addition, if Figure 7 As shown, the glue brushing device 1300 also has a cleaning mechanism 1399 for cleaning the residual glue on the back of the mesh. Fig. 9As shown, the cleaning mechanism 1399 includes a mounting base 1399a, a winding roller 1399b, an unwinding roller 1399c and a guide rod 1399d. The mounting base 1399a is arranged on the linear drive module, and can realize the horizontal movement of the cleaning mechanism 1399 in the front and rear directions. The mounting base 1399a has a mounting frame 1399f, and the winding roller 1399b, the unwinding roller 1399c and the guide rod 1399d are all arranged on the mounting frame 1399f. c is used to place the cleaning cloth roll, and the winding roller 1399b is driven by a motor. The cleaning cloth led out from the cleaning cloth roll is connected to the winding roller 1399b via a plurality of guide rods 1399d, and the cleaning cloth is tightened by the top block 1399e on the mounting frame at the highest point. During cleaning, driven by the linear drive module, the cleaning mechanism 1399 passes under the mesh body in the front-to-back direction, and the tightening surface of the cleaning cloth tightened by the top block 1399e just contacts the lower surface of the mesh body, removing the residual adhesive on the lower surface.

[0050] like Figure 8 As shown, the ball spreading device 1500 also has a first collecting mechanism 1598 for collecting residual solder balls on the back side of the mesh and a second collecting mechanism 1599 for collecting residual solder balls on the front side of the mesh.

[0051] like Fig.10 As shown, the first collecting mechanism 1598 includes a mounting base 1598a and a sticky roller 1598b. The mounting base 1598a is arranged on the linear drive module, so that the first collecting mechanism 1598 can be horizontally moved in the front-to-back direction. The mounting base 1598a is provided with a bearing frame 1598d. The peripheral surface of the sticky roller 1598b is sticky, and it is fixed on the bearing frame 1598d by rotating back and forth through the bearing, wherein the bearing is fixed by a quick-release part 1598c, so that the sticky roller 1598b can be quickly replaced. When in use, driven by the linear drive module, the first collecting mechanism 1598 passes under the mesh body in the front-to-back direction, and the top of the sticky roller 1598b just contacts with the lower surface of the mesh body, and the sticky roller 1598b is rotated by itself under the action of friction force, thereby taking away the residual solder balls on the back of the mesh body.

[0052] like Fig.11As shown, the second collecting mechanism 1599 includes a fixed beam 1599a in the front-to-back direction, a vacuum chamber 1599b fixed on the fixed beam 1599a, a collecting chamber 1599c and a long strip slot-type suction nozzle 1599d. The fixed beam 1599a is located above the grid 1570 and is driven by a linear drive module to achieve horizontal movement above the grid. The linear drive module is fixed on the grid 1570. The vacuum chamber 1599b has two first interfaces 1599e, and the collecting chamber 1599c has two second interfaces 1599f and two third interfaces 1599g. The two first interfaces 1599e It is connected to the two third interfaces 1599g through pipelines, and the two second interfaces 1599f are connected to the vacuum equipment. The suction nozzle 1599d is a long box structure in the front-to-back direction, and its lower side is a suction port. The inner cavity of the suction nozzle 1599d is connected to the inner cavity of the vacuum chamber 1599b. When working, the vacuum equipment vacuums the inner cavity of the suction nozzle 1599d through the two second interfaces 1599f, the collection chamber 1599c, the two third interfaces 1599g, the two first interfaces 1599e, and the vacuum chamber 1599b, thereby sucking away the residual solder balls on the front side of the mesh. Finally, the solder balls are collected in the collection chamber 1599c.

[0053] The structures of the transfer channel 1400 and the discharge channel 1600 are the same as that of the feed channel 1200 and will not be described in detail here.

[0054] The above modules can all use pneumatic cylinders or electric cylinders.

[0055] like Figure 2 As shown, the four transfer devices 1700 are respectively used to push the substrate on the feed channel 1200 to the supporting channel 1320 of the glue brushing device 1300, push the substrate on the supporting channel 1320 of the glue brushing device 1300 to the transfer channel 1400, push the substrate on the transfer channel 1400 to the supporting channel 1520 of the ball laying device 1500, and push the substrate on the supporting channel 1520 of the ball laying device 1500 to the discharge channel 1600.

[0056] Among them, Fig.13 As shown, the transfer device 1700 includes a push plate 1710, a transmission arm 1720 and a driving mechanism.

[0057] The push plate 1710 includes a vertical plate 1711 and a horizontal plate 1712. The vertical plate 1711 is used to push the substrate horizontally forward at the rear side of the substrate on the flow channel. The upper end of the vertical plate 1711 is connected to the lower surface of the rear end of the horizontal plate 1712, and the upper surface of the rear end of the horizontal plate 1712 has a top seat 1713.

[0058] The transmission arm 1720 is used to drive the push plate 1710 to rise and fall and move horizontally in the front-to-back direction. The transmission arm 1720 is in the left-right direction, and the lower surface of its right end is fixed with the first plate 1721, and the upper surface of the right end of the first plate 1721 is connected to the second plate 1722.

