Electronic device including structures for dissipating heat produced in electronic device

Abstract

An electronic device according to an embodiment includes: a hinge structure including a first hinge plate, a second hinge plate rotatable with respect to the first hinge plate, and a third hinge plate separated from the second hinge plate and rotatable with respect to the first hinge plate; a display; a layer attached to the display and including a first heat dissipation member including a first section, a second section spaced apart from the first section, and a plurality of third sections disposed between the first section and the second section and spaced apart from each other; and a first conductive member, where the first conductive member overlaps a portion of the first section and a portion of the second section in a deployed state of the electronic device.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to an electronic device including a structure for dissipating heat generated in the electronic device. Background Art

[0002] There is an increasing need for an electronic device in which the size of a display for displaying content can be changed so that various content can be provided to a user through the electronic device. For example, when the electronic device includes a foldable flexible display, the electronic device can provide a structure in which the size of the display for displaying content can be changed. Summary of the invention

[0003] Technical Solution

[0004] According to an embodiment, an electronic device may include a hinge structure including a first hinge plate, a second hinge plate rotatable relative to the first hinge plate, and a third hinge plate distinguished from the second hinge plate and rotatable relative to the first hinge plate. According to an embodiment, the electronic device may include a display provided on the hinge structure and foldable by movement of the second hinge plate and the third hinge plate relative to the first hinge plate. According to an embodiment, the electronic device may include a layer attached to the display, including a first heat dissipation member including a first section, a second section spaced apart from the first section, and a plurality of third sections provided between the first section and the second section and spaced apart from each other. According to an embodiment, the electronic device may include a first conductive member attached to a surface of the first hinge plate facing the plurality of third sections. According to an embodiment, in an unfolded state of the electronic device, wherein the direction facing the surface of the second hinge plate is the same as the direction facing the surface of the third hinge plate, when the display is viewed in a second direction opposite to the first direction facing the surface of the first hinge plate, the first conductive member may overlap with a portion of the first section and a portion of the second section.

[0005] According to an embodiment, an electronic device may include a hinge structure including a hinge bracket, a first hinge plate rotatable relative to the hinge bracket, and a second hinge plate distinguished from the first hinge plate and rotatable relative to the hinge bracket. According to an embodiment, the electronic device may include a display provided on the hinge structure and foldable by movement of the first hinge plate and the second hinge plate relative to the hinge bracket. According to an embodiment, the electronic device may include a layer attached to the display, including a first heat dissipation member including a first section, a second section spaced apart from the first section, and a plurality of third sections provided between the first section and the second section and spaced apart from each other. According to an embodiment, the electronic device may include a first conductive member attached to a surface of the first hinge plate facing the layer. According to an embodiment, the electronic device may include a second conductive member attached to a surface of the second hinge plate facing the layer. According to an embodiment, in an unfolded state of the electronic device, wherein the direction facing the surface of the first hinge plate is the same as the direction facing the surface of the second hinge plate, when the display is viewed in a second direction opposite to the first direction facing the surface of the first hinge plate, a portion of the plurality of third sections may overlap with the first conductive member and the second conductive member. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] Figure 2a An example of an unfolded state of an exemplary electronic device according to an embodiment is shown.

[0008] Figure 2b An example of a folded state of an exemplary electronic device according to an embodiment is shown.

[0009] Figure 2c is an exploded view of an exemplary electronic device according to an embodiment.

[0010] Figure 3a is a top plan view of an exemplary electronic device according to an embodiment.

[0011] Figure 3b is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in an unfolded state, cut along line AA′.

[0012] Figure 3c is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in a folded state, cut along line AA′.

[0013] Figure 4a is a cross-sectional view illustrating an example of cutting an exemplary electronic device in an unfolded state.

[0014] Figure 4b is a cross-sectional view illustrating an example of cutting an exemplary electronic device in a folded state.

[0015] Figure 5a is a cross-sectional view illustrating an example of cutting an exemplary electronic device in an unfolded state.

[0016] Figure 5b is a cross-sectional view illustrating an example of cutting an exemplary electronic device in a folded state. DETAILED DESCRIPTION

[0017] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0018] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0019] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0020] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0021] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0022] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0023] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0024] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0025] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0026] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0027] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0028] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0030] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0031] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0032] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0034] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0035] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0036] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high frequency band.

[0037] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0038] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0039] Figure 2a shows an example of an unfolded state of an electronic device according to an embodiment, Figure 2b shows an example of a folded state of an electronic device according to an embodiment, Figure 2c is an exploded view of an electronic device according to an embodiment.

[0040] Reference Figure 2a , Figure 2b and Figure 2c , the electronic device 200 (eg, Figure 1 The electronic device 101 may include a first housing 210, a second housing 220, a display 230 (eg, Figure 1display module 160), at least one camera 240 (eg, Figure 1 camera module 180), a hinge structure 250 and / or at least one electronic component 260.

[0041] The first housing 210 and the second housing 220 may form at least a portion of the outer surface of the electronic device 200 that can be grasped by the user. When the user uses the electronic device 200, the at least a portion of the outer surface of the electronic device 200 defined by the first housing 210 and the second housing 220 may contact a portion of the user's body. According to an embodiment, the first housing 210 may include a first surface 211, a second surface 212 facing the first surface 211 and spaced apart from the first surface 211, and a first side surface 213 surrounding at least a portion of the first surface 211 and the second surface 212. The first side surface 213 may connect the periphery of the first surface 211 to the periphery of the second surface 212. The first surface 211, the second surface 212, and the first side surface 213 may define an internal space of the first housing 210. According to an embodiment, the first housing 210 may provide a space formed by the first surface 211, the second surface 212, and the first side surface 213 as a space for arranging components of the electronic device 101.

[0042] According to an embodiment, the second housing 220 may include a third surface 221, a fourth surface 222 facing the third surface 221 and spaced apart from the third surface 221, and a second side surface 223 surrounding at least a portion of the third surface 221 and the fourth surface 222. The second side surface 223 may connect the periphery of the third surface 221 to the periphery of the fourth surface 222. The third surface 221, the fourth surface 222, and the second side surface 223 may define an internal space of the second housing 220. According to an embodiment, the second housing 220 may provide a space formed by the third surface 221, the fourth surface 222, and the second side surface 223 surrounding at least a portion of the third surface 221 and the fourth surface 222 as a space for mounting components of the electronic device 101. According to an embodiment, the second housing 220 may be coupled to the first housing 210 to be rotatable relative to the first housing 210.

[0043] According to an embodiment, each of the first housing 210 and the second housing 220 may include a first protective member 214 and a second protective member 224, respectively. The first protective member 214 and the second protective member 224 may be provided on the first surface 211 and the third surface 221 along the periphery of the display 230. According to an embodiment, the first protective member 214 and the second protective member 224 may prevent foreign matter (e.g., dust or moisture) from flowing in through the gap between the display 230 and the first housing 210 and the second housing 220. For example, the first protective member 214 may surround the periphery of the first display area 231 of the display 230, and the second protective member 224 may surround the periphery of the second display area 232 of the display 230. The first protective member 214 may be formed by being attached to the first side surface 213 of the first housing 210, or may be formed integrally with the first side surface 213. The second protective member 224 may be formed by being attached to the second side surface 223 of the second housing 220, or may be formed integrally with the second side surface 223.

[0044] According to an embodiment, the first side surface 213 and the second side surface 223 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side surface 223 may include at least one conductive member 225 and at least one non-conductive member 226. The at least one conductive member 225 may include a plurality of conductive members spaced apart from each other. The at least one non-conductive member 226 may be disposed between the plurality of conductive members. The plurality of conductive members may be disconnected from each other by at least one non-conductive member 226 disposed between the plurality of conductive members. According to an embodiment, the plurality of conductive members and the plurality of non-conductive members may form an antenna radiator together. The electronic device 200 may communicate with an external electronic device through the antenna radiator formed by the plurality of conductive members and the plurality of non-conductive members.

[0045] The display 230 may be configured to display visual information. According to an embodiment, the display 230 may be arranged on the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 across the hinge structure 250. For example, the display 230 may include a first display area 231 arranged on the first surface 211 of the first housing, a second display area 232 arranged on the third surface 221 of the second housing, and a third display area 233 arranged between the first display area 231 and the second display area 232. The first display area 231, the second display area 232, and the third display area 233 may form the front surface of the display 230. According to an embodiment, the display 230 may further include a sub-display panel 235 arranged on the fourth surface 222 of the second housing 220. For example, the display 230 may be referred to as a flexible display. According to an embodiment, the display 230 may include a window exposed toward the outside of the electronic device 200. The window may protect the surface of the display 230, and transmit the visual information provided by the display 230 to the outside of the electronic device 200 by including a substantially transparent material. For example, the window may include glass (eg, ultra-thin glass (UTG)) and / or polymer (eg, polyimide (PI)), but is not limited thereto.

[0046] At least one camera 240 may be configured to obtain an image based on receiving light from an object outside the electronic device 200. According to an embodiment, the at least one camera 240 may include a first camera 241, a second camera 242, and a third camera 243. The first camera 241 may be disposed in the first housing 210. For example, the first camera 241 may be disposed inside the first housing 210, and at least a portion of the first camera 241 may be visible through the second surface 212 of the first housing 210. The first camera 241 may be supported by a bracket (not shown) in the first housing 210. When the electronic device 200 is observed from above, the first housing 210 may include at least one opening 241a overlapping with the first camera 241. The first camera 241 may obtain an image based on receiving light from outside the electronic device 200 through the at least one opening 241a.

[0047] According to an embodiment, the second camera 242 may be provided in the second housing 220. For example, the second camera 242 may be provided inside the second housing 220 and may be visible through the sub-display panel 235. When the electronic device 200 is observed from above, the second housing 220 may include at least one opening 242a overlapping the second camera 242. The second camera 242 may obtain an image based on receiving light from the outside of the electronic device 200 through the at least one opening 242a.

[0048] According to an embodiment, the third camera 243 may be provided in the first housing 210. For example, the third camera 243 may be provided inside the first housing 210, and at least a portion of the third camera 243 may be visible through the first surface 211 of the first housing 210. For another example, the third camera 243 may be provided inside the first housing 210, and at least a portion of the third camera 243 may be visible through the first display area 231 of the display 230. The first display area 231 of the display 230 may include at least one opening (not shown) overlapping with the third camera 243 when the display 230 is viewed from above. The third camera 243 may obtain an image based on receiving light from the outside of the display 230 through the at least one opening.

