Semiconductor processing apparatus, multi-zone heating plate thereof and multi-zone temperature control driving method

Abstract

A semiconductor processing equipment and its multi-zone heating plate and multi-zone temperature control driving method, by setting a current limiting element to communicate the heating sheet in different heating zones of the multi-zone heating plate of the semiconductor processing equipment, each heating sheet will experience active heating operation and passive heating operation, each heating sheet will be applied with active heating power and at least passive heating power, by controlling the proportion of active heating power and passive heating power on the heating sheet, the sum of active heating power and all passive heating power applied to the same heating sheet is equal to the predetermined heating power of the heating sheet, finally realizing independent temperature control of each heating sheet, greatly reducing the maximum instantaneous heating current, reducing the instantaneous heating power and current of each heating sheet, the heating sheet is not easy to cause material cracking due to frequent and rapid heating and cooling, and the power and current level of the corresponding switch is also reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a semiconductor processing apparatus and its multi-zone heating plate and multi-zone temperature control driving method. Background Technology

[0002] Multi-zone temperature control technology is widely used in various technical fields, such as chemical, biological, pharmaceutical and integrated circuit fields. Especially in the field of integrated circuit manufacturing, as the critical dimensions of semiconductor workpieces, such as substrates, continue to decrease and the size of substrates continues to increase, the requirements for temperature control accuracy and regional control in the substrate processing process are getting higher and higher.

[0003] In a plasma reaction chamber filled with radio frequency radiation, it is necessary to independently control the temperature of a large number (more than 100) of heating elements embedded in an insulating heating plate. This requires driving the maximum number of heating elements with the fewest possible control drive lines to reduce the size and power loss of the filter below. The most common approach is to use a matrix arrangement of the heating elements, with each row and column connected to a drive switch or a power output terminal. This allows for the independent driving of m×n heating elements using m drive lines and n ground lines. However, this structure has a problem: when m is large (e.g., greater than 12), after the current drive line heats the heating element in the current row, it must wait for the heating elements in 11 other rows to finish heating before the current row can be heated again. This pulsed heating power requires each drive switch (MOSFET or diode) through which the heating current flows to withstand extremely high instantaneous current or voltage and high temperatures. Semiconductor devices that meet these stringent requirements are either too large or not heat-resistant, making it difficult to find suitable drive switches. Even if suitable switches exist, a specially designed heat dissipation system is required.

[0004] In summary, to independently drive more heating elements with fewer drive lines, time-division multiplexing of drive lines is required. This results in most drive switches operating in pulse mode, necessitating switches capable of withstanding extremely high instantaneous voltage and current to be suitable for plasma processor applications, which is difficult to manufacture and costly. The only way to reduce the demand for drive switches is to add additional drive control lines, but this would increase the design requirements of the filter; neither can be improved simultaneously.

[0005] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor processing device and its multi-zone heating plate and multi-zone temperature control driving method. When the heating elements in the heating plate are independently temperature controlled, the maximum instantaneous heating current can be significantly reduced, the instantaneous heating power and current of each heating element can be reduced, the heating elements are less likely to crack due to frequent and rapid heating and cooling, and the power and current level of the corresponding switches are also reduced.

[0007] To achieve the above objectives, the present invention provides a multi-zone heating plate, comprising: a substrate made of insulating material, wherein the substrate includes multiple heating zones and multiple current-limiting elements;

[0008] Each heating zone includes multiple heating elements, which are used to heat different areas of the substrate;

[0009] The first end of all heating elements in each heating zone is connected to the same grounding wire, and the second end of each heating element in each heating zone is connected to a different power line. The heating elements connected to each power line are located in different heating zones.

[0010] Each current-limiting element is connected between two grounding wires or two power lines, and multiple current-limiting elements are connected in series to form a closed loop.

[0011] When the current limiting element is connected between two grounding wires, the current limiting element causes a second current to flow through multiple heating elements in the first heating zone when the first current flows through multiple heating elements in the second heating zone adjacent to the first heating zone, wherein the second current is less than the first current.

[0012] When the current limiting element is connected between two power lines, the current limiting element causes a second current to flow through the multiple heating elements connected to the first power line when the first current flows through the multiple heating elements connected to the second power line adjacent to the first power line, wherein the second current is less than the first current.

[0013] Optionally, the current-limiting element includes a current-limiting resistor.

[0014] Optionally, the current limiting element includes a current limiting resistor and a unidirectional conductive element, wherein the current limiting resistor is connected in series with the unidirectional conductive element, and the unidirectional conductive element causes the current in the closed loop to be in a clockwise or counterclockwise direction.

[0015] The resistance of the current-limiting resistor is greater than or equal to one-eighth of the resistance of the heating element, and the resistance of the current-limiting resistor is less than or equal to one-half of the resistance of the heating element.

[0016] Optionally, the grounding wire is led out to the outside of the substrate through a first port provided at the bottom of the substrate, and the power wire is led out to the outside of the substrate through a second port provided at the bottom of the substrate;

[0017] When the current-limiting element is connected between two grounding wires, the current-limiting resistor is set at the first port;

[0018] When the current-limiting element is connected between two power lines, the current-limiting resistor is set at the second port.

[0019] Optionally, the current-limiting resistor is a heating resistance wire, which is uniformly wound inside the substrate.

[0020] The heating zone includes a first sub-heating zone and a second sub-heating zone. The first end of all heating elements in the first sub-heating zone is connected to the grounding wire through a first unidirectional conductive element. The first end of all heating elements in the second sub-heating zone is connected to the grounding wire through a second unidirectional conductive element. The connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite.

[0021] The present invention also provides a semiconductor processing apparatus, comprising:

[0022] reaction chamber;

[0023] A base is disposed in the reaction chamber, the base having a coolant channel and multiple through holes running vertically through it;

[0024] The multi-zone heating plate is disposed on the base, and the power line and the grounding line leading out from the multi-zone heating plate pass through the through hole on the base;

[0025] The electrostatic chucks installed on the multi-zone heating plate are used to support the substrate;

[0026] The drive device is located below the base. The drive device includes a drive power supply, a grounding terminal, multiple power switches, and multiple grounding switches. One end of each power switch is connected to a power line passing through the base, and the other end is connected to the drive power supply. One end of each grounding switch is connected to a grounding wire passing through the base, and the other end is connected to the grounding terminal.

[0027] Each heating zone in the multi-zone heating plate includes a first sub-heating zone and a second sub-heating zone. The first end of all the heating elements in the first sub-heating zone is connected to the grounding wire through a first unidirectional conductive element. The first end of all the heating elements in the second sub-heating zone is connected to the grounding wire through a second unidirectional conductive element. The connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite.

[0028] The driving power supply adopts a pulse heating power supply, and the heating voltage output by the pulse heating power supply varies between a positive heating voltage and a negative heating voltage. The heating voltage is applied to each heating element in the first sub-heating zone and the second sub-heating zone through the power switch and the power line.

[0029] The semiconductor processing device further includes: a controller for controlling the multiple power switches and the multiple grounding switches to perform on / off operations;

[0030] The controller controls multiple grounding switches to turn on sequentially.

[0031] The controller controls the multiple power switches to operate in pulse width modulation mode and adjusts the duty cycle of each power switch.

[0032] The present invention also provides a multi-zone temperature control driving method for adjusting the temperature of the multi-zone heating plate in the semiconductor processing equipment, the multi-zone temperature control driving method comprising:

[0033] When the current-limiting element is connected between two grounding wires, the controller controls multiple grounding switches to be turned on sequentially: the heating zone directly connected to the currently turned-on grounding switch is the active heating zone, and the heating element in the active heating zone is subjected to active heating power; the heating zone connected to the currently turned-on grounding switch through the current-limiting element is the passive heating zone, and the heating element in the passive heating zone is subjected to passive heating power; during the sequential turning on of the grounding switches, each heating zone serves as an active heating zone and at least one passive heating zone, and each heating element is subjected to active heating power and at least one passive heating power.

