Display panel and display device

Abstract

The invention discloses a display panel and a display device. The display panel comprises a substrate, wherein the substrate comprises a display area and a non-display area; the display function layer is located on one side of the substrate; the blocking structure is located on the side, away from the substrate, of the display function layer and located in the non-display area; the blocking structure comprises a dam and a buffer structure; the packaging layer is located on the side, away from the display function layer, of the blocking structure; the buffer structure is located on the side, close to the display area, of the dam and / or located on the bottom face of the groove on the side away from the display area. The buffer structure is lower than the dam. According to the technical scheme provided by the embodiment of the invention, the gradient of the dam is reduced, so that the forming quality of the touch signal routing covering the side wall of the dam is improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panels have the advantages of being light, thin, high brightness, low power consumption, fast response, high clarity, good flexibility and high luminous efficiency, and are increasingly being used in the field of display technology.

[0003] In the current organic light emitting diode display panel, a dam is provided in the non-display area, and the formation quality of the touch signal wiring covering the side wall of the dam is not high. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a display panel and a display device to improve the formation quality of the touch signal wiring covering the sidewall of the dam.

[0005] An embodiment of the present invention provides a display panel, including:

[0006] A substrate, the substrate comprising a display area and a non-display area;

[0007] A display function layer, wherein the display function layer is located on one side of the substrate;

[0008] A blocking structure, the blocking structure is located on a side of the display function layer away from the substrate and located in the non-display area; the blocking structure includes a dam and a slope angle reduction structure;

[0009] The encapsulation layer is located on a side of the blocking structure away from the display function layer; wherein,

[0010] The buffer structure is located on a side of the dam close to the display area, and / or on a side away from the display area; the height of the buffer structure is smaller than the height of the dam.

[0011] In this technical solution, a buffer structure is provided on the bottom surface of the groove on the side of the dam close to the display area, and / or on the bottom surface of the groove on the side away from the display area, and the height of the buffer structure is less than the height of the dam, thereby reducing the depth of the groove on the side wall of the dam, thereby reducing the slope of the side wall of the dam, improving the formation quality of the touch signal routing covering the side wall of the dam, and avoiding the problem of easy disconnection.

[0012] Optionally, the buffer structure includes a plurality of strip structures, the plurality of strip structures are arranged at intervals of a first preset distance in a direction from the display area to the non-display area, the minimum spacing between the plurality of strip structures and the dam in a direction from the display area to the non-display area is a second preset distance, the first preset distance is greater than a minimum exposure spacing value of a photolithography process, and the second preset distance is greater than a minimum exposure spacing value of a photolithography process;

[0013] Preferably, the slope angles of the side walls of the plurality of strip structures close to the display area and away from the display area are less than 90°.

[0014] In this technical solution, multiple strip structures and dams are arranged at intervals, which reduces the depth of the grooves on the side walls of the dams, thereby reducing the slope of the side walls of the dams, improving the formation quality of the touch signal routing covering the side walls of the dams, and avoiding the problem of easy disconnection. In addition, two adjacent strip structures are arranged at intervals of a first preset distance greater than the minimum exposure spacing of the photolithography process in the direction from the display area to the non-display area, and multiple strip structures and dams are arranged at intervals of a second preset distance greater than the minimum exposure spacing of the photolithography process in the direction from the display area to the non-display area, indicating that in the direction from the display area to the non-display area, multiple strip structures and dams are separated, and two adjacent strip structures are also separated. When the strip structures are organic materials, the above technical solution can prevent water vapor from entering the display area from the non-display area along the strip structures, thereby improving the reliability of the display panel.

[0015] Preferably, the slope angles of the side walls of the multiple strip structures close to the display area and away from the display area are less than 90°, which can further reduce the slope of the dam side walls to improve the formation quality of the touch signal routing covering the dam side walls and avoid the problem of easy disconnection.

[0016] Optionally, the buffer structure includes a plurality of comb-tooth structures, and the plurality of comb-tooth structures are arranged at intervals with a minimum spacing of a third preset distance in a direction perpendicular to the display area and pointing toward the non-display area, and the third preset distance is less than a minimum exposure spacing of a photolithography process;

[0017] Preferably, the plurality of comb-tooth structures are connected to the dam, and the slope angle of the plurality of comb-tooth structures away from the side wall of the dam connected thereto is less than 90°.

[0018] In this technical solution, the buffer structure includes a plurality of comb-tooth structures, which reduce the depth of the groove of the dam side wall, thereby reducing the slope of the dam side wall, improving the formation quality of the touch signal line covering the dam side wall, and avoiding the problem of easy disconnection. In addition, the plurality of comb-tooth structures are arranged at intervals of a third preset distance less than the minimum exposure spacing of the photolithography process in a direction perpendicular to the display area and pointing to the non-display area, so that a gentle slope is formed between two adjacent comb-tooth structures, which can avoid the problem of disconnection of the touch signal line at the position between the two adjacent comb-tooth structures.

[0019] Preferably, multiple comb tooth structures are connected to the dam, and the thickness of the multiple comb tooth structures gradually decreases in the direction away from the dam to which they are connected, that is, the slope angle of the multiple comb teeth away from the side wall of the dam to which they are connected is less than 90°, which can further reduce the slope of the side wall of the dam to improve the formation quality of the touch signal routing covering the side wall of the dam and avoid the problem of easy disconnection.

[0020] Optionally, the buffer structure further includes a plurality of strip structures, the plurality of strip structures are arranged at intervals of a first preset distance in a direction from the display area to the non-display area, the minimum spacing between the plurality of strip structures and the plurality of comb-tooth structures in a direction from the display area to the non-display area is a fourth preset distance, the first preset distance is greater than a minimum exposure spacing value of a photolithography process, and the fourth preset distance is greater than a minimum exposure spacing value of a photolithography process;

[0021] Preferably, the slope angles of the side walls of the plurality of strip structures close to the display area and away from the display area are less than 90°.