[0049] According to an embodiment, the second camera 242 and the third camera 243 may be disposed below the display 230 (for example, in a direction facing the inside of the first housing 210 or the inside of the second housing 220). For example, the second camera 242 and the third camera 243 may be under-display cameras (UDC). In the case where the second camera 242 and the third camera 243 are under-display cameras, an area of ​​the display 230 corresponding to each position of the second camera 242 and the third camera 243 may not be an inactive area. An inactive area of ​​the display 230 may mean an area of ​​the display 230 that does not include a pixel or does not emit light to the outside of the electronic device 200. For another example, the second camera 242 and the third camera 243 may be pinhole cameras. In the case where the second camera 242 and the third camera 243 are pinhole cameras, an area of ​​the display 230 corresponding to each position of the second camera 242 and the third camera 243 may be an inactive area.

[0050] According to an embodiment, the hinge structure 250 may rotatably connect the first housing 210 and the second housing 220. The hinge structure 250 may be disposed between the first housing 210 and the second housing 220 of the electronic device 101 so that the electronic device 200 may be bent, folded or folded. For example, the hinge structure 250 may be disposed between a portion of the first side surface 213 and a portion of the second side surface 223 facing each other. The hinge structure 250 may change the electronic device 200 to an unfolded state or a folded state, in which the first surface 211 of the first housing 210 faces the same direction as the third surface 221 of the second housing 220 faces, and in the folded state, the first surface 211 and the third surface 221 face each other. When the electronic device 200 is in the folded state, the first housing 210 and the second housing 220 may be stacked or overlapped by facing each other.

[0051] According to an embodiment, when the electronic device 200 is in a folded state, the direction facing the first surface 211 and the direction facing the third surface 221 may be different from each other. For example, when the electronic device 200 is in a folded state, the direction facing the first surface 211 and the direction facing the third surface 221 may be opposite to each other. For another example, when the electronic device 200 is in a folded state, the direction facing the first surface 211 and the direction facing the third surface 221 may be tilted relative to each other. In the case where the direction facing the first surface 211 is tilted relative to the direction facing the third surface 221, the first housing 210 may be tilted relative to the second housing 220.

[0052] According to an embodiment, the electronic device 200 may be foldable with respect to a folding axis f. The folding axis f may refer to a direction parallel to the longitudinal direction of the electronic device 200 (eg, Figure 2a and Figure 2b The folding axis f may be a virtual line extending through the hinge cover 251 on the folding axis d1, but is not limited thereto. For example, the folding axis f may be a virtual line extending through the hinge cover 251 on the folding axis d2 (eg, Figure 2a and Figure 2b In the case where the folding axis f extends in a direction perpendicular to the longitudinal direction of the electronic device 200, the hinge structure 250 can connect the first housing 210 and the second housing 220 by extending in a direction parallel to the folding axis f. The first housing 210 and the second housing 220 can be rotatable by the hinge structure 250 extending in a direction perpendicular to the longitudinal direction of the electronic device 200.

[0053] According to an embodiment, the hinge structure 250 may include a hinge cover 251, a first hinge plate 252, a second hinge plate 253, and a hinge module 254. The hinge cover 251 may surround the inner components of the hinge structure 250 and form the outer surface of the hinge structure 250. According to an embodiment, when the electronic device 200 is in a folded state, at least a portion of the hinge cover 251 surrounding the hinge structure 250 may be exposed to the outside of the electronic device 200 through the space between the first housing 210 and the second housing 220. According to another embodiment, when the electronic device 200 is in an unfolded state, the hinge cover 251 may be covered by the first housing 210 and the second housing 220 without being exposed to the outside of the electronic device 200.

[0054] According to an embodiment, the first hinge plate 252 and the second hinge plate 253 may rotatably connect the first housing 210 and the second housing 220 by being respectively coupled to the first housing 210 and the second housing 220. For example, the first hinge plate 252 may be coupled to the first front bracket 215 of the first housing 210, and the second hinge plate 253 may be coupled to the second front bracket 227 of the second housing 220. When the first hinge plate 252 and the second hinge plate 253 are respectively coupled to the first front bracket 215 and the second front bracket 227, the first housing 210 and the second housing 220 may be rotatable according to the rotation of the first hinge plate 252 and the second hinge plate 253.

[0055] The hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253. For example, the hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253 based on the folding axis f, and includes gears that can be rotatable by meshing with each other. According to an embodiment, the hinge module 254 can be multiple. For example, the multiple hinge modules 254 can be spaced apart from each other and respectively arranged at both ends of the first hinge plate 252 and the second hinge plate 253.

[0056] According to an embodiment, the first housing 210 may include a first front bracket 215 and a rear bracket 216, and the second housing 220 may include a second front bracket 227. The first front bracket 215 and the rear bracket 216 may be disposed inside the first housing 210, and may support components of the electronic device 200. The second front bracket 227 may be disposed inside the second housing 220, and may support components of the electronic device 200. For example, the display 230 may be disposed on a surface of the first front bracket 215 and a surface of the second front bracket 227. The rear bracket 216 may be disposed on another surface of the first front bracket 215, facing the surface of the first front bracket 215. The sub-display panel 235 may be disposed on the rear bracket 216.

[0057] According to an embodiment, a portion of the first front bracket 215 may be surrounded by the first side surface 213, and a portion of the second front bracket 227 may be surrounded by the second side surface 223. For example, the first front bracket 215 may be formed integrally with the first side surface 213, and the second front bracket 227 may be formed integrally with the second side surface 223. For another example, the first front bracket 215 may be formed separately from the first side surface 213, and the second front bracket 227 may be formed separately from the second side surface 223.

[0058] At least one electronic component 260 may implement various functions provided to the user. According to an embodiment, at least one electronic component 260 may include a first printed circuit board 261, a second printed circuit board 262, a flexible printed circuit board 263, a battery 264 (eg, Figure 1 battery 189) and / or antenna 265 (e.g., Figure 1 The first printed circuit board 261 and the second printed circuit board 262 may respectively form electrical connections between components in the electronic device 200. For example, components for realizing the overall functions of the electronic device 200 (e.g., Figure 1 The processor 120 of the fourth surface 222 may be disposed on the first printed circuit board 261, and the electronic components for implementing a part of the functions of the first printed circuit board 261 may be disposed on the second printed circuit board 262. For another example, the components for operating the sub-display panel 235 disposed on the fourth surface 222 may be disposed on the second printed circuit board 262.

[0059] According to an embodiment, the first printed circuit board 261 may be disposed in the first housing 210. For example, the first printed circuit board 261 may be disposed on the surface of the first front bracket 215. According to an embodiment, the second printed circuit board 262 may be disposed in the second housing 220. For example, the second printed circuit board 262 may be spaced apart from the first printed circuit board 261 and disposed on the surface of the second front bracket 227. The flexible printed circuit board 263 may connect the first printed circuit board 261 and the second printed circuit board 262. For example, the flexible printed circuit board 263 may extend from the first printed circuit board 261 to the second printed circuit board 262.

[0060] The battery 264 as a device for supplying power to at least one component of the electronic device 200 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 264 may be disposed on substantially the same plane as the first printed circuit board 261 or the second printed circuit board 262.

[0061] The antenna 265 may be configured to receive power or signals from outside the electronic device 200. According to an embodiment, the antenna 265 may be disposed between the rear bracket 216 and the battery 264. The antenna 265 may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna 265 may perform, for example, close range communication with an external device, or wirelessly transmit and receive power required for charging.

[0062] Figure 3a is a top plan view of an exemplary electronic device according to an embodiment. Figure 3b is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in an unfolded state, cut along line AA′. Figure 3c is shown along Figure 3a A cross-sectional view of an example of an exemplary electronic device in a folded state, cut along line AA′.

[0063] Reference Figure 3a , Figure 3b and Figure 3c According to the electronic device 300 of the embodiment (eg, Figure 1 The electronic device 101 and / or Figure 2a , Figure 2b and Figure 2c The electronic device 200 may include a first housing 310 (eg, Figure 2a , Figure 2b and Figure 2c The first housing 210), the second housing 320 (for example, Figure 2a , Figure 2b and Figure 2c The second housing 220), the display 330 (for example, Figure 2a , Figure 2b and Figure 2c 230), hinge structure 340 (eg, Figure 2a , Figure 2b and Figure 2c hinge structure 250), layer 350 and / or first conductive member 360.

[0064] According to an embodiment, the first housing 310 may support a portion of the display 330. The first housing 310 may be movable relative to the second housing 320. For example, the first housing 310 may be rotatable relative to the second housing 320. According to an embodiment, the first housing 310 may include a first surface 311 (eg, Figure 2a , Figure 2b and Figure 2c The first surface 211 and the second surface 312 (eg, Figure 2a , Figure 2b and Figure 2c The first surface 311 may support a portion of the display 330. The first surface 311 may be an inner surface of the portion of the first housing 310 facing the display 330. The second surface 312 may be opposite to the first surface 311. For example, the direction facing the second surface 312 may be opposite to the direction facing the first surface 311. The second surface 312 may mean an outer surface of the first housing 310 opposite to the first surface 311.

[0065] According to an embodiment, the second housing 320 may support another portion of the display 330. The second housing 320 may be movable relative to the first housing 310. For example, the second housing 320 may be rotatable relative to the first housing 310. According to an embodiment, the second housing 320 may include a third surface 321 (e.g., Figure 2a , Figure 2b and Figure 2c The third surface 321) and the fourth surface 322 (for example, Figure 2a , Figure 2b and Figure 2c The third surface 321 may support another portion of the display 330. The third surface 321 may be an inner surface of the second housing 320 that faces the other portion of the display 330. The fourth surface 322 may be opposite to the third surface 321. For example, the direction facing the fourth surface 322 may be opposite to the direction facing the third surface 321. The fourth surface 322 may refer to an outer surface of the second housing 320 that is opposite to the third surface 321.

[0066] According to an embodiment, the display 330 may be supported by the first housing 310 and the second housing 320. The display 330 may be arranged on the first housing 310 and the second housing 320 across the hinge structure 340. When an element is referred to as "on" another element, it should be understood that it may be directly on the other element, or there may be an intervening element therebetween. In contrast, when an element is referred to as "directly on" another element, there is no intervening element. For example, the display 330 may be arranged on the first surface 311 of the first housing 310 and the third surface 321 of the second housing 320. According to an embodiment, the display 330 may be foldable by the movement of the second housing 320 relative to the first housing 310. For example, when the state of the electronic device 300 changes from an unfolded state in which the direction facing the first surface 311 is substantially the same as the direction facing the third surface 321 to a folded state in which the first surface 331 and the third surface 321 face each other, the display 330 may be folded. In the folded state of the electronic device 300, at least a portion of the display 330 may have a curvature and be bent. For example, when the state of the electronic device 300 changes from the folded state to the unfolded state, the display 330 may be unfolded. In the unfolded state of the electronic device 300, the display 330 may be substantially parallel to the first surface 311 of the first housing 310 and the third surface 321 of the second housing 320.