[0059] The second plate 1722 is located above the horizontal plate 1712, and the two form a front-to-rear sliding fit through the combination of sliders and slide rails. An elastic self-recovering member 1740, such as a spring, is connected between the second plate 1722 and the horizontal plate 1712 in the front-to-rear horizontal direction, and the top seat 1713 just presses against the rear side of the second plate 1722.

[0060] The elastic self-restoring member 1740 plays a buffering role to avoid damaging the substrate when the push plate 1710 pushes the substrate.

[0061] The front end of the spring is connected to the first fixing pin 1722 a on the lower surface of the second plate 1722 , and the rear end of the spring is connected to the second fixing pin 1712 a on the right side of the transverse plate 1712 .

[0062] The driving mechanism is used to drive the transmission arm 1720 to move up and down and horizontally in the front and rear directions. Fig.13 As shown, it is composed of a lifting module 1731 and a linear module 1732 that drives the lifting module 1731 to move horizontally in the front and rear directions. The lifting module 1731 can be a cylinder or an electric cylinder, which is set on the linear module 1732 through a transmission plate 1733 and connected to the left end of the transmission arm 1720. At the same time, the transmission plate 1733 is slidably matched with the guide rail 1111 on the right side of the mounting plate 1110 of the machine table 1100. The linear module 1732 is a pulley assembly, which is set on the right side of the mounting plate 1110.

[0063] When the transfer device 1700 is working, under the action of the driving mechanism 1730, the push plate 1710 first moves to the upper rear side of the target substrate, then descends to align the front side of the vertical plate 1711 with the rear side of the target substrate, and then the push plate 1710 moves forward to push the target substrate.

[0064] In actual use, if the substrate is warped, it may get stuck during the pushing process. In order to detect the stuck material in time, Fig.14 As shown, a detection identification portion 1712b is provided in the middle of the left side of the horizontal plate 1712, and a sensor 1721a arranged in the left and right directions is embedded on the back of the first plate 1721 of the transmission arm 1720, and the sensor 1721a is used to detect the detection identification portion 1712b. When a material jam occurs, the push plate 1710 will slide backwards, and when the sensor 1721a cannot detect the identification portion 1712b, it means that a material jam has occurred.

[0065] During operation, the substrate first enters the feed channel 1200 , and the transfer device 1700 then moves the substrate to the support channel of the glue brushing device 1300 .

[0066] The vacuum suction table of the glue brushing device 1300 rises to lift up the substrate on the support flow channel. At the same time, the support table moves with the vacuum suction table to the bottom of the pressure plate. After the pressure plate 1340 presses the substrate, the vacuum suction table sucks the substrate. Then, the support table moves with the vacuum suction table to the bottom of the detection mechanism 1350 for detection. If the horizontal position of the substrate needs to be adjusted, it is adjusted by the horizontal adjustment mechanism.

[0067] Afterwards, the support table moves with the vacuum suction table to the bottom of the grid 1370, the vacuum suction table raises the substrate to a predetermined height, and the glue brushing mechanism applies glue.

[0068] After the glue application is completed, the support table returns to its original position with the vacuum suction table. After returning to its original position, the vacuum suction table descends to return the substrate to the supporting flow channel, and the transfer device 1700 moves the substrate to the transfer flow channel 1400.

[0069] When the ball-laying device 1500 is idle, the transfer device 1700 moves the substrate from the transfer channel 1400 to the supporting channel of the ball-laying device 1500 .

[0070] Then, the vacuum suction table of the ball laying device 1500 rises to lift up the substrate on the support flow channel, and at the same time, Figure 6 As shown, the support table moves with the vacuum suction table to the bottom of the pressure plate. After the pressure plate 1540 presses the substrate 2, the vacuum suction table sucks the substrate. Then, the support table moves with the vacuum suction table to the bottom of the detection mechanism 1550 for detection. If the horizontal position of the substrate needs to be adjusted, it is adjusted by the horizontal adjustment mechanism.

[0071] Afterwards, the support table moves with the vacuum suction table to the bottom of the grid frame 1570, and the support channel rises, and the mesh 1571 is sucked by the suction holes on the top of its side plate 1521. At the same time, the vacuum suction table lifts the substrate to press against the tension area 1571a formed by the mesh 1571 being sucked by the two side plates 1521 supporting the flow channel. Since the spacing between the two side plates 1521 supporting the flow channel is adapted to the left and right widths of the substrate, Fig.15 As shown, the width of the tensioning area 1571a is only slightly larger than the width of the substrate, so that the deformation amplitude of the tensioning area 1571a after being pushed up by the substrate is very small and will not affect the ball laying position.

[0072] Next, the ball-laying mechanism carries out ball-laying.

[0073] After the ball laying is completed, the support table returns to its original position with the vacuum suction table. After returning to its original position, the vacuum suction table descends to return the substrate to the supporting flow channel, and the transfer device 1700 moves the substrate to the discharge flow channel 1600.

[0074] As can be seen from the above, the ball implanting device provided in the embodiment of the present application does not need to use a fixture as in the prior art. It only needs to adjust the specifications of the mesh body on the grid to adapt to the implantation of solder balls of different sizes. It has a wide range of applications and greatly reduces costs.