[0034] The controller controls multiple power switches to operate in pulse width modulation mode. The controller adjusts the ratio of active heating power and passive heating power applied to the heating element connected to the power switch by adjusting the duty cycle of each power switch, so that the sum of the active heating power applied to the same heating element and all the passive heating power is equal to the predetermined heating power of the heating element.

[0035] The passive heating zone comprises multiple levels of passive heating zones: the heating zone connected to the currently activated grounding switch via a current limiting element serves as the first level of passive heating zone, where the heating element is subjected to first-level passive heating power; the heating zone connected to the currently activated grounding switch via two current limiting elements serves as the second level of passive heating zone, where the heating element is subjected to second-level passive heating power.

[0036] Due to the voltage division effect of the current limiting element, the active heating power is greater than the passive heating power, and the passive heating power of the previous stage is greater than the passive heating power of the next stage.

[0037] The present invention also provides a multi-zone temperature control driving method for adjusting the temperature of the multi-zone heating plate in the semiconductor processing equipment, the multi-zone temperature control driving method comprising:

[0038] When the current limiting element is connected between two power lines, the controller controls multiple grounding switches to turn on simultaneously, and the controller controls multiple power switches to turn on sequentially: multiple heating elements directly connected to the currently turned-on power switch act as active heating elements, and the active heating elements are subjected to active heating power; multiple heating elements connected to the currently turned-on power switch through the current limiting element act as passive heating elements, and the passive heating elements are subjected to passive heating power; during the sequential turning-on of the power switches, each heating element acts as an active heating element once and a passive heating element at least once, and each heating element is subjected to active heating power once and passive heating power at least once;

[0039] The controller controls multiple power switches to operate in pulse width modulation mode. The controller adjusts the ratio of active heating power and passive heating power applied to the heating element connected to the power switch by adjusting the duty cycle of each power switch, so that the sum of the active heating power applied to the same heating element and all the passive heating power is equal to the predetermined heating power of the heating element.

[0040] The passive heating element comprises multiple passive heating elements: a heating element connected to the currently turned-on power switch via a current limiting element serves as the first-level passive heating element, which is subjected to a first-level passive heating power; a heating element connected to the currently turned-on power switch via two current limiting elements serves as the second-level passive heating element, which is subjected to a second-level passive heating power.

[0041] Due to the voltage division effect of the current limiting element, the active heating power is greater than the passive heating power, and the passive heating power of the previous stage is greater than the passive heating power of the next stage.

[0042] This invention connects heating elements located in different heating zones by setting a current-limiting element. Each heating element undergoes both active and passive heating operations, and is subjected to active heating power once and passive heating power at least once. By controlling the ratio of active to passive heating power applied to the same heating element, the sum of the active and passive heating power applied to the same heating element is made equal to the predetermined heating power of the heating element, ultimately achieving independent temperature control for each heating element. Utilizing multiple, gradual heating operations using active and passive heating significantly reduces the maximum instantaneous heating current, decreases the instantaneous heating power and current of each heating element, and prevents material cracking caused by frequent and rapid heating and cooling. It also reduces the power and current rating of the corresponding switches. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the structure of a semiconductor processing device provided by the present invention.

[0044] Figure 2 This is a schematic diagram of a multi-zone heating plate in one embodiment of the present invention.

[0045] Figure 3 yes Figure 2 A schematic diagram showing the connection of the current-limiting element using a current-limiting resistor.

[0046] Figure 4 This is a schematic diagram showing the connection between the current-limiting element, the heating zone, and the grounding switch.

[0047] Figure 5 This is a schematic diagram showing the connection of a current-limiting resistor and a unidirectional conductive element in another embodiment of the present invention.

[0048] Figure 6 Yes Figure 5 A schematic diagram of a multi-zone heating plate driven by multi-zone temperature control.

[0049] Figure 7 yes Figure 6 Power distribution diagram for the heating zone.

[0050] Figure 8 This is a schematic diagram of a pulse heating power supply driving a multi-zone heating plate in another embodiment of the present invention.

[0051] Figure 9 This is a schematic diagram of a multi-zone heating plate in another embodiment of the present invention. Detailed Implementation

[0052] The following is based on Figures 1-9 The preferred embodiments of the present invention will be described in detail below.

[0053] This invention provides a semiconductor processing apparatus, such as... Figure 1 As shown, the system includes a reaction chamber 1, within which a base 2 is disposed. A multi-zone heating plate 3 is disposed on the base 2, and an electrostatic chuck 4 is disposed on the multi-zone heating plate 3, supporting a substrate W. The base 2 has a coolant channel 21 and multiple through holes 22 extending vertically. The multi-zone heating plate 3 includes a substrate 31 made of insulating material, within which multiple heating elements 32 are disposed. Each heating element 32 heats different areas of the substrate 31. One end of each heating element 32 is connected to a power line 33, and the other end is connected to a grounding wire 34. The grounding wire 34 extends to the outside of the substrate 31 through a first port 311 located at the bottom of the substrate 31, and the power line 33 extends to the outside of the substrate 31 through a second port 312 located at the bottom of the substrate 31. The power line 33 and the grounding wire 34 extending from the multi-zone heating plate 3 pass through the through holes 22 on the base 2. A driving device 5 is disposed outside the reaction chamber 1. The driving device 5 includes a driving power supply 51, a grounding terminal 52, multiple power switches 53, and multiple grounding switches 54. One end of each power switch 53 is connected to a power line 33 passing through the base 31, and the other end is connected to the driving power supply 51. One end of each grounding switch 54 is connected to a grounding wire 34 passing through the base 31, and the other end is connected to the grounding terminal 52. The semiconductor processing device also includes a controller 6, which is used to control the multiple power switches 53 and the multiple grounding switches 54.

[0054] like Figure 2 As shown, in one embodiment of the present invention, the substrate 31 of the multi-zone heating plate 3 includes multiple heating zones, each heating zone includes multiple heating elements 32, the first end of all heating elements 32 in each heating zone is connected to the same grounding wire 34, the second end of each heating element 32 in each heating zone is connected to different power lines 33, and the heating elements 32 connected to each power line 33 are located in different heating zones. Figure 2In the multi-zone heating plate 3, 16 heating elements 32 are arranged in a 4×4 matrix. The first column of heating elements R11 to R41 forms the first heating zone S1. The first ends of the first column of heating elements R11 to R41 are all connected to the first grounding wire 34-1 and grounded through the first grounding switch G1. The second end of heating element R11 is connected to the first power line 33-1 and connected to the driving power supply 51 through the first power switch K1. The second end of heating element R12 is connected to the second power line 33-2 and connected to the driving power supply 51 through the second power switch K2. The second end of heating element R13 is connected to the third power line 33-3 and connected to the driving power supply 51 through the third power switch K3. The second end of heating element R14 is connected to the fourth power line 33-4 and connected to the driving power supply 51 through the fourth power switch K4. Similarly, the second row of heating elements R12 to R42 forms the second heating zone S2. The first ends of each of the second row of heating elements R12 to R42 are connected to the second grounding wire 34-2 and grounded through the second grounding switch G2. The second ends of each of the second row of heating elements R12 to R42 are connected to different power lines. The third row of heating elements R13 to R43 forms the third heating zone S3. The first ends of each of the third row of heating elements R13 to R43 are connected to the third grounding wire 34-3 and grounded through the third grounding switch G3. The second ends of each of the third row of heating elements R13 to R43 are connected to different power lines. The fourth row of heating elements R14 to R44 forms the fourth heating zone S4. The first ends of each of the fourth row of heating elements R14 to R44 are connected to the fourth grounding wire 34-4 and grounded through the fourth grounding switch G4. The second ends of each of the fourth row of heating elements R14 to R44 are connected to different power lines.