[0022] In this technical solution, multiple comb-tooth structures reduce the depth of the grooves on the side walls of the dam, thereby reducing the slope of the side walls of the dam, improving the formation quality of the touch signal routing covering the side walls of the dam, and avoiding the problem of easy disconnection. In addition, multiple comb-tooth structures are arranged at intervals of a third preset distance that is less than the minimum exposure spacing of the photolithography process in a direction perpendicular to the display area and pointing to the non-display area, so that a gentle slope is formed between two adjacent comb-tooth structures, which can avoid the problem of touch signal routing being disconnected at the position between two adjacent comb-tooth structures. Multiple strip structures and dam intervals are arranged to reduce the depth of the grooves on the side walls of the dam, thereby reducing the slope of the side walls of the dam, improving the formation quality of the touch signal routing covering the side walls of the dam, and avoiding the problem of easy disconnection. Furthermore, two adjacent strip structures are arranged at a first preset distance greater than the minimum exposure spacing of the photolithography process in the direction from the display area to the non-display area, and multiple strip structures and multiple comb-tooth structures are arranged at a fourth preset distance greater than the minimum exposure spacing of the photolithography process in the direction from the display area to the non-display area, indicating that in the direction from the display area to the non-display area, multiple strip structures and multiple comb-tooth structures are separated and separated, and two adjacent strip structures are also separated. When the strip structure is an organic material, the above technical solution can prevent water vapor from entering the display area from the non-display area along the strip structure, thereby improving the reliability of the display panel.

[0023] Preferably, the slope angles of the side walls of the multiple strip structures close to the display area and away from the display area are less than 90°, which can further reduce the slope of the dam side walls to improve the formation quality of the touch signal routing covering the dam side walls and avoid the problem of easy disconnection.

[0024] Optionally, the dam comprises at least two sub-layers arranged in a stacked manner;

[0025] Part of the membrane layer of the buffer structure and the dam is located on the same layer.

[0026] In this technical solution, the buffer structure and the partial film layers of the dam are located in the same layer and made of the same material. In the process of completing the dam, the preparation of the buffer structure is completed, which simplifies the preparation process and reduces the preparation cost. Among them, the dam includes at least two stacked sub-layers, and in the direction from the substrate to the display function layer, the area of ​​at least two sub-layers gradually decreases to ensure that the side wall of the dam has a slope of a certain angle.

[0027] Optionally, the dam includes at least a first dam and a second dam, the first dam is located on a side of the second dam close to the display area, a groove is provided between the first dam and the second dam, and the height of the second dam is greater than that of the first dam;

[0028] The second dam includes a first sublayer, a second sublayer and a third sublayer which are sequentially stacked in a direction from the substrate to the display function layer;

[0029] The first dam includes a second sublayer and a third sublayer which are sequentially stacked in a direction from the substrate to the display function layer;

[0030] The buffer structure is at least located on the bottom surface of the groove at at least one position among a side of the first bank close to the display area, between the first bank and the second bank, and a side of the second bank away from the first bank;

[0031] Preferably, the buffer structure and any one of the first sublayer, the second sublayer and the third sublayer are located in the same layer.

[0032] In this technical solution, the dam includes at least a first dam and a second dam. Taking the organic layer as an inkjet printing layer as an example, the setting of the first dam and the second dam can prevent the ink from overflowing to the side of the second dam away from the display area during the inkjet printing of the organic layer of the encapsulation layer, thereby ensuring the encapsulation effect. The first dam can also block the external water and oxygen from invading the display area, thereby ensuring the display effect of the display panel. The height of the second dam is greater than the height of the first dam, and the second dam has the effect of further blocking the overflow of the organic layer and the invasion of water and oxygen into the display area. The more dams included in the dam, the better the effect of blocking the overflow of the organic layer and the invasion of water and oxygen into the display area.

[0033] Preferably, the first sublayer, the second sublayer and the third sublayer constitute the second dam, and the second sublayer and the third sublayer constitute the first dam; the buffer structure can be located in the same layer as the first sublayer and made of the same material; the buffer structure can be located in the same layer as the second sublayer and made of the same material; or the buffer structure can be located in the same layer as the third sublayer and made of the same material. In the process of preparing the dam, the preparation of the buffer structure is completed, the preparation process is simplified, and the preparation cost is reduced.

[0034] Optionally, the display function layer includes a driving circuit layer, a planarization layer, a pixel defining layer, a support layer and a display layer;

[0035] The driving circuit layer is located on one side of the substrate;

[0036] The planarization layer is located on a side of the driving circuit layer away from the substrate;

[0037] The pixel defining layer is located on a side of the planarizing layer away from the driving circuit layer, wherein the pixel defining layer includes a plurality of openings;

[0038] The supporting layer is located on a side of the pixel defining layer away from the driving circuit layer;

[0039] The display layer is located in the opening of the pixel defining layer;

[0040] The first sub-layer and the planarization layer are located at the same layer;

[0041] The second sublayer and the pixel defining layer are located in the same layer;

[0042] The third sublayer and the supporting layer are located at the same layer.

[0043] In this technical solution, the planarization layer, the pixel defining layer and the supporting layer are usually made of organic materials, that is, the sublayer included in the dam including at least the first dam and the second dam is an organic layer. Since the buffer structure and the dam are partially located in the same layer and made of the same material, the buffer structure is also made of organic materials. In addition, the preparation of the buffer structure and the dam is completed while the planarization layer, the pixel defining layer and the supporting layer are formed, which simplifies the preparation process and reduces the preparation cost.

[0044] Preferably, when the first sublayer and the planarization layer are located in the same layer and have the same material; the second sublayer and the pixel defining layer are located in the same layer and have the same material; the third sublayer and the supporting layer are located in the same layer and have the same material, if the pixel defining layer and the supporting layer are prepared using the same half-tone mask, then the buffer structure and the first sublayer can be arranged in the same layer and have the same material and be prepared using a common mask, thereby reducing the difficulty of simultaneously preparing the buffer structure and some sublayers of the dam.

[0045] Optionally, the driving circuit layer includes an insulating layer and a driving circuit and multiple signal lines located inside the insulating layer, the multiple signal lines are electrically connected to the driving circuit, the driving circuit is located in the display area, and the multiple signal lines are located in the non-display area; at least part of the multiple signal lines are located on a side of the first dam close to the display area and at least part of the multiple signal lines are located between the first dam and the second dam, and at least part of the multiple signal lines are spaced apart in a direction from the display area to the non-display area.