[0067] According to an embodiment, the hinge structure 340 may rotatably couple the first housing 310 and the second housing 320. For example, the first housing 310 may be coupled to the second housing 320 by the hinge structure 340 so as to be rotatable relative to the second housing 320. For example, the second housing 320 may be coupled to the first housing 310 by the hinge structure 340 so as to be rotatable relative to the first housing 310. The hinge structure 340 may fold or unfold the display 330 based on receiving a driving force from the first housing 310 or the second housing 320. According to an embodiment, the hinge structure 340 may include a hinge cover 341, a hinge bracket 342, a first hinge plate 343, a second hinge plate 344, and / or a third hinge plate 345.

[0068] The hinge cover 341 may define an outer surface of the hinge structure 340. For example, the hinge cover 341 may surround the hinge bracket 342, the first hinge plate 343, and the second hinge plate 344. According to an embodiment, the hinge cover 341 may be covered by the first housing 310 and the second housing 320 in the unfolded state of the electronic device 300. The hinge cover 341 may be exposed to the outside of the electronic device 300 in the folded state of the electronic device 300. For example, in the folded state of the electronic device 300, the hinge cover 341 may be exposed to the outside of the first housing 310 and the second housing 320.

[0069] The hinge bracket 342 may support the first hinge plate 343, the second hinge plate 344, and the third hinge plate 345. According to an embodiment, the hinge bracket 342 may be coupled to the first hinge plate 343, the second hinge plate 344, and the third hinge plate 345. For example, the first hinge plate 343 may be fastened by being coupled to the hinge bracket 342. For example, the second hinge plate 344 may be coupled to the hinge bracket 342 so as to be rotatable relative to the hinge bracket 342. For example, the third hinge plate 345 may be coupled to the hinge bracket 342 so as to be rotatable relative to the hinge bracket 342. According to an embodiment, the hinge bracket 342 may provide a rotation axis of each of the second hinge plate 344 and the third hinge plate 345. For example, the hinge bracket 342 may include a groove for accommodating each of the second hinge plate 344 and the third hinge plate 345. In the case where the hinge bracket 342 includes a groove, each of the second hinge plate 344 and the third hinge plate 345 may be rotatable along each groove of the hinge bracket 342. According to an embodiment, the hinge bracket 342 may be disposed in the hinge cover 341. For example, the hinge bracket 342 may be surrounded by the hinge cover 341.

[0070] The first hinge plate 343 may support the display 330. For example, when the state of the electronic device 300 changes from the unfolded state to the folded state or from the folded state to the unfolded state, the first hinge plate 343 may be fastened to the hinge bracket 342. According to an embodiment, a surface 343a of the first hinge plate 343 may face the display 330. For example, when the state of the electronic device 300 changes, the direction (e.g., +z direction) that the surface 343a of the first hinge plate 343 faces may be constant. According to an embodiment, the first hinge plate 343 may be disposed between the second hinge plate 344 and the third hinge plate 345. For example, in the unfolded state of the electronic device 300, the first hinge plate 343 may be disposed between a side surface of the second hinge plate 344 and a side surface of the third hinge plate 345 facing the side surface of the second hinge plate 344.

[0071] The second hinge plate 344 may be movable relative to the first hinge plate 343. For example, the second hinge plate 344 may be rotatable relative to the first hinge plate 343. According to an embodiment, a surface 344a of the second hinge plate 344 may face the display 330. When the surface 344a of the second hinge plate 344 faces the display 330, the display 330 may be foldable by movement of the second hinge plate 344 relative to the first hinge plate 343.

[0072] The third hinge plate 345 may be movable relative to the first hinge plate 343. For example, the third hinge plate 345 may be rotatable relative to the first hinge plate 343. According to an embodiment, a surface 345a of the third hinge plate 345 may face the display 330. When the surface 345a of the third hinge plate 345 faces the display 330, the display 330 may be foldable by movement of the third hinge plate 345 relative to the first hinge plate 343.

[0073] According to an embodiment, the rotation angle range in which the second housing 320 can rotate relative to the first housing 310 may be smaller than the rotation angle range in which the second hinge plate 344 can rotate relative to the first hinge plate 343. The rotation angle range in which the second housing 320 can rotate relative to the first housing 310 may be smaller than the rotation angle range in which the third hinge plate 345 can rotate relative to the first hinge plate 343. For example, the rotation angle range in which the first housing 310 can rotate relative to the second housing 320 may be smaller than the rotation angle range in which each of the second hinge plate 344 and the third hinge plate 345 can rotate relative to the first hinge plate 343. For example, when the state of the electronic device 300 changes from the unfolded state to the folded state, the first housing 310 and the second housing 320 may be rotated 90 degrees, respectively, and the second hinge plate 344 and the third hinge plate 345 may be rotated 100 degrees, respectively.

[0074] According to an embodiment, in the unfolded state of the electronic device 300, the direction (e.g., +z direction) facing the surface 344a of the second hinge plate 344 may be substantially the same as the direction (e.g., +z direction) facing the surface 345a of the third hinge plate 345. In the unfolded state of the electronic device 300, the state of the electronic device 300 may be changed from the unfolded state to the folded state by the movement of the second hinge plate 344 and the third hinge plate 345 relative to the first hinge plate 343. According to an embodiment, in the folded state of the electronic device 300, the surface 344a of the second hinge plate 344 may be inclined relative to the surface 345a of the third hinge plate 345. For example, in the folded state of the electronic device 300, the surface 344a of the second hinge plate 344 may be inclined relative to the first surface 311 of the first housing 310. For example, in the folded state of the electronic device 300, the surface 345a of the third hinge plate 345 may be inclined relative to the third surface 321 of the second housing 320. Since the rotation angles of the second hinge plate 344 and the third hinge plate 345 and the rotation angle ranges of the first housing 310 and the second housing 320 are different, the electronic device 300 according to the embodiment can provide a structure in which the curvature change of the portion of the display 330 located between the second hinge plate 344 and the third hinge plate 345 is gradual. For example, in the folded state of the electronic device 300, in the case where the second hinge plate 344 faces the third hinge plate 345, the curvature of the display 330 located between the second hinge plate 344 and the third hinge plate 345 can be sharply changed between the second hinge plate 344 and the third hinge plate 345. Since the second hinge plate 344 and the third hinge plate 345 are inclined relative to each other in the folded state of the electronic device 300, the electronic device 300 according to the embodiment can provide a structure in which the curvature change of the display 330 is gradual. Since the curvature of the display 330 changes gradually, the electronic device 300 according to the embodiment can provide a structure for reducing the formation of wrinkles on the display 330.

[0075] The layer 350 may be attached to the display 330. According to an embodiment, the layer 350 may be provided on the hinge structure 340. For example, the layer 350 may be provided on the first surface 311 of the first housing 310 and the third surface 321 of the second housing 320 across the hinge structure 340. According to an embodiment, the layer 350 may have a shape corresponding to the shape of the display 330. For example, in the unfolded state of the electronic device 300, the layer 350 may have a shape parallel to the first hinge plate 343 together with the display 330. For example, in the folded state of the electronic device 300, when the display 330 is bent, the layer 350 may have a curved shape. According to an embodiment, in the unfolded state of the electronic device 300, the layer 350 may be spaced apart from the hinge structure 340. For example, in the unfolded state of the electronic device 300, the layer 350 may be spaced apart from the surface 344a of the second hinge plate 344 and the surface 345a of the third hinge plate 345. In the folded state of the electronic device 300, the layer 350 may contact the surface 344a of the second hinge plate 344 and the surface 345a of the third hinge plate 345. According to an embodiment, the layer 350 may include a first heat dissipation member 351, a first deformation member 352, and a second deformation member 353.

[0076] The first heat dissipation member 351 may thermally connect the first housing 310 and the second housing 320. For example, the first heat dissipation member 351 may be made of a material having high thermal conductivity. For example, the first heat dissipation member 351 may include graphite. According to an embodiment, the first heat dissipation member 351 may include a first section 351a, a second section 351b, and a plurality of third sections 351c.

[0077] The first section 351a may be attached to the display 330. For example, a portion of the first section 351a may be disposed on the first hinge plate 343. For example, another portion of the first section 351a may be disposed on the second hinge plate 344. For example, another portion of the first section 351a may be disposed on the first surface 311 of the first housing 310.

[0078] The second section 351b may be attached to the display 330. The second section 351b may be spaced apart from the first section 351a. For example, a portion of the second section 351b may be disposed on the first hinge plate 343. For example, another portion of the second section 351b may be disposed on the third hinge plate 345. For example, another portion of the second section 351b may be disposed on the third surface 321 of the second housing 320.

[0079] A plurality of third sections 351c may be provided between the first section 351a and the second section 351b. According to an embodiment, the plurality of third sections 351c may be spaced apart from each other. For example, when the plurality of third sections 351c are spaced apart from each other, a gap may be provided between the plurality of third sections 351c. According to an embodiment, the plurality of third sections 351c may have a shape separated from each other. For example, the plurality of third sections 351c may be separated from the first section 351a and the second section 351b. According to an embodiment, the plurality of third sections 351c may be provided on the first hinge plate 343. For example, the plurality of third sections 351c may be provided on the surface 343a of the first hinge plate 343. According to an embodiment, the plurality of third sections 351c may be arranged on an area of ​​the display 330 where the curvature of the display 330 changes greatly when the state of the electronic device 300 changes. For example, in the case where the first heat dissipation member 351 is formed integrally, the first heat dissipation member 351 attached to the display 330 may be folded or unfolded according to the change of the state of the electronic device 300. As the first heat dissipation member 351 is folded or unfolded, stress generated inside the first heat dissipation member 351 may damage the first heat dissipation member 351. Since the first heat dissipation member 351 includes sections 351a, 351b, and 351c separated from each other, the electronic device 300 according to the embodiment can provide a structure capable of reducing damage to the first heat dissipation member 351 caused by stress generated due to repeated changes in the state of the electronic device 300.