[0055] In this embodiment, a current-limiting element E is connected between the two grounding wires, and the number of current-limiting elements E is the same as the number of grounding wires. Figure 2 As shown, a first current-limiting element E1 is connected in series between the first grounding wire 34-1 and the second grounding wire 34-2; a second current-limiting element E2 is connected in series between the second grounding wire 34-2 and the third grounding wire 34-3; a third current-limiting element E3 is connected in series between the third grounding wire 34-3 and the fourth grounding wire 34-4; and a fourth current-limiting element E4 is connected in series between the fourth grounding wire 34-4 and the first grounding wire 34-1. The first current-limiting element E1, the second current-limiting element E2, the third current-limiting element E3, and the fourth current-limiting element E4 form a closed loop.

[0056] The current-limiting element E is typically a current-limiting resistor R, such as... Figure 3As shown, the first current-limiting resistor R1 is connected in series between the first grounding wire 34-1 and the second grounding wire 34-2, the second current-limiting resistor R2 is connected in series between the second grounding wire 34-2 and the third grounding wire 34-3, the third current-limiting resistor R3 is connected in series between the third grounding wire 34-3 and the fourth grounding wire 34-4, and the fourth current-limiting resistor R4 is connected in series between the fourth grounding wire 34-4 and the first grounding wire 34-1.

[0057] like Figure 2 and Figure 3As shown, the controller 6 controls the first grounding switch G1, the second grounding switch G2, the third grounding switch G3, and the fourth grounding switch G4 in the grounding switch G to turn on sequentially, and controls the first power switch K1, the second power switch K2, the third power switch K3, and the fourth power switch K4 in the power switch K to operate in pulse width modulation mode. When the first grounding switch G1 is turned on, the remaining grounding switches are turned off. At this time, a first current flows through the heating elements R11 to R41 in the first heating zone S1, and each heating element R11 to R41 in the first heating zone S1 generates active heating power, making the first heating zone S1 an active heating zone. At the same time, the heating elements R12 to R42 in the second heating zone S2 are connected to the first grounding switch G1 through the first current-limiting resistor R1, and a second current flows through the heating elements R12 to R42 in the second heating zone S2. Due to the current-shunting effect of the first current-limiting resistor R1, the second current is less than the first current. Similarly, heating elements R14 to R44 in the fourth heating zone S4 are connected to the first grounding switch G1 through the fourth current-limiting resistor R4. A third current flows through the heating elements R14 to R44 in the fourth heating zone S4. Due to the current-shunting effect of the fourth current-limiting resistor R4, the third current is less than the first current. Further, heating elements R13 to R43 in the third heating zone S3 are connected to the first grounding switch G1 through the first current-limiting resistor R1 and the second current-limiting resistor R2. Simultaneously, heating elements R13 to R43 in the third heating zone S3 are also connected to the first grounding switch G1 through the fourth current-limiting resistor R4 and the third current-limiting resistor R3. A fourth current flows through the heating elements R13 to R43 in the third heating zone S3. Due to the current-shunting effect of the first current-limiting resistor R1 and the second current-limiting resistor R2 (and the fourth current-limiting resistor R4 and the third current-limiting resistor R3), the fourth current is less than the first current, less than the second current, and less than the third current. Because the heating elements R12-R42 in the second heating zone S2, R13-R43 in the third heating zone S3, and R14-R44 in the fourth heating zone S4 are passively turned on, passive heating power is generated on these heating elements (R12-R42, R13-R43, and R14-R44). The second heating zone S2, the third heating zone S3, and the fourth heating zone S4 are passive heating zones, which can play a role in preheating.

[0058] The resistance value of the current-limiting resistor R needs to be set appropriately. The resistance value of the current-limiting resistor R should not be too large, otherwise the current applied to the heating element in the passive heating zone will be too small to be negligible, thus failing to achieve the preheating effect. The resistance value of the current-limiting resistor R should also not be too small, otherwise the current applied to the heating element in the passive heating zone will be equivalent to the current applied to the heating element in the active heating zone, thereby losing the control effect of sequentially turning on the grounding switch. Preferably, the resistance value of the current-limiting resistor R can be greater than or equal to one-eighth of the resistance value of the heating element 32, and less than or equal to one-half of the resistance value of the heating element 32.

[0059] In this embodiment, by setting current-limiting resistors between the grounding switches, when any one grounding switch (numbered x) is turned on, in addition to the heating element in the x-th heating zone directly connected to the x-th grounding switch being connected to the driving power supply 51 to generate active heating power, the heating elements in the heating zones connected to several adjacent grounding switches (x-1, x+1) can also be connected to the currently turned-on x-th grounding switch through the current-limiting resistors, thereby connecting to the driving power supply 51 and generating passive heating power. However, the heating power of these passively turned-on heating elements is relatively small, usually only about 30% of the active heating power generated by the heating element in the x-th heating zone directly connected to the x-th grounding switch, so it can be used for preheating purposes. During the cyclical switching of each grounding switch, besides the active heating power P1 generated on each heating element in the x-th heating zone directly connected to the x-th grounding switch when the x-th grounding switch is switched on, the passive heating power generated on the heating elements in the x-th heating zone directly connected to the x-th grounding switch also affects the temperature of each heating element in the x-th heating zone when the (x-1)-th (or x+1)-th grounding switch is switched on. Therefore, the entire heating process changes from a single high-power heating step to a sequential passive preheating step and an active heating step. Because the heating time is extended, the maximum instantaneous heating current can be significantly reduced while maintaining the same total heating energy. For example, if the preheating step generates 40% of the required heating power and the active heating step generates 100%, the final maximum power can be reduced to 1 / 1.4 = 71% of the original, and correspondingly, the current can be reduced to 84% of the original value. By changing the resistance value of the current-limiting resistor, the ratio of the heating power of the preheating step to the heating power of the active heating step can be further increased to 0.6:1, the maximum power in the active heating step is reduced to 65% of the original, and the maximum current flowing through each heating element is 80% of the original value.

[0060] like Figure 1As shown, in one embodiment, the current-limiting resistor R is located at the first port 311. The grounding wire 34 is led out from the first port 311 located at the bottom of the substrate 31 to the outside of the substrate 31, and then continues to pass through the through hole 22 on the base 2 and connect to the grounding switch 54. Since the temperature of the base 2 is lower than the temperature of the multi-zone heating plate 3, the location of the first port 311 becomes a cold point where the base 2 absorbs heat from the multi-zone heating plate 3. By placing the current-limiting resistor R at the first port 311, the heating power generated by the current-limiting resistor R can just offset the heat loss caused by heat absorption.

[0061] In other embodiments, the current-limiting resistor R can also be a heating resistance wire, which can be evenly wound inside the substrate 31 so that the heating power is evenly distributed in each heating zone of the entire multi-zone heating plate 3, thus assisting in completing the preheating task.

[0062] like Figure 2 As shown, in this embodiment, a multi-zone temperature control driving method using the multi-zone heating plate is provided, comprising:

[0063] The controller 6 controls multiple grounding switches G to be turned on sequentially: the heating zone directly connected to the currently turned-on grounding switch G is the active heating zone, and the heating element 32 in the active heating zone is subjected to active heating power; the heating zone connected to the currently turned-on grounding switch G through the current limiting element E is the passive heating zone, and the heating element 32 in the passive heating zone is subjected to passive heating power; during the sequential turning on of the grounding switches G, each heating zone serves as an active heating zone and at least one passive heating zone, and each heating element 32 is subjected to active heating power and at least one passive heating power.

