Display backboard, backboard manufacturing method and display equipment

Abstract

The invention provides a display backboard, a backboard manufacturing method and display equipment. The display backboard comprises a substrate; the plurality of ICs are arranged on the substrate at intervals, and a pin of each IC is back to the substrate; the display layer is arranged on the IC, the display layer comprises a plurality of LEDs, and at least one LED is electrically connected with one IC through the pins. The pins of the IC are arranged back to the direction of the substrate, so that layered arrangement of the IC and the LED can be facilitated, the IC area does not need to be emptied when white oil is laid subsequently, and the backlight reflectivity is improved to a great extent; in addition, due to the fact that the LEDs and the IC are arranged in a layered mode, the LEDs are empty, and the light mixing effect between the LEDs is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display backplane, a backplane manufacturing method, and a display device. Background Art

[0002] At present, in the production process of COG (chip on glass) MLED backlight display panels, when the COB backplane of Micro LED or Mini LED is driven, it is necessary to use a Micro Driver IC or a channel in Micro Driver IC (subsequently Micro IC) for control. At present, the production of light boards requires IC to be mounted on the backplane, and the pins of the IC need to be bonded to the circuit. At this time, the pins of the IC are all facing the backplane; LED mounting will make the LED and IC on the same layer, so that when laying white oil, the IC area needs to be vacated, which will greatly affect the backlight reflectivity. On the other hand, the glue dispensing after LED mounting needs to consider the impact of IC on LED mixing, resulting in an increase in production processes and increased costs. In addition, Micro ICs are generally smaller in size, with smaller and more pins. In the process of binding ICs to the backplane, the process is complex, the precision requirements are high, and the yield is usually low. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the related art, the purpose of the present application is to provide a display backplane with a simple structure, a backplane manufacturing method and a display device to solve at least one of the above-mentioned problems.

[0004] In a first aspect, the present application provides a display backplane, the display backplane comprising:

[0005] substrate;

[0006] A plurality of ICs, wherein the plurality of ICs are arranged on the substrate at intervals, and a pin of each IC faces away from the substrate;

[0007] The display layer is arranged on the IC, and the display layer includes a plurality of LEDs, at least one of the LEDs is electrically connected to one of the ICs through the pins.

[0008] It can be understood that the present application arranges multiple ICs on the substrate at intervals, and makes the pins of each IC face away from the substrate, and then sets a display layer on the IC, so that each pin of the IC is electrically connected to each LED in the display layer, thereby driving the LED to emit light. In addition, by setting the IC pins facing away from the substrate, it is convenient to set the IC and LED in layers, so that when white oil is subsequently laid, there is no need to leave the IC area empty, which greatly improves the backlight reflectivity; in addition, since the LED and IC are set in layers, there is space between the LEDs, so as to improve the light mixing effect between the LEDs.

[0009] Optionally, the display layer includes:

[0010] A planarization layer, the planarization layer is laid on the plurality of the ICs, and the pins of each of the ICs are exposed outside the planarization layer;

[0011] A metal wiring layer, the metal wiring layer comprising a plurality of metal traces, each of the metal traces being arranged on the planarization layer, and each of the pins of the IC being connected to the metal traces;

[0012] The light-emitting layer includes a plurality of LEDs, and the positive / negative electrodes of each LED are bonded to the metal wiring, so that the positive / negative electrodes of the LED are connected to the pins of the IC through the metal wiring.

[0013] It can be understood that by setting a flat layer to fix the IC and bonding the IC to the LED through metal wiring, the process complexity of binding the IC to the backplane can be reduced, the IC binding accuracy can be improved, and thus the IC binding yield can be improved.

[0014] Optionally, the display layer further includes:

[0015] A white oil layer is filled between the LEDs.

[0016] It can be understood that by filling the white oil between the LEDs, the backlight reflectivity can be improved without leaving the IC area empty.

[0017] Optionally, the display layer further includes:

[0018] A packaging layer is laid on the white oil layer.

[0019] Optionally, the substrate is a glass substrate or a PCB substrate.

[0020] Optionally, the LED is a micro-LED or a mini-LED.

[0021] Second invention, the present application also provides a backplane manufacturing method, the backplane manufacturing method comprising:

[0022] providing a substrate;

[0023] Providing a plurality of ICs, and transferring each of the ICs to the substrate at a preset interval; wherein the pins of each of the ICs face away from the substrate;

[0024] Performing a planarization process on the plurality of ICs to form a planarization layer, wherein the pins of each IC are exposed outside the planarization layer;

[0025] Conducting metal routing on the planarization layer, wherein each of the metal routings is routed to a pin of the IC;

[0026] The positive / negative electrodes of the plurality of LEDs are bonded to different metal traces respectively, so as to connect the positive / negative electrodes of the LEDs to the pins of the IC through the metal traces.