[0080] The first deformation member 352 may connect the mutually separated sections 351a, 351b, and 351c of the first heat dissipation member 351. For example, the first deformation member 352 may have flexibility. Since the first deformation member 352 has flexibility, the first deformation member 352 may have a shape corresponding to the shape of the display 330. For example, the first deformation member 352 may include thermoplastic polyurethane (TPU), but is not limited thereto. According to an embodiment, the first deformation member 352 may be attached to the first heat dissipation member 351. For example, the first deformation member 351 may be interposed between the display 330 and the first heat dissipation member 351. For example, the first deformation member 352 may contact a surface of the first heat dissipation member 351 facing the display 330. According to an embodiment, the first deformation member 352 may extend across the hinge structure 340. For example, the first deformation member 352 may extend from the first housing 310 to the second housing 320 across the hinge structure 340. When the first deformation member 352 spans the hinge structure 340, the first section 351a, the second section 351b, and the plurality of third sections 351c of the first heat dissipation member 351 may be connected by the first deformation member 352. According to an embodiment, the first deformation member 352 may thermally connect the first housing 310 and the second housing 320. For example, the first deformation member 352 may transfer heat generated from a portion of the display 330 disposed on the first housing 310 to another portion of the display 330 disposed on the second housing 320. For example, the first deformation member 352 may transfer heat generated from another portion of the display 330 disposed on the second housing 320 to the portion of the display 330. For example, the first deformation member 352 may transfer heat generated in the first housing 310 to the second housing 320. For example, the first deformation member 352 may transfer heat generated in the second housing 320 to the first housing 310.

[0081] The second deformation member 353 may connect the sections 351a, 351b, and 351c of the first heat dissipation member 351 that are separated from each other. For example, the second deformation member 353 may have flexibility. Since the second deformation member 353 has flexibility, the second deformation member 353 may have a shape corresponding to the shape of the display 330. For example, the second deformable member 353 may include thermoplastic polyurethane (TPU), but is not limited thereto. According to an embodiment, the second deformation member 353 may be attached to the first heat dissipation member 351. For example, the second deformation member 353 may be interposed between the first heat dissipation member 351 and the first conductive member 360. For example, the second deformation member 353 may contact another surface of the first heat dissipation member 351 that is opposite to a surface of the first heat dissipation member 351 facing the display 330. According to an embodiment, the second deformation member 353 may extend across the hinge structure 340. For example, the second deformation member 353 may extend from the first housing 310 to the second housing 320 across the hinge structure 340. When the second deformation member 353 spans the hinge structure 340, the first section 351a, the second section 351b, and the plurality of third sections 351c of the first heat dissipation member 351 may be connected by the second deformation member 353. According to an embodiment, the second deformation member 353 may thermally connect the first housing 310 and the second housing 320. For example, the second deformation member 353 may transfer heat generated from a portion of the display 330 disposed on the first housing 310 to another portion of the display 330 disposed on the second housing 320. For example, the second deformation member 353 may transfer heat generated from another portion of the display 330 disposed on the second housing 320 to the portion of the display 330. For example, the second deformation member 353 may transfer heat generated in the first housing 310 to the second housing 320. For example, the second deformation member 353 may transfer heat generated in the second housing 320 to the first housing 310.

[0082] According to an embodiment, the size of the gap between the plurality of third sections 351c may be changed according to the deformation of the display 330. For example, when the display 330 is folded or unfolded by the second hinge plate 344 and the third hinge plate 345, the gap between the plurality of third sections 351c may be changed. For example, as the state of the electronic device 300 changes from the unfolded state to the folded state, the size of the gap between the plurality of third sections 351c may be reduced. For example, as the state of the electronic device 300 changes from the folded state to the unfolded state, the size of the gap between the plurality of third sections 351c may be expanded.

[0083] The first conduction member 360 may thermally connect the first housing 310 and the second housing 320. For example, the first conduction member 360 may be made of a material having high thermal conductivity. For example, the first conduction member 360 may include a thermal interface material (TIM). The thermal interface material may include, for example, at least one of a nano TIM, a silicon TIM, an acrylic TIM, and a carbon fiber-based TIM, but is not limited thereto. According to an embodiment, the first conduction member 360 may face the first heat dissipation member 351 in the layer 350. For example, the first conduction member 360 may contact the second deformation member 353 attached to the first heat dissipation member 351. According to an embodiment, the first conduction member 360 may be attached to the first hinge plate 343. For example, the first conduction member 360 may be disposed on a surface 343a of the first hinge plate 343 facing the plurality of third sections 351c. For example, the first conduction member 360 may be attached to the surface 343a of the first hinge plate 343. According to an embodiment, the first conduction member 360 may be disposed between the second hinge plate 344 and the third hinge plate 345. For example, when the state of the electronic device 300 changes from the folded state to the unfolded state, the first conductive member 360 may be fastened to the first hinge plate 343. For example, when the state of the electronic device 300 changes from the unfolded state to the folded state, the first conductive member 360 may be fastened to the first hinge plate 343.

[0084] According to an embodiment, in the unfolded state of the electronic device 300, when the display 330 is observed from above (e.g., in the z direction), the first conductive member 360 may overlap a portion of the first section 351a and a portion of the second section 351b. For example, in the unfolded state of the electronic device 300, when the display 330 is observed in a second direction (e.g., in the -z direction) opposite to the first direction (e.g., in the +z direction) that the surface 343a of the first hinge plate 343 faces, the first conductive member 360 may overlap the portion of the first section 351a and the portion of the second section 351b. According to an embodiment, the width of the first conductive member 360 may be greater than the width of the plurality of third sections 351c. For example, the width of the first conductive member 360 may be greater than the sum of the widths of each of the plurality of third sections 351c. Since the width of the first conductive member 360 is greater than the width of the plurality of third sections 351c, the first conductive member 360 may overlap the first section 351a and the second section 351b. For example, heat generated from the first housing 310 or the display 330 may move toward the second housing 320 along the first section 351a of the layer 350. Since the first section 351a and the plurality of third sections 351c are separated from each other, the heat of the first section 351a may not move to the second housing 320 through the plurality of third sections 351c. Since the heat in the first housing 310 does not move to the second housing 320, the heat generated in the first housing 310 or the display 330 may be concentrated in the first housing 310. When the heat is concentrated in the first housing 310, the performance of the electronic components in the first housing 310 may be deteriorated. In the case where the first heat dissipation member 351 is integrally formed for heat transfer between the first housing 310 and the second housing 320, the first heat dissipation member 351 may be damaged due to the folding display 330. The electronic device 300 according to the embodiment may provide a structure capable of dissipating heat in the electronic device 300 by overlapping the first conductive member 360 with the portion of the first section 351a and the portion of the second section 351b. For example, in the unfolded state of the electronic device 300, the heat transferred from the first housing 310 to the portion of the first section 351a may be transferred to the first conductive member 360 when the heat passes through the second deforming member 353. When the heat passes through the second deforming member 353, the heat transferred to the first conductive member 360 may be transferred to the portion of the second section 351b overlapping the first conductive member 360. When the heat transferred to the portion of the second section 351b is transferred to the second housing 320, the heat in the electronic device 300 may be dissipated.

[0085] According to an embodiment, the first conductive member 360 may be deformable. For example, when the display 330 is deformed, the first conductive member 360 may be deformable by the layer 350 attached to the display 330. For example, as the state of the electronic device 300 is deformed from the unfolded state to the folded state, the display 330 may be folded. As the display 330 is folded, the layer 350 attached to the display 330 may be folded. The reaction force generated by folding the display 330 and the layer 350 may press the first conductive member 360 provided on the first hinge plate 343 in a direction facing the hinge bracket 342 (e.g., -z direction). In the case where the first conductive member 360 is not deformable, the first conductive member 360 may be damaged due to the pressure of the display 330 and the layer 350. In the case where the first conductive member 360 is not deformable, the display 330 and the layer 350 may be damaged by the first conductive member 360 in contact with the display 330 and the layer 350. The electronic device 300 according to the embodiment can provide a structure capable of reducing damage to the display 330 and / or the first conductive member 360 due to repeated changes in the state of the electronic device 300 by the deformable first conductive member 360. For example, as the state of the electronic device 300 changes from the unfolded state to the folded state, the first conductive member 360 can be compressed. As the state of the electronic device 300 changes from the folded state to the unfolded state, the shape of the first conductive member 360 can be restored.

[0086] As described above, the electronic device 300 according to the embodiment can provide a structure capable of thermally connecting the first housing 310 and the second housing 320 by the first heat dissipation member 351 including the plurality of sections 351a, 351b, and 351c separated from each other regardless of repeated changes in the state of the electronic device 300. The electronic device 300 according to the embodiment can provide a structure capable of dissipating heat generated in the first housing 310 to the second housing 320 by the first conductive member 360 overlapping the first section 351a and the second section 351b in the unfolded state of the electronic device 300.

[0087] Figure 4a is a cross-sectional view showing an example of cutting an exemplary electronic device in an unfolded state, Figure 4b is a cross-sectional view illustrating an example of cutting an exemplary electronic device in a folded state.

[0088] because Figure 4a and Figure 4b The electronic device 300 may be Figure 3a , Figure 3b and Figure 3cThe electronic device 300 to which the second heat dissipation member 410, the third heat dissipation member 420, the fourth heat dissipation member 430, the second conduction member 440 and / or the third conduction member 450 are added, and thus a redundant description will be omitted.

[0089] Reference Figure 4a and Figure 4b , the electronic device 300 according to the embodiment may include a second heat dissipation member 410 , a third heat dissipation member 420 , a fourth heat dissipation member 430 , a second conductive member 440 and / or a third conductive member 450 .

[0090] The second heat dissipation member 410 may transfer the heat transferred from the first housing 310 to the second conductive member 440. For example, the second heat dissipation member 410 may be made of a material having a high thermal conductivity. For example, the second heat dissipation member 410 may include graphite. According to an embodiment, the second heat dissipation member 410 may extend in a direction from the first housing 310 toward the second housing 320. For example, the second heat dissipation member 410 may extend on the first surface 311 of the first housing 310. For example, the second heat dissipation member 410 may extend from the first housing 310 to the surface 344a of the second hinge plate 344. According to an embodiment, the second heat dissipation member 410 may be disposed on the second hinge plate 344. For example, the second heat dissipation member 410 may be disposed on the surface 344a of the second hinge plate 344. According to an embodiment, the second heat dissipation member 410 may be spaced apart from the layer 350. For example, the layer 350 may be spaced apart from the second heat dissipation member 410 in a direction in which the surface 344a of the second hinge plate 344 faces. Since the second heat dissipation member 410 extends from the first housing 310 to the second hinge plate 344 , a path through which heat transferred in the first housing 310 can move can be expanded.