[0046] In this technical solution, at least part of the plurality of signal lines is located at least on one side of the first dam close to the display area, and at least part of the plurality of signal lines is located between the first dam and the second dam, and is arranged at intervals in the direction from the display area to the non-display area. Since the signal lines are located inside the insulating layer, there are sharp-angle depressions on the surface of the insulating layer away from the signal lines. The buffer structure is made of organic materials, has good flexibility and filling performance, alleviates the surface unevenness caused by the sharp-angle depressions, can avoid the problem of easy disconnection of the touch signal line when passing through the area corresponding to the sharp-angle depressions at the bottom surface of the side wall grooves of the first dam and the second dam, and can also avoid the delamination of the inorganic layer at the bottom surface of the side wall grooves of the first dam and the second dam, thereby avoiding the invasion of water and oxygen, and then ensuring the encapsulation effect of the encapsulation layer.

[0047] Optionally, the encapsulation layer includes an inorganic layer and an organic layer stacked in layers; the organic layer is located on a side of the blocking structure close to the display area, and the inorganic layer is located in the display area and the non-display area and covers the blocking structure;

[0048] The display panel also includes a touch layer, which is located on a side of the packaging layer away from the blocking structure. The touch layer includes touch electrodes and touch signal wiring. The touch electrodes are located in the display area, and the touch signal wiring is located in the non-display area and covers the blocking structure.

[0049] In this technical solution, the inorganic layer is located in the display area and the non-display area, and covers the blocking structure to prevent external water and oxygen from invading the display area, thereby ensuring the display effect of the display panel. The touch electrode is located in the display area, and is used to realize a display panel with a touch function. The touch signal line is located in the non-display area and covers the blocking structure. The height of the buffer structure in the blocking structure is less than the height of the dam, which reduces the depth of the groove on the side wall of the dam, thereby reducing the slope of the side wall of the dam, improving the formation quality of the touch signal line covering the side wall of the dam, and avoiding the problem of easy disconnection.

[0050] An embodiment of the present invention further provides a display device, comprising any display panel described in the embodiment of the present invention.

[0051] In this technical solution, the display device also has the beneficial effects described for the display panel in the above embodiment, which will not be described in detail here.

[0052] The technical solution provided by the embodiment of the present invention is to set a buffer structure on the bottom surface of the groove on the side of the dam close to the display area, and / or on the bottom surface of the groove on the side away from the display area, and the height of the buffer structure is less than the height of the dam, thereby reducing the depth of the groove on the side wall of the dam, thereby reducing the slope of the side wall of the dam, improving the formation quality of the touch signal routing covering the side wall of the dam, and avoiding the problem of easy disconnection. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a top view of a display panel provided by the prior art;

[0054] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure along the A1-A2 direction;

[0055] Figure 3 is a top view of a display panel provided by an embodiment of the present invention;

[0056] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure in the A1-A2 direction;

[0057] Figure 5 for Figure 3 An enlarged view of a top view of a first dam, a second dam, and a buffer structure;

[0058] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the B1-B2 direction;

[0059] Figure 7 yes Figure 3 Another schematic diagram of the cross-sectional structure in the A1-A2 direction;

[0060] Figure 8 for Figure 3 Another enlarged view of a top view of the first dam, the second dam and the buffer structure;

[0061] Fig. 9 for Figure 8 Schematic diagram of the cross-sectional structure along the B1-B2 direction;

[0062] Fig.10 yes Figure 3 Another schematic diagram of the cross-sectional structure in the A1-A2 direction;

[0063] Fig.11 for Figure 3 A magnified view of a top view of a first dam, a second dam, and a buffer structure;

[0064] Fig.12 for Fig.11 Schematic diagram of the cross-sectional structure along the B1-B2 direction;

[0065] Fig.13 yes Figure 3 A schematic diagram of the cross-sectional structure of the middle display area in the direction of C1-C2;

[0066] Fig.14 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0067] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0068] In current organic light emitting diode display panels, the formation quality of the touch signal wiring covering the sidewalls of the dam is not high. Figure 1 and Figure 2 As shown, Figure 1 is a top view of a display panel provided by the prior art, Figure 2 yes Figure 1 The cross-sectional structure schematic diagram along the A1-A2 direction in the figure shows that the display panel includes a substrate 100, a display function layer 200, a dam L1, an encapsulation layer 400, a touch layer 500, a filling layer 600, a polarizer 700 and a cover plate 800. The substrate 100 includes a display area AA and a non-display area NA located on at least one side of the display area AA. Figure 2 Only part of the display area AA and part of the non-display area NA are shown. The display function layer 200 is located on one side of the substrate 100, and the dam L1 is located in the non-display area NA on the side of the display function layer 200 away from the substrate 100, and is arranged around the display area AA. A groove T01 is provided on the side of the dam L1 close to the display area AA, and a groove T02 is provided on the side of the dam L1 away from the display area AA. The encapsulation layer 400 exemplarily includes a first inorganic layer 401, a second inorganic layer 402 and an organic layer 403, and the organic layer 403 is located between the first inorganic layer 401 and the second inorganic layer 402. The touch layer 500 includes a touch electrode 501 and a touch signal line 502. The touch signal line 502 needs to pass through the side wall of the dam L1 close to the display area AA, the top surface of the dam L1 away from the display function layer 200, and the side wall of the dam L1 away from the display area AA to reach the pad of the binding area 900 for binding connection.

[0069] In the process of realizing the present invention, the inventors discovered the following problems in the related art: In the prior art, before the touch signal line 502 is formed, in addition to the first inorganic layer 401 and the second inorganic layer 402 of the encapsulation layer 400, no other film layer is provided to alleviate the relatively large slope of the dam L1, thereby resulting in the touch signal line 502 covering the side wall of the dam L1 being of low formation quality and easy to break.