[0027] It can be understood that the present application transfers each of the ICs to the substrate at a preset interval; wherein the pins of each of the ICs face away from the substrate, and performs a flattening process on the plurality of ICs to form a flattening layer, wherein the pins of each of the ICs are exposed outside the flattening layer. Then metal routing is performed on the flattening layer, and each of the metal routings is wired to the pins of the IC. Finally, the positive / negative electrodes of the plurality of LEDs are bonded to different metal routings respectively, so as to connect the positive / negative electrodes of the LEDs to the pins of the IC through the metal routings, thereby completing the backplane process. On the one hand, the present application reduces the process complexity of the IC binding process to the backplane, improves the IC binding accuracy, and thus improves the IC binding yield; on the other hand, since the IC and the LED are arranged in layers, it is no longer necessary to leave the IC area empty when laying white oil later, thereby greatly improving the backlight reflectivity; in addition, since the LED and the IC are arranged in layers, there is space between the LEDs, which can also improve the light mixing effect between the LEDs.

[0028] Optionally, the method further comprises:

[0029] White oil is spread between the LEDs to form a white oil layer.

[0030] Optionally, the method further comprises:

[0031] A packaging layer is formed on the white oil layer.

[0032] In a third aspect, the present application further provides a display device, comprising a display back panel as described in any one of the first aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of the planar structure of a back plate before whitening provided by the related technology;

[0034] Figure 2 A schematic diagram of the planar structure of a back plate after whitening provided in the related art;

[0035] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure;

[0036] Figure 4 A schematic diagram of the structure of a display backplane is provided for an embodiment of the present application;

[0037] Figure 5 for Figure 4 A schematic diagram of the cross-sectional structure of the display backplane shown;

[0038] Figure 6 A schematic flow chart of a backplane manufacturing method provided in another embodiment of the present application.

[0039] Figure numerals: 1-backplane; 2-IC; 3-LED; 100-display backplane; 110-substrate; 120-IC; 130-display layer; 131-LED; 132-planarization layer; 133-metal wiring; 135-white oil layer. DETAILED DESCRIPTION

[0040] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0041] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be used to implement. The serial numbers for the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present application, unless otherwise specified, include direct and indirect connections (couplings). The directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0042] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrally connected; it can be mechanically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. It should be noted that the terms "first", "second", etc. in the specification, claims, and drawings of this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include", "may include", "include", or "may include" used in this application indicate the existence of the corresponding functions, operations, elements, etc. disclosed, and do not limit one or more other functions, operations, elements, etc. In addition, the terms "include" or "include" indicate the existence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and do not exclude the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusions.

[0043] See also Figures 1 to 3 , for the relevant COB backplane design, there are many IC2 on the backplane 1, from Figure 3 From the top, the pins of IC2 and LED3 are facing downwards. Figure 1-2 As shown, when applying white oil, the white oil 4 needs to avoid the window areas of LED 3 and IC 2, which will greatly affect the backlight reflectivity; in addition, the back plate 1 is bound through the front of IC 2, which will result in a large window area of ​​IC 2, and since IC 2 is generally black, it will affect the light mixing effect of LED 3, thereby causing the optical effect to deteriorate; at the same time, when bonding the Micro IC, due to the small size of the IC, the bonding process requires ACF (Anisotropic Conductive Film) or solder paste to align it to the back plate 1, and then fix IC 2, resulting in a low bonding yield.

[0044] like Figure 4 As shown, the present application provides a display backplane 100 for solving the above technical problems; the display backplane 100 includes: a substrate 110 , a plurality of ICs 120 and a display layer 130 .

[0045] Optionally, the substrate 110 is a glass substrate or a PCB substrate.

[0046] The multiple ICs 120 are arranged on the substrate 110 at intervals, and the pins of each IC 120 face away from the substrate 110 .

[0047] It is understandable that the number of ICs 120 can be set according to actual needs, and this application does not make any specific limitation.

[0048] The display layer 130 is disposed on the IC 120 , and the display layer 130 includes a plurality of LEDs 131 , and at least one of the LEDs 131 is electrically connected to one of the ICs 120 through the pins.