[0091] The third heat dissipation member 420 may transfer the heat transferred from the second housing 320 to the third conductive member 450. For example, the third heat dissipation member 420 may be made of a material having a high thermal conductivity. For example, the third heat dissipation member 420 may include graphite. According to an embodiment, the third heat dissipation member 420 may extend in a direction from the second housing 320 toward the first housing 310. For example, the third heat dissipation member 420 may extend on the third surface 321 of the second housing 320. For example, the third heat dissipation member 420 may extend from the second housing 320 to the surface 345a of the third hinge plate 345. According to an embodiment, the third heat dissipation member 420 may be disposed on the third hinge plate 345. For example, the third heat dissipation member 420 may be disposed on the surface 345a of the third hinge plate 345. According to an embodiment, the third heat dissipation member 420 may be spaced apart from the layer 350. For example, the layer 350 may be spaced apart from the third heat dissipation member 420 in a direction in which the surface 345a of the third hinge plate 345 faces. Since the third heat dissipation member 420 extends from the second housing 320 to the third hinge plate 344 , a path through which heat transferred in the second housing 320 can move can be expanded.

[0092] The fourth heat dissipation member 430 may transfer heat transferred from the first section 351a to the second section 351b. According to an embodiment, the fourth heat dissipation member 430 may be disposed on the first hinge plate 343. For example, the fourth heat dissipation member 430 may be interposed between the first conductive member 360 and the surface 343a of the first hinge plate 343. According to an embodiment, the fourth heat dissipation member 430 may face the plurality of third sections 351c. When the display 330 is observed from above (e.g., in the z direction) in the unfolded state of the electronic device 300, the fourth heat dissipation member 430 may overlap with a portion of the first section 351a and a portion of the second section 351b. In the unfolded state of the electronic device 300, when the display 330 is observed in a second direction (e.g., in the -z direction) opposite to the first direction (e.g., in the +z direction) facing the surface 343a of the first hinge plate 343, the fourth heat dissipation member 430 may overlap with the portion of the first section 351a and the portion of the second section 351b. Since the fourth heat radiating member 430 is disposed on the first hinge plate 343 , a path through which heat can move between the first section 351 a and the second section 351 b may be expanded.

[0093] According to an embodiment, the fourth heat dissipation member 430 may be separated from the second heat dissipation member 410 and the third heat dissipation member 420. For example, the fourth heat dissipation member 430 may be spaced apart from the second heat dissipation member 410 and the third heat dissipation member 420. Since the second heat dissipation member 410 and the third heat dissipation member 420 are separated from each other, damage to the heat dissipation members 410, 420, and 430 due to repeated changes in the state of the electronic device 300 may be reduced.

[0094] The second conduction member 440 may thermally connect the layer 350 and the second heat dissipation member 410. For example, the second conduction member 440 may be made of a material having high thermal conductivity. For example, the second conduction member 440 may include a thermal interface material (TIM). The thermal interface material may also include, for example, at least one of a nano TIM, a silicon TIM, an acrylic TIM, and a carbon fiber-based TIM, but is not limited thereto. According to an embodiment, the second conduction member 440 may be interposed between the layer 350 and the second heat dissipation member 410. For example, the second conduction member 440 may be attached to the second heat dissipation member 410, and the second heat dissipation member 410 may be attached to the second hinge plate 344. For example, the second conduction member 440 may be disposed on the second heat dissipation member 410 and face the first section 351a of the layer 350. According to an embodiment, the second conduction member 440 may be deformable.

[0095] The third conduction member 450 may thermally connect the layer 350 and the third heat dissipation member 420. For example, the third conduction member 450 may be made of a material having high thermal conductivity. For example, the third conduction member 450 may include a thermal interface material (TIM). The thermal interface material may include, for example, at least one of a nano TIM, a silicon TIM, an acrylic TIM, and a carbon fiber-based TIM, but is not limited thereto. According to an embodiment, the third conduction member 450 may be interposed between the layer 350 and the third heat dissipation member 420. For example, the third conduction member 450 may be attached to the third heat dissipation member 420, and the third heat dissipation member 420 may be attached to the third hinge plate 345. For example, the third conduction member 450 may be disposed on the third heat dissipation member 420 and face the second section 351b of the layer 350. According to an embodiment, the third conduction member 450 may be deformable.

[0096] According to an embodiment, heat generated in the first housing 310 may be transferred to the second heat dissipation member 410. The heat transferred to the second heat dissipation member 410 may be transferred to the first section 351a by passing through the second conductive member 440 and the second deformation member 353. The heat transferred to the first section 351a may be transferred to the first conductive member 360 and the fourth heat dissipation member 430 by passing through the second deformation member 353. The heat transferred to the first conductive member 360 and the fourth heat dissipation member 430 may be transferred to the second section 351b by passing through the second deformation member 353. As the heat transferred to the second section 351b is transferred to the third conductive member 450 and the third heat dissipation member 420 by passing through the second deformation member 353, the heat generated in the first housing 310 may be dispersed to the second housing 320. According to an embodiment, the heat generated in the second housing 320 may be transferred to the third heat dissipation member 420. The heat transferred to the third heat dissipation member 420 may be transferred to the second section 351b by passing through the third conductive member 450 and the second deformation member 353. The heat transferred to the second section 351b may be transferred to the first conductive member 360 and the fourth heat dissipation member 430 by passing through the second deformation member 353. The heat transferred to the first conductive member 360 and the fourth heat dissipation member 430 may be transferred to the first section 351a by passing through the second deformation member 353. As the heat transferred to the first section 351a is transferred to the second conductive member 440 and the second heat dissipation member 410 by passing through the second deformation member 353, the heat generated in the second housing 320 may be dissipated in the first housing 310.

[0097] According to an embodiment, in the unfolded state of the electronic device 300, the second heat dissipation member 410 and the second conductive member 440 may be parallel to the display 330. When the second hinge plate 344 moves to change the state of the electronic device 300 from the unfolded state to the folded state, the second heat dissipation member 410 and the second conductive member 440 may move together with the second hinge plate 344. In the folded state of the electronic device 300, a portion of the second heat dissipation member 410 attached to the surface 344a of the second hinge plate 344 may be inclined relative to another portion of the second heat dissipation member 410 attached to the first surface 311 of the first housing 310.

[0098] According to an embodiment, in the unfolded state of the electronic device 300, the third heat dissipation member 420 and the third conductive member 450 may be parallel to the display 330. When the third hinge plate 345 moves to change the state of the electronic device 300 from the unfolded state to the folded state, the third heat dissipation member 420 and the third conductive member 450 may move together with the third hinge plate 345. In the folded state of the electronic device 300, a portion of the third heat dissipation member 420 attached to the surface 345a of the third hinge plate 345 may be inclined relative to another portion of the third heat dissipation member 420 attached to the third surface 321 of the second housing 320.

[0099] According to an embodiment, when the fourth heat dissipation member 430 is attached to the first hinge plate 343, the fourth heat dissipation member 430 may be fastened when the state of the electronic device 300 changes. For example, when the second hinge plate 344 and the third hinge plate 345 move, the fourth heat dissipation member 430 may be fastened to the first hinge plate 343.

[0100] As described above, the electronic device 300 according to the embodiment can reduce heat concentration in the electronic device 300 through the heat dissipation members 410 , 420 , and 430 and the conductive members 440 and 450 for dissipating heat generated in the housings 310 and 320 .

[0101] Figure 5a is a cross-sectional view showing an example of cutting an exemplary electronic device in an unfolded state, Figure 5b is a cross-sectional view illustrating an example of cutting an exemplary electronic device in a folded state.

[0102] because Figure 5a and Figure 5b The electronic device 300 may be in Figure 3a , Figure 3b and Figure 3c The structure of the hinge structure 340 in the electronic device 300 is changed, and thus a redundant description will be omitted.

[0103] Reference Figure 5a and Figure 5b , the electronic device 300 according to the embodiment may include a hinge structure 540 (eg, Figure 3a , Figure 3b and Figure 3c hinge structure 340), multiple heat dissipation members 550, multiple conductive members 560 and / or multiple reinforcement members 570.

[0104] According to an embodiment, the hinge structure 540 may rotatably couple the first housing 310 and the second housing 320. For example, the second housing 320 may be coupled to the first housing 310 by the hinge structure 540 so as to be rotatable relative to the first housing 310. According to an embodiment, the hinge structure 540 may include a hinge bracket 542, a fourth hinge plate 543, and / or a fifth hinge plate 544.

[0105] The hinge bracket 542 may support the fourth hinge plate 543 and the fifth hinge plate 544. According to an embodiment, the hinge bracket 542 may be coupled to the fourth hinge plate 543 and the fifth hinge plate 544. For example, the fourth hinge plate 543 may be coupled to the hinge bracket 542 so as to be rotatable relative to the hinge bracket 542. For example, the fifth hinge plate 544 may be coupled to the hinge bracket 542 so as to be rotatable relative to the hinge bracket 542. According to an embodiment, the hinge bracket 542 may provide a rotation axis of each of the fourth hinge plate 543 and the fifth hinge plate 544. For example, the hinge bracket 542 may include a groove to accommodate each of the fourth hinge plate 543 and the fifth hinge plate 544. In the case where the hinge bracket 542 includes a groove, each of the fourth hinge plate 543 and the fifth hinge plate 544 may be rotatable along each groove of the hinge bracket 542.

[0106] The fourth hinge plate 543 may be movable relative to the hinge bracket 542. According to an embodiment, a surface 543a of the fourth hinge plate 543 may face the display 330. When the surface 543a of the fourth hinge plate 543 faces the display 330, the display 330 may be foldable by movement of the fourth hinge plate 543 relative to the hinge bracket 542.

[0107] The fifth hinge plate 544 may be movable relative to the hinge bracket 542. According to an embodiment, a surface 544a of the fifth hinge plate 544 may face the display 330. When the surface 544a of the fifth hinge plate 544 faces the display 330, the display 330 may be foldable by movement of the fifth hinge plate 544 relative to the hinge bracket 542.

[0108] According to an embodiment, the rotation angle range in which the second housing 320 is rotatable relative to the first housing 310 may be smaller than the rotation angle range in which the fourth hinge plate 543 is rotatable relative to the hinge bracket 542. The rotation angle range in which the second housing 320 is rotatable relative to the first housing 310 may be smaller than the rotation angle range in which the fifth hinge plate 544 is rotatable relative to the hinge bracket 542. For example, the rotation angle range in which the first housing 310 is rotatable relative to the second housing 320 may be smaller than the rotation angle range in which each of the fourth hinge plate 543 and the fifth hinge plate 544 is rotatable relative to the hinge bracket 542. For example, when the state of the electronic device 300 changes from the unfolded state to the folded state, the first housing 310 and the second housing 320 may be rotated 90 degrees respectively, and the fourth hinge plate 543 and the fifth hinge plate 544 may be rotated 100 degrees respectively.