[0064] The controller 6 controls multiple power switches K to operate in pulse width modulation mode. The controller 6 adjusts the ratio of active heating power and passive heating power applied to the heating element 32 connected to the power switch K by adjusting the duty cycle of each power switch K, so that the sum of the active heating power applied to the same heating element 32 and all the passive heating power is equal to the predetermined heating power of the heating element.

[0065] The passive heating zone includes multiple levels of passive heating zones: the heating zone connected to the currently activated grounding switch G via a current limiting element E serves as the first level of passive heating zone, where the heating element 32 is subjected to first-level passive heating power; the heating zone connected to the currently activated grounding switch G via two current limiting elements E serves as the second level of passive heating zone, where the heating element 32 is subjected to second-level passive heating power.

[0066] Due to the voltage division effect of the current limiting element E, the active heating power is greater than the passive heating power, and the passive heating power of the previous stage is greater than the passive heating power of the next stage.

[0067] The ratio between the passive heating power and the active heating power of each stage is used as the heating coefficient of each passive heating zone. The controller 6 calculates the passive heating power of each stage based on the heating coefficient.

[0068] like Figure 4 As shown, the multi-zone heating plate 3 includes n heating zones and n current-limiting resistors, where n is a natural number. When any grounding switch is turned on, any heating zone connected to the currently turned-on grounding switch through the current-limiting resistor is considered a passive heating zone.

[0069] The multi-zone temperature control driving method specifically includes the following steps:

[0070] The controller controls the first grounding switch G1 to close and controls the other grounding switches to open: the first heating zone S1, connected to the first grounding switch G1 through the first grounding wire 34-1, is the active heating zone, and the heating element in the active heating zone S1 is subjected to active heating power; the second heating zone S2, connected to the first grounding switch G1 through the current-limiting resistor R1, is the first-level passive heating zone, and the nth heating zone Sn, connected to the first grounding switch G1 through the current-limiting resistor Rn, is the first-level passive heating zone, and the heating element in the first-level passive heating zone is subjected to first-level passive heating power; the third heating zone S3, connected to the first grounding switch G1 sequentially through the current-limiting resistors R1 and R2, is the second-level passive heating zone, and the (n-1)th heating zone Sn-1, connected to the first grounding switch G1 sequentially through the current-limiting resistors Rn and Rn-1, is the second-level passive heating zone, and the heating element in the second-level passive heating zone is subjected to second-level passive heating power; and so on;

[0071] The controller controls the second grounding switch G2 to close and controls the other grounding switches to open: the second heating zone S2, which is connected to the second grounding switch G2 through the second grounding wire 34-2, is the active heating zone, and the heating element in the active heating zone S2 is subjected to active heating power; the third heating zone S3, which is connected to the second grounding switch G2 through the current-limiting resistor R2, is the first-level passive heating zone, and the first heating zone S1, which is connected to the second grounding switch G2 through the current-limiting resistor R1, is the first-level passive heating zone, and the heating element in the first-level passive heating zone is subjected to first-level passive heating power; the fourth heating zone S4, which is connected to the second grounding switch G2 sequentially through the current-limiting resistors R2 and R3, is the second-level passive heating zone, and the nth heating zone Sn, which is connected to the second grounding switch G2 sequentially through the current-limiting resistors Rn and R1, is the second-level passive heating zone, and the heating element in the second-level passive heating zone is subjected to second-level passive heating power; and so on;

[0072] The controller controls the third grounding switch G3 to close and controls the other grounding switches to open: the third heating zone S3, connected to the third grounding switch G3 through the third grounding wire 34-3, is the active heating zone, and the heating element in the active heating zone S3 is subjected to active heating power; the fourth heating zone S4, connected to the third grounding switch G3 through the current-limiting resistor R3, is the first-level passive heating zone; the second heating zone S2, connected to the third grounding switch G3 through the current-limiting resistor R2, is the first-level passive heating zone, and the heating element in the first-level passive heating zone is subjected to first-level passive heating power; the fifth heating zone S5, connected to the third grounding switch G3 sequentially through the current-limiting resistors R3 and R4, is the second-level passive heating zone; the first heating zone S1, connected to the third grounding switch G3 sequentially through the current-limiting resistors R2 and R1, is the second-level passive heating zone, and the heating element in the second-level passive heating zone is subjected to second-level passive heating power; and so on;

[0073] The active heating power is greater than the first-stage passive heating power, the first-stage passive heating power is greater than the second-stage passive heating power, and so on.

[0074] The controller adjusts the ratio of active heating power to passive heating power of the heating element connected to the power switch by adjusting the duty cycle of the power switch, so that the sum of the active heating power applied to the heating element and the multi-level passive heating power applied to the heating element is equal to the predetermined heating power of the heating element.

[0075] This invention connects heating elements located in different heating zones by setting a current-limiting element. Each heating element undergoes both active and passive heating operations, and is subjected to active heating power once and passive heating power at least once. By controlling the ratio of active to passive heating power applied to the same heating element, the sum of the active and passive heating power applied to the same heating element is made equal to the predetermined heating power of the heating element, ultimately achieving independent temperature control for each heating element. Utilizing multiple, gradual heating operations using active and passive heating significantly reduces the maximum instantaneous heating current, decreases the instantaneous heating power and current of each heating element, and prevents material cracking caused by frequent and rapid heating and cooling. It also reduces the power and current rating of the corresponding switches.

[0076] In another embodiment of the invention, such as Figure 5 As shown, in Figure 4 Based on this, the current-limiting element also includes a unidirectional conductive element, which is a diode. The current-limiting resistor is connected in series with the diode, and the diode causes the current direction in the closed-loop circuit to be either clockwise or counterclockwise. When any grounding switch is turned on, only the heating area downstream of the current direction in the closed-loop circuit, connected to the currently turned-on grounding switch through the current-limiting resistor and diode, is considered a passive heating area. That is, only the heating area downstream in either the clockwise or counterclockwise direction will be conducted as a passive heating area, while the upstream heating area will not be conducted due to the diode's obstruction and cannot become a passive heating area. Using a unidirectional conductive element to control the current direction in the closed-loop circuit can reduce the number of passive heating areas, facilitate the calculation of the passive heating power of the heating element, and reduce the control difficulty of temperature control drive.

[0077] The controller controls the first grounding switch G1 to close and controls the other grounding switches to open: the first heating zone S1, which is connected to the first grounding switch G1 through the first grounding wire 34-1, is the active heating zone, and the heating element in the active heating zone S1 is subjected to active heating power; the second heating zone S2, which is connected to the first grounding switch G1 through the current-limiting resistor R1, is the first-level passive heating zone, and the heating element in the first-level passive heating zone is subjected to first-level passive heating power; the third heating zone S3, which is connected to the first grounding switch G1 sequentially through the current-limiting resistor R1 and the current-limiting resistor R2, is the second-level passive heating zone, and the heating element in the second-level passive heating zone is subjected to second-level passive heating power; and so on.

[0078] The controller controls the second grounding switch G2 to close and controls the other grounding switches to open: the second heating zone S2, which is connected to the second grounding switch G2 through the second grounding wire 34-2, is the active heating zone, and the heating element in the active heating zone S2 is subjected to active heating power; the third heating zone S3, which is connected to the second grounding switch G2 through the current-limiting resistor R2, is the first-level passive heating zone, and the heating element in the first-level passive heating zone is subjected to first-level passive heating power; the fourth heating zone S4, which is connected to the second grounding switch G2 sequentially through the current-limiting resistor R2 and the current-limiting resistor R3, is the second-level passive heating zone, and the heating element in the second-level passive heating zone is subjected to second-level passive heating power; and so on.