[0070] In view of the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0071] like Figure 3 and Figure 4 As shown, Figure 3 is a top view of a display panel provided by an embodiment of the present invention, Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure in the direction of A1-A2, the display panel comprises: a substrate 100, the substrate 100 comprises a display area AA and a non-display area NA; a display function layer 200, the display function layer 200 is located on one side of the substrate 100; a blocking structure L0, the blocking structure L0 is located on the side of the display function layer 200 away from the substrate 100, and is located in the non-display area NA; the blocking structure L0 comprises a dam L1 and a buffer structure L2; an encapsulation layer 400, the encapsulation layer 400 is located on the side of the blocking structure L0 away from the display function layer 200. The buffer structure L2 is located on the bottom surface of the groove on the side of the dam L1 close to the display area AA, and / or, on the bottom surface of the groove away from the display area AA; the height of the buffer structure L2 is less than the height of the dam L1, and is used to reduce the slope of the side wall of the dam L1. It should be noted that the slope and slope angle in the present invention are well-known definitions, the slope can be understood as the ratio of the vertical height to the horizontal width of the slope, and the slope angle is the tangent value of the slope.

[0072] Illustratively, in this embodiment, the blocking structure L0 is disposed around the display area AA to prevent water and oxygen from invading the display area AA, thereby ensuring the display effect of the display panel.

[0073] like Figure 4 As shown, when the dam L1 includes at least the first dam 300 and the second dam 301, the buffer structure L2 is located on the bottom surface of the groove of the dam L1 close to the display area AA, and / or the bottom surface of the groove located away from the display area AA includes the following schemes:

[0074] The buffer structure L2 is located at the bottom surface of the groove T03 on the side of the first dam 300 close to the display area AA, and / or, at the bottom surface of the groove T04 on the side away from the display area AA; and the buffer structure L2 is located at the bottom surface of the groove T04 on the side of the second dam 301 close to the display area AA, and / or, at the bottom surface of the groove T05 on the side away from the display area AA. In the embodiment of the present invention, only the bottom surface of the groove T03 on the side of the first dam 300 close to the display area AA, the bottom surface of the groove T04 on the side of the first dam 300 away from the display area AA, the bottom surface of the groove T04 on the side of the second dam 301 close to the display area AA, and the bottom surface of the groove T05 on the side of the second dam 301 away from the display area AA are shown. It should be noted that the groove T04 on the side of the first dam 300 away from the display area AA and the groove T04 on the side of the second dam 301 close to the display area AA are the same groove, that is, the groove located between the first dam 300 and the second dam 301 .

[0075] The technical solution provided by the embodiment of the present invention is to set a buffer structure L2 on the bottom surface of the groove on the side of the dam L1 close to the display area AA, and / or on the bottom surface of the groove on the side away from the display area AA, and the height of the buffer structure L2 is less than the height of the dam L1, thereby reducing the depth of the groove on the side wall of the dam L1, thereby reducing the slope of the side wall of the dam L1, improving the formation quality of the touch signal wiring 502 covering the side wall of the dam L1, and avoiding the problem of easy disconnection.

[0076] In an embodiment of the present invention, the height of the buffer structure L2 is less than the height of the dam L1, and the slope angle of the side wall of the dam L1 can be reduced to a range less than or equal to 20°, so as to improve the formation quality of the touch signal line 502 covering the side wall of the dam L1 and avoid the problem of easy disconnection.

[0077] The specific structure of the buffer structure L2 is described in detail below.

[0078] The first structure of the buffer structure L2 is as follows:

[0079] Optionally, based on the above technical solution, Figure 3 and Figure 4 as well as Figure 5 and Figure 6 As shown, Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure in the A1-A2 direction. Figure 5 for Figure 3 An enlarged view of a top view of a first dam, a second dam and a buffer structure, Figure 6 for Figure 5 The schematic cross-sectional structure diagram along the B1-B2 direction in FIG. 1 , the buffer structure L2 includes a plurality of strip structures 306, and the plurality of strip structures 306 are directed from the display area AA to the non-display area NA (ie Figure 5 The plurality of strip structures 306 and the dam L1 are arranged at intervals of a first preset distance in the Y direction of the display area AA pointing to the non-display area NA, and the minimum spacing between the plurality of strip structures 306 and the dam L1 is a second preset distance. The first preset distance is greater than the minimum exposure spacing of the photolithography process, and the second preset distance is greater than the minimum exposure spacing of the photolithography process.

[0080] In this embodiment, the bank L1 is described as including the first bank 300 and the second bank 301. The direction from the display area AA to the non-display area NA is the Y direction.

[0081] It should be noted that Figure 5 Only the first bank 300, the second bank 301, and the plurality of strip structures 306 included in the buffer structure L2 are shown. Figure 6Also shown are the substrate 100 , the display function layer 200 , the first inorganic layer 401 and the second inorganic layer 402 included in the encapsulation layer 400 , the filling layer 600 , the polarizer 700 , and the cover plate 800 .

[0082] Specifically, the plurality of strip structures 306 and the dam L1 are arranged at intervals, which reduces the depth of the groove on the side wall of the dam L1, thereby reducing the slope of the side wall of the dam L1, improving the formation quality of the touch signal wiring 502 covering the side wall of the dam L1, and avoiding the problem of easy disconnection. Figure 5 The strip structures 306 and the dam L1 are arranged at intervals of a first preset distance greater than the minimum exposure spacing of the photolithography process in the direction from the display area AA to the non-display area NA, and are arranged at intervals of a second preset distance greater than the minimum exposure spacing of the photolithography process, indicating that in the direction from the display area AA to the non-display area NA, the strip structures 306 and the dam L1 are separated, and two adjacent strip structures 306 are also separated. When the strip structures 306 are made of organic materials, the above technical solution can prevent water vapor from entering the display area AA from the non-display area NA along the strip structures 306, thereby improving the reliability of the display panel.

[0083] Preferably, the slope angles of the side walls of the multiple strip structures 306 close to the display area AA and away from the display area AA are less than 90°, which can further reduce the slope of the side wall of the dam L1 to improve the formation quality of the touch signal line 502 covering the side wall of the dam L1 and avoid the problem of easy disconnection.

[0084] Exemplarily, the minimum exposure spacing of the photolithography process is 2 microns, and the first preset distance and the second preset distance can be specifically set within a range greater than or equal to 3 microns and less than or equal to 5 microns, for example, 3 microns, 3.5 microns, 4 microns, 4.5 microns, and 5 microns.