[0109] According to an embodiment, in the unfolded state of the electronic device 300, the direction (e.g., +z direction) facing the surface 543a of the fourth hinge plate 543 may be substantially the same as the direction (e.g., +z direction) facing the surface 544a of the fifth hinge plate 544. In the unfolded state of the electronic device 300, the state of the electronic device 300 may be changed from the unfolded state to the folded state by the movement of the fourth hinge plate 543 and the fifth hinge plate 544 relative to the hinge bracket 542. According to an embodiment, in the folded state of the electronic device 300, the surface 543a of the fourth hinge plate 543 may be inclined relative to the surface 544a of the fifth hinge plate 544. For example, in the folded state of the electronic device 300, the surface 543a of the fourth hinge plate 543 may be inclined relative to the first surface 311 of the first housing 310. For example, in the folded state of the electronic device 300, the surface 544a of the fifth hinge plate 544 may be inclined relative to the third surface 321 of the second housing 320.

[0110] The plurality of heat dissipation members 550 may transfer heat generated in the first housing 310 to the second housing 320, or transfer heat generated in the second housing 320 to the first housing 310. For example, the plurality of heat dissipation members 550 may be made of a material having high thermal conductivity. For example, the plurality of heat dissipation members 550 may include graphite. According to an embodiment, the plurality of heat dissipation members 550 may include a fifth heat dissipation member 551 and a sixth heat dissipation member 552.

[0111] The fifth heat dissipation member 551 may transfer heat transferred from the first housing 310 to the plurality of conductive members 560. According to an embodiment, the fifth heat dissipation member 551 may extend in a direction from the first housing 310 toward the second housing 320. For example, the fifth heat dissipation member 551 may extend on the first surface 311 of the first housing 310. For example, the fifth heat dissipation member 551 may extend from the first housing 310 to the surface 543a of the fourth hinge plate 543. According to an embodiment, the fifth heat dissipation member 551 may be disposed on the fourth hinge plate 543. For example, the fifth heat dissipation member 551 may be disposed on the surface 543a of the fourth hinge plate 543. According to an embodiment, the fifth heat dissipation member 551 may be spaced apart from the layer 350. For example, the layer 350 may be spaced apart from the fifth heat dissipation member 551 in a direction in which the surface 543a of the fourth hinge plate 543 faces. Since the fifth heat dissipation member 551 extends from the first housing 310 to the fourth hinge plate 543, a path through which heat transferred in the first housing 310 can move may be expanded.

[0112] The sixth heat dissipation member 552 may transfer heat transferred from the second housing 320 to the plurality of conductive members 560. According to an embodiment, the sixth heat dissipation member 552 may extend in a direction from the second housing 320 toward the first housing 310. For example, the sixth heat dissipation member 552 may extend on the third surface 321 of the second housing 320. For example, the sixth heat dissipation member 552 may extend from the second housing 320 to the surface 544a of the fifth hinge plate 544. According to an embodiment, the sixth heat dissipation member 552 may be disposed on the fifth hinge plate 544. For example, the sixth heat dissipation member 552 may be disposed on the surface 544a of the fifth hinge plate 544. According to an embodiment, the sixth heat dissipation member 552 may be spaced apart from the layer 350. For example, the layer 350 may be spaced apart from the sixth heat dissipation member 552 in a direction in which the surface 544a of the fifth hinge plate 544 faces. Since the sixth heat dissipation member 552 extends from the second housing 320 to the fifth hinge plate 544, a path through which heat transferred in the second housing 320 can move may be expanded. According to an embodiment, the sixth heat dissipation member 552 may be spaced apart from the fifth heat dissipation member 551 .

[0113] The plurality of conductive members 560 may thermally connect the first housing 310 and the second housing 320. For example, the plurality of conductive members 560 may thermally connect the first section 351a and the second section 351b. For example, the plurality of conductive members 560 may be made of a material having high thermal conductivity. For example, the plurality of conductive members 560 may include a thermal interface material (TIM). The thermal interface material may include, for example, at least one of a nano TIM, a silicon TIM, an acrylic TIM, and a carbon fiber-based TIM, but is not limited thereto. According to an embodiment, the plurality of conductive members 560 may include a fourth conductive member 561 and a fifth conductive member 562.

[0114] The fourth conduction member 561 may face the layer 350. For example, the fourth conduction member 561 may be attached to a surface 543a of the fourth hinge plate 543 facing the layer 350. According to an embodiment, the fourth conduction member 561 may face the first section 351a and the plurality of third sections 351c. For example, the fourth conduction member 561 may face the first section 351a and the plurality of third sections 351c between the layer 350 and the fifth heat dissipation member 551. According to an embodiment, the fourth conduction member 561 may be deformable. According to an embodiment, the fourth conduction member 561 may be spaced apart from the fourth hinge plate 543. For example, the fourth conduction member 561 may be spaced apart from the surface 543a of the fourth hinge plate 543 along a direction in which the surface 543a of the fourth hinge plate 543 faces. When the fourth hinge plate 543 and the fourth conduction member 561 are spaced apart from each other, the fifth heat dissipation member 551 may be disposed between the fourth conduction member 561 and the fourth hinge plate 543.

[0115] The fifth conductive member 562 may face the layer 350. For example, the fifth conductive member 562 may be attached to the surface 544a of the fifth hinge plate 544 facing the layer 350. According to an embodiment, the fifth conductive member 562 may face the second section 351b and the plurality of third sections 351c. For example, the fifth conductive member 562 may face the second section 351b and the plurality of third sections 351c between the layer 350 and the sixth heat dissipation member 552. According to an embodiment, the fifth conductive member 562 may be deformable. According to an embodiment, the fifth conductive member 562 may be spaced apart from the fifth hinge plate 544. For example, the fifth conductive member 562 may be spaced apart from the surface 544a of the fifth hinge plate 544 along the direction in which the surface 544a of the fifth hinge plate 544 faces. When the fifth hinge plate 544 and the fifth conductive member 562 are spaced apart from each other, the sixth heat dissipation member 552 may be disposed between the fifth conductive member 562 and the fifth hinge plate 544. According to an embodiment, the fifth conductive member 562 may be spaced apart from the fourth conductive member 561 .

[0116] The plurality of reinforcing members 570 may support the display 330. For example, the plurality of reinforcing members 570 may be made of a material having rigidity (eg, metal). For example, the plurality of reinforcing members 570 may be referred to as a stiffener. According to an embodiment, the plurality of reinforcing members 570 may include a first reinforcing member 571 and a second reinforcing member 572.

[0117] The first reinforcement member 571 may be disposed between the first housing 310 and the display 330. For example, the first reinforcement member 571 may be disposed between the first surface 311 of the first housing 310 and the layer 350. When the first reinforcement member 571 is disposed on the first surface 311 of the first housing 310, the first reinforcement member 571 may face the first section 351a. According to an embodiment, the first reinforcement member 571 may be disposed on a portion of the fifth heat dissipation member 551 disposed on the first surface 311. For example, the first reinforcement member 571 may be disposed between the fifth heat dissipation member 551 and the layer 350.

[0118] The second reinforcement member 572 may be disposed between the second housing 320 and the display 330. For example, the second reinforcement member 572 may be disposed between the third surface 321 of the second housing 320 and the layer 350. When the second reinforcement member 572 is disposed on the third surface 321 of the second housing 320, the second reinforcement member 572 may face the second section 351b. According to an embodiment, the second reinforcement member 572 may be disposed on a portion of the sixth heat dissipation member 552 disposed on the third surface 321. For example, the second reinforcement member 572 may be disposed between the sixth heat dissipation member 552 and the layer 350.

[0119] According to an embodiment, the layer 350 may extend from the first housing 310 to the second housing 320 across the hinge structure 540. For example, the layer 350 may be disposed on the fourth hinge plate 543 and the fifth hinge plate 544. According to an embodiment, the first section 351a of the layer 350 may be disposed on a portion of the fourth hinge plate 543. For example, the first section 351a may extend on the first surface 311 of the first housing 310. The first section 351a may extend from the first housing 310 to the fourth hinge plate 543. According to an embodiment, the first section 351a may be disposed on a portion of the fourth conductive member 561. According to an embodiment, the second section 351b of the layer 350 may be disposed on the fifth hinge plate 544. For example, the second section 351b may extend on the third surface 321 of the second housing 320. The second section 351b may extend from the second housing 320 to the fifth hinge plate 544. According to an embodiment, the second section 351b may be disposed on a portion of the fifth conductive member 562. According to an embodiment, a plurality of third sections 351c may be provided on the fourth hinge plate 543 and the fifth hinge plate 544. For example, the plurality of third sections 351c may face the fourth conductive member 561 provided on the fourth hinge plate 543 and the fifth conductive member 562 provided on the fifth hinge plate 544.

[0120] According to an embodiment, some 351c-1 of the plurality of third sections 351c may thermally connect the fourth conductive member 561 and the fifth conductive member 562. For example, when the display 330 is observed from above (e.g., in the z direction) in the unfolded state of the electronic device 300, some 351c-1 of the plurality of third sections 351c may overlap the fourth conductive member 561 and the fifth conductive member 562. For example, when the display 330 is observed in a second direction (e.g., in the −z direction) opposite to the first direction (e.g., in the +z direction) to which the surface 543a of the fourth hinge plate 543 faces in the unfolded state of the electronic device 300, some 351c-1 of the plurality of third sections 351c may overlap the fourth conductive member 561 and the fifth conductive member 562. According to an embodiment, in the unfolded state of the electronic device 300, the width of some 351c-1 of the plurality of third sections 351c may be greater than the size of the gap between the fourth conductive member 561 and the fifth conductive member 562. For example, heat generated in the display 330 may move along the first section 351a, and heat generated in the first housing 310 may move along the fifth heat dissipation member 551. Heat moving along each of the first section 351a and the fifth heat dissipation member 551 may be transferred to the fourth conduction member 561. In the case where some 351c-1 of the plurality of third sections 351c do not overlap with the fourth conduction member 561 and the fifth conduction member 562, heat transferred to the fourth conduction member 561 cannot be transferred to the second housing 320 because the plurality of third sections 351c are spaced apart from each other. In the case where heat generated in the first housing 310 is not transferred to the second housing 320, performance of electronic components disposed in the first housing 310 may be deteriorated. The electronic device 300 according to the embodiment may provide a structure capable of dissipating heat in the electronic device 300 by overlapping some 351c-1 of the plurality of third sections 351c with the fourth conduction member 561 and the fifth conduction member 562. For example, the heat transferred to the fourth conductive member 561 may be transferred to the fifth conductive member 562 through some 351c-1 of the plurality of third sections 351c. When the heat transferred to the fifth conductive member 562 is respectively transferred to the second section 351b and / or the sixth heat radiating member 552, the heat generated in the electronic device 300 may be dissipated.