[0079] The controller controls the third grounding switch G3 to close and controls other grounding switches to open: the third heating zone S3, which is connected to the third grounding switch G3 through the third grounding wire 34-3, is the active heating zone, and the heating element in the active heating zone S3 is subjected to active heating power; the fourth heating zone S4, which is connected to the third grounding switch G3 through the current-limiting resistor R3, is the first-level passive heating zone, and the heating element in the first-level passive heating zone is subjected to first-level passive heating power; the fifth heating zone S5, which is connected to the third grounding switch G3 sequentially through the current-limiting resistor R3 and the current-limiting resistor R4, is the second-level passive heating zone, and the heating element in the second-level passive heating zone is subjected to second-level passive heating power; and so on.

[0080] like Figure 6 As shown, in this embodiment, each heating zone contains nine heating elements 32. The second end of each heating element 32 is connected to a power switch, and each power switch drives one heating element 32. Taking the first heating zone S1 as an example, it contains nine heating elements 32. The first ends of the nine heating elements 32 in the first heating zone S1 are all connected to the first grounding switch G1. The second end of the first heating element is connected to the first power switch K1, the second end of the second heating element is connected to the second power switch K2, the second end of the third heating element is connected to the third power switch K3, and so on. The power switches are all pulse width modulation switches (PWM switches). By adjusting the duty cycle of the power switches, the ratio of active heating power and passive heating power of the heating elements connected to the power switches is adjusted, so that the sum of the active heating power applied to the heating elements and the multi-level passive heating power applied to the heating elements is equal to the predetermined heating power of the heating elements. In this embodiment, the average duty cycle of the PWM signal is 40%-50%, and the conduction times of the different power switches K1-K9 are staggered as much as possible, with only four or five power switches being turned on at the same time.

[0081] When the first grounding switch G1 is closed, the first heating zone S1, which is directly connected to the first grounding switch G1, serves as the active heating zone. The heating element 32 in the first heating zone S1 is subjected to an active heating power of P, and the current flowing through the heating element 32 is I. The second heating zone S2, connected to the first grounding switch G1 through the first diode D1 and the first current-limiting resistor R1, serves as the first-stage passive heating zone, and the third heating zone S3 serves as the second-stage passive heating zone. When the resistance of the first current-limiting resistor R1 is equal to the resistance of the heating element 32, the current flowing through the heating element 32 in the second heating zone S2 is... The first-stage passive heating power applied to the heating element 32 in the second heating zone S2 is 0.04P, and the heating power of the first current-limiting resistor R1 is 0.64P. When the resistance of the first current-limiting resistor R1 is equal to half the resistance of the heating element 32, the current flowing through the heating element 32 in the second heating zone S2 is... The first-stage passive heating power applied to the heating element 32 in the second heating zone S2 is 0.11P, and the heating power of the first current-limiting resistor R1 is 0.89P. When the resistance of the first current-limiting resistor R1 is equal to one-quarter of the resistance of the heating element 32, the current flowing through the heating element 32 in the second heating zone S2 is... The first-stage passive heating power applied to the heating element 32 in the second heating zone S2 is 0.25P, and the heating power of the first current-limiting resistor R1 is P. The second-stage passive heating power applied to the heating element 32 in the third heating zone S3 is 0.11P, and the heating power of the second current-limiting resistor R2 is 0.4P.

[0082] The active heating power and the passive heating power are correlated:

[0083] P = a1 × P1

[0084] P = a² × P²

[0085] Where P is the active heating power, a1 is the first heating coefficient, P1 is the first-stage passive heating power, a2 is the second heating coefficient, and P2 is the second-stage passive heating power.

[0086] When the resistance value of the current-limiting resistor is different, the heating coefficient between the active heating power generated by the active heating zone and the passive heating power generated by the passive heating zone will also be different. Taking the resistance value of the first current-limiting resistor R1 as an example, which is equal to one-quarter of the resistance value of the heating element 32, the active heating power on the heating element 32 in the active heating zone S1 is P. The heating coefficient of the first-stage passive heating zone S2 downstream of the active heating zone S1 is 0.25, the heating coefficient of the second-stage passive heating zone S3 is 0.11, and the power of the heating zone S4 further downstream is too low to be ignored.

[0087] like Figure 7 As shown, multi-zone temperature control is achieved through three steps to reduce the driving power of active heating.

[0088] Step 1: Turn off other grounding switches and turn on the first grounding switch G1. The first heating zone S1, acting as the active heating zone, maintains the duty cycle of the heating elements that do not require temperature adjustment at the reference temperature at 40%, i.e., 40% of the maximum heating power. One high-temperature zone requiring additional heating corresponds to a duty cycle of 60, and the other low-temperature zone with a decreasing temperature corresponds to a duty cycle of 20. Simultaneously, the heating power of the heating elements at corresponding positions in the downstream first-stage passive heating zone S2 is 10%, 15%, and 5% of the maximum heating power, respectively. In the second-stage passive heating zone S3, the heating power of the heating elements at corresponding positions is 4.4%, 6.6%, and 2.2%, respectively.

[0089] Step 2: Close the first grounding switch G1 and open the second grounding switch G2 to begin active heating of the second heating zone S2. Set the heating duty cycle of the area maintaining the original temperature to 30%, maintaining a heating power of 40% together with the 10% preheated in Step 1. For the heating element corresponding to the high-temperature zone in the first heating zone S1, set its duty cycle to 25%, maintaining a heating power of 40% together with the 15% applied during preheating in Step 1. For the heating element corresponding to the low-temperature zone in the first heating zone S1, set its duty cycle to 35%, maintaining a heating power of 40% together with the 5% applied during the preheating stage in Step 1. Furthermore, a high-temperature zone appears in the second heating zone S2, requiring a duty cycle of 50%. These duty cycle parameters generated in the second heating zone S2 will generate corresponding proportions of heating power in the passive heating zone S3 downstream of the second heating zone S2.

[0090] Step 3: Close the second grounding switch G2 and open the third grounding switch G3 to begin active heating of the third heating zone S3. Based on the superposition of the heating power parameters in the third heating zone S3 from the first two steps, select the required heating power parameters so that the total heating power received by each heating element in the third heating zone S3 in step 3 is 40% of the maximum power.

[0091] The aforementioned zoned driving method enables simultaneous active heating of one active heating zone and preheating of two downstream passive heating zones. The preheating power is calculated when setting the heating power ratio for the active heating zone, ultimately achieving independent temperature control for each heating element in each heating zone. Since 36% of the heating power is already generated during the preheating stage, only the remaining 64% needs to be applied during the active heating stage. By gradually applying multiple heating powers to the heating elements across multiple heating steps, the instantaneous heating power and current of each heating element are reduced. This prevents material cracking caused by frequent and rapid heating and cooling, and also lowers the power and current ratings of the corresponding switches.

[0092] In other embodiments, for example Figure 3 and Figure 4 If the current-limiting element contains only a current-limiting resistor and not a diode, then all four secondary passive heating zones on both sides of the active heating zone will be connected to generate passive heating power. Therefore, each secondary passive heating zone has already generated 36 × 2 = 72% of the heating power in the passive heating stage. In the active heating stage, only the remaining 28% of the power needs to be heated, thus further reducing the maximum current. This structure requires storing and calculating the heating power distribution parameters of the four preheating stages during the driving process to obtain the heating power parameters that need to be actively adjusted in the active heating stage. As long as the active heating power applied in the final active heating stage can compensate for the power difference generated in the current heating zone during the passive heating stage, independent temperature control of all heating zones can be achieved. As long as the total heating power generated during the preheating process is less than 100%, that is, the preheating power is not greater than the active heating power, effective compensation in the final active heating stage can be guaranteed, achieving independent temperature control.