[0085] The second structure of the buffer structure L2 is as follows:

[0086] Optionally, based on the above technical solution, Figure 3 and Figure 7 as well as Figure 8 and Fig. 9 As shown, Figure 8 for Figure 3 Another enlarged view of a top view of the first dam, the second dam and the buffer structure, Fig. 9 for Figure 8 The cross-sectional structure schematic diagram along the B1-B2 direction in FIG. 1 , the buffer structure L2 includes a plurality of comb-tooth structures 305, and the plurality of comb-tooth structures 305 are perpendicular to the display area AA and point to the non-display area NA (ie Figure 8The first and second electrodes are arranged at a third preset distance in the X direction of the photolithography process, and the third preset distance is smaller than the minimum exposure pitch of the photolithography process.

[0087] In this embodiment, the bank L1 includes the first bank 300 and the second bank 301. The direction from the display area AA to the non-display area NA is the Y direction, and the direction perpendicular to the display area AA to the non-display area NA is the X direction.

[0088] It should be noted that Figure 8 Only the first bank 300 , the second bank 301 , and the plurality of comb-teeth structures 305 included in the buffer structure L2 are shown. Fig. 9 Also shown are the substrate 100 , the display function layer 200 , the first inorganic layer 401 and the second inorganic layer 402 included in the encapsulation layer 400 , the filling layer 600 , the polarizer 700 , and the cover plate 800 .

[0089] Specifically, the buffer structure L2 includes a plurality of comb-tooth structures 305, which reduce the depth of the groove on the side wall of the dam L1, thereby reducing the slope of the side wall of the dam L1, improving the formation quality of the touch signal wiring 502 covering the side wall of the dam L1, and avoiding the problem of easy disconnection. The plurality of comb-tooth structures 305 are perpendicular to the direction from the display area AA to the non-display area NA (i.e. Figure 8 In the X direction of the photolithography process, the three comb-tooth structures 305 are arranged at intervals of a third preset distance less than the minimum exposure pitch of the photolithography process, so that a gentle slope is formed between two adjacent comb-tooth structures 305, thereby avoiding the problem of disconnection of the touch signal wiring 502 at the position between two adjacent comb-tooth structures 305. Exemplarily, the minimum exposure pitch of the photolithography process is 2 microns, and the third preset distance can be selected to include but is not limited to a spacing of 1.5 microns or 1.4 microns.

[0090] Preferably, multiple comb-tooth structures 305 are connected to the dam L1, and the thickness of the multiple comb-tooth structures 305 gradually decreases in the direction away from the dam L1 connected thereto, that is, the slope angle of the multiple comb-tooth structures 305 away from the side wall of the dam L1 connected thereto is less than 90°, which can further reduce the slope of the side wall of the dam L1 to improve the formation quality of the touch signal routing 502 covering the side wall of the dam L1 and avoid the problem of easy disconnection.

[0091] The third structure of the buffer structure L2 is as follows:

[0092] Optionally, based on the above technical solution, Figure 3 and Fig.10 as well as Fig.11 and Fig.12 As shown, Fig.10 yes Figure 3Another cross-sectional structure schematic diagram in the A1-A2 direction, Fig.11 for Figure 3 A magnified view of a top view of the first dam, the second dam and the buffer structure, Fig.12 for Fig.11 The cross-sectional structure diagram along the B1-B2 direction in FIG. 1 , the buffer structure L2 includes a plurality of comb-tooth structures 305, the plurality of comb-tooth structures 305 are connected to the dam L1, and the plurality of comb-tooth structures 305 are perpendicular to the display area AA and point to the non-display area NA (i.e. Fig.11 The buffer structure L2 further includes a plurality of strip structures 306, and the plurality of strip structures 306 are arranged in a direction from the display area AA to the non-display area NA (i.e., the direction from the display area AA to the non-display area NA). Fig.11 The plurality of strip structures 306 and the plurality of comb-tooth structures 305 are arranged at intervals of a first preset distance in the display area AA pointing to the non-display area NA direction (i.e. Fig.11 The minimum spacing in the Y direction) is a fourth preset distance, the first preset distance is greater than the minimum exposure spacing of the photolithography process, and the fourth preset distance is greater than the minimum exposure spacing of the photolithography process.

[0093] In this embodiment, the bank L1 includes the first bank 300 and the second bank 301. The direction from the display area AA to the non-display area NA is the Y direction, and the direction perpendicular to the display area AA to the non-display area NA is the X direction.

[0094] It should be noted that Fig.11 Only the first bank 300, the second bank 301, and the plurality of comb-teeth structures 305 included in the buffer structure L2 are shown. Fig.12 Also shown are the substrate 100 , the display function layer 200 , the first inorganic layer 401 and the second inorganic layer 402 included in the encapsulation layer 400 , the filling layer 600 , the polarizer 700 , and the cover plate 800 .

[0095] Specifically, the plurality of comb-tooth structures 305 reduce the depth of the groove of the side wall of the dam L1, thereby reducing the slope of the side wall of the dam L1, improving the formation quality of the touch signal wiring 502 covering the side wall of the dam L1, and avoiding the problem of easy disconnection. Fig.11In the X direction in the lithography process), the strip structures 306 are arranged at intervals with a third preset distance less than the minimum exposure spacing of the photolithography process, so that a relatively gentle slope is formed between two adjacent comb-tooth structures 305, which can avoid the problem of disconnection of the touch signal line 502 at the position between the two adjacent comb-tooth structures 305. The plurality of strip structures 306 and the dam L1 are arranged at intervals, which reduces the depth of the groove on the side wall of the dam L1, thereby reducing the slope of the side wall of the dam L1, improving the formation quality of the touch signal line 502 covering the side wall of the dam L1, and avoiding the problem of easy disconnection. In addition, the adjacent two strip structures 306 are arranged in the direction from the display area AA to the non-display area NA (i.e. Fig.11 The plurality of strip structures 306 and the plurality of comb-tooth structures 305 are arranged at intervals of a first preset distance greater than the minimum exposure pitch of the photolithography process in the direction from the display area AA to the non-display area NA at a fourth preset distance greater than the minimum exposure pitch of the photolithography process, indicating that the plurality of strip structures 306 and the plurality of comb-tooth structures 305 are arranged at intervals of a fourth preset distance greater than the minimum exposure pitch of the photolithography process in the direction from the display area AA to the non-display area NA (i.e. Fig.11 In the Y direction of the display panel, the plurality of strip structures 306 and the plurality of comb-tooth structures 305 are separated from each other, and two adjacent strip structures 306 are separated from each other. When the strip structures 306 are made of organic materials, the above technical solution can prevent water vapor from entering the display area AA from the non-display area NA along the strip structures 306, thereby improving the reliability of the display panel.