[0121] According to an embodiment, in the unfolded state of the electronic device 300, the fifth heat dissipation member 551 and the fourth conductive member 561 may be parallel to the display 330. When the fourth hinge plate 543 moves to change the state of the electronic device 300 from the unfolded state to the folded state, the fifth heat dissipation member 551 and the fourth conductive member 561 may move together with the fourth hinge plate 543. In the folded state of the electronic device 300, a portion of the fifth heat dissipation member 551 attached to the surface 543a of the fourth hinge plate 543 may be inclined relative to another portion of the fifth heat dissipation member 551 attached to the first surface 311 of the first housing 310.

[0122] According to an embodiment, in the unfolded state of the electronic device 300, the sixth heat dissipation member 552 and the fifth conductive member 562 may be parallel to the display 330. When the fifth hinge plate 544 moves to change the state of the electronic device 300 from the unfolded state to the folded state, the sixth heat dissipation member 552 and the fifth conductive member 562 may move together with the fifth hinge plate 544. In the folded state of the electronic device 300, a portion of the sixth heat dissipation member 552 attached to the surface 544a of the fifth hinge plate 544 may be inclined relative to another portion of the sixth heat dissipation member 552 attached to the third surface 321 of the second housing 320.

[0123] As described above, the electronic device 300 according to the embodiment may provide a structure capable of dissipating heat generated in the electronic device 300 by thermally connecting the fourth conductive member 561 and the fifth conductive member 562 through some 351 c - 1 of the plurality of third sections 351 c .

[0124] In order to expand or reduce the display, the electronic device may include different housings that support the display. The different housings may be thermally separated by gaps between the different housings. For example, due to the gaps between the housings, the heat generated inside the housing may not be transferred to the other housing. In the case where heat is concentrated inside the housing, the performance of the electronic components in the electronic device may deteriorate. In the case of using a heat dissipation member that is integrally formed to thermally connect the different housings, the heat dissipation member may be damaged due to the stress generated by the movement of the housing. The electronic device may require a structure that can dissipate the heat inside the electronic device without being damaged by the movement of the housing.

[0125] According to an electronic device (eg, Figure 3a , Figure 3b and Figure 3c The electronic device 300 may include a hinge structure (eg, Figure 3b and Figure 3c The hinge structure 340 includes a first hinge plate (eg, Figure 3b and Figure 3cThe first hinge plate 343 of the embodiment of the present invention is provided, and the second hinge plate rotatable relative to the first hinge plate (for example, Figure 3b and Figure 3c The hinge plate 344 is a first hinge plate 344), and a third hinge plate (eg, a third hinge plate 344) different from the second hinge plate and rotatable relative to the first hinge plate. Figure 3b and Figure 3c According to an embodiment, the electronic device may include a display (eg, Figure 3b and Figure 3c The display 330 is provided on the hinge structure and is foldable by the movement of the second hinge plate and the third hinge plate relative to the first hinge plate. According to an embodiment, the electronic device may include a layer (eg, Figure 3a , Figure 3b and Figure 3c A layer 350 ) attached to the display includes a first heat dissipation member (eg, Figure 3a , Figure 3b and Figure 3c The first heat dissipation member 351 includes a first section (eg, Figure 3a , Figure 3b and Figure 3c a first section 351a), a second section spaced apart from the first section (eg, Figure 3a , Figure 3b and Figure 3c a second segment 351b), and a plurality of third segments (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a first conductive member (eg, Figure 3b and Figure 3c The first conductive member 360 is attached to the surface of the first hinge plate facing the plurality of third sections. According to an embodiment, in the unfolded state of the electronic device, the surface of the second hinge plate (eg, Figure 3b and Figure 3c The surface 344a of the hinge plate faces in a direction opposite to the surface of the third hinge plate (eg, Figure 3b and Figure 3c The surface 345a of the first hinge plate faces the same direction, when the display is viewed in a second direction opposite to the first direction facing the surface of the first hinge plate, the first conductive member may overlap a portion of the first segment and a portion of the second segment.

[0126] The electronic device according to the embodiment can provide a structure capable of thermally connecting the first housing and the second housing through the first heat dissipation member including a plurality of sections separated from each other regardless of repeated changes in the state of the electronic device. The electronic device according to the embodiment can provide a structure capable of dissipating heat generated in the first housing to the second housing through the first conductive member overlapping the first section and the second section in the unfolded state of the electronic device.

[0127] According to an embodiment, the layer may include a first deformable member (e.g., Figure 3b and Figure 3c The first deforming member 352 of the first heat dissipation member extends across the hinge structure and contacts the surface of the first heat dissipation member facing the display. According to an embodiment, the layer may include a second deforming member (e.g., Figure 3b and Figure 3c A second deformation member 353 is provided, which extends across the hinge structure and contacts another surface of the first heat dissipation member opposite to the surface of the first heat dissipation member.

[0128] The electronic device according to the embodiment can provide a structure capable of thermally connecting the first housing and the second housing by the first deformation member connecting sections of the first heat dissipation member and the second deformation member regardless of repeated changes in the state of the electronic device.

[0129] According to an embodiment, the gaps between the plurality of third sections may change as the display is folded or unfolded by the second hinge plate and the third hinge plate.

[0130] Since the size of the gaps between the plurality of third sections is reduced or expanded according to the state of the electronic device, the electronic device according to the embodiment can provide a structure capable of reducing damage to the first heat dissipation member caused by stress generated due to a change in the state of the electronic device.

[0131] According to an embodiment, another portion of the first section may face the second hinge plate. According to an embodiment, another portion of the second section may face the third hinge plate.

[0132] The electronic device according to the embodiment may provide a structure in which a first housing and a second housing are thermally connected through a first section facing the second hinge plate and a second section facing the third hinge plate.

[0133] According to an embodiment, when the display is deformed, the first conductive member may be deformable through the layer.

[0134] Since the first conductive member is deformable, the electronic device according to the embodiment can provide a structure capable of reducing damage to the display.

[0135] According to an embodiment, the layer may have a shape corresponding to the shape of the display.

[0136] Since the layer is deformable, the electronic device according to the embodiment can provide a structure capable of reducing damage to the layer due to stress generated by a change in the state of the electronic device.

[0137] According to an embodiment, a width of the first conductive member may be greater than a width of the plurality of third sections.

[0138] The electronic device according to the embodiment can provide a structure in which the first case and the second case are thermally connected by the first conductive member having a width greater than that of the plurality of third sections.

[0139] According to an embodiment, the electronic device may include a first housing (eg, Figure 3b and Figure 3c The first housing 310 includes a first surface supporting a portion of the display (eg, Figure 3b and Figure 3c a first surface 311) and a second surface opposite to the first surface (eg, Figure 2a , Figure 2b and Figure 2c According to an embodiment, the electronic device may include a second housing (eg, Figure 3b and Figure 3c The second housing 320 includes a third surface supporting another portion of the display (eg, Figure 3b and Figure 3c A third surface 321) and a fourth surface opposite to the third surface (eg, Figure 2a , Figure 2b and Figure 2c The fourth surface 222 of the housing is connected to the first housing through a hinge structure so as to be rotatable relative to the first housing. According to an embodiment, the layer can be arranged on the first surface and the third surface across the hinge structure.

[0140] Since the layer extends across the hinge structure on the first case and the second case, the electronic device according to the embodiment can provide a structure in which the first case and the second case are thermally connected.

[0141] According to an embodiment, the second housing may be rotatable within a first angle range relative to the first housing. According to an embodiment, the second hinge plate may be rotatable within a second angle range greater than the first angle range relative to the first hinge plate.

[0142] Since the second hinge plate and the second housing have different rotation angles, the electronic device according to the embodiment may provide a structure in which a change in curvature of the display is gradual.

[0143] According to an embodiment, in a folded state of the electronic device, in which the first surface and the third surface face each other, the surface of the second hinge plate may be inclined relative to the first surface.

[0144] Since the second hinge plate and the first housing are inclined in the folded state of the electronic device, the electronic device according to the embodiment can provide a structure in which a change in curvature of the display is gradual.

[0145] According to an embodiment, the electronic device may include a second heat dissipation member (eg, Figure 4a and Figure 4b The second heat dissipation member 410 is disposed on the surface of the second hinge plate and is spaced apart from the layer. According to an embodiment, the electronic device may include a second conductive member (eg, Figure 4a and Figure 4b A second conductive member 430 ) is interposed between the layer and the second heat dissipation member, facing the first section.

[0146] The electronic device according to the embodiment can provide a structure in which a path through which heat generated in the first housing can move is expanded through the second heat dissipation member and the second conduction member.

[0147] According to an embodiment, the electronic device may include a first housing (eg, Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second housing (eg, Figure 3b and Figure 3c The second housing 320 of the display device supports another part of the display and is connected to the first housing through a hinge structure so as to be rotatable relative to the first housing. According to an embodiment, the second heat dissipation member may extend from the first housing to the surface of the second hinge plate.

[0148] Since the second heat dissipation member is provided on the first housing, the electronic device according to the embodiment can provide a structure in which a path through which heat generated in the first housing can move is expanded.

[0149] According to an embodiment, the electronic device may include a third heat dissipation member (eg, Figure 4a and Figure 4b According to an embodiment, the electronic device may include a third conductive member (eg, Figure 4a and Figure 4b A third conductive member 440 ) is interposed between the layer and the third heat dissipation member, facing the second section.

[0150] The electronic device according to the embodiment can provide a structure in which a path through which heat generated in the second housing can move is expanded through the third heat dissipation member and the third conduction member.

[0151] According to an embodiment, the electronic device may include a first housing (eg, Figure 3b and Figure 3c According to an embodiment, the electronic device may include a second housing (eg, Figure 3b and Figure 3c The second housing 320 of the display device supports another part of the display and is connected to the first housing through a hinge structure so as to be rotatable relative to the first housing. According to an embodiment, the third heat dissipation member may extend from the second housing to the surface of the third hinge plate.

[0152] Since the third heat dissipation member is provided on the second housing, the electronic device according to the embodiment can provide a structure in which a path through which heat generated in the second housing can move is expanded.