[0093] In other embodiments of the present invention, each heating zone of the multi-zone heating plate includes a first sub-heating zone and a second sub-heating zone. The first end of all heating elements in the first sub-heating zone is connected to the grounding switch via a first diode, and the first end of all heating elements in the second sub-heating zone is connected to the grounding switch via a second diode. The first and second diodes are connected in opposite directions. The driving power supply is a pulse heating power supply 51-1, whose output heating voltage varies between a positive and a negative heating voltage. This heating voltage is applied to each heating element in the first and second sub-heating zones via the power switch.

[0094] like Figure 8As shown, in this embodiment, each heating zone contains six heating elements. A current-limiting resistor R1 is connected between the first heating zone S1 and the second heating zone S2, or alternatively, a current-limiting resistor R1 and a diode can be connected. The first heating zone S1 includes a first sub-heating zone S1a and a second sub-heating zone S1b. The first ends of the three heating elements in the first sub-heating zone S1a are all connected to the first grounding switch G1 through a diode D10a, and the second ends of the three heating elements are connected to the pulse heating power supply 51-1 through a first power switch K1, a second power switch K2, and a third power switch K3, respectively. Similarly, the first ends of the three heating elements in the second sub-heating zone S1b are all connected to the first grounding switch G1 through a diode D10b, and the second ends of the three heating elements are connected to the pulse heating power supply 51-1 through a first power switch K1, a second power switch K2, and a third power switch K3, respectively. The second heating zone S2 includes a first sub-heating zone S2a and a second sub-heating zone S2b. The first ends of the three heating elements in the first sub-heating zone S2a are all connected to the second grounding switch G2 through diode D20a. The second ends of the three heating elements are connected to the pulse heating power supply 51-1 through the first power switch K1, the second power switch K2 and the third power switch K3 respectively. The first ends of the three heating elements in the second sub-heating zone S2b are all connected to the second grounding switch G2 through diode D20b. The second ends of the three heating elements are connected to the pulse heating power supply 51-1 through the first power switch K1, the second power switch K2 and the third power switch K3 respectively.

[0095] Only with Figure 8 Taking the first heating zone S1 and the second heating zone S2 as examples, when the pulse heating power supply 51-1 outputs a positive heating voltage, the first grounding switch G1 is turned on. The second sub-heating zone S1b of the first heating zone S1 becomes the active heating zone, and the heating element in the second sub-heating zone S1b is actively heated. The second sub-heating zone S2b of the second heating zone S2, connected to the first grounding switch G1 through a current-limiting resistor R1, becomes the passive heating zone, and the heating element in the second sub-heating zone S2b is passively heated. When the pulse heating power supply 51-1 outputs a negative heating voltage, the first grounding switch G1 is turned on. The first sub-heating zone S1a of the first heating zone S1 becomes the active heating zone, and the heating element in the first sub-heating zone S1a is actively heated. The first sub-heating zone S2a of the second heating zone S2, connected to the first grounding switch G1 through a current-limiting resistor R1, becomes the passive heating zone, and the heating element in the first sub-heating zone S2a is passively heated. The methods for adjusting the active and passive heating power of the heating elements in different sub-heating zones are similar to those described above and will not be repeated here.

[0096] Pulse heating power supplies achieve more precise temperature control by varying the positive and negative heating voltages, reducing the risk of overheating and thermal stress, promoting uniform heating, improving thermal efficiency and equipment lifespan, adapting to the characteristics of different materials, reducing electromagnetic interference, and enabling complex temperature control curves, thus providing greater flexibility and safety.

[0097] In another embodiment of the invention, Figure 2 Based on the existing design, adjustments are made to the current-limiting elements in the multi-zone heating plate. These elements are changed from being positioned between grounding switches to being positioned between power switches. Each current-limiting element is connected between two power lines, and multiple current-limiting elements are connected in series to form a closed-loop circuit. This achieves the same objective of the invention. Figure 9 As shown, a first current-limiting element E1 is connected in series between the first power line 33-1 and the second power line 33-2; a second current-limiting element E2 is connected in series between the second power line 33-2 and the third power line 33-3; a third current-limiting element E3 is connected in series between the third power line 33-3 and the fourth power line 33-4; and a fourth current-limiting element E4 is connected in series between the fourth power line 33-4 and the first power line 33-1. The first current-limiting element E1, the second current-limiting element E2, the third current-limiting element E3, and the fourth current-limiting element E4 form a closed loop.

[0098] The current-limiting element E can also be a current-limiting resistor R, or a current-limiting resistor R connected in series with a diode. For example... Figure 1 As shown, the current-limiting resistor R is set at the second port 312. The power line 33 is led out to the outside of the substrate 31 through the second port 312 located at the bottom of the substrate 31, and then continues to pass through the through hole 22 on the base 2 to connect with the power switch 53. Since the temperature of the base 2 is lower than the temperature of the multi-zone heating plate 3, the position of the second port 312 will become a cold point where the base 2 absorbs heat from the multi-zone heating plate 3. By setting the current-limiting resistor R at the second port 312, the heating power generated by the current-limiting resistor R can just offset the heat loss caused by heat absorption.

[0099] Similarly, each heating zone of the multi-zone heating plate can also be as follows: Figure 8 The embodiments shown are similar, including a first sub-heating zone and a second sub-heating zone, and the driving power supply 51 adopts a pulse heating power supply, all of which can achieve the purpose of the present invention. The working principle is similar to that described above, and will not be repeated here.

[0100] like Figure 9As shown, the controller 6 controls the first grounding switch G1, the second grounding switch G2, the third grounding switch G3, and the fourth grounding switch G4 in the grounding switch G to be turned on simultaneously. The controller 6 controls the first power switch K1, the second power switch K2, the third power switch K3, and the fourth power switch K4 in the power switch K to operate in pulse width modulation mode, and the controller 6 controls the first power switch K1, the second power switch K2, the third power switch K3, and the fourth power switch K4 to be turned on sequentially. When the first power switch K1 is turned on, the remaining power switches are turned off. At this time, a first current flows through the heating elements R11 to R14 located in the first row connected to the first power switch K1, and active heating power is generated on the heating elements R11 to R14. The heating elements R11 to R14 serve as active heating elements. Meanwhile, the heating elements R21-R24 in the second row are connected to the first power switch K1 via the first current-limiting element E1. A second current flows through the heating elements R21-R24. Due to the voltage division effect of the current-limiting element E1, the second current is less than the first current, and passive heating power is generated on the heating elements R21-R24. The heating elements R21-R24 serve as the first-stage passive heating elements. Similarly, the heating elements R41-R44 in the fourth row are connected to the first power switch K1 via the fourth current-limiting element E4. A third current flows through the heating elements R41-R44. Due to the voltage division effect of the fourth current-limiting element E4, the third current is less than the first current, and passive heating power is generated on the heating elements R41-R44. The heating elements R41-R44 serve as the first-stage passive heating elements. Furthermore, the heating elements R31 to R34 in the third row are connected to the first power switch K1 through the first current limiting element E1 and the second current limiting element E2. At the same time, the heating elements R31 to R34 in the third row are also connected to the first power switch K1 through the third current limiting element E3 and the fourth current limiting element E4. A fourth current flows through the heating elements R31 to R34. Due to the current shunting effect of the first current limiting element E1 and the second current limiting element E2 (the fourth current limiting element E4 and the third current limiting element E3), the fourth current is less than the first current, less than the second current, and less than the third current. Passive heating power is generated on the heating elements R31 to R34, and the heating elements R31 to R34 serve as the second-stage passive heating elements.