[0096] For example, the minimum exposure pitch of the photolithography process is 2 microns, and the third preset distance can be selected to include but is not limited to a pitch of 1.5 microns or 1.4 microns. The first preset distance and the fourth preset distance can be set in a range greater than or equal to 3 microns and less than or equal to 5 microns, for example, 3 microns, 4 microns, and 5 microns.

[0097] Preferably, in this embodiment, the slope angles of the side walls of the multiple strip structures 306 close to the display area AA and the side walls away from the display area AA are less than 90°, which can further reduce the slope of the side walls of the dam L1 to improve the formation quality of the touch signal routing 502 covering the side walls of the dam L1 and avoid the problem of easy disconnection.

[0098] In order to simplify the preparation process of the buffer structure L2 and the dam L1, an embodiment of the present invention also proposes the following technical solution: Optionally, based on the above technical solution, the dam L1 includes at least two stacked sub-layers; part of the membrane layers of the buffer structure L2 and the dam L1 are located in the same layer and are made of the same material.

[0099] Specifically, the buffer structure L2 and part of the film layer of the dam L1 are located in the same layer and made of the same material. In the process of completing the dam L1, the preparation of the buffer structure L2 is completed, which simplifies the preparation process and reduces the preparation cost. Among them, the dam L1 includes at least two stacked sub-layers, and in the direction from the substrate 100 to the display function layer 200, the area of ​​at least two sub-layers gradually decreases to ensure that the side wall of the dam L1 forms a slope with a certain angle.

[0100] Optionally, based on the above technical solution, Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.10 as well as Fig.12 As shown, the dam L1 at least includes a first dam 300 and a second dam 301, the first dam 300 is located on a side of the second dam 301 close to the display area AA, a groove T04 is arranged between the first dam 300 and the second dam 301, and the height of the second dam 301 is greater than the height of the first dam 300; the second dam 301 includes a first sublayer 302, a second sublayer 303 and a third sublayer 304 stacked in sequence in the direction of the substrate 100 pointing to the display function layer 200; the first dam 300 includes a second sublayer 303 and a third sublayer 304 stacked in sequence in the direction of the substrate 100 pointing to the display function layer 200; the buffer structure L2 is at least located on the bottom surface of the groove at at least one position on the side of the first dam 300 close to the display area AA, between the first dam 300 and the second dam 301, and on the side of the second dam 301 away from the first dam 300.

[0101] By way of example, in the embodiment of the present invention, the figure only shows the bottom surface of the groove T03 of the buffer structure L2 located on the side of the first dam 300 close to the display area AA, the bottom surface of the groove T04 between the first dam 300 and the second dam 301, and the bottom surface of the groove T05 located on the side of the second dam 301 away from the first dam 300.

[0102] Specifically, the dam L1 includes at least a first dam 300 and a second dam 301. In this embodiment, the dam L1 includes the first dam 300 and the second dam 301 as an example for description. Taking the organic layer 403 as an inkjet printing layer as an example, the arrangement of the first dam 300 and the second dam 301 can prevent the ink from overflowing to the side of the second dam 301 away from the display area AA during the inkjet printing process of the organic layer 403 of the encapsulation layer 400, thereby ensuring the encapsulation effect. The first dam 300 can also block the external water and oxygen from invading the display area AA, thereby ensuring the display effect of the display panel. The height of the second dam 301 is greater than the height of the first dam 300, and the second dam 301 has the effect of further blocking the overflow of the organic layer 403 and the invasion of water and oxygen into the display area AA. The more dams included in the dam L1, the better the effect of blocking the overflow of the organic layer 403 and the invasion of water and oxygen into the display area AA.

[0103] It will be specifically described below that the sublayer included in the dam L1 can be located in the same layer as a part of the film layer of the display function layer 200 located in the display area AA, and the materials are the same.

[0104] Preferably, the buffer structure L2 and any one of the first sub-layer 302 , the second sub-layer 303 and the third sub-layer 304 are located in the same layer and are made of the same material.

[0105] Specifically, the first sublayer 302, the second sublayer 303 and the third sublayer 304 constitute the second dam 301, and the second sublayer 303 and the third sublayer 304 constitute the first dam 300; the buffer structure L2 can be located in the same layer as the first sublayer 302, and the materials are the same; the buffer structure L2 can be located in the same layer as the second sublayer 303, and the materials are the same; or, the buffer structure L2 can also be located in the same layer as the third sublayer 304, and the materials are the same. In the process of preparing the dam L1, the preparation of the buffer structure L2 is completed, the preparation process is simplified, and the preparation cost is reduced. Optionally, on the basis of the above technical solution, if Fig.13 As shown, Fig.13 yes Figure 3 Schematic diagram of the cross-sectional structure of the display area C1-C2 direction, the display function layer 200 includes a driving circuit layer 201, a planarization layer 202, a pixel defining layer 203, a support layer 204 and a display layer 205; the driving circuit layer 201 is located on one side of the substrate 100; the planarization layer 202 is located on the side of the driving circuit layer 201 away from the substrate 100; the pixel defining layer 203 is located on the side of the planarization layer 202 away from the driving circuit layer 201, wherein the pixel defining layer 203 includes a plurality of openings; the support layer 204 is located on the side of the pixel defining layer 203 away from the planarization layer 202; the display layer 205 is located in the opening of the pixel defining layer 203; Figure 4 , Figure 6 , Figure 7 , Fig. 9, Fig.10 as well as Fig.12 As shown, the first sublayer 302 and the planarization layer 202 are located in the same layer and have the same material; the second sublayer 303 and the pixel defining layer 203 are located in the same layer and have the same material; the third sublayer 304 and the support layer 204 are located in the same layer and have the same material.