[0049] That is, the display layer 130 can perform light display through the LED 131. In addition, the display layer 130 and the IC 120 are layered, that is, the display layer 130 and the IC 120 belong to different layers.

[0050] It should be noted that one IC 120 can control one LED 131 or multiple LEDs 131. Optionally, one IC 120 controls multiple LEDs 131, and the multiple LEDs 131 can be of the same color or different colors.

[0051] As an implementation manner, the display layer 130 includes: a planarization layer 132, a metal wiring layer and a light-emitting layer.

[0052] The planarization layer 132 is laid on the plurality of ICs 120 , and the pins of each IC 120 are exposed outside the planarization layer 132 .

[0053] It is understandable that the pins of the IC 120 may be just exposed outside the planarization layer 132 , that is, the exposed surface of the pins of the IC 120 is flush with the surface of the planarization layer 132 .

[0054] Of course, in other application scenarios, the pins of IC 120 may be higher than the height of the planarization layer 132 , which is not specifically limited here.

[0055] It is understandable that the present application fixes the IC 120 on the substrate 110 by providing the planarization layer 132 to prevent the IC 120 from being displaced or falling off.

[0056] The metal wiring layer includes a plurality of metal traces 133 , each of the metal traces 133 is arranged on the planarization layer 132 , and each pin of the IC 120 is connected to the metal trace 133 .

[0057] That is to say, in the present application, metal wiring 133 is directly performed on the planarization layer 132 by means of metal wiring, so that each pin of IC 120 can be bonded to the metal wiring 133, thereby changing the bonding method of the IC and reducing the complexity of the IC binding process.

[0058] It is understandable that the process of metal routing is an existing process and is not specifically limited in this application.

[0059] The light-emitting layer includes a plurality of LEDs 131 , and the positive / negative electrodes of each LED 131 are bonded to the metal wiring 133 , so that the positive / negative electrodes of the LED 131 are connected to the pins of the IC 120 through the metal wiring 133 .

[0060] It is understandable that the light-emitting layer is the layer where the LED 131 is located. The LED 131 is bonded by bonding the positive electrode of each LED 131 to a metal trace 133, and the negative electrode of each LED 131 to another metal trace 133. In addition, the LED 131 can be driven by the pin of IC 120.

[0061] As an implementation manner, the display layer 130 further includes: a white oil layer 135 , and the white oil layer 135 is filled between the LEDs 131 .

[0062] It is understandable that, since IC120 and LED131 are arranged in layers, there is no need to leave the area where IC120 is located empty when filling white oil between LED131, thereby avoiding the influence of the area where IC is located on the backlight reflection and improving the backlight reflectivity.

[0063] As an implementation manner, the display layer 130 further includes: an encapsulation layer, and the encapsulation layer is laid on the white oil layer 135 .

[0064] Optionally, the LED 131 is a micro-LED or a mini-LED.

[0065] As an implementation, the LED 131 may include three primary color LEDs, ie, a red LED, a green LED, and a blue LED.

[0066] Of course, in other application scenarios, LED 131 can be a single-color LED, such as LED 131 is any one of a red LED, a green LED, or a blue LED. LED 131 can also be a dual-color LED, such as LED 131 is any two of a red LED, a green LED, or a blue LED, and two LEDs of different colors are alternately arranged on the metal trace 133.

[0067] In this embodiment, the display backplane 100 provided in this embodiment arranges a plurality of IC120 on a substrate 110 at intervals, and makes the pins of each IC120 face away from the substrate 110, and then sets a display layer 130 on the IC120, so that each pin of the IC120 is electrically connected to each LED131 in the display layer 130, thereby driving the LED131 to emit light. In addition, by setting the pins of the IC120 facing away from the substrate 110, it is convenient to arrange the IC120 and the LED131 in layers, so that when white oil is subsequently laid, there is no need to leave the IC120 area empty, which greatly improves the backlight reflectivity; in addition, since the LED131 and the IC120 are arranged in layers, there is space between the LED131, so as to improve the light mixing effect between the LED131.

[0068] Based on the same inventive concept, Figure 6 As shown, this embodiment also provides a backplane manufacturing method, the backplane manufacturing method comprises the following steps:

[0069] Step S201, providing a substrate;

[0070] Step S202 , providing a plurality of ICs, and transferring each of the ICs onto the substrate at a preset interval.

[0071] Wherein, the pins of each IC face away from the substrate;

[0072] Step S203 , performing a planarization process on the plurality of ICs to form a planarization layer.