[0101] In this embodiment, a multi-zone temperature control driving method using the multi-zone heating plate is provided, comprising:

[0102] The controller 6 controls multiple grounding switches G to turn on simultaneously, and the controller 6 controls multiple power switches K to turn on sequentially: multiple heating elements 32 directly connected to the currently turned-on power switch K act as active heating elements, and the active heating elements are applied active heating power; multiple heating elements 32 connected to the currently turned-on power switch K through the current limiting element E act as passive heating elements, and the passive heating elements are applied passive heating power; during the sequential turning-on of the power switches K, each heating element 32 acts as an active heating element once and a passive heating element at least once, and each heating element 32 is applied active heating power once and passive heating power at least once.

[0103] The passive heating element comprises multiple passive heating elements: a heating element 32 connected to the currently powered power switch K via a current limiting element E serves as the first-stage passive heating element, which is subjected to a first-stage passive heating power; a heating element connected to the currently powered power switch K via two current limiting elements E serves as the second-stage passive heating element, which is subjected to a second-stage passive heating power. Due to the voltage division effect of the current limiting element E, the active heating power is greater than the passive heating power, and the passive heating power of the previous stage is greater than the passive heating power of the next stage.

[0104] The ratio between the passive heating power and the active heating power of each stage is used as the heating coefficient of each stage of passive heating element. The controller 6 calculates the passive heating power of each stage based on the heating coefficient.

[0105] The controller 6 controls multiple power switches K to operate in pulse width modulation mode. The controller 6 adjusts the ratio of active heating power and passive heating power applied to the heating element 32 connected to the power switch K by adjusting the duty cycle of each power switch K, so that the sum of the active heating power applied to the same heating element 32 and all the passive heating power is equal to the predetermined heating power of the heating element 32.

[0106] This invention connects heating elements located in different heating zones by setting a current-limiting element. Each heating element undergoes both active and passive heating operations, and is subjected to active heating power once and passive heating power at least once. By controlling the ratio of active to passive heating power applied to the same heating element, the sum of the active and passive heating power applied to the same heating element is made equal to the predetermined heating power of the heating element, ultimately achieving independent temperature control for each heating element. Utilizing multiple, gradual heating operations using active and passive heating significantly reduces the maximum instantaneous heating current, decreases the instantaneous heating power and current of each heating element, and prevents material cracking caused by frequent and rapid heating and cooling. It also reduces the power and current rating of the corresponding switches.

[0107] It should be noted that, in the embodiments of the present invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0108] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0109] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described feature, integral, step, operation, element and / or component, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0110] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0111] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0112] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0113] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention. After reading the above content, various modifications and substitutions to the present invention will be obvious to those skilled in the art. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A multi-zone hot plate characterized by, The multi-zone heating plate comprises a substrate made of insulating material, and a plurality of heating zones and a plurality of current-limiting elements are contained in the substrate. Each of the heating zones comprises a plurality of heating pieces for heating different areas of the substrate. The first ends of all the heating pieces in each of the heating zones are connected to the same ground line, and the second ends of each of the heating pieces in each of the heating zones are respectively connected to different power lines, the heating pieces connected by each of the power lines are respectively located in different heating zones, and each of the heating zones is respectively connected to a different ground line. Each of the current-limiting elements is connected between two of the ground lines or two of the power lines, one current-limiting element is connected between two of the ground lines or two of the power lines, the number of the current-limiting elements is consistent with the number of the ground lines or the power lines, and a plurality of the current-limiting elements are connected in series to form a closed loop circuit. When the current-limiting element is connected between two ground lines, the current-limiting element allows a first current to flow through the plurality of heating pieces in a first heating zone, and allows a second current to flow through the plurality of heating pieces in a second heating zone adjacent to the first heating zone, wherein the second current is smaller than the first current. When the current-limiting element is connected between two power lines, the current-limiting element allows a first current to flow through the plurality of heating pieces connected by a first power line, and allows a second current to flow through the plurality of heating pieces connected by a second power line adjacent to the first power line, wherein the second current is smaller than the first current. The current-limiting element comprises a current-limiting resistor. The resistance of the current-limiting resistor is greater than or equal to one-eighth of the resistance of the heating piece, and the resistance of the current-limiting resistor is less than or equal to one-half of the resistance of the heating piece.

2. The multi-zone hot plate of claim 1, wherein, The current-limiting element comprises a current-limiting resistor and a unidirectional conductive element, the current-limiting resistor and the unidirectional conductive element are connected in series, and the unidirectional conductive element allows the current direction in the closed loop circuit to be in a clockwise direction or an anticlockwise direction.

3. The multi-zone hot plate of claim 1 or 2, wherein, The ground lines are led out of the substrate through first ports provided at the bottom of the substrate, and the power lines are led out of the substrate through second ports provided at the bottom of the substrate. When the current-limiting element is connected between two ground lines, the current-limiting resistor is provided at the first port. When the current-limiting element is connected between two power lines, the current-limiting resistor is provided at the second port.

4. The multi-zone hot plate of claim 1 or 2, wherein, The current-limiting resistor adopts a heating resistance wire, and the heating resistance wire is uniformly coiled in the substrate.

5. The multi-zone hot plate of claim 1, wherein, The heating zone comprises a first sub-heating zone and a second sub-heating zone, the first ends of all the heating pieces in the first sub-heating zone are connected to the ground line through a first unidirectional conductive element, the first ends of all the heating pieces in the second sub-heating zone are connected to the ground line through a second unidirectional conductive element, and the connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite.