[0106] Specifically, the planarization layer 202, the pixel defining layer 203 and the supporting layer 204 are usually made of organic materials, that is, the sublayer of the dam L1 including at least the first dam 300 and the second dam 301 is an organic layer. Since the buffer structure L2 and the part of the film layer of the dam L1 are located in the same layer and made of the same material, the buffer structure L2 is also made of organic materials. And the preparation of the buffer structure L2 and the dam L1 is completed at the same time as the planarization layer 202, the pixel defining layer 203 and the supporting layer 204 are formed, which simplifies the preparation process and reduces the preparation cost.

[0107] Preferably, when the first sublayer 302 and the planarization layer 202 are located in the same layer and have the same material; the second sublayer 303 and the pixel defining layer 203 are located in the same layer and have the same material; the third sublayer 304 and the supporting layer 204 are located in the same layer and have the same material, if the pixel defining layer 203 and the supporting layer 204 are prepared using the same half-tone mask, then the buffer structure L2 and the first sublayer 302 can be arranged to be located in the same layer and have the same material and be prepared using a common mask, thereby reducing the difficulty of simultaneously preparing the buffer structure L2 and part of the sublayers of the dam L1.

[0108] Optionally, based on the above technical solution, Fig.13 as well as Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.10 and Fig.12 The driving circuit layer 201 includes an insulating layer 2010, and a driving circuit and multiple signal lines located inside the insulating layer 2010, the multiple signal lines are electrically connected to the driving circuit, the driving circuit is located in the display area AA, and the multiple signal lines are located in the non-display area NA; at least part of the multiple signal lines are at least located on one side of the first dam 300 close to the display area AA, and at least part of the multiple signal lines are located between the first dam 300 and the second dam 301, and are arranged at intervals in the direction from the display area AA to the non-display area NA.

[0109] Specifically, at least part of the plurality of signal lines is at least located on one side of the first dam 300 close to the display area, and at least part of the plurality of signal lines is located between the first dam 300 and the second dam 301, and is arranged at intervals in the direction from the display area AA to the non-display area NA. Since the signal lines are located inside the insulating layer 2010, there is an acute angle depression S0 on the surface of the insulating layer 2010 away from the signal lines. The buffer structure L2 is made of organic material, has good flexibility and filling performance, alleviates the surface unevenness caused by the acute angle depression S0, can avoid the problem of easy disconnection of the touch signal line 502 when passing through the area corresponding to the acute angle depression S0 at the bottom surface of the side wall groove of the first dam 300 and the second dam 301, and can also avoid the delamination of the inorganic layer at the bottom surface of the side wall groove of the first dam 300 and the second dam 300, thereby avoiding the invasion of water and oxygen, and then ensuring the encapsulation effect of the encapsulation layer 400.

[0110] It should be noted that the driving circuit is not explicitly shown in the drawings of the embodiments of the present invention. The driving circuit is composed of a storage capacitor and a plurality of thin film transistors, and is used to provide a driving electrical signal for the light-emitting unit included in the display layer 205. Exemplarily, the multiple signal lines in the driving circuit layer 201 include a first signal line prepared by a first metal layer M1, and a second signal line prepared by a second metal layer M2. The first metal layer M1 and the second metal layer M2 can be located in the same layer as the metal layer provided in the driving circuit, and the material is the same, so as to simplify the preparation process and reduce the preparation cost. The first signal line and the second signal line can be used as a data line or a scan line electrically connected to the driving circuit.

[0111] like Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.10 as well as Fig.12As shown, the first signal line made of the first metal layer M1 and the second signal line made of the second metal layer M2 are at least located on one side of the first dam 300 close to the display area AA and at least between the first dam 300 and the second dam 301, and are arranged at intervals in the direction from the display area AA to the non-display area NA, and the surface of the insulating layer 2010 away from the first signal line made of the first metal layer M1 and the second signal line made of the second metal layer M2 has an acute angle depression S0 at two adjacent signal lines. When the touch signal line 502 passes through the bottom surface of the groove at the side wall of the first dam 300 and the second dam 301, the flexibility and filling performance of the first inorganic layer 401 and the second inorganic layer 402 are not good, and the touch signal line 502 is easily broken when passing through the area corresponding to the acute angle depression S0 at the bottom surface of the groove at the side wall of the first dam 300 and the second dam 301. In this embodiment, the planarization layer 202, the pixel defining layer 203 and the support layer 204 are usually made of organic materials, so that the sublayers included in the first dam 300 and the second dam 301 are organic layers. Since the buffer structure L2 and the partial film layers of the dam L1 are located in the same layer and are made of the same material, the buffer structure L2 is also made of organic materials, so that the buffer structure L2 has good flexibility and filling performance, which can avoid the problem of easy disconnection of the touch signal line 502 when passing through the area corresponding to the sharp angle depression S0 at the bottom surface of the groove at the side wall of the first dam 300 and the second dam 301. The buffer structure L2 is made of organic materials and has good flexibility and filling performance, which can avoid the delamination between the first inorganic layer 401 and the second inorganic layer 402 at the bottom surface of the groove at the side wall of the first dam 300 and the second dam 301, thereby avoiding the invasion of water and oxygen, and then ensuring the encapsulation effect of the encapsulation layer 400.

[0112] Optionally, combined Fig.13 as well as Figure 4 , Figure 6 , Figure 7 , Fig. 9 , Fig.10 and Fig.12 The driving circuit layer 201 also shows a third signal line made of a third metal layer M3, which can be used as a power signal line. The third signal line made of the third metal layer M3 is located on the side of the insulating layer 2010 away from the substrate 100.

[0113] Optionally, based on the above technical solution, Figure 4As shown, the encapsulation layer 400 is located on the side of the blocking structure L0 away from the display function layer 200, and the encapsulation layer 400 includes a stacked inorganic layer (exemplarily, the inorganic layer includes a first inorganic layer 401 and a second inorganic layer 402) and an organic layer 403; the organic layer 403 is located on the side of the blocking structure L0 close to the display area AA, the inorganic layer is located in the display area AA and the non-display area NA, and covers the blocking structure L0; the touch layer 500, the touch layer 500 is located on the side of the encapsulation layer 400 away from the blocking structure L0, the touch layer 500 includes a touch electrode 501 and a touch signal wiring 502, the touch electrode 501 is located in the display area AA, the touch signal wiring 502 is located in the non-display area NA, and covers the blocking structure L0.