[0153] According to an embodiment, the electronic device may include a fourth heat dissipation member (eg, Figure 4a and Figure 4b A fourth heat dissipation member 450).

[0154] The electronic device according to the embodiment can provide a structure in which a path through which heat can move on the hinge structure is expanded through the fourth heat dissipation member.

[0155] According to an electronic device (eg, Figure 3a , Figure 3b and Figure 3c The electronic device 300 may include a hinge structure (eg, Figure 5a and Figure 5b The hinge structure 540 includes a hinge bracket (eg, Figure 5a and Figure 5b The hinge bracket 542 of the embodiment of the present invention is provided, and the first hinge plate (for example, Figure 5a and Figure 5b The hinge bracket includes a first hinge plate 543 and a second hinge plate (eg, a first hinge plate 543) that is different from the first hinge plate and is rotatable relative to the hinge bracket. Figure 5a and Figure 5b According to an embodiment, the electronic device may include a display (eg, Figure 3a and Figure 3bThe display 330 is provided on the hinge structure and is foldable by moving the first hinge plate and the second hinge plate relative to the hinge bracket. According to an embodiment, the electronic device may include a layer (eg, Figure 3a , Figure 3b and Figure 3c A layer 350 ) attached to the display includes a first heat dissipation member (eg, Figure 3a , Figure 3b and Figure 3c The first heat dissipation member 351 includes a first section (eg, Figure 3a , Figure 3b and Figure 3c a first section 351a), a second section spaced apart from the first section (eg, Figure 3a , Figure 3b and Figure 3c a second segment 351b), and a plurality of third segments (eg, Figure 3a , Figure 3b and Figure 3c According to an embodiment, the electronic device may include a surface (eg, Figure 5a and Figure 5b The first conductive member (eg, Figure 5a and Figure 5b According to an embodiment, the electronic device may include a surface (eg, Figure 5a and Figure 5b The second conductive member (eg, Figure 5a and Figure 5b According to an embodiment, in the unfolded state of the electronic device, in which the direction in which the surface of the first hinge plate faces is the same as the direction in which the surface of the second hinge plate faces, when the display is viewed in a second direction opposite to the first direction in which the surface of the first hinge plate faces, some of the plurality of third segments (e.g., Figure 5a and Figure 5b Some of 351c-1) may at least partially overlap the first conductive member and the second conductive member.

[0156] The electronic device according to the embodiment may provide a structure capable of dissipating heat generated in the electronic device by thermally connecting the fourth conductive member and the fifth conductive member through some of the plurality of third sections.

[0157] According to an embodiment, the electronic device may include a second heat dissipation member (eg, Figure 5a and Figure 5bAccording to an embodiment, the electronic device may include a third heat dissipation member (eg, Figure 5a and Figure 5b The sixth heat dissipation member 552 is provided in the embodiment of the present invention, wherein the third heat dissipation member is spaced apart from the second heat dissipation member and is disposed between the second conductive member and the second hinge plate.

[0158] The electronic device according to the embodiment can provide a structure in which a path through which heat can move between the first housing and the second housing is expanded through the fifth heat dissipation member and the sixth heat dissipation member.

[0159] According to an embodiment, the layer may include a first deformable member (e.g. Figure 3b and Figure 3c The first deformable member 352 of the first heat dissipation member extends across the hinge structure and contacts the surface of the first heat dissipation member facing the display. According to an embodiment, the layer may include a second deformable member (e.g., Figure 3b and Figure 3c The second deformation member 353 extends across the hinge structure and contacts the other surface of the first heat dissipation member, and the other surface of the first heat dissipation member is opposite to the surface of the first heat dissipation member.

[0160] The electronic device according to the embodiment can provide a structure capable of thermally connecting the first housing and the second housing by the first deformation member and the second deformation member connecting sections of the first heat dissipation member regardless of repeated changes in the state of the electronic device.

[0161] According to an embodiment, the electronic device may include a first housing (eg, Figure 3b and Figure 3c The first housing 310 includes a first surface supporting a portion of the display (eg, Figure 3b and Figure 3c a first surface 311) and a second surface opposite to the first surface (eg, Figure 2a , Figure 2b and Figure 2c According to an embodiment, the electronic device may include a second housing (eg, Figure 3b and Figure 3c The second housing 320 includes a third surface supporting another portion of the display (eg, Figure 3b and Figure 3c A third surface 321) and a fourth surface opposite to the third surface (eg, Figure 2a , Figure 2b and Figure 2cThe fourth surface 222 of the first hinge plate is connected to the first housing through a hinge structure so as to be rotatable relative to the first housing. According to an embodiment, in a folded state of the electronic device, where the first surface and the third surface face each other, the surface of the first hinge plate can be tilted relative to the surface of the second hinge plate.

[0162] Since the second hinge plate is inclined with respect to the first hinge plate in the folded state of the electronic device, the electronic device according to the embodiment may provide a structure in which a change in curvature of the display is gradual.

[0163] According to an embodiment, the electronic device may include a first reinforcement member (eg, Figure 5a and Figure 5b According to an embodiment, the electronic device may include a second reinforcing member (eg, Figure 5a and Figure 5b second reinforcing member 572).

[0164] The electronic device according to the embodiment may provide a structure capable of protecting a display from an external impact of the electronic device through the first reinforcement member and the second reinforcement member.

[0165] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0166] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with” or “connected with” another element (e.g., a second element) when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0167] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0168] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between the case where data is semi-permanently stored in the storage medium and the case where data is temporarily stored in the storage medium.

[0169] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) the computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0170] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

Claims

1. An electronic device (101; 200; 300), comprising: A hinge structure (340), comprising a first hinge plate (343), a second hinge plate (344) rotatable relative to the first hinge plate (343), and a third hinge plate (345) rotatable relative to the first hinge plate (343); a display (330) disposed on the hinge structure (340) and foldable by movement of the second hinge plate (344) and the third hinge plate (345) relative to the first hinge plate (343); a layer (350) attached to the display (330), comprising a first heat dissipation member (351), the first heat dissipation member (351) comprising a first segment (351a), a second segment (351b) spaced apart from the first segment (351a), and a plurality of third segments (351c) disposed between the first segment (351a) and the second segment (351b) and spaced apart from each other; and a first conductive member (360) attached to a surface (343a) of the first hinge plate (343) facing the plurality of third sections (351c), Wherein, in the unfolded state of the electronic device (101; 200; 300) in which the direction facing the surface (344a) of the second hinge plate (344) is the same as the direction facing the surface (345a) of the third hinge plate (345), when the display (330) is observed in a second direction opposite to the first direction facing the surface (343a) of the first hinge plate (343), the first conductive member (360) overlaps with a portion of the first section (351a) and a portion of the second section (351b).

2. The electronic device (101; 200; 300) according to claim 1, in, The layer (350) further comprises: a first deformable member (352) extending across the hinge structure (340) and in contact with a surface of the first heat dissipation member (351) facing the display (330); and The second deformable member (353) extends across the hinge structure (340) and contacts another surface of the first heat dissipation member (351), wherein the other surface of the first heat dissipation member (351) is opposite to the surface of the first heat dissipation member (351).

3. The electronic device (101; 200; 300) according to any one of claims 1 and 2, in, The gaps between the plurality of third sections (351c) change as the display (330) is folded or unfolded by the second hinge plate (344) and the third hinge plate (345).

4. The electronic device (101; 200; 300) according to any one of claims 1 to 3, in, Another portion of the first section (351a) faces the second hinge plate (344), and Wherein, another part of the second section (351b) faces the third hinge plate (345).

5. The electronic device (101; 200; 300) according to any one of claims 1 to 4, in, When the display (330) is deformed, the first conductive member (360) is deformable through the layer (350).

6. The electronic device (101; 200; 300) according to any one of claims 1 to 5, in, The layer (350) has a shape corresponding to the shape of the display (330).

7. The electronic device (101; 200; 300) according to any one of claims 1 to 6, in, The width of the first conductive member (360) is greater than the width of the plurality of third sections (351c).

8. The electronic device (101; 102) according to any one of claims 1 to 7. 200; 300), further including: A first housing (310) comprising a first surface (311) supporting a portion of the display (330) and a second surface opposite to the first surface (311); and a second housing (320) comprising a third surface (321) supporting another part of the display (330) and a fourth surface opposite to the third surface (321), and being coupled to the first housing (310) via the hinge structure (340) so as to be rotatable relative to the first housing (310), Wherein, a portion of the layer (350) is disposed on the first surface (311) and the third surface (321) across the hinge structure (340).

9. The electronic device (101; 200; 300) according to any one of claims 1 to 8, in, The second shell (320) is rotatable relative to the first shell (310) within a first angle range, and Wherein, the second hinge plate (344) is rotatable relative to the first hinge plate (343) within a second angle range that is greater than the first angle range.

10. The electronic device (101; 200; 300) according to any one of claims 1 to 9, in, In a folded state of the electronic device (101; 200; 300) in which the first surface (311) and the third surface (321) face each other, the surface of the second hinge plate (344) is inclined relative to the first surface (311).

11. The electronic device (101; 200; 300) according to any one of claims 1 to 10, further comprising: A second heat dissipation member (410) is disposed on the surface of the second hinge plate (344) and is spaced apart from the layer (350); as well as A second conductive member (440) is interposed between the layer (350) and the second heat dissipating member (410), facing the first section (351a).

12. The electronic device (101; 102) according to any one of claims 1 to 11. 200; 300), further including: A first housing (310) supporting a portion of the display (330); and a second housing (320), supporting another part of the display (330), connected to the first housing (310) via the hinge structure (340) so as to be rotatable relative to the first housing (310), Wherein, the second heat dissipation component (410) extends from the first housing (310) to the surface (344a) of the second hinge plate (344).

13. The electronic device (101; 102) according to any one of claims 1 to 12. 200; 300), further including: a third heat dissipation member (420), disposed on the surface (345a) of the third hinge plate (345) and spaced apart from the layer (350); as well as A third conductive member (450) is interposed between the layer (350) and the third heat dissipating member (420), facing the second section (351b).

14. The electronic device (101; 102) according to any one of claims 1 to 13. 200; 300), further including: A first housing (310) supporting a portion of the display (330); and a second housing (320), supporting another part of the display (330), connected to the first housing (310) via the hinge structure (340) so as to be rotatable relative to the first housing (310), Wherein, the third heat dissipation component (420) extends from the second shell (320) to the surface (345a) of the third hinge plate (345).

15. The electronic device (101; 200; 300) according to any one of claims 1 to 14, further comprising: A fourth heat dissipation member (430) is interposed between the first conductive member (360) and the surface (343a) of the first hinge plate (343).

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