6. A semiconductor processing apparatus, characterized by comprising: The multi-zone heating plate comprises a substrate made of insulating material, and a plurality of heating zones and a plurality of current-limiting elements are contained in the substrate. Each of the heating zones comprises a plurality of heating pieces for heating different areas of the substrate. The first ends of all the heating pieces in each of the heating zones are connected to the same ground line, and the second ends of each of the heating pieces in each of the heating zones are respectively connected to different power lines, the heating pieces connected by each of the power lines are respectively located in different heating zones, and each of the heating zones is respectively connected to a different ground line. Each of the current-limiting elements is connected between two of the ground lines or two of the power lines, one current-limiting element is connected between two of the ground lines or two of the power lines, the number of the current-limiting elements is consistent with the number of the ground lines or the power lines, and a plurality of the current-limiting elements are connected in series to form a closed loop circuit. When the current-limiting element is connected between two ground lines, the current-limiting element allows a first current to flow through the plurality of heating pieces in a first heating zone, and allows a second current to flow through the plurality of heating pieces in a second heating zone adjacent to the first heating zone, wherein the second current is smaller than the first current. When the current-limiting element is connected between two power lines, the current-limiting element allows a first current to flow through the plurality of heating pieces connected by a first power line, and allows a second current to flow through the plurality of heating pieces connected by a second power line adjacent to the first power line, wherein the second current is smaller than the first current. The current-limiting element comprises a current-limiting resistor. The resistance of the current-limiting resistor is greater than or equal to one-eighth of the resistance of the heating piece, and the resistance of the current-limiting resistor is less than or equal to one-half of the resistance of the heating piece. The current-limiting element comprises a current-limiting resistor and a unidirectional conductive element, the current-limiting resistor and the unidirectional conductive element are connected in series, and the unidirectional conductive element allows the current direction in the closed loop circuit to be in a clockwise direction or an anticlockwise direction. The ground lines are led out of the substrate through first ports provided at the bottom of the substrate, and the power lines are led out of the substrate through second ports provided at the bottom of the substrate. When the current-limiting element is connected between two ground lines, the current-limiting resistor is provided at the first port. When the current-limiting element is connected between two power lines, the current-limiting resistor is provided at the second port. The current-limiting resistor adopts a heating resistance wire, and the heating resistance wire is uniformly coiled in the substrate. The heating zone comprises a first sub-heating zone and a second sub-heating zone, the first ends of all the heating pieces in the first sub-heating zone are connected to the ground line through a first unidirectional conductive element, the first ends of all the heating pieces in the second sub-heating zone are connected to the ground line through a second unidirectional conductive element, and the connection directions of the first unidirectional conductive element and the second unidirectional conductive element are opposite. The multi-zone heating plate comprises a substrate made of insulating material, and a plurality of heating zones and a plurality of current-limiting elements are contained in the substrate. Each of the heating zones comprises a plurality of heating pieces for heating different areas of the substrate. The first ends of all the heating pieces in each of the heating zones are connected to the same ground line, and the second ends of each of the heating pieces in each of the heating zones are respectively connected to different power lines, the heating pieces connected by each of the power lines are respectively located in different heating zones, and each of the heating zones is respectively connected to a different ground line. Each of the current-limiting elements is connected between two of the ground lines or two of the power lines, one current-limiting element is connected between two of the ground lines or two of the power lines, the number of the current-limiting elements is consistent with the number of the ground lines or the power lines, and a plurality of the current-limiting elements are connected in series to form a closed loop circuit. When the current-limiting element is connected between two ground lines, the current-limiting element allows a first current to flow through the plurality of heating pieces in a first heating zone, and allows a second current to flow through the plurality of heating pieces in a second heating zone adjacent to the first heating zone, wherein the second current is smaller than the first current. When the current-limiting element is connected between two power lines, the current-limiting element allows a first current to flow through the plurality of heating pieces connected by a first power line, and allows a second current to flow through the plurality of heating pieces connected by a second power line adjacent to the first power line, wherein the second current is smaller than the first current. The current-limiting element comprises a current-limiting resistor. The resistance of the current-limiting resistor is greater than or equal to one-eighth of the resistance of the heating piece, and the resistance of the current-limiting resistor is less than or equal to one-half of the resistance of the heating piece. The current-limiting element comprises a current-limiting resistor and a unidirectional conductive element, the current-limiting resistor and the unidirectional conductive element are connected in series, and the unidirectional conductive element allows the current direction in the closed loop circuit to be in a clockwise direction or an anticlockwise direction. The ground lines are led out of the substrate through first ports provided at the bottom of the substrate, and the power lines are led out of the substrate through second ports provided at the bottom of the substrate. When the current-limiting element is connected between two ground lines, the current-limiting resistor is provided at the first port. When the current-limiting element is connected between two power lines, the current-limiting resistor is provided at the second port. The current-limiting resistor adopts a heating resistance wire, and the heating resistance wire is uniformly coiled in the substrate. The heating zone comprises a first sub-heating zone and a second sub-heating zone An electrostatic chuck is arranged on the multi-zone heating plate to support a substrate; A driving device is arranged below the base, the driving device comprises a driving power supply, a grounding terminal, a plurality of power switches and a plurality of grounding switches, one end of each power switch is connected to a power line passing through the base, and the other end is connected to the driving power supply, one end of each grounding switch is connected to a grounding line passing through the base, and the other end is connected to the grounding terminal.

7. The semiconductor processing apparatus of claim 6, wherein, Each heating zone in the multi-zone heating plate comprises a first sub-heating zone and a second sub-heating zone, the first ends of all the heating pieces in the first sub-heating zone are connected to the grounding line through first one-way conductive elements, the first ends of all the heating pieces in the second sub-heating zone are connected to the grounding line through second one-way conductive elements, and the connection directions of the first one-way conductive elements and the second one-way conductive elements are opposite; The driving power supply adopts a pulse heating power supply, the heating voltage output by the pulse heating power supply changes between a positive heating voltage and a negative heating voltage, and the heating voltage is applied to each heating piece in the first sub-heating zone and the second sub-heating zone through the power switches and the power lines.

8. The semiconductor processing apparatus of claim 6 or 7, wherein The semiconductor processing equipment further comprises a controller for controlling the on-off operation of the plurality of power switches and the plurality of grounding switches; The controller controls the plurality of grounding switches to be sequentially opened in turn; The controller controls the plurality of power switches to work in a pulse width modulation mode and adjusts the on-duty ratio of each power switch.

9. A multi-zone temperature control driving method for adjusting the temperature of the multi-zone heater plate in the semiconductor processing apparatus according to claim 8, characterized in that, The multi-zone temperature control driving method comprises: The current limiting element is connected between the two grounding lines, and the controller controls the plurality of grounding switches to be sequentially opened in turn: the heating zone connected to the currently opened grounding switch is used as an active heating zone, and the heating pieces in the active heating zone are applied with active heating power; The heating zone connected to the currently opened grounding switch through the current limiting element is used as a passive heating zone, and the heating pieces in the passive heating zone are applied with passive heating power; during the sequential opening of the grounding switches, each heating zone is used as an active heating zone and at least one passive heating zone, and each heating piece is applied with active heating power and at least passive heating power; The controller controls the plurality of power switches to work in a pulse width modulation mode, and adjusts the proportion of active heating power and passive heating power applied to the heating pieces connected to the power switches by adjusting the on-duty ratio of each power switch, so that the sum of the active heating power and all the passive heating power applied to the same heating piece is equal to the predetermined heating power of the heating piece.

10. The multi-zone temperature control driving method according to claim 9, wherein The passive heating zone comprises a plurality of passive heating zones: the heating zone connected to the currently opened grounding switch through one current limiting element is used as a first passive heating zone, and the heating pieces in the first passive heating zone are applied with first passive heating power; the heating zone connected to the currently opened grounding switch through two current limiting elements is used as a second passive heating zone, and the heating pieces in the second passive heating zone are applied with second passive heating power; Due to the voltage division effect of the current-limiting element, the active heating power is greater than the passive heating power, and the passive heating power of the upper stage is greater than the passive heating power of the lower stage.

11. A multi-zone temperature control driving method for adjusting the temperature of the multi-zone heater plate in the semiconductor processing apparatus according to claim 8, characterized in that, The multi-zone temperature control driving method comprises: The current-limiting element is connected between two power supply lines, the controller controls multiple grounding switches to be opened simultaneously, and the controller controls multiple power supply switches to be opened individually in sequence: multiple heating pieces directly connected with the currently opened power supply switch are active heating pieces, and the active heating pieces are applied with active heating power; multiple heating pieces connected with the currently opened power supply switch through the current-limiting element are passive heating pieces, and the passive heating pieces are applied with passive heating power; during the process of sequentially opening the power supply switches, each heating piece is used as a primary active heating piece and at least one passive heating piece, and each heating piece is applied with primary active heating power and at least one passive heating power; The controller controls multiple power supply switches to work in a pulse width modulation mode, and adjusts the proportion of the active heating power and the proportion of the passive heating power applied to the heating pieces connected with the power supply switches by adjusting the opening duty cycle of each power supply switch, so that the active heating power applied to the same heating piece and the sum of all passive heating powers are equal to the predetermined heating power of the heating piece.

12. The multi-zone temperature control driving method according to claim 11, wherein The passive heating pieces comprise multiple-stage passive heating pieces: the heating pieces connected with the currently opened power supply switch through one current-limiting element are first-stage passive heating pieces, and the first-stage passive heating pieces are applied with first-stage passive heating power; the heating pieces connected with the currently opened power supply switch through two current-limiting elements are second-stage passive heating pieces, and the second-stage passive heating pieces are applied with second-stage passive heating power; Due to the voltage division effect of the current-limiting element, the active heating power is greater than the passive heating power, and the passive heating power of the upper stage is greater than the passive heating power of the lower stage.

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