[0114] Specifically, the inorganic layer is located in the display area AA and the non-display area NA, and covers the blocking structure L0, which is used to block the external water and oxygen from invading the display area AA, thereby ensuring the display effect of the display panel. The touch electrode 501 is located in the display area AA, and is used to realize a display panel with a touch function. The touch signal line 502 is located in the non-display area NA, and covers the blocking structure L0. The height of the buffer structure L2 in the blocking structure L0 is less than the height of the dam L1, which reduces the depth of the groove on the side wall of the dam L1, thereby reducing the slope of the side wall of the dam L1, improving the formation quality of the touch signal line 502 covering the side wall of the dam L1, and avoiding the problem of easy disconnection.

[0115] An embodiment of the present invention further provides a display device, Fig.14 A schematic diagram of the structure of a display device provided by an embodiment of the present invention. Fig.14 , the display device 01a includes the display panel 01b described in the above embodiment, therefore, the display device provided in the embodiment of the present invention also has the beneficial effects described in the above embodiment, which will not be described in detail here. For example, the display device can be an electronic device such as a mobile phone, a computer or a wearable device, and the embodiment of the present invention does not limit the specific form of the display device.

[0116] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: A substrate, the substrate comprising a display area and a non-display area; A display function layer, wherein the display function layer is located on one side of the substrate; A blocking structure, the blocking structure is located on a side of the display function layer away from the substrate and located in the non-display area; the blocking structure includes a dam and a buffer structure; An encapsulation layer, the encapsulation layer is located on a side of the blocking structure away from the display function layer; wherein, The buffer structure is located on a side of the dam close to and / or away from the display area, and the height of the buffer structure is smaller than the height of the dam.

2. The display panel according to claim 1, characterized in that: The buffer structure comprises a plurality of strip structures, wherein the plurality of strip structures are arranged at intervals of a first preset distance in a direction from the display area to the non-display area, and a minimum distance between the plurality of strip structures and the dam in a direction from the display area to the non-display area is a second preset distance, wherein the first preset distance is greater than a minimum exposure spacing value of a photolithography process, and the second preset distance is greater than a minimum exposure spacing value of the photolithography process; Preferably, the slope angles of the side walls of the plurality of strip structures close to the display area and away from the display area are less than 90°.

3. The display panel according to claim 1, characterized in that: The buffer structure comprises a plurality of comb-tooth structures, wherein the plurality of comb-tooth structures are arranged at intervals with a minimum spacing of a third preset distance in a direction perpendicular to the display area and pointing to the non-display area, and the third preset distance is less than a minimum exposure spacing value of a photolithography process; Preferably, the plurality of comb-tooth structures are connected to the dam, and a slope angle of the plurality of comb-tooth structures away from a side wall of the dam connected to the plurality of comb-tooth structures is less than 90°.

4. The display panel according to claim 3, characterized in that: The buffer structure further comprises a plurality of strip structures, wherein the plurality of strip structures are arranged at intervals of a first preset distance in a direction from the display area to the non-display area, and a minimum spacing between the plurality of strip structures and the plurality of comb-tooth structures in a direction from the display area to the non-display area is a fourth preset distance, wherein the first preset distance is greater than a minimum exposure spacing value of the photolithography process, and the fourth preset distance is greater than a minimum exposure spacing value of the photolithography process; Preferably, the slope angles of the side walls of the plurality of strip structures close to the display area and away from the display area are less than 90°.

5. The display panel according to any one of claims 1 to 4, characterized in that: The dam comprises at least two sub-layers arranged in a stacked manner; At least a portion of the membrane layers of the buffer structure and the dam are located in the same layer.

6. The display panel according to claim 5, characterized in that: The dam at least includes a first dam and a second dam, the first dam is located on a side of the second dam close to the display area, a groove is provided between the first dam and the second dam, and the height of the second dam is greater than that of the first dam; The second dam comprises a first sublayer, a second sublayer and a third sublayer which are sequentially stacked in a direction from the substrate to the display function layer; The first dam includes the second sublayer and the third sublayer which are sequentially stacked in a direction from the substrate to the display function layer; The buffer structure is at least located on the bottom surface of the groove at at least one position of a side of the first dam close to the display area, between the first dam and the second dam, and a side of the second dam away from the first dam; Preferably, the buffer structure and any one of the first sublayer, the second sublayer and the third sublayer are located in the same layer.

7. The display panel according to claim 6, characterized in that: The display function layer includes a driving circuit layer, a planarization layer, a pixel defining layer, a support layer and a display layer; The driving circuit layer is located on one side of the substrate; The planarization layer is located on a side of the driving circuit layer away from the substrate; The pixel defining layer is located on a side of the planarization layer away from the driving circuit layer, wherein the pixel defining layer includes a plurality of openings; The supporting layer is located on a side of the pixel defining layer away from the driving circuit layer; The display layer is located in the opening of the pixel defining layer; The first sub-layer and the planarization layer are located in the same layer; The second sublayer and the pixel defining layer are located in the same layer; The third sublayer and the support layer are located in the same layer.

8. The display panel according to claim 7, characterized in that: The driving circuit layer includes an insulating layer, a driving circuit and a plurality of signal lines located inside the insulating layer, the plurality of signal lines are electrically connected to the driving circuit, the driving circuit is located in the display area, and the plurality of signal lines are at least located in the non-display area; at least part of the plurality of signal lines are located on a side of the first dam close to the display area, and at least part of the plurality of signal lines are located between the first dam and the second dam, and at least part of the plurality of signal lines are spaced apart in a direction from the display area to the non-display area.

9. The display panel according to any one of claims 1 to 4 or 6 to 8, characterized in that: The encapsulation layer includes an inorganic layer and an organic layer stacked together; the organic layer is located on a side of the blocking structure close to the display area, and the inorganic layer is located in the display area and the non-display area and covers the blocking structure; Preferably, the display panel also includes a touch layer, which is located on a side of the packaging layer away from the blocking structure, and the touch layer includes touch electrodes and touch signal routing, the touch electrodes are located in the display area, and the touch signal routing is at least located in the non-display area and covers the blocking structure.

10. A display device, characterized in that: A display panel comprising any one of claims 1-9.

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