[0075] Obviously, those skilled in the art should realize that the above embodiments are only used to illustrate the present invention, and are not used to limit the present invention. As long as they are within the spirit of the present invention, any changes and modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A bulb implanting device, characterized in that: include: A glue-brushing device for brushing glue on the ball-planting points on the upper surface of the substrate and a ball-laying device for laying balls on the ball-planting points on the upper surface of the substrate after brushing glue, the glue-brushing device and the ball-laying device both include a support platform, a support channel for horizontally supporting the substrate, a vacuum suction table for sucking the substrate on the support channel at the bottom, a grid located on the left and right sides of the support platform, a first linear drive module for driving the support platform to move horizontally in the left and right directions to below the grid, and an actuator, the support platform is fixed on the first linear drive module, and the support channel and the vacuum suction table are fixed to the support platform via a first lifting module and a second lifting module, respectively. On the upper part, the supporting flow channel includes two side plates arranged at intervals on the left and right, the inner sides of the two side plates each have a supporting edge for lifting the substrate, the vacuum suction table is located between the two side plates, and its upper surface is initially lower than the supporting edge, the upper surface of the vacuum suction table has adsorption holes, the grid frame has a horizontal grid body, the actuator of the glue brushing device is a glue brushing mechanism, which includes a glue brushing head located above the grid body and a horizontal driving module for driving the glue brushing head to move horizontally, the actuator of the ball laying device is a ball laying mechanism, which includes a ball laying head located above the grid body and a horizontal driving module for driving the ball laying head to move horizontally; A transfer device for transferring substrates between flow channels.

2. The bulb planting device according to claim 1, characterized in that: The glue brushing device and the ball laying device also include a pressing plate for pressing down the substrate located on the vacuum suction table and a third lifting module for driving the pressing plate, and the pressing plate is located between the support platform and the grid.

3. The bulb planting device according to claim 2, characterized in that: The glue brushing device and the ball laying device also include a detection mechanism for visually detecting whether the horizontal position of the substrate on the vacuum suction table deviates from the mesh body and a horizontal adjustment mechanism for adjusting the horizontal position of the substrate. The detection mechanism is located between the pressure plate and the mesh frame, the horizontal adjustment mechanism is arranged on the first linear drive module, and the support platform is fixed on the horizontal adjustment mechanism.

4. The bulb planting device according to claim 3, characterized in that: The horizontal adjustment mechanism includes a lower plate, an upper plate, a second linear drive module for driving the upper plate to move horizontally back and forth, and a rotation drive module for driving the support platform to rotate horizontally. The lower plate is driven by the first linear drive module, the second linear drive module is fixed to the lower plate, and the rotation drive module is fixed to the upper plate.

5. The bulb planting device according to claim 1, characterized in that: The inner side surface of the side plate supporting the flow channel also has a retaining edge located above the supporting edge, and the rear end of the supporting edge has a slope that gradually rises from the back to the front, and the slope and the rear end of the retaining edge form a flared opening.

6. The bulb planting device according to claim 1, characterized in that: The top surface of the side plate supporting the flow channel of the ball laying device is provided with adsorption holes for adsorbing the mesh body.

7. The bulb planting device according to claim 1, characterized in that: The glue brushing device also includes a cleaning mechanism for cleaning the residual glue on the back of the mesh, and the ball spreading device also includes a first collecting mechanism for collecting the residual solder balls on the back of the mesh and a second collecting mechanism for collecting the residual solder balls on the front of the mesh.

8. The bulb planting device according to claim 1, characterized in that: It also includes a feed channel, a transfer channel and a discharge channel. The feed channel, the supporting channel of the glue brushing device, the transfer channel, the supporting channel of the ball laying device and the discharge channel are arranged in sequence from the back to the front. The rear end and the front end of the supporting channel of the glue brushing device are initially connected with the front end of the feed channel and the rear end of the transfer channel, respectively. The rear end and the front end of the supporting channel of the ball laying device are initially connected with the front end of the transfer channel and the rear end of the discharge channel, respectively.

9. The bulb planting device according to claim 2, characterized in that: The transfer device includes a push plate for horizontally pushing the substrate forward at the rear side of the substrate located on the flow channel, a transmission arm for driving the push plate to rise and fall and move horizontally in the front-to-back direction, and a driving mechanism for driving the transmission arm to rise and fall and move horizontally in the front-to-back direction. The push plate and the transmission arm slide together horizontally in the front-to-back direction, and a horizontal elastic self-restoring part is connected between the two. The push plate has a detection identification part on the side surface in the left and right directions, and the transmission arm is provided with a sensor arranged along the left and right directions for detecting the identification part.

10. The bulb planting device according to claim 9, characterized in that: There are four transfer devices, which are respectively used to push the substrate on the feed flow channel to the supporting flow channel of the glue brushing device, push the substrate on the supporting flow channel of the glue brushing device to the transfer flow channel, push the substrate on the transfer flow channel to the supporting flow channel of the ball laying device, and push the substrate on the supporting flow channel of the ball laying device to the discharge flow channel.

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