[0073] Wherein, the pins of each IC are exposed outside the planarization layer;

[0074] Step S204, performing metal routing on the planarization layer.

[0075] Wherein, each of the metal traces is routed to a pin of the IC;

[0076] Step S205 , bonding the positive / negative electrodes of the plurality of LEDs to different metal traces respectively, so as to connect the positive / negative electrodes of the LEDs to the pins of the IC through the metal traces.

[0077] Optionally, the backplane manufacturing method further includes:

[0078] White oil is spread between the LEDs to form a white oil layer.

[0079] Optionally, the backplane manufacturing method further includes:

[0080] A packaging layer is formed on the white oil layer.

[0081] It can be understood that the present application transfers each of the ICs to the substrate at a preset interval; wherein the pins of each of the ICs face away from the substrate, and performs a flattening process on the plurality of ICs to form a flattening layer, wherein the pins of each of the ICs are exposed outside the flattening layer. Then metal routing is performed on the flattening layer, and each of the metal routings is wired to the pins of the IC. Finally, the positive / negative electrodes of the plurality of LEDs are bonded to different metal routings respectively, so as to connect the positive / negative electrodes of the LEDs to the pins of the IC through the metal routings, thereby completing the backplane process. On the one hand, the present application reduces the process complexity of the IC binding process to the backplane, improves the IC binding accuracy, and thus improves the IC binding yield; on the other hand, since the IC and the LED are arranged in layers, it is no longer necessary to leave the IC area empty when laying white oil later, thereby greatly improving the backlight reflectivity; in addition, since the LED and the IC are arranged in layers, there is space between the LEDs, which can also improve the light mixing effect between the LEDs.

[0082] It should be noted that the structure formed by the backplane manufacturing method can refer to the above description and Figure 4-Figure 5 , I will not go into details here.

[0083] Based on the same inventive concept, an embodiment of the present application further provides a display device, which includes the display backplane shown above.

[0084] It should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the embodiments of the present application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0086] It should be understood that the application of this application is not limited to the above examples. For ordinary technicians in this field, they can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments are implemented, and equivalent changes made according to the claims of this application still fall within the scope covered by this application.

Claims

1. A display backplane, characterized in that: The display backplane comprises: substrate; A plurality of ICs, wherein the plurality of ICs are arranged on the substrate at intervals, and a pin of each IC faces away from the substrate; The display layer is arranged on the IC, and the display layer includes a plurality of LEDs, at least one of the LEDs is electrically connected to one of the ICs through the pins.

2. The display backplane according to claim 1, characterized in that: The display layer comprises: A planarization layer, the planarization layer is laid on the plurality of the ICs, and the pins of each of the ICs are exposed outside the planarization layer; A metal wiring layer, the metal wiring layer comprising a plurality of metal traces, each of the metal traces being arranged on the planarization layer, and each of the pins of the IC being connected to the metal traces; The light-emitting layer includes a plurality of LEDs, and the positive / negative electrodes of each LED are bonded to the metal wiring, so that the positive / negative electrodes of the LED are connected to the pins of the IC through the metal wiring.

3. The display backplane according to claim 2, characterized in that: The display layer further includes: A white oil layer is filled between the LEDs.

4. The display backplane according to claim 3, characterized in that: The display layer further includes: A packaging layer is laid on the white oil layer.

5. The display backplane according to any one of claims 1 to 4, characterized in that: The substrate is a glass substrate or a PCB substrate.

6. The display backplane according to any one of claims 1 to 4, characterized in that: The LED is a micro-LED or a mini-LED.

7. A backplane manufacturing method, characterized in that: The backplane manufacturing method comprises: providing a substrate; Providing a plurality of ICs, and transferring each of the ICs to the substrate at a preset interval; wherein the pins of each of the ICs face away from the substrate; Performing a planarization process on the plurality of ICs to form a planarization layer, wherein the pins of each IC are exposed outside the planarization layer; Conducting metal routing on the planarization layer, wherein each of the metal routings is routed to a pin of the IC; The positive / negative electrodes of the plurality of LEDs are bonded to different metal traces respectively, so as to connect the positive / negative electrodes of the LEDs to the pins of the IC through the metal traces.

8. The backplane manufacturing method according to claim 7, characterized in that: The method further comprises: White oil is spread between the LEDs to form a white oil layer.

9. The backplane manufacturing method according to claim 8, characterized in that: The method further comprises: A packaging layer is formed on the white oil layer.

10. A display device, characterized in that: Comprising a display back panel as described in any one of claims 1-6.

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